A die bonder head pressure early warning device

Abstract

The present application belongs to the technical field of die bonding head pressure early warning, and particularly relates to a die bonder die bonding head pressure early warning device. The die bonder die bonding head pressure early warning device comprises a wafer pickup device and a buffer module. The wafer pickup device comprises a lifting module and a rotating module. The lifting module is used to drive the rotating module to move up and down. When the pressure of the suction nozzle exceeds the critical value, the buffer module allows the central shaft to slightly move into the interior of the wafer pickup device, so as to reduce the pressure received by the suction nozzle, protect the suction nozzle and the wafer, and improve the service life and safety. When the pressure of the suction nozzle is abnormal, the buffer module works to buffer while the recording module changes shape to mechanically record the pressure abnormality, so that the worker can directly observe that the pressure of the suction nozzle is abnormal. In addition, the worker can observe the frequency of pressure abnormality of different suction nozzles in the same time period according to the shape of the recording module.

Description

Technical Field

[0001] This invention belongs to the field of die bond head pressure early warning technology, and specifically relates to a die bonder die bond head pressure early warning device. Background Technology

[0002] In the field of die bonding technology, a pick-up and die bonding operation is performed using a nozzle. During pick-up, the nozzle is positioned above the wafer disk, and the ejector pin is positioned below the wafer disk. A blue film is installed on the wafer disk, and the wafer rests on the blue film. The ejector pin lifts the wafer from below, and then the nozzle picks up the wafer, completing the pick-up operation. To prevent abnormal nozzle pressure, a pressure warning device is typically installed to detect the nozzle pressure.

[0003] However, during die pick-up, the nozzle lacks a buffer device, which can easily damage the wafer or the nozzle itself if the pressure exceeds the maximum limit. Furthermore, when the nozzle pressure is abnormal or malfunctions, the abnormal data is usually fed back to the die bonder's control terminal. The control terminal issues instructions, records the abnormal data, and controls the nozzle to reset for another die pick-up operation. The die bonder does not stop operating as a result. However, the software-recorded data is lost when the terminal malfunctions. If staff do not check the alarm records, they will not know that a pressure abnormality has occurred. Existing pressure warning devices do not have a mechanical recording method, making it impossible for staff to visually observe abnormal nozzle pressure.

[0004] For example, Chinese patent CN215680645U discloses a pressure-measuring die bonding head and pressure warning device, including a motor, a nozzle, a force transmission component, and a pressure sensor. The motor includes a motor body and a motor spindle connected to the motor body. The nozzle is connected to the motor spindle. When the motor spindle moves, it will drive the force transmission component to move accordingly. When the force transmission component moves, it will squeeze the pressure sensor. However, there is no buffering when the pressure is abnormal, and there is no mechanical recording method. Summary of the Invention

[0005] The purpose of this invention is to provide a die bonder head pressure early warning device that can buffer the nozzle and wafer when the nozzle malfunctions, thereby reducing the damage caused by excessive pressure. At the same time, it can mechanically record when the pressure is abnormal, so that the staff can intuitively observe the abnormal pressure of the nozzle. The combination of mechanical and software recording improves the accuracy of data recording.

[0006] The specific technical solution adopted by this invention is as follows:

[0007] A die bonder head pressure warning device, comprising:

[0008] A wafer pickup device includes a lifting module and a rotating module. The lifting module is used to drive the rotating module to move up and down. The rotating module includes a drive motor and a central shaft. The drive motor is mounted on the wafer pickup device. The central shaft is mounted on the output end of the drive motor. A suction nozzle is mounted on the lower end of the central shaft. A pressure sensor is mounted on the lower end of the drive motor and located outside the central shaft.

[0009] A buffer module is installed between the pressure sensor and the nozzle, and the buffer module is used to reduce the pressure on the pressure sensor;

[0010] A recording module is installed on the outside of the wafer pickup device. One end of the recording module is connected to a buffer module. The recording module is used to record abnormalities in the nozzle pressure.

