Heat conducting component

Abstract

The present application provides a heat transfer member. The heat transfer member has a case in which a working medium is arranged in an internal space. The case has a first plate portion and a second plate portion arranged on an upper portion of the first plate portion. At least one of an upper surface of the first plate portion and a lower surface of the second plate portion has a plurality of groove portions arranged and a plurality of linear recessed portions arranged between the groove portions. At least one of the linear recessed portions is not connected to the groove portions.

Description

Technical Field

[0001] This invention relates to heat conduction components. Background Technology

[0002] Conventional flat-plate heat pipes have a flat-plate sealed container. The flat-plate sealed container is provided with a bottom wall, an upper wall, and a support connecting the bottom wall and the upper wall. Moreover, a working fluid is sealed inside the flat-plate sealed container, and a porous sintered sheet through which the support passes is tightly attached to the inner surface of the bottom wall and the inner surface of the upper wall.

[0003] A flat, sealed container is positioned in contact with a heating element. The working fluid is heated by the heating element and vaporized from the porous sintered sheet. The vaporized working fluid moves towards the upper wall side inside the flat, sealed container. On the upper wall side, the working fluid is cooled and condensed by heat dissipation. The liquid working fluid moves towards the heating element side within the porous sintered sheet through capillary action. Thus, heat is transferred from the bottom wall side to the upper wall side (see, for example, Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2002-62072

[0005] However, such a flat, sealed container requires porous sintered sheets that are in close contact with the inner surfaces of the bottom and upper walls, thus increasing the number of components. Summary of the Invention

[0006] The purpose of this invention is to provide a component that can reduce the heat conduction of constituent parts while maintaining heat transfer efficiency.

[0007] An exemplary heat-conducting component of the present invention includes: a housing having an internal space; a first core structure; a second core structure; and a working medium. The housing has: a first plate portion; and a second plate portion disposed opposite to the first plate portion, and a heating element disposed on its outer surface. The working medium, the first core structure, and the second core structure are disposed in the internal space. The first core structure is disposed on the side of the first plate portion. The second core structure is disposed on the side of the second plate portion. The second core structure has a plurality of openings that open on an opposing surface opposite to the first core structure and extend along the thickness direction.

[0008] According to the present invention, it is possible to provide a component that can reduce the heat conduction of constituent parts while maintaining heat transfer efficiency. Attached Figure Description

[0009] Figure 1 This is a perspective view of the heat conduction component of the present invention.

[0010] Figure 2 Cut with II-II line Figure 1A schematic cross-sectional view of the heat-conducting component shown.

[0011] Figure 3 Cut with III-III line Figure 1 A schematic cross-sectional view of the heat-conducting component shown.

[0012] Figure 4 This is a top view of the first plate section of this embodiment.

[0013] Figure 5 This is a top view of the first plate section of the first modified example.

[0014] Figure 6 This is a top view of the first plate section of the second variation.

[0015] Figure 7 This is a top view of the first plate section of the third variation.

[0016] Figure 8 This is a top view of the first plate section of the fourth variation.

[0017] Figure 9 This is a top view of the first plate section of the fifth variation.

[0018] Label Explanation

[0019] 10: Shell; 20: Working medium; 20G: Gas working medium; 20L: Liquid working medium; 1, 1a, 1b, 1c, 1d, 1e: First plate portion; 11, 11a, 11b, 11c, 11d, 11e: Upper surface; 12: First side wall portion; 13: Core structure; 2: Second plate portion; 21: Lower surface; 22: Second side wall portion; 3: Column portion; 4: Groove portion; 51, 511, 512, 513, 514, 515, 516, 517: Wire 52, 521, 522, 523: Linear recesses; 531, 532, 533, 534, 535, 536, 537, 538: Linear recesses; 54, 541, 542, 543: Linear recesses; 100: Heat conduction component; 101: Internal space; 102: Heated area; 103: Heat dissipation area; 104, 104a, 104b, 104c, 104d, 104e: Core structure; 121: Upper surface; 221: Lower surface. Detailed Implementation

[0020] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. The heat conduction member 100 is rectangular in shape when viewed from above, with the first plate portion 1 and the second plate portion 2 overlapping in the direction of gravity. Furthermore, in the drawings, a three-dimensional orthogonal coordinate system, namely the XYZ coordinate system, is appropriately used for illustration. In the XYZ coordinate system, the Z direction represents the vertical direction (i.e., the direction of gravity).

[0021] Furthermore, when viewing the heat conduction component 100 from the Z direction, the width direction of the heat conduction component 100 is defined as the X direction, and the length direction is defined as the Y direction. That is, the X direction refers to the width direction of the heat conduction component 100, which is perpendicular to the Z direction. The Y direction refers to the length direction of the heat conduction component 100, which is perpendicular to the Z direction. However, this definition of direction is merely for ease of explanation and does not limit the orientation of the heat conduction component 100 during manufacturing or use. In addition, when parallelism is presented in this specification, it does not only refer to strictly mechanical parallelism, but also includes parallelism to the degree to which it achieves the effect of the present invention. Furthermore, in the following description, the working medium 20 is sometimes referred to as the liquid working medium 20L or the gaseous working medium 20G.

[0022] <Heat conduction component 100>

[0023] Figure 1 This is a perspective view of a heat conduction component 100 according to an exemplary embodiment of the present invention. Figure 2 Cut with II-II line Figure 1 A schematic cross-sectional view of the heat conduction component 100 shown. Figure 3 Cut with III-III line Figure 1 A schematic cross-sectional view of the heat-conducting component 100 shown. Additionally, in Figure 2 In the diagram, the black arrows indicate the flow of the working medium 20G, which is generated by the vaporization of the working medium 20, and the hollow arrows indicate the flow of the liquid working medium 20L.

