A single board, cabinet and data center

Abstract

The application provides a single board, a cabinet and a data center. The single board comprises a board body for carrying a chip. The single board further comprises an evaporator arranged on the board body, a first heat dissipation pipeline embedded in the board body and used for conveying a working medium, the first heat dissipation pipeline comprising a first pipeline and a second pipeline; the first pipeline and the second pipeline are respectively connected with an input end and an output end of the evaporator in one-to-one correspondence; and the first pipeline and the second pipeline are respectively provided with a first quick plug connector at an end away from the evaporator; the first pipeline is connected with the input end of the evaporator; and at least the first pipeline is provided with a switch valve. The first quick plug connector is used for realizing quick plug connection between the condenser and the evaporator, the condenser can be arranged in the cabinet, and thus the heat dissipation effect of the single board can be improved. In addition, the switch valve arranged on at least the first pipeline ensures that the working medium in the single board remains basically consistent when the single board is pulled out in the power-on or power-off state.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a single board, cabinet and data center. Background Technology

[0002] With the continuous improvement of performance requirements for communication and computing equipment, and the advancement of semiconductor chip technology, chip performance is becoming increasingly powerful. Simultaneously, the adoption of multi-core stacking packaging methods has led to increasingly higher thermal density in both chips and individual communication equipment boards. Under system air-cooling conditions, it is becoming increasingly difficult to solve the chip heat dissipation problem within the limited heat dissipation space of a single board. Therefore, effectively transferring heat to a larger space for heat dissipation has become an effective path for communication equipment architecture solutions.

[0003] Current popular high-power chip cooling technologies typically collect the heat generated by the chip within the circuit board using heat pipes, VC (cooling coil), or loop heat pipes (LTS). This heat is then transferred to a condenser located further away on the board for dissipation. For example, a condenser can be installed in a space within the circuit board, with an evaporator below the chip. The evaporator and condenser are connected by piping. The entire loop heat pipe is evacuated and filled with a heat-dissipating medium. During operation, the liquid medium absorbs heat from the chip in the evaporator, evaporates, and turns into a gaseous state. This gaseous medium then condenses in the condenser, releasing heat into the environment. The condenser then carries away the heat generated by the chip through convection with the ambient air. However, this cooling method is limited by the space and layout within the circuit board, resulting in a limited increase in heat dissipation area and cooling capacity. As chip power consumption continues to increase, chip cooling remains a bottleneck. Summary of the Invention

[0004] This application provides a single board, a cabinet, and a data center to improve the heat dissipation of the single board.

[0005] In a first aspect, a single-board circuit board is provided, comprising a board body for carrying a chip. The board also includes an evaporator disposed within the board body, wherein the evaporator dissipates heat from the chip, and the chip can be mounted on the evaporator during installation. The board further includes a first heat dissipation conduit embedded within the board body for transporting a working fluid. The first heat dissipation conduit includes a first pipe and a second pipe; the first pipe and the second pipe are respectively connected to the input and output ends of the evaporator; and each of the first pipes and the second pipe is provided with a first quick-connect coupling at its end furthest from the evaporator. The first pipe is connected to the input end of the evaporator; and at least the first pipe is provided with a switching valve. When the above structure is adopted, the condenser and evaporator are quickly plugged in and out through the first quick-connect connector. The condenser can be installed in the cabinet, so it is not limited by the size of the single board. On the one hand, it avoids the condenser affecting the arrangement of components on the single board. On the other hand, there is enough space in the cabinet to install a larger condenser with better cooling effect, thereby improving the heat dissipation effect on the single board. In addition, by installing a switch valve on at least the first pipe, it is ensured that the working fluid in the single board remains basically the same when the single board is unplugged in the power-on or power-off state.

[0006] In one specific implementation scheme, both the first pipe and the second pipe are equipped with on / off valves. By installing on / off valves in the first and second pipes respectively, it is ensured that the working fluid inside the board remains essentially consistent when the board is removed under power-on or power-off conditions.

[0007] In one specific implementation, the switching valve is an electromagnetic control valve; the board also includes a control unit for controlling the opening and closing of the electromagnetic control valve. Automatic control of the electromagnetic control valve is achieved through the control unit.

[0008] In one specific implementation, the control unit is a control circuit mounted on the board. When the board is electrically connected to the backplane of the cabinet, the control circuit controls the electromagnetic control valve to open. When the board is connected to the backplane, the electromagnetic control valve can be opened.

[0009] In one specific implementation, the board further includes a sensor for detecting the temperature of a heat source on the board; the control unit controls the electromagnetic control valve to open when the temperature detected by the sensor exceeds a set value. The opening or closing of the electromagnetic control valve is controlled by temperature.

