Condensation verification method, device, equipment and storage medium

Abstract

The application discloses a dew verification method, device, equipment and storage medium. The method comprises the following steps: acquiring the installation position of a domain controller; determining reference environmental parameters according to the installation position; determining a dew state according to the reference environmental parameters; if the dew state is dew generation, calculating the weight of the dew; and determining the influence of the dew on a chip according to the weight of the dew. According to the technical scheme, the temperature and other parameters of the inlet of the domain controller are monitored to determine whether dew is generated at the inlet of the domain controller. When it is determined that dew is generated, the weight of the dew is calculated, and the influence of the dew on the chip is determined according to the weight of the dew.

Description

Technical Field

[0001] This application belongs to the field of vehicle safety technology, and in particular relates to a condensation verification method, apparatus, equipment and storage medium. Background Technology

[0002] Currently, some domain controller thermal management solutions connect the domain controller in parallel with the battery pack system. Therefore, the domain controller's inlet coolant temperature changes in tandem with the battery pack's inlet coolant temperature. Vehicles generally have two cooling modes: one where the coolant dissipates heat through the vehicle's front radiator, resulting in a coolant temperature approximately equal to ambient temperature, suitable for normal or low-temperature environments; and another where the coolant exchanges heat through the vehicle's radiator, achieving a lower coolant temperature, typically around 20°C, suitable for high-temperature environments. When the system radiator is activated, the coolant temperature is relatively low, and if the domain controller is in a high-temperature, high-humidity environment, there is a risk of condensation.

[0003] However, the current ISO 16750 (Automotive Electrical and Electronic Performance Testing Standard) damp heat cycling test method cannot verify the impact of condensation caused by excessively low inlet water temperature on the chip. Summary of the Invention

[0004] This application aims to at least partially address one of the technical problems in the related art. Therefore, one objective of this application is to provide a condensation verification method, apparatus, device, and storage medium.

[0005] To address the aforementioned technical problems, embodiments of this application provide the following technical solutions:

[0006] A method for verifying condensation includes:

[0007] Obtain the installation location of the domain controller;

[0008] Determine the reference environmental parameters based on the installation location;

[0009] The condensation state is determined based on the aforementioned reference environmental parameters;

[0010] If the condensation state is that condensation occurs, then the weight of the condensation is calculated.

[0011] The impact of the condensation on the chip is determined based on the weight of the condensation.

[0012] Optionally, determining the reference environmental parameters based on the installation location includes:

[0013] Determine the reference position based on the installation location;

[0014] Based on the reference location, the reference environmental parameters are determined; wherein, the reference environmental parameters include ambient temperature, cooler inlet water temperature, and actual relative humidity.

[0015] Optionally, determining the condensation state based on the reference environmental parameters includes:

[0016] Obtain a reference relative humidity and the actual relative air humidity, and compare the actual relative air humidity with the reference relative air humidity to obtain a comparison result;

[0017] Based on the comparison results, the condensation state is determined; wherein, if the comparison result is that the reference relative air humidity is greater than the actual relative air humidity, the condensation state is determined to be condensation occurring; conversely, if the comparison result is that the reference relative air humidity is less than or equal to the actual relative air humidity, the condensation state is determined to be no condensation occurring.

[0018] Optionally, calculating the weight of the condensation based on the reference environmental parameters includes:

[0019] The first moisture content is determined based on the ambient temperature and the actual relative air humidity.

[0020] The second water content is determined based on the inlet water temperature of the cooler;

[0021] Based on the first moisture content and the second moisture content, the amount of water separated is calculated.

[0022] Based on the amount of water separated, the weight of the condensation is calculated.

[0023] Optionally, calculating the weight of the condensation based on the amount of water separated includes:

[0024] Obtain preset parameters; wherein, the preset parameters include protection level, air volume inside the domain controller housing, and safety factor;

[0025] Based on the preset parameters and the amount of water separated, the weight of the condensation is calculated.

