Methods, electronic devices, and storage media for extracting load inductance from S-parameters on a chip

Abstract

This application provides a method, electronic device, and storage medium for extracting load inductance from on-chip S-parameters. The method includes: acquiring measured values ​​of an on-chip short-circuit calibrator; calculating the current load inductance of the on-chip load calibrator based on a predetermined first relationship, according to the load resistance value of the on-chip load calibrator and the measured values ​​of the on-chip short-circuit calibrator; and calibrating the device under test (DUT) based on the current load inductance of the on-chip load calibrator. This application can improve the measurement reliability of on-chip S-parameter measurement systems.

Description

Technical Field

[0001] This application relates to the field of on-chip S-parameter technology, and in particular to a method, electronic device and storage medium for extracting load inductance from on-chip S-parameters. Background Technology

[0002] Before use, on-chip S-parameter measurement systems used in the microelectronics industry require calibration using appropriate methods. Most existing on-chip calibration methods employ the 8-team error model. This 8-team error model characterizes various imperfections in system source / load matching, reflection / transmission tracking, directivity, and isolation, and exhibits high accuracy in the on-chip S-parameter, coaxial, and waveguide fields, thus gaining widespread application.

[0003] When calibrating an on-chip S-parameter measurement system using an 8-team error model, the standard value of the load inductance is typically used directly for calibration. However, since the load inductance value changes in real time due to the different positions of the pressure pins during measurement, calibration using only the standard value of the load inductance may introduce errors. Summary of the Invention

[0004] This application provides a method, electronic device, and storage medium for extracting load inductance from on-chip S-parameters, in order to solve the problem that the load inductance value changes in real time due to the different positions of the pressure pins during measurement, and that calibration using only the standard value of the load inductance may result in errors.

[0005] In a first aspect, this application provides a method for extracting load inductance from on-chip S-parameters, comprising:

[0006] Obtain the measured values ​​on the short-circuit calibrator;

[0007] Based on a predetermined first relationship, the current load inductance of the on-chip load calibrator is calculated according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator.

[0008] The device under test is calibrated based on the current load inductance of the on-chip load calibrator.

[0009] In one possible implementation, the first relation includes at least one of the following:

[0010] The first on-chip short-circuit relationship is:

[0011]

[0012] Among them, L load,short,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip short-circuit calibrator. 1,loadThis represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,short ) represents the real part of the first short-circuit measurement value at the first port of the chip short-circuit calibrator, imag(Z) 1,app,short ) represents the imaginary part of the first short-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0013] The second short-circuit relationship in the chip is:

[0014]

[0015] Among them, L load,short,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip short-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,short ) represents the real part of the second short-circuit measurement value at the second port of the chip short-circuit calibrator, imag(Z) 2,app,short ) represents the imaginary part of the second short-circuit measurement.

[0016] In one possible implementation, calculating the current load inductance of the on-chip load calibrator includes:

[0017] L load,short,1 As the actual load inductance of the on-chip load calibration device, or L load,short,2 As the actual load inductance of the on-chip load calibration device, or calculated L load,short,1 and L load,short,2 The average value is used as the actual load inductance of the on-chip load calibrator.

[0018] In one possible implementation, after obtaining the measurement value of the short-circuit calibrator, the method further includes:

[0019] Obtain the measurement values ​​of the on-chip open-circuit calibration device;

[0020] Accordingly, based on a predetermined first relationship, the current load inductance of the on-chip load calibrator is calculated according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip open-circuit calibrator, including:

[0021] Based on the first relation and the predetermined second relation, the current load inductance of the on-chip load calibrator is calculated according to the load resistance value of the on-chip load calibrator, the measured value of the on-chip open-circuit calibrator, and the measured value of the on-chip short-circuit calibrator.

[0022] In one possible implementation, the second relation includes at least one of the following:

[0023] The first open-circuit relation is:

[0024]

[0025] Among them, L load,open,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip open-circuit calibrator. 1,load This represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,open ) represents the real part of the first open-circuit measurement value at the first port of the open-circuit calibrator, imag(Z) 1,app,open ) represents the imaginary part of the first open-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0026] The second open-circuit relationship is:

[0027]

[0028] Among them, L load,open,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip open-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,open ) represents the real part of the second open-circuit measurement value at the second port of the open-circuit calibrator, imag(Z) 2,app,open ) represents the imaginary part of the second open-circuit measurement.

[0029] In one possible implementation, obtaining the measurement values ​​of the on-chip short-circuit calibrator includes:

[0030] The on-chip S-parameter measurement system was used to measure the on-chip load calibration device, on-chip open circuit calibration device, and on-chip short circuit calibration device respectively to obtain the on-chip load S-parameter, on-chip open circuit S-parameter, and on-chip short circuit S-parameter.

[0031] Calculate the initial eight errors of the on-chip S-parameter measurement system based on the on-chip load S-parameter, on-chip open-circuit S-parameter, and on-chip short-circuit S-parameter;

[0032] The measured values ​​of the on-chip short-circuit calibrator are calculated based on the initial eight errors.

[0033] In one possible implementation, calibrating the device under test based on the current load inductance of the on-chip load calibration device includes:

[0034] Based on the current load inductance of the on-chip load calibrator, calculate the correction for eight errors of the on-chip S-parameter measurement system;

[0035] The test piece is calibrated based on corrections for eight errors.

[0036] Secondly, this application provides an apparatus for extracting load inductance using on-chip S-parameters, comprising:

[0037] The first acquisition module is used to acquire the measurement values ​​of the short-circuit calibrator;

[0038] The first calculation module is used to calculate the current load inductance of the on-chip load calibrator based on a predetermined first relationship, according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator.

[0039] The calibration module is used to calibrate the device under test based on the current load inductance of the on-chip load calibration device.

