Camera module and electronic device

Abstract

A camera module and an electronic device, the camera module includes an imaging lens group, an electronic photosensitive element and an optical flat. The electronic photosensitive element is disposed on an imaging surface of the imaging lens group. The optical flat is disposed between the imaging lens group and the electronic photosensitive element, and includes a substrate and at least one anti-reflection film layer. The substrate has an object side surface and an image side surface, and the object side surface and the image side surface are respectively towards an object side and an image side and parallel to each other. The anti-reflection film layer is disposed on the object side surface or the image side surface of the substrate and includes a nano-grain structure layer and an optical connecting film layer, wherein the nano-grain structure layer includes a metal oxide crystal. By disposing the anti-reflection film layer on the optical flat, the stray light of the camera module can be reduced, and the imaging quality can be effectively improved.

Description

Technical Field

[0001] This disclosure relates to a camera module, and more particularly to a camera module used in portable electronic devices. Background Technology

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have become ubiquitous in modern life. Camera modules mounted on these portable electronic devices have also flourished. However, as technology advances, users' demands for the quality of camera modules are also increasing.

[0003] Please refer to Figure 11 The diagram illustrates a camera module 60 according to existing technology. In existing technology, when an imaging ray enters the camera module 60, stray light is generated due to reflection from the surface of the optical plate 62 of the camera module 60, potentially forming at least three stray light paths P1, P2, and P3, but not limited to these. When the imaging ray enters the camera module 60, it passes through the optical plate 62 and is reflected, then reflected or totally reflected by the optical surface of the imaging lens 61 in the imaging lens group, causing stray light P1 in the optical image. When the imaging ray enters the camera module 60, it passes through the optical plate 62 and undergoes secondary reflection within the optical plate 62, causing stray light P2 in the optical image. When the imaging ray enters the camera module 60, it enters the microlens on the electronic photosensitive element 63 and undergoes light diffraction, then is reflected by the optical plate 62, causing stray light P3 in the optical image. Therefore, developing a camera module that can effectively eliminate stray light has become an important and urgent problem to be solved in the industry. Summary of the Invention

[0004] This disclosure provides a camera module and electronic device that reduces stray light from the camera module and effectively improves image quality by setting an anti-reflective coating on the optical flat plate.

[0005] According to one embodiment of this disclosure, a camera module is provided, comprising an imaging lens group, an electronic photosensitive element, and an optical plate. The electronic photosensitive element is disposed on an imaging surface of the imaging lens group. The optical plate is disposed between the imaging lens group and the electronic photosensitive element and includes a substrate and at least one anti-reflective coating. The substrate has an object-side surface and an image-side surface, the object-side surface and the image-side surface facing the object side and the image side respectively and being parallel to each other. The anti-reflective coating is disposed on the image-side surface of the substrate and includes a nanocrystalline structure layer and an optical connection layer, wherein the nanocrystalline structure layer includes a metal oxide crystal, the optical connection layer connects the substrate and the nanocrystalline structure layer, and the nanocrystalline structure layer is in direct physical contact with the optical connection layer, and the top portion of the optical connection layer is in contact with air. The refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection film layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection film layer is Hf, and the total height of the antireflective film layer is H. These conditions must satisfy the following conditions: Nf < Nc; Hf + Hc = H; and Hf < Hc.

[0006] According to the camera module of the embodiment described above, the number of anti-reflective coating layers can be two, and they are respectively disposed on the object-side surface and the image-side surface of the substrate.

[0007] In the camera module according to the embodiments described above, the optical plate can be a polarizer.

[0008] According to the camera module of the embodiment described above, one image-side optical surface of the imaging lens group may be an optical aspherical surface, and the optical aspherical surface may have at least one inflection point.

[0009] According to the camera module of the embodiment described above, the thickness of the optical connection film is Hf, which satisfies the following condition: 20 nm < Hf < 120 nm. Additionally, it satisfies the following condition: 40 nm < Hf < 90 nm.

[0010] According to the camera module of the embodiment described above, the refractive index of the nanocrystalline structure layer is Nc, and the refractive index of the substrate is Ns, which can satisfy the following condition: Ns < Nc.

[0011] According to the camera module of the embodiment described above, the height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 120 nm < Hc < 350 nm. Additionally, it satisfies the following condition: 150 nm < Hc < 300 nm.

[0012] In the camera module according to the embodiments described above, the nanocrystalline structure layer may be arranged irregularly.

[0013] The camera module according to the embodiment described in the preceding paragraph, wherein the substrate of the optical flat plate can be a glass substrate.

[0014] According to an embodiment of the present disclosure, an electronic device is provided, which comprises the camera module according to the embodiment described in the preceding paragraph.