[0026] Optionally, determining the impact of the condensation on the chip based on the weight of the condensation includes:

[0027] The volume of the water droplet is calculated based on the weight of the condensation; wherein the water droplet is obtained based on the condensation.

[0028] The impact of condensation on the chip is determined based on the volume of the water droplets.

[0029] Optionally, determining the impact of condensation on the chip based on the volume of the water droplets includes:

[0030] The diameter of the water droplet is determined based on its volume.

[0031] Obtain the reference distance between two pins of the chip;

[0032] The reference distance is compared with the diameter of the water droplet to obtain the comparison result;

[0033] Based on the comparison results, the impact of condensation on the chip is determined.

[0034] Embodiments of this application also provide a condensation verification device, comprising:

[0035] The acquisition module is used to obtain the installation location of the domain controller;

[0036] The determination module is used to determine reference environmental parameters based on the installation location;

[0037] The judgment module is used to determine the condensation state based on the reference environmental parameters;

[0038] A calculation module is used to calculate the weight of the condensation if the condensation state is that condensation is occurring.

[0039] The comparison module is used to determine the impact of the condensation on the chip based on the weight of the condensation.

[0040] Embodiments of this application also provide an electronic device, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor executes the computer program to implement the method described above.

[0041] Embodiments of this application also provide a computer-readable storage medium, the computer-readable storage medium including a stored computer program, wherein, when the computer program is executed, it controls the device where the computer-readable storage medium is located to perform the method described above.

[0042] The embodiments of this application have the following technical effects:

[0043] The above-mentioned technical solution of this application monitors parameters such as the temperature at the inlet of the domain controller to determine whether condensation occurs at the inlet of the domain controller. Once condensation is confirmed, the weight of the condensation is calculated, and the impact of the condensation on the chip is determined based on the weight of the condensation.

[0044] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0045] Figure 1 This is a flowchart illustrating a condensation verification method provided in an embodiment of this application;

[0046] Figure 2 This is an enthalpy-humidity diagram provided in an embodiment of this application;

[0047] Figure 3 This is a schematic diagram of the structure of a condensation verification device provided in an embodiment of this application. Detailed Implementation

[0048] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0049] To facilitate understanding of the embodiments by those skilled in the art, some terms are explained below:

[0050] (1) MCU: Microcontroller Unit.

[0051] (2)chiller: battery cooler.

[0052] Embodiments of this application provide a condensation verification system, comprising:

[0053] Domain controller; wherein, the domain controller is equipped with a chip;

[0054] Cooler; the cooler can be based on a chiller. Specifically, the coolant exchanges heat through the vehicle's cooler, which can achieve a lower coolant temperature, generally around 20°C, suitable for high-temperature operating environments. However, when heat exchange is based on a chiller, due to the low coolant temperature, if the domain controller is in a high-temperature and high-humidity environment after water is introduced, there is a risk of condensation at the domain controller's inlet.

[0055] The verifier is connected to both the domain controller and the cooler. It is used to monitor parameters such as the temperature at the domain controller's inlet, the ambient temperature, and the relative humidity, and to obtain monitoring data. The verifier then sends the monitoring data to the processor, which processes the data to determine the condensation status at the domain controller's inlet (including whether condensation occurs or not).

[0056] If the verifier determines, based on monitoring data, that condensation occurs at the entry point of the domain controller, it calculates the weight of the condensation and, in conjunction with the weight of the condensation, determines the impact on the functionality of the domain controller's chip (including whether it causes or does not cause chip malfunction).

[0057] In an optional embodiment of this application, the verifier may include multiple sensors (e.g., temperature sensors, humidity sensors, etc.) for monitoring parameters such as the temperature of the domain controller's inlet, ambient temperature, and relative humidity; wherein each sensor can interact with the processor via a network to feed back the acquired monitoring data to the processor for processing; wherein the processor may be based on a component with this function, such as an MCU.

