Touch panel and electronic terminal

Abstract

The application discloses a touch panel and an electronic terminal, comprising: a substrate, a thin film transistor layer and a magnetic induction layer on the substrate, the thin film transistor layer and the magnetic induction layer are arranged in different layers, the thin film transistor layer comprises a metal layer, the magnetic induction layer comprises a winding coil, wherein the orthographic projection of the winding coil on the substrate and the orthographic projection of the metal layer on the substrate overlap to form a first capacitor, the first capacitor further forms a first filter with the winding coil, the first filter is used for receiving and converting an original signal into a first signal loaded to a touch chip, reduces the signal of impurity current in the original signal, and improves the reliability of the touch function of the touch panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to the field of display panel manufacturing technology, specifically to touch panels and electronic terminals. Background Technology

[0002] With the development of display technology, touch technology, which involves touching or approaching the display screen of a touch display device with one's hand or other object to input information or perform operations, is becoming increasingly widespread. Touch technology can be implemented through resistive touch, capacitive touch, electromagnetic touch, or optical touch.

[0003] Electromagnetic touch control involves an electromagnetic stylus emitting a magnetic field signal to interact with a magnetic induction plate in the touch panel. The magnetic induction plate reacts to changes in the sensed magnetic field signal (e.g., caused by the stylus moving closer to or further away from the touch panel), resulting in changes in the magnetic flux of the coils within the plate and generating a weak current. The touch position is detected by analyzing the changes in the induced current of different coils. However, interference from display signals and external signals can cause deviations in the magnetic field signal acting on the magnetic induction plate, leading to variations in the generated induced current and consequently lower reliability of the touch panel's touch function.

[0004] Therefore, existing electromagnetic touch panels have the aforementioned defects and urgently need improvement. Summary of the Invention

[0005] The present invention provides a touch panel and an electronic terminal to solve the technical problem of low reliability of touch function caused by interference of other signals with magnetic field signals in existing electromagnetic touch panels.

[0006] This invention provides a touch panel, comprising:

[0007] substrate;

[0008] A thin-film transistor layer, located on the substrate, includes a metal layer;

[0009] A magnetic induction layer, located on the substrate and disposed on a different layer from the thin-film transistor layer, includes a plurality of wound coils;

[0010] The touch chip is electrically connected to the wound coil;

[0011] The orthographic projections of the plurality of winding coils on the substrate and the orthographic projections of the metal layer on the substrate overlap, so that the winding coils and the metal layer form a first capacitor. The first capacitor and at least one of the winding coils form a first filter. The first filter is used to receive and convert the original signal into a first signal for transmission to the touch chip.

[0012] In one embodiment, the thin-film transistor layer further includes an active layer, and the metal layer includes:

[0013] A gate layer is located on the side of the active layer that is close to or far from the substrate;

[0014] The source / drain layer is located on the active layer;

[0015] The orthographic projection of the gate layer on the substrate and the orthographic projection of the winding coil on the substrate overlap.

[0016] In one embodiment, the resistivity of the constituent material of the winding coil is less than the resistivity of the constituent material of the gate layer.

[0017] In one embodiment, it further includes:

[0018] The wiring layer is located on the substrate and is disposed on a different layer from either the thin-film transistor layer or the magnetic induction layer, and is electrically connected to the thin-film transistor layer.

[0019] In one embodiment, the wiring layer includes a trace, the orthographic projection of the trace on the substrate having a first portion that extends beyond the orthographic projection of the metal layer on the substrate, and the orthographic projection of the winding coil on the substrate overlaps with the first portion.

[0020] In one embodiment, the magnetic induction layer further includes an auxiliary coil disposed in the same layer as the winding coil, wherein the area of ​​the orthographic projection of the auxiliary coil onto the winding coil is greater than 0.

[0021] In one embodiment, the touch chip includes a second filter, which receives and converts the first signal into a second signal, and the second signal is used to determine the touch status of the touch panel.