[0024] The heat conduction component 100 has a housing 10 in which a working medium 20 is disposed in an internal space 101. The heat conduction component 100 is disposed in contact with a heating element Ht and is subjected to heat transfer from the heating element Ht. In the heat conduction component 100, the working medium 20 within the internal space 101 undergoes a state change due to the heat transferred from the heating element Ht. The working medium 20 moves within the internal space 101, releasing heat to the outside of the heat conduction component 100 as it moves. As a result, the temperature rise of the heating element Ht is suppressed. That is, the heat conduction component 100 utilizes the latent heat during the state change of the working medium 20 to transport and release heat to the outside.

[0025] <Shell 10>

[0026] The housing 10 has a first plate portion 1 and a second plate portion 2 disposed above the first plate portion 1.

[0027] <Section 1 and Section 2>

[0028] The first plate portion 1 and the second plate portion 2 are, for example, plates formed of metals with high thermal conductivity, such as copper, or alloys thereof. For example, the first plate portion 1 and the second plate portion 2 can also be formed by copper plating on the surface of a metal with a higher modulus of elasticity (e.g., Young's modulus) than copper. As a result, the rigidity of the housing 10 can be improved while maintaining thermal conductivity.

[0029] Alternatively, metals other than copper with a certain or higher thermal conductivity can be used. Examples of metals other than copper include any one of iron, aluminum, zinc, silver, gold, magnesium, manganese, and titanium, or alloys containing any of the above metals (brass, duralumin, stainless steel, etc.), but are not limited to these. By using a metal with a higher modulus of elasticity (e.g., Young's modulus) than copper, the rigidity of the casing 10 can be improved.

[0030] The first plate portion 1 is a rectangular plate when viewed from the Z direction. The length direction of the first plate portion 1 is the Y direction. In this embodiment, the first plate portion 1 is rectangular, but it is not limited to this shape. For example, it may be polygonal, circular, elliptical, etc. when viewed from above.

[0031] Figure 4 This is a top view of the first plate portion 1 in this embodiment. (As shown...) Figure 3 , Figure 4 As shown, a first sidewall portion 12 is connected to the outer periphery of the upper surface 11 of the first plate portion 1. The first sidewall portion 12 is a cylindrical body with a rectangular cross-section parallel to the XY plane and extending upward in the Z direction. The first plate portion 1 and the first sidewall portion 12 can be formed as a single component or as separate components. Figure 3 , Figure 4 As shown, the upper surface 11 of the first plate portion 1 has a plurality of grooves 4 and a plurality of linear recesses 51. Details of the grooves 4 and linear recesses 51 will be described later. Figure 4 The upper surface 11 of the first plate portion 1 shown has 5 groove portions 4 and 8 linear recesses 51, but the number of groove portions 4 and linear recesses 51 is not limited to that number.

[0032] The second plate portion 2 is disposed above the first plate portion 1. The second plate portion 2 is a rectangular plate when viewed from the Z direction. The length direction of the second plate portion 2 is the Y direction. In this embodiment, the second plate portion 2 is rectangular, but is not limited to this shape. For example, it can also be polygonal, circular, elliptical, etc. when viewed from above. A second sidewall portion 22 is connected to the outer periphery of the lower surface 21 of the second plate portion 2. The second sidewall portion 22 is a cylindrical body with a rectangular cross-section parallel to the XY plane and extending downward in the Z direction. The second plate portion 2 and the second sidewall portion 22 can be formed as a single component or can be formed from different components.

[0033] In the housing 10, the upper surface 121 of the first sidewall portion 12 is joined to the lower surface 221 of the second sidewall portion 22. This forms an internal space 101 surrounded by the upper surface 11 of the first plate portion 1, the first sidewall portion 12, the lower surface 21 of the second plate portion 2, and the second sidewall portion 22. For example, if an internal space 101 with a certain or greater volume can be formed, the second sidewall portion 22 can be omitted, and the upper surface 121 of the first sidewall portion 12 can be joined to the lower surface 21 of the second plate portion 2. Alternatively, the first sidewall portion 12 can be omitted, and the lower surface 221 of the second sidewall portion 22 can be joined to the upper surface 11 of the first plate portion 1.

[0034] A working medium 20 is disposed inside the internal space 101. The working medium 20 changes state to liquid or gas depending on the temperature. At this time, the internal space 101 is formed with a degree of airtightness to the extent that the liquid or gaseous working medium 20 will not leak to the outside and that foreign objects from the outside will not intrude into the interior. To further explain, the upper surface 121 of the first side wall portion 12 and the lower surface 221 of the second side wall portion 22 are joined by a joining method that can ensure the aforementioned degree of airtightness. The joining method of the upper surface 121 of the first side wall portion 12 and the lower surface 221 of the second side wall portion 22 can include joining methods by heating and pressurizing, diffusion joining, joining using brazing materials, etc., but is not limited to these.

[0035] In this embodiment, the interior space 101 of the heat transfer component 100 is maintained in a depressurized state, for example, where the air pressure is lower than atmospheric pressure. Because the interior space 101 is in a depressurized state, the boiling point of the working medium 20 contained within the interior space 101 decreases, making it easier for the working medium 20 to undergo a change in state. Details regarding the heat transfer caused by this change in state of the working medium 20 will be explained later.

[0036] <Column 3>

[0037] like Figure 2 , Figure 3 As shown, the column portions 3 are arranged in the internal space 101. That is, the housing 10 also has a plurality of column portions 3 disposed between the first plate portion 1 and the second plate portion 2 and in contact with the first plate portion 1 and the second plate portion 2. The column portions 3 are cylindrical in shape, extending along the Z direction. It is not limited to this, and the cross-section obtained by cutting with a plane parallel to the XY plane may be polygonal, elliptical, etc. The column portions 3 are arranged regularly in two dimensions in the XY plane, for example.