[0058] In the embodiments of this application, a verifier is set up to monitor parameters such as the temperature at the inlet of the domain controller to determine whether condensation occurs at the inlet of the domain controller. Once condensation is determined, the weight of the condensation is calculated, and the impact of the condensation on the chip is determined based on the weight of the condensation.

[0059] like Figure 1 As shown, embodiments of this application also provide a condensation verification method, applied to the above-mentioned condensation verification system, comprising:

[0060] Step S11: Obtain the installation location of the domain controller;

[0061] In the embodiments of this application, the installation location of the domain controller is first determined. For example, the installation location of the domain controller may be under the foot pedal or seat of the vehicle.

[0062] In the embodiments of this application, the reference environmental parameters to be referenced for verification may be different depending on the installation location of the domain controller. Therefore, in the embodiments of this application, when performing condensation verification, it is first necessary to determine the installation location of the domain controller to be verified.

[0063] Step S12: Determine the reference environmental parameters based on the installation location;

[0064] In an optional embodiment of this application, determining the reference environmental parameters based on the installation location includes:

[0065] Determine the reference position based on the installation location;

[0066] Based on the reference location, the reference environmental parameters are determined; wherein, the reference environmental parameters include ambient temperature, cooler inlet water temperature, and actual relative humidity.

[0067] In the embodiments of this application, the ambient temperature and relative humidity corresponding to the normal operation of the domain controller are determined based on the installation location of the domain controller;

[0068] For example, if the domain controller is installed under the foot pedal or seat of the vehicle, the reference location can be determined as the passenger compartment;

[0069] In other words, at this point, it can be determined that the environment in which the domain controller is located is the same as that in the crew cabin. That is, after obtaining the environmental parameters of the crew cabin, the environmental parameters of the crew cabin are determined as the reference environmental parameters for condensation verification.

[0070] In the embodiments of this application, since the domain controller has multiple installation locations and the environmental parameters inside the domain controller housing are not easy to obtain, it is necessary to determine a reference location based on the installation location of the domain controller. In the embodiments of this application, when the installation location of the domain controller is determined to be under the foot pedal or seat of the vehicle, the reference location is determined to be the passenger compartment. Compared with the environmental parameters inside the domain controller housing, the environmental parameters of the passenger compartment are easier to obtain.

[0071] It should be noted that the correspondence between the installation location and the reference location can be determined based on a preset or actual needs, and the embodiments of this application do not impose specific limitations on this.

[0072] Step S13: Determine the condensation state based on the reference environmental parameters;

[0073] In an optional embodiment of this application, determining the condensation state based on the reference environmental parameters includes:

[0074] Obtain a reference relative humidity and the actual relative air humidity, and compare the actual relative air humidity with the reference relative air humidity to obtain a comparison result;

[0075] Based on the comparison results, the condensation state is determined; wherein, if the comparison result is that the reference relative air humidity is greater than the actual relative air humidity, the condensation state is determined to be condensation occurring; conversely, if the comparison result is that the reference relative air humidity is less than or equal to the actual relative air humidity, the condensation state is determined to be no condensation occurring.

[0076] In the embodiments of this application, after determining the reference position as the passenger compartment, it is also necessary to determine the actual scenario of the passenger compartment and determine the condensation state based on the actual scenario; wherein, the actual scenario may include a scenario where the air conditioning is on and a scenario where the air conditioning is not on.

[0077] In an optional embodiment of this application, if the actual scenario of the passenger cabin is an air-conditioning scenario, and the ambient temperature of the passenger cabin is obtained to be <25°C and the relative humidity is <45%; after the cooler is activated, the inlet water temperature of the domain controller is 20°C; assuming that the ambient temperature of the passenger cabin is 25°C and the relative humidity is 45%, and assuming that the inlet temperature of the domain controller is also 20°C, then condensation will not occur.