[0022] In one embodiment, the first filter is a low-pass filter and the second filter is a high-pass filter.

[0023] In one embodiment, the wound coil includes:

[0024] Multiple first winding coils;

[0025] A plurality of second winding coils are disposed in a different layer and insulated from a plurality of first winding coils, and at least one of the orthographic projections of the plurality of first winding coils on the substrate and the orthographic projections of the plurality of second winding coils on the substrate overlaps with the orthographic projection of the metal layer on the substrate.

[0026] This invention provides an electronic terminal, which includes a touch panel as described above.

[0027] The touch panel and electronic terminal provided in this invention include: a substrate; a thin-film transistor layer located on the substrate, including a metal layer; a magnetic induction layer located on the substrate, disposed separately from the thin-film transistor layer, including a plurality of wound coils; and a touch chip electrically connected to the wound coils. The orthographic projections of the plurality of wound coils on the substrate and the orthographic projections of the metal layer on the substrate overlap, such that the wound coils and the metal layer form a first capacitor. The first capacitor and at least one of the wound coils form a first filter. The first filter is used to receive and convert the original signal into a first signal, meaning that at least high-frequency impurity current signals in the original signal transmitted to the magnetic induction layer can be filtered out by the first filter formed by the first capacitor and at least one wound coil, thereby reducing the impurity current signals in the original signal and improving the reliability of the touch function of the touch panel. Attached Figure Description

[0028] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.

[0029] Figure 1 This is a cross-sectional schematic diagram of a first embodiment of the touch panel provided in this invention.

[0030] Figure 2 This is a cross-sectional schematic diagram of a second embodiment of the touch panel provided in this invention.

[0031] Figure 3 This is a first equivalent connection block diagram of the low-pass filter and high-pass filter in the touch panel provided in an embodiment of the present invention.

[0032] Figure 4 This is a second equivalent connection block diagram of the low-pass filter and high-pass filter in the touch panel provided in an embodiment of the present invention.

[0033] Figure 5 This is a cross-sectional schematic diagram of a first embodiment of the magnetic induction layer provided in this invention.

[0034] Figure 6 This is a cross-sectional schematic diagram of a second embodiment of the magnetic induction layer provided in this invention. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and continuously described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] The terms "first," "second," "third," etc., used in this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or modules is not limited to the listed steps or modules, but may optionally include steps or modules not listed, or may optionally include other steps or modules inherent to these processes, methods, products, or apparatuses.

[0037] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase at various points in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0038] The present invention provides a touch panel, which includes, but is not limited to, the following embodiments and combinations thereof.

[0039] In one embodiment, such as Figures 1 to 4 As shown, the touch panel 100 includes: a substrate 10; a thin-film transistor layer 20 located on the substrate 10, including a metal layer 201; a magnetic induction layer 30 located on the substrate 10, disposed in a different layer from the thin-film transistor layer 20, including a plurality of wound coils 301; and a touch chip 40 electrically connected to the wound coils 301; wherein the orthographic projections of the plurality of wound coils 301 on the substrate 10 and the orthographic projections of the metal layer 201 on the substrate 10 overlap to form a first capacitor C1, the first capacitor C1 and at least one of the wound coils 301 form a first filter WF1, and the first filter WF1 is used to receive and convert the original signal S0 into a first signal S1 for transmission to the touch chip 40.