[0011] In a preferred embodiment, the buffer module includes a fixed tube a, an electromagnet a, an electromagnet b, a fixed tube b, and a connecting ring. The fixed tube a is fixed to the lower end of the pressure sensor, the electromagnet a is fixed to the outer side of the lower end of the fixed tube a, the connecting ring is fixed to the upper end of the suction nozzle, the fixed tube b is rotatably connected to the upper end of the connecting ring, the electromagnet b is fixed inside the upper end of the fixed tube b, and the electromagnet b is located above the electromagnet a.

[0012] In a preferred embodiment, both electromagnet a and electromagnet b are circular rings.

[0013] In a preferred embodiment, the outer diameter of electromagnet a is smaller than the inner diameter of fixed tube b, and the inner diameter of electromagnet b is larger than the outer diameter of fixed tube a.

[0014] In a preferred embodiment, the recording module includes a fixed frame a, a fixed rod a, an iron pipe a, a lower support plate, an upper support plate, an electromagnet c, and a proximity switch a. The fixed frame a is fixed to the outside of the fixed pipe b, the fixed rod a is fixed to the upper end of the fixed frame a, the lower support plate is fixed to one side of the wafer pickup device and slidably connected to the fixed rod a, the upper support plate is also fixed to the outside of the wafer pickup device and slidably connected to the fixed rod a, the iron pipe a is slidably connected to the outside of the fixed rod a and located between the lower support plate and the upper support plate, the electromagnet c is fixed to the outside of the wafer pickup device and located at the lower part of the upper support plate, and the proximity switch a is fixed to the outside of the wafer pickup device and located at the lower part of the electromagnet c.

[0015] In a preferred embodiment, a rubber ring is provided inside the iron pipe a, and the rubber ring is slidably connected to the fixed rod a, with an interference fit between the rubber ring and the fixed rod a.

[0016] In a preferred embodiment, the attractive force between the electromagnet c and the iron pipe a is greater than the frictional force between the rubber ring and the fixed rod a, and the frictional force between the rubber ring and the fixed rod a is greater than the weight of the iron pipe a and the rubber ring.

[0017] In a preferred embodiment, the recording module includes a fixed frame b, a fixed rod b, an iron pipe b, a limiting plate, a friction strip, a rotating shaft, a torsion spring, and a proximity switch b. The fixed frame b is fixed to the outside of the fixed pipe b, the fixed rod b is fixed to the upper end of the fixed frame b, the limiting plate is fixed to one side of the wafer pickup device and slidably connected to the fixed rod b, the iron pipe b is slidably connected to the outside of the fixed rod b and located above the limiting plate, the friction strip is rotatably connected to the wafer pickup device near the iron pipe b, the rotating shaft is fixed to one end of the friction strip near the wafer pickup device, the torsion spring is disposed on the outside of the friction strip, one end of the torsion spring is fixedly connected to the wafer pickup device, the other end of the torsion spring is fixedly connected to the rotating shaft, and the proximity switch b is fixed to one side of the wafer pickup device and located above the iron pipe b.

[0018] In a preferred embodiment, when the fixed rod b moves upward, the iron pipe b moves upward along with the fixed rod b. When the iron pipe b moves upward, the frictional force between the iron pipe b and the fixed rod b is greater than the frictional force between the friction strip and the iron pipe b. When the fixed rod b moves upward and then moves downward to return to its original position, the iron pipe b remains stationary. When the iron pipe b remains stationary, the frictional force between the friction strip and the iron pipe b is greater than the frictional force between the iron pipe b and the fixed rod b.

[0019] In a preferred embodiment, two alarm lights are installed on the outer side of the fixed tube b.

[0020] The technical effects achieved by this invention are as follows:

[0021] This invention, when the pressure of the suction nozzle exceeds a critical value, allows the central axis to be slightly moved into the interior of the wafer pickup device through a buffer module, thereby reducing the pressure on the suction nozzle, protecting the suction nozzle and the wafer, and improving service life and safety.

