半导体结构

By designing the junction isolation structure in the semiconductor structure to have the opposite conductivity type to the drift region, and adjusting its spacing and width, the balance problem between high breakdown voltage and low specific on-resistance in laterally diffused metal-oxide-semiconductor devices is solved, thereby improving the reliability and performance of the devices.

CN115548124BActive Publication Date: 2026-07-17SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Filing Date
2022-10-28
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing laterally diffused metal-oxide-semiconductor devices have shortcomings in terms of performance improvement, especially in balancing the requirements of high voltage withstand capability and low specific on-resistance.

Method used

A semiconductor structure is designed in which the second ion in the junction isolation structure has the opposite conductivity type to the first ion in the drift region. By adjusting the spacing and width of the junction isolation structure to gradually change along the direction from the source region to the drain region, a depletion region is formed, reducing the specific on-resistance of the drift region while maintaining the circuit conduction performance.

Benefits of technology

Without changing the length of the drift region, the specific on-resistance of the drift region is reduced, which enhances the reliability and withstand voltage of the device, avoids the risk of breakdown caused by excessive current density, and improves the overall performance of the device.

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Abstract

一种半导体结构,包括:衬底,所述衬底包括垂直堆叠的第一区和位于第一区上的第二区,所述第二区包括漂移区和体区,所述漂移区和体区沿平行于衬底表面的方向排列,所述漂移区内具有第一离子;位于衬底上的栅极结构,所述栅极结构横跨所述漂移区和体区;位于衬底内的结隔离结构,所述结隔离结构内具有第二离子,所述第二离子的导电类型与第一离子的导电类型相反,所述结隔离结构位于部分所述漂移区内和部分所述第一区内。所述半导体结构的性能得到提升。
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