[0040] Specifically, the thin-film transistor layer 20 may include multiple transistors and multiple signal lines electrically connected, and the multiple transistors include at least multiple driving transistors. Further, the touch panel 100 may also include a pixel layer located on the substrate 10. The pixel layer may include multiple sub-pixels corresponding to the multiple driving transistors. The sub-pixels may be electrically connected to their corresponding driving transistors. The driving transistors may input corresponding sub-pixel data to their corresponding sub-pixels under the control of signals loaded on the multiple signal lines, thereby controlling the light emission of the corresponding sub-pixels. In this embodiment, the relative positions of the thin-film transistor layer 20, the magnetic sensing layer 30, and the pixel layer are not limited. For example… Figure 1The magnetic induction layer 30 can be located above the thin-film transistor layer 20. The thin-film transistor layer 20 can also include a first dielectric layer 202 located between the metal layer 201 and the magnetic induction layer 30 to insulate the metal layer 201 and the magnetic induction layer 30. The magnetic induction layer 30 can also include a second dielectric layer 305 located between the plurality of wound coils 301 and the pixel layer to insulate the plurality of wound coils 301 and the pixel layer. The driving transistors in the thin-film transistor layer 20 can be electrically connected to the corresponding sub-pixels by passing through the magnetic induction layer 30 at least through via technology; for example... Figure 2 The thin-film transistor layer 20 can be located above the magnetic induction layer 30. Similarly, the magnetic induction layer 30 can also include a second dielectric layer 305 located between the plurality of winding coils 301 and the thin-film transistor layer 20. The thin-film transistor layer 20 can also include a first dielectric layer 202 located between the metal layer 201 and the pixel layer. The driving transistors in the thin-film transistor layer 20 can be electrically connected to the corresponding sub-pixels by passing through at least the first dielectric layer 202 via via technology.

[0041] Specifically, the metal layer 201 mentioned above may include at least one film structure made of metal, such as a transistor or a signal trace. When the touch panel 100 is a liquid crystal panel, the sub-pixel may include a pixel electrode made of a transparent conductive material. When the touch panel 100 is an organic light-emitting semiconductor panel, the sub-pixel may include an organic light-emitting material and two corresponding electrodes. When the touch panel 100 is a diode direct display panel, the sub-pixel may include a diode. In other words, it can be considered that the sub-pixel contains little or no metal material.

[0042] The working principle of electromagnetic touch control is as follows: When the electromagnetic pen approaches at least one wound coil 301 in the magnetic induction layer 30, the corresponding at least one wound coil 301 senses the enhancement of the magnetic field signal emitted by the electromagnetic pen, causing the magnetic flux of the at least one wound coil 301 to increase within a fixed time period, thereby generating an induced current and transmitting it to the touch chip 40. The touch chip 40 then determines the touch position of the electromagnetic pen based on the magnitude of the current generated by the at least one wound coil 301. It should be noted that due to interference from display signals and external signals on the magnetic field signal, the accuracy of the magnetic field signal acting on the wound coil 301 is low, resulting in a low accuracy of the induced current received by the touch chip 40, thus causing low reliability of the touch function.

[0043] Specifically, in combination Figures 1 to 4 As shown, in this embodiment, the orthographic projections of multiple wound coils 301 on the substrate 10 and the orthographic projections of the metal layer 201 on the substrate 10 overlap to form a first capacitor C1. Figure 3 and Figure 4The winding coil 301 in the magnetic induction layer 30 can represent all the winding coils 301 that receive the original signal S0. The original signal S0 can be understood as including the signal of the induced current caused by the electromagnetic signal that changes as described above, and the signal of the impurity current caused by the interference of the display signal and external signals on the magnetic field signal. The first capacitor C1 can represent the capacitance formed between all the winding coils 301 and all the metal layers 201 in the magnetic induction layer 30. Of course, there can also be a capacitance formed by other conductive film layers (not shown) between the first capacitor C1 and ground. In this embodiment, the quantitative relationship between the first capacitor C1 and the winding coils 301 is not limited. Furthermore, for example, the frequency of the induced current signal mentioned above can be within a specific frequency range, while the frequency of the impurity current signal can be outside a specific frequency range (the impurity current signal can include the signal of high-frequency impurity current with a frequency greater than the specific frequency range and the signal of low-frequency impurity current with a frequency less than the specific frequency range).

