Substrate edge protection device and semiconductor machine

Abstract

This invention provides a substrate edge protection device and a semiconductor machine for protecting the edge of a substrate placed on a support unit. The support unit is disposed within a cavity. The substrate edge protection device includes an edge protection unit and a horizontal driving unit. The edge protection unit is disposed around the support unit and is used to partially shield the edge of the substrate from above. The horizontal driving unit is driven by the edge protection unit and drives the edge protection unit to move horizontally to expose or at least partially shield the edge of the substrate. In this invention, the horizontal driving unit drives the edge protection unit to move horizontally to expose or at least partially shield the edge of the substrate, reducing the space occupied by the edge protection unit and allowing it to be used in confined spaces for substrate placement and removal. The horizontal driving unit is driven by the edge protection unit to adjust the protection range of the edge protection unit.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a substrate edge protection device and a semiconductor machine. Background Technology

[0002] As integrated circuit technology continues to develop, semiconductor manufacturing processes are also constantly evolving. For example, annealing processes are gradually shifting from long-term overall heating of batch substrates to rapid thermal processing (RTP), pulse annealing, and laser annealing.

[0003] Among these methods, laser scanning annealing is more effective. It utilizes a high-energy laser spot to directly act on the surface of the substrate and scans it sequentially across the entire surface at a certain speed, achieving rapid annealing. During the laser annealing process, the high heat generated by the laser spot causes thermal strain in the substrate. This thermal strain can be absorbed and buffered by the surrounding areas. However, when the laser spot acts on the edge of the substrate, the thermal strain at the edge cannot be completely absorbed and buffered by the surrounding areas. If there are microcracks at the edge of the substrate caused by cutting, grinding, or collision, the aforementioned thermal strain will directly lead to further expansion of the microcracks, or even rupture.

[0004] Therefore, an edge protection unit is needed to protect the edges of the substrate during laser annealing. Existing edge protection units are fixed-size rings positioned above the substrate to block the laser from reaching its edges. These rings can also be raised and lowered above the substrate to facilitate placement and removal. However, these rings occupy a significant amount of space during raising and lowering, and the protected edge area is fixed, making it impossible to finely adjust the edge protection range for different products. Summary of the Invention

[0005] The purpose of this invention is to provide a substrate edge protection device and a semiconductor machine, so as to reduce the space occupied by the edge protection unit when handling substrates.

[0006] Another object of the present invention is to facilitate the adjustment of the range of the edge protection unit protecting the edge of the substrate.

[0007] To address the aforementioned technical problems, the present invention provides a substrate edge protection device for protecting the edge of a substrate placed on a support unit. The support unit is disposed within a cavity. The substrate edge protection device includes an edge protection unit and a horizontal driving unit. The edge protection unit is disposed around the support unit and is used to partially shield the edge of the substrate from above. The horizontal driving unit is drively connected to the edge protection unit and drives the edge protection unit to move continuously in the horizontal direction to expose the edge of the substrate from above, or to adjustably shield at least partially the edge of the substrate to protect the edge of the substrate.

[0008] Optionally, the edge protection unit includes a protection ring and a protection ring support member. The protection ring support member surrounds the bearing unit, the protection ring is disposed on the protection ring support member, and the protection ring is located above the edge of the substrate.

[0009] Optionally, the vertical distance between the protective ring and the upper surface of the substrate is 0.1 mm to 3 mm.

[0010] Optionally, the protective ring is a mechanical aperture structure.

[0011] Optionally, the protective ring includes an adjustment mechanism, aperture blades, and a housing that partially accommodates the adjustment mechanism and the aperture blades; the housing is fixedly connected to the protective ring support; a plurality of aperture blades are movably arranged in a ring on the adjustment mechanism, and the adjustment mechanism drives the plurality of aperture blades to open and close to change the inner diameter of the protective ring, so as to expose or at least partially block the edge of the substrate.

[0012] Optionally, the maximum inner diameter of the protective ring is greater than the diameter of the substrate, and the minimum inner diameter of the protective ring is less than the diameter of the substrate.

[0013] Optionally, the diameter of the substrate is 300 mm, and the minimum inner diameter of the protective ring is 290 mm to 295 mm.

