Slide ring forming mold, slide ring forming apparatus, and slide ring forming method

Abstract

The application provides a slip ring forming die, a slip ring forming device and a slip ring forming method. The slip ring forming die comprises a shell, a bottom disc, an inner column, a first pad, a second pad and a ring cover. The shell has a through hole penetrating the shell, and the bottom disc is arranged at one end of the shell. The inner column is arranged in the through hole and connected with the bottom disc, and a glue pouring cavity is formed between the inner column and the hole wall of the through hole, which is used for accommodating a plurality of copper rings arranged in the axial direction of the shell. The first pad is arranged between the bottom disc and the copper ring closest to the bottom disc, and the second pad abuts against the copper ring farthest from the bottom disc. The ring cover is arranged at the end of the shell away from the bottom disc, and the inner diameter of the ring cover is smaller than the inner diameter of the shell, so that the ring cover presses the end of the second pad away from the copper ring, thereby solving the problems of poor concentricity of the slip ring and the metal powder generated by the brush wire loss during the operation of the slip ring falling into the gap to cause short circuit.

Description

Technical Field

[0001] This invention relates to the field of slip ring technology, specifically to a slip ring forming mold, a slip ring forming device, and a slip ring forming method. Background Technology

[0002] A stacked slip ring consists of alternating copper rings and insulating plastic baffles nested on a rotating shaft. The copper rings are machined from tin bronze, and the insulating plastic baffles are manufactured using injection molding. Two insulating plastic baffles and the copper ring sandwiched in the middle form a single loop. The concentricity of the slip ring is determined by the installation position of the two insulating plastic baffles. A stacked slip ring can be considered as a combination of several single loops stacked together.

[0003] However, each insulating plastic baffle in a stacked slip ring is injection molded, and there are errors between each mold. Therefore, during the installation of the stacked slip ring, stacking errors are unavoidable, resulting in poor concentricity of the stacked slip ring. This leads to uneven wear of the brush filaments in each group during operation, increasing maintenance costs. Furthermore, since the stacked slip ring is composed of stacked single-loop circuits, there will be gaps between the plastic baffles. Metal powder generated by brush filament wear during operation may fall into these gaps, causing short circuits. Summary of the Invention

[0004] The main objective of this invention is to provide a slip ring forming mold, a slip ring forming device, and a slip ring forming method, which aims to solve the technical problems of poor concentricity of stacked slip rings and the possibility of metal powder generated by brush filament wear falling into the gaps and causing short circuits during the operation of stacked slip rings.

[0005] To achieve the above objectives, the present invention provides a slip ring forming mold, the slip ring forming mold comprising:

[0006] The shell has a hollow through-hole;

[0007] The chassis is located at one end of the housing;

[0008] An inner column is disposed within the through hole and connected to the chassis. A potting cavity is formed between the inner column and the wall of the through hole. The potting cavity is used to accommodate a number of copper rings stacked along the axial direction of the housing.

[0009] The first pad is disposed between the chassis and the copper ring closest to the chassis;

[0010] The second pad abuts against the copper ring furthest from the chassis;

[0011] A ring cover is provided at the end of the housing away from the chassis. The inner diameter of the ring cover is smaller than the inner diameter of the housing, so that the ring cover presses against the end of the second pad away from the copper ring.

[0012] In an optional embodiment, a first slot and a second slot are provided on the outer side wall of the inner column, the first slot and the second slot extending through both ends of the inner column along the axial direction of the housing, and a copper strip is provided on the inner side of the copper ring at least partially.

[0013] The slip ring forming mold also includes:

[0014] A first perforated plate is inserted into the first slot, and the first perforated plate has a plurality of first through holes;

[0015] The second perforated plate is inserted into the second slot, and the second perforated plate has several second through holes;

[0016] The copper strip on the copper ring is inserted into the first through hole and / or the second through hole.

[0017] In an optional embodiment, the chassis is provided with at least one first locking hole, the surface of the housing near the chassis is provided with at least one second locking hole, the ring cover is provided with at least one third locking hole, and the surface of the housing away from the chassis is provided with at least one fourth locking hole.

[0018] The slip ring forming mold also includes:

[0019] A first locking member passes through the first locking hole and the second locking hole in sequence, and locks the chassis to one end of the housing;

[0020] The second locking member passes through the third locking hole and the fourth locking hole in sequence, and locks the ring cover at the end of the housing away from the chassis.

[0021] In an optional embodiment, when the ring cover is not locked onto the housing, the second pad protrudes from the surface of the housing away from the chassis, and the height of the second pad protruding from the housing is 0.2 mm to 0.8 mm;

[0022] With the ring cover locked onto the housing, the surface of the second pad away from the copper ring is flush with the surface of the housing away from the chassis.

[0023] In an optional embodiment, the chassis is provided with a fifth locking hole and a sixth locking hole in the areas corresponding to the first hole plate and the second hole plate, respectively; the first hole plate and the second hole plate are provided with a seventh locking hole and an eighth locking hole, respectively; the chassis is provided with a ninth locking hole in the area corresponding to the inner column; and the inner column is provided with a tenth locking hole.

