Tapered inductor package structure and method of making same

Abstract

This invention provides a tapered inductor packaging structure and its fabrication method, relating to the field of semiconductor packaging technology. The tapered inductor packaging structure includes a carrier chassis, an IC device, a first receiving block, a second receiving block, and a tapered inductor module. The wire bonding method avoids the use of conventional "flying wire" structures, and the tapered inductor module structure facilitates easy pick-up and automated soldering. Simultaneously, the wire bonding structure results in a smaller tapered inductor structure and a smaller final product size. Furthermore, it eliminates the need for pre-reserved terminal wires for soldering. More importantly, the angle between the tapered inductor module and the carrier chassis can be controlled by adjusting the height of the first and second receiving blocks, allowing the magnetic core to be parallel or at an angle to the carrier chassis. This enables adjustments to signal strength and isolation functions, improving product applicability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically, to a tapered inductor packaging structure and its fabrication method. Background Technology

[0002] With the development of the semiconductor industry, miniature tapered inductors, due to their combination of wide bandwidth and high-frequency performance, are increasingly being used in fields such as optical communication, bias circuits, and amplifier circuits. In microwave RF circuits, inductors are typically needed to isolate the RF circuit from the DC power supply circuit to prevent mutual interference between signals. Simultaneously, microwave RF circuits are characterized by wide bandwidth and high frequency, and ordinary inductors cannot meet the wide bandwidth requirements; therefore, tapered inductors are usually chosen. Compared to ordinary inductors, tapered inductors, due to their special geometric structure, can achieve isolation of RF signals with a certain bandwidth. Current tapered inductors use a "flying wire" structure, which presents significant difficulties in the assembly process and cannot achieve automated soldering. Furthermore, existing tapered inductors, due to limitations in wire material and magnetic core, employ a wire-wound tapered inductor structure, resulting in a larger size and a larger final product. Moreover, the wire-wound extension method of tapered inductors requires pre-reserved terminal wires to ensure soldering at both ends. The soldering height cannot be precisely controlled, forcing them to be mounted directly flat on the substrate during installation, making it impossible to adjust the angle of the tapered inductor according to actual conditions, thus limiting signal strength and isolation capabilities. Summary of the Invention

[0003] The present invention aims to provide, for example, a tapered inductor packaging structure and its fabrication method, which allows for precise control of the mounting height and angle of the tapered inductor structure. This facilitates adjustment of the tapered inductor angle according to actual conditions, thereby adjusting signal strength and improving isolation functionality. Furthermore, the use of wire bonding to form the coil simplifies assembly, reduces size, eliminates the need for pre-installed terminal wires, and solves the problem of manually fabricating / soldering coils.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In one aspect, embodiments of the present invention provide a tapered inductor packaging structure, comprising:

[0006] Load-bearing chassis;

[0007] IC devices mounted on the supporting chassis;

[0008] The first and second receiving rubber blocks are installed on the supporting chassis;

[0009] A tapered inductor module is disposed on the first receiving adhesive block and the second receiving adhesive block;

[0010] The conical inductor module is electrically connected to the IC device and has a built-in magnetic core. The side of the conical inductor module closest to the support chassis has multiple first inductor arcs formed by wire bonding, and the side of the conical inductor module furthest from the support chassis has multiple second inductor arcs formed by wire bonding. The multiple first inductor arcs and the multiple second inductor arcs are electrically connected to each other, forming a conical coil structure around the magnetic core. The first and second receiving adhesive blocks are used to control the angle between the conical inductor module and the support chassis, so that the magnetic core is parallel to or at an angle to the support chassis.

[0011] In an optional embodiment, the supporting chassis is provided with a receiving groove, the IC device is spaced apart from the receiving groove, the first receiving adhesive block and the second receiving adhesive block are respectively disposed at both ends of the receiving groove, and a plurality of first inductor wire arcs are accommodated in the receiving groove.