[0010] In one specific implementation scheme, the solenoid control valve is a normally closed control valve, which reduces the amount of working fluid carried when the board is removed.

[0011] In one specific implementation, a liquid accumulation chamber is provided on the first pipe. This liquid accumulation chamber prevents the working fluid in the first heat dissipation pipe from flowing back into the condenser when the first heat dissipation pipe is connected to the condenser.

[0012] In one specific implementation, the liquid collection chamber is located on the side of the switching valve away from the evaporator. This ensures that the working fluid does not flow back into the condenser.

[0013] In one specific implementation, the first pipe, the second pipe, or the evaporator is provided with a filling hole. A working fluid is filled into the first heat dissipation pipe within the single-board through the filling hole.

[0014] In one specific implementation, the filling hole also serves as a vacuum evacuation hole. A vacuum is created in the first heat dissipation pipe through this filling hole.

[0015] In one specific implementation, there are multiple evaporators connected in parallel to achieve heat dissipation for different chips.

[0016] In one specific implementation, the evaporator is embedded within the board, thereby reducing the chip's mounting height.

[0017] In one specific implementation, the first heat dissipation pipe is filled with a working fluid, which absorbs the heat generated by the chip through its flow and the conversion between liquid and gaseous states.

[0018] Secondly, a cabinet is provided, comprising a cabinet body, a condenser disposed within the cabinet body, and a second heat dissipation pipe for transferring the working fluid; the second heat dissipation pipe includes a third pipe and a fourth pipe; the third pipe and the fourth pipe are respectively connected to the input end and the output end of the condenser; the ends of the third pipe and the fourth pipe away from the condenser are respectively provided with a second quick-connect connector for engaging with a first quick-connect connector. With the above structure, a quick-connect connection between the condenser and the evaporator is achieved through the engagement of the first and second quick-connect connectors. The condenser can be disposed within the cabinet, thus not being limited by the size of the PCB. This avoids the condenser affecting the arrangement of components on the PCB, and the cabinet provides ample space for a larger condenser with better cooling performance, thereby improving the heat dissipation effect on the PCB.

[0019] The third aspect provides a data center comprising a server rack and the aforementioned single-board unit; wherein the first quick-connect connector and the second quick-connect connector are connected in a one-to-one correspondence; the evaporator and the condenser are connected through the first and second heat dissipation pipes to form a heat dissipation loop. This improves the heat dissipation effect on the single-board unit. When adopting the above structure, the quick-connect connection between the condenser and the evaporator is achieved through the cooperation of the first and second quick-connect connectors. The condenser can be installed inside the server rack, thus not being limited by the size of the single-board unit. On the one hand, this avoids the condenser affecting the arrangement of components on the single-board unit; on the other hand, there is sufficient space inside the server rack to install a larger condenser with better cooling performance, thereby improving the heat dissipation effect on the single-board unit. Furthermore, by installing a switching valve on at least the first pipe, it is ensured that the working fluid inside the single-board unit remains essentially consistent when it is unplugged while powered on or off. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a single board in the prior art;

[0021] Figure 2 This is a schematic diagram illustrating the application scenario of the single board provided in the embodiments of this application;

[0022] Figure 3 This is a schematic diagram of the structure of a single board provided in an embodiment of this application;

[0023] Figure 4 This is a schematic diagram showing the measured work quality of a single board under different conditions of the heat dissipation loop.

[0024] Figure 5 This is a schematic diagram illustrating the effect of the working fluid on the heat dissipation efficiency in the heat dissipation loop.

[0025] Figure 6 This is a schematic diagram of the structure of another single board provided in an embodiment of this application;

[0026] Figure 7 This is a schematic diagram of the cabinet structure provided in an embodiment of this application;

[0027] Figure 8 A schematic diagram of the structure of a data center provided in an embodiment of this application. Detailed Implementation

[0028] The single-board provided in this application embodiment can be applied to data communication equipment, servers, and energy equipment to support the single-board in the aforementioned equipment. With the promotion of ICT application technologies such as AR / VR, 5G, and cloud computing, the device density and power on the single-board are rapidly increasing. Microelectronic components are dissipating more and more power while their package size is getting smaller and smaller, thus placing increasingly higher demands on the heat dissipation of the single-board. To improve heat dissipation efficiency, existing single-board technologies often incorporate a heat dissipation system to cool the chips, such as... Figure 1As shown, a single-board 1 has an evaporator 3 attached to the chip, and a condenser 2 is also provided on the single-board 1. The evaporator 3 and the condenser 2 form a heat dissipation loop through pipes. The heat generated by the chip is absorbed by the working fluid in the evaporator 3, and the working fluid enters the condenser 2 through pipes for cooling, and then flows back to the evaporator 3 to absorb the heat generated by the chip again. When using the above heat dissipation method, the condenser 2 is affected by the size of the single-board 1, resulting in poor condensation effect. On the other hand, the condenser 2 also occupies space on the single-board 1, affecting the layout of the devices. Therefore, this application provides a single-board 1 to improve the heat dissipation effect of the single-board 1. The following is a detailed description with reference to the specific drawings and embodiments.