[0024] The slip ring forming mold also includes:

[0025] The third locking member passes through the fifth locking hole and the seventh locking hole in sequence, and locks the first hole plate onto the chassis;

[0026] The fourth locking member passes through the sixth locking hole and the eighth locking hole in sequence, and locks the second hole plate onto the chassis;

[0027] The fifth locking member passes through the ninth locking hole and the tenth locking hole in sequence, and locks the inner column onto the chassis.

[0028] In an optional embodiment, a sealing groove is provided on the surface of the chassis near the housing;

[0029] The slip ring forming mold also includes:

[0030] A sealing ring is disposed in the sealing groove and is used to seal the chassis and the housing.

[0031] To achieve the above objectives, the present invention proposes a slip ring forming apparatus, which includes a glue-filling structure and a slip ring forming mold as described above. The glue-filling structure is used to inject glue into the glue-filling cavity of the slip ring forming mold.

[0032] To achieve the above objectives, the present invention proposes a slip ring forming method, the slip ring forming method comprising:

[0033] Provide a slip ring forming apparatus as described above;

[0034] Several copper rings are stacked along the axial direction of the shell in the glue-filling cavity and locked by ring caps. The copper rings are pressed and positioned by a first pad and a second pad.

[0035] The adhesive is injected into the potting cavity and cured so that the adhesive is cured between the copper rings to form a potting layer;

[0036] Separate the copper ring from the mold body to obtain the slip ring.

[0037] In an optional embodiment, prior to the step of stacking a plurality of copper rings along the axial direction of the housing within the potting cavity, the method further includes:

[0038] A plurality of copper strips are provided and the copper strips are welded to part or all of the inner side of the copper ring, wherein the copper strips are inserted into a first through hole and / or a second through hole.

[0039] In an optional embodiment, after stacking the plurality of copper rings along the axial direction of the housing within the potting cavity and before locking them with the ring cap, the method further includes:

[0040] The second pad protrudes from the housing, and the height of the second pad protruding from the housing is 0.2mm to 0.8mm.

[0041] This invention provides a slip ring forming mold, a slip ring forming apparatus, and a slip ring forming method. The slip ring forming mold includes a housing, a base, an inner post, a first pad, a second pad, and a ring cap. The housing has a hollow through-hole, and the base is located at one end of the housing. The inner post is located within the through-hole and connected to the base, forming a potting cavity between the inner post and the wall of the through-hole. The potting cavity accommodates several copper rings stacked along the axial direction of the housing. The first pad is located between the base and the copper ring closest to the base, and the second pad abuts against the copper ring furthest from the base. The ring cap is located at the end of the housing furthest from the base, and the inner diameter of the ring cap is smaller than the inner diameter of the housing, so that the ring cap presses against the end of the second pad furthest from the copper ring. After stacking the copper rings along the axial direction of the housing in the potting cavity, a first and a second pad are used to press and position them. This arrangement eliminates the need for the insulating plastic baffle component found in exemplary technologies, avoids the purchase of expensive injection molding machines and molds, and ensures that each copper ring is completely fixed after potting, guaranteeing high concentricity between the slip rings and consistent brush bristle wear during operation, thus reducing maintenance costs. Furthermore, after the copper rings are pressed and positioned by the first and second pads, the adhesive is directly injected into the potting cavity. This adhesive can completely fill each copper ring, increasing the insulation between them and preventing gaps. Even if metal powder is generated during brush bristle wear during operation, it will not fall between the copper rings, thus avoiding short circuits. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments or examples of the present invention, the drawings used in the embodiments or examples will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the slip ring forming mold according to an embodiment of the present invention;

[0044] Figure 2 This is an exploded view of the slip ring forming mold according to an embodiment of the present invention;

[0045] Figure 3 This is a cross-sectional view of the slip ring forming mold according to an embodiment of the present invention;

[0046] Figure 4 This is a schematic diagram of the structure of the first and second perforated plates in an embodiment of the present invention;

[0047] Figure 5 This is a flowchart illustrating the steps of the slip ring forming method according to an embodiment of the present invention;

[0048] Figure 6 This is a partial structural schematic diagram of the slip ring forming mold according to an embodiment of the present invention;

[0049] Figure 7 This is a schematic diagram of the structure of the copper ring and copper strip in an embodiment of the present invention;

[0050] Figure 8 This is a schematic diagram of the slip ring structure according to an embodiment of the present invention.