[0012] In an optional embodiment, the tapered inductor module includes a first inductor module and a second inductor module. The first inductor module is disposed across the receiving groove and on the first and second receiving adhesive blocks. The first inductor module has a plurality of opposite first conductive terminals on the side near the supporting chassis. A plurality of first inductor wire arcs are staggered and connected to the plurality of first conductive terminals. The length of the plurality of first inductor wire arcs gradually increases along the direction near the first receiving adhesive block.

[0013] The second inductor module is attached to the first inductor module, and the second inductor module has a plurality of pairs of opposite second conductive terminals on the side away from the supporting chassis. The plurality of second inductor wire arcs are staggered and connected to the plurality of second conductive terminals, and the length of the plurality of second inductor wire arcs gradually increases along the direction closer to the first receiving adhesive block.

[0014] The magnetic core is disposed between the first inductor module and the second inductor module. Multiple first conductive terminals correspond one-to-one with multiple second conductive terminals and are electrically connected to each other. The second conductive terminals located at both ends of the second inductor module are electrically connected to the IC device through a first connecting line arc.

[0015] In an optional embodiment, the first inductor module is provided with a plurality of first conductive pillars, and the plurality of first conductive pillars are provided in a one-to-one correspondence with a plurality of first conductive terminals. One end of each first conductive pillar is connected to the corresponding first conductive terminal, and the other end extends through to the surface of the first inductor module that is joined with the second inductor module.

[0016] The second inductor module is provided with a plurality of second conductive pillars, and the plurality of second conductive pillars are provided one-to-one with a plurality of second conductive terminals. One end of each second conductive pillar is connected to the corresponding second conductive terminal, and the other end extends through to the surface of the second inductor module that is joined with the first inductor module.

[0017] In this configuration, a plurality of the first conductive posts are connected and electrically linked to a plurality of the second conductive posts in a one-to-one correspondence.

[0018] In an optional embodiment, the first inductor module is provided with a first placement groove on the side away from the supporting chassis, and the second inductor module is provided with a second placement groove on the side closer to the supporting chassis. The first placement groove and the second placement groove are provided correspondingly, and the magnetic core is simultaneously embedded in the first placement groove and the second placement groove.

[0019] In an optional embodiment, the magnetic core includes two sub-magnetic blocks, which are respectively embedded in the first placement slot and the second placement slot, and the two sub-magnetic blocks are in contact with each other.

[0020] In an optional embodiment, the first inductor module is further provided with a first connecting guide plate at both ends of one side surface near the supporting chassis. The first connecting guide plate is connected to the first conductive terminal located at the end. A second connecting guide plate is also embedded in the first receiving adhesive block and the second receiving adhesive block. The second connecting guide plate is electrically connected to the first connecting guide plate, and a second connecting arc is also connected to the second connecting guide plate. The second connecting arc is electrically connected to the IC device.

[0021] In an optional embodiment, a third conductive post is provided in the support chassis, the third conductive post is disposed around the IC device, and a third connecting arc is provided on the third conductive post, the third connecting arc being connected to the IC device so that the IC device is electrically connected to the support chassis.

[0022] In an optional embodiment, the tapered inductor package structure further includes a molding compound disposed on the carrier chassis and covering the IC device, the tapered inductor module, the first inductor arc, and the second inductor arc.

[0023] In another aspect, embodiments of the present invention provide a method for fabricating a tapered inductor package structure, used to fabricate the aforementioned tapered inductor package structure, the method comprising:

[0024] Provide a load-bearing chassis;

[0025] A first receiving rubber block and a second receiving rubber block are formed on the supporting chassis;

[0026] IC devices are mounted on the carrier chassis;

[0027] A tapered inductor module is mounted on the first receiving adhesive block and the second receiving adhesive block;

[0028] The conical inductor module is electrically connected to the IC device and has a built-in magnetic core. The side of the conical inductor module closest to the support chassis has multiple first inductor arcs formed by wire bonding, and the side of the conical inductor module furthest from the support chassis has multiple second inductor arcs formed by wire bonding. The multiple first inductor arcs and the multiple second inductor arcs are electrically connected to each other, forming a conical coil structure around the magnetic core. The first and second receiving adhesive blocks are used to control the angle between the conical inductor module and the support chassis, so that the magnetic core is parallel to or at an angle to the support chassis.