[0029] refer to Figure 2 , Figure 2 This illustration shows the application of the single-board 10 provided in this embodiment in a data center scenario. The data center includes a server rack and the single-board 10. In use, the single-board 10 is inserted into the server rack to realize the main functions of the data center.

[0030] The server rack includes a cabinet body 20 and a back panel 22 disposed within the cabinet body 20. The back panel 22 is fixedly connected to the cabinet body 20 by clips or threaded connectors (bolts or screws, etc.). When the single board 10 is inserted into the server rack, the single board 10 and the back panel 22 are electrically connected by a connector.

[0031] To improve the heat dissipation of the single board 10, a heat dissipation loop consisting of an evaporator 11 and a condenser 21 is used to dissipate heat from the chips on the single board 10. The evaporator 11 is installed on the single board 10, and the condenser 21 is installed inside the cabinet. The condenser 21 and the evaporator 11 are connected by pipes.

[0032] During operation, the electronic components on the single board 10 are cooled by a heat dissipation loop consisting of condenser 21 and evaporator 11. A working fluid flows within the heat dissipation loop; as the working fluid flows past the evaporator 11 below the electronic components, it absorbs the heat generated by the electronic components, thereby achieving heat dissipation. In this embodiment, the electronic components include, but are not limited to, chips, capacitors, inductors, and other electronic components that generate high amounts of heat. Figure 1 The location of electronic devices illustrated by the chip example.

[0033] The working fluid refers to the medium used in various machines to convert thermal energy into other forms of energy; it is also called the thermodynamic working fluid. The working fluid is generally a fluid (gas or liquid); for example, common working fluids include kerosene and water. During operation, the working fluid exists in both liquid and gaseous states. When the working fluid flows through the evaporator 11, it absorbs heat transferred from the electronic devices and changes from a liquid to a gaseous state (evaporation). When the gaseous working fluid flows through the condenser 21, it releases heat and changes from a gaseous state to a liquid state (condensation). The working fluid continuously transforms between liquid and gaseous states, carrying away the heat generated by the electronic devices to achieve heat dissipation.

[0034] When the above structure is adopted, the condenser 21 is placed in a large space inside the cabinet, so a larger condenser 21 can be installed. As the size of the condenser 21 increases, its heat dissipation effect also increases, thereby increasing the heat dissipation effect on the single board 10.

[0035] The condenser 21 and evaporator 11 are connected by a detachable pipe. When the single-board 10 is plugged into the back panel 22, the detachable pipe allows for simultaneous plugging and unplugging of the evaporator 11 and condenser 21. For ease of description, the pipe connected to the evaporator 11 is named the first heat dissipation pipe 12, and the pipe connected to the condenser 21 is named the second heat dissipation pipe 23. When the single-board 10 is connected to the back panel 22, the first heat dissipation pipe 12 and the second heat dissipation pipe 23 are connected, forming a heat dissipation loop between the evaporator 11 and the condenser 21. To facilitate understanding of the above structure, the structures of the single-board 10 and the cabinet are described below.

[0036] refer to Figure 3 , Figure 3 The illustration shows a single-board 10 provided in an embodiment of this application. The single-board 10 includes a board body 13, which serves as a support structure for carrying electronic devices that implement the electrical functions of the single-board 10. Exemplarily, the electronic devices can be active or passive devices, and are not specifically limited in this application, such as chips, capacitors, inductors, etc.

[0037] The single board 10 also includes an evaporator 11 and a first heat dissipation pipe 12 connected to the evaporator 11. The evaporator 11 is disposed on the board body 13, and the specific disposal method can be directly fixed to the surface of the board body 13, completely embedded in the board body 13, or partially embedded in the board body 13. For example, the single board 10 is provided with a groove, the evaporator 11 is fixed in the groove, and one surface of the evaporator 11 is exposed outside the groove. The evaporator 11 exposed on the surface of the board body 13 can be used to support electronic devices, such as chips. During assembly, the chip and the evaporator 11 are directly attached to each other, improving the heat exchange effect between the chip and the evaporator 11. Of course, the evaporator 11 can also be directly disposed on the surface of the board body 13, or completely embedded in the board body 13 without being exposed, etc., which will not be described in detail here.