[0014] Optionally, the aperture blades are made of ceramic.

[0015] Optionally, the horizontal drive unit includes a drive component and a transmission component. The drive component is disposed outside the cavity, and the transmission component passes through the cavity and connects the drive component and the edge protection unit.

[0016] According to another aspect of the present invention, the present invention also provides a semiconductor machine tool, including the substrate edge protection device as described above, wherein the semiconductor machine tool is a laser annealing device.

[0017] In summary, the substrate edge protection device and semiconductor equipment provided by the present invention have the following beneficial effects:

[0018] 1) The horizontal driving unit drives the edge protection unit to move in the horizontal direction to block or expose the edge of the substrate in order to cooperate with the picking and placing of the substrate. This reduces the space occupied by the edge protection unit when it moves, so that the edge protection unit can cooperate with the picking and placing of the substrate in a narrow space.

[0019] 2) The horizontal drive unit is connected to the edge protection unit and drives the edge protection unit to move in the horizontal direction to adjust the protection range of the edge protection unit, thereby meeting different protection range requirements. Attached Figure Description

[0020] Those skilled in the art will understand that the accompanying drawings are provided to better understand the invention and do not constitute any limitation thereof. Wherein:

[0021] Figure 1 This is a schematic diagram of the substrate edge protection device provided in the embodiments of this application;

[0022] Figure 2a This is a side view of one side of the protection ring provided in the embodiment of this application;

[0023] Figure 2b This is a top view of the protection ring provided in an embodiment of this application;

[0024] Figure 2c This is a schematic diagram of the adjustment mechanism provided in an embodiment of this application;

[0025] Figure 3a This is a side view of the lifting pin of the substrate edge protection device provided in the embodiments of this application, with the pin raised.

[0026] Figure 3b This is a top view of the lifting pin of the substrate edge protection device provided in the embodiments of this application rising;

[0027] Figure 4 This is a side view of the lifting pin of the substrate edge protection device provided in the embodiments of this application being lowered;

[0028] Figure 5a This is a side view schematic diagram of the protective ring protecting the edge of the substrate provided in the embodiment of this application;

[0029] Figure 5b This is a top view schematic diagram of the protective ring protecting the edge of the substrate provided in the embodiment of this application.

[0030] In the attached image:

[0031] 10-Substrate; 11-Cavity; 111-Top plate; 112-Side plate; 113-Bottom plate;

[0032] 20-Bearing unit; 21-Bearing plate; 22-Lifting unit; 221-Lifting pin; 222-Vertical drive unit; 23-Baseboard fixing unit;

[0033] 30 - Edge protection unit; 31 - Protective ring; 311 - Aperture blade; 311a - Boss; R - Inner diameter of protective ring; 312 - Adjustment mechanism; 312a - Rotary adjustment part; 312b - Sliding adjustment part; 313 - Housing; 32 - Protective ring support;

[0034] 40 - Horizontal drive unit; 41 - Transmission component; 42 - Drive component;

[0035] 50-Energy Device. Detailed Implementation

[0036] To make the objectives, advantages, and features of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the embodiments of this invention. Furthermore, the structures shown in the drawings are often part of the actual structures. In particular, different figures may emphasize different aspects and may sometimes use different scales.

[0037] It should be understood that when an element or layer is referred to as "on" or "connected to" other elements or layers, it may be directly on or connected to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on" or "directly connected to" other elements or layers, there are no intervening elements or layers. Although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. Spatial relation terms such as "below," "under," "below," "above," "on top," "above," etc., may be used herein for convenience of description to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatial relational terms are intended to also include different orientations of the devices in use and operation. For example, if the devices in the figures are flipped, then elements or features described as “below,” “under,” or “below” will be oriented “on” other elements or features. Devices may be oriented additionally (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly. The terminology used herein is intended only to describe particular embodiments and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “comprising” is used to identify the presence of features, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. When used herein, the terms “and / or” include any and all combinations of the associated listed items.

[0038] The present invention provides a substrate edge protection device and a semiconductor machine, so as to reduce the space occupied by the edge protection unit when picking up and placing the substrate, and at the same time facilitate the adjustment of the range of the edge of the substrate protected by the edge protection unit.