[0078] Specifically, such as Figure 2 The figure shows an enthalpy-humidity graph, with ambient temperature as the vertical axis and moisture content as the horizontal axis. The relative air humidity corresponds to each point on the curve (ambient temperature, moisture content).

[0079] The first curve corresponds to a relative air humidity of 45%; the second curve corresponds to a relative air humidity of 60%; and the third curve corresponds to a relative air humidity of 100%.

[0080] Then combine Figure 2 It can be seen that at point A, the temperature in the crew cabin is 25℃, the moisture content is 8.88g / kg, and the corresponding actual relative air humidity is 45%.

[0081] At point B, the crew cabin temperature is 20°C, and the moisture content is 8.88 g / kg, corresponding to an actual relative humidity of 60%. From point A to point B, the gas inside the domain controller housing cools down to 20°C due to contact with the 20°C cooler. To ensure the moisture content remains unchanged, the gas state changes from point A to point B. At this point, the actual relative humidity is less than the reference relative humidity, i.e., 60% < 100%. Therefore, under this condition, condensation will not occur at the domain controller inlet, thus confirming that condensation is not occurring under these conditions.

[0082] In an optional embodiment of this application, if the actual scenario of the passenger cabin is that the air conditioning is not turned on, the ambient temperature of the passenger cabin depends on the ambient temperature. Therefore, condensation cannot be avoided, that is, the condensation state is the occurrence of condensation.

[0083] Step S14: If the condensation state is that condensation has occurred, then calculate the weight of the condensation.

[0084] In an optional embodiment of this application, calculating the weight of condensation based on the reference environmental parameters includes:

[0085] The first moisture content is determined based on the ambient temperature and the actual relative air humidity.

[0086] The second water content is determined based on the inlet water temperature of the cooler;

[0087] Based on the first moisture content and the second moisture content, the amount of water separated is calculated.

[0088] Based on the amount of water separated, the weight of the condensation is calculated.

[0089] In an optional embodiment of this application, if the condensation state is condensation, then it is assumed that 1) the effect of chip condensation on the air inside the domain controller housing is ignored, and the air inside the domain controller housing is at the same temperature as the passenger compartment and the environment.

[0090] 2) The protection level is IP4X, and the gas inside the domain controller housing can freely enter and exit (that is, the gas is in a free fluid state).

[0091] 3) The volume of air inside the domain controller housing is QL. The calculated weight of condensation corresponds to a safety factor of T times, and Q, T > 0.

[0092] Furthermore, the initial ambient temperature and initial actual relative humidity are preset, and the initial water content under this state can be determined by the enthalpy-humidity diagram as Mg / kg (first water content); where M > 0;

[0093] When the inlet water temperature of the cooler is N℃, the air temperature inside the domain controller housing will drop from the initial ambient temperature to close to the inlet water temperature N℃. After water is supplied, the air temperature inside the domain controller housing is taken as N℃; where N>0.

[0094] By using the enthalpy-humidity chart, we can determine that when the actual ambient temperature is 20℃ and the actual relative humidity is 100%, the corresponding actual water content is Pg / kg (second water content); where P > 0.

[0095] The comparison shows that after the cooler is activated, if Pg / kg < Mg / kg, then when the air temperature inside the domain controller housing drops from the initial ambient temperature to the actual ambient temperature, (MP)g (water precipitation) of water will be precipitated for every 1kg of air, which is the state of condensation.

[0096] Calculate the weight of the condensation produced based on the fact that (MP)g of water will precipitate out for every 1kg of air.

[0097] In an optional embodiment of this application, calculating the weight of the condensation based on the amount of water separated includes:

[0098] Obtain preset parameters; wherein, the preset parameters include protection level, air volume inside the domain controller housing, and safety factor;

[0099] Based on the preset parameters and the amount of water separated, the weight of the condensation is calculated.