[0022] In this invention, when the pressure of the suction nozzle becomes abnormal, the buffer module works to buffer the pressure while causing the recording module to change shape and mechanically record the pressure abnormality. This allows the staff to directly observe the abnormal pressure of the suction nozzle. At the same time, the frequency of pressure abnormalities in different suction nozzles within the same time period can be observed based on the shape of the recording module. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is the front view of the present invention;

[0025] Figure 3 This is a schematic diagram of the connection between the central shaft, nozzle, pressure sensor, and buffer module in this invention;

[0026] Figure 4 This is the present invention. Figure 3 Enlarged view of point A in the middle;

[0027] Figure 5 This is a side view of the installation of the first recording module and the wafer pickup device of the present invention;

[0028] Figure 6 This is the present invention. Figure 5 Enlarged view of point B in the middle;

[0029] Figure 7 This is a schematic diagram of the structure of the first recording module of the present invention;

[0030] Figure 8 This is a side view of the installation of the second recording module and the wafer pickup device according to the present invention;

[0031] Figure 9 This is the present invention. Figure 8 Enlarged view of point C in the middle;

[0032] Figure 10 This is the present invention. Figure 9 Enlarged view at point D;

[0033] Figure 11 This is a schematic diagram of the structure of the second recording module of the present invention.

[0034] The attached diagram lists the components represented by each number as follows:

[0035] 1. Wafer pickup device; 2. Central shaft; 3. Nozzle; 4. Pressure sensor; 11. Fixing tube a; 12. Electromagnet a; 13. Electromagnet b; 14. Fixing tube b; 15. Connecting ring; 21. Fixing frame a; 22. Fixing rod a; 23. Iron pipe a; 24. Lower support plate; 25. Upper support plate; 26. Electromagnet c; 27. Proximity switch a; 31. Fixing frame b; 32. Fixing rod b; 33. Iron pipe b; 34. Limiting plate; 35. Friction strip; 36. Rotating shaft; 37. Torsion spring; 38. Proximity switch b. Detailed Implementation

[0036] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in a preferred embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that mutually excludes other embodiments.

[0039] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0040] Example 1

[0041] Please see the appendix Figure 1 and Figure 2 As shown, this is the first embodiment of the present invention. This embodiment provides a die bonder head pressure warning device, including a wafer pickup device 1 and a buffer module. The wafer pickup device 1 includes a lifting module and a rotating module. The lifting module is used to drive the rotating module to move up and down. The rotating module includes a drive motor and a central shaft 2. The drive motor is mounted on the wafer pickup device 1. The central shaft 2 is mounted on the output end of the drive motor. A suction nozzle 3 is mounted on the lower end of the central shaft 2. A pressure sensor 4 is mounted on the lower end of the drive motor and located outside the central shaft 2. The buffer module is installed between the pressure sensor 4 and the suction nozzle 3. The buffer module is used to reduce the pressure on the pressure sensor 4.

[0042] Specifically, when the lifting module drives the nozzle 3 to approach the wafer and pick up the wafer, the nozzle 3 is subjected to the reaction force of the wafer, which will cause a slight axial movement of the central axis 2. The pressure sensor 4 detects the reaction force on the nozzle 3, which is the pressure on the nozzle 3. When the pressure is abnormal, the data detected by the pressure sensor 4 is fed back to the control terminal of the die bonder, and at the same time, the buffer module is activated to reduce the pressure on the nozzle 3. When the buffer module is activated, the control terminal controls the wafer pickup device 1 to reset and controls the wafer pickup device 1 so that the nozzle 3 can perform the wafer picking operation again.

[0043] In a preferred embodiment, please refer to Figure 3 and Figure 4The buffer module includes a fixed tube a11, an electromagnet a12, an electromagnet b13, a fixed tube b14, and a connecting ring 15. The fixed tube a11 is fixed to the lower end of the pressure sensor 4, the electromagnet a12 is fixed to the outer side of the lower end of the fixed tube a11, the connecting ring 15 is fixed to the upper end of the suction nozzle 3, the fixed tube b14 is rotatably connected to the upper end of the connecting ring 15, and the electromagnet b13 is fixed inside the upper end of the fixed tube b14, with the electromagnet b13 located above the electromagnet a12.

[0044] Furthermore, both electromagnets a12 and b13 are circular rings. The outer diameter of electromagnet a12 is smaller than the inner diameter of fixed tube b14, and the inner diameter of electromagnet b13 is larger than the outer diameter of fixed tube a11, so as to avoid affecting the relative movement of fixed tube a11 and fixed tube b14.