[0015] According to an embodiment of the present disclosure, a camera module is provided, comprising an imaging lens group, an electronic photosensitive element and an optical flat plate. The electronic photosensitive element is disposed on an imaging surface of the imaging lens group. The optical flat plate is disposed between the imaging lens group and the electronic photosensitive element, and comprises a substrate and at least one anti-reflection film layer. The substrate has an object-side surface and an image-side surface, the object-side surface and the image-side surface face an object side and an image side respectively and are parallel to each other. The anti-reflection film layer is disposed on the object-side surface of the substrate, the anti-reflection film layer comprises a nano-crystalline grain structure layer and an optical connection film layer, wherein the nano-crystalline grain structure layer comprises a metal oxide crystal, the optical connection film layer connects the substrate and the nano-crystalline grain structure layer, the nano-crystalline grain structure layer is in direct physical contact with the optical connection film layer, and the top portion of the optical connection film layer is in contact with air. The refractive index of the material of the nano-crystalline grain structure layer is Nc, the refractive index of the material of the optical connection film layer is Nf, the height of the nano-crystalline grain structure layer is Hc, the film thickness of the optical connection film layer is Hf, and the total height of the anti-reflection film layer is H, which satisfy the following conditions: Nf < Nc; Hf+Hc=H; and Hf < Hc.

[0016] The camera module according to the embodiment described in the preceding paragraph, wherein the optical flat plate can be an infrared filter.

[0017] The camera module according to the embodiment described in the preceding paragraph, wherein the film thickness of the optical connection film layer is Hf, which can satisfy the following condition: 20 nm < Hf < 120 nm. In addition, it can satisfy the following condition: 40 nm < Hf < 90 nm.

[0018] The camera module according to the embodiment described in the preceding paragraph, wherein the height of the nano-crystalline grain structure layer is Hc, which can satisfy the following condition: 120 nm < Hc < 350 nm. In addition, it can satisfy the following condition: 150 nm < Hc < 300 nm.

[0019] The camera module according to the embodiment described in the preceding paragraph, wherein an image-side optical surface of the imaging lens group can be an optical aspheric surface, and the optical aspheric surface has at least one inflection point.

[0020] The camera module according to the embodiment described in the preceding paragraph, wherein the nano-crystalline grain structure layer can be arranged in an irregular pattern. Brief Description of the Drawings

[0021] Figure 1AA schematic diagram of the camera module according to the first embodiment of this disclosure is shown;

[0022] Figure 1B Drawing according to Figure 1A A schematic diagram of part of the optical path of the camera module in the first embodiment;

[0023] Figure 1C Drawing according to Figure 1A A schematic diagram of the optical flat plate in the first embodiment;

[0024] Figure 1D To observe using an electron microscope Figure 1A Photograph of a nanocrystalline structure layer on the surface of an optical flat plate;

[0025] Figure 1E For another observation using an electron microscope Figure 1A Photograph of a nanocrystalline structure layer on the surface of an optical flat plate;

[0026] Figure 1F To observe using an electron microscope Figure 1A Cross-sectional view of the anti-reflective coating;

[0027] Figure 1G For another observation using an electron microscope Figure 1A Cross-sectional view of the anti-reflective coating;

[0028] Figure 2 Drawing according to Figure 1A A schematic diagram of the optical flat plate in the second embodiment of the first embodiment;

[0029] Figure 3 Drawing according to Figure 1A A schematic diagram of the optical flat plate in the third embodiment of the first embodiment;

[0030] Figure 4 Drawing according to Figure 1A A schematic diagram of the optical flat plate in the fourth embodiment of the first embodiment;

[0031] Figure 5 Drawing according to Figure 1A A schematic diagram of the optical flat plate of the fifth embodiment in the first embodiment;

[0032] Figure 6 Drawing according to Figure 1A A schematic diagram of the optical flat plate of the sixth embodiment in the first embodiment;

[0033] Figure 7 A schematic diagram of the camera module according to the second embodiment of this disclosure is shown;

[0034] Figure 8A schematic diagram of the camera module according to the third embodiment of this disclosure is shown;

[0035] Figure 9A A schematic diagram of an electronic device according to the fourth embodiment of this disclosure is shown;

[0036] Figure 9B Drawing according to Figure 9A Another schematic diagram of the electronic device in the fourth embodiment;

[0037] Figure 9C Drawing according to Figure 9A A schematic diagram of an image captured by an electronic device in the fourth embodiment;

[0038] Figure 9D Drawing according to Figure 9A Another image diagram captured by the electronic device in the fourth embodiment;

[0039] Figure 9E Drawing according to Figure 9A Another image diagram captured by the electronic device in the fourth embodiment;

[0040] Figure 10 A schematic diagram illustrating the electronic device according to the fifth embodiment of this disclosure; and

[0041] Figure 11 A schematic diagram of a camera module according to the prior art is shown.

[0042] [Symbol Explanation]

[0043] 100, 200, 300, 60: Camera modules

[0044] 110, 210, 310: Imaging lens group

[0045] 111,311: Most like the side lens

[0046] 1112, 3112: Image-side optical surfaces

[0047] 120, 220, 320, 62: Optical flat panel

[0048] 121,221,321:Substrate

[0049] 122,222,322: Anti-reflective coating

[0050] 1221: Nanocrystalline structure layer

[0051] 1222: Optical Connecting Film

[0052] 123: Infrared light filter film layer

[0053] 124: Polarizing film layer

[0054] 125: Fresnel lens

[0055] 130, 230, 330, 63: Electronic photosensitive element

[0056] 131,231,331: Imaging planes

[0057] 140, 240, 340: Lens tube

[0058] 211: Light-transforming element

[0059] 40, 50: Electronic devices

[0060] 41: User Interface

[0061] 42, 51, 52: Ultra-wide-angle camera module

[0062] 43: High-resolution camera module

[0063] 44, 55, 56, 57, 58: Telephoto camera module

[0064] 45: Imaging signal processing element

[0065] 46,501: Flash module

[0066] 53, 54: Wide-angle camera module

[0067] 59: TOF Module

[0068] 61: Imaging Lens

[0069] P1, P2, P3: Stray light

[0070] IP: Recurve Point

[0071] X: Optical axis

[0072] Ns: Refractive index of the substrate material

[0073] Nf: Refractive index of the material in the optical bonding film.