[0040] Thirdly, this application provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can run on the processor, and the processor executes the computer program to implement the steps of the method for extracting load inductance in chip S parameters as described in the first aspect or any possible implementation of the first aspect.

[0041] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method for extracting load inductance from S-parameters as described in the first aspect or any possible implementation of the first aspect.

[0042] This application provides a method, electronic device, and storage medium for extracting load inductance from on-chip S-parameters. Considering that the load inductance of the on-chip load calibrator may change due to different probe positions during the calibration process, the current load inductance of the on-chip load calibrator is extracted using the measured value of the on-chip short-circuit calibrator, and then the on-chip load calibrator is corrected. Finally, the on-chip load calibrator is used for calibration, which can improve the measurement accuracy of the on-chip S-parameter measurement system and thus improve the measurement reliability of the on-chip S-parameter measurement system. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is the 8-team error model provided in the embodiments of this application;

[0045] Figure 2 This is the 8-team error model represented by ABCD parameters provided in the embodiments of this application;

[0046] Figure 3This is a flowchart illustrating the implementation of the on-chip S-parameter extraction method for load inductance provided in this application embodiment;

[0047] Figure 4 This is a schematic diagram showing the relationship between parameters ABCD and voltage and current in an embodiment of this application;

[0048] Figure 5 This is an equivalent circuit diagram of the on-chip load calibration device in the embodiments of this application;

[0049] Figure 6 The measurement results of parameter S21 provided in the embodiments of this application;

[0050] Figure 7 These are the measurement results of the S11 parameters provided in the embodiments of this application;

[0051] Figure 8 This is a schematic diagram of the structure of the on-chip S-parameter extraction device for load inductance provided in the embodiments of this application;

[0052] Figure 9 This is a schematic diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0053] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.

[0055] See Figure 1 This illustrates the 8-team error model provided in an embodiment of this application. For example... Figure 1As shown, the 8-team error characterizes the imperfections in source / load matching, reflection / transmission tracking, directivity, and isolation of on-chip S-parameter measurement systems. It exhibits high accuracy in on-chip S-parameter measurement, coaxial, and waveguide applications, and is therefore widely used. The SOLT (Short-Open-Load-Thru) calibration method requires accurate knowledge of the definitions of four calibration components; the TRL (Thru-Reflect-Line) calibration method has high requirements for the load calibration components, and its frequency coverage is not wide enough due to the use of only one transmission line; the LRRM (Line-Reflect-Reflect-Match) calibration method has fewer requirements for the definitions of calibration components. For the two reflection calibration components, it is not necessary to know their inductance and capacitance; only their theoretical delay needs to be calculated. The inductance in the load calibration component is extracted in real time based on the probe position. Therefore, the LRRM calibration method has high accuracy and is widely used.

[0056] See Figure 2 This illustrates the 8-team error model represented by ABCD parameters provided in an embodiment of this application. Figure 2 As shown, the eight-item error model is usually represented by S-parameters. In the actual solution process, the error networks need to be cascaded. The error networks are represented by transfer parameters (ABCD) (ABCD parameters and S-parameters have a one-to-one correspondence) to facilitate cascaded calculation. The conversion relationship between ABCD parameters and S-parameters is shown in equation (1):

[0057]

[0058] Among them, S 11 S 12 S 21 S 22 This represents the S-parameters.

[0059] Vector network analyzers, as an on-chip S-parameter measurement system, play a crucial role in the field of on-chip S-parameter measurement. The calibration process for an on-chip S-parameter measurement system can be as follows:

[0060] SS01 uses an uncalibrated on-chip S-parameter measurement system to measure the on-chip load calibration component and obtain the on-chip load S-parameters; it also uses the same system to measure the on-chip short-circuit calibration component and obtain the on-chip short-circuit S-parameters; and finally, it uses the same system to measure the on-chip open-circuit calibration component and obtain the on-chip open-circuit S-parameters. The load inductance of the on-chip load calibration component is a known standard value.

[0061] SS02 uses on-chip load S-parameters, on-chip short-circuit S-parameters, and on-chip open-circuit S-parameters to calculate eight errors, namely: A1 / D1, B1 / D1, C1 / D1, A2 / D2, B2 / D2, C2 / D2, and D1D2.

[0062] SS03 uses eight error parameters to calibrate an uncalibrated on-chip S-parameter measurement system, thereby obtaining a calibrated on-chip S-parameter measurement system.

[0063] During actual calibration, the position of the indenter during calibration may affect the on-chip short-circuit calibrator, on-chip load calibrator, and on-chip open-circuit calibrator, meaning the nominal value may not be the actual value. After assessment, the effect of the indenter position on the on-chip short-circuit and on-chip open-circuit calibrators is negligible. However, it has a significant impact on the load inductance of the on-chip load calibrator. Different indenter positions correspond to different load inductances. Without calibration, directly measuring the device under test based on the standard load inductance may result in inaccurate measurements.

[0064] To address the aforementioned issues, this application provides a method for extracting load inductance from on-chip S-parameters, which will be described in detail below with reference to the accompanying drawings.

[0065] See Figure 3 This illustrates a flowchart of the implementation of the on-chip S-parameter extraction method for load inductance provided in an embodiment of this application. Figure 3 As shown, a method for extracting load inductance from on-chip S-parameters may include steps S101 to S103.

[0066] S101, Obtain the measurement value of the short-circuit calibrator.

[0067] A vector network analyzer can be used to measure the on-chip open-circuit calibrator, on-chip short-circuit calibrator, and on-chip load calibrator respectively, and the measured value of the on-chip short-circuit calibrator can be calculated based on the measurement results.