[0029] The beneficial effects of the embodiments of the present invention include, for example:

[0030] The conical inductor packaging structure and its fabrication method provided in this invention form a conical coil structure by attaching a first inductor arc and a second inductor arc to both sides of the conical inductor module. This, combined with a magnetic core, forms a conical inductor structure. The wire-attaching method avoids the use of conventional "flying wire" structures, and the conical inductor module structure facilitates easy pick-up and automated soldering. Simultaneously, the wire-attaching structure results in a smaller volume of the conical inductor structure and a smaller final product size. Furthermore, no pre-existing terminal wires are required for soldering. More importantly, a first and second receiving adhesive block are placed on the carrier chassis, and the two ends of the conical inductor module are respectively positioned on the first and second receiving adhesive blocks. The angle between the conical inductor module and the carrier chassis is controlled by adjusting the height of the first and second receiving adhesive blocks, allowing the magnetic core to be parallel or at an angle to the carrier chassis. This enables adjustments to signal strength and isolation functions, improving product applicability. Compared to existing technologies, the tapered inductor packaging structure and its fabrication method provided in this invention can precisely control the mounting height and angle of the tapered inductor structure, thereby facilitating adjustment of the tapered inductor angle according to actual conditions, adjusting signal strength, and improving isolation functionality. Furthermore, the use of wire bonding to form the coil simplifies assembly, reduces size, eliminates the need for pre-reserved terminal wires, and solves the problem of manually fabricating / soldering coils. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is an internal structural diagram of the tapered inductor packaging structure provided in an embodiment of the present invention from a first-view perspective.

[0033] Figure 2 This is a schematic diagram of the tapered inductor packaging structure provided in an embodiment of the present invention from a second perspective.

[0034] Figure 3 A schematic diagram of the tapered inductor packaging structure provided in an embodiment of the present invention from a third-view perspective;

[0035] Figures 4 to 6 A process flow diagram illustrating the fabrication method of the tapered inductor packaging structure provided in this embodiment of the invention.

[0036] Icons: 100 - Conical inductor package structure; 110 - Support chassis; 111 - Receiving groove; 130 - IC device; 131 - First connecting arc; 133 - Second connecting arc; 135 - Third connecting arc; 150 - First receiving block; 170 - Second receiving block; 180 - Molded enclosure; 190 - Conical inductor module; 191 - Magnetic core; 193 - First inductor arc; 195 - Second inductor arc; 197 - First inductor module; 1971 - First conductive post; 1973 - First connecting guide plate; 1975 - Second connecting guide plate; 199 - Second inductor module; 1991 - Second conductive post. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0041] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0042] As disclosed in the background art, the existing tapered inductors typically employ a "flying wire" structure, which uses copper wire spirally wound around a magnetic core to form a tapered coil. This usually requires pre-fabrication, and because the resulting tapered inductor structure is irregularly shaped, it is difficult to automatically pick up by the pick-up or gripping device of the mounting machine, thus making automatic soldering impossible. The conventional method is to manually solder the tapered inductor onto the substrate.

[0043] In addition, due to the wire, magnetic core and operating method, the existing wire-wound tapered inductor needs to be wound around the perimeter, which makes its overall volume larger and the final product larger, making it inconvenient to install.

[0044] Furthermore, conventional tapered inductors are manufactured using a wire-wound method, with the coil exposed. This makes them prone to damage and deformation during packaging and transportation, which affects the yield when mounted on a substrate.

[0045] Finally, conventional tapered inductors are manufactured using a wire-wound method, which requires pre-reserved end wires at both ends for easy soldering. This further increases the size of the tapered inductor and complicates the soldering process.