[0044] Understandably, in this embodiment, since the orthographic projections of multiple wound coils 301 on the substrate 10 and the orthographic projections of the metal layer 201 on the substrate 10 overlap to form a first capacitor C1, and the first capacitor C1 is connected to ground, it can be known from the characteristic of capacitors passing high frequencies and blocking low frequencies that at least the high-frequency impurity current signal in the original signal S0 transmitted to the magnetic induction layer 30 can be filtered out by the first filter WF1 (low-pass filter) formed by the first capacitor C1 and at least one wound coil 301, thereby reducing the impurity current signal in the original signal S0, so as to improve the accuracy of the induced current received by the touch chip 40. It can also be understood that this embodiment can still improve the reliability of the touch function of the touch panel 100 without increasing the power consumption of the touch chip 40 to process the impurity current signal in the original signal S0.

[0045] Among them, such as Figure 3 and Figure 4 As shown, if we do not consider Figure 4 The influence of the first capacitor C1 on the side of the first filter WF1 closest to the electromagnetic pen. Figure 3 and Figure 4 The cutoff frequency of the first filter WF1 can be 1 / (2*π*r1*c1), where c1 can be the size of the first capacitor C1 on the side of the first filter WF1 away from the electromagnetic pen, and r1 can be the size of the equivalent resistance of the multiple wound coils 301.

[0046] In one embodiment, such as Figure 3 and Figure 4As shown, the touch chip 40 includes a second filter WF2. The second filter WF2 is used to receive and convert the first signal S1 into a second signal S2. The second signal S2 is used to determine the touch status of the touch panel 100. It can be understood that, in conjunction with the above discussion, the first filter WF1 (low-pass filter) formed by the first capacitor C1 in the magnetic induction layer 30 and at least one wound coil 301 can at least filter out the high-frequency impurity current signal in the original signal S0 to obtain a change in the first signal S1 that is more convenient to obtain the corresponding magnetic field signal. Furthermore, in this embodiment, a second filter WF2 can also be provided in the touch chip 40 to further filter out the impurity current signal in the first signal S1, to further obtain a second signal S2 that is more convenient to obtain the change in the corresponding magnetic field signal, thereby further improving the accuracy of the induced current received by the touch chip 40, and thus further improving the reliability of the touch function of the touch panel 100.

[0047] In one embodiment, such as Figure 3 and Figure 4 As shown, the first filter WF1 is a low-pass filter, and the second filter WF2 is a high-pass filter. It can be understood that, in conjunction with the above discussion, the first filter WF1 (low-pass filter) can at least filter out the high-frequency impurity current signal in the original signal S0 to obtain a first signal S1 that is more convenient for obtaining the corresponding change in the magnetic field signal. Furthermore, in this embodiment, the touch chip 40 including the second filter WF2 can be set as a high-pass filter. Based on the first signal S1, which has already had the high-frequency impurity current signal filtered out, the low-frequency impurity current signal in the first signal S1 can be further filtered out, so that both the high-frequency and low-frequency impurity current signals in the original signal S0 are filtered out to form a second signal S2 that is more convenient for obtaining the corresponding change in the magnetic field signal, thereby further improving the accuracy of the induced current received by the touch chip 40, and thus further improving the reliability of the touch function of the touch panel 100.

[0048] Specifically, such as Figure 3 and Figure 4 As shown, the second filter WF2 can be a filter module in the integrated circuit of the touch chip 40. The equivalent circuit corresponding to the second filter WF2 can include a grounded resistor R and a second capacitor C2 connected between the resistor R and the first filter WF1. Figure 3 and Figure 4 This example uses the second filter WF2 as a first-order high-pass filter, but WF2 can also be configured as a multi-order high-pass filter. Figure 3 and Figure 4The cutoff frequency of the second filter WF2 can be 1 / (2*π*r2*c2), where c2 can be the value of the second capacitor C2 and r2 can be the value of the resistor R.