[0068] For a two-port network, it includes a first port and a second port. Correspondingly, the measurements of the on-chip short-circuit calibrator can include: a first short-circuit measurement of the on-chip short-circuit calibrator at the first port, and / or a second short-circuit measurement of the on-chip short-circuit calibrator at the second port. The specific method can be selected based on the actual situation.

[0069] For example, the process of obtaining measurements from an on-chip open-circuit calibrator may include:

[0070] S1011 uses an on-chip S-parameter measurement system to measure the on-chip load calibration component, on-chip open circuit calibration component, and on-chip short circuit calibration component respectively, and obtains the on-chip load S-parameter, on-chip open circuit S-parameter, and on-chip short circuit S-parameter.

[0071] Specifically, the on-chip load S-parameters are obtained by measuring the on-chip load calibration component using an on-chip S-parameter measurement system. The on-chip short-circuit S-parameters are obtained by measuring the on-chip short-circuit calibration component using the same system. The on-chip open-circuit S-parameters are obtained by measuring the on-chip open-circuit calibration component using the same system.

[0072] S1012 calculates the initial eight errors of the on-chip S-parameter measurement system based on the on-chip load S-parameter, on-chip open-circuit S-parameter, and on-chip short-circuit S-parameter.

[0073] Based on the on-chip load S-parameters, on-chip open-circuit S-parameters, and on-chip short-circuit S-parameters, the initial eight errors of the on-chip S-parameter measurement system can be calculated.

[0074] S1013, calculates the measured value of the on-chip short-circuit calibrator based on the initial eight errors.

[0075] Based on existing methods, the measured values ​​of the on-chip short-circuit calibrator can be calculated according to the initial eight errors. The embodiments described in this application will not be elaborated upon here.

[0076] S102, based on a predetermined first relationship, calculates the current load inductance of the on-chip load calibrator according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator.

[0077] The load resistance of the on-chip load calibrator is a known standard value, and its influence during actual measurement is negligible. To further ensure measurement reliability, a digital multimeter can be used to measure the load resistance of the on-chip load calibrator. The current load inductance of the load calibrator can then be accurately calculated using this measured value, further improving calibration accuracy.

[0078] The first relation can be expressed as equation (2), as follows:

[0079]

[0080] Among them, L load,short R represents the current load inductance of the on-chip load calibrator extracted using the on-chip short-circuit calibrator. load This represents the load resistance value of the on-chip load calibration component, real(Z). app,short ) represents the real part of the measured value of the short-circuit calibrator, imag(Z) app,short ) represents the imaginary part of the measured value of the short-circuit calibrator.

[0081] S103 calibrates the device under test based on the current load inductance of the on-chip load calibrator.

[0082] After obtaining the current load inductance of the on-chip load calibration device, the eight-term error can be recalculated, i.e., the corrected eight-term error can be obtained. Then, the measured values ​​of the device under test (DUT) are calibrated using the corrected eight-term error to obtain the true value of the DUT. The DUT can be a microwave module, such as a DUT.

[0083] For example, the calibration process may include:

[0084] S1031 calculates the correction of eight errors for the on-chip S-parameter measurement system based on the current load inductance of the on-chip load calibrator.

[0085] The eight errors of the on-chip S-parameter measurement system can be recalculated based on the current load inductance, on-chip load S-parameters, on-chip open-circuit S-parameters, and on-chip short-circuit S-parameters of the on-chip load calibrator, and these eight errors can be used as corrections for the eight errors.

[0086] S1032, calibrate the test piece according to the correction of eight errors.

[0087] For each device under test (DUT), the load inductance of the on-chip load calibrator changes due to the different probe positions during measurement. Therefore, the current load inductance can be recalculated for each measurement, and then the eight error correction terms can be calculated to correct the measured value of the DUT, thus obtaining the true value of the DUT.

[0088] This application embodiment extracts the current load inductance of the on-chip load calibrator by utilizing the measurement value of the on-chip short-circuit calibrator, and then corrects the measurement value of the device under test to obtain the true value of the device under test. This can improve the measurement accuracy and reliability of the on-chip S-parameter measurement system.

[0089] In some embodiments of this application, the first relation includes at least one of the following;

[0090] The first on-chip short-circuit relationship is:

[0091]

[0092] Among them, L load,short,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip short-circuit calibrator. 1,load This represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,short ) represents the real part of the first short-circuit measurement value at the first port of the chip short-circuit calibrator, imag(Z) 1,app,short ) represents the imaginary part of the first short-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0093] The second short-circuit relationship in the chip is:

[0094]

[0095] Among them, L load,short,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip short-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,short ) represents the real part of the second short-circuit measurement value at the second port of the chip short-circuit calibrator, imag(Z) 2,app,short ) represents the imaginary part of the second short-circuit measurement.

[0096] The reasoning process for the first relation in the embodiments of this application is given below:

[0097] See Figure 4 This diagram illustrates the relationship between parameters ABCD and voltage and current in an embodiment of this application. (See also...) Figure 5 The diagram shows an equivalent circuit diagram of the on-chip load calibration device in an embodiment of this application.

[0098] like Figure 3 As shown, ABCD are parameters represented by voltage and current. According to the definition, when measuring on-chip calibration, we get the relationships (5) and (6).

[0099]

[0100]

[0101] Among them, Z 1,A Z represents the actual impedance value of the on-chip calibrator at the first port. 1,M Z represents the impedance measurement value at the first port of the on-chip calibrator. 2,A Z represents the actual impedance value of the on-chip calibrator at the first port. 2,M This indicates the impedance measurement value of the on-chip calibrator at the first port.