[0100] In an optional embodiment of this application, based on the above assumptions, the protection level is IP4X, the air inside the domain controller housing can freely enter and exit the domain controller, and the volume of the air inside the domain controller housing is QL. The calculated weight of condensation is taken as a safety factor of T, and the air density is taken as 1.205 kg / m³. 3 If all the air inside the domain controller housing condenses, the maximum weight of the condensation, G, can be calculated as follows:

[0101] G = T * QL * 1.205 kg / m 3 *(MP)g / kg; where G>0.

[0102] Step S15: Determine the impact of the condensation on the chip based on the weight of the condensation.

[0103] In an optional embodiment of this application, determining the impact of the condensation on the chip based on the weight of the condensation includes:

[0104] The volume of the water droplet is calculated based on the weight of the condensation; wherein the water droplet is obtained based on the condensation.

[0105] The impact of condensation on the chip is determined based on the volume of the water droplets.

[0106] In the embodiments of this application, it can be assumed that all the condensation eventually converges into a single water droplet. Then, by combining the weight of the condensation, the diameter D of the water droplet can be calculated.

[0107] Specifically, the diameter D of the water droplet can be calculated using the following formula:

[0108]

[0109] Where ρ=1g / cm 3 , is used to characterize the density of water.

[0110] The maximum diameter of the water droplet can be obtained through the above calculations.

[0111] In an optional embodiment of this application, determining the impact of condensation on the chip based on the volume of the water droplets includes:

[0112] The diameter of the water droplet is determined based on its volume.

[0113] Obtain the reference distance between two pins of the chip;

[0114] The reference distance is compared with the diameter of the water droplet to obtain the comparison result;

[0115] Based on the comparison results, the impact of condensation on the chip is determined.

[0116] In the embodiments of this application, assuming the reference distance is R, R is compared with D. If the comparison result is R > D, then condensation will not cause the chip to malfunction.

[0117] Conversely, if the comparison result is R < D, condensation may cause abnormal chip function, which can be further verified. The embodiments of this application do not impose specific limitations on this.

[0118] In embodiments of this application, after condensation is determined to occur at the entrance of the domain controller, the same weight of condensation may have different functional effects on different chips. For example, some chips with a small reference distance between two pins may experience malfunctions, while some chips with a large reference distance between two pins may not experience any malfunctions; or, some chips with a small reference distance between two pins may experience significant malfunctions, while some chips with a large reference distance between two pins may experience less malfunctions. To solve the above problems, embodiments of this application obtain the reference distance between two pins of each chip, compare the obtained reference distance with the diameter of the water droplet, and determine the impact of the weight of condensation on the chip's function based on the comparison result.

[0119] The above embodiments of this application can be implemented based on the following methods:

[0120] Specifically, assuming the domain controller is working normally and the vehicle is driving under the worst conditions (ambient temperature of 40℃ and actual relative humidity of 95%), the cooler inlet water temperature is 20℃ and the circulation time is 4 hours (assuming it is the maximum value of the vehicle's driving time).

[0121] The domain controller housing was inspected, and the domain controller housing was installed at the same angle as the vehicle.

[0122] The default protection rating is IP4X. Air can freely enter and exit the domain controller enclosure, and the volume of air inside the enclosure is 0.5L (Q = 0.5). The calculated weight of condensation is taken as a safety factor of 2 (T = 2), and the air density is taken as 1.205 kg / m³. 3 Furthermore, all the air inside the domain controller housing condenses (which means the maximum weight of the condensation in this state can be obtained).

[0123] Furthermore, the initial ambient temperature and initial relative humidity are determined based on the city where the vehicle is located;

[0124] 1) When the vehicle was located in Turpan, the initial ambient temperature was 50℃ and the initial relative humidity was 30%. The enthalpy-humidity chart shows that the corresponding initial moisture content under these conditions was 23.6 g / kg.

[0125] When the inlet water temperature of the cooler is 20℃, the air temperature inside the domain controller housing will drop from 50℃ to close to the inlet water temperature of 20℃. After water is supplied, the air temperature inside the domain controller housing is taken as 20℃.

