Finite element simulation method, device and storage medium for laser via

Abstract

The application provides a kind of finite element simulation method, equipment and storage medium of laser via, comprising: constructing laser heat source model;Constructing the finite element grid model of material to be processed;Based on laser heat source model, finite element grid model and its boundary heat source condition and simulation parameter in simulation process, the laser via process of material to be processed is simulated deformation analysis, until deformation to the preset material deformation height, load the strong cold convection condition of pre-setting to stop deformation, obtain via simulation result.The application adopts the technical means that laser heat source model and boundary condition are applied to finite element grid model to deform, and strong cold convection condition is added when deforming to the preset material deformation height, to simulate the whole via forming process, solve the technical problem that model material domain grid cannot occur topological change, leading to the whole via forming process cannot be simulated, improve the accuracy of real structure component via.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a finite element simulation method, device and storage medium for laser through-holes. Background Technology

[0002] Currently, many products require through-holes in their structural components to perform specific functions and improve product performance. Creating these through-holes often involves multiple physical experiments or relies on experience, resulting in lengthy testing cycles and significant consumption of material and human resources, thus severely impacting the timeline for component deployment. Therefore, laser through-hole simulation and modeling are of paramount importance.

[0003] However, when using commercial finite element software to simulate large deformation deep holes, the model's material domain mesh cannot undergo topological changes, which means that only the process before the hole reaches the bottom can be simulated, and the entire formation process of the through hole cannot be simulated, thus affecting the effect of through holes in real structural components. Summary of the Invention

[0004] This invention provides a finite element simulation method, device, and storage medium for laser-guided through-holes, aiming to simulate the entire through-hole formation process and thereby improve the accuracy of through-holes in real structural components.

[0005] This invention provides a finite element simulation method for laser-guided holes, comprising:

[0006] Construct a laser heat source model;

[0007] Construct a finite element mesh model of the material to be processed;

[0008] Based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process, the laser through-hole process of the material to be processed is simulated and deformed until the material is deformed to a preset deformation height. Then, a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation result is obtained.

[0009] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention, the simulation parameters include laser parameters, environmental parameters, and material parameters of the material to be processed, wherein,

[0010] The laser parameters include at least one of laser power, laser focal radius, laser action time, and laser action frequency.

[0011] The material parameters include at least one of the following: fixed density, thermal conductivity, specific heat capacity, laser absorption coefficient, sublimation heat, liquid density, convective heat transfer coefficient, and surface emissivity.

[0012] The environmental parameters include the initial ambient temperature.

[0013] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention, the construction of the laser heat source model includes:

[0014] Based on the laser power and the laser focal radius, a laser energy equation is established;

[0015] Based on the laser focal radius and the preset focusing constant, the Gaussian function equation is subjected to two-dimensional axisymmetric deformation in a pre-set two-dimensional axisymmetric plane to obtain the target Gaussian function equation.

[0016] Based on the target Gaussian function equation, the laser energy equation is updated to obtain the target laser energy equation;

[0017] Based on the target laser energy equation, the laser action time, and the laser action frequency, the laser heat source model is constructed.

[0018] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention, the step of performing two-dimensional axisymmetric deformation processing on the Gaussian function equation in a two-dimensional axisymmetric plane based on the laser focal radius and a preset focusing constant to obtain the target Gaussian function equation includes:

[0019] The Gaussian function equation is integrated and normalized, and the relationship between the real constants in the Gaussian function equation is calculated by combining the laser focal radius and the preset focusing constant.

[0020] Substitute the relationship results of the real constants into the Gaussian function equation to calculate the target Gaussian function equation.

[0021] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention,

[0022] The expression for the laser heat source model is:

[0023]

[0024]

[0025] Where S represents the laser input energy density, Q represents the laser power, f is the energy concentration coefficient, gp(r) represents the target Gaussian function equation, r0 represents the laser focal radius, r represents the coordinates of the two-dimensional axisymmetric plane, and t p Indicates the duration of laser action.

[0026] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention, the construction of a finite element mesh model of the material to be processed includes:

[0027] Obtain the material dimensions of the material to be processed;

[0028] Based on the material dimensions, a material geometry model of the material to be processed is constructed using finite element simulation software, and the material geometry model is meshed to obtain the finite element mesh model.