[0038] The pillar 3 is a component distinct from the first plate portion 1 and the second plate portion 2, and is formed of a metal with high thermal conductivity, such as copper. The lower and upper ends of the pillar 3 are joined to the upper surface 11 of the first plate portion 1 and the lower surface 21 of the second plate portion 2, respectively, using brazing material. Alternatively, the pillar 3 can be joined to the first plate portion 1 and the second plate portion 2 by welding or the like. Furthermore, the pillar 3 can also be integrally formed with one of the first plate portion 1 and the second plate portion 2. In this case, the pillar 3 is formed by etching or cutting the first plate portion 1 or the second plate portion 2.

[0039] The column 3 supports the first plate 1 and the second plate 2. By supporting the first plate 1 and the second plate 2 with the column 3, the distance in the Z direction between the upper surface 11 of the first plate 1 and the lower surface 21 of the second plate 2 is kept constant. In addition, even when the pressure inside the internal space 101 changes due to changes in the state of the working medium 20, deformation of the internal space 101 of the housing 10 can be suppressed, even when external forces are applied.

[0040] <Working Medium 20>

[0041] Here, the working medium 20 will be described. The working medium 20 is disposed in the internal space 101 of the housing 10. When the working medium 20 is heated due to the heat transferred from the heating element Ht to the heat conduction component 100 and rises to a certain temperature (boiling point) or above, it changes from a liquid state to a gas. In the heat conduction component 100 of this embodiment, water is used as the working medium 20, but it is not limited to this. For example, alcohol compounds, Freon substitutes, hydrocarbon compounds, fluorinated hydrocarbon compounds, and diol compounds can be used. The working medium 20 can be widely made of materials that are liquid when not being heated by the heat from the heating element Ht and will evaporate (vaporize) when heated.

[0042] <Core Structure 13>

[0043] like Figure 2 , Figure 3 As shown, a core structure 13 is disposed in the internal space 101 of the housing 10. The core structure 13 is a porous sintered body. By making the core structure 13 a porous sintered body, voids (not shown) are formed for the flow of the working medium 20, thus facilitating the flow of the working medium 20. As a result, the heat transfer efficiency is improved. In addition, the core structure 13 is not limited to a porous body and can also be formed of a mesh. As the core structure 13, a structure having voids that allow capillary forces to act on the liquid working medium 20L can be widely adopted.

[0044] The core structure 13 is disposed in contact with the lower surface of the second plate portion 2 and faces the internal space 101. In this specification, "facing" the internal space 101 means facing the internal space 101. That is, the core structure 13 is disposed on the side closest to the second plate portion 2.

[0045] like Figure 1 , Figure 2 As shown, a heating element Ht is disposed on the lower surface of the first plate portion 1. The heating element Ht can be in direct contact with the first plate portion 1, or it can be disposed via a heat transfer medium such as heat transfer grease. Heat from the heating element Ht is transferred to the first plate portion 1. The working medium 20 disposed inside the internal space 101 changes from a liquid state to a gas (vapor) using the heat transferred to the first plate portion 1 from the heating element. That is, the working medium 20 is determined based on conditions such as the pressure reduction level of the internal space 101, the heat output of the heating element Ht, and the heat that can be released to the outside. Furthermore, the placement of the heating element Ht relative to the heat conduction member 100 is not limited to the lower surface of the first plate portion 1; it can also be disposed on the upper surface of the second plate portion 2. Alternatively, it can be disposed on both sides.

[0046] <Groove 4 and linear recess 51>

[0047] The following is a detailed description of the groove 4 and the linear recess 51 of the first plate portion 1. For example... Figure 3 , Figure 4 As shown, the upper surface 11 of the first plate portion 1 has a plurality of grooves 4 arranged in a row. The grooves 4 are recesses that are recessed downward from the upper surface 11 of the first plate portion 1. The grooves 4 extend in the Y direction and are arranged parallel to the X direction. In this embodiment, one groove 4 is provided between each adjacent column portion 3 in the X direction.

[0048] The heat conduction component 100 is sometimes not fixed in its orientation during use, such as vertically. In such cases, the liquid working medium 20L may adhere to the lower surface 21 of the second plate portion 2. In this case, the groove portion 4 may also be formed on the lower surface 21 of the second plate portion 2. Alternatively, the groove portion 4 may be formed on both the upper surface 11 of the first plate portion 1 and the lower surface 21 of the second plate portion 2. That is, at least one of the upper surface 11 of the first plate portion 1 and the lower surface 21 of the second plate portion 2 has a plurality of groove portions 4 arranged in a specific configuration.

[0049] The groove 4 can also be formed during the manufacturing of the first plate 1 by etching, cutting, or other processing methods. Alternatively, other processing methods can be used to form the groove 4.

[0050] Within the internal space 101 of the housing 10, capillary force acts on the liquid working medium 20L through the groove 4 on the upper surface 11 of the first plate portion 1. The movement of the liquid working medium 20L is facilitated by the capillary force based on the groove 4.

[0051] like Figure 3 , Figure 4 As shown, the lower end of the column portion 3 supports the area between adjacent groove portions 4 on the upper surface 11 of the first plate portion 1. Furthermore, linear recesses 51 are disposed between adjacent groove portions 4 on the upper surface 11 of the first plate portion 1. That is, a plurality of linear recesses 51 are disposed between the groove portions 4. The linear recesses 51 can be formed by the same processing method as the groove portions 4. Alternatively, the linear recesses 51 can be formed by irradiating them with a laser. Additionally, the linear recesses 51 can also be formed on the lower surface 21 of the second plate portion 2 in the same manner as the groove portions 4. Furthermore, the linear recesses 51 can also be formed on the upper surface 11 of the first plate portion 1 and the lower surface 21 of the second plate portion 2.

