Alignment system and alignment method for coaxial chip fixing

Abstract

This invention discloses an adjustment system and method for coaxial chip fixing. The adjustment system includes: an intelligent positioning fixture for fixing a housing and adjusting the position of the chip above the housing; an image measuring device for acquiring alignment images of the chip and sending adjustment command information to the intelligent positioning fixture; and a correction module for determining whether the chip position meets the requirements based on the alignment images, and generating adjustment command information for judgments that do not meet the requirements. This invention eliminates uncontrollable errors caused by fixture wear and human operation in existing alignment processes, while ensuring that the chip adjustment process is completely controllable, making chip adjustment more accurate, precise, stable, and controllable. Because it replaces manual adjustment work, it enables precise, efficient, and large-scale chip-housing alignment.

Description

Technical Field

[0001] This invention relates to the field of laser navigation technology, and more specifically to a positioning system and method for coaxial chip fixing. Background Technology

[0002] The photodetector is used for laser navigation. It connects to the system's central axis via a bottom positioning hole, ensuring the chip's center aligns with the system's axis. During navigation, the system uses this axis as the default origin and corrects its flight trajectory based on the position of the laser signal illuminating the chip. The chip, the housing's positioning hole, and the system axis must all be aligned to guarantee navigation accuracy.

[0003] The positioning hole of the housing is of standard size and is an integral part of the housing. The center point of the positioning hole coincides with the center point of the end surface of the housing. By fixing the chip to the end surface of the housing and coinciding with the center point of the chip and the center point of the end surface, the center points of the positioning hole of the chip and the housing can be made to be on the same axis.

[0004] In existing technologies, the method for coaxial positioning of the chip and the casing is as follows: (1) Install the alignment assembly fixture on the base, and insert the standard parts (the housing and chip that have been adjusted) into the alignment assembly fixture. Manually adjust the lens of the image measuring instrument located directly above the alignment assembly fixture so that the cross line at the center of the chip of the standard part coincides with the cross line on the video, and complete the calibration of the lens of the image measuring instrument. (2) Remove the standard parts, install the housing on the alignment assembly fixture, apply glue to the upper surface of the housing, and manually adjust the cross lines of the chip to be adjusted and the cross lines on the video on the upper surface of the housing so that the two cross lines are parallel and coincident, thus completing the initial adjustment of the chip and the housing. (3) Remove the alignment assembly fixture one after another, install the alignment detection fixture on the base, put the chip and the housing that have completed the initial alignment into the alignment detection fixture, rotate the housing one revolution, observe the maximum distance between the center point of the chip crosshair and the center point of the video crosshair during the rotation, measure and calculate whether the coaxiality is qualified. If it is not qualified, continue to adjust until the coaxiality is qualified.

[0005] In practical application, the inventors of this application discovered that the existing positioning schemes have the following defects: (1) To ensure that the housing can be assembled onto the shaft in the middle of the alignment assembly fixture, the machining dimensions of the shaft used by the alignment assembly fixture to fix the housing are as follows: The inner diameter of the shell is At this point, the minimum assembly gap is 0.013mm and the maximum is 0.035mm. However, the coaxiality requirement between the chip and the housing needs to be less than or equal to 0.07mm, which exceeds the accuracy requirement. When force is applied to the housing to rotate it, the outer wall of the housing and the inner wall of the assembly tool continue to rub against each other. Furthermore, with continuous use, the shaft of the alignment assembly tool will be worn, resulting in the assembly gap between the shaft and the inner hole of the housing becoming larger and larger. (2) Current technology uses alignment assembly fixtures and alignment detection fixtures to complete the positioning and detection of the shell and the chip. In actual operation, the shell needs to be installed and removed multiple times, which increases the number of times the shell itself is transferred and increases the risk of collision. The chip may be displaced due to collision or vibration when the glue is not dry, which will affect the final positioning effect. Since the entire operation is performed manually, the risk of accidental chip displacement cannot be effectively controlled. (3) In the current technology, the alignment detection fixture is fixed during the process of checking the alignment effect. The shell and chip rotate 360°. During this process, the operator may touch the chip. When the operator applies force directly to the shell, the shell and chip will be subjected to uneven force, resulting in the center of gravity shifting and thus causing detection error. Summary of the Invention

