A method of process migration
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-09-16
- Publication Date
- 2026-08-11
AI Technical Summary
换不同工艺或者不同工厂的时候,需要更换不同的工艺套件去重新设计产品,若不使用自动化脚本的方式,时间成本和人力成本将会翻倍增加
[0007] The beneficial effects of this invention are: it can solve the problem of process migration between different processes and factories, and is compatible with almost all pin breaks or incorrect connections caused by process migration. It facilitates automated resolution of all process migration issues. When factory capacity is tight, the process of this invention can quickly select a suitable factory for tape-out.
Smart Images

Figure CN115496033B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a method for process migration, belonging to the field of integrated circuit design technology. Background Technology
[0002] As the chip industry continues to boom, competition within the industry is becoming increasingly fierce. Since most chip design companies are now fabless, once a product design is completed, there are multiple factories and various processes to choose from for tape-out.
[0003] Current factory capacity is tight, and tape-out times are uncertain. Therefore, switching to different processes or different factories for tape-out is necessary. Switching to different processes or factories requires changing different process suites and redesigning the product. Without automated scripts, time and labor costs would double. Thus, automated processes for process migration have emerged. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to provide a method for rapidly completing process migration.
[0005] To solve the above-mentioned technical problems, the technical solution proposed by this invention is: a method for process migration, comprising the following steps: 1) Compare the old and new process kit libraries to confirm the number of components; 2) Record the coordinates and parameter values of each component in the circuit schematic; 3) Based on the circuit schematic, generate a transitional process kit library using the new process kit library; For devices with the same pin port position in the new process kit and the old process kit, the transition process kit library is generated and assigned according to the corresponding coordinates and parameter values during the generation process; For devices with different pin port positions in the new process kit and the old process kit, the pin port position correspondence is completed when generating the transition process kit library; 4) Replace the existing process kit library with the transition process kit library to complete the process migration.
[0006] To solve the above-mentioned technical problems, another technical solution proposed by the present invention is: 1) compare the old and new process kit libraries to determine the components that need to be replaced; 2) Record the coordinates and parameter values of the component to be replaced in the circuit schematic; 3) Determine whether the pin positions of the component to be replaced are the same in the old and new process libraries; If they are the same, the corresponding new device in the new process kit library is inserted into the old device position, and the parameter value is assigned to the new device to complete the process migration; If they are different, proceed to step 4. 4) Create a transition process kit library and transition parameter units, and assign the parameter values to the transition parameter units; 5) Insert the new device into the parameter unit and establish the connection of each port to complete the pin position correspondence; 6) Return to step 3) and confirm whether the pin positions of the new device in the transition process kit library are the same as those of the device to be replaced.
[0007] The beneficial effects of this invention are: it can solve the problem of process migration between different processes and factories, and is compatible with almost all pin breaks or incorrect connections caused by process migration. It facilitates automated resolution of all process migration issues. When factory capacity is tight, the process of this invention can quickly select a suitable factory for tape-out. Attached Figure Description
[0008] The invention will now be further described with reference to the accompanying drawings.
[0009] Figure 1 This is a flowchart illustrating Embodiment 1 of the present invention.
[0010] Figure 2 This is a flowchart illustrating Embodiment 2 of the present invention.
[0011] Figure 3 This is an icon of the MOSFET in the old PDK of Embodiment 2 of the present invention.
[0012] Figure 4 This is an icon of a MOSFET device, one of the new PDKs in Embodiment 2 of the present invention.
[0013] Figure 5 This is an icon of the MOSFET device in the second new PDK of the present invention. Detailed Implementation
[0014] Example 1 This embodiment of one method for process migration, such as Figure 1 As shown, perform the following steps: 1) Compare the old and new process kit libraries to confirm the number of components; 2) Record the coordinates and parameter values of each component in the circuit schematic; 3) Based on the circuit schematic, generate a transitional process kit library using the new process kit library; For devices with the same pin port position in the new process kit and the old process kit, the transition process kit library is generated and assigned according to the corresponding coordinates and parameter values during the generation process; For devices with different pin port positions in the new process kit and the old process kit, the pin port position correspondence is completed when generating the transition process kit library; 4) Replace the existing process kit library with the transition process kit library to complete the corresponding parameter transfer and parameter enabling, thereby realizing process migration.
[0015] Example 2 This embodiment two provides a method for process migration, such as... Figure 2 As shown, perform the following steps: 1) Compare the old and new process kit libraries to determine the components that need to be replaced; 2) Record the coordinates and parameter values of the component to be replaced in the circuit schematic; 3) Determine whether the pin positions of the component to be replaced are the same in the old and new process libraries; If they are the same, the corresponding new device in the new process kit library is inserted into the old device position, and the parameter value is assigned to the new device to complete the process migration; If they are different, proceed to step 4. 4) Create a transition process kit library and transition parameter units, and assign the parameter values to the transition parameter units; 5) Insert the new device into the parameter unit and establish the connection of each port to complete the pin position correspondence; 6) Return to step 3) and confirm whether the pin positions of the new device in the transition process kit library are the same as those of the device to be replaced.
[0016] Examples of pin differences between old and new PDK (Process Technology Kit) devices, using MOSFETs as an example: the old PDK's MOSFET symbol is as follows... Figure 3 As shown, the MOSFETs of the new PDK are as follows Figure 4 , Figure 5 As shown in the image, S, D, and G are all at the same position as the MOSFETs of the old PDK. However, the B terminal clearly shows a different MOSFET position compared to the old PDK. This type of device exhibits pinouts where the pin positions of the new and old PDKs are different.
[0017] The process of establishing a transition PDK is as follows, where The old PDK's mosA, mos(library:A cell:mosA view:symbol), has parameters assumed to be w, l, nf, and m; The new PDK's mosB, mos(library:B cell:mosB view:symbol), has the following assumed parameters: W, L, NF, M. Create a Pcell with the same Symbol (mosA) as the old PDK, and transition the PDK's mosC, mos(library:Ccell:mosC view:symbol); create a schematic view using PCell, assigning parameters wn, ln, nfn, and mn, and insert the new PDK's mos into the newly created schematic view; at this point, the transition PDK's mosC, mos(library:Ccell:mosC view:schematic) passes parameter values as wn => W, ln => L, nfn => NF, and mn => M. A key feature of this parameter passing is that newly created parameters can be passed to the parameters of mosB.
[0018] The process of device replacement and parameter transfer during process migration using a transition PDK is as follows: Delete mosA of the old PDK in the schematic diagram and record the values of parameters w, l, nf, and m; insert the transition PDK mosC and assign its parameters w=>wn, l =>ln, nf=>nfn, and m=>mn.
Claims
1. A method for process transfer, characterized in that, Perform the following steps: 1) Compare the old and new process kit libraries to determine the components that need to be replaced; 2) Record the coordinates and parameter values of the component to be replaced in the circuit schematic; 3) Determine whether the pin positions of the component to be replaced are the same in the old and new process libraries; If they are the same, the corresponding new device in the new process kit library is inserted into the old device position, and the parameter value is assigned to the new device to complete the process migration; If they are different, proceed to step 4). 4) Create a transition process kit library and transition parameter units, and assign the parameter values to the transition parameter units; 5) Insert the new device into the parameter unit and establish the connection of each port to complete the pin position correspondence; 6) Return to step 3) and confirm whether the pin positions of the new device in the transition process kit library are the same as those of the device to be replaced.
Citation Information
Patent Citations
Circuit diagram migration method and apparatus
CN108170953A
Process design toolkit development method and device, electronic equipment and storage medium
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