[0074] Nc: Refractive index of the nanocrystalline structure layer

[0075] Hc: Height of the nanocrystalline structure layer

[0076] Hf: Thickness of the optical bonding layer

[0077] H: Total height of the anti-reflective coating Detailed Implementation

[0078] This invention provides a camera module comprising an imaging lens assembly, an electronic photosensitive element, and an optical plate. The electronic photosensitive element is disposed on the imaging surface of the imaging lens assembly. The optical plate is disposed between the imaging lens assembly and the electronic photosensitive element and includes a substrate and at least one anti-reflective coating. The substrate has an object-side surface and an image-side surface, the object-side surface and the image-side surface facing the object side and the image side respectively and being parallel to each other. The anti-reflective coating is disposed on the object-side surface or the image-side surface of the substrate and includes a nanocrystalline structure layer and an optical connection layer. The nanocrystalline structure layer includes a metal oxide crystal. The optical connection layer connects the substrate and the nanocrystalline structure layer, and the nanocrystalline structure layer is in direct physical contact with the optical connection layer. The refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection layer is Hf, and the total height of the anti-reflective coating layer is H, which satisfy the following conditions: Nf < Nc; Hf + Hc = H; and Hf < Hc. By applying an anti-reflective coating to the optical plate, stray light from the camera module can be reduced, effectively improving image quality. Furthermore, using a nanocrystalline structure layer with a high refractive index as the outer layer increases the transmittance of the optical plate, thereby reducing reflected light. Moreover, the design of the optical bonding film layer makes it easier to deposit the nanocrystalline structure layer onto the optical plate.

[0079] The material refractive index described in this disclosure refers to the material refractive index when the material is presented in the form of an optical planar film. When the material forms a thin film with a nanocrystalline structure, due to the shape of the structure, part of the volume will be replaced by air, causing the equivalent material refractive index of the overall thin film to vary towards 1.00 depending on the density of the grain structure.

[0080] During manufacturing, an optical connection film layer is first deposited on the substrate, followed by a nanocrystalline structure layer, which improves the structural stability of the anti-reflective film. There are no gaps between the top of the optical connection film layer and the bottom of the nanocrystalline structure layer; the two layers are tightly bonded. Since the nanocrystalline structure layer does not form a completely flat surface, the top of the optical connection film layer can be partially exposed to air.

[0081] The number of anti-reflective coating layers can be two, and they are respectively applied to the object-side surface and the image-side surface of the substrate. In this way, by using double-sided coating technology, anti-reflective coating layers can be deposited on both the object-side surface and the image-side surface of the optical plate, which can more effectively reduce the reflected light from the optical plate.

[0082] Specifically, optical flat panels can be infrared (IR) filters, blue glass (BG), polarizers, liquid crystal panels, neutral density (ND) filters, or Fresnel lenses. When an optical flat panel is a polarizer, it can absorb light in a specific electric field direction, achieving a filtering effect. When an optical flat panel is an infrared filter, it can filter out infrared light.

[0083] The image-side optical surface of the imaging lens group can be an optical aspherical surface, and the optical aspherical surface has at least one inflection point. In this way, imaging lens groups with higher optical specifications can be provided.

[0084] The thickness of the optical bonding film is Hf, which satisfies the following condition: 20 nm < Hf < 120 nm. By setting an optical bonding film within a specific thickness range, the deposition yield of the nanocrystalline structure layer can be improved, and the optical transmittance can be increased. Additionally, it can satisfy the following condition: 40 nm < Hf < 90 nm. This allows for a film thickness range with better uniformity.

[0085] The refractive index of the nanocrystalline structure layer is Nc, and the refractive index of the substrate is Ns, satisfying the condition: Ns < Nc. Combining a substrate with a low refractive index with a nanocrystalline structure layer with a high refractive index can reduce secondary reflections within the optical plate.

[0086] The height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 120nm < Hc < 350nm. Combined with an optical bonding film layer, it can effectively improve the height range of transmittance. Additionally, it satisfies the following condition: 150nm < Hc < 300nm. This allows for the provision of more uniformly sized nanocrystals and higher coating quality.

[0087] The nanocrystalline structure layer can be arranged irregularly and can be arranged in a non-fixed periodic pattern. By using a non-fixed periodic arrangement, optical diffraction of the nanocrystalline structure layer can be avoided, and the actual optical path of the imaging light rays can be made to better conform to the preset path.

[0088] The substrate for the optical flat panel can be a glass substrate. This makes mass production easier.

