Heat dissipation structure assembly
By combining elastic limiting components and phase-change metals, the fluidity problem of liquid metal heat dissipation is solved, achieving stable heat dissipation and circuit safety, and adapting to differences in heat source height.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MICRO STAR INTERNATIONAL CO LTD
- Filing Date
- 2021-06-30
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, liquid metal heat dissipation methods have fluidity issues, which may lead to poor heat dissipation or short circuits, especially when subjected to vibration or changes in angle.
The structure employs a combination of elastic limiting components, a paste-like heat dissipation wall, sealing components, and phase change metals. The elastic limiting components restrict the flow area of the phase change metals, and the phase change metals are converted into liquid at critical temperatures for heat dissipation. The heat is then dissipated by the assembled plates.
It effectively restricts the flow of phase-change metals, prevents overflow from affecting circuit components, ensures stable heat dissipation without causing short circuits, adapts to differences in heat source height, and improves the reliability of the heat dissipation structure.
Smart Images
Figure CN115551174B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronics, and more specifically to a heat dissipation structure assembly for a heat source mounted on a circuit board. Background Technology
[0002] As the efficiency of various electronic devices increases, the heat they generate also increases. If the heat source cannot be effectively dissipated, it may cause the internal electronic components to thermally collapse or fail, or even damage the entire electronic device.
[0003] Taking computers as an example, the main heat sources are currently the Central Processing Unit (CPU) or the Graphics Processing Unit (GPU). Liquid metal is typically used to conduct heat away from these components through a heatsink housing. However, due to the fluid nature of liquid metal, it can flow out to other locations due to angles of travel or vibrations. This can lead to poor heat dissipation or short circuits caused by contact between the liquid metal and other components. Summary of the Invention
[0004] This invention primarily provides a heat dissipation structure assembly applied to a heat source mounted on a circuit board. The heat dissipation structure assembly includes an elastic limiting member, a paste-like heat dissipation wall, a sealing member, a phase change metal, and an assembly plate. The elastic limiting member is disposed on the circuit board, located at the periphery of the heat source, and has a first height. The paste-like heat dissipation wall is disposed on the circuit board, located between the heat source and the elastic limiting member, contacting the periphery of the heat source and adjacent to the elastic limiting member. The paste-like heat dissipation wall has a second height, the first height being greater than the second height, and the second height being greater than the height of the heat source. The sealing member contacts the top of the paste-like heat dissipation wall and is engaged with the side of the elastic limiting member. The phase change metal fills the area between the sealing member, the paste-like heat dissipation wall, and the heat source; the phase change metal transforms into a liquid state after exceeding a critical temperature. The assembly plate is connected to the sealing member, and a portion of the assembly plate contacts the top of the elastic limiting member.
[0005] In some embodiments, the heat source is a central processing unit (CPU) or a graphics processing unit (GPU).
[0006] In some embodiments, the critical temperature range of the phase change metal is 50 to 65 degrees Celsius. Preferably, in some embodiments, the critical temperature range of the phase change metal is 54 to 60 degrees Celsius.
[0007] In some embodiments, the elastic limiting element is elastic foam.
[0008] In some embodiments, the sealing element is a copper block.
[0009] In some embodiments, the assembly panel is a metal plate.
[0010] In some embodiments, the assembly board is fixed to the circuit carrier board.
[0011] In some embodiments, the sealing element is welded to the assembly plate as a single unit.
[0012] In some embodiments, the thickness of the assembly plate is greater than that of the sealing member.
[0013] In some embodiments, the heat dissipation structure assembly further includes a second elastic limiting member disposed on the circuit board and surrounding the elastic limiting member. As can be understood in the foregoing embodiments, by selecting a phase change metal, a low flow state is maintained when the heat-generating electronic device is not in use or is being cooled, and the elasticity of the elastic limiting member and the assembly board restrict the area where the phase change metal may flow, preventing its overflow and affecting the overall electrical properties.