[0045] It should be noted that during the crystal extraction operation, electromagnets a12 and b13 are in a state of mutual attraction, and the value of the mutual attraction between electromagnets a12 and b13 is greater than the maximum value of the pressure abnormal range set by pressure sensor 4. This prevents electromagnets a12 and b13 from separating when the pressure on the suction nozzle 3 does not reach the set value of pressure sensor 4, thus ensuring the accuracy of pressure warning.

[0046] In this embodiment, when the nozzle 3 is subjected to the reaction force of the wafer, it causes a slight axial movement of the central axis 2, which causes the electromagnet b13 to press the connecting ring 15 upward, press the fixing tube b14 and the fixing tube a11, and then press the pressure sensor 4. At this time, the force detected by the pressure sensor 4 is the pressure on the nozzle 3. When the pressure exceeds the maximum value set by the pressure sensor 4, the electromagnets a12 and b13 stop supplying power, which causes the wafer to push the nozzle 3 to move, and move the fixing tube b14 closer to the pressure sensor 4, thereby reducing the pressure on the nozzle 3 and preventing it from exceeding the critical value. At the same time as the electromagnets a12 and b13 stop supplying power, the control terminal of the die bonder controls the wafer pickup device 1 to return to its original state to protect the nozzle 3.

[0047] Example 2

[0048] Please see the appendix Figure 5 As shown, this is the second embodiment of the present invention. This embodiment provides a die bonder head pressure early warning device, which also includes a recording module. The recording module is installed on the outside of the wafer pickup device 1. One end of the recording module is connected to the buffer module. The recording module is used to record abnormal pressure of the nozzle 3.

[0049] Specifically, when the pressure on the nozzle 3 reaches the set value of the pressure sensor 4, the buffer module activates, causing the recording module to change shape to record the abnormal pressure of the nozzle 3. The recording module can record the pressure of the nozzle 3 multiple times. After a certain number of times, the die bonder stops operating and sounds an alarm to alert the staff to perform maintenance. Multiple mechanical recordings can prevent erroneous actions and provide feedback on the frequency of abnormal pressure of the nozzle 3.

[0050] In a preferred embodiment, please refer to Figure 6 and Figure 7 In a preferred embodiment, the recording module includes a fixing frame a21, a fixing rod a22, an iron pipe a23, a lower support plate 24, an upper support plate 25, an electromagnet c26, and a proximity switch a27. The fixing frame a21 is fixed to the outside of the fixing pipe b14, the fixing rod a22 is fixed to the upper end of the fixing frame a21, the lower support plate 24 is fixed to one side of the wafer pickup device 1 and is slidably connected to the fixing rod a22, the upper support plate 25 is also fixed to the outside of the wafer pickup device 1 and is slidably connected to the fixing rod a22, the iron pipe a23 is slidably connected to the outside of the fixing rod a22 and is located between the lower support plate 24 and the upper support plate 25, the electromagnet c26 is fixed to the outside of the wafer pickup device 1 and is located below the upper support plate 25, and the proximity switch a27 is fixed to the outside of the wafer pickup device 1 and is located below the electromagnet c26.

[0051] Furthermore, a rubber ring is provided inside the iron pipe a23. The rubber ring is slidably connected to the fixed rod a22 and is interference-fitted with the fixed rod a22 to increase the friction between the fixed rod a22 and the iron pipe a23.

[0052] It should be noted that the attractive force between electromagnet c26 and iron pipe a23 is greater than the frictional force between rubber ring and fixed rod a22, ensuring that when fixed rod a22 moves upward, iron pipe a23 moves downward relative to fixed rod a22, thereby changing the position of iron pipe a23 on fixed rod a22. The number of abnormal pressures of suction nozzle 3 is recorded by the change in the position of iron pipe a23. The frictional force between rubber ring and fixed rod a22 is greater than the weight of iron pipe a23 and rubber ring, ensuring the stability of the position of iron pipe a23 on fixed rod a22.