[0089] The imaging lens group can be a main lens, a telephoto lens, or a wide-angle lens. The camera module can be an automotive camera module, a mobile device camera module, or a head-mounted device camera module, but this disclosure is not limited thereto.

[0090] The various technical features in the camera module disclosed above can be combined and configured to achieve the corresponding effects.

[0091] This disclosure provides an electronic device that includes the aforementioned camera module. This allows for improved image quality.

[0092] Based on the above implementation methods, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0093] <First Implementation Method>

[0094] Please refer to Figure 1A and Figure 1B ,in Figure 1A A schematic diagram of the camera module 100 according to the first embodiment of this disclosure is shown. Figure 1B Drawing according to Figure 1A A schematic diagram of part of the optical path of the camera module 100 in the first embodiment. Figure 1A As can be seen, the camera module 100 includes an imaging lens group 110, an optical plate 120, and an electronic image sensor 130. The imaging lens group 110, the optical plate 120, and the electronic image sensor 130 are arranged sequentially from the object side to the image side along the optical axis X of the camera module 100. The electronic image sensor 130 is disposed on an imaging surface 131 of the imaging lens group 110, and the optical plate 120 is disposed between the imaging lens group 110 and the electronic image sensor 130. This is in conjunction with a reference... Figure 1B It can be seen that the setting of the optical plate 120 can reduce reflectivity and reduce the generation of stray light.

[0095] The imaging lens group 110 can be disposed in a lens barrel 140 and includes multiple lenses. The lens closest to the image side of the camera module 100 is an image-side lens 111, and its image-side surface is an image-side optical surface 1112 of the imaging lens group 110. The image-side optical surface 1112 is an optical aspherical surface, and the optical aspherical surface has at least one inflection point IP. In addition, other optical elements, such as light shields, spacers, and fixing rings, can be disposed in the lens barrel 140 as needed, which will not be described in detail here.

[0096] The optical plate 120 includes a substrate 121 and at least one antireflective film layer 122. The substrate 121 has an object-side surface and an image-side surface, the object-side surface and the image-side surface facing the object side and the image side respectively and being parallel to each other. The antireflective film layer 122 is disposed on at least one of the object-side surface and the image-side surface of the substrate 121. Please refer to the reference. Figure 1C Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 in the first embodiment. (From...) Figure 1A as well as Figure 1C It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0097] In detail, in the first embodiment of the first implementation, the optical plate 120 may be an infrared light filter, which may further include an infrared light filter film layer 123 disposed between the image-side surface of the substrate 121 and the optical connection film layer 1222 of the anti-reflection film layer 122. The optical connection film layer 1222 in the anti-reflection film layer 122 on the object-side surface of the substrate 121 connects the substrate 121 and the nanocrystalline structure layer 1221. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection film layer 1222. The substrate 121 may be a glass substrate. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection film layer 1222 is made of silicon dioxide. The infrared light filter film layer 123 can absorb and reflect infrared light, but this disclosure is not limited thereto.

[0098] In the first embodiment of the first implementation, the refractive index of the substrate 121 is Ns, the refractive index of the nanocrystalline structure layer 1221 is Nc, the refractive index of the optical connection film layer 1222 is Nf, the height of the nanocrystalline structure layer 1221 is Hc, the thickness of the optical connection film layer 1222 is Hf, and the total height of the anti-reflection film layer 122 is H, which satisfies the conditions in Table 1 below.

[0099]

[0100] As shown in Table 1 above, the first embodiment of the first implementation satisfies the following conditions: Nf < Nc; Hf + Hc = H; Hf < Hc; and Ns < Nc. It must be noted that subsequent embodiments of the first implementation also satisfy the aforementioned conditions, and the actual parameter values ​​may be the same as or different from those in Table 1. The contents of this disclosure will not be listed in any of the embodiments.

[0101] Please refer to Figure 1D and Figure 1E ,in Figure 1D To observe using an electron microscope Figure 1A A photograph of the nanocrystalline structure layer 1221 on the surface of the optical flat plate 120. Figure 1E This is another photograph taken using an electron microscope to observe the nanocrystalline structure layer 1221 on the surface of the optical plate 120. Figure 1C , Figure 1D and Figure 1E It is known that the nanocrystalline structure layer 1221 is arranged in an irregular shape. Through the non-fixed periodic arrangement, optical diffraction of the nanocrystalline structure layer 1221 can be avoided, and the actual optical path of the imaging light rays can be made to conform to the preset path.

[0102] Please refer to Figure 1F and Figure 1G ,in Figure 1F To observe using an electron microscope Figure 1A Cross-sectional view of antireflective coating 122. Figure 1G For another observation using an electron microscope Figure 1A Cross-sectional view of antireflective coating 122. Figure 1F It can be seen that the height of the nanocrystalline structure layer 1221 is Hc, and the thickness of the optical connection film layer 1222 is Hf, which satisfies the following conditions: Hc = 200.3 nm; and Hf = 73.68 nm. From Figure 1G It can be seen that the height of the nanocrystalline structure layer 1221 is Hc, and the thickness of the optical connection film layer 1222 is Hf, which satisfies the following conditions: Hc = 232.7 nm; and Hf = 76.62 nm. From Figure 1C , Figure 1F and Figure 1G It can be seen that there is no gap between the top of the optical connection film layer 1222 and the bottom of the nanocrystalline structure layer 1221, and the two layers are tightly bonded. The nanocrystalline structure layer 1221 does not form a complete plane, so part of the top of the optical connection film layer 1222 can be in contact with air. To further explain, by first depositing the optical connection film layer 1222 on the substrate 121 and then depositing the nanocrystalline structure layer 1221, the setting of the optical connection film layer 1222 makes it easier for the nanocrystalline structure layer 1221 to be deposited on the optical plate 120, thereby improving the structural stability of the anti-reflection film layer 122.

