Microstrip patch antenna

Abstract

This invention discloses a microstrip patch antenna, comprising a first dielectric substrate mounted at the port of a feed assembly and extending along a first direction; a ground layer formed on one side of the first dielectric substrate; a plurality of transition layer patches formed on the side of the first dielectric substrate away from the ground layer; a second dielectric substrate located on the side of the transition layer patches away from the first dielectric substrate; and a plurality of radiating patches mounted on the side of the second dielectric substrate away from the transition layer patches, and staggered on both sides of the central axis of the second dielectric substrate. The transition layer patches receive radio frequency (RF) signals from the feed assembly or transmit RF signals received by the transition layer patches to the feed assembly using a coaxial bottom-feed method. The radiating patches receive RF signals from the transition layer patches and radiate them outwards using a coupled feed method or couple externally received RF signals to the transition layer patches. The staggered radiating patches can achieve good broadband characteristics and radiation pattern performance within a limited unit size.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and more particularly to a microstrip patch antenna. Background Technology

[0002] Microstrip antennas are increasingly favored due to their advantages such as light weight, small size, simple structure, and low cost, and are being used more and more in airborne, spaceborne, missile-borne antennas, medical microwave, and civilian communications.

[0003] Among various antenna types, microstrip patch antennas are favored for their regular radiation patterns and flexible installation arrangements, which facilitates antenna array design. However, in radar systems, traditional rectangular microstrip antenna arrays struggle to meet the requirements of good broadband characteristics and radiation patterns within the constraints of limited antenna aperture and element size. Summary of the Invention

[0004] To address the existing technical problems, this invention provides a microstrip patch antenna that at least partially solves the above-mentioned technical problems. The radiating patches, located on both sides of the central axis and distributed in an alternating pattern, can meet the requirements of good broadband characteristics and radiation pattern indicators, as well as lightweight, low profile, large bandwidth, and high radiation pattern quality within a limited unit size.

[0005] This invention provides a microstrip patch antenna, comprising:

[0006] A first dielectric substrate extends along a first direction and is mounted at the port of the power supply assembly;

[0007] A grounding layer is formed on one side of the first dielectric substrate;

[0008] Multiple transition layer patches are formed on the side of the first dielectric substrate away from the ground layer;

[0009] The second dielectric substrate is located on the side of the transition layer patch away from the first dielectric substrate; and

[0010] Multiple radiating patches are mounted on the side of the second dielectric substrate away from the transition layer patch, and are staggered and spaced apart on both sides of the central axis of the second dielectric substrate;

[0011] The transition layer patch receives radio frequency (RF) signals from the power supply component via a coaxial bottom-feed method or transmits RF signals received from the transition layer patch to the power supply component. The radiating patch receives RF signals from the transition layer patch and radiates them outward via a coupling power supply method or couples externally received RF signals to the transition layer patch.

[0012] According to embodiments of this disclosure, the transition layer patch includes:

[0013] A transition sheet, the projection of which in the thickness direction covers the radiating patch;

[0014] The feed plate (31) extends from the transition plate (32) to the central axis of the first dielectric plate (1).

[0015] According to an embodiment of the present disclosure, a plurality of welding holes are formed in the thickness direction on the first dielectric substrate. The plurality of welding holes are coaxial with the plurality of feed plates. The welding holes are adapted to allow probes of the feed assembly to pass through. The core of the probe is in electrical contact with the feed plate (31), and the metal outer layer of the probe is in electrical contact with the ground layer.

[0016] According to embodiments of this disclosure, both the first dielectric plate and the second dielectric plate have a plurality of through holes extending in the thickness direction, and the plurality of through holes are adapted to cooperate with bolts to mount the first dielectric plate and the second dielectric plate to the power supply assembly.

[0017] According to embodiments of this disclosure, the centers of the plurality of through holes are located at the central axis of the first dielectric plate and the second dielectric plate, and the plurality of through holes are distributed at intervals with the plurality of feed plates.