[0053] In this embodiment, when the fixed tube b14 approaches the pressure sensor 4 to reduce the pressure on the suction nozzle 3, the fixed tube b14 moves the fixed frame a21 upward, causing the fixed rod a22 to move upward. Simultaneously, when the electromagnets a12 and b13 stop receiving power, the electromagnet c26 operates, generating an attractive force that attracts the iron tube a23, fixing its position. This causes the fixed rod a22 to move inside the iron tube a23. When the die bonding machine's control terminal resets the wafer pickup device 1, the wafer releases the pressure on the suction nozzle 3, the fixed tube b14 returns to its original position, and the fixed rod a22 moves downward, returning to its original position. Simultaneously, when the wafer pickup device 1 resets, the electromagnet c26 stops operating, releasing the attraction to the iron tube a23, thus fixing the position of the fixed rod a22. As rod a22 moves downward to return to its original position, it also moves iron pipe a23 downward. At this time, the position of iron pipe a23 on fixed rod a22 changes. By observing the position of iron pipe a23, the number of times the suction nozzle 3 pressure is abnormal can be distinguished. When the suction nozzle 3 pressure is abnormal multiple times, the position of iron pipe a23 on fixed rod a22 changes multiple times, and the pressure abnormality can be recorded multiple times. By observing the position of iron pipe a23 within a certain time range, the frequency of the suction nozzle 3 pressure abnormality can be observed. When the pressure of suction nozzle 3 is recorded multiple times, iron pipe a23 moves multiple times on fixed rod a22 and approaches the lower support plate 24. When proximity switch a27 detects iron pipe a23, it sends a command to the control terminal, causing the wafer pickup device 1 to stop working and alarm, prompting the staff to check the pressure of suction nozzle 3.

[0054] It is worth mentioning that two alarm lights are installed on the outside of the fixed tube b14. When the pressure of the suction nozzle 3 is abnormal, one of the alarm lights will be activated. When the proximity switch a27 detects the iron pipe a23 and sends a command to the control terminal, the other alarm light will be activated to remind the staff that the number of times the pressure of the suction nozzle 3 has been detected has reached the limit.

[0055] Example 3

[0056] Please see the appendix Figure 8 As shown, this is the third embodiment of the present invention. This embodiment is a further improvement on the second embodiment, and its difference from the second embodiment lies in the different recording modules.

[0057] like Figures 9 to 11As shown, the recording module includes a fixed frame b31, a fixed rod b32, an iron pipe b33, a limiting plate 34, a friction strip 35, a rotating shaft 36, a torsion spring 37, and a proximity switch b38. The fixed frame b31 is fixed to the outside of the fixed pipe b14, the fixed rod b32 is fixed to the upper end of the fixed frame b31, the limiting plate 34 is fixed to one side of the wafer pickup device 1 and is slidably connected to the fixed rod b32, the iron pipe b33 is slidably connected to the outside of the fixed rod b32 and is located above the limiting plate 34, the friction strip 35 is rotatably connected to the wafer pickup device 1 near the iron pipe b33, the rotating shaft 36 is fixed to one end of the friction strip 35 near the wafer pickup device 1, the torsion spring 37 is disposed on the outside of the friction strip 35, one end of the torsion spring 37 is fixedly connected to the wafer pickup device 1, and the other end of the torsion spring 37 is fixedly connected to the rotating shaft 36, and the proximity switch b38 is fixed to one side of the wafer pickup device 1 and located above the iron pipe b33.

[0058] It should be noted that when the fixed rod b32 moves upward, the iron pipe b33 moves upward along with the fixed rod b32. When the iron pipe b33 moves upward, the frictional force between the iron pipe b33 and the fixed rod b32 is greater than the frictional force between the friction strip 35 and the iron pipe b33. When the fixed rod b32 moves upward and then moves downward to return to its original position, the iron pipe b33 remains stationary. When the iron pipe b33 remains stationary, the frictional force between the friction strip 35 and the iron pipe b33 is greater than the frictional force between the iron pipe b33 and the fixed rod b32.

