Memory expansion device

Abstract

The application discloses a memory expansion device which comprises a shell (10) and a memory expansion component (30), the shell (10) is provided with a contact surface (11), a heat dissipation surface (12) and a heat conduction port (14), the shell (10) is provided with a containing cavity (13), the heat conduction port (14) penetrates through the contact surface (11) and the heat dissipation surface (12) and is arranged separately from the containing cavity (13); the memory expansion component (30) is arranged in the containing cavity (13). When the contact surface of the shell is in contact with the outer surface of a computer host, part of heat dissipation holes on the bottom of the computer host are in communication with the heat conduction port (14) on the shell (10) correspondingly, so that the heat on the computer host can be dissipated to the side where the heat dissipation surface (12) is located through the heat conduction port (14), the heat on the computer host can be dissipated in time, and the heat dissipation of the computer host is facilitated.

Description

Technical Field

[0001] This application relates to the field of computer technology, and more specifically to a memory expansion device. Background Technology

[0002] With the development of microelectronics technology and industrial informatization, computers are being used more and more widely in various fields. A computer, commonly known as a PC, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and also has storage and memory functions.

[0003] Currently, with the rapid development of computers, existing computer systems have increasingly higher requirements for storage capacity. During the use of computers, insufficient memory capacity may occur, requiring memory capacity expansion to meet the business needs of data centers. As a result, memory expansion docks have emerged. Summary of the Invention

[0004] The purpose of this application is, but is not limited to, solving the technical problem in the prior art where, when a memory expansion dock is in contact with a computer host, it blocks some of the heat dissipation holes on the computer host, thereby affecting the heat dissipation of the computer host.

[0005] The technical solution adopted in the embodiments of this application is:

[0006] A memory expansion device is provided, comprising:

[0007] A housing, having a contact surface, a heat dissipation surface, and a heat conduction port on its surface, and an internal receiving cavity within the housing, wherein the heat conduction port penetrates the contact surface and the heat dissipation surface and is separated from the receiving cavity; and

[0008] A memory expansion component is disposed within the receiving cavity.

[0009] In one embodiment, the contact surface is disposed opposite to the heat dissipation surface, and the housing is further provided with a plurality of air inlets and a plurality of air outlets, the air inlets and the air outlets being connected to the receiving cavity and located on the side of the heat dissipation surface.

[0010] In one embodiment, the circumferential region of the heat dissipation surface corresponding to the heat conduction port is recessed towards the contact surface to form a flow guide groove, and the circumferential region of the heat dissipation surface corresponding to the air inlet and the air outlet is inclined towards the flow guide groove.

[0011] In one embodiment, a plurality of anti-slip pads are also included, the plurality of anti-slip pads being spaced apart on the heat dissipation surface.

[0012] In one embodiment, the contact surface includes a middle region, a transition region, and an edge region. The transition region surrounds the periphery of the middle region, and the edge region surrounds the periphery of the transition region. The receiving cavity is correspondingly disposed to the middle region, and the heat conduction port is correspondingly disposed to the transition region. A wiring cavity is provided inside the housing, and the wiring cavity is correspondingly disposed to the edge region and communicates with the receiving cavity.

[0013] In one embodiment, the central region is recessed relative to the edge region to form a placement groove.

[0014] In one embodiment, the transition region is inclined relative to the edge region and faces the center of the intermediate region.

[0015] In one embodiment, the housing includes a front shell and a bottom shell, the bottom shell and the front shell being connected to form the receiving cavity and the wiring cavity, the side of the front shell facing away from the bottom shell being the contact surface, the side of the bottom shell facing away from the front shell being the heat dissipation surface, and the heat conduction port penetrating through the front shell and the bottom shell.

[0016] In one embodiment, one of the front shell and the bottom shell is provided with a slot, and the other of the front shell and the bottom shell is provided with a buckle. The buckle and the slot are both provided corresponding to the transition area, and the buckle and the slot engage with each other.

[0017] In one embodiment, the front shell is an aluminum shell and the bottom shell is a plastic shell.