[0046] To address the aforementioned problems, this invention provides a novel conical inductor packaging structure and its fabrication method. It should be noted that, unless otherwise specified, the features in the embodiments of this invention can be combined with each other. Specific Implementation

[0048] See Figures 1 to 3This embodiment provides a tapered inductor packaging structure 100, which can precisely control the mounting height and angle of the tapered inductor structure, thereby facilitating the adjustment of the tapered inductor angle according to actual conditions, adjusting the signal strength, and improving the isolation function. Furthermore, the use of wire bonding to form the coil simplifies assembly, reduces size, eliminates the need for pre-reserved terminal wires, and solves the problem of manually fabricating / soldering coils.

[0049] The present invention provides a conical inductor packaging structure 100, comprising a support chassis 110, an IC device 130, a first receiving block 150, a second receiving block 170, and a conical inductor module 190. The IC device 130 is mounted on the support chassis 110. The first and second receiving blocks 150 and 170 are spaced apart on the support chassis 110. The two ends of the conical inductor module 190 are respectively mounted on the first and second receiving blocks 150 and 170. The conical inductor module 190 is electrically connected to the IC device 130 and contains a built-in magnetic core 191. The inductor module 190 has multiple first inductor arcs 193 formed by wire bonding on the side near the support chassis 110, and the tapered inductor module 190 has multiple second inductor arcs 195 formed by wire bonding on the side away from the support chassis 110. The multiple first inductor arcs 193 and multiple second inductor arcs 195 are electrically connected to each other and form a tapered coil structure around the magnetic core 191. The first receiving block 150 and the second receiving block 170 are used to control the angle between the tapered inductor module 190 and the support chassis 110 so that the magnetic core 191 is parallel to or at an angle to the support chassis 110.

[0050] In this embodiment, wiring is pre-completed on the carrier chassis 110. The IC device 130 can be a chip, which can be mounted upright on the carrier chassis 110 or flipped on the carrier chassis 110 and electrically connected to the wiring layer of the carrier chassis 110.

[0051] It should be noted that in this embodiment, a tapered coil structure is formed by wiring a first inductor arc 193 and a second inductor arc 195 on both sides of the tapered inductor module 190. This, combined with the magnetic core 191, forms a tapered inductor structure. The wiring method avoids the use of conventional "flying wire" structures. Furthermore, the tapered inductor module 190 structure facilitates pick-up and enables automated soldering. Simultaneously, the wiring structure results in a smaller tapered inductor structure and a smaller final product size. Moreover, no pre-existing terminal wires are required for soldering. More importantly, a first receiving block 150 and a second receiving block 170 are provided on the support chassis 110, and the two ends of the tapered inductor module 190 are respectively provided on the first receiving block 150 and the second receiving block 170. The angle between the tapered inductor module 190 and the support chassis 110 is controlled by adjusting the height of the first receiving block and the second receiving block, so that the magnetic core 191 is parallel to or at an angle to the support chassis 110, thereby realizing the adjustment of signal strength and isolation function, and making the product more applicable.

[0052] In this embodiment, the first and second receiving adhesive blocks are at the same height, thus keeping the magnetic core 191 parallel to the supporting chassis 110. The first and second receiving adhesive blocks also serve to fix and bond the tapered inductor module 190, ensuring its secure fixation and facilitating subsequent encapsulation. Of course, in other preferred embodiments of the invention, the offset angle of the tapered inductor module 190 can be adjusted by varying the heights of the first and second receiving adhesive blocks, thereby adjusting the signal strength and isolation function.

[0053] In this embodiment, a receiving groove 111 is provided on the carrier chassis 110. The IC device 130 is spaced apart from the receiving groove 111. The first receiving adhesive block 150 and the second receiving adhesive block 170 are respectively disposed at both ends of the receiving groove 111. Multiple first inductor arcs 193 are accommodated in the receiving groove 111. Specifically, by providing the receiving groove 111 on the carrier chassis 110, multiple first inductor arcs 193 can be accommodated, thereby embedding part of the coil of the tapered inductor inside the carrier chassis 110, thereby reducing the package size of the tapered inductor and realizing product miniaturization.

