Sheet attaching apparatus and sheet attaching method

Abstract

The present application provides a sheet sticking device and a sheet sticking method, which can prevent a sticking sheet from being stuck to an adherend in a state where a wrinkle or a bubble is formed in a front end portion of the sticking sheet. The sheet sticking device (EA) includes a sheet supply unit (10) that supplies a sticking sheet (AS), and a pressing unit (20) that has a pressing roller (22) that presses the sticking sheet (AS) against an adherend (WK), and sticks the sticking sheet (AS) to the adherend (WK) that relatively moves with respect to the pressing roller (22), the pressing unit (20) abuts the pressing roller (22) against an adhering surface (WK1) of the adherend (WK) and rotates the pressing roller (22) on the adhering surface (WK1) at a stage before the sticking sheet (AS) is pressed against the adherend (WK) by the pressing roller (22).

Description

Technical Field

[0001] This invention relates to a sheet bonding device and a sheet bonding method. Background Technology

[0002] A known sheet-adhesive device is used to adhere an adhesive sheet to an object (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-74106 Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] For the sheet pasting apparatus 10 (sheet pasting apparatus) described in Patent Document 1, when the feeding unit 14 (sheet supply unit) supplies the adhesive sheet AS (adhesive sheet), if the front end of the supply direction of the adhesive sheet (hereinafter referred to as the "supply front end") comes into contact with the pressing roller 19 (pressing roller), the following adverse situation will occur: the movement of the adhesive sheet will be temporarily hindered, causing the adhesive sheet to be pasted onto the annular frame RF (object to be pasted) in a state where wrinkles and bubbles are formed at the supply front end.

[0008] The purpose of this invention is to provide a sheet bonding device and a sheet bonding method that can prevent the adhesive sheet from being bonded to the object in a state where wrinkles or air bubbles are formed at the supply end.

[0009] (II) Technical Solution

[0010] The present invention employs the structure described in the claims.

[0011] (III) Beneficial Effects

[0012] According to the present invention, even if the supply tip comes into contact with the pressing roller, the movement of the adhesive sheet will not be temporarily hindered due to the rotation of the pressing roller. Therefore, it is possible to prevent the adhesive sheet from being adhered to the substrate in a state where wrinkles or air bubbles are formed at the supply tip. Attached Figure Description

[0013] exist Figure 1 In the diagram, (A) is an explanatory diagram of a sheet pasting device according to an embodiment of the present invention, and (B) to (E) are explanatory diagrams of the operation of the sheet pasting device. Detailed Implementation

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0015] Furthermore, in this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal. The X-axis and Y-axis are defined as axes within a specified plane, and the Z-axis is defined as an axis orthogonal to the specified plane. Also, in this embodiment, the axis parallel to the Y-axis... Figure 1 Based on the observation in the near-forward direction, when no diagram is specified to represent direction, "up" is the arrow direction along the Z-axis and "down" is its opposite direction, "left" is the arrow direction along the X-axis and "right" is its opposite direction, and "forward" is parallel to the Y-axis. Figure 1 The direction is near the front and the "back" direction is the opposite direction.

[0016] The sheet bonding apparatus EA of the present invention includes: a sheet supply unit 10 that supplies adhesive sheets AS; and a pressing unit 20 that has a pressing roller 22 for pressing the adhesive sheets AS onto a workpiece WK and pressing the adhesive sheets AS onto the workpiece WK which moves relative to the pressing roller 22 for bonding. The sheet bonding apparatus EA is disposed near a workpiece conveying unit 30 that conveys the workpiece WK.

[0017] The sheet supply unit 10 is configured to peel off and supply the adhesive sheet AS temporarily bonded to the release sheet RL.

[0018] That is, the sheet supply unit 10 includes: a support roller 11, which supports the raw material RS of the adhesive sheet AS temporarily bonded to the strip-shaped release sheet RL; a guide roller 12, which guides the raw material RS; a release plate 13, which acts as a release unit, causing the release sheet RL to fold back at the release edge 13A and peeling the adhesive sheet AS from the release sheet RL; a drive roller 14, which is supported on the output shaft (not shown) of the rotary motor 14A, which acts as a drive device, and clamps the release sheet RL with the pinch roller 14B; and a recovery roller 15, which acts as a recovery unit, is supported on the output shaft of the drive device (not shown), and applies a predetermined tension to the release sheet RL between the recovery roller 15 and the pinch roller 14B during the automatic operation of the sheet bonding device EA, and recovers the release sheet RL.