[0018] In one embodiment, the memory expansion component is positioned close to the heat dissipation surface.

[0019] In one embodiment, the memory expansion component includes a circuit board and an expansion card, the expansion card being detachably mounted on the circuit board.

[0020] In one embodiment, the circuit board is provided with a card holder and an elastic limiting post, the card holder and the elastic limiting post are arranged at intervals relative to each other, and the expansion card is snapped between the card holder and the elastic limiting post.

[0021] In one embodiment, the elastic limiting post is a silicone particle.

[0022] In one embodiment, the housing is provided with a mounting port communicating with the receiving cavity, and the mounting port is located on the side of the heat dissipation surface; the memory expansion device further includes a cover plate that covers the mounting port; the expansion card is correspondingly provided with the mounting port.

[0023] In one embodiment, the cover plate has multiple heat dissipation fins on the side opposite to the receiving cavity.

[0024] In one embodiment, an indicator light assembly is further included, which is disposed on the housing and electrically connected to the circuit board for indicating the working status of the expansion card.

[0025] In one embodiment, when the expansion card is not working, the indicator light assembly displays a first color light; when the expansion card is not assembled on the circuit board, the indicator light assembly displays a second color light; when the expansion card is properly connected and can work, the indicator light assembly displays a third color light, wherein the first color light, the second color light, and the third color light are each different colors of light.

[0026] In one embodiment, a data transmission line is further included, one end of which is electrically connected to the memory expansion component, and the other end extends through the outer peripheral sidewall of the housing to the outside of the housing.

[0027] In one embodiment, the number of data transmission lines is two, and the two data transmission lines are arranged side by side.

[0028] The beneficial effects of the memory expansion device provided in this application are as follows: The memory expansion device includes a housing and a memory expansion component. The memory expansion component is used to store programs and various data to expand the memory of the computer host. By opening a heat-conducting port on the housing that penetrates the contact surface and the heat dissipation surface, when the contact surface of the housing contacts the outer surface of the computer host, some heat dissipation holes on the bottom of the computer host are connected to the heat-conducting port on the housing. Thus, the heat on the computer host can be dissipated to the side where the heat dissipation surface is located through the heat-conducting port, so that the heat on the computer host can be dissipated in a timely manner, which is beneficial to ensuring the heat dissipation of the computer host. Moreover, the heat-conducting port is separated from the receiving cavity, which effectively prevents the heat dissipated by the computer from entering the receiving cavity through the heat-conducting port and damaging the memory expansion component. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A three-dimensional structural diagram of the memory expansion device provided in the embodiments of this application. Figure 1 ;

[0031] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the memory expansion device.

[0032] Figure 3 A three-dimensional structural diagram of the memory expansion device provided in the embodiments of this application. Figure 2 ;

[0033] Figure 4 for Figure 3 An exploded view of the memory expansion device shown. Detailed Implementation

[0034] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0035] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0036] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0038] Please refer to the following: Figures 1 to 4 Some embodiments of this application provide a memory expansion device for expanding the memory of a computer host to improve its operating speed and smoothness. Specifically, in this embodiment, the computer host is a Mac SDIO. It is understood that the memory expansion device of this application is primarily adapted to the Mac SDIO, i.e., used to expand the Mac SDIO's memory. Additionally, it can also serve as a dedicated stand for the Mac SDIO to support it.

[0039] Specifically, please refer to the following: Figure 1 and Figure 2 The memory expansion device includes a housing 10 and a memory expansion assembly 30. The housing 10 has a contact surface 11, a heat dissipation surface 12, and a heat conduction port 14. A receiving cavity 13 is provided inside the housing 10. The heat conduction port 14 penetrates the contact surface 11 and the heat dissipation surface 12 and is separated from the receiving cavity 13. Understandably, the heat conduction port 14 is not connected to the receiving cavity 13. The memory expansion assembly 30 is disposed within the receiving cavity 13 and is used to store programs and various data.