[0038] The first heat dissipation pipe 12 is divided into a first pipe 121 and a second pipe 122. The first pipe 121 and the second pipe 122 are connected to the input and output ends of the evaporator 11 respectively. For example, the first pipe 121 is connected to the input end of the evaporator 11, and the second pipe 122 is connected to the output end of the evaporator 11. The working fluid flowing in the first pipe 121 is liquid, and the first pipe 121 can also be called a liquid pipe; the working fluid flowing in the second pipe 122 is gaseous, and the second pipe 122 can also be called a gas pipe. Alternatively, the first pipe 121 can be connected to the output end of the evaporator 11, and the second pipe 122 can be connected to the input end of the evaporator 11. In this embodiment, the first pipe 121 is described as a liquid pipe, and the second pipe 122 as a gas pipe.

[0039] When setting the first heat dissipation pipe 12, the first heat dissipation pipe 12 is embedded in the single board 10. However, it should be understood that in addition to the above-mentioned embedding method, the first heat dissipation pipe 12 can also be installed in other ways, such as semi-embedded or set on the surface of the board 13, which will not be listed here. The material of the first heat dissipation pipe 12 is not limited, and it can be copper pipe, stainless steel flexible hose, aluminum pipe, etc.

[0040] To facilitate connection with the second heat dissipation pipe, a first quick-connect coupling 15 is provided at the end of the first pipe 121 and the second pipe 122 away from the evaporator 11. The first quick-connect coupling 15 has a sealing function. When the first heat dissipation pipe 12 and the second heat dissipation pipe are separated, the first quick-connect coupling 15 can seal the first pipe 121 and the second pipe 122, thereby preventing leakage of the working fluid in the first heat dissipation pipe 12.

[0041] In the heat dissipation loop, the liquid working fluid at the evaporation end (evaporator 11 side) turns into a gaseous state upon heating, while the heat dissipation working fluid at the condensation end (condenser side) turns into a liquid state upon cooling. Therefore, under different operating temperature conditions, the amount of cooling working fluid remaining in the evaporation end pipe (first heat dissipation pipe 12) and the condensation end pipe (second heat dissipation pipe) will not be completely consistent. When the evaporation end pipe inside the board 10 is plugged in and out of the condensation end pipe outside the board, the total amount of cooling working fluid in the entire heat dissipation loop will be inconsistent under different temperature conditions, resulting in inconsistent heat dissipation capacity of the entire heat dissipation loop.

[0042] For example, such as Figure 4 As shown, the measured mass of the cooling media on the single board under different states of the heat dissipation loop differs significantly between the unpowered, cold state and the fully powered-on state. For example, when the single board is at low power consumption, the liquid mass at the evaporation end is 211.6g. However, when the single board is at 100W power consumption, the liquid mass at the evaporation end is 161.8g, a decrease of 49.8g in cooling media. As the power consumption of the single board gradually increases, the mass of the cooling media at the evaporation end gradually decreases, especially when the power consumption is below 100W, the rate of decrease is faster. If a single board in a cooling state is used to replace a working, hot single board, the amount of cooling media remaining at the evaporation end after the single board is swapped will be too large, resulting in the heat dissipation capacity of the loop being significantly affected by the amount of internal cooling media. At the same time, if a single board in a working state is removed, there will be less cooling media inside the single board. Therefore, when this single board is used with another backplane, the amount of cooling media in the new heat dissipation loop formed by the evaporator and condenser will be reduced.

[0043] Too little or too much working fluid will reduce the heat exchange efficiency of the heat dissipation loop, such as... Figure 5 As shown, too much working fluid will increase both evaporation and condensation thermal resistance, limiting the heat dissipation capacity of the chips on the board and leading to higher chip operating temperatures. Conversely, too little working fluid will cause "dry burning" at the evaporation end within the board, causing a sharp rise in chip temperature and increasing the likelihood of overheating damage. Figure 5 As shown, when the liquid level (liquid working fluid) is below 40%, the chip temperature spikes dramatically.

[0044] To avoid affecting heat dissipation when replacing the circuit board, the circuit board provided in this application embodiment is equipped with a switching valve 14 on the first pipe 121 or the second pipe 122 to control the closure of the first pipe 121 or the second pipe 122. For example, when the first pipe 121 is connected to the input end of the evaporator, a switching valve 14 is provided on the first pipe 121 to control its conduction. Effective control of the working fluid mass is achieved by setting a switching valve 14 to control the working fluid in the heat dissipation loop. The switching valve 14 can be a normally open solenoid valve (closed when energized, open when de-energized), a temperature valve (closed at a certain temperature, open at a certain temperature), or other control valves that achieve the same purpose. The switching valve 14 controls the working fluid mass at the evaporator end to remain stable, ensuring that the cooling capacity of the entire heat dissipation loop remains constant after the circuit boards are swapped at different temperatures. For example, the switching valve 14 can be a solenoid valve, a shape memory alloy temperature control valve, or other valves that can achieve working fluid mass distribution control. To facilitate understanding of the circuit board provided in this application embodiment, it is described in detail below with reference to specific drawings.