[0054] In this embodiment, the tapered inductor module 190 includes a first inductor module 197 and a second inductor module 199. The first inductor module 197 is disposed across the receiving groove 111 and on the first receiving adhesive block 150 and the second receiving adhesive block 170. The first inductor module 197 has a plurality of first conductive terminals that are opposite to each other on the side near the supporting chassis 110. A plurality of first inductor arcs 193 are staggered and connected to the plurality of first conductive terminals, and the length of the plurality of first inductor arcs 193 gradually increases along the direction near the first receiving adhesive block 150.

[0055] The second inductor module 199 is attached to the first inductor module 197, and the second inductor module 199 has a plurality of pairs of opposite second conductive terminals on the side away from the supporting chassis 110. A plurality of second inductor arcs 195 are staggered and connected to the plurality of second conductive terminals, and the length of the plurality of second inductor arcs 195 gradually increases along the direction close to the first receiving adhesive block 150.

[0056] The magnetic core 191 is disposed between the first inductor module 197 and the second inductor module 199. Multiple first conductive terminals correspond one-to-one with multiple second conductive terminals and are electrically connected to each other. The second conductive terminals located at both ends of the second inductor module 199 are electrically connected to the IC device 130 through the first connecting line arc 131.

[0057] It should be noted that the first inductor module 197 and the second inductor module 199 have the same structure and shape. At the same time, the first inductor module 197 and the first inductor arc 193 can be pre-formed by wire bonding, and the second inductor arc 195 can also be pre-formed by wire bonding. When forming the tapered inductor, the first inductor module 197 or the second inductor module 199 can be picked up by a pick-up device to realize the stacking and forming of the tapered inductor module 190.

[0058] It is worth noting that in this embodiment, the plurality of first inductor arcs 193 and the plurality of second inductor arcs 195 are spirally distributed, so that the first inductor arcs 193 and the second inductor arcs 195 on the upper and lower sides can surround the magnetic core 191 to form a tapered inductor structure.

[0059] In this embodiment, a plurality of first conductive posts 1971 are provided in the first inductor module 197. The plurality of first conductive posts 1971 are provided one-to-one with a plurality of first conductive terminals. One end of each first conductive post 1971 is connected to the corresponding first conductive terminal, and the other end extends through to the surface of the first inductor module 197 that is joined with the second inductor module 199.

[0060] In this embodiment, the second inductor module 199 is provided with a plurality of second conductive posts 1991, and the plurality of second conductive posts 1991 are provided one-to-one with a plurality of second conductive terminals. One end of each second conductive post 1991 is connected to the corresponding second conductive terminal, and the other end extends through to the surface of the second inductor module 199 that is joined with the first inductor module 197.

[0061] Among them, a plurality of first conductive posts 1971 are connected and electrically connected to a plurality of second conductive posts 1991 in a one-to-one correspondence.

[0062] It should be noted that in this embodiment, the multiple first conductive pillars 1971 and the multiple second conductive pillars 1991 are all made of copper pillars. The copper pillar structure runs through both ends of the first inductor module 197 and the second inductor module 199. Specifically, the copper pillars can be formed by electroplating copper layers after laser grooving, thereby forming conductive endpoints on one side and island conductive pads on the other side, which facilitates the mutual electrical connection between the first conductive pillars 1971 and the second conductive pillars 1991.

[0063] In this embodiment, a first placement groove is provided on the side of the first inductor module 197 away from the supporting chassis 110, and a second placement groove is provided on the side of the second inductor module 199 close to the supporting chassis 110. The first and second placement grooves are correspondingly arranged, and the magnetic core 191 is simultaneously embedded in both the first and second placement grooves. Specifically, by providing the first and second placement grooves, the magnetic core 191 can be placed reasonably, preventing displacement of the magnetic core 191.

[0064] In this embodiment, the magnetic core 191 includes two sub-magnetic blocks, which are respectively embedded in the first placement slot and the second placement slot, and the two sub-magnetic blocks are in contact with each other. Specifically, the two sub-magnetic blocks are respectively disposed on the first inductor module 197 and the second inductor module 199. At the same time, the stacking of the first inductor module 197 and the second inductor module 199 can realize the mounting of the two sub-magnetic blocks, which can significantly improve the magnetic induction intensity of the tapered inductor, thereby improving the performance of the tapered inductor.