[0040] In use, the computer host is placed on the contact surface 11 of the housing 10. Some of the heat dissipation holes on the bottom of the computer host are connected to the heat conduction ports 14 on the housing 10, allowing the computer host to dissipate heat through the heat conduction ports 14. Understandably, the heat dissipated by the computer host through the heat dissipation holes corresponding to the heat conduction ports 14 can be dissipated to the side of the heat dissipation surface 12 of the housing 10. Simultaneously, the cool airflow on the side of the heat dissipation surface 12 can also flow into the computer host through the heat conduction ports 14 and the corresponding heat dissipation holes. The memory expansion component 30 is electrically connected to the computer host to expand its memory.

[0041] Compared with the prior art, the memory expansion device provided in this application includes a housing 10 and a memory expansion component 30. The memory expansion component 30 is used to store programs and various data to expand the memory of the computer host. By opening a heat conduction port 14 on the housing 10 that penetrates the contact surface 11 and the heat dissipation surface 12, when the contact surface 11 of the housing 10 contacts the outer surface of the computer host, some heat dissipation holes on the bottom of the computer host are connected to the heat conduction port 14 on the housing 10. Thus, the heat on the computer host can be dissipated to the side where the heat dissipation surface 12 is located through the heat conduction port 14, so that the heat on the computer host can be dissipated in a timely manner, which is beneficial to ensuring the heat dissipation of the computer host. Moreover, the heat conduction port 14 is separated from the receiving cavity 13, which effectively prevents the heat dissipated by the computer from entering the receiving cavity 13 through the heat conduction port 14 and damaging the memory expansion component 30.

[0042] In another embodiment of this application, the contact surface 11 includes a middle region 110, a transition region 111, and an edge region 112. The transition region 111 surrounds the periphery of the middle region 110, and the edge region 112 surrounds the periphery of the transition region 111. The receiving cavity 13 is correspondingly disposed with respect to the middle region 110, and the heat conduction port 14 is correspondingly disposed with respect to the transition region 111. The housing 10 is provided with a wiring cavity 15, which is correspondingly disposed with respect to the edge region 112 and communicates with the receiving cavity 13. The wiring cavity 15 is separated from the heat conduction port 14, and the wiring cavity 15 is used for wiring of the memory expansion component 30.

[0043] Furthermore, a wire-passing hole is provided in the corresponding transition area 111 inside the housing 10. The wire-passing hole is spaced apart from the heat conduction port 14, that is, the wire-passing hole is not connected to the heat conduction port 14. The wire-passing hole connects the receiving cavity 13 and the wiring cavity 15, thereby realizing the connection between the wiring cavity 15 and the receiving cavity 13.

[0044] Furthermore, please refer to the following: Figure 2 and Figure 3 The middle region 110 is recessed relative to the edge region 112 to form a placement groove 113, allowing the bottom portion of the computer host to be placed precisely within the placement groove 113, thus providing stability for the computer host on the contact surface 11. The transition region 111 is inclined relative to the edge region 112, and the transition region 111 faces the center of the middle region 110, so that the transition region 111 matches and fits with the inclined portion of the bottom of the computer host. This inclined portion of the bottom of the computer host has heat dissipation holes, and through the matching and fitting of the transition region 111 with the inclined portion of the bottom of the computer host, the heat conduction port 14 corresponds well with the heat dissipation holes on the bottom of the computer host.

[0045] It should be noted that the shapes of the middle region 110, the edge region 112, and the transition region 111 are set according to the bottom shape of the adapted computer host, and are not limited here. Optionally, in this embodiment, the shell 10 is rectangular, that is, the edge region 112 is rectangular, and the middle region 110 and the transition region 111 are both circular. In other embodiments, the shell 10 can also be other polygons, triangles, or ellipses, that is, the edge region 112 can also be other polygons, triangles, or ellipses, and the middle region 110 and the transition region 111 can also be polygons, triangles, or ellipses.

[0046] In another embodiment of this application, there are multiple heat conduction ports 14, which are distributed at intervals along the circumference of the transition region 111. Optionally, there are four heat conduction ports 14, which are distributed at equal intervals along the circumference of the transition region 111.