[0049] In this embodiment, the frequency of the induced current signal generated by the enhanced magnetic field signal emitted by the electromagnetic pen generally falls within a specific frequency range. Based on the above discussion, the low-pass filter (first filter WF1) and high-pass filter (second filter WF2) connected in this embodiment can form a band-pass filter. The frequency of the signal that the band-pass filter can pass through should be between the cutoff frequency of the first filter WF1 (1 / (2*π*r1*c1)) and the cutoff frequency of the second filter WF2 (1 / (2*π*r2*c2)). Therefore, the values ​​of r1, c1, r2, and c2 can be reasonably set to match the frequency of the induced current signal generated by the enhanced magnetic field signal emitted by the electromagnetic pen. For example, the cutoff frequency of the first filter WF1 can be set to be close to or equal to the minimum frequency of the induced current signal, and the cutoff frequency of the second filter WF2 can be set to be close to or equal to the maximum frequency of the induced current signal.

[0050] In one embodiment, such as Figure 1 and Figure 2 As shown, the thin-film transistor layer 20 further includes an active layer, and the metal layer 201 includes: a gate layer located on the side of the active layer close to or away from the substrate 10; and a source-drain layer located on the active layer; wherein the orthographic projection of the gate layer on the substrate 10 and the orthographic projection of the wound coil 301 on the substrate 10 overlap.

[0051] The substrate 10 can be a rigid substrate or a flexible substrate. The rigid substrate can be composed of at least one of glass and quartz, while the flexible substrate can be composed of polymer resin, used to support the film layer disposed thereon. The active layer can be composed of polysilicon or oxide semiconductor. The oxide semiconductor can be based on oxides of titanium, hafnium, zirconium, aluminum, tantalum, germanium, zinc, gallium, tin, or indium, or composite oxides thereof. Further, the active layer can include a semiconductor pattern, which can include a channel region vertically overlapping the gate layer and two conductive regions located on both sides of the channel region with higher conductivity. A dielectric layer can be provided between the source / drain layer and the active layer to insulate them. The source / drain layer can include a source and a drain. The source can be electrically connected to one of the conductive regions through a via in the dielectric layer, and the drain can be electrically connected to the other conductive region through another via. It should be noted that in this embodiment, there is no limitation on whether the thin-film transistor layer 20 is a top-gate structure or a bottom-gate structure, and the vertical positional relationship between the source / drain layer and the gate layer is also not limited.

[0052] Specifically, the gate layer can be composed of low-resistivity materials, such as at least one of molybdenum, aluminum, platinum, palladium, silver, magnesium, gold, nickel, neodymium, iridium, chromium, calcium, titanium, tantalum, tungsten, and copper. The source / drain layers can be composed of materials as described above regarding the gate layer's composition. These layers can be single-layer or multi-layer films. For example, multi-layer source / drain layers can be formed as stacked structures such as Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, and Ti / Cu. It is important to note that the film layer containing the gate layer can also include multiple gate lines, and the film layers containing the source / drain layers can also include multiple data lines and multiple power lines. Therefore, the circuit layout complexity of the film layer containing the gate layer can be considered lower than that of the film layer containing the source / drain layers.

[0053] Understandably, in this embodiment, the orthogonal projection of the winding coil 301 on the substrate 10 is set to overlap with the orthogonal projection of the gate layer on the substrate 10. That is, it can be considered that the winding coil 301 and the gate layer are arranged opposite each other to form the first capacitor C1 mentioned above. Since the circuit layout of the film layer where the gate layer is located is less complex, on the one hand, the position of the gate layer can be reasonably set to facilitate the realization that the gate layer overlaps with the active layer in the vertical direction, and also the gate layer overlaps with the winding coil 301 in the vertical direction. On the other hand, the types and number of signals transmitted by the film layer where the gate layer is located are also less, which can reduce the types and number of signals affected by the signals transmitted in the winding coil 301.