[0065] In this embodiment, a first connecting guide plate 1973 is provided at both ends of the side surface of the first inductor module 197 near the support chassis 110. The first connecting guide plate 1973 is connected to a first conductive terminal located at the end. A second connecting guide plate 1975 is also embedded in the first receiving block 150 and the second receiving block 170. The second connecting guide plate 1975 is electrically connected to the first connecting guide plate 1973, and a second connecting arc 133 is also connected to the second connecting guide plate 1975. The second connecting arc 133 is electrically connected to the IC device 130. Specifically, both the first connecting guide plate 1973 and the second connecting guide plate 1975 can be copper plates, thereby achieving good electrical connection function and realizing the electrical connection between the first inductor module 197 and the support chassis 110.

[0066] In this embodiment, a third conductive post is provided in the support chassis 110. The third conductive post is disposed around the IC device 130, and a third connecting arc 135 is provided on the third conductive post. The third connecting arc 135 is connected to the IC device 130 to electrically connect the IC device 130 to the support chassis 110. Specifically, by providing the third conductive post, an electrical connection between the IC device 130 and the support chassis 110 can be achieved. Of course, in other preferred embodiments of the present invention, the IC device 130 can also adopt a flip-chip structure, directly maintaining an electrical connection with the support chassis 110 through solder pads.

[0067] Furthermore, the tapered inductor package structure 100 also includes a molding compound 180, which is disposed on the support chassis 110 and covers the IC device 130, the tapered inductor module 190, the first inductor arc 193, and the second inductor arc 195. Specifically, by providing the molding compound 180, the tapered inductor structure can be completely enclosed, preventing the coil from being exposed and providing good support, effectively protecting the coil. Furthermore, by stacking the IC device 130 on the support chassis 110, a package-level tapered inductor structure can be realized, which has more functions and is smaller in size.

[0068] This invention also provides a method for fabricating a tapered inductor package structure 100, which includes the following steps:

[0069] S1: Provide a load-bearing chassis 110.

[0070] Specifically, a pre-wired carrier chassis 110 can be provided, on which electrical connections can be achieved through multiple pad structures.

[0071] S2: A first receiving rubber block 150 and a second receiving rubber block 170 are formed on the supporting chassis 110.

[0072] See also Figure 4 Specifically, a groove can first be carved into the supporting chassis 110 to form a receiving groove 111, and then a first receiving adhesive block 150 and a second receiving adhesive block 170 can be formed at both ends of the receiving groove 111 by dispensing adhesive. The heights of the first receiving adhesive block 150 and the second receiving adhesive block 170 can be the same or different.

[0073] S3: Mount IC devices 130 on the support chassis 110.

[0074] See also Figure 5Specifically, the IC device 130 can be mounted and fixed using adhesives or other adhesive layers. The IC device 130 can be mounted upright, and the third conductive post can be pre-fabricated in the carrier chassis 110, with the pad structure exposed on the surface of the carrier chassis 110 to facilitate subsequent wire bonding for electrical connection between the IC device 130 and the carrier chassis 110.

[0075] S4: Mount the tapered inductor module 190 on the first and second receiving adhesive blocks 170.

[0076] See also Figure 6 and Figure 1 Specifically, before mounting the tapered inductor module 190, the first inductor module 197 can be prepared in advance, and wire bonding can be completed on the first inductor module 197 to form the first inductor wire arc 193.

[0077] In actual mounting, the first inductor module 197 can be first mounted on the first and second receiving adhesive blocks, with the first inductor arc 193 facing downwards and accommodated in the receiving groove 111. Then, the second inductor module 199 is mounted on the first inductor module 197. Electrical contact is achieved by the mutual contact of the first conductive post 1971 and the second conductive post 1991, thereby forming a tapered inductor module 190. The tapered inductor module 190 is electrically connected to the IC device 130 and has a built-in magnetic core 191.