[0014] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description
[0015] Figure 1 This is a cross-sectional view of the heat dissipation structure assembly;
[0016] Figure 2 This is an exploded view of the heat dissipation structure assembly;
[0017] Figure 3 This is an exploded view of another embodiment of the heat dissipation structure assembly. Detailed Implementation
[0018] The present invention will be further described below through specific embodiments. The accompanying drawings are merely illustrative to facilitate understanding of the invention, and their specific proportions can be adjusted according to design requirements. The vertical relationship between relative elements in the figures described herein should be understood by those skilled in the art as referring to the relative positions of the components. Correspondingly, the element on the upper side is considered the front, and the element on the lower side is considered the back for ease of understanding. Therefore, all can be flipped to present the same component, and all of this should fall within the scope disclosed in this specification.
[0019] Figure 1 This is a cross-sectional view of the heat dissipation structure assembly. Figure 2 This is an exploded view of the heat dissipation structure assembly. (See diagram below.) Figure 1 and Figure 2 As shown, the heat dissipation structure assembly 1 is applied to the heat source 510 mounted on the circuit board 500. The heat dissipation structure assembly 1 includes an elastic limiting member 10, a paste-like heat dissipation wall 20, a sealing member 30, a phase change metal 40, and an assembly plate 50.
[0020] A resilient retaining member 10 is disposed on the circuit board 500, located at the periphery of the heat source 510, and has a first height. A paste-like heat sink 20 is disposed on the circuit board 500, located between the heat source 510 and the resilient retaining member 10, in contact with the periphery of the heat source 510, and adjacent to the resilient retaining member 10. That is, the paste-like heat sink 20 may be in contact with the resilient retaining member 10, or a gap may be maintained. The paste-like heat sink 20 has a second height, the first height being greater than the second height, and the second height being greater than the height of the heat source 510. In some embodiments, the heat source is a central processing unit (CPU) or a graphics processing unit (GPU). The paste-like heat sink 20 can be experimentally applied directly to the periphery of the heat source 510 using general thermal paste or other insulating thermally conductive paste rich in ceramic particles, or it can be directly filled into the space between the resilient retaining members 10 after the resilient retaining members 10 are installed.
[0021] The sealing member 30 contacts the top of the paste-like heat dissipation wall 20 and is engaged with the side of the elastic limiting member 10. A phase change metal 40 fills the area between the sealing member 30, the paste-like heat dissipation wall 20, and the heat source 510. The phase change metal 40 transforms into a liquid state after exceeding a critical temperature. In some embodiments, the phase change metal 40 is applied to the surface of the heat source 510 after the elastic limiting member 10 and the paste-like heat dissipation wall 20 are installed, and then the sealing member 30 is fixed in contact with the paste-like heat dissipation wall 20, thus restricting the position of the phase change metal 40.
[0022] The assembly plate 50 is connected to the sealing member 30, and a portion of the assembly plate 50 contacts the top end of the elastic limiting member 10. In some embodiments, the sealing member 30 is a copper block and the assembly plate 50 is a metal plate. The heat generated by the heat source 510 is quickly conducted to the outside through the tightly connected phase change metal 40, sealing member 30, and assembly plate 50, and then removed by a heat pipe or a fan (not shown).
[0023] In some embodiments, the sealing member 30 is welded to the assembly plate 40 as a single unit. In other words, the sealing member 30 and the assembly plate 40 can serve as an outer cover, and the elastic limiting member 10, the paste-like heat dissipation wall 20, and the phase change metal 40 can be completed and assembled directly as a cover. Furthermore, in some embodiments, the assembly plate 50 can also be fixed to the circuit board 500 by screws or other means.
[0024] In some embodiments, the critical temperature range of the phase change metal 40 is 50 to 65 degrees Celsius. Preferably, in some embodiments, the critical temperature range of the phase change metal 40 is 54 to 60 degrees Celsius. More preferably, the critical temperature of the phase change metal is 58 degrees Celsius + / - 0.5 degrees Celsius. In other words, if an electronic device such as a laptop or tablet computer is turned off or cooled for a certain period of time, the phase change metal 40 will change from a liquid to a solid state. Therefore, when moved or subjected to vibration, the phase change metal 40 will not flow, effectively preventing it from overflowing or detaching from the surface of the heat source 510.
