一种标识位置确定方法、设备及系统
By using automated program calculations and process simulations, the optimal placement position of semiconductor dicing marks is determined, solving the problems of low efficiency and low accuracy in mark position determination, and achieving more efficient mark position control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2022-09-23
- Publication Date
- 2026-07-17
AI Technical Summary
In the semiconductor manufacturing process, determining the position of the markings on the dicing track is inefficient and inaccurate. Especially in the DRAM R&D stage, manually placing the markings cannot meet the actual process requirements.
By acquiring the wafer design layout, manufacturing process information, and marking design drawings, the product is simulated based on the 3D model and manufacturing conditions to determine the optimal location point with the minimum thickness, and the marking is automatically placed. The marking position is calculated and the process is simulated using an automated program.
It improves the accuracy of the marking position on the cutting track, reduces the impact of the loading effect, and improves the efficiency of marking position determination.
Smart Images
Figure CN115470744B_ABST