[0051] Explanation of reference numerals in the attached figures:

[0052] 100 - Housing, 110 - Through hole, 120 - Second locking hole, 130 - Fourth locking hole;

[0053] 200 - Chassis, 210 - First locking hole, 220 - Fifth locking hole, 230 - Sixth locking hole, 240 - Ninth locking hole, 250 - Sealing groove;

[0054] 300 - Inner post, 310 - First slot, 320 - Second slot, 330 - Tenth locking hole;

[0055] 400 - First gasket;

[0056] 500 - Second gasket;

[0057] 600 - Ring cap, 610 - Third locking hole;

[0058] 700 - Glue-filling cavity;

[0059] 800 - Copper ring, 810 - Copper vertical plate, 820 - Copper horizontal plate;

[0060] 900-Copper Bar;

[0061] 1000 - First perforated plate, 1001 - First through hole, 1002 - Seventh locking hole;

[0062] 1100 - Second hole plate, 1101 - Second through hole, 1102 - Eighth locking hole;

[0063] A-Potting adhesive layer.

[0064] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0065] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0066] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0067] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0068] like Figures 1-4 As shown, the present invention provides a slip ring forming mold.

[0069] Specifically, the slip ring forming mold includes a housing 100, a base 200, an inner post 300, a first pad 400, a second pad 500, and a ring cover 600. The housing 100 has a hollow through hole 110, and the base 200 is located at one end of the housing 100. The inner post 300 is located inside the through hole 110 and is connected to the base 200. A potting cavity 700 is formed between the inner post 300 and the wall of the through hole 110. The potting cavity 700 is used to accommodate a plurality of copper rings 800 stacked along the axial direction of the housing 100. The first pad 400 is located between the base 200 and the copper ring 800 closest to the base 200, and the second pad 500 abuts against the copper ring 800 furthest from the base 200. The ring cover 600 is located at the end of the housing 100 away from the chassis 200. The inner diameter of the ring cover 600 is smaller than the inner diameter of the housing 100, so that the ring cover 600 presses against the end of the second pad 500 away from the copper ring 800. The axial and radial directions of the housing 100 are as shown in Figure 1.

[0070] One end of the aforementioned housing 100 is the lower end of the housing 100, that is, the chassis 200 is connected to the lower end of the housing 100, while the ring cover 600 is connected to the upper end of the housing 100, as indicated by the up and down directions in Figure 1. It should be noted that the terms "upper end" and "lower end" here are only used to describe the directions in the accompanying drawings of this application. In practical applications, the upper end in the drawings can also be the lower end of the housing 100, and the lower end in the drawings can also be the upper end of the housing 100. This application does not impose any limitations on these terms.

[0071] The ring cover 600 is an annular cover. The ring cover 600 and the housing 100 are coaxially arranged, and since the inner diameter of the ring cover 600 is smaller than the inner diameter of the housing 100 (the housing 100 is also a hollow cylindrical shape; of course, in other embodiments, the housing 100 is not limited to a cylindrical shape, but can also be other columnar structures, such as prisms, cuboids, etc., which are not limited in this application), the inner side of the ring cover 600 protrudes from the inner side of the housing 100 (i.e., the hole wall of the through hole 100), so that when the ring cover 600 is placed on the housing 100, the part of the inner side of the ring cover 600 protruding from the inner side of the housing 100 presses against the second pad 500, while the first pad 400 presses against the chassis 200. In this way, the stacked copper rings 800 can be pressed together by the first pad 400 and the second pad 500. When injecting adhesive into the glue filling cavity 700, the adhesive can be injected into the glue filling cavity 700 through the central hole of the ring cover 600.

[0072] In this embodiment, the inner post 300 is coaxially arranged with the housing 100, and the central axis of the inner post 300 coincides with the central axis of the housing 100. This ensures that the lateral distance between the inner post 300 and the inner side of the housing 100 (i.e., the wall of the through hole 110) forming the glue-filling cavity 700 is equal at all points, so that the amount of glue injected into the glue-filling cavity 700 is equal at all points. The lateral distance refers to the distance along the radial direction of the housing 100; here, the lateral distance of the glue-filling cavity 700 can be the radial distance between the inner post 300 and the housing 100.

[0073] In this embodiment, the copper ring 800 is configured as an L-shape. Specifically, in conjunction with... Figure 3 As shown, the copper ring 800 includes a copper vertical plate 810 and a copper horizontal plate 820. The copper vertical plate 820 and the copper horizontal plate 830 are connected to each other and form an L-shaped structure. The copper vertical plates 810 of two adjacent copper rings 800 abut against each other so that the copper rings 800 can be stacked sequentially. Furthermore, the width of the copper horizontal plate 810, the width of the first pad 400, and the width of the second pad 500 are all equal, so that the first pad 400 and the second pad 500 can press and position the copper ring 800 within the potting cavity 700. Here, the width of the copper horizontal plate 810 is the radial dimension of the copper horizontal plate 810 along the housing 100. Similarly, the widths of the first pad 400 and the second pad 500 are also the radial dimensions of the first pad 400 and the second pad 500 along the housing 100.

[0074] In this embodiment, the adhesive is injected into the filling cavity 700 from the central hole of the ring cover 600, that is, from the top of the housing 100. Specifically, the opening of the L-shaped copper ring 800 faces the ring cover 600, ensuring that the adhesive completely fills the gap between the copper horizontal plates 820 of each adjacent copper ring 800 when injecting it into the filling cavity 700, thus better bonding the copper rings 800 together.