[0029] Optionally, according to the finite element simulation method for laser-driven through-holes provided by the present invention, the laser-driven through-hole process of the material to be processed is simulated and deformed based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters during the simulation process, until the deformation reaches a preset material deformation height, at which point a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation result is obtained, including:

[0030] Construct two-dimensional solid thermal conductivity differential equations and physical heat transfer equations;

[0031] In the finite element simulation software, the laser heat source model, the boundary heat source conditions, the two-dimensional solid heat conduction differential equation, and the physical heat transfer equation are loaded into the finite element mesh model, and the deformation rate is calculated to control the finite element domain in the finite element mesh model to deform at the deformation rate.

[0032] When the finite element domain deforms to the preset material deformation height, the strong cooling convection condition is applied to stop the deformation, and the material through-hole result is obtained.

[0033] Optionally, according to the finite element simulation method for laser-guided holes provided by the present invention, the two-dimensional solid thermal conductivity differential equation is:

[0034]

[0035] Where ρ represents the fixed density of the material, Cp represents the specific heat capacity, S represents the input energy density of the laser, and kJ / L is the kJ / L. r k represents the thermal conductivity along the r direction. z The value represents the thermal conductivity along the z-direction, and T represents the local temperature calculated within the finite element method.

[0036] The physical heat transfer equation is:

[0037]

[0038] Where k represents the thermal conductivity, α represents the laser absorption coefficient, and L v It's sublimation fever, v e The deformation rate is represented by ρ1, the liquid density by h, the convective heat transfer coefficient by ξ, the surface emissivity of the material by T0, and the initial ambient temperature by k. Bdenoted by Boltzmann constant, T represents the local temperature calculated within the finite element method, and ▽T represents the temperature gradient;

[0039] The boundary heat source conditions include heat flux boundary conditions, thermal radiation boundary conditions, and convective heat transfer boundary conditions, wherein...

[0040] The boundary condition equation corresponding to the heat flux boundary condition is:

[0041]

[0042] The boundary condition equation corresponding to the thermal radiation boundary condition is:

[0043]

[0044] The boundary condition equations corresponding to the convective heat transfer boundary conditions are:

[0045]

[0046] The condition equation corresponding to the strong cooling convection condition is:

[0047]

[0048] Where n represents the direction of the outer normal to the boundary surface, h1 represents the convective heat transfer coefficient, and h2 represents the heat transfer coefficient calculated based on the convective heat transfer coefficient h1.

[0049] The present invention also provides a finite element simulation device for laser-guided holes, comprising:

[0050] The first building module is used to build the laser thermal source model;

[0051] The second building module is used to construct the finite element mesh model of the material to be processed.

[0052] The simulation deformation module is used to simulate and analyze the laser through-hole process of the material to be processed based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process. When the deformation reaches the preset material deformation height, a pre-set strong cooling convection condition is applied to stop the deformation and obtain the through-hole simulation result.

[0053] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the finite element simulation method for laser through-hole as described above.

[0054] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the finite element simulation method for laser-guided holes as described above.

[0055] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the finite element simulation method for laser-guided holes as described above.

[0056] The present invention provides a finite element simulation method, device, and storage medium for laser-driven through-holes. This involves constructing a laser heat source model; constructing a finite element mesh model of the material to be processed; and, based on the laser heat source model, the finite element mesh model, its boundary heat source conditions, and simulation parameters during the simulation process, performing a simulated deformation analysis of the laser-driven through-hole process on the material to be processed until the deformation reaches a preset material deformation height. At this point, a pre-set strong cooling convection condition is applied to stop the deformation, thus obtaining the through-hole simulation result. The present invention achieves the simulation of the entire through-hole formation process by applying the laser heat source model and boundary heat source conditions to the finite element mesh model, causing the finite element threshold of the finite element mesh model to deform. Furthermore, by adding a strong cooling convection condition when the deformation reaches the preset material deformation height, the entire through-hole formation process can be simulated. This allows for the improvement of the accuracy of through-holes in real structural components based on the simulated formation process of the entire through-hole. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0058] Figure 1 This is one of the flowcharts illustrating the finite element simulation method for laser-guided holes provided by the present invention;

[0059] Figure 2 A schematic diagram of the material geometry model constructed for this invention;

[0060] Figure 3 This is a schematic diagram of the boundary of the finite element mesh model of the finite element simulation method for laser-guided holes provided by the present invention;

[0061] Figure 4 This is a schematic diagram of the finite element mesh model in this invention, which is divided into reference and non-reference regions.