[0047] Furthermore, the heat conduction port 14 is arc-shaped and extends circumferentially along the contact surface 11. Specifically, the heat conduction port 14 extends circumferentially along the transition region 111.

[0048] In some embodiments, the contact surface 11 and the heat dissipation surface 12 are disposed opposite to each other, that is, the contact surface 11 and the heat dissipation surface 12 are opposite sides of the housing 10. It is understood that the heat dissipation surface 12 is disposed away from the contact surface 11. Optionally, the contact surface 11 is the top surface of the housing 10, and the heat dissipation surface 12 is the bottom surface of the housing 10. In other embodiments, the heat dissipation surface 12 may also be a peripheral side surface of the housing 10, that is, the heat dissipation surface 12 is disposed adjacent to the contact surface 11. Alternatively, the heat dissipation surface 12 and the heat dissipation surface 12 are located on the same side of the housing 10, and the heat dissipation surface 12 does not contact the computer host. It is understood that the heat dissipation surface 12 can be any side of the housing 10, as long as the heat in the heat conduction port 14 can be dissipated to the outside through the heat dissipation surface 12.

[0049] In another embodiment of this application, the housing 10 is further provided with a plurality of air inlets 120 and a plurality of air outlets 121. The air inlets 120 and air outlets 121 are all connected to the receiving cavity 13 and are located on the side of the heat dissipation surface 12. Further, the air inlets 120 and air outlets 121 are respectively located on opposite sides of the corresponding middle region 110 of the housing 10. External air enters the receiving cavity 13 through the air inlets 120 and then exits through the air outlets 121, thereby forming air convection between the air inlets 120 and the air outlets 121 to remove heat from the receiving cavity 13, thereby dissipating heat from the memory expansion component 30 in the receiving cavity 13, reducing the temperature of the memory expansion component 30 during use, avoiding high temperature damage, and effectively preventing the housing 10 from overheating and burning the user.

[0050] Furthermore, the circumferential area of ​​the heat dissipation surface 12 corresponding to the heat conduction port 14 is recessed towards the contact surface 11 to form a guide groove 122, that is, the guide groove 122 is annular along the circumference of the housing 10. Understandably, the guide groove 122 is connected to the heat conduction port 14. The circumferential area of ​​the heat dissipation surface 12 corresponding to the air inlet 120 and air outlet 121 is inclined towards the guide groove 122. Understandably, the guide groove 122 is connected to the air inlet 120 and air outlet 121. By setting the guide groove 122, it is beneficial to increase the airflow space at the bottom of the housing 10, so that the heat at the heat conduction port 14 can be quickly dissipated through the guide groove 122, and at the same time, it is beneficial to improve the convection effect between the air inlet 120 and the air outlet 121.

[0051] In some embodiments, the housing 10 is provided with a mounting port 123, which communicates with the receiving cavity 13 and is located on the side where the heat dissipation surface 12 is located; the expansion card 32 of the memory expansion component 30 is installed or removed through the mounting port 123.

[0052] In some embodiments, please refer to the following: Figure 1 and Figure 4The housing 10 includes a front shell 16 and a bottom shell 17. The bottom shell 17 is connected to the front shell 16 to form a receiving cavity 13 and a wiring cavity 15. The side of the front shell 16 facing away from the bottom shell 17 is the contact surface 11, and the side of the bottom shell 17 facing away from the front shell 16 is the heat dissipation surface 12. The heat conduction port 14 passes through the front shell 16 and the bottom shell 17. The air inlet, air outlet and mounting port 123 are all provided on the bottom shell 17.

[0053] One of the front shell 16 and the bottom shell 17 is provided with a slot 160, and the other of the front shell 16 and the bottom shell 17 is provided with a buckle 170. Both the buckle 170 and the slot 160 are correspondingly provided to the transition area 111, and the buckle 170 and the slot 160 engage in a snap-fit ​​connection. Understandably, in some embodiments, the front shell 16 is provided with a slot 160, and the bottom shell 17 is provided with a buckle 170, with the buckle 170 and the slot 160 corresponding to the transition area 111, and the buckle 170 and the slot 160 engaging in a snap-fit ​​connection. In other embodiments, the front shell 16 is provided with a buckle 170, and the bottom shell 17 is provided with a slot 160, with the buckle 170 and the slot 160 corresponding to the transition area 111, and the buckle 170 and the slot 160 engaging in a snap-fit ​​connection.