[0052] The linear recess 51 is a recess continuously formed along a pre-conceived line. Furthermore, the linear recess 51 is located in a region different from the region that contacts the column portion 3 of the upper surface 11 of the first plate portion 1. In other words, when viewed from the Z direction, the linear recess 51 does not contact the column portion 3.

[0053] In addition, such as Figure 3 , Figure 4 As shown, the upper surface 11 of the first plate portion 1 may also have a linear recess 510 formed at a position overlapping with the column portion 3 in the Z direction. That is, when viewed from the vertical direction, at least one of the linear recesses 51 overlaps with at least one of the plurality of column portions 3. With this configuration, capillary forces based on the bottom surface of the linear recess 510 and the end face of the column portion 3 facing the bottom surface can act on the liquid working medium 20L. As a result, the flow of the liquid working medium 20L can be promoted.

[0054] like Figure 4 As shown, in the first plate portion 1, when viewed from the Z direction, a plurality of linear recesses 51 are arranged parallel to the groove portion 4 extending along the Y direction, forming a straight line. Furthermore, the linear recesses 51 are not connected to the groove portion 4. That is, at least one of the linear recesses 51 is not connected to the groove portion 4. Here, "not connected" means that the working medium 20 does not move directly between the linear recesses 51 and the groove portion 4. The same applies below. Additionally, the term "linear" in "linear recesses 51" includes both "straight-line" and "curved" shapes.

[0055] To describe in more detail, at least a portion of the linear recess 51 extends along the groove 4. At least a portion of the linear recess 51 is straight and arranged in parallel. That is, the linear recess 51 is not connected to any other linear recess 51.

[0056] like Figure 4 As shown, when viewed from the Z direction, the width W2 of the linear recess 51 is narrower than the width W1 of the groove 4. Furthermore, as... Figure 2 , Figure 3 As shown, the depth D2 of the linear recess 51 is shallower than the depth D1 of the groove 4. That is, the linear recess 51, which is shallower than the groove 4, is disposed between the grooves 4. Inside the linear recess 51, the capillary force of the linear recess 51 acts on the working medium 20L of the liquid. The movement of the working medium 20L of the liquid is promoted by the capillary force based on the linear recess 51.

[0057] As described above, the upper surface 11 of the first plate portion 1, which has the groove portion 4 and the linear recess portion 51, has the same effect as the core structure. That is, the upper surface 11 of the first plate portion 1 is the core structure portion 104 of the housing 10. In addition, the "core structure portion 104" is a part of the housing 10, and like the core structure formed of a mesh, porous body, etc., it has a structure that can promote the movement of the liquid working medium 20L by utilizing capillary force.

[0058] Therefore, in the heat conduction member 100 of this embodiment, the core structure composed of a mesh, porous material, etc., disposed on the upper surface 11 of the first plate portion 1 can be reduced. This reduces the number of constituent parts of the heat conduction member 100. The heat conduction member 100 has the structure described above.

[0059] <Operation of heat conduction component 100>

[0060] like Figure 1 , Figure 2 As shown, the heat conduction component 100 has a heated region 102 and a heat dissipation region 103. A heating element Ht is disposed below the heated region 102. The heat dissipation region 103 is adjacent to the heated region 102 in the Y direction.

[0061] In the heat conduction component 100, the region where heat is transferred from the heat source Ht is the heated region 102, and the region adjacent to the heated region 102 is the heat dissipation region 103. Therefore, the positions of the heated region 102 and the heat dissipation region 103 are not limited to [specific locations]. Figure 1 , Figure 2 wait.

[0062] The operation of the heat conduction component 100 will be explained in detail below.

[0063] like Figure 2 As shown, heat from the heating element Ht is transferred to the heated area 102 of the heat conduction component 100. Due to the heat transferred to the heated area 102, the liquid working medium 20L in the internal space 101 is heated and evaporates (vaporizes), and the working medium 20G changes state to gas.

[0064] The gaseous working medium 20G moves towards the heat dissipation area 103 within the internal space 101. Simultaneously, the gaseous working medium 20G moves towards the core structure 13, and within the core structure 13, it moves towards the heat dissipation area 103. At this time, the potential heat of the gaseous working medium 20G is transferred to the core structure 13, thereby cooling the gaseous working medium 20G. Thus, within the core structure 13, the gaseous working medium 20G changes state to a liquid working medium 20L.

[0065] Inside the core structure 13, the contact area between the core structure 13 and the gaseous working medium 20G is relatively large. Therefore, the efficiency of heat transfer from the gaseous working medium 20G to the core structure 13 is increased. Because of the core structure 13, the gaseous working medium 20G is easily condensed.

[0066] A portion of the working medium 20L, which is condensed in the core structure 13, drips down and flows toward the core structure 104 on the upper surface 11 of the first plate portion 1. In addition, a portion of the working medium 20L, which is condensed in the core structure 13, moves along the outer surface of the column portion 3 and flows toward the core structure 104 on the upper surface 11 of the first plate portion 1.

[0067] The heat transferred from the gaseous working medium 20G to the core structure 13 is transferred to the housing 10 in the heat dissipation region 103. As a result, the gaseous working medium 20G is cooled and condensed (liquefied), returning to the liquid working medium 20L. Additionally, the heat transferred from the gaseous working medium 20G to the housing 10 is dissipated to the outside of the housing 10. That is, heat is transferred within the internal space 101 of the housing 10 of the heat conduction member 100 using the gaseous working medium 20G. Then, the transferred heat is discharged to the outside of the heat conduction member 100.