[0075] The number of slip rings can be determined by the size of the mold and the number of copper rings 800 inserted. If more slip rings are needed after molding, simply add more copper rings 800 and connect them in series to form a larger slip ring. This application does not specify the exact number of slip rings.

[0076] In this application, the number of copper rings 800 is preferably 12, so as to match the entire mold.

[0077] The first gasket 400 and the second gasket 500 can be gaskets, and these gaskets are also hollow and through-shaped, mainly serving to press and position the copper rings 800. In addition, after locking the chassis 200 and the ring cover 600, the height of the first gasket 400, the second gasket 500, and each copper ring 800 along the axial direction of the housing 100 is equal to the height of the housing 100, so that adjacent copper rings 800 can be tightly abutted against each other, thereby preventing the glue injected into the glue filling cavity 700 from leaking from the gaps between the copper rings 800.

[0078] The technical solution provided in this application includes a slip ring forming mold comprising a housing 100, a base 200, an inner column 300, a first pad 400, a second pad 500, and a ring cover 600. The housing 100 has a hollow through-hole 110, and the base 200 is located at one end of the housing 100. The inner column 300 is located within the through-hole 110 and connected to the base 200, forming a potting cavity 700 between the inner column 300 and the wall of the through-hole 110. The potting cavity 700 accommodates a plurality of copper rings 800 stacked along the axial direction of the housing 100. The first pad 400 is located between the base 200 and the copper ring 800 closest to the base 200, and the second pad 500 abuts against the copper ring 800 furthest from the base 200. The ring cover 600 is located at the end of the housing 100 away from the chassis 200. The inner diameter of the ring cover 600 is smaller than the inner diameter of the housing 100, so that the ring cover 600 presses against the end of the second pad 500 away from the copper ring 800. That is, after the copper rings 800 are stacked along the axial direction of the housing 100 in the glue-filling cavity 700, the first pad 400 and the second pad 500 are used to press and position them. With this arrangement, the insulating plastic baffle component in the exemplary technology can be eliminated, and there is no need to purchase expensive injection molding machines and molds. Moreover, each copper ring 800 is completely fixed after glue filling and molding, which can ensure the high concentricity between each slip ring 800, ensure that the wear of each set of brush bristles is consistent during slip ring operation, and reduce maintenance costs. Furthermore, after each copper ring 800 is pressed and positioned by the first pad 400 and the second pad 500, adhesive is directly injected into the potting cavity 700. This adhesive can completely fill each copper ring 800, thereby increasing the insulation between them and preventing gaps. Even if metal powder is generated from brush wear during slip ring operation, it will not fall between the copper rings 800, thus avoiding short circuits. Optionally, the adhesive injected into the potting cavity 700 via the potting structure can be epoxy resin or other types of adhesive. The specific structure of the potting structure is not limited in this application as long as it enables the injection of adhesive into the potting cavity 700.

[0079] Furthermore, combined Figures 1-4As shown, a first slot 310 and a second slot 320 are provided on the outer side wall of the inner column 300. The first slot 310 and the second slot 320 penetrate both ends of the inner column 300 along the axial direction of the housing 100. A copper strip 900 is provided on the inner side of the copper ring 800 at least partially. The slip ring forming mold also includes a first perforated plate 1000 and a second perforated plate 1100. The first perforated plate 1000 is inserted into the first slot 310 and has a plurality of first through holes 1001. The second perforated plate 1100 is inserted into the second slot 320 and has a plurality of second through holes 1101. The copper strip 900 on the copper ring 800 is inserted into the first through holes 1001 and / or the second through holes 1101.

[0080] In this embodiment, the function of the first perforated plate 1000 and the second perforated plate 1100 is to provide clearance space for the copper strip 900 so as to prevent the copper strip 900 from being sealed by the adhesive in the potting cavity 700. Moreover, the first perforated plate 1000 and the second perforated plate 1100 are respectively inserted into the first slot 310 and the second slot 320 on the inner column 300. In this way, when disassembling after the adhesive has cured, the inner column 300 can be removed first, and then the first perforated plate 1000 and the second perforated plate 1100 can be removed from the copper strip 900, so as to facilitate the separation of the slip ring from the mold and facilitate the separation of the slip ring and the mold.

[0081] Specifically, the copper strip 900 is cylindrical. One end of the cylindrical copper strip 900 is welded to the inner wall of the copper ring 800, and the other end is inserted into the first through hole 1001, or the other end of the cylindrical copper strip 900 is inserted into the second through hole 1101, or a portion of the copper strip 900 has its other end inserted into the first through hole 1001 and the remaining copper strip 900 has its other end inserted into the second through hole 1101. In this embodiment, the copper strip 900 is used to connect wires so that the entire slip ring can be connected to an external power source or the power source of an external device, thereby energizing the slip ring for operation.