[0018] According to embodiments of this disclosure, the reflection coefficient of the port of the power supply component is less than 1.5 in a broadband range of 9-10 GHz.

[0019] The microstrip patch antenna according to claim 1, wherein the port of the feeding component is an SMA port or an SMB port.

[0020] According to embodiments of this disclosure, the grounding layer, the transition layer patch, and the radiating patch are formed using a silver paste printing process.

[0021] According to the microstrip patch antenna provided by the present invention, the feed assembly emits a radio frequency (RF) signal, which is transmitted through the ground layer to the transition layer patch using a coaxial bottom feed method. Subsequently, the transition layer patch and the radiating patch are coupled and fed together to excite the radiating patch to radiate the RF signal outward, or the radiating patch receives the external RF signal and couples it to the transition layer patch. Then, the transition layer patch transmits the received RF signal to the feed assembly. The coupled feeding method helps to flexibly adjust the positional relationship between the feed point and the radiating patch, effectively solving the problem of the large size of the radiating patch and the small spacing between the feed points. In addition, the radiating patches are located on both sides of the central axis and are staggered, which can effectively reduce the pitch spacing and effectively eliminate the grating lobes that appear in the radiation pattern during large-angle scanning. Moreover, the feed is concentrated at the central axis of the first dielectric substrate, which solves the problem of radiation pattern asymmetry. It can meet the requirements of good broadband characteristics and radiation pattern indicators, as well as lightweight, low profile, large bandwidth and high radiation pattern quality within a limited unit size. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of a microstrip patch antenna according to an embodiment of the present invention;

[0023] Figure 2 This is an exploded view of the microstrip patch antenna in the thickness direction according to an embodiment of the present invention;

[0024] Figure 3 This is a top view of a microstrip patch antenna according to an embodiment of the present invention;

[0025] Figure 4 This is a partial view of the first dielectric substrate and the transition layer patch of the microstrip patch antenna according to an embodiment of the present invention;

[0026] Figure 5 This is a partial view of the second dielectric substrate and the radiating patch of the microstrip patch antenna according to an embodiment of the present invention;

[0027] Figure 6 This is a simulation diagram of the standing wave ratio of a microstrip patch antenna according to an embodiment of the present invention;

[0028] Figure 7 This is the radiation pattern of a microstrip patch antenna according to an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the array distribution of a microstrip patch antenna according to an embodiment of the present invention;

[0030] Figure 9 This is the radiation pattern of the array surface of a microstrip patch antenna according to an embodiment of the present invention.

[0031] Figure Labels

[0032] 1. First dielectric substrate;

[0033] 2. Grounding layer;

[0034] 3. Transition layer patch;

[0035] 31. Feeder plate;

[0036] 32. Transition film;

[0037] 4. Second dielectric substrate;

[0038] 5. Radiation patches;

[0039] 6. Through hole;

[0040] 7. Welding holes;

[0041] 8. Leaving hole. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0043] The present invention is described herein with respect to structural embodiments and methods. It should be understood that this is not intended to limit the invention to the specific disclosed embodiments; the invention can be practiced using other features, elements, methods, and embodiments. Similar elements in different embodiments are typically designated with similar numbers.

[0044] This invention provides a microstrip patch antenna, comprising a first dielectric substrate 1, a ground layer 2, multiple transition layer patches 3, a second dielectric substrate 4, and multiple radiating patches 5. The first dielectric substrate 1 extends along a first direction and is mounted at the port of a feed assembly; the ground layer 2 is formed on one side of the first dielectric substrate 1; multiple transition layer patches 3 are formed on the side of the first dielectric substrate 1 away from the ground layer 2; the second dielectric substrate 4 is located on the side of the transition layer patches 3 away from the first dielectric substrate 1; multiple radiating patches 5 are mounted on the side of the second dielectric substrate 4 away from the transition layer patches 3 and are staggered on both sides of the central axis of the second dielectric substrate 4; wherein, the transition layer patches 3 receive radio frequency signals from the feed assembly or transmit radio frequency signals received from the transition layer patches 3 to the feed assembly using a coaxial bottom-feed method, and the radiating patches 5 receive radio frequency signals from the transition layer patches 3 and radiate them outwards using a coupled feed method or couple radio frequency signals received from the outside to the transition layer patches 3.