[0068] As described above, a core structure 104 is formed on the upper surface 11 of the first plate portion 1. In the housing 10 of the heat conduction member 100, the groove 4 and the linear recess 51 of the core structure 104 extend in the direction connecting the heated region 102 and the heat dissipation region 103. Therefore, the liquid working medium 20L adhering to the upper surface 11 of the first plate portion 1 flows back from the heat dissipation region 103 to the heated region 102 within the internal space 101 by the capillary force based on the groove 4 and the linear recess 51 of the core structure 104. Then, the liquid working medium 20L is heated again in the heated region 102 and evaporates.

[0069] By repeating the above actions, the heat transfer component 100 transfers heat from the heated region 102 to the heat dissipation region 103. Furthermore, by making the heat dissipation region 103 of the housing 10 larger than the heated region 102 in the heat transfer component 100, more heat can be transferred. This allows for efficient removal of heat from the heating element Ht.

[0070] In the heat conduction component 100, the working medium 20L, after condensation in the heat dissipation region 103, can rapidly flow to the heated region 102 by means of the core structure 104. As a result, the heat conduction efficiency of the heat conduction component 100 can be improved.

[0071] To explain in more detail, a capillary force based on the groove 4 acts on the liquid working medium 20L adhering to the upper surface 11 of the first plate portion 1. The liquid working medium 20L is stretched from the heat dissipation area 103 to the heated area 102 by the capillary force of the groove 4. As a result, the liquid working medium 20L in contact with the upper surface 11 of the first plate portion 1 moves from the heat dissipation area 103 to the heated area 102.

[0072] As described above, the heat conduction component 100 transfers and releases the heat generated by the heat-generating element Ht. Furthermore, to improve heat dissipation, heat exchange units (not shown), such as heat sink fins or a radiator, can be thermally connected in the heat dissipation area 103. In this case, a cooling medium can flow within the heat exchange unit. The cooling medium can be, for example, water, oil, or air. The heat conduction component 100 is used, for example, in devices such as smartphones, tablet PCs, and laptops. In this case, the heat-generating element Ht can be, for example, a CPU, a camera unit, a battery, or a display panel.

[0073] As described above, by forming the upper surface 11 of the first plate portion 1 into a core structure portion 104 having a groove portion 4 and a linear recess portion 51, the core structure portion 104 can be reliably disposed in the internal space 101. This allows for the reduction of the constituent components of the heat conduction component 100 while promoting the flow of the working medium 20. In the heat conduction component 100 of this embodiment, the number of constituent components can be reduced while maintaining heat conduction efficiency.

[0074] The linear recess 51 facilitates the flow of the liquid working medium 20L along the direction of the groove 4. More specifically, the liquid working medium 20L in contact with the upper surface 11 of the first plate portion 1 is moved by the capillary force of the groove 4. Therefore, the liquid working medium 20L near the groove 4 is easily moved.

[0075] On the other hand, since the capillary force based on the groove 4 is difficult to apply to the working medium 20L of the liquid far from the groove 4, the working medium 20L of the liquid sometimes remains on the upper surface 11 of the first plate portion 1. At this time, the remaining working medium 20L of the liquid flows into the linear recess 51. By using the capillary force based on the linear recess 51, the portion of the working medium 20 of the liquid remaining between the grooves 4 can also be moved. As a result, more working medium 20 of the liquid can be moved, thereby improving the heat transfer efficiency of the heat transfer component 100.

[0076] In this embodiment, two linear recesses 51 are provided between adjacent grooves 4, but this is not a limitation. There may be one or more. Furthermore, the number of linear recesses 51 can vary depending on the portion between the grooves 4. For example, the portion between the grooves 4 on the central side of the X-direction (i.e., the arrangement direction of the grooves 4) of the first plate 1 may have more linear recesses 51 than the portion between the grooves 4 on the end side. Alternatively, the opposite may also be true. Furthermore, when the posture of the heat conduction member 100 is fixed during operation, multiple linear recesses 51 may be provided on the portion of the upper surface 11 of the first plate 1 where liquid easily remains in the working medium 20L.

[0077] In this embodiment, a core structure 13 with a porous material disposed near the lower surface 21 of the second plate portion 2 is used, and the upper surface 11 of the first plate portion 1 has a core structure portion 104, which has a groove portion 4 and a linear recess portion 51, but is not limited to this. For example, the core structure 13 with a porous material disposed on the upper surface 11 of the first plate portion 1 and the core structure portion 104 on the lower surface 21 of the second plate portion 2 may also be used. Alternatively, a structure in which both the upper surface 11 of the first plate portion 1 and the lower surface 21 of the second plate portion 2 have core structures 104 may be used. Furthermore, if the working medium 20G condenses on the lower surface 21 of the second plate portion 2 through contact with the lower surface 21 of the second plate portion 2, the core structure 13 may be omitted.

[0078] <Example 1>

[0079] Figure 5 This is a top view of the first plate portion 1a of the first modified example. Figure 5 The first plate portion 1a shown has linear recesses 51, 511, 512, and 513. Other points on the first plate portion 1a are... Figure 4 The first plate portion 1 shown is the same. Therefore, the parts of the first plate portion 1a that are substantially the same as the first plate portion 1 are labeled with the same reference numerals, and detailed descriptions of the substantially the same parts are omitted.

[0080] like Figure 5As shown, the upper surface 11a of the first plate portion 1a has two linear recesses 51, 511, 512, and 513. The upper surface 11a of the first plate portion 1a has a core structure portion 104a, which has linear recesses 51, 511, 512, and 513. The linear recesses 51, 511, 512, and 513 are another example of the linear recess 51. The linear recesses 51, 511, 512, and 513 will be described below.