[0082] In this embodiment, the number of copper strips 900 is preferably 6 groups, with 2 copper strips forming a group (as mentioned above, the number of copper rings 800 is preferably 12). Thus, two copper strips 900 can be welded onto each copper ring 800. Moreover, each copper strip 900 is provided with a first through hole 1000 or a second through hole 1101 on the first hole plate 1000 or the second hole plate 1100 to prevent the copper strip 900 from being sealed by the injected adhesive. Preferably, three sets of first through holes 1001 can be provided on the first hole plate 1000, and three sets of second through holes 1101 can be provided on the second hole plate 1100. However, in specific implementation, it is necessary to open corresponding first through holes 1001 or second through holes 1101 on the first hole plate 1000 or the second hole plate 1100 according to the number and position of the copper strips 900; or, the number and position of the copper strips 900 can be set according to the number and position of the first through holes 1001 or second through holes 1101 on the first hole plate 1000 or the second hole plate 1101, which is not limited in this application.

[0083] Furthermore, the chassis 200 is provided with at least one first locking hole 210, the surface of the housing 100 near the chassis is provided with at least one second locking hole 120, the ring cover 600 is provided with at least one third locking hole 610, and the surface of the housing 100 away from the chassis 200 is provided with at least one fourth locking hole 130; the slip ring forming mold also includes a first locking member (not shown) and a second locking member (not shown). The first locking member passes through the first locking hole 210 and the second locking hole 120 in sequence and locks the chassis 200 to one end of the housing 100; the second locking member passes through the third locking hole 610 and the fourth locking hole 130 in sequence and locks the ring cover 600 to the end of the housing 100 away from the chassis 200, that is, locks the ring cover 600 to the upper end of the housing 100.

[0084] In this embodiment, the first locking member and the second locking member can be screws, bolts, or threaded rods, etc. That is, after locking the ring cover 600 and the housing 100, and the chassis 200 and the housing 100, the locking ring cover 600 and the housing 100, and the chassis 200 and the housing 100 can be tightly fitted together, thereby further pressing the first pad 400 and the second pad 500 against each copper ring 800, preventing the glue from leaking from the gaps between the copper rings 800 after the glue is injected into the glue cavity 700.

[0085] Specifically, when the ring cover 600 is not locked onto the housing 100, the second pad 500 protrudes from the surface of the housing 100 away from the chassis 200, and the height of the second pad 500 protruding from the housing is 0.2mm to 0.8mm. In this state, there may still be gaps between two adjacent copper rings 800, meaning that the copper rings 800 are not completely pressed together. At this time, since the ring cover 600 presses against the second pad 500, when the ring cover 600 is locked onto the housing 100 by the second locking member 1300, the ring cover 600 will drive the second pad 500 to move along the axial direction of the housing 100 toward the chassis 200 until the ring cover 600 and the housing 100 are tightly fitted together. The surface of the second pad 500 away from the copper rings 800 is flush with the surface of the housing 100 away from the chassis 200. In this way, each copper ring 800 will be completely pressed between the first pad 400 and the second pad 500 (that is, pressed between the chassis 200 and the ring cover 600), thereby ensuring that there are no gaps between two adjacent copper rings 800 and avoiding the problem of glue leakage.

[0086] Preferably, the second pad 500 protrudes from the housing by 0.5mm, that is, the second pad 500 moves 0.5mm toward the chassis 200 to completely press each copper ring 800.

[0087] Furthermore, the chassis 200 is provided with a fifth locking hole 220 and a sixth locking hole 230 in the areas corresponding to the first hole plate 1000 and the second hole plate 1100, respectively. The first hole plate 1000 and the second hole plate 1100 are provided with a seventh locking hole 1002 and an eighth locking hole 1102, respectively. The chassis 200 is provided with a ninth locking hole 240 in the area corresponding to the inner column 300, and the inner column 300 is provided with a tenth locking hole 330. The slip ring forming mold also includes a third locking component (not shown). The fourth locking member (not shown) and the fifth locking member (not shown) are respectively connected. The third locking member passes through the fifth locking hole 220 and the seventh locking hole 1002 in sequence, and locks the first hole plate 1000 onto the chassis 200. The fourth locking member passes through the sixth locking hole 230 and the eighth locking hole 1102 in sequence, and locks the second hole plate 1100 onto the chassis 200. The fifth locking member passes through the ninth locking hole 240 and the tenth locking hole 330 in sequence, and locks the inner column 300 onto the chassis 200.

[0088] In this embodiment, the third, fourth, and fifth locking components can be screws, bolts, or threaded rods, which can lock the inner column 300, the first hole plate 1000, and the second hole plate 1100 onto the chassis 200, preventing the adhesive from leaking from the gaps between the inner column 300, the first hole plate 1000, the second hole plate 1100, and the chassis 200, respectively.