[0054] Furthermore, the front cover 16 is an aluminum shell; understandably, the front cover 16 is made of aluminum alloy, which is beneficial for heat dissipation of the memory expansion component 30 and the computer host. The bottom cover 17 is a plastic shell; understandably, the bottom cover 17 is made of plastic. Optionally, the plastic material used to make the bottom cover 17 can be acrylonitrile butadiene styrene plastic (ABS).

[0055] Furthermore, the memory expansion device also includes a cover plate 20, which is detachably fitted onto the mounting port 123. Understandably, by opening the cover plate 20, the user can install or remove the expansion card 32 through the mounting port 123, facilitating the user's replacement of the expansion card 32.

[0056] Furthermore, multiple heat dissipation fins 21 are provided on the side of the cover plate 20 opposite to the receiving cavity 13, and the multiple heat dissipation fins 21 are spaced apart. By providing multiple heat dissipation fins 21 on the cover plate 20, it is beneficial to dissipate heat from the memory expansion component 30.

[0057] Optionally, both the cover plate 20 and the heat dissipation fins 21 are made of aluminum alloy.

[0058] In another embodiment of this application, please refer to Figures 2 to 4The memory expansion device also includes multiple anti-slip feet 60, which are spaced apart on the heat dissipation surface 12 of the bottom shell 17. Further, the anti-slip feet 60 correspond to the edge area 112. Optionally, there are four anti-slip feet 60, each located at one of the four corners of the bottom shell 17. By providing the anti-slip feet 60, the height of the bottom of the shell 10 is increased, allowing heat from the heat dissipation port 14 to the outside when the memory expansion device is placed on a desktop or the ground, while simultaneously creating air convection between the air inlet 120 and the air outlet 121.

[0059] Please refer to the following: Figure 2 and Figure 4 The memory expansion component 30 is positioned close to the heat dissipation surface 12. Furthermore, the memory expansion component 30 is positioned close to the bottom case 17. Understandably, during use, the computer host generates heat that is transferred to the contact surface 11, and the memory expansion component 30 also generates heat. Therefore, by positioning the memory expansion component 30 close to the heat dissipation surface 12, i.e., away from the contact surface 11, the memory expansion component 30 is separated from the computer host, effectively preventing cross-heat transfer between the memory expansion component 30 and the computer host.

[0060] Specifically, the memory expansion component 30 includes a circuit board 31 and an expansion card 32. The circuit board 31 is disposed within the receiving cavity 13 and is located near the heat dissipation surface 12. The expansion card 32 is detachably mounted on the circuit board 31, enabling electrical connection between the expansion card 32 and the circuit board 31. The expansion card 32 is correspondingly positioned with the mounting port 123, allowing the expansion card 32 to be installed or removed by opening the cover plate 20.

[0061] Furthermore, the circuit board 31 is sandwiched between the front shell 16 and the bottom shell 17. Optionally, the front shell 16, the circuit board 31, and the bottom shell 17 are connected in sequence by screws. Optionally, the circuit board 31 is a PCBA, which is short for Printed Circuit Board Assembly, and is the entire process of a bare PCB board after SMT assembly or DIP insertion.

[0062] There are two expansion cards 32, arranged side-by-side with an interval between them. The expansion cards 32 can be standard M.2 PCIe cards available on the market.

[0063] In some embodiments, the circuit board 31 is provided with a card holder 33 and an elastic limiting post 34, the card holder 33 and the elastic limiting post 34 are arranged at a distance from each other, and the expansion card 32 is engaged between the card holder 33 and the elastic limiting post 34. Further, the card holder 33 is provided with a limiting groove, into which one end of the expansion card 32 can be inserted. The elastic limiting post 34 is a silicone pellet, which is a soft material with good elasticity. The elastic limiting post 34 can deform to adjust the distance between the elastic limiting post 34 and the card holder 33, thereby limiting the expansion card 32 between the card holder 33 and the elastic limiting post 34.