[0045] According to embodiments of this disclosure, the feed assembly emits a radio frequency (RF) signal, which is transmitted through the ground layer 2 to the transition layer patch 3 via a coaxial bottom feed method. Subsequently, the transition layer patch 3 and the radiating patch 5 are coupled and fed together to excite the radiating patch 5 to radiate the RF signal outward or to receive the external RF signal and couple it to the transition layer patch. Then, the transition layer patch transmits the received RF signal to the feed assembly. The coupled feeding method helps to flexibly adjust the positional relationship between the feed point and the radiating patch 5, effectively solving the problem of the large size of the radiating patch 5 and the small spacing between the feed points. In addition, the radiating patches 5 are located on both sides of the central axis and are staggered, which can effectively reduce the pitch spacing size and effectively eliminate the grid lobes that appear in the radiation pattern during large-angle scanning. Moreover, the feed is concentrated at the central axis of the first dielectric substrate 1, which solves the problem of radiation pattern asymmetry. It can meet the requirements of good broadband characteristics and radiation pattern indicators, as well as lightweight, low profile, large bandwidth and high radiation pattern quality within a limited unit size.

[0046] Figure 1 This is a three-dimensional structural schematic diagram of a microstrip patch antenna according to an embodiment of the present invention; Figure 2 This is an exploded view of the microstrip patch antenna in the thickness direction according to an embodiment of the present invention.

[0047] In one exemplary embodiment, reference is made to Figure 1 and 2 The first dielectric substrate 1 extends along a first direction, which is horizontal, meaning the first dielectric substrate 1 is horizontally positioned and mounted at the port of the power supply component, which is either an SMA port or an SMB port. A ground layer 2 is formed on the bottom surface of the first dielectric substrate 1 using a silver paste printing process. Multiple transition layer patches 3 are formed on the top surface of the first dielectric substrate 1 using a silver paste printing process. The transition layer patches 3 receive radio frequency signals emitted from the power supply component via a coaxial bottom-feed method.

[0048] Figure 3 This is a top view of a microstrip patch antenna according to an embodiment of the present invention; Figure 4 This is a partial view of the first dielectric substrate and the transition layer patch of the microstrip patch antenna according to an embodiment of the present invention.

[0049] In one exemplary embodiment, reference is made to Figure 3 and 4The transition layer patch 3 includes a transition plate 32 and a feed plate 31. The transition plate 32 is formed on the top surface of the first dielectric substrate 1. In this embodiment, the transition plate 32 is rectangular, and its projection in the thickness direction covers the radiating patch 5. In this embodiment, the feed plate 31 is circular, with a diameter equal to the width of the transition plate 32. The two long sides of the feed plate 31 and the transition plate 32 are tangent, and the feed plate 31 extends from the transition plate 32 to the central axis of the first dielectric substrate 1. By adjusting the shape and position of the feed plate 31 and the transition plate 32 according to actual engineering design requirements, ideal impedance matching can be obtained, enabling large bandwidth operation.

[0050] In one exemplary embodiment, reference is made to Figure 2 and 4 Multiple welding holes 7 are formed on the first dielectric substrate 1 through the thickness direction. The multiple welding holes 7 are coaxially arranged with multiple feed plates 31. The welding holes 7 are adapted to allow probes of the feed assembly to pass through. The core of the probe is in electrical contact with the feed plate 31, and the metal outer layer of the probe is in electrical contact with the ground layer 2. The probe is welded to the first dielectric substrate 1. Each probe is set independently. The port of the feed assembly emits radio frequency signals, and then the feed plate 31 receives the radio frequency signals emitted from the port of the feed assembly by the probe.