[0089] To prevent the adhesive from leaking from the gap between the chassis 200 and the housing 100, a sealing groove 250 is provided on the surface of the chassis 200 near the housing 100 in this embodiment; the slip ring molding die also includes a sealing ring (not shown), which is located in the sealing groove 250 and is used to seal the chassis 200 and the housing 100.

[0090] The technical solution provided in this application includes a slip ring forming mold comprising a housing 100, a base 200, an inner column 300, a first pad 400, a second pad 500, and a ring cover 600. The housing 100 has a hollow through-hole 110, and the base 200 is located at one end of the housing 100. The inner column 300 is located within the through-hole 110 and connected to the base 200, forming a potting cavity 700 between the inner column 300 and the wall of the through-hole 110. The potting cavity 700 accommodates a plurality of copper rings 800 stacked along the axial direction of the housing 100. The first pad 400 is located between the base 200 and the copper ring 800 closest to the base 200, and the second pad 500 abuts against the copper ring 800 furthest from the base 200. The ring cover 600 is located at the end of the housing 100 away from the chassis 200. The inner diameter of the ring cover 600 is smaller than the inner diameter of the housing 100, so that the ring cover 600 presses against the end of the second pad 500 away from the copper ring 800. That is, after the copper rings 800 are stacked along the axial direction of the housing 100 in the glue-filling cavity 700, the first pad 400 and the second pad 500 are used to press and position them. With this arrangement, the insulating plastic baffle component in the exemplary technology can be eliminated, and there is no need to purchase expensive injection molding machines and molds. Moreover, each copper ring 800 is completely fixed after glue filling and molding, which can ensure the high concentricity between each slip ring 800, ensure that the wear of each set of brush bristles is consistent during slip ring operation, and reduce maintenance costs. Furthermore, after each copper ring 800 is pressed and positioned by the first pad 400 and the second pad 500, adhesive is directly injected into the glue filling cavity 700. The adhesive can be completely injected into each copper ring 800, thereby increasing the insulation between each copper ring 800 and preventing gaps from forming between each copper ring 800. Even if the brush bristles wear out and produce metal powder during the operation of the slip ring, the metal powder will not fall between each copper ring 800, thereby avoiding short circuits between each copper ring 800.

[0091] Based on the above embodiments, this application also provides a slip ring forming apparatus.

[0092] In this embodiment, the slip ring forming device includes a glue-filling structure and the slip ring forming mold in the above embodiment. The glue-filling structure is used to inject glue into the glue-filling cavity of the slip ring forming mold.

[0093] Since the slip ring forming device in this embodiment includes the slip ring forming mold in the above embodiments, that is, the slip ring forming device in this embodiment includes all the technical features and achieved technical effects of the slip ring forming mold in the above embodiments, please refer to the description in the above embodiments for details, and will not be repeated here.

[0094] Based on the above embodiments, this application also provides a slip ring forming method.

[0095] like Figure 5 As shown, the slip ring forming method includes:

[0096] S1. Provide the slip ring forming apparatus in the above embodiments.

[0097] The slip ring forming apparatus includes a slip ring forming mold, as shown in Figures 1-4. The slip ring forming mold includes a housing 100, a base 200, an inner post 300, a first pad 400, a second pad 500, and a ring cover 600. The housing 100 has a hollow through hole 110, and the base 200 is located at one end of the housing 100. The inner post 300 is located inside the through hole 110 and is connected to the base 200, forming a potting cavity 700 between the inner post 300 and the wall of the through hole 110. The first pad 400 is located between the base 200 and the copper ring 800 closest to the base 200, and the second pad 500 abuts against the copper ring 800 furthest from the base 200. The ring cover 600 is located at the end of the housing 100 away from the chassis 200. The inner diameter of the ring cover 600 is smaller than the inner diameter of the housing 100, so that the ring cover 600 presses against the end of the second pad 500 away from the copper ring 800.

[0098] S2. Several copper rings are stacked along the axial direction of the shell in the glue-filling cavity and locked with ring caps. The copper rings are pressed and positioned by a first pad and a second pad.

[0099] In this embodiment, a plurality of copper rings 800 are stacked along the axial direction of the housing 100 within the potting cavity 700 and locked in place by a ring cap 600. The copper rings 800 are pressed and positioned by a first pad 400 and a second pad 500 (e.g., ...). Figure 6(As shown). The first pad 400 and the second pad 500 are used for clamping and positioning. This arrangement eliminates the need for the insulating plastic baffle component found in exemplary technologies, avoiding the purchase of expensive injection molding machines and molds. Furthermore, each copper ring 800 is completely fixed after glue injection molding, ensuring high concentricity between the slip rings 800 and consistent brush bristle wear during slip ring operation, thus reducing maintenance costs. Moreover, after each copper ring 800 is clamped and positioned by the first pad 400 and the second pad 500, glue is directly injected into the glue injection cavity 700. This glue can completely fill each copper ring 800, increasing the insulation between them and preventing gaps. Even if metal powder is generated during slip ring operation due to brush bristle wear, this metal powder will not fall between the copper rings 800, thus avoiding short circuits between them.