[0078] It should be noted that both the first inductor module 197 and the second inductor module 199 have a built-in magnetic core 191 beforehand, so that the built-in magnetic core 191 is achieved after the second inductor module 199 is mounted.

[0079] After mounting the second inductor module 199, the second inductor arc 195 can be wired onto the second inductor module 199, and simultaneously the first connecting arc 131 and the second connecting arc 133 can be wired, thus completing the electrical connection at each point. On the final conical inductor module 190, multiple first inductor arcs 193 formed by wire bonding are provided on the side near the supporting chassis 110, and multiple second inductor arcs 195 formed by wire bonding are provided on the side of the conical inductor module 190 away from the supporting chassis 110. The multiple first inductor arcs 193 and multiple second inductor arcs 195 are electrically connected to each other, forming a conical coil structure around the magnetic core 191. The first receiving adhesive block 150 and the second receiving adhesive block 170 are used to control the angle between the conical inductor module 190 and the supporting chassis 110, so that the magnetic core 191 is parallel to or at an angle to the supporting chassis 110.

[0080] S5: Form a plastic seal 180 on the load-bearing chassis 110.

[0081] Please continue reading Figure 2 After the stitching is completed, a plastic sealer is used to form a plastic seal 180 on the support chassis 110, which encapsulates multiple components.

[0082] This embodiment provides a conical inductor packaging structure 100 and its fabrication method. By attaching first inductor arcs 193 and second inductor arcs 195 to both sides of the conical inductor module 190, a conical coil structure is formed. This, combined with the magnetic core 191, forms a conical inductor structure. The wire-attaching method avoids the use of conventional "flying wire" structures. Furthermore, the conical inductor module 190 structure facilitates easy pick-up and allows for automated soldering. Simultaneously, the wire-attaching structure results in a smaller volume of the conical inductor structure and a smaller final product size. Moreover, no pre-existing terminal wires are required for soldering. More importantly, a first receiving block 150 and a second receiving block 170 are provided on the supporting chassis 110, and the two ends of the tapered inductor module 190 are respectively set on the first receiving block 150 and the second receiving block 170. The angle between the tapered inductor module 190 and the supporting chassis 110 is controlled by adjusting the height of the first and second receiving blocks, so that the magnetic core 191 is parallel to or at an angle to the supporting chassis 110, thereby realizing the adjustment of signal strength and isolation function, and improving the applicability of the product. Compared with the prior art, the tapered inductor packaging structure 100 and its preparation method provided in this embodiment can precisely control the installation height and installation angle of the tapered inductor structure, so as to facilitate the adjustment of the tapered inductor angle according to the actual situation, adjust the signal strength and improve the isolation function. Furthermore, the use of wire bonding to form the coil makes assembly simple, the size small, and eliminates the need for pre-reserved terminal wires, solving the problem of manual coil making / soldering.

[0083] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A structure for a conical inductor package, characterized by include: Load-bearing chassis; IC devices mounted on the supporting chassis; The first and second receiving rubber blocks are installed on the supporting chassis; A tapered inductor module is disposed on the first receiving adhesive block and the second receiving adhesive block; The conical inductor module is electrically connected to the IC device and has a built-in magnetic core. The side of the conical inductor module closest to the support chassis has multiple first inductor arcs formed by wire bonding, and the side of the conical inductor module furthest from the support chassis has multiple second inductor arcs formed by wire bonding. The multiple first inductor arcs and the multiple second inductor arcs are electrically connected to each other and form a conical coil structure around the magnetic core. The first and second receiving adhesive blocks are used to control the angle between the conical inductor module and the support chassis, so that the magnetic core is parallel to or at an angle to the support chassis. The supporting chassis is provided with a receiving groove, the IC device is spaced apart from the receiving groove, the first receiving adhesive block and the second receiving adhesive block are respectively provided at both ends of the receiving groove, and a plurality of first inductor wire arcs are received in the receiving groove; The tapered inductor module includes a first inductor module and a second inductor module. The first inductor module is transversely disposed on the receiving groove and disposed on the first receiving adhesive block and the second receiving adhesive block. The first inductor module has a plurality of first conductive terminals that are opposite to each other on the side near the supporting chassis. A plurality of first inductor wire arcs are staggered and connected to the plurality of first conductive terminals. The length of the plurality of first inductor wire arcs gradually increases along the direction near the first receiving adhesive block. The second inductor module is attached to the first inductor module, and the second inductor module has a plurality of pairs of opposite second conductive terminals on the side away from the supporting chassis. The plurality of second inductor wire arcs are staggered and connected to the plurality of second conductive terminals, and the length of the plurality of second inductor wire arcs gradually increases along the direction closer to the first receiving adhesive block.