[0102] like Figure 4 As shown, under rational conditions, for the on-chip open-circuit calibrator of the first port, equation (7) can be obtained from equation (5); for the on-chip short-circuit calibrator of the first port, equation (8) can be obtained from equation (5). For the on-chip open-circuit calibrator of the second port, equation (9) can be obtained from equation (6); for the on-chip short-circuit calibrator of the second port, equation (10) can be obtained from equation (6). Specifically:

[0103]

[0104]

[0105]

[0106]

[0107] Among them, Z 1,M,open Z represents the impedance measurement at the first port of the open-circuit calibrator. 1,M,short Z represents the impedance measurement at the first port of the on-chip short-circuit calibrator. 2,M,open Z represents the impedance measurement at the second port of the open-circuit calibrator. 2,M,short Z represents the impedance measurement at the second port of the on-chip short-circuit calibrator. 1,A,open Z represents the actual impedance value of the open-circuit calibrator at the first port. 1,A,short Z represents the actual impedance value of the on-chip short-circuit calibrator at the first port. 2,A,open Z represents the actual impedance value at the second port of the open-circuit calibrator. 2,A,short This indicates the actual impedance value at the second port of the on-chip short-circuit calibrator. The actual impedance value is also the known nominal impedance value.

[0108] Based on equations (5) and (6), equations (11) and (12) are obtained as follows:

[0109]

[0110]

[0111] For the on-chip calibration component of the first port, There exists a corresponding measurement value Equation (13) can be obtained. For the on-chip calibration component of the second port, There exists a corresponding measurement value Equation (14) can be obtained as follows:

[0112]

[0113]

[0114] The proportional value Q1 in equation (15) can be obtained from equations (11) and (13), and the proportional value Q2 in equation (16) can be obtained from equations (12) and (14), as follows:

[0115]

[0116]

[0117] For the on-chip load calibration components of the first and second ports, equations (17) and (18) are obtained from equations (15) and (16), respectively, as follows:

[0118]

[0119]

[0120] Among them, Z 1,app,load Z represents the measured value at the first port of the on-chip load calibrator. 1,A,load Z represents the actual value of the on-chip load calibrator at the first port. 2,app,load Z represents the measured value at the second port of the on-chip load calibrator. 2,A,load This indicates the actual value of the on-chip load calibrator at the second port.

[0121] The measured values ​​of the on-chip load calibration components at the first and second ports are shown in equations (19) and (20), respectively, as follows:

[0122] Z 1,app,load =R 1,load +jwL 1,load (19)

[0123] Z 2,app,load =R 2,load +jwL 2,load (20)

[0124] When the reference plane is in the middle of the through-hole, the actual values ​​of the on-chip load calibration component are shown in equations (18) and (19), as follows:

[0125] Z 1,A,load =R 1,load (twenty one)

[0126] Z 2,A,load =R 2,load (twenty two)

[0127] In the embodiments of this application, the process of obtaining the first short-circuit relation (3) is as follows:

[0128] For the on-chip short-circuit calibrator at the first port, equation (23) is obtained from equation (15), as follows:

[0129]

[0130] When the reference plane is in the middle of the through, the measured value of the on-chip short-circuit calibrator at the first port is expressed by equation (24), as follows:

[0131] Z 1,app,short =R 1,short +jwL 1,short (twenty four)

[0132] Among them, L 1,short This indicates the port inductance of the short-circuit calibrator at the first port.

[0133] The actual value of the on-chip short-circuit calibrator at the first port is expressed by equation (25), as follows:

[0134] Z 1,A,short =jwL 1,short (25)

[0135] make:

[0136] real(Z 1,app,short ) = R 1,short (26)

[0137] imag(Z 1,app,short )=wL 1,short (27)

[0138] Equations (17), (19) and (23), (26), (27) yield equations (28) and (29) as follows:

[0139]

[0140]

[0141] From equation (29), the first on-chip short-circuit relationship (3) is obtained as follows:

[0142]

[0143] In the embodiments of this application, the process of obtaining the second short-circuit relation (4) is as follows:

[0144] For the on-chip short-circuit calibrator of the second port, equation (30) is obtained from equation (16) as follows:

[0145]

[0146] When the reference plane is in the middle of the through, the measured value of the on-chip short-circuit calibrator at the second port is expressed by equation (31), as follows:

[0147] Z 2,app,short =R 2,short +jwL 2,short (31)

[0148] Among them, L 2,short This indicates the port inductance of the short-circuit calibrator at the second port.

[0149] The actual value of the on-chip short-circuit calibrator at the second port is expressed by equation (32), as follows:

[0150] Z 2,A,short =jwL 2,short (32)

[0151] make:

[0152] real(Z 2,app,short ) = R 2,short (33)

[0153] imag(Z 2,app,short )=wL 2,short (34)

[0154] Equations (18), (20) and (30), (33), (34) yield equations (35) and (36) as follows:

[0155]

[0156]

[0157] From equation (53), we obtain the second on-chip short-circuit relationship (4), as follows:

[0158]

[0159] In some embodiments of this application, the "calculating the current load inductance of the on-chip load calibrator" in S102 above may include:

[0160] L load,short,1 As the actual load inductance of the on-chip load calibration device, or L load,short,2 As the actual load inductance of the on-chip load calibration device, or calculated L load,short,1 and L load,short,2 The average value is used as the actual load inductance of the on-chip load calibrator.

[0161] When the first relation only includes the first on-chip short-circuit relation, L can be... load,short,1 The current load inductance serves as the on-chip load calibration component.

[0162] When the first relation only includes the second on-chip short-circuit relation, L can be... load,short,2 The current load inductance serves as the on-chip load calibration component.

[0163] When the first relation includes the first on-chip short-circuit relation and the second on-chip short-circuit relation, calculate L. load,short,1 and L load,short,2 The average value is used as the current load inductance of the on-chip load calibrator.

[0164] This application provides at least three methods for calculating the current load inductance of the on-chip load calibrator. The calculation efficiency using a single relation is higher, and the calculation accuracy of the average value is higher. The specific method can be selected according to the actual situation.