[0126] By using the enthalpy-humidity chart, it can be determined that when the actual ambient temperature is 20℃ and the actual relative humidity is 100%, the corresponding actual water content is 14.7g / kg.

[0127] The comparison shows that after the cooler is activated, 14.7g / kg < 23.6g / kg. Therefore, when the air temperature inside the domain controller housing drops from 50℃ to 20℃, 23.6-14.7=8.9g of water will be released per 1kg of air.

[0128] Based on the above assumptions, the protection level is IP4X, the air inside the domain controller housing can freely enter and exit the domain controller, and the volume of the air inside the domain controller housing is 0.5L. The calculated weight of condensation is taken as a safety factor of 2, and the air density is taken as 1.205kg / m³. 3 If all the air inside the domain controller housing condenses, the maximum weight of the condensation is: 2 * 0.5 L * 1.205 kg / m³. 3 *8.9g / kg=0.011g.

[0129] Based on the formula provided in the above embodiments, the diameter of the water droplets obtained from condensation can be calculated to be 0.276 cm.

[0130] Because of differences in chip size, it is necessary to obtain the reference distance between two pins of each chip for different chips.

[0131] 1. Assuming the reference distance between the two pins of the chip is 0.3cm, then 0.3 > 0.273. Therefore, condensation at the domain controller's inlet will not cause any malfunction of the chip.

[0132] 2. Assuming the reference distance between the two pins of the chip is 0.2cm, then 0.2 < 0.273. Therefore, condensation at the domain controller's inlet may cause abnormal chip function.

[0133] Furthermore, certain performance characteristics of the chip can be tested. Based on criteria such as chip performance degradation, the specific impact of condensation on the chip can be determined. Then, the inlet water temperature of the cooler can be controlled according to factors such as the degree of impact. This is to avoid the risk of condensation caused by excessively low water temperature during actual use of the domain controller, thereby preventing condensation from having an adverse effect on the chip.

[0134] 2) When the vehicle was located in Haikou, the initial ambient temperature was 35℃ and the initial relative humidity was 90%. The enthalpy-humidity chart shows that the corresponding initial moisture content under these conditions was 32.7 g / kg.

[0135] When the inlet water temperature of the cooler is 20℃, the air temperature inside the domain controller housing will drop from 50℃ to close to the inlet water temperature of 20℃. After water is supplied, the air temperature inside the domain controller housing is taken as 20℃.

[0136] By using the enthalpy-humidity chart, it can be determined that when the actual ambient temperature is 20℃ and the actual relative humidity is 100%, the corresponding actual water content is 14.7g / kg.

[0137] The comparison shows that after the cooler is activated, 14.7g / kg < 32.7g / kg. Therefore, when the air temperature inside the domain controller housing drops from 35℃ to 20℃, 32.7-14.7=18g of water will be released per 1kg of air.

[0138] Based on the above assumptions, the protection level is IP4X, the air inside the domain controller housing can freely enter and exit the domain controller, and the volume of the air inside the domain controller housing is 0.5L. The calculated weight of condensation is taken as a safety factor of 2, and the air density is taken as 1.205kg / m³. 3 If all the air inside the domain controller housing condenses, the maximum weight of the condensation is: 2 * 0.5 L * 1.205 kg / m³. 3 *18g / kg=0.022g.

[0139] Based on the formula provided in the above embodiments, the diameter of the water droplets obtained from condensation can be calculated to be 0.552 cm.

[0140] Because of differences in chip size, it is necessary to obtain the reference distance between two pins of each chip for different chips.

[0141] 1. Assuming the reference distance between the two pins of the chip is 0.6cm, then 0.6 > 0.552. Therefore, condensation at the domain controller's inlet will not cause any malfunction of the chip.