[0103] Depending on different needs, six different optical flat plates 120 can be provided, namely the second embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, and the sixth embodiment. For clarity, the optical flat plates 120 and corresponding components in the second embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, and the sixth embodiment are all represented by the same numbers. The configuration relationships of other components in the second embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, and the sixth embodiment are the same as those in the first embodiment of the first implementation, and will not be described again here.

[0104] Please refer to Figure 2 Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 in the second embodiment of the first embodiment. (From...) Figure 1A , Figure 1C as well as Figure 2 It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0105] In detail, Figure 2In the second embodiment, the substrate 121 can be a blue glass substrate, which can absorb infrared light, making the optical plate 120 an infrared light filter. In the anti-reflective film layers 122 located on the object-side and image-side surfaces of the substrate 121, the optical connection layer 1222 connects the substrate 121 and the nanocrystalline structure layer 1221. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection layer 1222. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection layer 1222 is made of silicon dioxide.

[0106] Please refer to Figure 3 Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 in the third embodiment of the first embodiment. (From...) Figure 1A , Figure 1C as well as Figure 3 It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0107] In detail, in the third embodiment of the first embodiment, the optical plate 120 can be a filter, which may further include a polarizing film layer 124 disposed between the object-side surface of the substrate 121 and the optical connection film layer 1222 of the anti-reflection film layer 122. The optical connection film layer 1222 connects the substrate 121 and the nanocrystalline structure layer 1221 in the anti-reflection film layer 122 located on the image-side surface of the substrate 121. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection film layer 1222. The substrate 121 can be a glass substrate. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection film layer 1222 is made of silicon dioxide. The polarizing film layer 124 can absorb light in a specific electric field direction to achieve the effect of filtering light, but this disclosure is not limited to this.

[0108] Please refer to Figure 4 Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 in the fourth embodiment of the first embodiment. (From...) Figure 1A , Figure 1C as well as Figure 4 It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0109] In detail, in the fourth embodiment of the first implementation, the substrate 121 can be a neutral density filter, which has the function of absorbing a specific proportion of light, making the optical plate 120 a filter that absorbs a specific proportion of light. In the antireflective film layers 122 located on the object-side and image-side surfaces of the substrate 121, the optical connection film layers 1222 are connected to both the substrate 121 and the nanocrystalline structure layer 1221. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection film layers 1222. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection film layer 1222 is made of silicon dioxide.

[0110] Please refer to Figure 5 Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 of the fifth embodiment in the first embodiment. (From...) Figure 1A , Figure 1C as well as Figure 5 It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0111] In detail, in the fifth embodiment of the first embodiment, the substrate 121 can be a liquid crystal film layer. By adjusting the voltage, the liquid crystal film layer can filter out or allow light in a specific electric field direction to pass through, making the optical plate 120 a filter. In the anti-reflective film layers 122 located on the object-side and image-side surfaces of the substrate 121, the optical connection film layers 1222 are connected to both the substrate 121 and the nanocrystalline structure layer 1221. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection film layers 1222. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection film layer 1222 is made of silicon dioxide.

[0112] Please refer to Figure 6 Its drawing is based on Figure 1A A schematic diagram of the optical flat plate 120 of the sixth embodiment in the first embodiment. (From...) Figure 1A , Figure 1C as well as Figure 6 It is known that there are two anti-reflective film layers 122, which are respectively disposed on the object-side surface and the image-side surface of the substrate 121. Each anti-reflective film layer 122 includes a nanocrystalline structure layer 1221 and an optical connection film layer 1222.

[0113] In detail, in the sixth embodiment of the first embodiment, the optical plate 120 may be a filter, and may further include a Fresnel lens 125 disposed between the object-side surface of the substrate 121 and the optical connection layer 1222 of the anti-reflection film layer 122. The optical connection layer 1222 in the anti-reflection film layer 122 on the image-side surface of the substrate 121 connects the substrate 121 and the nanocrystalline structure layer 1221. The nanocrystalline structure layers 1221 on both sides of the substrate 121 are in direct physical contact with the optical connection layer 1222. The substrate 121 may be a glass substrate. The nanocrystalline structure layer 1221 contains a metal oxide crystal and is irregularly arranged. The optical connection layer 1222 is made of silicon dioxide. The Fresnel lens 125 can be used to adjust the angle of the imaging light, but this disclosure is not limited thereto.