[0081] Two linear recesses 511 are parallel to each other but inclined relative to the groove 4. Two linear recesses 512 are aligned with one side facing the Y direction (in... Figure 5 The two linear recesses 512 are positioned symmetrically across the center of the connecting column 3 (with the center on the left side) and are close to each other. When viewed from the Z direction, the two linear recesses 512 are positioned symmetrically across the center of the connecting column 3. Furthermore, the two linear recesses 513 are curved, with their central portions in the Y direction curving away from each other in the X direction. When viewed from the Z direction, the two linear recesses 513 are positioned symmetrically across the center of the connecting column 3. In addition, the two linear recesses 513 are shaped along an elliptical arc, but are not limited to this; they can also be formed along curves such as wavy lines or parabolas.

[0082] The linear recesses 51, 511, 512, and 513 are all along the groove 4 and are not connected to each other or to the groove 4. Therefore, the core structure portion 104a formed in the first plate portion 1a has the same effect as the core structure portion 104 formed in the first plate portion 1.

[0083] Furthermore, the first plate portion 1a adopts a structure having linear recesses 51, 511, 512, and 513, but is not limited to this. The first plate portion 1a may adopt a structure having one of the linear recesses 51, 511, 512, and 513, or it may adopt a structure obtained by combining multiple recesses.

[0084] <Second Variation>

[0085] Figure 6 This is a top view of the first plate portion 1b of the first modified example. Figure 6 The upper surface 11b of the first plate portion 1b shown replaces one of the linear recesses 51, 511, 512, 513 with linear recesses 514, 515, 516, 517. Other points of the first plate portion 1b are... Figure 5 The first plate portion 1a shown is the same. Therefore, the parts of the first plate portion 1b that are substantially the same as those of the first plate portion 1a are labeled with the same reference numerals, and detailed descriptions of the substantially the same parts are omitted.

[0086] like Figure 6As shown, the upper surface 11b of the first plate portion 1b has linear recesses 514, 515, 516, and 517. The linear recesses 514, 515, 516, and 517 of the first plate portion 1b are respectively arranged on opposite sides of the linear recesses 51, 511, 512, and 513, separated by a line connecting the center of the column portion 3. The upper surface 11b of the first plate portion 1b has a core structure portion 104b, which has a groove portion 4 and linear recesses 51, 511, 512, 513, 514, 515, 516, and 517. The linear recesses 514, 515, 516, and 517 will be described below.

[0087] The linear recess 514 is arranged obliquely relative to the linear recess 51. Furthermore, one side of the linear recess 514 in the Y direction (in...) Figure 6 The end of the groove (located on the left side) is connected to the groove 4. Furthermore, the linear recess 515 is arranged parallel to the linear recess 511. Moreover, one side of the linear recess 515 in the Y direction (in...) Figure 6 The end of the linear recess 515 (left side) is connected to the groove 4. That is, at least one of the linear recesses 515 is connected to the groove 4 at least a portion of its length.

[0088] Linear recesses 512 and 516 are aligned with one side facing the Y direction (in Figure 6 (The middle is on the left) and they are close to each other. When viewed from the Z direction, the linear recesses 512 and 516 are arranged in a position that is symmetrical about each other, separated by a line from the center of the connecting column 3.

[0089] Furthermore, the linear recesses 513 and 517 are curved, with their central portions in the Y direction curving away from each other in the X direction. The middle portion of the linear recess 517 in the Y direction is connected to the groove 4.

[0090] As shown above, the upper surface 11b of the first plate portion 1b has a core structure portion 104b, which has linear recesses 514, 515, 516, and 517 connected to the groove portion 4. Because the first plate portion 1b has the core structure portion 104b, the working medium 20L, which moves due to capillary force based on the linear recesses 514, 515, 516, and 517, can flow into the groove portion 4. This promotes the flow of the working medium 20L. Furthermore, the working medium 20L overflowing from the groove portion 4 can be moved using the capillary force based on the linear recesses 514, 515, 516, and 517. This also promotes the flow of the working medium 20L.

[0091] Furthermore, the core structure 104b has linear recesses 51, 511, 512, and 513 that are not connected to the groove 4. Therefore, it also has the same effect as the core structures 104 and 104a.

[0092] Furthermore, the first plate portion 1b is configured to have linear recesses 514, 515, 516, and 517, but is not limited to this. The first plate portion 1b may also be a structure obtained by combining one or more of the linear recesses 51, 511, 512, and 513 with one or more of the linear recesses 514, 515, 516, and 517.

[0093] <Example 3>

[0094] Figure 7 This is a top view of the first plate portion 1c of the third modified example. Figure 7 The first plate portion 1c shown is similar to the first plate portion 1c in that it has linear recesses 52, 521, 522, and 523 instead of linear recesses 51. Figure 4 The first plate portion 1 shown is different. Except for this, the points of the first plate portion 1c are the same as those of the first plate portion 1. Therefore, the parts of the first plate portion 1c that are substantially the same as those of the first plate portion 1 are marked with the same reference numerals, and detailed descriptions of the substantially the same parts are omitted.

[0095] like Figure 7 As shown, the upper surface 11c of the first plate portion 1c has linear recesses 52, 521, 522, and 523. The upper surface 11c of the first plate portion 1c has a core structure portion 104c, which has a groove portion 4 and linear recesses 52, 521, 522, and 523. The width of the linear recesses 52, 521, 522, and 523 is narrower than the width of the groove portion 4.