[0062] Figure 5 This is a comparative schematic diagram of the material through-hole results provided by the present invention;

[0063] Figure 6This is a schematic diagram of the finite element simulation device for laser-guided holes provided by the present invention;

[0064] Figure 7 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0066] The terminology used in one or more embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The singular forms “a,” “the,” and “the” used in one or more embodiments of the invention are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” used in one or more embodiments of the invention refers to and includes any or all possible combinations of one or more associated listed items.

[0067] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of the present invention, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of the present invention, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0068] The following is combined with Figures 1-7 The exemplary embodiments of the present invention will be described in detail below.

[0069] like Figure 1 The diagram shown is a flowchart of a finite element simulation method for laser-guided holes according to an embodiment of the present invention. Figure 1 As shown, the finite element simulation method for this laser-guided hole includes:

[0070] Step S10: Construct a laser heat source model;

[0071] In this embodiment, it should be noted that the laser heat source model includes a Gaussian heat source model, a double ellipsoidal heat source model, and a hemispherical heat source model, etc. Preferably, a Gaussian heat source model is selected. The laser heat source model is constructed in finite element simulation software, including software such as COMSOL and ANSYS. Preferably, the model is built on COMSOL software.

[0072] As one possible implementation method, specifically, the power density equation of the laser is first established, which can be expressed as follows:

[0073]

[0074] Where Q represents laser power, R b Indicates the laser focal radius.

[0075] Based on the power density equation, a laser energy equation is constructed, which can be expressed as follows:

[0076]

[0077] Where Q represents laser power, R b Let f represent the laser focal radius, f represent the energy concentration coefficient, and (x, y, z) represent the coordinates in the three-dimensional coordinate system.

[0078] A two-dimensional axisymmetric plane model is then constructed, wherein the parameters of the two-dimensional axisymmetric plane model include radius and height, and the correspondence between the two-dimensional coordinates in the two-dimensional axisymmetric plane model and the three-dimensional coordinates in the three-dimensional coordinate system is as follows:

[0079]

[0080] Where r represents the radius and z represents the height, thus transforming the laser energy equation... Transform into Where r represents the radius coordinate of the two-dimensional axisymmetric plane in the two-dimensional axisymmetric plane model.

[0081] Furthermore, since the general form of the Gaussian function equation is:

[0082]

[0083] In the Gaussian function equation, a, b, and c are real constants, where a > 0. Parameter a represents the peak value of the Gaussian curve, b represents its corresponding x-axis, and c represents the standard deviation (also known as the Gaussian RMS width), which controls the width of the Gaussian function equation.

[0084] Understandably, the general form of the Gaussian function equation and the laser energy equation... Similar, can The process is transformed into a Gaussian function equation. Specifically, for the laser heat source model, based on the laser focal radius and a preset focusing constant, the Gaussian function equation is integrated and normalized to calculate the relationship between the real constants in the Gaussian function equation. Then, the relationship between the real constants is substituted into the Gaussian function equation to obtain the target Gaussian function equation.

[0085] Furthermore, based on the target Gaussian function equation, the laser energy equation is updated to obtain the target laser energy equation, thereby constructing the laser heat source model based on the target laser energy equation, the laser action time, and the laser action frequency.

[0086] Step S20: Construct a finite element mesh model of the material to be processed;

[0087] In this embodiment, based on the material dimensions of the material to be processed, a material geometry model of the material to be processed is constructed on the COMSOL software, and the material geometry model is meshed to obtain the finite element mesh model. The meshing includes methods such as mapped meshing, swept meshing, and swept meshing, etc., as referred to... Figure 2 Construct a material geometry model with dimensions of 1mm × 5mm, where the width is 1mm and the height is 5mm.

[0088] Step S30: Based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process, the laser through-hole process of the material to be processed is simulated and deformed until the deformation reaches the preset material deformation height. Then, a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation result is obtained.