[0039] Figure 1 This is a schematic diagram of the substrate edge protection device provided in the embodiments of this application.

[0040] like Figure 1As shown, the substrate edge protection device provided in this embodiment is used to protect the edge of a substrate 10 placed on a support unit 20. The support unit 20 is disposed within a cavity 11, which includes a top plate 111, a bottom plate 113, and a side plate 112. The side plate 112 connects the top plate 111 and the bottom plate 113, thereby enclosing and defining an accommodating space. The substrate edge protection device includes an edge protection unit 30 and a horizontal driving unit 40. The support unit 20 is disposed on the bottom plate 113 of the cavity 11 and is used to support the substrate 10. The edge protection unit 30 is disposed on the bottom plate 113 of the cavity 11 and surrounds the support unit 20, and is used to partially shield the edge of the substrate 10 from above. The horizontal driving unit 40 is driveably connected to the edge protection unit 30, and drives the edge protection unit 30 to move horizontally to expose the edge of the substrate 10 from above, or to adjustably at least partially shield the edge of the substrate 10 to protect its edge.

[0041] The substrate 10 can be placed on the carrier unit 20 within the cavity 11. The substrate 10 can be made of any suitable material, such as silicon, glass, sapphire, or ceramic, and may also have corresponding films or microstructures on its surface. In this embodiment, the substrate 10 is a silicon wafer (also called a silicon wafer).

[0042] The supporting unit 20 and the edge protection unit 30 are both fixedly connected to the base plate 113, and the horizontal drive unit 40 is disposed below the base plate 113. An energy device 50 is disposed outside the cavity 11, located above the top plate 111. The top plate 111 has a high energy transmittance, allowing the energy device 50 to emit electromagnetic energy that passes through the top plate 111 and acts vertically on the substrate 10 inside the cavity 11 for corresponding processing. Additionally, the energy device 50 may be equipped with a moving component, allowing the electromagnetic energy emitted by the energy device 50 to move sequentially along the surface of the substrate 10 to achieve corresponding processing on the entire surface of the substrate 10. In this embodiment, the energy device 50 is an infrared energy device used to emit infrared laser light, thereby scanning the substrate 10 to perform an annealing process on the substrate 10. The cavity 11 is preferably a sealed cavity. Furthermore, the smaller the space of the sealed cavity, the faster and more effective the air is expelled from the cavity 11 before the annealing process, which helps to shorten the processing time and improve overall efficiency.

[0043] Please continue to refer to Figure 1The support unit 20 is used to support and fix the substrate 10, and may include a support plate 21, a lifting unit 22, and a substrate fixing unit 23. Specifically, the support plate 21 is disposed on the bottom plate 113 of the cavity 11 to support the substrate 10. The substrate fixing unit 23 is disposed in the support plate 21, and the upper surface of the substrate fixing unit 23 is flush with or slightly lower than the upper surface of the support plate 21 (the height difference is within a set range) to fix the substrate 10. Preferably, the substrate fixing unit 23 is a vacuum adsorption component, disposed in the area where the substrate 10 contacts the support plate 21, and the number of substrate fixing units 23 is, for example, more than three and evenly distributed.

[0044] The lifting unit 22 includes at least three lifting pins 221 and a vertical drive unit 222 for driving the substrate 10 to rise and fall, thereby enabling the placement and removal (mounting and unmounting) of the substrate 10. Specifically, the lifting pins 221 penetrate the bottom plate 113 and the support plate 21 of the cavity 11, and the vertical drive unit 222 is located below the bottom plate 113 outside the cavity 11, for driving the lifting pins 221 to rise and fall vertically, thereby driving the substrate 10 to rise and fall. In this embodiment, the number of lifting pins 221 is three, and the three lifting pins 221 are evenly distributed in the edge area of ​​the substrate, which has a better lifting effect.

[0045] A substrate picking and placing unit (not shown in the figure) is provided outside the cavity 11, such as a transfer hand (robotic arm). An openable and closable window is provided on the side plate 112 or top plate 111 of the cavity 11 for picking and placing the substrate.