[0045] When setting the switch valve 14, it can be installed on different pipes. For example, the switch valve 14 is installed on the first pipe 121, located at the end of the first pipe 121 near the first quick-connect fitting 15, so that the switch valve 14 can cooperate with the first quick-connect fitting 15 to seal the working fluid. Of course, the switch valve 14 can also be installed at other locations on the first pipe 121, which is not specifically limited in this embodiment. Alternatively, switch valves 14 can be installed on both the first pipe 121 and the second pipe 122. When the single-board is powered off and not in operation, the liquid working fluid in the condenser may flow back into the single-board through the first pipe 121, and a small portion of the liquid working fluid may also flow back into the single-board through the second pipe 122. To avoid the backflow of liquid working fluid leading to an increase in the mass of the working fluid in the single-board, when setting the switch valve 14, switch valves 14 are installed on both the first pipe 121 and the second pipe 122, so that after the single-board is powered off, the first pipe and the second pipe are closed respectively by the two switch valves 14, preventing the liquid working fluid in the condenser from flowing into the single-board. To ensure that the mass of the liquid working fluid inside the single board remains basically consistent when the single board is powered on or off, so as to avoid affecting the mass of the working fluid in the entire heat dissipation loop when the single board is plugged in or unplugged.

[0046] The switching valve 14 can be controlled by an electrical signal or a temperature signal, which will be explained below.

[0047] When the switching valve 14 is controlled by an electrical signal, the switching valve 14 can be a solenoid valve, which can be controlled by a control unit on the single board 10. If the switching valve 14 is a solenoid valve, the control unit can be used to control the opening and closing of the solenoid valve. When the single board 10 is inserted into the back plate, the single board 10 is energized, and the control unit controls the solenoid valve to open based on the detected energization signal of the single board 10. When the single board 10 is removed from the back plate, the single board 10 is de-energized, and the control unit controls the solenoid valve to close based on the detected de-energization signal of the single board 10. In the above state, the solenoid valve is a normally closed control valve, so that it can remain normally closed after the single board 10 is de-energized, thus cooperating with the first quick-connect fitting 15 at the port of the first pipe 121 to seal the working fluid inside the pipe.

[0048] The control unit can be a control circuit installed on board 13. When board 10 is electrically connected to the backplane of the cabinet, the control circuit controls the solenoid valve to conduct. Of course, the control unit can also be a common control unit that can control the solenoid valve, such as a PLC or a relay.

[0049] When using the above-mentioned electrical control, the switch valve 14 remains normally closed when the single board 10 is powered off, and opens after the single board 10 is powered on (correctly inserted into the frame). It can open immediately or after a delay, such as 10ms, 15ms, or 20ms.

[0050] When temperature control is used for the switching valve 14, the switching valve 14 can be a temperature valve, such as a shape memory alloy temperature control valve. When the board 10 is powered on, the control part (shape memory alloy) in the shape memory alloy temperature control valve contracts, causing the valve to open. When the board 10 is powered off, the control part (shape memory alloy) in the shape memory alloy temperature control valve contracts, causing the valve to open.

[0051] Alternatively, the switching valve 14 can also be an electromagnetic control valve. Correspondingly, the board 10 also includes a sensor and a control unit. The sensor is used to detect the temperature of the heat source (chip), and the control unit is used to control the electromagnetic control valve to open when the temperature detected by the sensor exceeds a set value. For example, the switching valve 14 opens when the chip temperature is greater than 80 degrees (T1 threshold) and closes when the chip temperature is lower than 60 degrees (T2 threshold).

[0052] When specifically controlling the aforementioned switching valve 14, either individual temperature control and electrical control can be used, or a combination of temperature control and electrical control can be used to control the switching valve 14. No specific limitation is made in the embodiments of this application.

[0053] Between the single plate 10 and the back plate, the single plate 10 is filled with working fluid. In order to facilitate the working fluid to be flushed into the pipes on the single plate 10, a filling hole 16 is also provided on the single plate 10. The working fluid can be filled into the first pipe 121, the second pipe 122 and the evaporator 11 through the filling hole 16.

[0054] The filling hole 16 can be provided on the first pipe 121, the second pipe 122, or the evaporator 11. For example, the filling hole 16 is provided on the second pipe 122; however, it should be understood that in this embodiment, the filling hole 16 can be provided at different locations as needed, and no specific limitation is made in this embodiment. The filling hole 16 also serves as a vacuum hole for evacuating the pipes on the single-board 10. For example, a vacuum pump is connected to the filling hole 16 to perform vacuum evacuation, and then the filling pump fills the pipes with working fluid through the filling hole 16.