[0089] In this embodiment, it should be noted that the preset material deformation height is the deformation stop height, and the simulation parameters include laser parameters, environmental parameters, and material parameters of the material to be processed. The environmental parameters include parameters such as initial environmental temperature and environmental pressure. The laser parameters include parameters such as laser power, laser focal radius, laser action time, and laser action frequency. The material parameters may include parameters such as material fixed density, thermal conductivity, specific heat capacity, laser absorption coefficient, heat of sublimation, liquid density, convective heat transfer coefficient, material surface emissivity, dynamic viscosity of the solid region of the melt material, dynamic viscosity of the liquid region, surface tension coefficient, and the derivative of surface tension with respect to temperature.

[0090] Furthermore, the boundary heat source conditions of the finite element mesh model are determined based on the influencing factors of each finite element domain in the finite element mesh model. These boundary heat source conditions include heat flux boundary conditions, thermal radiation boundary conditions, and convective heat transfer boundary conditions, wherein:

[0091] The boundary condition equation corresponding to the heat flux boundary condition is:

[0092]

[0093] The boundary condition equation corresponding to the thermal radiation boundary condition is:

[0094]

[0095] The boundary condition equations corresponding to the convective heat transfer boundary conditions are:

[0096]

[0097] Where k represents thermal conductivity, S represents laser input energy density, α represents laser absorption coefficient, h represents convective heat transfer coefficient, ξ represents material surface emissivity, T0 represents initial ambient temperature, and k B denoted by Boltzmann constant, T represents the local temperature calculated in the finite element method, n represents the direction of the outward normal to the boundary surface, and h1 represents the convective heat transfer coefficient.

[0098] For reference Figure 3 In this model, boundary 1 is the rotational symmetry axis of the finite element mesh model, boundary 3 is the region radiated by the laser beam, and the main influencing factor is the energy distribution of the laser beam. Therefore, the main influencing factor of boundary 3 is the ablation heat flux. The influencing factors of boundaries 2, 3 and 4 are thermal radiation to the environment. Boundaries 2, 3 and 4 also have convective heat transfer to the environment. Boundary 5 is approximately considered to be insulating.

[0099] Specifically, please refer to Figure 4 Based on the preset material deformation height, the finite element mesh model is divided into a reference region and a non-reference region. For example, the reference region... Figure 2 , Figure 1 The height range in the range is -1 to 4, and the part below the height z = 0 can be divided into the non-reference region.

[0100] Furthermore, a two-dimensional solid thermal conductivity differential equation and a physical heat transfer equation are constructed. Then, based on the finite element mesh model, the two-dimensional solid thermal conductivity differential equation, the physical heat transfer equation, the laser heat source model, the boundary heat source conditions, and the simulation parameters are loaded, allowing the finite element domain of the finite element mesh model to deform, forming a small hole. In this embodiment, when the deformation reaches the preset material cutoff height, i.e., when it reaches the non-reference region, a strong cooling convection condition is added, causing the material region at the preset material cutoff height to quickly stop deforming, thus simulating the deformation of the laser-guided hole process. (Refer to...) Figure 3Assuming a preset material deformation height z = 0, the portion below z = 0 is divided into a non-reference region. The two-dimensional solid heat conduction differential equation, physical heat transfer equation, laser heat source model, boundary heat source conditions, and simulation parameters are loaded into the finite element mesh model. The boundary 3 of the finite element mesh model undergoes ablation deformation. When the deformation reaches z = 0, a strong cold convection condition is added to the edge 3.

[0101] The strong cooling convection condition can be expressed as follows:

[0102]

[0103] in,

[0104] Where k represents the thermal conductivity, n represents the direction of the outer normal of the boundary surface, T0 represents the initial ambient temperature, T represents the local temperature calculated in the finite element method, h1 represents the convective heat transfer coefficient, and h2 represents the heat transfer coefficient calculated based on the convective heat transfer coefficient h1.

[0105] This application employs the above-mentioned scheme, namely, constructing a laser heat source model; constructing a finite element mesh model of the material to be processed; and, based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, as well as the simulation parameters during the simulation process, simulating the deformation analysis of the laser-driven through-hole process of the material to be processed until the deformation reaches a preset material deformation height. Then, a pre-set strong cooling convection condition is applied to stop the deformation, thus obtaining the through-hole simulation result. This invention achieves the simulation of the entire through-hole formation process by applying the laser heat source model and boundary heat source conditions to the finite element mesh model, causing the finite element threshold of the finite element mesh model to deform. Furthermore, when the deformation reaches a preset material deformation height, a strong cooling convection condition is added, thereby realizing the simulation of the entire through-hole formation process. Based on this simulation of the entire through-hole formation process, the accuracy of through-holes in real structural components is improved.