[0046] The process of lifting the substrate 10 by the lifting pin 221 includes, for example:

[0047] Loading process: The window of the cavity 11 (which can be opened on the side plate 112 or the top plate 111) is opened, and the edge protection unit 30 inside the cavity 11 avoids (avoids) the lifting area of ​​the lifting pin 221. The lifting pin 221 rises to the top of the stroke, and the substrate pick-and-place unit places the substrate 10 on the lifting pin 221 from the window of the cavity 11. Then, the vertical drive unit 222 drives the lifting pin 221 to descend to the bottom of the lifting stroke, placing the substrate 10 on the support plate 21 to realize the loading.

[0048] Unloading process: The window of the cavity 11 (which can be opened on the side plate 112 or the top plate 111) is opened, the edge protection unit 30 inside the cavity 11 avoids the lifting area of ​​the lifting pin 221, the lifting pin 221 drives the substrate 10 to rise to the top of the stroke, and the substrate pick-up and drop unit takes out the substrate 10 from the window to realize unloading.

[0049] Please continue to refer to Figure 1The edge protection unit 30 includes a protection ring 31 and a protection ring support 32. The protection ring support 32 is disposed on the bottom plate 113 of the cavity 11 and surrounds the support plate 21. The height of the protection ring support 32 is higher than the height of the support plate 21. The protection ring 31 is fixedly disposed on the protection ring support 32 so that the protection ring 31 is located above the edge of the substrate 10. It is used to partially block the electromagnetic energy emitted from the energy device 50 from acting on the edge of the substrate 10, thereby protecting the edge of the substrate 10. The range of the edge of the substrate 10 blocked by the protection ring 31 is the protection range of the protection ring 31. The distance by which the protection ring 31 extends beyond the upper surface of the substrate 10 on the support plate 21 is preferably 0.1mm to 3mm. The specific distance can be determined according to the wavelength of the energy emitted by the energy device 50 and the specific requirements of the substrate 10 (product) to prevent scattering due to excessive distance, which would reduce the protection effect. It can also avoid scratching between the protection ring 31 and the substrate 10 due to insufficient distance, which would be detrimental to control.

[0050] The protective ring 31 is, for example, a mechanical aperture structure. The horizontal drive unit 40 drives the protective ring 31 to change the size of the inner diameter R of the protective ring, so that the protective ring 31 completely exposes the edge of the substrate 10, so as to achieve avoidance when the substrate 10 is loaded or unloaded, or to partially block the edge of the substrate 10, so as to protect the edge of the substrate 10 when the energy device 50 scans the substrate 10.

[0051] Preferably, the protective ring 31 is an iris-type aperture structure. For example... Figure 2a The schematic cross-sectional view of one side of the protective ring 31 shown illustrates that the protective ring 31 includes an adjustment mechanism 312, an aperture blade 311, and a housing 313. The housing 313 partially accommodates the adjustment mechanism 312 and the aperture blade 311. Its overall shape matches the shape of the substrate 10; for example, if the substrate 10 is circular, the housing 313 is annular. The housing 313 includes at least a vertical portion and a horizontal portion fixedly connected to the vertical portion. The vertical portion is fixedly connected to the protective ring support 32 to fix the protective ring 31, and the horizontal portion contacts and movably connects to the aperture blade 311. In practice, the cross-sectional shape of the housing 313 is compared to... Figure 2a The diagram is relatively complex to facilitate the setting and adjustment of the adjustment mechanism 312 and the aperture blades 311.

[0052] Please refer to Figure 2bThe aperture blades 311 can be arc-shaped sheet structures. Multiple aperture blades 311 are arranged in a ring on the adjustment mechanism 312. The multiple aperture blades 311 are sequentially spliced ​​and coupled to form an aperture facing the center of the protective ring. The diameter of the aperture is the inner diameter R of the protective ring. It is easy to understand that the greater the curvature of the aperture blades 311 and the more aperture blades 311 there are, the closer the coupled aperture is to a circle, thereby improving the matching degree between the aperture and the edge of the substrate 10. A boss 311a is provided on the lower surface of the aperture blades 311 for cooperating with the adjustment mechanism 312 to adjust the inner diameter R (aperture) of the protective ring.