[0165] In some embodiments of this application, for higher accuracy, the on-chip short-circuit calibrator and the on-chip open-circuit calibrator can be used together to extract the current load inductance of the on-chip load calibrator. The specific process is as follows:

[0166] After obtaining the measurements of the on-chip open-circuit calibrator, the method further includes:

[0167] Obtain the measurement values ​​of the on-chip open-circuit calibration device.

[0168] A vector network analyzer can be used to measure the on-chip open-circuit calibrator, on-chip short-circuit calibrator, and on-chip load calibrator respectively, and the measured value of the on-chip open-circuit calibrator can be calculated based on the measurement results.

[0169] For a two-port network, it includes a first port and a second port. Correspondingly, the measurements of the on-chip open-circuit calibrator can include: a first open-circuit measurement of the on-chip open-circuit calibrator at the first port, and / or a second open-circuit measurement of the on-chip open-circuit calibrator at the second port. The specific choice can be made based on the actual situation.

[0170] For example, the process of obtaining measurements from an on-chip open-circuit calibrator may include:

[0171] The on-chip S-parameter measurement system was used to measure the on-chip load calibration device, on-chip open circuit calibration device, and on-chip short circuit calibration device to obtain the on-chip load S-parameter, on-chip open circuit S-parameter, and on-chip short circuit S-parameter.

[0172] Calculate the initial eight errors of the on-chip S-parameter measurement system based on the on-chip load S-parameter, on-chip open-circuit S-parameter, and on-chip short-circuit S-parameter.

[0173] The measured values ​​of the on-chip open-circuit calibrator are calculated based on the initial eight error items.

[0174] Accordingly, the phrase "calculating the current load inductance of the on-chip load calibrator based on the load resistance value of the on-chip load calibrator and the measured value of the on-chip open-circuit calibrator" in S102 above may include:

[0175] Based on the first relation and the predetermined second relation, the current load inductance of the on-chip load calibrator is calculated according to the load resistance value of the on-chip load calibrator, the measured value of the on-chip open-circuit calibrator, and the measured value of the on-chip short-circuit calibrator.

[0176] The second relation can be expressed as equation (37), as follows:

[0177]

[0178] Among them, L load,open R represents the current load inductance of the on-chip load calibrator extracted using the on-chip open-circuit calibrator.load This represents the load resistance value of the on-chip load calibration component, real(Z). app,open ) represents the real part of the measured value of the open-circuit calibrator, imag(Z) app,open ) represents the imaginary part of the measured value of the on-chip open-circuit calibrator, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system.

[0179] In some embodiments of this application, the second relation includes at least one of the following:

[0180] The first open-circuit relation is:

[0181]

[0182] Among them, L load,open,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip open-circuit calibrator. 1,load This represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,open ) represents the real part of the first open-circuit measurement value at the first port of the open-circuit calibrator, imag(Z) 1,app,open ) represents the imaginary part of the first open-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0183] The second open-circuit relationship is:

[0184]

[0185] Among them, L load,open,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip open-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,open ) represents the real part of the second open-circuit measurement value at the second port of the open-circuit calibrator, imag(Z) 2,app,open ) represents the imaginary part of the second open-circuit measurement.

[0186] The reasoning process for the second relation in the embodiments of this application is given below:

[0187] In the embodiments of this application, the process of obtaining the first on-chip open-circuit relation (38) is as follows:

[0188] For the on-chip open-circuit calibration component of the first port, equation (40) is obtained from (15) as follows:

[0189]

[0190] When the reference plane is in the middle of the through, the measured value of the on-chip open-circuit calibrator at the first port is expressed by equation (41), as follows:

[0191]

[0192] Among them, C 01,open This indicates the port capacitance of the open-circuit calibrator at the first port.

[0193] The actual value of the on-chip open-circuit calibrator at the first port is expressed by equation (42), as follows:

[0194]

[0195] make:

[0196] real(Z 1,app,open ) = R 1,open (43)

[0197]

[0198] Equations (14), (16) and (20), (40), (41) yield equations (45) and (46) as follows:

[0199]

[0200]

[0201] From equation (46), we obtain the first on-chip open-circuit relation (3), as follows:

[0202]

[0203] Where w = 2πf, f represents the frequency.

[0204] In the embodiments of this application, the process of obtaining the second on-chip open-circuit relation (39) is as follows:

[0205] For the on-chip open-circuit calibration component of the second port, equation (47) is obtained from equation (16), as follows:

[0206]

[0207] When the reference plane is in the middle of the through, the on-chip open-circuit calibration measurement of the second port is expressed as Equation (48), as follows:

[0208]

[0209] Among them, C 02,open This indicates the port capacitance at the second port of the on-chip open-circuit calibrator.

[0210] The actual value of the on-chip open-circuit calibrator at the second port is expressed by equation (49), as follows:

[0211]

[0212] make:

[0213] real(Z 2,app,open ) = R 2,open (50)

[0214]

[0215] Equations (18), (20) and (30), (33), (34) yield equations (52) and (53) as follows:

[0216]

[0217]

[0218] From equation (53), we obtain the second on-chip open-circuit relation (39), as follows:

[0219]

[0220] The above is the derivation process of obtaining the first on-chip open-circuit relation (38) and the second on-chip open-circuit relation (39) provided in the embodiments of this application. The current load inductance of the on-chip load calibrator can be extracted according to the equations (38) and / or (39).

[0221] The embodiments of this application extract the current load inductance of the on-chip load calibration device by pre-deriving the first relation, namely the first on-chip open-circuit relation and the second on-chip open-circuit relation. The calculation is convenient and fast, which can improve the calibration efficiency of the on-chip S-parameter measurement system.