[0142] 2. Assuming the reference distance between the two pins of the chip is 0.3cm, then 0.3 < 0.552. Therefore, condensation at the domain controller's inlet may cause abnormal chip function.

[0143] Furthermore, certain performance characteristics of the chip can be tested based on chip standard protocols, and the specific impact of condensation on the chip can be determined based on criteria such as chip performance degradation. Then, the inlet water temperature of the cooler can be controlled based on factors such as the degree of impact to avoid the risk of condensation caused by excessively low water temperature during actual use of the domain controller, thereby preventing condensation from having an adverse effect on the chip.

[0144] According to an optional embodiment of this application, when the actual scenario of the passenger cabin is that the air conditioning is not turned on, the condensation state at the entrance of the domain controller is that condensation occurs. Compared with the two cities of Turpan and Haikou, Haikou has a larger amount of condensation, so the diameter of the water droplets is also larger. Consequently, the possibility of chip malfunction is greater. Therefore, when determining the condensation verification method for Haikou, the ambient temperature and actual relative humidity of Haikou are considered. The corresponding ambient temperature and actual relative humidity are adjusted upward, that is, the initial ambient temperature of 35°C and the initial relative humidity of 90% are adjusted to the initial ambient temperature of 40°C and the initial relative humidity of 95%, respectively.

[0145] Furthermore, the above steps were repeated under the conditions of an initial ambient temperature of 40°C and an initial relative humidity of 95% to verify the effect of condensation on the chip.

[0146] like Figure 3 As shown, embodiments of this application also provide a condensation verification device 30, comprising:

[0147] Module 31 is used to obtain the installation location of the domain controller;

[0148] The determining module 32 is used to determine reference environmental parameters based on the installation location;

[0149] The judgment module 33 is used to determine the condensation state based on the reference environmental parameters;

[0150] The calculation module 34 is used to calculate the weight of the condensation if the condensation state is that condensation is generated.

[0151] The comparison module 35 is used to determine the impact of the condensation on the chip based on the weight of the condensation.

[0152] Optionally, determining the reference environmental parameters based on the installation location includes:

[0153] Determine the reference position based on the installation location;

[0154] Based on the reference location, the reference environmental parameters are determined; wherein, the reference environmental parameters include ambient temperature, cooler inlet water temperature, and actual relative humidity.

[0155] Optionally, determining the condensation state based on the reference environmental parameters includes:

[0156] Obtain a reference relative humidity and the actual relative air humidity, and compare the actual relative air humidity with the reference relative air humidity to obtain a comparison result;

[0157] Based on the comparison results, the condensation state is determined; wherein, if the comparison result is that the reference relative air humidity is greater than the actual relative air humidity, the condensation state is determined to be condensation occurring; conversely, if the comparison result is that the reference relative air humidity is less than or equal to the actual relative air humidity, the condensation state is determined to be no condensation occurring.

[0158] Optionally, calculating the weight of the condensation based on the reference environmental parameters includes:

[0159] The first moisture content is determined based on the ambient temperature and the actual relative air humidity.

[0160] The second water content is determined based on the inlet water temperature of the cooler;

[0161] Based on the first moisture content and the second moisture content, the amount of water separated is calculated.

[0162] Based on the amount of water separated, the weight of the condensation is calculated.

[0163] Optionally, calculating the weight of the condensation based on the amount of water separated includes:

[0164] Obtain preset parameters; wherein, the preset parameters include protection level, air volume inside the domain controller housing, and safety factor;

[0165] Based on the preset parameters and the amount of water separated, the weight of the condensation is calculated.

[0166] Optionally, determining the impact of the condensation on the chip based on the weight of the condensation includes:

[0167] The volume of the water droplet is calculated based on the weight of the condensation; wherein the water droplet is obtained based on the condensation.

[0168] The impact of condensation on the chip is determined based on the volume of the water droplets.

[0169] Optionally, determining the impact of condensation on the chip based on the volume of the water droplets includes:

[0170] The diameter of the water droplet is determined based on its volume.