[0053] Please refer to Figure 2c The shape of the adjustment mechanism 312 matches the shape of the housing 313, for example, it is a circular annular plate structure. The adjustment mechanism 312 includes a circular annular body 312c, a rotary adjustment part 312a disposed on the periphery of the circular annular body 312c, and a sliding adjustment part 312b disposed on the upper surface of the circular annular body 312c. The rotary adjustment part 312a consists of a plurality of teeth arranged circumferentially along the circular annular body 312c, and the sliding adjustment part 312b is provided with a plurality of arc-shaped grooves on the circular annular body 312c. The arc-shaped grooves match the bosses 311a of the aperture blades 311, and the plurality of arc-shaped grooves all point to the center of the adjustment mechanism 312.

[0054] The horizontal drive unit 40, which is connected to the adjustment mechanism 312, drives the rotary adjustment part 312a to rotate. The rotary adjustment part 312a drives the sliding adjustment part 312b to rotate, and then drives the aperture blade 311 to move in the horizontal direction through the boss 311a, thereby adjusting the size of the inner diameter R (aperture) of the protective ring. This allows for avoidance when the substrate 10 is mounted or dismounted, or partial blocking of the edge of the substrate 10, so as to protect the edge of the substrate 10 when the energy device 50 scans the substrate 10.

[0055] Specifically, such as Figure 3a and Figure 3b As shown, the horizontal drive unit 40 drives the edge protection unit 30 to move the aperture blades 311 horizontally outside the area of ​​the lifting substrate 10 (adjusting the inner diameter R of the protection ring to make it larger than the diameter of the substrate 10), and the vertical drive unit 222 drives the lifting pin 221 to rise to the top of the lifting stroke (above the protection ring 31) to receive the substrate 10. Then, as... Figure 4 As shown, the vertical drive unit 222 drives the lifting pin 221 to descend to the bottom of the lifting stroke (below the upper surface of the support plate 21) to place the substrate 10 on the support plate 21. Then, as... Figure 5a and Figure 5bAs shown, the horizontal drive unit 40 drives the edge protection unit 30 to move the aperture blades 311 horizontally to a predetermined size within the edge of the substrate 10 (adjusting the inner diameter R of the protection ring to make it smaller than the diameter of the substrate 10) in order to protect the edge of the substrate 10. The substrate 10 uncoupling process is similar to the substrate 10 loading process described above, and will not be repeated here.

[0056] The aperture blades 311 have a low transmittance of energy emitted by the energy emitter 50, for example, less than 1%, to improve the protection effect, and the maximum temperature that the material can withstand must be higher than the maximum temperature during the processing. Simultaneously, the adjustment range of the inner diameter R of the protective ring must cover the diameter of the substrate 10; that is, the maximum inner diameter R of the protective ring is greater than the diameter of the substrate 10, and the minimum inner diameter R of the protective ring is less than the diameter of the substrate 10. Furthermore, the protective ring 31 is continuously moved horizontally by the horizontal drive unit 40, so that the inner diameter R of the protective ring is continuously adjustable within the aforementioned adjustment range. In addition, the edges of the substrate 10 may have different protection range requirements for different processes or products, and these protection range requirements can be specifically adjusted according to actual needs. Since the inner diameter R of the protective ring is smaller than the protection range requirement of the substrate 10, the inner diameter R of the protective ring can also be continuously adjusted within the protection range requirement of the substrate 10. In this embodiment, the aperture blade 311 is made of ceramic, the substrate 10 is a silicon wafer with a diameter of 300mm, the minimum inner diameter of the inner diameter R of the protective ring is 290mm to 295mm, and the maximum inner diameter of the inner diameter R of the protective ring is 310mm to 315mm, that is, the inner diameter R of the protective ring is continuously adjustable within at least 295mm to 310mm.

[0057] Please continue to refer to Figure 1 The horizontal drive unit 40 includes a drive component 42 and a transmission component 41. The drive component 42 is disposed outside the cavity 11, and the transmission component 41 passes through the bottom plate 113 of the cavity 11, drivingly connecting the protective ring 31 and the drive component 42. The drive component 42 may be, for example, a motor. The transmission component 41 passes through the bottom plate 113 and the protective ring support 32, drivingly connecting to the adjustment mechanism 312 (rotation adjustment part 312a) of the protective ring 31. In a specific implementation, the horizontal drive unit 40 may also include a reduction unit (not shown in the figure) connected between the transmission component 41 and the adjustment mechanism 312, used to reduce the rotation input from the drive component 42 and output it to the adjustment mechanism 312, thereby improving control accuracy.