[0059] In this embodiment, when the fixed tube b14 approaches the pressure sensor 4 to reduce the pressure on the suction nozzle 3, the fixed tube b14 moves upward along with the pressure sensor 4, causing the fixed rod b32 to move upward. This, in turn, causes the fixed rod b32 to push the iron tube b33 upward. When the die pick-up device 1 is reset by the control terminal of the die bonder, the wafer releases the pressure on the suction nozzle 3, the fixed tube b14 returns to its original position, and the fixed rod b32 follows suit, moving downward to its original position. As the fixed rod b32 moves downward, the torsional force of the torsion spring 37 keeps the friction strip 35 in contact with the surface of the iron tube b33. When the fixed rod b32 moves downward, the friction strip 35 restricts the iron tube b33, preventing it from following the fixed rod. When the fixed rod b32 moves, the position of the iron pipe b33 on the fixed rod b32 changes. By observing the position of the iron pipe b33, the number of times the suction nozzle 3 pressure is abnormal can be distinguished. When the suction nozzle 3 pressure is abnormal multiple times, the position of the iron pipe b33 on the fixed rod b32 changes multiple times, and the pressure abnormality can be recorded multiple times. By observing the position of the iron pipe b33 within a certain time range, the frequency of the suction nozzle 3 pressure abnormality can be observed. When the suction nozzle 3 pressure is recorded multiple times, the iron pipe b33 moves multiple times on the fixed rod b32 and approaches the proximity switch b38. When the torsion spring 37 detects the iron pipe b33, it sends a command to the control terminal, causing the wafer pickup device 1 to stop working and alarm, prompting the staff to check the pressure of the suction nozzle 3.

[0060] The working principle of this invention is as follows: When the lifting module drives the suction nozzle 3 to approach the wafer and pick up the wafer, the suction nozzle 3 is subjected to the reaction force of the wafer, which causes a slight axial movement of the central axis 2. The pressure sensor 4 detects the reaction force on the suction nozzle 3, which is the pressure on the suction nozzle 3. When the pressure is abnormal, the data detected by the pressure sensor 4 is fed back to the control terminal of the die bonder. At the same time, the buffer module is activated to reduce the pressure on the suction nozzle 3, thus protecting the suction nozzle 3 and the wafer, improving service life and safety. While the buffer module is activated, the control terminal controls the wafer pickup device 1 to reset, controlling the wafer... The pickup device 1 causes the nozzle 3 to perform a crystal picking operation again. When the pressure on the nozzle 3 reaches the set value of the pressure sensor 4, the buffer module activates, which in turn drives the recording module to change shape. This changes the shape of the recording module to record any abnormal pressure on the nozzle 3, allowing the operator to visually observe the abnormal pressure. The recording module can also record the pressure of the nozzle 3 multiple times. After reaching the required number of times, the die bonder stops operating and triggers an alarm to alert the operator to perform maintenance. This repeated mechanical recording helps prevent erroneous actions and provides feedback on the frequency of abnormal pressure on the nozzle 3.

[0061] The above description is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained in this invention are implemented according to conventional methods in the art unless otherwise specified or limited.

Claims

1. A die bonder head pressure early warning device, characterized in that: include: A wafer pickup device (1) includes a lifting module and a rotating module. The lifting module is used to drive the rotating module to move up and down. The rotating module includes a drive motor and a central shaft (2). The drive motor is mounted on the wafer pickup device (1). The central shaft (2) is mounted on the output end of the drive motor. A suction nozzle (3) is mounted on the lower end of the central shaft (2). A pressure sensor (4) is mounted on the lower end of the drive motor and on the outside of the central shaft (2). A buffer module is installed between the pressure sensor (4) and the nozzle (3) to reduce the pressure on the pressure sensor (4); A recording module is installed on the outside of the wafer pickup device (1), one end of which is connected to a buffer module. The recording module is used to record abnormal pressure of the nozzle (3). The buffer module includes a fixed tube a (11), an electromagnet a (12), an electromagnet b (13), a fixed tube b (14), and a connecting ring (15). The fixed tube a (11) is fixed to the lower end of the pressure sensor (4). The electromagnet a (12) is fixed to the outside of the lower end of the fixed tube a (11). The connecting ring (15) is fixed to the upper end of the suction nozzle (3). The fixed tube b (14) is rotatably connected to the upper end of the connecting ring (15). The electromagnet b (13) is fixed inside the upper end of the fixed tube b (14). The electromagnet b (13) is located above the electromagnet a (12).

