Bonding process and device for mini LED / micro LED lamp beads

By employing a Mini LED/Micro LED chip bonding process with precise detection and alignment, the problem of high bonding failure rate has been solved, achieving a highly efficient bonding process and improving the processing quality and yield of the display.

CN115524335BActive Publication Date: 2026-07-21LEADING OPTICAL TECH (JIANGSU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
LEADING OPTICAL TECH (JIANGSU) CO LTD
Filing Date
2022-09-21
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing bonding processes for Mini LED/Micro LED displays suffer from high bonding failure rates, especially with the SMD technology route, which presents challenges in quality control, leading to increased rework rates and impacting display quality.

Method used

By detecting the integrity of the first bonding layer, a high-resolution color camera and neural network model are used to detect surface and optical defects. Planar and three-dimensional coordinate systems are established to precisely control the alignment of the bonding layer and the solder plate. A physical adhesive layer is used for fixation, and a pressing mold is used for precise bonding.

Benefits of technology

This improved bonding accuracy, reduced rework due to size issues or misaligned installation, and ensured the processing quality and yield of the monitor.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a bonding process and device of Mini LED / Micro LED lamp beads, and belongs to the field of display manufacturing.The process comprises the following steps: detecting the integrity of a first bonding layer; manufacturing a physical adhesion layer at the connection of the first bonding layer and a second bonding layer, and fixing the second bonding layer; establishing two plane coordinate systems with a reference position corresponding to the first bonding layer and the second bonding layer as the origin respectively; obtaining the area characteristic value of the first bonding layer and the area characteristic value of the second bonding layer; judging whether the area characteristic value of the first bonding layer is uniformly covered on the area characteristic value of the second bonding layer; and physically bonding the first bonding layer and the second bonding layer by using a pressing mold.The application realizes mathematical modeling of the first bonding layer and the second bonding layer, and performs simulation bonding in advance, so that the position accuracy between the first bonding layer and the second bonding layer is ensured, and the rework caused by the size or misalignment installation is reduced.
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