[0019] The pressing unit 20 has the following structure: a bracket 21 supported on the peeling plate 13; and a pressing roller 22 rotatably supported on the bracket 21, which presses the adhesive sheet AS onto the object WK with the pressing surface 22A. Before the pressing unit 20 presses the adhesive sheet AS onto the object WK using the pressing roller 22, the pressing roller 22 abuts against the bonding surface WK1 of the object WK and rotates on the bonding surface WK1.

[0020] Furthermore, the pressing roller 22 in this embodiment deforms by abutting against the object WK to be adhered.

[0021] The object conveying unit 30 has a support platform 32, which is supported on a slider 31A of a linear motor 31 that serves as a drive device, and has a holding surface 32A that can be adsorbed and held by a pressure reducing unit (holding unit) not shown, such as a pressure reducing pump or a vacuum pump.

[0022] For the above-mentioned sheet pasting device EA, such as Figure 1 As shown in (B), the structure is as follows: the adhesive surface WK1 of the adhered object WK moves within a predetermined moving plane SF, which is located between a first plane SF1 and a second plane SF2. The first plane SF1 is in contact with the pressing roller 22 and parallel to the moving plane SF at the position closest to the moving plane SF. The second plane SF2 is within the moving range AR of the adhesive surface WK1 and is in contact with the release tab RL and parallel to the moving plane SF at the position closest to the moving plane SF. Furthermore, the contact portion 22B between the pressing roller 22 and the adhesive surface WK1 deforms between the first plane SF1 and the second plane SF2, and the pressing roller 22 rotates on the adhesive surface WK1.

[0023] In addition, the contact portion 22B of the pressing roller 22 deforms between the first plane SF1 and the third plane SF3, and presses the adhesive sheet AS onto the object WK for adhesion. The third plane SF3 is farther away from the moving plane SF side than the second plane SF2 by a distance equivalent to the thickness of the adhesive sheet AS and is parallel to the moving plane SF.

[0024] The operation of the above-mentioned sheet pasting device EA will be explained.

[0025] First, regarding in such Figure 1 In the case of the sheet bonding device EA, whose components are initially positioned as shown by the solid lines in (A), the user (hereinafter referred to as "user") sets the raw material RS as shown in the figure, and then inputs a signal to start automatic operation via an operation unit (not shown), such as an operation panel or personal computer. The sheet supply unit 10 then drives the rotary motor 14A to feed the raw material RS, and stops driving the rotary motor 14A when the leading end of the first adhesive sheet AS has been peeled a predetermined length from the peeling edge 13A of the peeling plate 13. Next, when the user or a conveying unit (not shown), such as a multi-joint robot or belt conveyor, places the object to be bonded WK onto the support table 32, the object conveying unit 30 drives a pressure-reducing unit (not shown) to begin adsorption and retention of the object to be bonded WK on the support surface 32A.

[0026] Subsequently, when the object conveying unit 30 drives the linear motor 31 to move the support platform 32 to the left, the object to be adhered WK comes into contact with the pressing roller 22, and the pressing roller 22 that abuts against the object to be adhered WK... Figure 1As shown in (C), it deforms and rotates on the adhesive surface WK1 as the object WK moves. At this time, the pressing roller 22... Figure 1 As shown in (C), it deforms between the first plane SF1 and the second plane SF2 and rotates on the adhesive surface WK1. Then, when the adhesive WK reaches a predetermined position relative to the sheet supply unit 10, the sheet supply unit 10 drives the rotary motor 14A to feed the raw material RS at the same speed as the conveying speed of the adhesive WK, and feeds the adhesive sheet AS by peeling it off from the peeling sheet RL using the peeling plate 13.

[0027] Furthermore, the adhesive sheet AS supplied by the sheet supply unit 10 is as follows: Figure 1 As shown in (D), it is pressed and adhered to the object WK by the pressing roller 22. At this time, the pressing roller 22... Figure 1 As shown in (D), the deformation amount is increased by an amount equivalent to the thickness of the adhesive sheet AS, deforming between the first plane SF1 and the third plane SF3, and rotating on the adhesive sheet AS. Next, the first adhesive sheet AS is entirely bonded to the object WK to form a single piece UP, and when the leading end of the next adhesive sheet AS following the first adhesive sheet AS in the feeding direction is peeled off a predetermined length at the peeling edge 13A of the peeling plate 13, the sheet supply unit 10 stops the drive of the rotary motor 14A. Afterwards, when the single piece UP reaches a predetermined position to the left of the pressing roller 22, the object conveying unit 30 stops the drive of the linear motor 31, and after the movement of the support table 32 to the left stops, the drive of the pressure reducing unit (not shown) is stopped, releasing the adsorption and holding of the object WK on the support surface 32A. Next, when the user or a conveying unit (not shown) transports the integral UP to the next process, the adhesive conveying unit 30 drives the linear motor 31 to return the support table 32 to its initial position, and then repeats the same operation as described above.