[0096] The linear recess 52 is disposed in a region different from the region that contacts the column portion 3 of the upper surface 11c of the first plate portion 1c. The linear recess 52 extends in a direction intersecting with the groove portion 4. Moreover, the linear recess 52 is arranged in the direction in which the groove portion 4 extends. That is, at least a portion of the linear recess 52 extends in a direction intersecting with the groove portion 4 and is arranged along the groove portion 4.

[0097] With this structure, the liquid working medium 20L flows in the direction along the linear recess 52. Furthermore, the liquid working medium 20L flowing in the direction along the linear recess 52 flows into the tank 4. This promotes the flow of the liquid working medium 20L.

[0098] Furthermore, the linear recess 52 is configured to be inclined at an angle other than a right angle relative to the groove 4, but is not limited to this. That is, the linear recess 52 may also be configured to extend in a direction perpendicular to the direction in which the groove 4 extends.

[0099] like Figure 7As shown in the upper surface 11c of the first plate portion 1c, in addition to the parallel linear recesses 52, it may also have linear recesses 521 with a structure inclined relative to the linear recesses 52. In other words, it may also have linear recesses 521 that are inclined relative to the groove 4 at an angle different from the inclination angle of the linear recesses 52 relative to the groove 4. In the first plate portion 1c, the linear recesses 52 and linear recesses 521 are alternately arranged in the direction in which the groove 4 extends, that is, in the Y direction, but it is not limited to this.

[0100] For example, the linear recesses 52 and 521 can be continuously arranged. The linear recesses 521 are inclined in the opposite direction to the groove 4, but this is not a limitation. The linear recesses 521 can also be configured to have the same inclination direction relative to the groove 4 but different inclination angles. Furthermore, linear recesses 521 with different inclination angles can also be used.

[0101] Figure 7 The upper surface 11c of the first plate portion 1c shown may also have a linear recess 522 with the same inclination angle relative to the groove portion 4 as the linear recess 52 and connected to the groove portion 4 at both ends. Alternatively, it may have a linear recess 523 with the same inclination angle relative to the groove portion 4 as the linear recess 521 and connected to the groove portion 4 at both ends. That is, at least one of the linear recesses 522 and 523 is connected to the groove portion 4 at least a portion of its length.

[0102] With this configuration, the working medium 20L, which flows along the linear recesses 522 and 523, can flow into the tank 4. This promotes the flow of the working medium 20L. Furthermore, the working medium 20L flowing within the tank 4 can flow through the linear recesses 522 and 523 to other tank sections 4. This suppresses deviations in the flow rate of the working medium 20L within the tank 4, further promoting its flow. Consequently, the heat transfer efficiency of the heat transfer component 100 can be improved.

[0103] Furthermore, the first plate portion 1c is configured to have linear recesses 52, 521, 522, and 523, but is not limited to this. The first plate portion 1c may have a structure having one of the linear recesses 52, 521, 522, and 523, or it may have a structure obtained by combining multiple of them.

[0104] <4th Variation>

[0105] Figure 8 This is a top view of the first plate portion 1d in the fourth variation. Figure 8 The first plate portion 1d shown is similar in that it has linear recesses 531, 532, 533, 534, 535, 536, 537, and 538 instead of linear recesses 51. Figure 4 The first plate portion 1 shown is different. Except for this, the points of the first plate portion 1d are the same as those of the first plate portion 1. Therefore, the parts of the first plate portion 1d that are substantially the same as those of the first plate portion 1 are marked with the same reference numerals, and detailed descriptions of the substantially the same parts are omitted.

[0106] like Figure 8 As shown, the upper surface 11d of the first plate portion 1d has linear recesses 531, 532, 533, 534, 535, 536, 537, and 538. The upper surface 11d of the first plate portion 1d has a core structure portion 104d, which has a groove portion 4 and linear recesses 531, 532, 533, 534, 535, 536, 537, and 538. The width of the linear recesses 531, 532, 533, 534, 535, 536, 537, and 538 is narrower than the width of the groove portion 4.

[0107] The linear recess 531 adopts the same as Figure 4 The linear recess 532 has the same structure as the linear recess 532 on the upper surface 11 of the first plate portion 1 shown. The linear recess 532 extends along the arrangement direction of the groove portions 4 and is arranged in the direction in which the groove portions 4 extend. The linear recess 532 intersects with the linear recess 531. That is, at least a portion of the linear recess 531 intersects with other linear recesses 532. Furthermore, the linear recess 532 is not connected to the groove portion 4.

[0108] With this configuration, the liquid working medium 20L flows in multiple different directions due to the capillary force based on the linear recesses 531 and 532. This prevents the liquid working medium 20L from stagnating on the upper surface 11d of the first plate portion 1d. Consequently, it prevents the liquid working medium 20L from remaining in a single area, thereby improving the heat transfer efficiency of the heat transfer component 100. Furthermore, while the linear recesses 532 and 531 are perpendicular, they are not limited to this configuration and may intersect at angles other than right angles.

[0109] in addition, Figure 8 The upper surface 11d of the first plate portion 1d shown has linear recesses 533 and 534. Both linear recesses 533 and 534 extend obliquely relative to the groove portion 4. Moreover, the linear recesses 533 and 534 intersect each other. By having linear recesses 533 and 534, the same effect as described above is achieved.

[0110] in addition, Figure 8The upper surface 11d of the first plate portion 1d shown has linear recesses 535 and 536. Linear recesses 535 have the same structure as linear recesses 531. Furthermore, linear recesses 536 have the same structure as linear recesses 532, and both ends of the linear shape are connected to the groove portion 4. Moreover, linear recesses 535 and 536 intersect each other. By having linear recesses 535 and 536, the same effects as described above are achieved.