[0222] In some embodiments of this application, the "calculating the current load inductance of the on-chip load calibrator" in S102 above may include:

[0223] Will As the current load inductance of the on-chip load calibration device, or to As the current load inductance of the on-chip load calibrator, or to calculate L load,open,1 L load,open,2 L load,short,1 and L load,short,2 The average value is used as the current load inductance of the on-chip load calibrator.

[0224] When the first relation only includes the first on-chip open-circuit relation, and the second relation only includes the first on-chip short-circuit relation, then... The current load inductance serves as the on-chip load calibration component.

[0225] When the first relation only includes the second on-chip open-circuit relation, and the second relation only includes the second on-chip short-circuit relation, then... The current load inductance serves as the on-chip load calibration component.

[0226] When the first relation includes a first on-chip open-circuit relation and a second on-chip open-circuit relation, and the second relation includes a first on-chip short-circuit relation and a second on-chip open-circuit relation, calculate L. load,open,1 L load,open,2 L load,short,1 and L load,short,2 The average value is used as the current load inductance of the on-chip load calibrator.

[0227] Furthermore, it may also include: when the first relation only includes the first on-chip open-circuit relation, and the second relation only includes the second on-chip short-circuit relation, then... As the current load inductance of the on-chip load calibration device. When the first relationship includes only the second on-chip open-circuit relationship, and the second relationship includes only the first on-chip short-circuit relationship, then... The current load inductance serves as the on-chip load calibration component. The specific inductance can be selected based on actual conditions, and will not be elaborated upon in the embodiments of this application.

[0228] In some embodiments of this application, the load inductance calculated by the second relation can also be used as the current load inductance of the on-chip calibration device. For example, L can be... load,open,1 As the current load inductance of the on-chip load calibration device, or L load,open,2 As the current load inductance of the on-chip load calibration device, or to The current load inductance is used as the on-chip load calibration component. The specific inductance can be selected based on the actual situation.

[0229] As the frequency changes, the load inductance exhibits a frequency response, and averaging the inductance within a frequency band can reduce the impact introduced by the frequency response. Therefore, in some embodiments of this application, the "calculating the current load inductance of the on-chip load calibrator" in S102 above may further include:

[0230] The average value of the load inductance within the preset frequency band is taken as the load inductance of the load calibration device.

[0231] Right now:

[0232] Among them, L oad Indicates the load inductance of the on-chip load calibration device, L1, L2, ..., L n This represents the extracted load inductance value at various frequency points within a preset frequency band. The preset frequency band can be a band above 2GHz, and can be selected according to the actual situation.

[0233] This application embodiment calculates the average value of the load inductance within a preset frequency band as the current load inductance of the on-chip calibration component. Then, considering the influence of the pressure pin position on the on-chip load calibration component, it comprehensively considers the influence of frequency, making the calculation results more accurate and further improving the accuracy of the measurement of the device under test.

[0234] For example, see Figure 6 This illustrates the measurement results of parameter S21 provided in an embodiment of this application. See also... Figure 7 It shows the measurement results of the S11 parameter provided in the embodiments of this application.

[0235] A 10dB attenuator was selected as the device under test. The same on-chip S-parameter measurement system was calibrated in the 100MHz to 67GHz frequency band using the load inductance value extracted by the method provided in the embodiments of this application and the LRRM calibration method of the prior art. After calibration, the same 10dB attenuator was measured to obtain the S-parameters of the reference surface at the probe end, and the measurement results were compared.

[0236] like Figure 6 and Figure 5 As shown in the figure, 10dB_WINCAL(S21) / 10dB_WINCAL(S11) represents the measurement result of WINCAL; 10dB_1(S21) / 10dB_1(S11) represents the measurement result of extracting the load inductance using the on-chip open-circuit calibration device at the first port, that is, the load inductance is: L load,open,1 ; 10dB_2(S21) / 10dB_2(S11) represents the measurement result of the load inductance extracted using the on-chip short-circuit calibration device at the first port, i.e., the load inductance is: L load,short,1 ; 10dB_3(S21) / 10dB_3(S11) represents the measurement result of the load inductance extracted using the on-chip open-circuit calibrator and on-chip short-circuit calibrator at the first port, i.e., the load inductance is: 10dB_4(S21) / 10dB_4(S11) represents the measurement result of the load inductance extracted using the on-chip open-circuit calibration device at the second port, i.e., the load inductance is: L load,open,2 ; 10dB_5(S21) / 10dB_5(S11) represents the measurement result of the load inductance extracted using the on-chip short-circuit calibration device at the second port, i.e., the load inductance is: L load,short,2 ; 10dB_6(S21) / 10dB_6(S11) represents the measurement result of the load inductance extracted using the on-chip open-circuit calibrator and on-chip short-circuit calibrator at the second port, i.e., the load inductance is: 10dB_7(S21) / 10dB_7(S11) represents the measurement result of the load inductance extracted using the on-chip open-circuit calibration device at the first and second ports, i.e., the load inductance is: L load,open,1and L load,open,2 The average value; 10dB_8(S21) / 10dB_8(S11) represents the measurement result of the load inductance extracted using the on-chip short-circuit calibration device of the first and second ports, that is, the load inductance is: L load,short,1 and L load,short,2 The average value;

[0237] according to Figure 6 and Figure 7 The results show that the method provided in this application embodiment has a maximum transmission amplitude deviation of 0.15 dB and a maximum reflection amplitude deviation of 0.08 dB compared to the measurement of the same 10 dB attenuator using WinCAL software. The real-time extraction method for load inductance in this invention is reasonable and meets the requirements for on-chip S-parameter calibration and testing.