[0006] To address the issues of accuracy limitations due to images, uncontrollable displacement risks during tooling changes, and offset during manual chip adjustments in the prior art, this invention provides an alignment system and method for coaxial chip fixing. By analyzing the acquired alignment images, corresponding adjustment commands are generated, replacing existing manual operations throughout the alignment process. This ensures the accuracy of chip alignment, eliminates the need for tooling changes, and completely resolves the uncontrollable offset risks associated with manual operations.

[0007] A positioning system for coaxial chip fixing includes: An image measuring device is used to acquire alignment images of a chip. The calibration module is used to determine whether the chip position meets the requirements by using the alignment image, and to generate adjustment instruction information for the judgment result that does not meet the requirements; The intelligent positioning fixture is used to fix the housing and adjust the position of the chip above the housing according to the adjustment instruction information.

[0008] This invention replaces traditional alignment and assembly fixtures and alignment detection fixtures with intelligent positioning fixtures. During the entire chip positioning process, the housing is fixed by the intelligent positioning fixture, and the power source for rotating the housing is changed from manual operation to the fixture itself, eliminating the uncontrollable errors caused by fixture wear and human operation during the current positioning process. The image measurement device collects alignment images, and the calibration module analyzes and judges whether the requirements are met. Based on the actual offset distance and offset direction of the chip in the alignment image, the chip position is finely adjusted to ensure that the chip positioning process is completely controllable, and ensures that the chip positioning is more accurate, precise, stable and controllable.

[0009] Optionally, the intelligent positioning fixture includes: A fastening mechanism is used to fix the housing so that the housing is located directly below the image measuring device, and the center points of the fastening mechanism, the housing and the image measuring device are coaxial in the vertical direction. This axis is a standard axis, which is determined by the image measuring device. A rotating mechanism is provided to transmit rotational power to a fastening mechanism, thereby driving the housing to rotate around the standard axis. The adjustment actuator adjusts the position of the chip according to the adjustment instruction information; A tooling wireless communication module, wherein the tooling wireless communication module is used to receive adjustment command information; The main control module is used to receive and parse the adjustment instruction information, and control the fastening mechanism, the rotating mechanism and the adjustment execution mechanism to perform the corresponding work.

[0010] Optionally, the image measuring device includes: An image measurement lens is positioned directly above the fastening mechanism to capture alignment images of the chip, wherein the alignment images are used to capture the position of the chip from a top-down view. The image wireless communication module is used to send alignment images to the calibration module.

[0011] Optionally, the correction module has a built-in virtual standard reference. By determining whether the center point of the chip in the static alignment image is coaxial with the center point of the virtual standard reference in the static image, it determines whether the chip and the housing are coaxial in the static state. By calculating the coaxiality between the center point of the chip in the rotational state alignment image and the center point of the virtual standard reference in the rotational state, it determines whether the coaxiality between the chip and the housing in the rotational state meets the requirements.

[0012] Optionally, the adjustment instruction information includes: When the chip and housing are not aligned in a static state, the first adjustment instruction information is generated; and When the coaxiality between the chip and the housing does not meet the requirements during rotation, a second adjustment instruction is generated.

[0013] The adjustment method for an adjustment system used for coaxial chip fixing includes the following steps: S1. Acquire the alignment image of the chip under static conditions, and determine whether the chip and the housing are coaxial. If they are not coaxial, proceed to step S2; if they are coaxial, proceed to step S3. S2. Using the center point of the virtual standard reference as the standard, generate the first adjustment instruction information based on the deviation difference and deviation direction between the center point of the chip in the alignment image and the center point of the virtual standard reference, and after adjusting the chip position, execute step S1. S3. Acquire the alignment image of the chip in the rotating state, identify the maximum deviation distance between the center point of the chip in the alignment image and the center point of the virtual standard reference, calculate the coaxiality between the center point of the chip in the alignment image and the center point of the virtual standard reference, and determine whether the calculation result meets the requirements; if not, proceed to step S4; if it meets the requirements, proceed to step S5. S4. Using the center point of the virtual standard reference as the standard, generate the second adjustment instruction information according to the maximum deviation distance, and after adjusting the chip position, execute step S3; S5. Complete the coaxial fixation of the chip and the housing.