[0054] Furthermore, the resistivity of the material comprising the winding coil 301 is lower than the resistivity of the material comprising the gate layer. Specifically, the material comprising the winding coil 301 can be the same as the material comprising the source and drain layers, and the source and drain layers can also be formed into a stacked structure such as Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, etc. It is understandable that, based on the principle of magnetoelectricity generation in coils, the winding coil 301 made of a material with lower resistivity in this embodiment has lower resistance, meaning a smaller driving load results in a larger induced current, less delay in the touch signal, and higher touch sensitivity.

[0055] In one embodiment, such as Figure 1 and Figure 2As shown, the touch panel 100 further includes a wiring layer located on the substrate 10, and disposed on a different layer from either the thin-film transistor layer 20 or the magnetic sensing layer 30, and electrically connected to the thin-film transistor layer 20. Specifically, the touch panel 100 may include multiple sub-pixels and corresponding multiple pixel driving circuits. The pixel driving circuits may include multiple transistors, which may include the aforementioned thin-film transistor layer 20 and multiple wirings in the wiring layer electrically connected to the thin-film transistor layer 20. The driving transistors in the multiple transistors may be electrically connected to the corresponding sub-pixels, and the multiple wirings in the wiring layer may also transmit electrical signals, such as those different from gate signals and data signals, to the multiple transistors.

[0056] In one embodiment, such as Figure 1 and Figure 2 As shown, the wiring layer includes wiring, and the orthographic projection of the wiring on the substrate 10 has a first portion that exceeds the orthographic projection of the metal layer 201 on the substrate 10. The orthographic projection of the winding coil 301 on the substrate 10 overlaps with the first portion. It can be understood that, in conjunction with the above discussion, the orthographic projections of multiple winding coils 301 on the substrate 10 and the orthographic projections of the metal layer 201 on the substrate 10 overlap to form a first capacitor C1. Similarly, in this embodiment, based on the fact that the orthographic projection of the wiring on the substrate 10 has a first portion that exceeds the orthographic projection of the metal layer 201 on the substrate 10, the orthographic projection of the winding coil 301 on the substrate 10 is set to overlap with the first portion. That is, the physical portions of the winding coil 301 and the wiring corresponding to the first portion are arranged opposite each other to form a third capacitor, and the third capacitor and the first capacitor C1 are connected in parallel. Figure 3 and Figure 4 As shown, the total capacitance of the third capacitor and the first capacitor C1 connected in parallel can be greater than the capacitance of the first capacitor C1 set alone. When the equivalent resistance of the winding coil 301 is small, it is beneficial to achieve the required cutoff frequency.

[0057] Understandable, combined Figures 1 to 4As discussed above, once the cutoff frequency is determined, if the equivalent resistance r1 of the winding coil 301 is relatively small, this embodiment increases the total capacitance by setting the orthogonal projection of the winding coil 301 on the substrate 10 to overlap with the first part. Combined with the formula for the cutoff frequency, this setting can compensate for the loss caused by the small equivalent resistance r1 of the winding coil 301. As shown in Table 1, for example, when the cutoff frequency is determined to be 700kHz, when the equivalent resistance r1 of the winding coil 301 is large (equal to 500Ω), the total capacitance formed by the winding coil 301 can be set to be small (equal to 454.96pF). When the equivalent resistance r1 of the winding coil 301 is small (equal to 50Ω), the total capacitance C formed by the winding coil 301 can be set to be large (equal to 4.5496nF).

[0058] Table 1

[0059]

[0060] In one embodiment, combined with Figures 1 to 6 As shown, the winding coil 301 includes: a plurality of first winding coils 302; a plurality of second winding coils 303, which are disposed in a different layer and insulated from the plurality of first winding coils 302. At least one of the orthographic projections of the plurality of first winding coils 302 on the substrate 10 and the orthographic projections of the plurality of second winding coils 303 on the substrate 10 overlaps with the orthographic projection of the metal layer 201 on the substrate 10.