[0025] Generally, the heat source 510 may have uneven surfaces and may have height differences due to manufacturing tolerances. In some embodiments, the elastic limiting member 10 is elastic foam. The thickness of the assembly plate 50 is greater than that of the sealing member 30. In other words, the assembly plate 50 provides greater weight to generate pressure. Regardless of whether the height of the heat source 510 is high or low, it can be adjusted by the elasticity of the elastic limiting member 10 to avoid gaps, thus ensuring that the phase change metal 40 adheres as closely as possible to the surface of the heat source 510 and prevents leakage. Even if there are gaps in the paste-like heat dissipation wall 20 causing leakage of the phase change metal 40, the elastic foam has an absorption effect, preventing the phase change metal 40 from escaping to the outside and affecting the electrical connections of components on other circuit boards 500.
[0026] Figure 3 This is an exploded view of another embodiment of the heat dissipation structure assembly. (See diagram below.) Figure 3 As shown, in some embodiments, the heat dissipation structure assembly 1 further includes a second elastic limiting member 15. The second elastic limiting member 15 is disposed on the circuit carrier 500 and surrounds the elastic limiting member 10. The second elastic limiting member 15 and the elastic limiting member 10 may both be formed of elastic foam, but are not limited thereto, and may also be other elastic and absorbent materials. The second elastic limiting member 15 can further prevent the phase change metal 40 from diffusing to the outside.
[0027] In summary, by selecting the phase change metal 40, a low flow state is maintained when the heat source electronic device is not in use or is being cooled. The elasticity of the elastic limiting member 10 and the assembly plate 50 limit the area where the phase change metal 40 may flow and prevent it from overflowing and affecting the overall electrical properties.
[0028] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.
Claims
1. A heat dissipation structure assembly, applied to a heat source mounted on a circuit board, characterized in that, Include: An elastic limiting member is disposed on the circuit carrier board and located at the periphery of the heat source, and the elastic limiting member has a first height; A paste-like heat dissipation wall is disposed on the circuit carrier board, located between the heat source and the elastic limiting member, in contact with the periphery of the heat source and adjacent to the elastic limiting member, the paste-like heat dissipation wall having a second height, wherein the first height is greater than the second height, and the second height is greater than the height of the heat source; The sealing component contacts the top of the paste-like heat dissipation wall and is snapped into the side of the elastic limiting component; A phase change metal, filling the region between the sealing member, the paste-like heat dissipation wall, and the heat source, wherein the phase change metal transforms into a liquid state above a critical temperature; and An assembly plate is connected to the sealing member, and a portion of the assembly plate contacts the top end of the elastic limiting member.
2. The heat dissipation structure assembly as described in claim 1, characterized in that: The heat source is a central processing unit (CPU) or a graphics processing unit (GPU).
3. The heat dissipation structure assembly as described in claim 1, characterized in that: The critical temperature range for the phase change metal is 50 to 65 degrees Celsius.
4. The heat dissipation structure assembly as described in claim 1, characterized in that: The critical temperature range for the phase change metal is 54 to 60 degrees Celsius.
5. The heat dissipation structure assembly as described in claim 1, characterized in that: The elastic limiting component is elastic foam.
6. The heat dissipation structure assembly as described in claim 1, characterized in that: The sealing component is a copper block.
7. The heat dissipation structure assembly as described in claim 1, characterized in that: The assembly panel is a metal panel.
8. The heat dissipation structure assembly as described in claim 1, characterized in that: The assembly board is fixed to the circuit carrier board.
9. The heat dissipation structure assembly as described in claim 1, characterized in that: The sealing component is welded to the assembly plate as a whole.
10. The heat dissipation structure assembly as described in claim 1, characterized in that: The thickness of the assembled plate is greater than that of the sealing member.
11. The heat dissipation structure assembly as described in claim 1, characterized in that: It further includes a second elastic limiting member disposed on the circuit board and surrounding the elastic limiting member.