[0055] When filling the single-plate 10 with liquid, the amount of working fluid inside the single-plate 10 is based on the working fluid content in the first heat dissipation pipe 12 when the single-plate 10 is in working condition. For example, when the single-plate 10 is normally powered on and working, if the working mass inside the single-plate 10 is 100g to 180g, then the working mass filled into the pipe inside the single-plate 10 will be between 100g and 180g, such as 100g, 130g, 150g, etc. When using the working mass inside the single-plate 10 as the working mass contained in the single-plate 10 during normal operation, excessive working fluid filling is avoided, which would result in excessive working mass in the heat dissipation loop composed of the evaporator 11 and condenser after the single-plate 10 is connected to the back plate, affecting the heat dissipation effect of the entire heat dissipation loop. Meanwhile, when the single plate 10 is powered off, the switch valve 14 closes, and the liquid working fluid of the condenser cannot flow into the pipe of the single plate 10, so that the working fluid in the single plate 10 remains basically unchanged. This ensures that when the single plate 10 is inserted into other back plates, the change in the working fluid in the heat dissipation loop composed of the evaporator 11 and the condenser is not too large.

[0056] To facilitate understanding of the changes in the working fluid within board 10, the operating state of board 10 is described in detail. After board 10 is powered on, the solenoid valve opens, connecting evaporator 11 and condenser to form a heat dissipation loop. When the chip powers on and generates heat, the liquid working fluid evaporates and absorbs heat in evaporator 11, becoming gaseous. It then enters the condenser through the second pipe 122, where it condenses and releases heat, returning to liquid form. This liquid working fluid then returns to evaporator 11 through the first pipe 121, thus forming a circulation loop for heat transfer. When board 10 is powered off, the solenoid valve quickly closes, disconnecting the heat dissipation loop, and the amount of working fluid in the entire loop remains constant. As can be seen from the above description, whether board 10 is plugged in or unplugged while powered on (operating state) or powered off (non-operating state), the working fluid quantity on the corresponding board 10 remains essentially consistent. Therefore, replacing board 10 or swapping boards 10 in different slots during maintenance will not cause significant changes in the working fluid quantity in the loop, thus maintaining the stability of the heat dissipation capacity.

[0057] Continue to refer to Figure 3 The main heat source device on the single board 10 has two chips. Correspondingly, two evaporators 11 are installed on the single board 10, and the two evaporators 11 are in thermal contact with two corresponding devices.

[0058] It should be understood that, in the embodiments of this application, the number of heat sources is not limited to... Figure 3 The two shown can also be three, four, or other different numbers. The corresponding number of evaporators 11 can also be multiple. When multiple evaporators 11 are used, they are connected in parallel, such as... Figure 3 As shown, the first pipe 121 and the second pipe 122 are arranged on both sides of each evaporator 11 and are respectively connected to the input end and the output end of each evaporator 11.

[0059] refer to Figure 6 , Figure 6 It shows the basis Figure 3 One modified structure of the single plate 10 shown is as follows: Figure 6 Some of the labels in the text can be referenced. Figure 3 The same reference numerals are used in the diagram. To prevent the working fluid in the first heat dissipation pipe 12 from flowing back into the condenser when the single board 10 is inserted into the back plate, a liquid accumulation chamber 17 is provided on the first pipe 121. The liquid accumulation chamber 17 acts as a buffer and stabilizes the distribution of the working fluid, which can prevent the problem of some liquid working fluid in the first pipe 121 flowing back into the condenser when the single board 10 is first powered on and started, due to the sudden increase in pressure in the evaporator 11, resulting in low heat exchange efficiency of the condenser.

[0060] For example, the liquid collection chamber 17 is located on the side of the switching valve 14 away from the evaporator 11, that is, the liquid collection chamber 17 is located between the first quick-connect fitting 15 of the first pipe 121 and the switching valve 14. When backflow occurs in the first pipe 121, the working fluid will flow into the liquid collection chamber 17, preventing it from flowing back into the condenser. In addition, the liquid collection chamber 17 can store excess working fluid, preventing excessive working fluid from affecting the heat dissipation effect of the entire heat dissipation loop.

[0061] To better demonstrate the effect of the liquid accumulation chamber 17, actual measurements were performed on single-plate 10s with and without the liquid accumulation chamber 17. The single-plate 10 with the liquid accumulation chamber 17 showed a 2-3°C improvement in subcooling compared to the single-plate 10 without the liquid accumulation chamber. Furthermore, under a measured 300W load, the single-plate 10 with the liquid accumulation chamber 17 showed a 2.8°C improvement in superheat compared to the single-plate 10 without the liquid accumulation chamber 17.