[0061] Specifically, multiple first winding coils 302 can be arranged along a first direction D1 and extend along a second direction D2, and multiple second winding coils 303 can be arranged along the second direction D2 and extend along the first direction D1. The relative positions of the first direction D1 and the second direction D2 are not limited here; only their perpendicularity is used as an example. Of course, the direction in which the multiple first winding coils 302 are arranged can differ from the direction in which the multiple second winding coils 303 extend, and vice versa. Here, "extension" can be understood as the direction of the overall length of the corresponding first winding coil 302 or second winding coil 303. Figure 5 and Figure 6As shown, taking the first direction D1 as the horizontal rightward direction and the second direction D2 as the vertical downward direction as an example, the circuit in the first winding coil 302 can, but is not limited to, extend sequentially from one end along the vertically upward direction, the horizontal rightward direction, and the vertical downward direction to the other end to form a first winding. Furthermore, it can also extend in the "vertically downward direction" mentioned above and then sequentially extend along the horizontal leftward direction, the vertically upward direction, the horizontal rightward direction, and the vertical downward direction to the other end to form a second winding. Here, there is no limit to the number of times the first winding coil 302 is wound. Of course, the last winding of the first winding coil 302 can also be partially or completely completed. Similarly, the winding method of the circuit in the second winding coil 303 can also refer to the winding method of the circuit in the first winding coil 302. Without considering the difference in size and number of turns, the second winding coil 303 can be understood as being obtained by rotating the first winding coil 302 by a certain angle.

[0062] Furthermore, the multiple first winding coils 302 and multiple second winding coils 303 can be arranged in different layers and insulated from each other, and their orthogonal projections on the substrate 10 can have multiple overlapping portions. Each first winding coil 302 and each second winding coil 303 can be electrically connected to the touch chip 40 through corresponding connecting lines. Specifically, the touch chip 40 can detect the corresponding touch point coordinates by the change in the induced current of each of the multiple first winding coils 302 and multiple second winding coils 303, thereby realizing the electromagnetic touch function. Based on the above discussion, the working principle can be as follows: when the electromagnetic pen approaches the magnetic induction layer 30, the magnetic flux change of the first winding coil 302 within a fixed time period generates a first induced current I1, and at the same time, the magnetic flux change of the second winding coil 303 within a fixed time period generates a second induced current I2. The touch position can be located by the change in the first induced current I1 and the second induced current I2.

[0063] In one embodiment, combined with Figures 1 to 6 As shown, the magnetic induction layer 30 also includes an auxiliary coil 304 disposed on the same layer as the wound coil 301, and the auxiliary coil 304 is at least partially opposite to the wound coil 301. Specifically, for example... Figure 5 Auxiliary coil 304, located in the upper middle part. Figure 6 The auxiliary coils 304 on the right side of the center can all be wound along the same path as their corresponding wound coils 301. This maximizes the relative area between the auxiliary coils 304 and their corresponding wound coils 301, thereby maximizing the capacitance value of the resulting capacitor. For example... Figure 5 Auxiliary coil 304, located in the lower middle section Figure 6The auxiliary coil 304 on the left side can be segmented. Each segment of the auxiliary coil 304 can be positioned opposite to a portion of the winding coil 301 to form a corresponding capacitor.

[0064] As can be understood, similarly to the above discussion, in this embodiment, the magnetic induction layer 30 is configured to also include an auxiliary coil 304 disposed on the same layer as the wound coil 301 and disposed at least partially opposite to the wound coil 301. That is, the wound coil 301 and the auxiliary coil 304 disposed opposite to each other can form a fourth capacitor, and the fourth capacitor and the first capacitor C1 are disposed in parallel. Figure 3 and Figure 4 As shown, the total capacitance of the fourth capacitor and the first capacitor C1 connected in parallel can be greater than the capacitance of the first capacitor C1 set alone. When the equivalent resistance of the winding coil 301 is small, it is beneficial to achieve the required cutoff frequency.