[0064] In some embodiments, please refer to Figure 4 The memory expansion device also includes an indicator light assembly 40, which is disposed on the housing 10 and electrically connected to the circuit board 31. The indicator light assembly 40 is used to indicate the working status of the expansion card 32.

[0065] It should be noted that when the expansion card 32 is not working, the indicator light assembly 40 displays a first color light. When the expansion card 32 is not installed on the circuit board 31, the indicator light assembly 40 displays a second color light. When the expansion card 32 is properly connected and working, the indicator light assembly 40 displays a third color light. The first, second, and third color lights are all different colors of light.

[0066] Optionally, the first color light is red, the second color light is yellow, and the third color light is green.

[0067] Specifically, the housing 10 has a light-transmitting hole 18 located on its side wall and communicating with the wiring cavity 15. The indicator light assembly 40 includes a flexible printed circuit board (FPC) 41 and foam 42. One end of the FPC 41 is located within the receiving cavity 13 and electrically connected to the circuit board 31. The other end of the FPC 41 extends through a wire hole into the wiring cavity 15 and corresponds to the light-transmitting hole 18. An indicator light is provided on the end of the FPC 41 corresponding to the light-transmitting hole 18. If the indicator light is red, it indicates that the expansion card 32 is not working. If the indicator light is yellow, it indicates that the expansion card 32 is not assembled. If the indicator light is green, it indicates that the expansion card 32 is properly connected and can work. Of course, in other embodiments, the first color light, the second color light, and the third color light can also be other different colors of light, and this application does not limit this.

[0068] Foam 42 is placed inside the wiring cavity 15 and between the flexible circuit board 41 and the light-transmitting hole 18. Foam 42 is used to protect the indicator light on the flexible circuit board 41. At the same time, foam 42 also has a semi-shading function to prevent the indicator light from transmitting light from the part outside the light-transmitting hole 18 of the housing 10, which helps to ensure the consistency of the brightness of the appearance of the housing 10.

[0069] In some embodiments, please refer to the following: Figure 1 , Figure 3 and Figure 4 The memory expansion device also includes a data transmission line 50. One end of the data transmission line 50 is electrically connected to the memory expansion component 30, and the other end of the data transmission line 50 extends out of the outer peripheral sidewall of the housing 10 and is used for electrical connection with the computer host. That is, the memory expansion component 30 is electrically connected to the computer host through the data transmission line 50. Specifically, one end of the data transmission line 50 is located inside the receiving cavity 13 and is electrically connected to the circuit board 31. The other end of the data transmission line 50 passes through the cable hole, the cable routing cavity 15, and the outer peripheral sidewall of the housing 10 in sequence and extends out of the housing 10. By having the data transmission line 50 built into the memory expansion device, when using the memory expansion device, the end of the data transmission line 50 extending out of the housing 10 is plugged into the computer host, so that the memory expansion device is electrically connected to the computer host without the need for additional wiring, which is convenient for users.

[0070] Furthermore, there are two data transmission lines 50. By setting two data transmission lines 50, dual-line input is achieved, and double the transmission rate is achieved, resulting in high transmission efficiency and improved user experience.

[0071] Optionally, the data transmission cable 50 is a Type-C cable.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A memory expansion device, characterized in that, include: A housing, having a contact surface, a heat dissipation surface, and a heat conduction port on its surface, and an internal receiving cavity within the housing, wherein the heat conduction port penetrates the contact surface and the heat dissipation surface and is separated from the receiving cavity; and A memory expansion component, wherein the memory expansion component is disposed within the receiving cavity; The heat-conducting port penetrates the contact surface and the heat dissipation surface, and is separated from the receiving cavity; the contact surface includes a middle region, a transition region and an edge region, the transition region surrounds the periphery of the middle region, the edge region surrounds the periphery of the transition region, the receiving cavity is correspondingly arranged with the middle region, the heat-conducting port is correspondingly arranged with the transition region, a wiring cavity is provided inside the housing, the wiring cavity is correspondingly arranged with the edge region; a wire-passing hole is provided inside the housing corresponding to the transition region, the wire-passing hole is spaced apart from the heat-conducting port, and the wire-passing hole connects the receiving cavity and the wiring cavity.