[0106] Based on the above embodiments, step S10: constructing a laser heat source model specifically includes:

[0107] Step S11: Based on the laser power and the laser focal radius, establish the laser energy equation;

[0108] Step S12: Based on the laser focal radius and the preset focusing constant, perform two-dimensional axisymmetric deformation processing on the Gaussian function equation in a pre-set two-dimensional axisymmetric plane to obtain the target Gaussian function equation;

[0109] Step S13: Based on the target Gaussian function equation, update the laser energy equation to obtain the target laser energy equation;

[0110] Step S14: Based on the target laser energy equation, the laser action time, and the laser action frequency, the laser heat source model is constructed.

[0111] It should be noted that the two-dimensional axisymmetric deformation processing means that the Gaussian function equation is deformed on a two-dimensional axisymmetric plane. Processing the Gaussian function equation on a two-dimensional axisymmetric plane can effectively improve the efficiency of laser heat source model construction. Specifically, in this embodiment, a laser energy equation is established based on the laser power and the laser focal radius. Furthermore, the Gaussian function equation is deformed based on the laser focal radius and a preset focusing constant. Specifically, since the general form of the Gaussian function equation... and the laser energy equation Similar, can This is transformed into a Gaussian function equation. Specifically, first, a two-dimensional axisymmetric plane model containing two parameters, radius and height, is constructed. Based on the correspondence between two-dimensional and three-dimensional coordinates, the laser energy equation can be transformed into a Gaussian function equation. Transform into

[0112] Furthermore, since a, b, and c in the Gaussian function equation are real constants, and a > 0, parameter a represents the peak value of the Gaussian curve, b is its corresponding abscissa, and c, the standard deviation σ, controls the width of the Gaussian function equation. For the laser heat source model, b = 0, and c is related to the laser's focusing degree. Therefore, the relationship between the real constant c in the Gaussian function equation and the laser focal radius and the preset focusing constant can be determined. Then, the Gaussian function equation is integrated and normalized. Substituting the relationship between b = 0, the real constant c, and the laser focal radius and preset focusing constant into the integrated and normalized Gaussian function equation, the relationship of the real constant a in the Gaussian function equation is calculated. Furthermore, substituting the relationship of the real constant a, the relationship between b = 0, and the relationship between the real constant c and the laser focal radius and preset focusing constant into... The target Gaussian function equation can then be obtained.

[0113] Understandably, for example, taking Where r0 is the laser focusing radius and k is the preset focusing constant, the Gaussian function equation is integrated and normalized as follows:

[0114]

[0115] Substituting b = 0, Seeking

[0116] At this point, when c = r0 / k, the general form of the Gaussian function equation is:

[0117]

[0118] Where r represents the coordinates of the two-dimensional axisymmetric plane.

[0119] Furthermore, based on the target Gaussian function equation, the laser energy equation is updated and transformed to obtain the target laser energy equation, which is expressed as follows:

[0120]

[0121] Where Q represents the laser power, f represents the energy concentration coefficient, gp(r) represents the target Gaussian function equation, and r0 represents the laser focal radius.

[0122] Based on the laser action time and the laser action frequency, a laser action duration equation is constructed, which can be expressed as follows:

[0123]

[0124] Among them, t p Indicates the duration of laser action.

[0125] Furthermore, by multiplying the laser action duration equation and the target laser energy equation, the laser heat source model is constructed, and the expression of the laser heat source model is as follows:

[0126]

[0127] Where S represents the input energy density of the laser, f represents the energy concentration coefficient, Q represents the laser power, gp(r) represents the target Gaussian function equation, and r0 represents the laser focal radius.

[0128] The embodiments of the present invention, through the above-described scheme, realize the two-dimensional axisymmetric deformation of the Gaussian function equation in a pre-set two-dimensional axisymmetric plane, and then construct a laser heat source model based on the target Gaussian function equation. Deforming the Gaussian function equation on the two-dimensional axisymmetric plane can effectively improve the efficiency of laser heat source model construction, thereby enabling the loading of the laser heat source model and causing the finite element threshold of the finite element mesh model to deform, laying the foundation for realizing the simulation formation process of the entire through hole.