[0014] Optionally, the procedure may further include the following steps before performing step S1: Obtain the alignment image of the center point of the fastening mechanism. Using the center point of the virtual standard reference as the standard, adjust the position of the fastening mechanism so that the center of the fastening mechanism coincides with the center point of the virtual standard reference. Secure the housing to the center of the fastening mechanism so that the housing is directly below the image measuring device; Place the chip on top of the housing.

[0015] Optionally, in step S1, determining whether the chip and the housing are coaxial includes: Determine whether the center point of the alignment image chip in static condition coincides with the center point of the virtual standard reference. If they coincide, the chip and the housing are coaxial; if they do not coincide, the chip and the housing are not coaxial.

[0016] Optionally, in step S3, the maximum deviation distance includes: the maximum lateral deviation distance and the maximum longitudinal deviation distance; Step S3 includes: S301. Identify the maximum lateral deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S302. Identify the maximum longitudinal deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S303. Calculate the coaxiality between the chip center point and the virtual standard reference center point using the following formula. : Among them, judgment Does it meet the requirements? If the condition is met, the coaxiality between the chip and the housing in the rotating state meets the requirements; if the condition is not met, the coaxiality between the chip and the housing in the rotating state does not meet the requirements.

[0017] Optionally, in steps S2 and S4, the intelligent positioning fixture adjusts the chip's position according to the first adjustment instruction information or the second adjustment instruction information.

[0018] Through the above technical solution, the entire coaxial chip alignment process can be completed without human intervention. All operations on the housing and chip are completed by intelligent positioning fixtures, eliminating the uncontrollable errors caused by fixture wear and human operation in the existing alignment process. At the same time, it ensures that the chip alignment process is completely controllable, making the chip alignment more accurate, precise, stable and controllable. Because it replaces manual alignment work, it can achieve precise, efficient and large-scale chip and housing alignment.

[0019] Other features and advantages of the embodiments of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the relationships within the system of this invention; Figure 2 This is a schematic diagram of the system structure of the present invention; Figure 3 It is a cross-sectional view of the chip and the housing in a standard part; Figure 4 This is a side view of the image measurement lens acquiring alignment images in this invention; Figure 5 This is a side sectional view of an existing alignment assembly fixture; Figure 6 This is a side sectional view of the fastening mechanism in this invention; Figure 7 This is a top view of the fastening structure in this invention; Figure 8 This is a flowchart illustrating the method of the present invention; Figure 9This is a flowchart illustrating step S3 in the method of the present invention; Figure 10 This is a virtual standard reference in this invention; Figure 11 This is a diagram showing the motion trajectory of the center point of the chip in a rotating state in this invention.

[0021] Among them, 1-shell, 2-chip, 3-positioning hole, 4-image acquisition lens, 5-alignment assembly fixture, 6-intelligent positioning fixture, 601-adjustment actuator, 602-main control module, 603-adjustment rotation auxiliary mechanism, 604-rotation mechanism, 605-fastening mechanism. Detailed Implementation

[0022] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present invention.

[0023] like Figures 1-2 As shown, the positioning system for coaxial fixing of the chip includes: An image measuring device is used to acquire alignment images of chip 2; The calibration module is used to determine whether the position of chip 2 meets the requirements by using the alignment image, and to generate adjustment instruction information for the judgment result that does not meet the requirements; The intelligent positioning fixture 6 is used to fix the housing 1 and adjust the position of the chip 2 above the housing 1 according to the adjustment instruction information.