[0062] refer to Figure 7 This application also provides a cabinet, which includes a cabinet body 20, a condenser 21 disposed within the cabinet body 20, and a second heat dissipation pipe 23 for transferring working fluid. The second heat dissipation pipe 23 includes a third pipe 231 and a fourth pipe 232; the third pipe 231 and the fourth pipe 232 are respectively connected to the input and output ends of the condenser 21. For example, the third pipe 231 is connected to the input end of the condenser 21, and the fourth pipe 232 is connected to the output end of the condenser 21; alternatively, the third pipe 231 can be connected to the output end of the condenser 21, and the fourth pipe 232 can be connected to the input end of the condenser 21.

[0063] To facilitate connection with the second heat dissipation pipe 23 and the first heat dissipation pipe, the third pipe 231 and the fourth pipe 232 are respectively provided with a second quick-connect connector 25 for mates with the first quick-connect connector at their ends away from the condenser 21. When the single board 10 is installed in the cabinet, the single board 10 is plugged into the back panel 22. When the single board 10 is inserted into the back panel 22, the first quick-connect connector and the second quick-connect connector 25 are connected one-to-one, and the evaporator and the condenser 21 are connected through the first heat dissipation pipe and the second heat dissipation pipe 23 to form a heat dissipation loop.

[0064] To improve the heat dissipation effect of condenser 21, condenser 21 can have tube-fin or parallel flow heat exchange fins. The material of the pipes inside condenser 21 is not limited, and can be copper pipes, stainless steel flexible hoses, etc. When air flows through the fins of condenser 21, the cold air exchanges heat with the fins and loses heat, and the working fluid in condenser 21 condenses and releases heat, becoming liquid.

[0065] In addition, a fan assembly 24 is installed inside the cabinet. This fan assembly 24 is used to supply air to the condenser 21 to improve the condensation effect of the condenser 21. The air supplied by the fan assembly 24 can flow through the condenser 21, carrying away the heat of the working fluid and causing the working fluid to change from a gaseous state to a liquid state.

[0066] As an optional solution, a switching valve 26 can also be installed on the second heat dissipation pipe 23. For example, the switching valve 26 is installed on the third pipe 231 to prevent the liquid working fluid in the condenser 21 from flowing into the single plate when the single plate is cut off. The control method of the switching valve 26 can refer to the control method of the switching valve on the single plate, and will not be described in detail here.

[0067] It should be understood that when multiple slots for mates with single-board 10 are provided in the rack, a corresponding condenser 21 is provided for each single-board 10, so that each single-board 10 can form a corresponding heat dissipation loop when mates with the backplane 22. Alternatively, a single condenser 21 can be provided, but the condenser 21 contains multiple internal pipes, each corresponding to a single-board 10, to form a corresponding heat dissipation loop.

[0068] refer to Figure 8 This application also provides a data center, which includes a server rack and a single board inserted into the server rack. Figure 8 Some of the labels in the text can be referenced. Figure 3 and Figure 7 The same label in the text.

[0069] The single board 10 contains two chip heat sources, and there are also two corresponding evaporators 11. The chips and evaporators 11 are in one-to-one thermal contact. The cabinet is equipped with a condenser 21 and a fan group 24. The condenser 21 and the evaporator 11 are connected by a sealed pipe. A switch valve 14 is installed on the pipe. The single board 10 and the externally extended condenser 21 are connected by a quick-connect device (a first quick-connect connector and a second quick-connect connector). The quick-connect device can realize the quick installation or disconnection of the single board 10 and the condenser 21.

[0070] Generally, the single board 10, which performs business functions within the overall system, requires plug-and-play installation and maintenance. By setting a quick-connect device on the heat dissipation loop, the evaporator end of the single board 10 and the condenser 21 can be plugged and unplugged separately, overcoming the defect that the external condenser 21 of the single board 10 cannot be plugged and unplugged together with the single board 10 due to space and reliability limitations. At the same time, a switching valve 14 is set on the pipeline of the evaporator end (or condenser end), which can overcome the defect that the mass distribution in the heat pipe of the loop is greatly changed due to the plugging and unplugging of the single board 10 in different scenarios by controlling the on / off state of the switching valve 14.