[0129] Based on the above embodiments, step S30 above: Based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process, the laser through-hole process of the material to be processed is simulated and deformed until the deformation reaches the preset material deformation height, then a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation result is obtained, specifically including:

[0130] Step S31: Construct the two-dimensional solid thermal conductivity differential equation and the physical heat transfer equation;

[0131] Step S32: In the finite element simulation software, the laser heat source model, the boundary heat source conditions, the two-dimensional solid heat conduction differential equation, and the physical heat transfer equation are loaded into the finite element mesh model to calculate the deformation rate, so as to control the finite element domain in the finite element mesh model to deform at the deformation rate.

[0132] Step S33: When the finite element domain deforms to the preset material deformation height, the strong cooling convection condition is applied to stop the deformation, and the material through-hole result is obtained.

[0133] Specifically, in this embodiment, based on the preset material deformation height, the finite element mesh model is divided into a reference region and a non-reference region, thereby constructing a two-dimensional solid thermal conductivity differential equation and a physical heat transfer equation. The two-dimensional solid thermal conductivity differential equation can be expressed as follows:

[0134]

[0135] Where ρ represents the fixed density of the material, Cp represents the specific heat capacity, S represents the input energy density of the laser, and kJ / L is the kJ / L. r k represents the thermal conductivity along the r direction. z The value represents the thermal conductivity along the z-direction, and T represents the local temperature calculated within the finite element method.

[0136] The physical heat transfer equation is expressed as follows:

[0137]

[0138] Where k represents the thermal conductivity, α represents the laser absorption coefficient, and L v It's sublimation fever, v e The deformation rate is represented by ρ1, the liquid density by h, the convective heat transfer coefficient by ξ, the surface emissivity of the material by T0, and the initial ambient temperature by k. B denoted by Boltzmann constant, T represents the local temperature calculated within the finite element method, and ▽T represents the temperature gradient.

[0139] In finite element simulation software, the laser heat source model, the boundary heat source conditions, the two-dimensional solid heat conduction differential equation, and the physical heat transfer equation are loaded into the finite element mesh model. Submitting the calculation in COMSOL software yields the results. Furthermore, during the through-hole process, the deformation rate is calculated, thereby controlling the finite element mesh model to deform at the specified rate. In another implementation, when the physical heat transfer equation is difficult to solve by direct coupling into the heat transfer field, the deformation rate at the material evaporation front can be extracted separately, resulting in the following equation:

[0140]

[0141] Among them, v e Let α represent the deformation velocity, α represent the laser absorption coefficient, S represent the laser input energy density, ρ1 represent the liquid density, and L represent the liquid density. v It is the heat of sublimation, from which the deformation rate is calculated.

[0142] Furthermore, when the deformation reaches the non-reference region, the strong cooling convection condition is applied to stop the deformation, resulting in the material having through-holes. (Refer to...) Figure 5 , Figure 5 The left image shows a schematic diagram of the model between the through holes, and the right image shows a schematic diagram of the model after adding strong cooling convection conditions to the through holes. It can be understood that adding the strong cooling convection conditions can realize the entire simulation process of laser through holes.

[0143] The embodiments of the present invention, through the above-described scheme, realize the control of deformation by adding a strong cold convection condition when the finite element domain deforms to a non-reference region, thereby enabling the entire simulation process of laser drilling from small holes to deep holes and then to through holes to be realized by considering only the material domain of the reference region.

[0144] The finite element simulation device for laser-guided holes provided by the present invention will be described below. The finite element simulation device for laser-guided holes described below can be referred to in correspondence with the finite element simulation method for laser-guided holes described above.

[0145] like Figure 6 As shown, an embodiment of the present invention provides a finite element simulation device for laser-guided holes, the device comprising:

[0146] The present invention also provides a finite element simulation device for laser-guided holes, comprising:

[0147] The first building module 10 is used to build a laser thermal source model;

[0148] The second building module 20 is used to build a finite element mesh model of the material to be processed;

[0149] The simulation deformation module 30 is used to simulate and analyze the laser through-hole process of the material to be processed based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process. When the deformation reaches the preset material deformation height, a pre-set strong cooling convection condition is applied to stop the deformation and obtain the through-hole simulation result.