[0114] <Second Implementation Method>

[0115] Please refer to Figure 7 The diagram illustrates a camera module 200 according to the second embodiment of this disclosure. Figure 7 As can be seen, the camera module 200 includes an imaging lens group 210, an optical plate 220, and an electronic image sensor 230. The imaging lens group 210, the optical plate 220, and the electronic image sensor 230 are arranged sequentially from the object side to the image side along the optical axis X of the camera module 200. The electronic image sensor 230 is disposed on an imaging surface 231 of the imaging lens group 210, and the optical plate 220 is disposed between the imaging lens group 210 and the electronic image sensor 230. Therefore, the placement of the optical plate 220 can reduce reflectivity and decrease the generation of stray light.

[0116] The camera module 200 may also include a light-deflecting element 211, which is disposed on the outermost side of the imaging lens group 210. This allows the light path to be adjusted so that it enters the electronic photosensitive element 230 along the optical axis.

[0117] The imaging lens group 210 can be disposed in a lens barrel 240 and includes multiple lenses. In addition, other optical elements, such as light shields, spacers, and fixing rings, can be disposed in the lens barrel 240 as needed, which will not be described in detail here.

[0118] The optical flat panel 220 includes a substrate 221 and at least one anti-reflective film layer 222. The substrate 221 has an object-side surface and an image-side surface, which face the object side and the image side respectively and are parallel to each other. The anti-reflective film layer 222 is disposed on at least one of the object-side surface and the image-side surface of the substrate 221. In a second embodiment, there are two anti-reflective film layers 222, which are disposed on the object-side surface and the image-side surface of the substrate 221 respectively.

[0119] Depending on different optical requirements, in the camera module 200 of the second embodiment, the optical flat plate 220 may be any of the first, second, third, fourth, fifth and sixth embodiments of the first embodiment, but the content of this disclosure is not limited thereto.

[0120] In the first embodiment of the second implementation, the refractive index of the substrate 221 is Ns, the refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection film layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection film layer is Hf, and the total height of the anti-reflection film layer 222 is H, which satisfies the conditions in Table 2 below.

[0121]

[0122] As can be seen from Table 2 above, the first embodiment of the second implementation satisfies the following conditions: Nf < Nc; Hf + Hc = H; Hf < Hc; and Ns < Nc.

[0123] <Third Implementation Method>

[0124] Please refer to Figure 8 The diagram illustrates a camera module 300 according to the third embodiment of this disclosure. Figure 8 As can be seen, the camera module 300 includes an imaging lens group 310, an optical plate 320, and an electronic image sensor 330. The imaging lens group 310, the optical plate 320, and the electronic image sensor 330 are arranged sequentially from the object side to the image side along the optical axis X of the camera module 300. The electronic image sensor 330 is disposed on an imaging surface 331 of the imaging lens group 310, and the optical plate 320 is disposed between the imaging lens group 310 and the electronic image sensor 330. Therefore, the placement of the optical plate 320 can reduce reflectivity and decrease the generation of stray light.

[0125] An imaging lens group 310 may be disposed within a lens barrel 340 and includes multiple lenses. The lenses are arranged sequentially from the object side to the image side along the optical axis X of the camera module 300. The lens closest to the image side of the camera module 300 is an image-side lens 311, whose image-side surface is an image-side optical surface 3112 of the imaging lens group 310. The image-side optical surface 3112 is an aspherical surface, and the aspherical surface has at least one inflection point IP. Additionally, other optical elements, such as light-blocking plates, spacers, and fixing rings, may be disposed in the lens barrel 340 as needed, which will not be described further here.

[0126] The optical plate 320 is located on the image side of the lens barrel 340 and can be mounted on the image side of the lens barrel 340. The optical plate 320 includes a substrate 321 and at least one anti-reflective film layer 322. The substrate 321 has an object-side surface and an image-side surface, which face the object side and the image side respectively and are parallel to each other. The anti-reflective film layer 322 is disposed on at least one of the object-side surface and the image-side surface of the substrate 321. In the third embodiment, there are two anti-reflective film layers 322, which are disposed on the object-side surface and the image-side surface of the substrate 321 respectively.

[0127] Depending on different optical requirements, in the camera module 300 of the third embodiment, the optical flat plate 320 may be any of the first, second, third, fourth, fifth and sixth embodiments of the first embodiment, but this disclosure does not take that as the case.

[0128] In the first embodiment of the third implementation, the refractive index of the substrate 321 is Ns, the refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection film layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection film layer is Hf, and the total height of the anti-reflection film layer 322 is H, which satisfies the conditions in Table 3 below.

[0129]

[0130] As can be seen from Table 3 above, the first embodiment of the third implementation satisfies the following conditions: Nf < Nc; Hf + Hc = H; Hf < Hc; and Ns < Nc.

[0131] <Fourth Implementation Method>

[0132] Please refer to Figure 9A and Figure 9B . Figure 9A A schematic diagram of the electronic device 40 according to the fourth embodiment of this disclosure is shown. Figure 9B Drawing according to Figure 9A Another schematic diagram of the electronic device 40 in the fourth embodiment. Figure 9A and Figure 9B As can be seen, the electronic device 40 of the fourth embodiment is a smartphone. The electronic device 40 includes a camera module (not shown) and an electronic photosensitive element (not shown). The electronic photosensitive element is disposed on the imaging surface of the camera module (not shown). The camera module includes an ultra-wide-angle camera module 42, a high-pixel camera module 43, and a telephoto camera module 44.