2. The die bonder head pressure early warning device according to claim 1, characterized in that: Both electromagnet a (12) and electromagnet b (13) are circular rings.

3. The die bonder head pressure early warning device according to claim 2, characterized in that: The outer diameter of electromagnet a (12) is smaller than the inner diameter of fixed tube b (14), and the inner diameter of electromagnet b (13) is larger than the outer diameter of fixed tube a (11).

4. The die bonder head pressure early warning device according to claim 1, characterized in that: The recording module includes a fixed frame a (21), a fixed rod a (22), an iron pipe a (23), a lower support plate (24), an upper support plate (25), an electromagnet c (26), and a proximity switch a (27). The fixed frame a (21) is fixed to the outside of the fixed pipe b (14), the fixed rod a (22) is fixed to the upper end of the fixed frame a (21), the lower support plate (24) is fixed to one side of the wafer pickup device (1) and is slidably connected to the fixed rod a (22), and the upper support plate a (25) is fixed to the outside of the fixed pipe b (14). The plate (25) is also fixed on the outside of the wafer pickup device (1) and is slidably connected to the fixed rod a (22). The iron pipe a (23) is slidably connected on the outside of the fixed rod a (22) and located between the lower support plate (24) and the upper support plate (25). The electromagnet c (26) is fixed on the outside of the wafer pickup device (1) and located at the lower part of the upper support plate (25). The proximity switch a (27) is fixed on the outside of the wafer pickup device (1) and located at the lower part of the electromagnet c (26).

5. A die bonder head pressure early warning device according to claim 4, characterized in that: The iron pipe a (23) is provided with a rubber ring inside, and the rubber ring is slidably connected to the fixed rod a (22), and the rubber ring is interference fit with the fixed rod a (22).

6. The die bonder head pressure early warning device according to claim 5, characterized in that: The attraction between the electromagnet c (26) and the iron pipe a (23) is greater than the friction between the rubber ring and the fixed rod a (22), and the friction between the rubber ring and the fixed rod a (22) is greater than the weight of the iron pipe a (23) and the rubber ring.

7. The die bonder head pressure early warning device according to claim 1, characterized in that: The recording module includes a fixed frame b (31), a fixed rod b (32), an iron pipe b (33), a limiting plate (34), a friction strip (35), a rotating shaft (36), a torsion spring (37), and a proximity switch b (38). The fixed frame b (31) is fixed to the outside of the fixed pipe b (14), the fixed rod b (32) is fixed to the upper end of the fixed frame b (31), the limiting plate (34) is fixed to one side of the wafer pickup device (1) and is slidably connected to the fixed rod b (32), and the iron pipe b (33) is slidably connected to the outside of the fixed rod b (32) and located at the limiting plate. Above the plate (34), the friction strip (35) is rotatably connected to the wafer pickup device (1) near the iron pipe b (33). The rotating shaft (36) is fixed at one end of the friction strip (35) near the wafer pickup device (1). The torsion spring (37) is located on the outside of the friction strip (35), and one end of the torsion spring (37) is fixedly connected to the wafer pickup device (1). The other end of the torsion spring (37) is fixedly connected to the rotating shaft (36). The proximity switch b (38) is fixed on one side of the wafer pickup device (1) and located above the iron pipe b (33).

8. A die bonder head pressure early warning device according to claim 7, characterized in that: When the fixed rod b (32) moves upward, the iron pipe b (33) moves upward along with the fixed rod b (32). When the iron pipe b (33) moves upward, the friction between the iron pipe b (33) and the fixed rod b (32) is greater than the friction between the friction strip (35) and the iron pipe b (33). When the fixed rod b (32) moves upward and then moves downward to return to its original position, the iron pipe b (33) remains stationary. When the iron pipe b (33) remains stationary, the friction between the friction strip (35) and the iron pipe b (33) is greater than the friction between the iron pipe b (33) and the fixed rod b (32).

9. A die bonder head pressure early warning device according to claim 1, characterized in that: Two alarm lights are installed on the outside of the fixed tube b (14).

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