[0150] Optionally, the first building module 10 is further configured to:

[0151] Based on the laser power and the laser focal radius, a laser energy equation is established;

[0152] Based on the laser focal radius and the preset focusing constant, the Gaussian function equation is subjected to two-dimensional axisymmetric deformation in a pre-set two-dimensional axisymmetric plane to obtain the target Gaussian function equation.

[0153] Based on the target Gaussian function equation, the laser energy equation is updated to obtain the target laser energy equation;

[0154] Based on the target laser energy equation, the laser action time, and the laser action frequency, the laser heat source model is constructed.

[0155] Optionally, the first building module 10 is further configured to:

[0156] The Gaussian function equation is integrated and normalized, and the relationship between the real constants in the Gaussian function equation is calculated by combining the laser focal radius and the preset focusing constant.

[0157] Substitute the relationship results of the real constants into the Gaussian function equation to calculate the target Gaussian function equation.

[0158] Optionally, the second building module 20 is further configured to:

[0159] Obtain the material dimensions of the material to be processed;

[0160] Based on the material dimensions, a material geometry model of the material to be processed is constructed using finite element simulation software, and the material geometry model is meshed to obtain the finite element mesh model.

[0161] Optionally, the simulated deformation module 30 is further configured to:

[0162] Construct two-dimensional solid thermal conductivity differential equations and physical heat transfer equations;

[0163] In the finite element simulation software, the laser heat source model, the boundary heat source conditions, the two-dimensional solid heat conduction differential equation, and the physical heat transfer equation are loaded into the finite element mesh model, and the deformation rate is calculated to control the finite element domain in the finite element mesh model to deform at the deformation rate.

[0164] When the finite element domain deforms to the preset material deformation height, the strong cooling convection condition is applied to stop the deformation, and the material through-hole result is obtained.

[0165] It should be noted that the apparatus provided in this application embodiment can implement all the method steps implemented in the above method embodiment and can achieve the same technical effect. Therefore, the parts that are the same as those in the method embodiment and the beneficial effects will not be described in detail here.

[0166] Figure 7 A schematic diagram of the physical structure of an electronic device is provided. This electronic device may include a processor 610, a memory 620, a communication interface 630, and a communication bus 640. The processor 610, memory 620, and communication interface 630 communicate with each other via the communication bus 640. The processor 610 can call logical instructions in the memory 620 to execute a finite element simulation method for laser-guided holes. This method includes: constructing a laser heat source model; constructing a finite element mesh model of the material to be processed; and, based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and simulation parameters during the simulation process, performing a simulated deformation analysis of the laser-guided hole process on the material to be processed until the deformation reaches a preset material deformation height, at which point a pre-set strong cooling convection condition is applied to stop the deformation, thus obtaining the simulation result of the through-hole.

[0167] Furthermore, the logical instructions in the aforementioned memory 620 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0168] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon. When executed by a processor, the computer program implements a finite element simulation method for laser-guided holes provided by the above methods. The method includes: constructing a laser heat source model; constructing a finite element mesh model of the material to be processed; and performing a simulation deformation analysis of the laser-guided hole process of the material to be processed based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and simulation parameters during the simulation process, until the deformation reaches a preset material deformation height, and then applying a pre-set strong cooling convection condition to stop the deformation, thereby obtaining the hole simulation result.

[0169] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the finite element simulation method for laser-guided holes provided by the above methods. The method includes: constructing a laser heat source model; constructing a finite element mesh model of the material to be processed; and performing a simulation deformation analysis of the laser-guided hole process of the material to be processed based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and simulation parameters in the simulation process, until the deformation reaches a preset material deformation height, and then loading a pre-set strong cooling convection condition to stop the deformation, thereby obtaining the hole simulation result.