[0111] Furthermore, since the linear recess 536 is configured to connect with the groove 4, the working medium 20L, which flows along the linear recess 536, can flow into the groove 4. Thus, it has a connection with... Figure 7 The linear recesses 522 and 523 on the upper surface 11c of the first plate portion 1c shown have the same effect. Furthermore, the linear recess 535 has the same effect as the linear recess 531 described above. Through the effects of the linear recesses 535 and 536, the heat conduction efficiency of the heat conduction component 100 can be improved.

[0112] Alternatively, it can be like Figure 8 As shown in the linear recesses 537 and 538, both ends of the linear portion are connected to the groove 4. The linear recesses 537 and 538 allow the liquid working medium 20L to move and flow into the groove 4. Furthermore, the liquid working medium 20L within the groove 4 can also be transported to other grooves 4. This prevents the liquid working medium 20L from remaining in a single portion, thereby improving the heat transfer efficiency of the heat transfer component 100.

[0113] Furthermore, the first plate portion 1d has combinations of linear recesses 531 and 532, linear recesses 533 and 534, linear recesses 535 and 536, and linear recesses 537 and 538, but is not limited to these. It can have multiple arbitrary combinations, or it can employ a structure obtained by combining multiple of these combinations.

[0114] <5th Variation>

[0115] Figure 9 This is a top view of the first plate part 1e in the fifth variation. Figure 9 The first plate portion 1e shown is similar in that it has linear recesses 54, 541, 542, and 543 instead of linear recesses 51. Figure 4 The first plate portion 1 shown is different. Except for this, the points of the first plate portion 1e are the same as those of the first plate portion 1. Therefore, the parts of the first plate portion 1e that are substantially the same as those of the first plate portion 1 are marked with the same reference numerals, and detailed descriptions of the substantially the same parts are omitted.

[0116] like Figure 9As shown, the upper surface 11e of the first plate portion 1e has pairs of linear recesses 54, 541, 542, and 543. The upper surface 11e of the first plate portion 1e has a core structure portion 104e, which has a groove portion 4 and pairs of linear recesses 54, 541, 542, and 543. The width of the linear recesses 54, 541, 542, and 543 is narrower than the width of the groove portion 4.

[0117] Two linear recesses 54 are arranged opposite each other in the X direction, spaced apart by the column portion 3. Furthermore, the two linear recesses 54 are oriented towards one side along the Y direction (in... Figure 9 (The middle is on the left) and they are close to each other. Moreover, the two linear recesses 54 are on one side along the Y direction (in Figure 9 The ends of the linear recesses 54 (with the middle being the left side) intersect. That is, at least a portion of the linear recesses 54 are arranged in pairs in the direction of the grooves 4, and the pairs of linear recesses 54 approach each other toward the side along the direction of the grooves 4.

[0118] This configuration allows the working liquid medium 20L to be concentrated. This promotes liquid flow, resulting in improved heat transfer efficiency of the heat transfer component 100.

[0119] It can also be like Figure 9 The paired linear recesses 541 shown are non-intersecting structures. Alternatively, like the paired linear recesses 542 and 543, the other side in the Y direction (in...) Figure 9 The end of the middle (right side) is connected to the groove 4. Even with this structure, the flow of the liquid working medium 20L is promoted, resulting in improved heat transfer efficiency of the heat transfer component 100.

[0120] Furthermore, the first plate portion 1e is configured to have a pair of linear recesses 54, a pair of linear recesses 541, a pair of linear recesses 542, and a pair of linear recesses 543, but is not limited to this. The first plate portion 1e may have a structure having one of the pairs of linear recesses 54, 541, 542, and 543, or it may have a structure combining multiple of them.

[0121] The embodiments of the present invention have been described above. However, the scope of the present invention is not limited to the embodiments described above. The present invention can be implemented with various modifications to the above embodiments without departing from the spirit of the invention. Furthermore, the matters described in the above embodiments can be appropriately combined arbitrarily without causing contradictions.

[0122] Industrial availability

[0123] It can be used for cooling various heat-generating elements.

Claims

1. A heat-conducting component having a housing in which a working medium is disposed within an internal space, wherein, The housing has: Section 1; The second plate is positioned above the first plate. as well as A plurality of column portions are disposed between the first plate portion and the second plate portion and are in contact with the first plate portion and the second plate portion. At least one of the upper surface of the first plate and the lower surface of the second plate has: Multiple slots, arranged in a specific configuration; as well as Multiple linear recesses are disposed between the grooves and are shallower than the grooves. At least one of the linear recesses is not connected to the groove. When viewed from above, none of the plurality of linear recesses overlap with the plurality of columnar portions.

2. The heat conduction component according to claim 1, wherein, At least a portion of the linear recess extends along the groove.

3. The heat conduction component according to claim 1, wherein, At least a portion of the linear recess extends in a direction intersecting the groove and is arranged along the groove.

4. The heat conduction component according to claim 3, wherein, The groove is not connected to the linear recess.

5. The heat-conducting component according to any one of claims 1 to 3, wherein, At least a portion of the linear recess intersects with other linear recesses.

6. The heat-conducting component according to any one of claims 2 to 4, wherein, At least a portion of the linear recesses are straight and arranged in parallel.

7. The heat conduction component according to claim 2, wherein, At least a portion of the linear recesses are arranged in a ground-facing configuration in the direction of the groove arrangement. The paired linear recesses approach each other toward one side in the direction along the groove.

8. The heat-conducting component according to any one of claims 1 to 4, wherein, The width of the linear recess is narrower than the width of the groove.

9. The heat-conducting component according to any one of claims 1 to 4, wherein, At least one of the linear recesses is connected to the groove at at least a portion of its length.

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