[0171] Obtain the reference distance between two pins of the chip;

[0172] The reference distance is compared with the diameter of the water droplet to obtain the comparison result;

[0173] Based on the comparison results, the impact of condensation on the chip is determined.

[0174] Embodiments of this application also provide an electronic device, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor executes the computer program to implement the method described above.

[0175] Embodiments of this application also provide a computer-readable storage medium, the computer-readable storage medium including a stored computer program, wherein, when the computer program is executed, it controls the device where the computer-readable storage medium is located to perform the method described above.

[0176] Furthermore, other configurations and functions of the apparatus in the embodiments of this application are known to those skilled in the art, and will not be described in detail here to reduce redundancy.

[0177] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0178] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0179] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0180] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0181] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0182] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0183] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0184] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for verifying condensation, characterized in that, include: Obtain the installation location of the domain controller; Determine the reference environmental parameters based on the installation location; The condensation state is determined based on the aforementioned reference environmental parameters; If the condensation state is that condensation occurs, then the weight of the condensation is calculated. The impact of the condensation on the chip is determined based on the weight of the condensation. The step of determining the impact of the condensation on the chip based on the weight of the condensation includes: calculating the volume of the water droplet based on the weight of the condensation; wherein the water droplet is obtained based on the condensation; and the impact of the condensation on the chip is determined based on the volume of the water droplet. The step of determining the impact of condensation on the chip based on the volume of the water droplet includes: determining the diameter of the water droplet based on its volume; obtaining a reference distance between two pins of the chip; comparing the reference distance with the diameter of the water droplet to obtain a comparison result; and determining the impact of condensation on the chip based on the comparison result.

2. The method according to claim 1, characterized in that, The step of determining the reference environmental parameters based on the installation location includes: Determine the reference position based on the installation location; Based on the reference location, the reference environmental parameters are determined; wherein, the reference environmental parameters include ambient temperature, cooler inlet water temperature, and actual relative humidity.

3. The method according to claim 2, characterized in that, Determining the condensation state based on the reference environmental parameters includes: Obtain a reference relative humidity and the actual relative air humidity, and compare the actual relative air humidity with the reference relative air humidity to obtain a comparison result; Based on the comparison results, the condensation state is determined; wherein, if the comparison result is that the reference relative air humidity is greater than the actual relative air humidity, the condensation state is determined to be condensation occurring; conversely, if the comparison result is that the reference relative air humidity is less than or equal to the actual relative air humidity, the condensation state is determined to be no condensation occurring.

4. The method according to claim 2, characterized in that, The step of calculating the weight of condensation based on the reference environmental parameters includes: The first moisture content is determined based on the ambient temperature and the actual relative air humidity. The second water content is determined based on the inlet water temperature of the cooler; Based on the first moisture content and the second moisture content, the amount of water separated is calculated. Based on the amount of water separated, the weight of the condensation is calculated.

5. The method according to claim 4, characterized in that, The calculation of the weight of the condensation based on the water separation volume includes: Obtain preset parameters; wherein, the preset parameters include protection level, air volume inside the domain controller housing, and safety factor; Based on the preset parameters and the amount of water separated, the weight of the condensation is calculated.

6. A condensation verification device, used to implement the method as described in any one of claims 1 to 5, characterized in that, include: The acquisition module is used to obtain the installation location of the domain controller; The determination module is used to determine reference environmental parameters based on the installation location; The judgment module is used to determine the condensation state based on the reference environmental parameters; A calculation module is used to calculate the weight of the condensation if the condensation state is that condensation is occurring. The comparison module is used to determine the impact of the condensation on the chip based on the weight of the condensation.

7. An electronic device, characterized in that, The method includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor, when executing the computer program, implements the method as claimed in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored computer program, wherein, when the computer program is executed, it controls the device on which the computer-readable storage medium is located to perform the method as described in any one of claims 1 to 5.

Images