2. The memory expansion device according to claim 1, characterized in that: The contact surface is positioned opposite to the heat dissipation surface. The housing is also provided with multiple air inlets and multiple air outlets. The air inlets and air outlets are all connected to the receiving cavity and are located on the side of the heat dissipation surface.

3. The memory expansion device according to claim 2, characterized in that: The circumferential area of ​​the heat dissipation surface corresponding to the heat conduction port is recessed towards the contact surface to form a flow guide groove, and the circumferential area of ​​the heat dissipation surface corresponding to the air inlet and the air outlet is inclined towards the flow guide groove.

4. The memory expansion device according to claim 2, characterized in that: It also includes multiple anti-slip pads, which are spaced apart on the heat dissipation surface.

5. The memory expansion device according to claim 2, characterized in that: The middle region is recessed relative to the edge region to form a placement groove.

6. The memory expansion device according to claim 2, characterized in that: The transition region is inclined relative to the edge region, and the transition region faces the center of the middle region.

7. The memory expansion device according to claim 2, characterized in that: The housing includes a front shell and a bottom shell. The bottom shell is connected to the front shell to form the receiving cavity and the wiring cavity. The side of the front shell facing away from the bottom shell is the contact surface, and the side of the bottom shell facing away from the front shell is the heat dissipation surface. The heat conduction port passes through the front shell and the bottom shell.

8. The memory expansion device according to claim 7, characterized in that: One of the front shell and the bottom shell is provided with a slot, and the other of the front shell and the bottom shell is provided with a buckle. The buckle and the slot are both provided corresponding to the transition area, and the buckle and the slot are engaged to engage.

9. The memory expansion device according to claim 7, characterized in that: The front shell is made of aluminum, and the bottom shell is made of plastic.

10. The memory expansion device according to claim 1, characterized in that: The memory expansion component is positioned close to the heat dissipation surface.

11. The memory expansion device according to claim 1, characterized in that: The memory expansion component includes a circuit board and an expansion card, the expansion card being detachably mounted on the circuit board.

12. The memory expansion device according to claim 11, characterized in that: The circuit board is provided with a card holder and an elastic limiting post, the card holder and the elastic limiting post are arranged at intervals relative to each other, and the expansion card is snapped between the card holder and the elastic limiting post.

13. The memory expansion device according to claim 12, characterized in that: The elastic limiting post is a silicone particle.

14. The memory expansion device according to claim 11, characterized in that: The housing is provided with an installation port communicating with the receiving cavity, and the installation port is located on the side of the heat dissipation surface; the memory expansion device also includes a cover plate that covers the installation port; the expansion card is provided correspondingly to the installation port.

15. The memory expansion device according to claim 14, characterized in that: The cover plate has multiple heat dissipation fins on the side opposite to the receiving cavity.

16. The memory expansion device according to claim 11, characterized in that: It also includes an indicator light assembly, which is disposed on the housing and electrically connected to the circuit board, for indicating the working status of the expansion card.

17. The memory expansion device according to claim 16, characterized in that: When the expansion card is not working, the indicator light assembly displays a first color light; when the expansion card is not assembled on the circuit board, the indicator light assembly displays a second color light; when the expansion card is properly connected and can work, the indicator light assembly displays a third color light, and the first color light, the second color light, and the third color light are all different colors of light.

18. The memory expansion device according to claim 1, characterized in that: It also includes a data transmission line, one end of which is electrically connected to the memory expansion component, and the other end extends out of the housing through the outer peripheral sidewall.

19. The memory expansion device according to claim 18, characterized in that: The number of data transmission lines is two, and the two data transmission lines are arranged side by side.

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