[0058] This embodiment also provides a semiconductor machine tool, which includes the substrate edge protection device as described above, for protecting the edge of the substrate when performing the corresponding process of the substrate 10.

[0059] In some specific embodiments, the aforementioned semiconductor equipment is a laser annealing device, and the energy source 50 is an infrared laser with an energy density, for example, up to 200 kW / cm². 2During the annealing process of the substrate 10 by the infrared laser, the edge of the substrate is protected by the above-mentioned substrate edge protection device, and it can operate in a narrow space to facilitate the placement and removal of the substrate 10.

[0060] In summary, the substrate edge protection device and semiconductor equipment provided by the present invention have the following beneficial effects:

[0061] 1) The horizontal driving unit drives the edge protection unit to move in the horizontal direction to block or expose the edge of the substrate in order to cooperate with the picking and placing of the substrate. This reduces the space occupied by the edge protection unit when it moves, so that the edge protection unit can cooperate with the picking and placing of the substrate in a narrow space.

[0062] 2) The horizontal drive unit is connected to the edge protection unit and drives the edge protection unit to move in the horizontal direction to adjust the protection range of the edge protection unit to meet different protection range requirements.

[0063] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A substrate edge protection device for protecting the edge of a substrate placed on a support unit in a laser annealing apparatus, the support unit being disposed within a cavity, characterized in that, The substrate edge protection device includes an edge protection unit and a horizontal driving unit; the edge protection unit is disposed around the support unit and is used to partially cover the edge of the substrate from above; the horizontal driving unit is connected to the edge protection unit and drives the edge protection unit to move continuously in the horizontal direction to expose the edge of the substrate from above, or to adjustably at least partially cover the edge of the substrate to protect the edge of the substrate. The edge protection unit includes a protective ring and a protective ring support. The protective ring support surrounds the bearing unit, the protective ring is disposed on the protective ring support, and the protective ring is located above the edge of the substrate. The protective ring includes an adjustment mechanism, an aperture blade, and a housing that partially accommodates the adjustment mechanism and the aperture blade; The housing is fixedly connected to the protective ring support; a plurality of aperture blades are movably arranged in a ring on the adjustment mechanism, and the adjustment mechanism drives the plurality of aperture blades to open and close to change the inner diameter of the protective ring so as to expose or at least partially block the edge of the substrate. The adjustment mechanism includes an annular body, a rotary adjustment part disposed around the periphery of the annular body, and a sliding adjustment part disposed on the upper surface of the annular body. The rotary adjustment part consists of several teeth arranged circumferentially along the annular body. The sliding adjustment part is provided with multiple arc-shaped grooves on the annular body. The arc-shaped grooves match the bosses on the lower surface of the aperture blades. All the arc-shaped grooves point towards the center of the adjustment mechanism. The horizontal drive unit drives the rotary adjustment part to rotate, so that the rotary adjustment part drives the sliding adjustment part to rotate, thereby driving the aperture blades to move horizontally through the bosses. The horizontal drive unit includes a drive component and a transmission component. The drive component is disposed outside the cavity, and the transmission component passes through the bottom plate of the cavity and the protective ring support member and is connected to the rotary adjustment part.

2. The substrate edge protection device according to claim 1, characterized in that, The vertical distance between the protective ring and the upper surface of the substrate is 0.1mm to 3mm.

3. The substrate edge protection device according to claim 1, characterized in that, The maximum inner diameter of the protective ring is greater than the diameter of the substrate, and the minimum inner diameter of the protective ring is less than the diameter of the substrate.

4. The substrate edge protection device according to claim 3, characterized in that, The substrate has a diameter of 300 mm, and the minimum inner diameter of the protective ring is 290 mm to 295 mm.

5. The substrate edge protection device according to claim 1, characterized in that, The aperture blades are made of ceramic.

6. A semiconductor machine, characterized in that, The semiconductor equipment includes a substrate edge protection device as described in any one of claims 1 to 5, wherein the semiconductor equipment is a laser annealing device.

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