[0024] This invention replaces the traditional alignment assembly fixture 5 and alignment detection fixture with an intelligent positioning fixture 6. During the entire chip 2 positioning process, the intelligent positioning fixture 6 fixes the housing 1, and the power source for rotating the housing 1 is changed from manual operation to the fixture itself, eliminating the uncontrollable errors caused by fixture wear and manual operation during the current positioning process. The image measurement device collects alignment images, and the calibration module analyzes and judges whether the requirements are met. Based on the actual offset distance and offset direction of the chip 2 in the alignment image, the position of the chip 2 is finely adjusted to ensure that the chip 2 positioning process is completely controllable, and ensures that the chip positioning is more accurate, precise, stable and controllable.

[0025] like Figure 3 As shown, the chip 2 is positioned directly above the housing 1. Before placing the chip 2 onto the housing 1, an adhesive is applied to the bottom of the chip 2. After placement, the chip 2 is repositioned. After repositioning, wait for a specified time until the adhesive has completely solidified, thus completing the repositioning of the chip 2 and the housing 1.

[0026] like Figure 4 , Figure 5 As shown, this is the state of tooling adjustment in the prior art. The tooling is placed directly below the image measuring lens. In the prior art, the shaft of the tooling is used to fix the housing 1. In order to ensure that the housing 1 can rotate, the diameter of the shaft is slightly smaller than the inner wall diameter of the housing 1. However, with the increase of the number of uses, the diameter of the shaft is worn, resulting in a gradual decrease in accuracy.

[0027] like Figure 4 , Figure 6 , Figure 7 As shown, optionally, the intelligent positioning fixture 6 includes: The fastening mechanism 605 is used to fix the housing 1 so that the housing 1 is located directly below the image measuring device. The center points of the fastening mechanism 605, the housing 1 and the image measuring device are coaxial in the vertical direction. This axis is a standard axis, which is determined by the image measuring device. The rotating mechanism 604 is used to transmit rotational power to the fastening mechanism 605, and the fastening mechanism 605 drives the housing 1 to rotate around the standard axis. The adjustment actuator 601 adjusts the position of chip 2 according to the adjustment instruction information; The tooling wireless communication module is used to receive data from the image measurement device. In practical applications, after the calibration module generates adjustment command information, it can directly send the adjustment command information to the tooling wireless communication module; alternatively, it can send the adjustment command information to the image measuring device, which will then send it to the tooling wireless communication module via the image wireless communication module.

[0028] The main control module 602 is used to receive and parse adjustment command information, and control the fastening mechanism 605, the rotating mechanism 604 and the adjustment actuator 601 to perform the corresponding work.

[0029] Optionally, the image measurement device includes: An image measurement lens is positioned directly above the fastening mechanism 605 to capture alignment images of the chip 2. These alignment images are used to capture the position of the chip 2 from a top-down view. The image wireless communication module is used to send alignment images to the calibration module.

[0030] like Figure 7As shown, in practical applications, the fastening mechanism 605 can adopt a triangular internal support structure, with three blades supporting the inner wall of the housing 1, thereby completing the fixation of the housing 1. It should be noted that the fastening mechanism 605 proposed in this invention can be implemented in various forms in practice. As long as the effect is to fix the housing 1 and maintain stability, it should be within the scope of protection of this invention.

[0031] The rotating mechanism 604 is connected to the bottom of the fastening mechanism 605. The rotation of the rotating mechanism 604 drives the fastening mechanism 605 to rotate, which replaces the method of manually applying force to the outer wall of the housing 1 to rotate in the prior art.

[0032] The lower part of the adjusting actuator 601 is connected to the adjusting rotation auxiliary mechanism 603. The adjusting rotation auxiliary mechanism 603 operates on the same principle as the rotating mechanism 604. The adjusting rotation auxiliary mechanism 603 drives the adjusting actuator 601 to rotate, adjusting the chip 2 in the optimal adjustment direction. Figure 6 As shown, the adjustment rotation auxiliary mechanism 603 is located above the rotation mechanism 604. When the adjustment rotation auxiliary mechanism 603 drives the adjustment actuator 601 to rotate, it generates an alignment image of the housing 1.