[0051] According to the embodiments of this disclosure, the feed point is located at the central axis of the feed plate 31, and the power supply is uniformly concentrated at the central axis of the first dielectric plate 1, and uniformly concentrated in one column, which solves the problem of asymmetrical radiation pattern caused by the feed point being biased to the same side; in addition, the feed point is concentrated in one column, which makes it easy for the first dielectric plate 1 to be integrated with the port of the power supply component, so that other supporting components do not need to be arranged in an interlaced manner, saving internal space and reducing integration difficulty.

[0052] Figure 5 This is a partial view of the second dielectric substrate and the radiating patch of the microstrip patch antenna according to an embodiment of the present invention.

[0053] In one exemplary embodiment, reference is made to Figure 2 and 5 The second dielectric substrate 4 is located above the transition layer patch 3. The second dielectric substrate 4 has the same size as the first dielectric substrate 1. Multiple clearance holes 8 are formed on the second dielectric substrate 4 through the thickness direction. The projection of the multiple clearance holes 8 in the thickness direction covers the feed patch 31, so that the radiating patch 5 is coupled and fed to the transition layer patch 3. Multiple radiating patches 5 are installed on the top surface of the second dielectric substrate 4. In this embodiment, the radiating patches 5 of the microstrip patch antenna are arranged in groups of 16, with each group divided into two rows of 8 radiating patches 5. The two rows of 8 radiating patches 5 are located on both sides of the central axis of the second dielectric substrate 4 and are staggered. The radiating patches 5 receive and radiate radio frequency signals from the transition layer patch 3 by means of coupled feeding.

[0054] According to embodiments of this disclosure, the coupled feeding method between the radiating patch 5 and the transition layer patch 3 facilitates flexible adjustment of the positional relationship between the feed point and the radiating patch 5, effectively resolving the contradiction between the large size of the radiating patch 5 and the small spacing between the feed points. Furthermore, the radiating patches 5 are located on both sides of the central axis and are staggered, which effectively reduces the pitch spacing and eliminates grating lobes in the radiation pattern during large-angle scanning. This allows for the achievement of good broadband characteristics and radiation pattern performance within a limited element size, while also meeting the requirements for lightweight design, low profile, large bandwidth, and high radiation pattern quality.

[0055] In one exemplary embodiment, reference is made to Figure 2 Both the first dielectric plate 1 and the second dielectric plate 4 have multiple through holes 6 extending through the thickness direction. The center of the multiple through holes 6 is located at the central axis of the first dielectric plate 1 and the second dielectric plate 4, and is distributed at intervals with the multiple feed plates 31. The through holes 6 are suitable for cooperating with bolts to install the first dielectric plate 1 and the second dielectric plate 4 at the port of the feed assembly.

[0056] According to the embodiments of this disclosure, when a microstrip patch antenna is installed at the port of the feed assembly, the probe of the feed assembly port is inserted into the solder hole 7, and the first dielectric substrate 1 and the second dielectric substrate 4 are installed at the port of the feed assembly by bolts or screws passing through the through hole 6, which is convenient to operate.

[0057] Figure 6 This is a simulation diagram of the standing wave ratio of a microstrip patch antenna according to an embodiment of the present invention; Figure 7 This is the radiation pattern of a microstrip patch antenna according to an embodiment of the present invention.

[0058] In one exemplary embodiment, reference is made to Figure 6 Within the 9-10GHz broadband range, the reflection coefficient at the port of the power supply component is less than 1.5. (Reference) Figure 7 Microstrip patch antennas can achieve good impedance matching and large-angle scanning characteristics of the radiation pattern.

[0059] Figure 8 This is a schematic diagram of the array distribution of a microstrip patch antenna according to an embodiment of the present invention; Figure 9 This is the radiation pattern of the array surface of a microstrip patch antenna according to an embodiment of the present invention.