[0028] According to the above embodiment, even if the supply end AS1 comes into contact with the pressing roller 22, the movement of the adhesive sheet AS will not be temporarily hindered due to the rotation of the pressing roller 22. Therefore, it is possible to prevent the adhesive sheet AS from being adhered to the substrate WK in a state where wrinkles or air bubbles are formed at the supply end AS1.

[0029] For the units and processes in this invention, there are no particular limitations as long as they can realize the actions, functions, or processes described for these units and processes, and they are not limited to the components or processes of a single embodiment shown in the above embodiments. For example, the sheet supply unit is not particularly limited as long as it can supply adhesive sheets and is within the scope of its technology in accordance with the common technical knowledge at the time of the initial application (the same applies to other units and processes).

[0030] For the sheet supply unit 10, raw material, with the predetermined area divided by the cut defined as the adhesive sheet AS, can be supplied by forming a closed-loop or integral cut in the short-width direction on the strip-shaped adhesive sheet substrate temporarily bonded to the release sheet RL. Alternatively, the structure can be as follows: raw material with a strip-shaped adhesive sheet substrate temporarily bonded to the release sheet RL is used, and a cutting unit forms a closed-loop or integral cut in the short-width direction on the adhesive sheet substrate, defining the predetermined area divided by the cut as the adhesive sheet AS, and supplying the strip-shaped adhesive sheet. When the adhesive sheet AS is peeled off from the release sheet RL, the torque of the rotation motor 14A can be controlled to apply a predetermined tension to the raw material RS. Alternatively, a support can be used instead. The support roller 11, guide roller 12, and other rollers use plate-shaped components, shaft components, etc. to support and guide the raw material RS and the release sheet RL. Alternatively, the raw material RS can be supported by means of being able to be pulled out from the fan-shaped folded raw material RS, without winding it. Alternatively, the release sheet RL can be fan-shaped folded, cut by a shredder, or arbitrarily gathered to recycle the release sheet RL. Alternatively, the recycling unit can be omitted. Alternatively, the support table 32 can be moved, and the adhesive sheet AS can be supplied by moving itself. Alternatively, the adhesive sheet AS can be supplied by moving itself while the support table 32 moves. Alternatively, the adhesive sheet AS that is not temporarily bonded to the release sheet RL can be sent out for supply.

[0031] In the above-described embodiment, the sheet supply unit 10 supplies the adhesive sheet AS by feeding the raw material RS at the same speed as the conveying speed of the substrate WK. However, the adhesive sheet AS can also be adhered to the area of ​​the substrate WK in a way that avoids the formation of wrinkles or air bubbles at the supply tip AS1, by feeding the raw material RS at a speed faster than the conveying speed of the substrate WK, or at a speed slower than the conveying speed of the substrate WK.

[0032] For the pressing unit 20, the pressing roller 22 may not abut against the holding surface 32A, or it may abut against the holding surface 32A and rotate on it. Alternatively, the pressing roller 22 may abut against the object to be bonded WK and undergo elastic deformation, or it may undergo plastic deformation. Or, the pressing roller 22 may abut against the holding surface 32A, the object to be bonded WK, or the adhesive sheet AS without deformation. In the above embodiments, by moving the object to be bonded WK relative to the stationary pressing roller 22, the adhesive sheet AS is pressed onto the object to be bonded WK, which is moving relative to the pressing roller 22, for bonding. However, it is also possible to press the adhesive sheet AS onto the object WK, which moves relative to the pressing roller 22, without moving the object WK. Alternatively, the pressing roller 22 can be moved while the object WK is being moved, thereby pressing the adhesive sheet AS onto the object WK, which moves relative to the pressing roller 22. The pressing roller 22 can be a brush-shaped pressing roller that presses the adhesive sheet AS onto the object WK using a brush-like component. The pressing roller 22 can be made of materials such as rubber, resin, sponge, or metal.

[0033] When the object to be adhered, WK, is set to be a semiconductor wafer and a ring frame, the Young's modulus of the pressing roller 22 is preferably 100MPa to 2000MPa.

[0034] [Reasons for selecting the lower limit value]

[0035] In the sheet bonding apparatus EA of the present invention, a rubber roller with a Young's modulus of 100 MPa is used as the pressing roller 22. An integrated object with a semiconductor wafer disposed at the opening of an annular frame is used as the bonded object WK. The bonding sheet AS is pressed onto the integrated object for bonding. At this time, no air bubbles are mixed between the integrated object and the bonding sheet AS, and no wrinkles are generated on the bonding sheet AS, resulting in good bonding of the bonding sheet AS. Furthermore, a polyethylene roller with a Young's modulus of 700 MPa is used as the pressing roller 22, and the same bonding is performed as described above. In this case, the bonding sheet AS is bonded in the same good manner as described above.