[0033] The main control module 602 controls other components of the intelligent positioning fixture 6 through integrated circuits.

[0034] Optional, such as Figure 10 As shown, the calibration module has a built-in virtual standard reference. It determines whether the chip 2 and the housing 1 are coaxial by judging whether the center point of the chip 2 in the static alignment image is coaxial with the center point of the virtual standard reference in the static image. It also determines whether the coaxiality of the chip 2 and the housing 1 in the rotating state meets the requirements by calculating the coaxiality between the center point of the chip 2 in the alignment image and the center point of the virtual standard reference in the rotating state.

[0035] Optional, the adjustment instruction information includes: When chip 2 and housing 1 are not aligned in a static state, the first adjustment instruction information is generated; and When the coaxiality between chip 2 and housing 1 does not meet the requirements in the rotating state, a second adjustment instruction is generated.

[0036] A virtual standard reference is set at the center of the field of view that the image measuring lens can acquire. Specifically, the image measuring lens itself is fixed. Regardless of whether the chip 2 is being adjusted under the image measuring lens, the center point of the image acquired by the image measuring lens coincides with the center point of the virtual standard reference. When the center point of the fastening structure coincides with the center point of the virtual standard reference, the center points of both are on the standard axis. The fastening mechanism 605 is fixed and the housing 1 is adjusted. After the adjustment of the fastening mechanism 605 and the housing 1 is completed, the center point of the chip 2 is adjusted with the center point of the virtual standard reference as the standard to ensure that the center points of the fastening mechanism 605, the housing 1, the chip 2, and the virtual standard reference are all on the standard axis, thus completing the static adjustment of the chip 2 on the housing 1.

[0037] While the housing 1 is rotating, the chip 2 body is adjusted after the housing 1 has rotated 360° by identifying the coaxiality between the center point of the chip 2 and the center point of the virtual standard reference. This completes the repositioning of the chip 2 on the housing 1 while it is rotating.

[0038] To enhance the calibration module's ability to issue adjustment commands quickly, accurately, and efficiently, ensuring that chip 2 can complete high-precision adjustment within a short time, the calibration module also includes a calibration database and a calibration training model: The calibration database is used to store alignment images and adjustment command information during each chip 2 adjustment process. The calibration training model uses the data in the calibration database as training data for deep learning training. As the number of adjustments performed by the calibration module increases, the amount of training data in the calibration database will also increase, and the calibration training model will be able to generate adjustment command information more and more accurately and efficiently.

[0039] like Figure 8 As shown, the adjustment method of the adjustment system for coaxial chip fixing includes the following steps: S1. Acquire the alignment image of chip 2 under static conditions, and determine whether chip 2 and housing 1 are coaxial. If they are not coaxial, proceed to step S2; if they are coaxial, proceed to step S3. S2. Using the center point of the virtual standard reference as the standard, based on the deviation difference and deviation direction between the center point of chip 2 in the alignment image and the center point of the virtual standard reference, generate the first adjustment instruction information, adjust the position of chip 2, and then execute step S1. S3. Acquire the alignment image of chip 2 in the rotated state, identify the maximum deviation distance between the center point of chip 2 in the alignment image and the center point of the virtual standard reference, calculate the coaxiality between the center point of chip 2 in the alignment image and the center point of the virtual standard reference, and determine whether the calculation result meets the requirements; if not, proceed to step S4; if it meets the requirements, proceed to step S5. S4. Using the center point of the virtual standard reference as the standard, generate the second adjustment instruction information according to the maximum deviation distance, and after adjusting the position of chip 2, execute step S3. S5. Complete the coaxial fixation of chip 2 and housing 1.

[0040] This invention identifies the adjustment results under static and rotational states by executing steps S1 and S3, ensuring that the chip 2 and the housing 1 are coaxial after the final adjustment. The correction module generates first and second adjustment instruction information to specify the adjustment distance direction of the chip 2, make the distance more precise, and make the process more efficient.