[0170] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0171] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0172] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A finite element simulation method for laser-guided through-holes, characterized in that, include: Construct a laser heat source model; Construct a finite element mesh model of the material to be processed; Based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters in the simulation process, the laser through-hole process of the material to be processed is simulated and deformed until the material is deformed to a preset deformation height. Then, a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation results are obtained. The simulation parameters include laser parameters, environmental parameters, and material parameters of the material to be processed, wherein: The laser parameters include at least one of laser power, laser focal radius, laser action time, and laser action frequency. The material parameters include at least one of the following: fixed density, thermal conductivity, specific heat capacity, laser absorption coefficient, sublimation heat, liquid density, convective heat transfer coefficient, and surface emissivity. The environmental parameters include the initial ambient temperature; Based on the laser heat source model, the finite element mesh model and its boundary heat source conditions, and the simulation parameters during the simulation process, the laser-driven through-hole process of the material to be processed is simulated and deformed until the deformation reaches a preset material deformation height. Then, a pre-set strong cooling convection condition is applied to stop the deformation, and the through-hole simulation results are obtained, including: Construct two-dimensional solid thermal conductivity differential equations and physical heat transfer equations; In the finite element simulation software, the laser heat source model, the boundary heat source conditions, the two-dimensional solid heat conduction differential equation, and the physical heat transfer equation are loaded into the finite element mesh model, and the deformation rate is calculated to control the finite element domain in the finite element mesh model to deform at the deformation rate. When the finite element domain deforms to the preset material deformation height, the strong cooling convection condition is applied to stop the deformation, and the simulation result of the through hole is obtained. The two-dimensional solid thermal conductivity differential equation is as follows: ； Where ρ represents the fixed density of the material, Cp represents the specific heat capacity, S represents the input energy density of the laser, and kJ / L is the kJ / L. r k represents the thermal conductivity along the r direction. z The value represents the thermal conductivity along the z-direction, and T represents the local temperature calculated within the finite element method. The expression for the physical heat transfer equation is: ； Where k represents the thermal conductivity, α represents the laser absorption coefficient, and L v It's sublimation fever, v e The deformation rate is represented by ρ1, the liquid density by h, the convective heat transfer coefficient by ξ, the surface emissivity of the material by T0, and the initial ambient temperature by k. B denoted by Boltzmann constant, T represents the local temperature calculated within the finite element method, and ▽T represents the temperature gradient; The boundary heat source conditions include heat flux boundary conditions, thermal radiation boundary conditions, and convective heat transfer boundary conditions, wherein... The boundary condition equation corresponding to the heat flux boundary condition is: ； The boundary condition equation corresponding to the thermal radiation boundary condition is: ； The boundary condition equations corresponding to the convective heat transfer boundary conditions are: ； The condition equation corresponding to the strong cooling convection condition is: ， ； Where n represents the direction of the outer normal to the boundary surface, h1 represents the convective heat transfer coefficient, and h2 represents the heat transfer coefficient calculated based on the convective heat transfer coefficient h1.

2. The finite element simulation method for laser-guided through-holes according to claim 1, characterized in that, The construction of the laser heat source model includes: Based on the laser power and the laser focal radius, a laser energy equation is established; Based on the laser focal radius and the preset focusing constant, the Gaussian function equation is subjected to two-dimensional axisymmetric deformation in a pre-set two-dimensional axisymmetric plane to obtain the target Gaussian function equation. Based on the target Gaussian function equation, the laser energy equation is updated to obtain the target laser energy equation; Based on the target laser energy equation, the laser action time, and the laser action frequency, the laser heat source model is constructed.

3. The finite element simulation method for laser-guided holes according to claim 2, characterized in that, The step of performing a two-dimensional axisymmetric deformation on the Gaussian function equation in a two-dimensional axisymmetric plane based on the laser focal radius and a preset focusing constant to obtain the target Gaussian function equation includes: The Gaussian function equation is integrated and normalized, and the relationship between the real constants in the Gaussian function equation is calculated by combining the laser focal radius and the preset focusing constant. Substitute the relationship results of the real constants into the Gaussian function equation to calculate the target Gaussian function equation.

4. The finite element simulation method for laser-guided holes according to claim 2, characterized in that, The expression for the laser heat source model is: ； ； Where S represents the laser input energy density, Q represents the laser power, f is the energy concentration coefficient, gp(r) represents the target Gaussian function equation, r0 represents the laser focal radius, r represents the coordinates of the two-dimensional axisymmetric plane, and t p Indicates the duration of laser action.

5. The finite element simulation method for laser-guided holes according to claim 1, characterized in that, The construction of the finite element mesh model of the material to be processed includes: Obtain the material dimensions of the material to be processed; Based on the material dimensions, a material geometry model of the material to be processed is constructed using finite element simulation software, and the material geometry model is meshed to obtain the finite element mesh model.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the finite element simulation method for laser-guided holes as described in any one of claims 1 to 5.

7. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the finite element simulation method for laser-guided holes as described in any one of claims 1 to 5.

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