[0133] Furthermore, the telephoto camera module 44 can be any of the camera modules described in the first to third embodiments, but this disclosure is not limited thereto. This helps to meet the current market requirements for mass production and aesthetics of camera modules mounted on electronic devices.

[0134] The user enters the shooting mode through the user interface 41 of the electronic device 40. In the fourth embodiment, the user interface 41 can be a touch screen, which is used to display the screen and has touch function. It can also be used to manually adjust the shooting angle to switch between different camera modules. At this time, the camera module gathers the imaging light onto the electronic photosensitive element and outputs the relevant electronic signal of the image to the image signal processing element (ISP) 45.

[0135] Depend on Figure 9B As can be seen, depending on the camera specifications of the electronic device 40, the electronic device 40 may also include an optical image stabilization component (not shown in the figure). Furthermore, the electronic device 40 may also include at least one focus assist module (not shown in the figure) and at least one sensing element (not shown in the figure). The focus assist module may be a color temperature compensated flash module 46, an infrared rangefinder, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and kinetic energy, such as an accelerometer, a gyroscope, or a Hall effect element, to sense the shaking and tremors caused by the user's hand or the external environment. This is beneficial to the autofocus function and optical image stabilization component configured in the camera module of the electronic device 40, so as to obtain good image quality and help the electronic device 40 according to the present disclosure to have multiple shooting modes, such as optimized Selfie, low light HDR (High Dynamic Range) imaging, and high resolution 4K video recording. In addition, users can directly view the camera's shooting screen through the user interface 41 and manually operate the framing range on the user interface 41 to achieve the WYSIWYG autofocus function.

[0136] Furthermore, the camera module, electronic image sensor, optical image stabilization component, sensing element, and focus assist module can be mounted on a flexible printed circuit board (FPC) (not shown), and electrically connected to the imaging signal processing element 45 and other related components via a connector (not shown) to execute the shooting process. Current electronic devices, such as smartphones, are trending towards thinner and lighter designs. Mounting the camera module and related components on a flexible printed circuit board, and then using a connector to integrate the circuitry onto the mainboard of the electronic device, satisfies the structural design and circuit layout requirements of the limited internal space of the electronic device, providing greater flexibility. It also allows for more flexible control of the camera module's autofocus function through the device's touchscreen. In the fourth embodiment, the electronic device 40 may include multiple sensing elements and multiple focus assist modules. The sensing elements and focus assist modules are mounted on a flexible printed circuit board and at least one other flexible printed circuit board (not shown), and electrically connected to the imaging signal processing element 45 and other related components via corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensing element and auxiliary optical element may also be mounted on the motherboard of the electronic device or other types of carrier boards, depending on the mechanical design and circuit layout requirements.

[0137] Furthermore, the electronic device 40 may further include, but is not limited to, a display unit, a control unit, a storage unit, random access memory (RAM), read-only memory (ROM), or a combination thereof.

[0138] Figure 9C Drawing according to Figure 9A A schematic diagram of an image captured by the electronic device 40 in the fourth embodiment. Figure 9C It can be seen that the ultra-wide-angle camera module 42 can capture images of a larger range and has the function of capturing more scenery.

[0139] Figure 9D Drawing according to Figure 9A A schematic diagram of another image captured by the electronic device 40 in the fourth embodiment. Figure 9D It can be seen that the high-pixel camera module 43 can capture images within a certain range and also has high pixel count, with high resolution and low distortion.

[0140] Figure 9E Drawing according to Figure 9A A further image illustration captured by the electronic device 40 in the fourth embodiment. Figure 9E It is known that the telephoto camera module 44 has a high magnification function, which can capture images at a distance and magnify them to a high degree.

[0141] Depend on Figures 9C to 9EIt is understood that by using camera modules with different focal lengths for framing and combining them with image processing technology, the electronic device 40 can achieve the function of zooming.

[0142] <Fifth Implementation>

[0143] Please refer to Figure 10 , Figure 10 A schematic diagram of the electronic device 50 according to the fifth embodiment of this disclosure is shown. Figure 10 It is known that the electronic device 50 is a smartphone, and the electronic device 50 includes a camera module (not shown) and an electronic image sensor (not shown). The electronic image sensor is disposed on the imaging surface of the camera module (not shown). The camera module includes ultra-wide-angle camera modules 51 and 52, wide-angle camera modules 53 and 54, telephoto camera modules 55, 56, 57 and 58, and a TOF module (Time-Of-Flight) 59. The TOF module 59 may also be other types of image acquisition devices and is not limited to this configuration.

[0144] Furthermore, the telephoto camera modules 55, 56, 57, and 58 can be any of the camera modules described in the first to third embodiments, but this disclosure is not limited thereto. This helps to meet the current market requirements for mass production and aesthetics of camera modules mounted on electronic devices.

[0145] Furthermore, telephoto camera modules 57 and 58 are used to deflect light, but this disclosure is not limited to this.