[0041] Optionally, the procedure before performing step S1 may also include: Acquire the alignment image of the center point of the fastening mechanism 605, and adjust the position of the fastening mechanism 605 with the center point of the virtual standard reference as the standard, so that the center of the fastening mechanism 605 coincides with the center point of the virtual standard reference. Fix housing 1 to the center of fastening mechanism 605, so that housing 1 is located directly below the image measuring device; Place chip 2 on top of housing 1.

[0042] Before adjusting the position of chip 2, the center point of the fastening mechanism 605 needs to be aligned with the center point of the virtual standard reference. That is, the position of the intelligent positioning fixture 6 is first adjusted to ensure accuracy throughout the process. The fastening mechanism 605 is used to fix the housing 1 at the positioning hole 3 inside the housing 1. The difference between the fastening mechanism 605 in this invention and the prior art for fixing the housing 1 is that in the prior art, there is a gap between the inner wall of the housing 1 and the shaft of the fixture, and the housing 1 is actually "fitted" on the shaft. In this invention, the fastening mechanism 605 is designed according to the shape of the positioning hole 3 and fits into the positioning hole 3. It has a built-in retractable elastic element. When fixing the housing 1, the fastening mechanism 605 is retracted and then opened to complete the fixing of the housing 1. At this time, the top of the housing 1 is aligned with the image acquisition lens 4, and the center point of the housing 1 coincides with the center point of the virtual standard reference.

[0043] Optionally, in step S1, determining whether chip 2 and housing 1 are coaxial includes: Determine whether the center point of the static alignment image chip 2 coincides with the center point of the virtual standard reference. If they coincide, then chip 2 and housing 1 are coaxial; if they do not coincide, then chip 2 and housing 1 are not coaxial.

[0044] Optionally, in step S3, the maximum deviation distance includes: the maximum lateral deviation distance and the maximum longitudinal deviation distance; like Figure 9 As shown, step S3 includes: S301. Identify the maximum lateral deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S302. Identify the maximum longitudinal deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S303. Calculate the coaxiality between the chip center point and the virtual standard reference center point using the following formula. : Among them, judgment Does it meet the requirements? If the condition is met, the coaxiality between the chip and the housing in the rotating state meets the requirements; if the condition is not met, the coaxiality between the chip and the housing in the rotating state does not meet the requirements.

[0045] like Figures 10-11 As shown, the center point of chip 2 rotates, and the dashed line is the rotation trajectory of the center point of the chip. The correction module uses the motion trajectory of the center point of chip 2 in the alignment image, with the center point of the virtual standard reference as the stationary standard point, to identify the maximum lateral deviation and the maximum longitudinal deviation distance between the center point of chip 2 and the center point of the virtual standard reference. The coaxiality of chip 2 is calculated using the above formula.

[0046] Optionally, in steps S2 and S4, the intelligent positioning fixture 6 adjusts the chip 2 in the corresponding position according to the first adjustment instruction information or the second adjustment instruction information.

[0047] The first and second adjustment instructions include working instructions for the entire intelligent positioning fixture 6. For example, in steps S2 and S4, the first and second adjustment instructions need to control the rotating mechanism 604 and the adjustment execution mechanism 601 to adjust the chip 2. In addition, in step S3, the calibration module sends information to control the rotating mechanism 604 to rotate.

[0048] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0049] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0050] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0051] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0052] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0053] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0054] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0055] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0056] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A positioning system for coaxial fixation of a chip, characterized in that include: An image measuring device is used to acquire alignment images of a chip. The calibration module is used to determine whether the chip position meets the requirements by using the alignment image, and to generate adjustment instruction information for the judgment result that does not meet the requirements; The intelligent positioning fixture is used to fix the housing and adjust the position of the chip on the housing according to the adjustment instruction information; The intelligent positioning fixture includes a fastening mechanism for fixing the housing so that the housing is located directly below the image measuring device. The center points of the fastening mechanism, the housing, and the image measuring device are coaxial in the vertical direction. This axis is a standard axis, which is determined by the image measuring device. A rotating mechanism is provided to transmit rotational power to a fastening mechanism, thereby driving the housing to rotate around the standard axis. The adjustment actuator adjusts the position of the chip according to the adjustment instruction information; A tooling wireless communication module, wherein the tooling wireless communication module is used to receive adjustment command information; The main control module is used to receive and parse the adjustment instruction information, and control the fastening mechanism, the rotating mechanism and the adjustment execution mechanism to perform the corresponding work. The correction module has a built-in virtual standard reference. It determines whether the chip and the housing are coaxial in a static alignment image by judging whether the center point of the chip and the center point of the virtual standard reference are coaxial. It also determines whether the coaxiality of the chip and the housing in a rotating state meets the requirements by calculating the coaxiality between the center point of the chip and the center point of the virtual standard reference in a rotating state.