[0100] Furthermore, prior to the step of stacking several copper rings along the axial direction of the housing within the potting cavity, the method further includes providing several copper strips and welding the copper strips to the inner side of some or all of the copper rings (e.g., Figure 7 As shown in the figure, the copper strip is inserted into the first through hole and / or the second through hole.

[0101] Specifically, a first slot 310 and a second slot 320 are provided on the outer wall of the inner column 300. The first slot 310 and the second slot 320 penetrate both ends of the inner column 300 along the axial direction of the housing 100. At least part of the inner side of the copper ring 800 is provided with a copper strip 900. The slip ring forming mold also includes a first perforated plate 1000 and a second perforated plate 1100. The first perforated plate 1000 is inserted into the first slot 310 and has a plurality of first through holes 1001. The second perforated plate 1100 is inserted into the second slot 320 and has a plurality of second through holes 1101. The copper strip 900 on the copper ring 800 is inserted into the first through holes 1001 and / or the second through holes 1101.

[0102] Specifically, the copper strip 900 is cylindrical. One end of the cylindrical copper strip 900 is welded to the inner wall of the copper ring 800, and the other end is inserted into the first through hole 1001, or the other end of the cylindrical copper strip 900 is inserted into the second through hole 1101, or a portion of the copper strip 900 has its other end inserted into the first through hole 1001 and the remaining copper strip 900 has its other end inserted into the second through hole 1101. In this embodiment, the copper strip 900 is used to connect wires so that the entire slip ring can be connected to an external power source or the power source of an external device, thereby energizing the slip ring for operation.

[0103] In this embodiment, the number of copper strips 900 is preferably 6 (as can be seen from the above, the number of copper rings 800 is preferably 12). Thus, a copper strip 900 can be welded on every other copper ring 800. Moreover, a first through hole 1000 or a second through hole 1101 is provided on the first hole plate 1000 or the second hole plate 1100 corresponding to each copper strip 900 to prevent the copper strip 900 from being sealed by the injected adhesive. Preferably, three first through holes 1001 can be provided on the first hole plate 1000, and three second through holes 1101 can be provided on the second hole plate 1100. However, in specific implementation, it is necessary to open corresponding first through holes 1001 or second through holes 1101 on the first hole plate 1000 or the second hole plate 1100 according to the number and position of the copper strips 900; or, the number and position of the copper strips 900 can be set according to the number and position of the first through holes 1001 or second through holes 1101 on the first hole plate 1000 or the second hole plate 1101, which is not limited in this application.

[0104] When the ring cover 600 is not locked onto the housing 100, the second pad is provided to protrude from the housing, and the height of the second pad protruding from the housing is 0.2mm to 0.8mm. In this state, there may still be gaps between two adjacent copper rings 800, meaning that the copper rings 800 are not completely pressed together. At this time, since the ring cover 600 presses against the second pad 500, when the ring cover 600 is locked onto the housing 100 by the second locking member 1300, the ring cover 600 will drive the second pad 500 to move along the axial direction of the housing 100 toward the chassis 200 until the ring cover 600 and the housing 100 are tightly fitted together. The surface of the second pad 500 away from the copper rings 800 is flush with the surface of the housing 100 away from the chassis 200. In this way, each copper ring 800 will be completely pressed between the first pad 400 and the second pad 500 (that is, pressed between the chassis 200 and the ring cover 600), thereby ensuring that there are no gaps between two adjacent copper rings 800 and avoiding the problem of glue leakage.

[0105] Preferably, the second pad 500 protrudes from the housing by 0.5mm, that is, the second pad 500 moves 0.5mm toward the chassis 200 to completely press each copper ring 800.

[0106] S3. Inject adhesive into the potting cavity and cure the adhesive to form a potting layer between the copper rings. The adhesive injected into the potting cavity 700 through the potting structure in the slip ring forming device is epoxy resin or other types of adhesive, which are not limited here.

[0107] S4. Separate the copper ring from the mold body to obtain the slip ring.

[0108] After the adhesive has cured, first remove the ring cap 600 and the base plate 200, then remove the inner column 300 (here, by setting the first perforated plate 1000 and the second perforated plate 1100 at the inner column 300, the inner column 300 can be removed first when disassembling after the adhesive has cured, and then the first perforated plate 1000 and the second perforated plate 1100 can be removed from the copper strip 900, so as to facilitate the separation of the slip ring from the mold, which is convenient for separating the slip ring and the mold, as described above). Then, remove the first perforated plate 1000 and the second perforated plate 1100 from the copper strip 900 and unload them. Finally, separate the housing 100 from the slip ring to obtain the encapsulated slip ring, which includes a copper ring 800, a copper strip 900, and an encapsulating layer A (e.g., ...). Figure 8 (As shown).