[0146] Depending on the camera specifications of the electronic device 50, the electronic device 50 may also include an optical image stabilization component (not shown). Furthermore, the electronic device 50 may also include at least one focus assist module (not shown) and at least one sensing element (not shown). The focus assist module may be a color temperature-compensating flash module 501, an infrared rangefinder, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and kinetic energy, such as an accelerometer, gyroscope, or Hall effect sensor, to sense the shaking and tremors caused by the user's hand or the external environment. This facilitates the performance of the autofocus function and optical image stabilization component configured in the camera module of the electronic device 50, resulting in good image quality. This helps the electronic device 50 according to this disclosure to have multiple shooting modes, such as optimized Selfie, low-light HDR, and high-resolution 4K video recording.

[0147] Furthermore, the structure and arrangement of the remaining components in the fifth embodiment are the same as those in the fourth embodiment, and will not be described again here.

[0148] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope defined in the appended claims.

Claims

1. A camera module, characterized in that, Include: One imaging lens group; An electronic photosensitive element is disposed on an imaging surface of the imaging lens group; and An optical flat plate, disposed between the imaging lens group and the electronic photosensitive element, includes: A substrate having an object-side surface and an image-side surface, the object-side surface and the image-side surface facing the object side and the image side respectively and being parallel to each other; and At least one anti-reflective film layer is disposed on the image-side surface of the substrate. The at least one anti-reflective film layer includes a nanocrystalline structure layer and an optical connection film layer. The nanocrystalline structure layer includes a metal oxide crystal. The optical connection film layer connects the substrate and the nanocrystalline structure layer, and the nanocrystalline structure layer is in direct physical contact with the optical connection film layer. The top portion of the optical connection film is in contact with air. Wherein, the refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection film layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection film layer is Hf, and the total height of the antireflective film layer is H, which satisfies the following conditions: Nf < Nc; Hf + Hc = H; and Hf < Hc.

2. The camera module according to claim 1, characterized in that, The number of at least one antireflective film layers is two, and they are respectively disposed on the object-side surface and the image-side surface of the substrate.

3. The camera module according to claim 1, characterized in that, The optical plate is a polarizer.

4. The camera module according to claim 1, characterized in that, One image-side optical surface of the imaging lens group is an optical aspherical surface, and the optical aspherical surface has at least one inflection point.

5. The camera module according to claim 1, characterized in that, The thickness of the optical connection film is Hf, and it satisfies the following condition: 20 nm < Hf < 120 nm.

6. The camera module according to claim 5, characterized in that, The thickness of the optical connection film is Hf, and it satisfies the following condition: 40 nm < Hf < 90 nm.

7. The camera module according to claim 1, characterized in that, The refractive index of the nanocrystalline structure layer is Nc, and the refractive index of the substrate is Ns, which satisfy the following conditions: Ns < Nc.

8. The camera module according to claim 1, characterized in that, The height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 120 nm < Hc < 350 nm.

9. The camera module according to claim 8, characterized in that, The height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 150 nm < Hc < 300 nm.

10. The camera module according to claim 1, characterized in that, The nanocrystalline structure layers are arranged in an irregular pattern.

11. The camera module according to claim 1, characterized in that, The substrate of the optical flat plate is a glass substrate.

12. An electronic device, characterized in that, Include: The camera module as described in claim 1.

13. A camera module, characterized in that, Include: One imaging lens group; An electronic photosensitive element is disposed on an imaging surface of the imaging lens group; and An optical flat plate, disposed between the imaging lens group and the electronic photosensitive element, includes: A substrate having an object-side surface and an image-side surface, the object-side surface and the image-side surface facing the object side and the image side respectively and being parallel to each other; and At least one anti-reflective film layer is disposed on the object-side surface of the substrate. The at least one anti-reflective film layer includes a nanocrystalline structure layer and an optical connection film layer. The nanocrystalline structure layer includes a metal oxide crystal. The optical connection film layer connects the substrate and the nanocrystalline structure layer, and the nanocrystalline structure layer is in direct physical contact with the optical connection film layer. The top portion of the optical connection film is in contact with air. Wherein, the refractive index of the nanocrystalline structure layer is Nc, the refractive index of the optical connection film layer is Nf, the height of the nanocrystalline structure layer is Hc, the thickness of the optical connection film layer is Hf, and the total height of the antireflective film layer is H, which satisfies the following conditions: Nf < Nc; Hf + Hc = H; and Hf < Hc.

14. The camera module according to claim 13, characterized in that, The optical plate is an infrared light filter.

15. The camera module according to claim 13, characterized in that, The thickness of the optical connection film is Hf, and it satisfies the following condition: 20 nm < Hf < 120 nm.

16. The camera module according to claim 15, characterized in that, The thickness of the optical connection film is Hf, and it satisfies the following condition: 40 nm < Hf < 90 nm.

17. The camera module according to claim 13, characterized in that, The height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 120 nm < Hc < 350 nm.

18. The camera module according to claim 17, characterized in that, The height of the nanocrystalline structure layer is Hc, which satisfies the following condition: 150 nm < Hc < 300 nm.

19. The camera module according to claim 13, characterized in that, One image-side optical surface of the imaging lens group is an optical aspherical surface, and the optical aspherical surface has at least one inflection point.

20. The camera module according to claim 13, characterized in that, The nanocrystalline structure layers are arranged in an irregular pattern.

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