[0065] The present invention also provides an electronic terminal, which includes a touch panel as described in any of the above descriptions.

[0066] The touch panel and electronic terminal provided in this invention include: a substrate; a thin-film transistor layer located on the substrate, including a metal layer; a magnetic induction layer located on the substrate, disposed separately from the thin-film transistor layer, including a plurality of wound coils; and a touch chip electrically connected to the wound coils. The orthographic projections of the plurality of wound coils on the substrate and the orthographic projections of the metal layer on the substrate overlap, such that the wound coils and the metal layer form a first capacitor. The first capacitor and at least one of the wound coils form a first filter. The first filter is used to receive and convert the original signal into a first signal, meaning that at least high-frequency impurity current signals in the original signal transmitted to the magnetic induction layer can be filtered out by the first filter formed by the first capacitor and at least one wound coil, thereby reducing the impurity current signals in the original signal and improving the reliability of the touch function of the touch panel.

[0067] The touch panel and electronic terminal provided in the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of the present invention. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A touch panel, characterized in that, include: substrate; A thin-film transistor layer, located on the substrate, includes a metal layer; A magnetic induction layer, located on the substrate and disposed on a different layer from the thin-film transistor layer, includes a plurality of wound coils; A wiring layer is located on the substrate and is disposed in a different layer from either the thin-film transistor layer or the magnetic induction layer, and is electrically connected to the thin-film transistor layer; the wiring layer includes wirings, the orthographic projection of the wirings on the substrate having a first portion that exceeds the orthographic projection of the metal layer on the substrate, and the orthographic projection of the winding coil on the substrate overlaps with the first portion. The touch chip is electrically connected to the wound coil; In this embodiment, the orthographic projections of the plurality of wound coils on the substrate and the orthographic projections of the metal layer on the substrate overlap, so that the wound coils and the metal layer form a first capacitor. The first capacitor is connected to ground. The first capacitor and at least one of the wound coils form a first filter. The first filter is a low-pass filter. The first filter is used to receive and convert the original signal into a first signal for transmission to the touch chip. The touch chip includes a second filter. The second filter is used to receive and convert the first signal into a second signal. The second signal is used to determine the touch status of the touch panel. The second filter is a high-pass filter. The winding coil and the physical portion of the trace corresponding to the first part are arranged opposite to each other to form a third capacitor, and the third capacitor and the first capacitor are connected in parallel. The total capacitance value of the third capacitor and the first capacitor connected in parallel is greater than the capacitance value of the first capacitor. In this process, at least the high-frequency impurity current signal in the original signal transmitted to the magnetic induction layer is filtered out by the first filter, and the high-pass filter is used to filter out the low-frequency impurity current signal in the first signal.

2. The touch panel as described in claim 1, characterized in that, The thin-film transistor layer further includes an active layer, and the metal layer includes: A gate layer is located on the side of the active layer that is close to or far from the substrate; The source / drain layer is located on the active layer; The orthographic projection of the gate layer on the substrate and the orthographic projection of the winding coil on the substrate overlap.

3. The touch panel as described in claim 2, characterized in that, The resistivity of the constituent material of the winding coil is less than the resistivity of the constituent material of the gate layer.

4. The touch panel as described in claim 1, characterized in that, The magnetic induction layer also includes an auxiliary coil disposed in the same layer as the winding coil, and the area of ​​the orthogonal projection of the auxiliary coil onto the winding coil is greater than 0.

5. The touch panel as described in claim 1, characterized in that, The wound coil includes: Multiple first winding coils; A plurality of second winding coils are disposed in a different layer and insulated from a plurality of first winding coils, and at least one of the orthographic projections of the plurality of first winding coils on the substrate and the orthographic projections of the plurality of second winding coils on the substrate overlaps with the orthographic projection of the metal layer on the substrate.

6. An electronic terminal, characterized in that, The electronic terminal includes a touch panel as described in any one of claims 1 to 5.

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