2. The alignment system for coaxial fixation of chips according to claim 1, characterized in that, The image measuring device includes: An image measurement lens is positioned directly above the fastening mechanism to capture alignment images of the chip, wherein the alignment images are used to capture the position of the chip from a top-down view. The image wireless communication module is used to send alignment images to the calibration module.

3. The alignment system for coaxial fixation of chips according to claim 2, wherein, The adjustment instruction information includes: When the chip and housing are not aligned in a static state, the first adjustment instruction information is generated; and When the coaxiality between the chip and the housing does not meet the requirements during rotation, a second adjustment instruction is generated.

4. A positioning method for coaxial chip fixing, employing the positioning system described in any one of claims 1-3, characterized in that, Includes the following steps: S1. Acquire the alignment image of the chip under static conditions, and determine whether the chip and the housing are coaxial. If they are not coaxial, proceed to step S2; if they are coaxial, proceed to step S3. S2. Using the center point of the virtual standard reference as the standard, generate the first adjustment instruction information based on the deviation difference and deviation direction between the center point of the chip in the alignment image and the center point of the virtual standard reference, and after adjusting the chip position, execute step S1. S3. Acquire the alignment image of the chip in the rotating state, identify the maximum deviation distance between the center point of the chip in the alignment image and the center point of the virtual standard reference, calculate the coaxiality between the center point of the chip in the alignment image and the center point of the virtual standard reference, and determine whether the calculation result meets the requirements; if not, proceed to step S4; if it meets the requirements, proceed to step S5. S4. Using the center point of the virtual standard reference as the standard, generate the second adjustment instruction information according to the maximum deviation distance, and after adjusting the chip position, execute step S3; S5. Complete the coaxial fixation of the chip and the housing.

5. The positioning method for coaxial chip fixing according to claim 4, characterized in that, Before performing step S1, the following is also included: Obtain the alignment image of the center point of the fastening mechanism. Using the center point of the virtual standard reference as the standard, adjust the position of the fastening mechanism so that the center of the fastening mechanism coincides with the center point of the virtual standard reference. Secure the housing to the center of the fastening mechanism so that the housing is directly below the image measuring device; Place the chip on top of the housing.

6. The positioning method for coaxial chip fixing according to claim 4, characterized in that, In step S1, determining whether the chip and the casing are coaxial includes: Determine whether the center point of the alignment image chip in static condition coincides with the center point of the virtual standard reference. If they coincide, the chip and the housing are coaxial; if they do not coincide, the chip and the housing are not coaxial.

7. The positioning method for coaxial chip fixing according to claim 4, characterized in that, In step S3, the maximum deviation distance includes: the maximum lateral deviation distance and the maximum longitudinal deviation distance; Step S3 includes: S301. Identify the maximum lateral deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S302. Identify the maximum longitudinal deviation between the center point of the identification chip and the center point of the virtual standard reference. ; S303. Calculate the coaxiality between the chip center point and the virtual standard reference center point using the following formula. : Among them, judgment Does it meet the requirements? If the condition is met, the coaxiality between the chip and the housing in the rotating state meets the requirements; if the condition is not met, the coaxiality between the chip and the housing in the rotating state does not meet the requirements.

8. The positioning method for coaxial chip fixing according to claim 4, characterized in that, In steps S2 and S4, the intelligent positioning fixture adjusts the chip's position according to the first or second adjustment instruction information.

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