2. The structure of claim 1, wherein, The magnetic core is disposed between the first inductor module and the second inductor module. Multiple first conductive terminals correspond one-to-one with multiple second conductive terminals and are electrically connected to each other. The second conductive terminals located at both ends of the second inductor module are electrically connected to the IC device through a first connecting line arc.

3. The structure of claim 2, wherein The first inductor module is provided with a plurality of first conductive pillars, and the plurality of first conductive pillars are provided one-to-one with a plurality of first conductive terminals. One end of each first conductive pillar is connected to the corresponding first conductive terminal, and the other end extends through to the surface of the first inductor module that is joined with the second inductor module. The second inductor module is provided with a plurality of second conductive pillars, and the plurality of second conductive pillars are provided one-to-one with a plurality of second conductive terminals. One end of each second conductive pillar is connected to the corresponding second conductive terminal, and the other end extends through to the surface of the second inductor module that is joined with the first inductor module. In this configuration, a plurality of the first conductive posts are connected and electrically linked to a plurality of the second conductive posts in a one-to-one correspondence.

4. The structure of claim 2, wherein The first inductor module has a first placement slot on the side away from the supporting chassis, and the second inductor module has a second placement slot on the side closer to the supporting chassis. The first placement slot and the second placement slot are arranged correspondingly, and the magnetic core is embedded in both the first placement slot and the second placement slot.

5. The structure of claim 4, wherein, The magnetic core includes two sub-magnetic blocks, which are respectively embedded in the first placement slot and the second placement slot, and the two sub-magnetic blocks are in contact with each other.

6. The structure of claim 2, wherein The first inductor module is provided with first connecting guide plates at both ends of one side surface near the supporting chassis. The first connecting guide plates are connected to the first conductive endpoints located at the ends. The first receiving adhesive block and the second receiving adhesive block are also embedded with second connecting guide plates. The second connecting guide plates are electrically connected to the first connecting guide plates, and the second connecting guide plates are also connected with second connecting arcs. The second connecting arcs are electrically connected to the IC device.

7. The structure of claim 1, wherein The supporting chassis is provided with a third conductive post, which is arranged around the IC device, and a third connecting arc is provided on the third conductive post. The third connecting arc is connected to the IC device so that the IC device is electrically connected to the supporting chassis.

8. The tapered inductor packaging structure according to claim 1, characterized in that, The tapered inductor packaging structure also includes a molding compound, which is disposed on the carrier chassis and covers the IC device, the tapered inductor module, the first inductor arc, and the second inductor arc.

9. A method for fabricating a tapered inductor package structure, used to fabricate the tapered inductor package structure as described in any one of claims 1-8, characterized in that, include: Provide a load-bearing chassis; A first receiving rubber block and a second receiving rubber block are formed on the supporting chassis; IC devices are mounted on the carrier chassis; A tapered inductor module is mounted on the first receiving adhesive block and the second receiving adhesive block; The conical inductor module is electrically connected to the IC device and has a built-in magnetic core. The side of the conical inductor module closest to the support chassis has multiple first inductor arcs formed by wire bonding, and the side of the conical inductor module furthest from the support chassis has multiple second inductor arcs formed by wire bonding. The multiple first inductor arcs and the multiple second inductor arcs are electrically connected to each other, forming a conical coil structure around the magnetic core. The first and second receiving adhesive blocks are used to control the angle between the conical inductor module and the support chassis, so that the magnetic core is parallel to or at an angle to the support chassis.

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