[0060] In one exemplary embodiment, reference is made to Figure 8 and 9 Eight microstrip patch antennas arranged sequentially in the elevation direction form a column, and two columns of microstrip patch antennas arranged sequentially in the range direction form a microstrip patch antenna array, satisfying good broadband characteristics and radiation pattern indicators.

[0061] The microstrip patch antenna disclosed herein can be used to acquire information such as distance, orientation, and height of the object under test. Specifically, the feeding component emits an RF signal, which is transmitted through the ground layer 2 to the transition layer patch 3 via a coaxial bottom feed. Then, the transition layer patch 3 and the radiating patch 5 are coupled and fed together to excite the radiating patch 5 to radiate the RF signal to the object under test. The radiating patch then receives the RF signal reflected from the object under test and couples it to the transition layer patch. The transition layer patch then transmits the received RF signal to the feeding component, thereby obtaining information such as the distance, azimuth, and height of the object under test. The coupled feeding method helps to flexibly adjust the positional relationship between the feed point and the radiating patch 5, effectively solving the problem of the large size of the radiating patch 5 and the small spacing between the feed points. In addition, the radiating patches 5 are located on both sides of the central axis and are staggered, which can effectively reduce the pitch spacing and effectively eliminate the grid lobes that appear in the radiation pattern during large-angle scanning. Moreover, the feeding is concentrated at the central axis of the first dielectric substrate 1, which solves the problem of radiation pattern asymmetry. It can meet the requirements of good broadband characteristics and radiation pattern indicators, as well as lightweight, low profile, large bandwidth, and high radiation pattern quality within a limited unit size.

[0062] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A microstrip patch antenna, characterized in that, include: A first dielectric plate (1) extends along a first direction and is mounted at the port of the power supply assembly; A grounding layer (2) is formed on one side of the first dielectric substrate (1); Multiple transition layer patches (3) are formed on the side of the first dielectric substrate (1) away from the ground layer (2); The second dielectric plate (4) is located on the side of the transition layer patch (3) away from the first dielectric plate (1); as well as Multiple radiating patches (5) are mounted on the side of the second dielectric plate (4) away from the transition layer patch (3) and are staggered on both sides of the central axis of the second dielectric plate (4); The transition layer patch (3) receives radio frequency signals from the power supply component via a coaxial bottom feed or transmits radio frequency signals received from the transition layer patch (3) to the power supply component. The radiating patch (5) receives radio frequency signals from the transition layer patch (3) and radiates them outward via a coupling power supply or couples radio frequency signals received from the outside to the transition layer patch (3). The transition layer patch (3) includes: A transition piece (32) whose projection in the thickness direction covers the radiation patch (5); The feed plate (31) extends from the transition plate (32) to the central axis of the first dielectric plate (1); Both the first dielectric plate (1) and the second dielectric plate (4) have multiple through holes (6) extending through the thickness direction. The multiple through holes (6) are suitable for mounting the first dielectric plate (1) and the second dielectric plate (4) to the power supply assembly in cooperation with bolts. The center of the multiple through holes (6) is located at the central axis of the first dielectric plate (1) and the second dielectric plate (4). The multiple through holes (6) are distributed at intervals with the multiple power supply plates (31).

2. The microstrip patch antenna according to claim 1, characterized in that, A plurality of welding holes (7) are formed on the first dielectric plate (1) through the thickness direction. The plurality of welding holes (7) are coaxial with the plurality of feed plates (31). The welding holes (7) are adapted to allow the probe of the feed assembly to pass through. The core of the probe is in electrical contact with the feed plate (31), and the metal outer layer of the probe is in electrical contact with the ground layer (2).

3. The microstrip patch antenna according to claim 1, characterized in that, Within a broadband range of 9-10 GHz, the reflection coefficient of the port of the power supply component is less than 1.

5.

4. The microstrip patch antenna according to claim 2, characterized in that, The power supply component has an SMA port or an SMB port.

5. The microstrip patch antenna according to claim 1, characterized in that, The grounding layer (2), the transition layer patch (3), and the radiation patch (5) are formed using a silver paste printing process.

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