[0238] This application first calculates the ratio of the measured value to the actual value based on the reference plane of the on-chip open-circuit calibrator or the on-chip short-circuit calibrator when it is in the middle of the through circuit. Then, the load inductance value extracted in real time during on-chip S-parameter calibration is calculated using the S-parameter measurements of the on-chip open-circuit calibrator, the on-chip short-circuit calibrator, and the DC resistance measurement of the on-chip load calibrator. Finally, the average load inductance value within the frequency band is taken to reduce the influence introduced by the frequency response. This enables accurate measurement of the device under test (DUT) while achieving good performance indicators, meeting the requirements of on-chip S-parameter calibration and testing, and has certain economic and social benefits.

[0239] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0240] The following are device embodiments of this application. For details not described in detail, please refer to the corresponding method embodiments described above.

[0241] Figure 8 The diagram shows a schematic of the device for extracting load inductance from on-chip S-parameters according to an embodiment of this application. For ease of explanation, only the parts relevant to the embodiment of this application are shown, and are described in detail below:

[0242] like Figure 8 As shown, the device 20 for extracting load inductance using S-parameters may include:

[0243] The first acquisition module 201 is used to acquire the measurement value of the short-circuit calibrator;

[0244] The first calculation module 202 is used to calculate the current load inductance of the on-chip load calibrator based on a predetermined first relationship, according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator.

[0245] The calibration module 203 is used to calibrate the device under test based on the current load inductance of the on-chip load calibration device.

[0246] In some embodiments of this application, the first relation includes at least one of the following;

[0247] The first on-chip short-circuit relationship is:

[0248]

[0249] Among them, L load,short,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip short-circuit calibrator. 1,load This represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,short ) represents the real part of the first short-circuit measurement value at the first port of the chip short-circuit calibrator, imag(Z) 1,app,short ) represents the imaginary part of the first short-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0250] The second short-circuit relationship in the chip is:

[0251]

[0252] Among them, L load,short,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip short-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,short ) represents the real part of the second short-circuit measurement value at the second port of the chip short-circuit calibrator, imag(Z) 2,app,short ) represents the imaginary part of the second short-circuit measurement.

[0253] In some embodiments of this application, the first calculation module 202 can also be used to calculate L load,short,1 As the actual load inductance of the on-chip load calibration device, or L load,short,2 As the actual load inductance of the on-chip load calibration device, or calculated L load,short,1 and L load,short,2 The average value is used as the actual load inductance of the on-chip load calibrator.

[0254] In some embodiments of this application, the device 20 may further include:

[0255] The second acquisition module is used to acquire the measurement value of the on-chip open-circuit calibrator after acquiring the measurement value of the short-circuit calibrator;

[0256] The second calculation module is used to calculate the current load inductance of the on-chip load calibrator based on the first relation and a predetermined second relation, according to the load resistance value of the on-chip load calibrator, the measured value of the on-chip open-circuit calibrator, and the measured value of the on-chip short-circuit calibrator.

[0257] In some embodiments of this application, the second relation includes at least one of the following:

[0258] The first open-circuit relation is:

[0259]

[0260] Among them, L load,open,1 R represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip open-circuit calibrator. 1,load This represents the load resistance value at the first port of the on-chip load calibrator, real(Z). 1,app,open ) represents the real part of the first open-circuit measurement value at the first port of the open-circuit calibrator, imag(Z) 1,app,open ) represents the imaginary part of the first open-circuit measurement, w = 2πf, where f represents the frequency of the on-chip S-parameter measurement system;

[0261] The second open-circuit relationship is:

[0262]

[0263] Among them, L load,open,2 R represents the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip open-circuit calibrator. 2,load This represents the load resistance value at the second port of the on-chip load calibrator, real(Z). 2,app,open ) represents the real part of the second open-circuit measurement value at the second port of the open-circuit calibrator, imag(Z) 2,app,open ) represents the imaginary part of the second open-circuit measurement.

[0264] In some embodiments of this application, the acquisition module 201 may include:

[0265] The measurement unit is used to measure the on-chip load calibrator, on-chip open circuit calibrator and on-chip short circuit calibrator respectively using the on-chip S-parameter measurement system to obtain the on-chip load S-parameter, on-chip open circuit S-parameter and on-chip short circuit S-parameter.

[0266] The first calibration unit is used to calculate the initial eight errors of the on-chip S-parameter measurement system based on the on-chip load S-parameter, on-chip open-circuit S-parameter, and on-chip short-circuit S-parameter.

[0267] The first calculation unit is used to calculate the measured values ​​of the on-chip short-circuit calibrator based on the initial eight errors.

[0268] In some embodiments of this application, the calibration module 203 may include:

[0269] The second calculation unit is used to calculate the correction of eight errors of the on-chip S-parameter measurement system based on the current load inductance of the on-chip load calibrator.

[0270] The second calibration unit is used to calibrate the test piece according to the correction of eight errors.

[0271] Figure 9 This is a schematic diagram of an electronic device provided in an embodiment of this application. Figure 9 As shown, the electronic device 30 of this embodiment includes a processor 300 and a memory 301. The memory 301 stores a computer program 302 that can run on the processor 300. When the processor 300 executes the computer program 302, it implements the steps in the above-described methods for extracting load inductance using on-chip S-parameters, for example... Figure 3 S101 to S103 are shown. Alternatively, when the processor 300 executes the computer program 302, it implements the functions of each module / unit in the above-described device embodiments, for example... Figure 8 The functions of modules 201 to 203 are shown.

[0272] For example, computer program 302 can be divided into one or more modules / units, one or more of which are stored in memory 301 and executed by processor 300 to complete this application. One or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of computer program 302 in electronic device 30. For example, computer program 302 can be divided into... Figure 8 Modules 201 to 203 are shown.

