一种半导体工艺设备的喷淋板及半导体工艺设备
By adding a liner and a purge air channel to the spray plate, the film formation problem of the spray plate device was solved, achieving efficient cleaning and simplified maintenance, and improving the service life of semiconductor process equipment and product quality.
CN115547892BActive Publication Date: 2026-07-17PIOTECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- PIOTECH CO LTD
- Filing Date
- 2022-10-21
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing semiconductor process equipment, process gases accumulate and form films during the use of spray plate devices, affecting subsequent processes and causing inconvenience in maintenance.
Method used
A liner structure is added between the spray upper plate and the spray panel. The purging is carried out through the purging air channel between the liner and the spray upper plate to prevent the reaction gas from directly contacting the spray upper plate. The liner is fixed by a snap-fit method for easy maintenance.
Benefits of technology
It effectively cleans the surface of the spray plate, reduces maintenance difficulty, extends the service life of the equipment, and improves the yield of products produced by the process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN115547892B_ABST
Abstract
本发明提供了一种半导体工艺设备的喷淋板及半导体工艺设备，该喷淋板包括：上下叠放的喷淋上板和喷淋面板，喷淋上板和喷淋面板之间构成喷淋腔室，喷淋上板顶部设有第一进气口，工艺反应气体由第一进气口进入喷淋腔室后，再通过喷淋面板上的孔洞喷淋至位于喷淋面板下方的反应腔室；以及衬板，衬板设于喷淋上板和喷淋面板之间，覆盖喷淋上板的下表面，在第一进气口的对应位置也开有孔洞以输入工艺反应气体至反应腔室。
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