[0109] Thus, after stacking the copper rings 800 along the axial direction of the housing 100 in the potting cavity 700, the first pad 400 and the second pad 500 are used to press and position them. This arrangement eliminates the need for the insulating plastic baffle component in the exemplary technology, avoids the need to purchase expensive injection molding machines and molds, and ensures that each copper ring 800 is completely fixed after potting and molding, thus guaranteeing high concentricity between the slip rings 800 and ensuring that the wear of each set of brush bristles is consistent during slip ring operation, reducing maintenance costs. Furthermore, after each copper ring 800 is pressed and positioned by the first pad 400 and the second pad 500, the adhesive is directly injected into the potting cavity 700. The adhesive can completely fill each copper ring 800, thereby increasing the insulation between the copper rings 800 and preventing gaps from forming between them. Even if metal powder is generated during slip ring operation due to brush bristle wear, the metal powder will not fall between the copper rings 800, thus avoiding short circuits between the copper rings 800.

[0110] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A slip ring forming mold, characterized in that, The slip ring forming mold includes: The shell has a hollow through-hole; The chassis is located at one end of the housing; An inner column is disposed within the through hole and connected to the chassis. A potting cavity is formed between the inner column and the wall of the through hole. The potting cavity is used to accommodate a number of copper rings stacked along the axial direction of the housing. The first pad is disposed between the chassis and the copper ring closest to the chassis; The second pad abuts against the copper ring furthest from the chassis; A ring cover is provided at the end of the housing away from the chassis. The inner diameter of the ring cover is smaller than the inner diameter of the housing, so that the ring cover presses against the end of the second pad away from the copper ring. The inner column has a first slot and a second slot on its outer side wall. The first slot and the second slot pass through both ends of the inner column along the axial direction of the housing. At least part of the inner side of the copper ring is provided with a copper strip. The slip ring forming mold also includes: A first perforated plate is inserted into the first slot, and the first perforated plate has a plurality of first through holes; The second perforated plate is inserted into the second slot, and the second perforated plate has several second through holes; The copper strip on the copper ring is inserted into the first through hole and / or the second through hole; The chassis is provided with at least one first locking hole, the surface of the housing near the chassis is provided with at least one second locking hole, the ring cover is provided with at least one third locking hole, and the surface of the housing away from the chassis is provided with at least one fourth locking hole. The slip ring forming mold also includes: A first locking member passes through the first locking hole and the second locking hole in sequence, and locks the chassis to one end of the housing; The second locking member passes through the third locking hole and the fourth locking hole in sequence, and locks the ring cover to the end of the housing away from the chassis; When the ring cover is not locked onto the housing, the second pad protrudes from the surface of the housing away from the chassis, and the height of the second pad protruding from the housing is 0.2mm~0.8mm; With the ring cover locked onto the housing, the surface of the second pad away from the copper ring is flush with the surface of the housing away from the chassis. The chassis is provided with a fifth locking hole and a sixth locking hole in the areas corresponding to the first hole plate and the second hole plate, respectively. The first hole plate and the second hole plate are provided with a seventh locking hole and an eighth locking hole, respectively. The chassis is provided with a ninth locking hole in the area corresponding to the inner column, and the inner column is provided with a tenth locking hole. The slip ring forming mold also includes: The third locking member passes through the fifth locking hole and the seventh locking hole in sequence, and locks the first hole plate onto the chassis; The fourth locking member passes through the sixth locking hole and the eighth locking hole in sequence, and locks the second hole plate onto the chassis; The fifth locking member passes through the ninth locking hole and the tenth locking hole in sequence, and locks the inner column onto the chassis.

2. The slip ring forming mold according to claim 1, characterized in that: A sealing groove is provided on the surface of the chassis near the housing; The slip ring forming mold also includes: A sealing ring is disposed in the sealing groove and is used to seal the chassis and the housing.

3. A slip ring forming device, characterized in that, The slip ring forming apparatus includes a glue-filling structure and a slip ring forming mold as described in any one of claims 1 to 2, wherein the glue-filling structure is used to inject glue into the glue-filling cavity of the slip ring forming mold.

4. A slip ring forming method, characterized in that, The slip ring forming method includes: Provide a slip ring forming apparatus as described in claim 3; Several copper rings are stacked along the axial direction of the shell in the glue-filling cavity and locked by ring caps. The copper rings are pressed and positioned by a first pad and a second pad. The adhesive is injected into the potting cavity and cured so that the adhesive is cured between the copper rings to form a potting layer; Separate the copper ring from the mold body to obtain the slip ring.

5. The slip ring forming method according to claim 4, characterized in that, Before the step of stacking several copper rings along the axial direction of the shell inside the potting cavity, the method further includes: A plurality of copper strips are provided and the copper strips are welded to part or all of the inner side of the copper ring, wherein the copper strips are inserted into a first through hole and / or a second through hole.

6. The slip ring forming method according to claim 5, characterized in that, After stacking several copper rings along the axial direction of the shell inside the potting cavity, and before locking them with the ring cap, the process further includes: The second pad protrudes from the housing, and the height of the second pad protruding from the housing is 0.2mm~0.8mm.

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