[0071] The heat dissipation loop is divided into an evaporator end and a condenser end. Each end has a first quick-connect fitting. When the first quick-connect fitting is inserted into a second quick-connect fitting, the entire heat dissipation loop is connected as a single unit and can operate normally. When the first quick-connect fitting is removed, the loop is disconnected, and the loop splits into two parts: the evaporator end and the condenser end. A switching valve 14 is installed along the entire heat dissipation loop. Figure 8 The example illustrates the installation of a switching valve (14) on the single board. The switching valve 14 is controlled by whether the power is on or off, or by other methods such as whether the temperature reaches a certain threshold. For instance, when the cabinet is powered on, the single board 10 is inserted into the cabinet, and the first quick-connect connector connects to form an integrated heat dissipation loop. Simultaneously, the connector of the single board 10 is inserted into the connector of the backplane 22, achieving electrical connection, and the single board is powered on. The switching valve 14 on the heat dissipation loop is energized and the heat dissipation loop operates normally. In this state, if the single board 10 is pulled out, the first quick-connect connector disconnects, the heat dissipation loop is in a split state, the connector of the single board 10 and the connector of the backplane 22 are simultaneously separated, the switching valve 14 on the heat dissipation loop is de-energized, and the working fluid distribution in the heat dissipation loop remains consistent with the normal connected and powered-on operating state. When the cabinet is powered off, and board 10 is inserted into the cabinet, the first quick-connect connector and the second quick-connect connector connect and form an integrated heat dissipation loop. Simultaneously, the connector of board 10 inserts into the connector of backplane 22, establishing an electrical connection, but the board is not powered on. The switching valve 14 on the heat dissipation loop remains in the powered-off, open state, and the working fluid distribution in the heat dissipation loop remains consistent with the open state before board 10 insertion, i.e., consistent with the normal connected and powered-on operating state.

[0072] As can be seen from the above description, in this embodiment, by extending the condenser 21 to an area outside the single board 10, the heat dissipation area can be effectively expanded without being limited by the space and layout of the single board 10, thereby increasing the heat dissipation capacity. Furthermore, by setting a quick-connect device on the pipes of the heat dissipation loop, the problem of quick connection and disconnection of the pipes is solved. This allows the condenser 21 to be placed outside the single board 10, avoiding the problem of limited heat dissipation capacity caused by the space and layout limitations of the single board 10, while reducing the space occupied on the single board 10 and improving the device layout space of the single board. The size and heat dissipation area of ​​the condenser 21 can be effectively adjusted according to the chip power consumption and heat dissipation requirements to achieve a more flexible heat dissipation effect. In addition, when the evaporation end inside the single board 10 and the condensation end outside the board are separately plugged in and out, after replacement under different temperature conditions, the total amount of cooling medium in the entire heat dissipation loop is kept as consistent as possible to ensure consistent cooling capacity of the entire heat dissipation loop.

[0073] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A single-board unit, characterized in that, It includes: a plate, an evaporator disposed on the plate, and a first heat dissipation pipe embedded in the plate for conveying working fluid, wherein the first heat dissipation pipe includes a first pipe and a second pipe. The first pipe and the second pipe are respectively connected to the input end and the output end of the evaporator; The first pipe and the second pipe are each provided with a first quick-connect coupling at the end away from the evaporator; The first pipe is connected to the input end of the evaporator; and at least the first pipe is equipped with a switch valve. Both the first pipe and the second pipe are equipped with a switch valve, which is in a closed / disconnected state when the single board is powered off and not in operation.

2. The single board as described in claim 1, characterized in that, The switching valve is an electromagnetic control valve; The single board also includes a control unit, which is used to control the opening and closing of the electromagnetic control valve.

3. The single board as described in claim 2, characterized in that, The control unit is a control circuit installed on the board. When the board is electrically connected to the back panel of the cabinet, the control circuit controls the electromagnetic control valve to open.

4. The single board as described in claim 2, characterized in that, The single board also includes a sensor for detecting the temperature of the heat source on the single board; When the temperature detected by the sensor exceeds a set value, the control unit controls the electromagnetic control valve to open.

5. The single board as described in claim 1, characterized in that, The first pipe is provided with a liquid accumulation chamber.

6. The single board as described in claim 5, characterized in that, The liquid accumulation chamber is located on the side of the switch valve away from the evaporator.

7. The single board as described in claim 1, characterized in that, The first pipe, the second pipe, or the evaporator is provided with a liquid filling hole.

8. The single board as described in any one of claims 1 to 7, characterized in that, The number of evaporators is multiple, and the multiple evaporators are connected in parallel.

9. A data center, characterized in that, include: A cabinet includes a cabinet body, a condenser disposed within the cabinet body, and a second heat dissipation pipe for transferring working fluid; the second heat dissipation pipe includes a third pipe and a fourth pipe; the third pipe and the fourth pipe are respectively connected to the input end and the output end of the condenser; the ends of the third pipe and the fourth pipe away from the condenser are respectively provided with a second quick-connect connector for engaging with a first quick-connect connector; as well as The single board as described in any one of claims 1 to 8 is used for insertion into the cabinet, wherein, The first quick-release connector and the second quick-release connector are connected in a one-to-one correspondence. The evaporator and the condenser are connected by the first heat dissipation pipe and the second heat dissipation pipe to form a heat dissipation loop.

Images