[0273] Electronic device 30 may be a computing device such as a microcontroller or controller. Electronic device 30 may include, but is not limited to, a processor 300 and a memory 301. Those skilled in the art will understand that... Figure 9 This is merely an example of electronic device 30 and does not constitute a limitation on electronic device 30. It may include more or fewer components than shown, or combine certain components, or different components. For example, electronic device may also include input / output devices, network access devices, buses, etc.

[0274] The processor 300 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0275] The memory 301 can be an internal storage unit of the electronic device 30, such as a hard disk or RAM of the electronic device 30. The memory 301 can also be an external storage device of the electronic device 30, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the electronic device 30. Furthermore, the memory 301 can include both internal and external storage units of the electronic device 30. The memory 301 is used to store computer programs and other programs and data required by the electronic device. The memory 301 can also be used to temporarily store data that has been output or will be output.

[0276] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0277] This application also provides an on-chip S-parameter measurement system, including a vector network analyzer and the electronic device 30 described above. The vector network analyzer is controlled by the electronic device 30.

[0278] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0279] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0280] In the embodiments provided in this application, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0281] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0282] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0283] If an integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium. When executed by a processor, the computer program can implement the steps of the above-described on-chip S-parameter extraction of load inductance method embodiments. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc.

[0284] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for extracting load inductance from on-chip S-parameters, characterized in that, include: Obtain the measurement values ​​of the on-chip short-circuit calibration component; Based on a predetermined first relationship, the current load inductance of the on-chip load calibrator is calculated according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator. The device under test is calibrated based on the current load inductance of the on-chip load calibration device; The first relation is: in, This represents the current load inductance of the on-chip load calibrator extracted using the on-chip short-circuit calibrator. This indicates the load resistance value of the on-chip load calibration component. This represents the real part of the measured value of the on-chip short-circuit calibrator. This represents the imaginary part of the measured value of the on-chip short-circuit calibrator. , f This indicates the frequency of the on-chip S-parameter measurement system; The first relationship is based on the impedance measurement of the on-chip load calibration device at the same port. Compared with the actual impedance value The ratio, and the impedance measurement of the on-chip short-circuit calibrator in the same port. Compared with the actual impedance value The ratio can be obtained by solving the following equations simultaneously: 。 2. The method for extracting load inductance from on-chip S-parameters according to claim 1, characterized in that, When the measurement port is the first port: The first relation is: in, This represents the current load inductance of the on-chip load calibrator extracted at the first port using the on-chip short-circuit calibrator. This represents the load resistance value of the on-chip load calibration component at the first port. This represents the real part of the first short-circuit measurement value of the on-chip short-circuit calibrator at the first port. This represents the imaginary part of the first short-circuit measurement value. , f This indicates the frequency of the on-chip S-parameter measurement system; When the measurement port is the second port: The first relation is: in, This indicates the current load inductance of the on-chip load calibrator extracted at the second port using the on-chip short-circuit calibrator. This indicates the load resistance value of the on-chip load calibration component at the second port. This represents the real part of the second short-circuit measurement value of the on-chip short-circuit calibrator at the second port. This represents the imaginary part of the second short-circuit measurement.

3. The method for extracting load inductance from on-chip S-parameters according to claim 2, characterized in that, The calculation of the current load inductance of the on-chip load calibrator includes: Will As the actual load inductance of the on-chip load calibration device, or as As the actual load inductance of the on-chip load calibration device, or calculated and The average value is used as the actual load inductance of the on-chip load calibrator.

4. The method for extracting load inductance from on-chip S-parameters according to any one of claims 1 to 3, characterized in that, The acquisition of the measurement values ​​of the on-chip short-circuit calibrator includes: The on-chip S-parameter measurement system was used to measure the on-chip load calibration device, on-chip open circuit calibration device, and on-chip short circuit calibration device respectively to obtain the on-chip load S-parameter, on-chip open circuit S-parameter, and on-chip short circuit S-parameter. Calculate the initial eight errors of the on-chip S-parameter measurement system based on the on-chip load S-parameter, the on-chip open-circuit S-parameter, and the on-chip short-circuit S-parameter; The measured values ​​of the on-chip short-circuit calibrator are calculated based on the initial eight errors.

5. The method for extracting load inductance from on-chip S-parameters according to claim 4, characterized in that, The calibration of the device under test based on the current load inductance of the on-chip load calibration device includes: Based on the current load inductance of the on-chip load calibrator, calculate the correction eight-term error of the on-chip S-parameter measurement system; The test piece is calibrated according to the eight error corrections.

6. An apparatus for extracting load inductance using on-chip S-parameters, characterized in that, include: The first acquisition module is used to acquire the measurement values ​​of the on-chip short-circuit calibration device; The first calculation module is used to calculate the current load inductance of the on-chip load calibrator based on a predetermined first relationship, according to the load resistance value of the on-chip load calibrator and the measured value of the on-chip short-circuit calibrator. The calibration module is used to calibrate the device under test based on the current load inductance of the on-chip load calibration device; The first relation is: in, This represents the current load inductance of the on-chip load calibrator extracted using the on-chip short-circuit calibrator. This indicates the load resistance value of the on-chip load calibration component. This represents the real part of the measured value of the on-chip short-circuit calibrator. This represents the imaginary part of the measured value of the on-chip short-circuit calibrator. , f This indicates the frequency of the on-chip S-parameter measurement system; The first relationship is based on the impedance measurement of the on-chip load calibration device at the same port. Compared with the actual impedance value The ratio, and the impedance measurement of the on-chip short-circuit calibrator in the same port. Compared with the actual impedance value The ratio can be obtained by solving the following equations simultaneously: 。 7. An electronic device comprising a memory and a processor, wherein the memory stores a computer program executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the on-chip S-parameter extraction of load inductance method as described in any one of claims 1 to 5.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the on-chip S-parameter extraction of load inductance method as described in any one of claims 1 to 5.

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