[0036] On the other hand, in the sheet bonding apparatus EA of the present invention, a polyurethane foam roller with a Young's modulus of 60 MPa was used as the pressing roller 22 to press the adhesive sheet AS onto the aforementioned integrated object. However, the pressing pressure of the adhesive sheet was insufficient, causing air bubbles to get trapped between the integrated object and the adhesive sheet AS, resulting in wrinkles on the adhesive sheet AS and failing to bond it properly. Furthermore, when a rubber roller with a Young's modulus of 40 MPa was used as the pressing roller 22 for the same bonding process, the bonding also failed to achieve the same result.

[0037] Furthermore, the above phenomenon also occurs when the adhered object WK is only a ring frame or when the adhered object WK is only a semiconductor wafer.

[0038] [Reasons for selecting the upper limit value]

[0039] In the sheet bonding apparatus EA of the present invention, a polyester roller with a Young's modulus of 2000 MPa is used as the pressing roller 22 to press the adhesive sheet AS onto the aforementioned integrated object for bonding. At this time, no air bubbles are introduced between the integrated object and the adhesive sheet AS, and no wrinkles are generated on the adhesive sheet AS, resulting in good bonding of the adhesive sheet AS. Furthermore, a acrylic roller with a Young's modulus of 1600 MPa is used as the pressing roller 22, and the same bonding process is performed, resulting in equally good bonding of the adhesive sheet AS.

[0040] On the other hand, in the sheet bonding apparatus EA of the present invention, an epoxy resin roller with a Young's modulus of 2600 MPa is used as the pressing roller 22 to press the bonding sheet AS onto the aforementioned integrated object. If the parallelism between the bonding surface of the integrated object and the pressing portion of the pressing roller 22 is slightly off, air bubbles will be introduced between the integrated object and the bonding sheet AS, resulting in wrinkles on the bonding sheet AS and failing to bond it properly. Furthermore, deformation will occur on the annular frame, and damage such as cracks and gaps will occur on the semiconductor wafer. Similarly, when a polystyrene roller with a Young's modulus of 3000 MPa is used as the pressing roller 22 for the same bonding process, the bonding is again unsuccessful, resulting in deformation on the annular frame and damage such as cracks and gaps on the semiconductor wafer.

[0041] Furthermore, the above phenomenon also occurs when the adhered object WK is only a ring frame or when the adhered object WK is only a semiconductor wafer.

[0042] For the object conveying unit 30, it may be a drive device that moves the support platform 32 in the forward and backward direction, so that the object WK can move in the forward and backward direction in addition to moving in the left and right direction within the working area of ​​each unit. In the sheet bonding apparatus EA of the present invention, the object conveying unit 30 may or may not be included.

[0043] For the chip bonding apparatus EA, it is possible to set the object to be bonded WK as a semiconductor wafer and bond a protective sheet to the circuit surface of the semiconductor wafer; it is also possible to set the object to be bonded WK as an annular frame and bond an adhesive sheet AS to the annular frame; or it is possible to set the object to be bonded WK as a semiconductor wafer and an annular frame and bond an adhesive sheet AS to the semiconductor wafer and the annular frame to integrate them. In these cases, an adhesive sheet AS with a shape that matches the shape of the semiconductor wafer and the shape of the annular frame can be used.

[0044] like Figure 1 As shown in (E), when the moving plane SF is in the same position as the second plane SF2, the object to be adhered WK is the maximum thickness that can be adhered by the sheet adhesive device EA.

[0045] There are no particular limitations on the material, type, or shape of the adhesive sheet AS and the adhered object WK in this invention. For example, the adhesive sheet AS and the adhered object WK can be polygonal shapes such as circles, ellipses, triangles, and quadrilaterals, or other shapes. The adhesive sheet AS can be a pressure-sensitive adhesive, a heat-sensitive adhesive, or other adhesive method. When using a heat-sensitive adhesive sheet AS, it can be bonded by a suitable method such as providing a heating unit that heats the adhesive sheet AS with a suitable coil heater, a heat pipe heating side, etc. Furthermore, such an adhesive sheet AS can be, for example, a single layer with only an adhesive layer; an intermediate layer between the substrate and the adhesive layer; three or more layers such as a cover layer on the upper surface of the substrate; or a so-called double-sided adhesive sheet that allows the substrate to be peeled off from the adhesive layer. For a double-sided adhesive sheet, it can have a single or multiple intermediate layers, or a single or multiple intermediate layers without an intermediate layer. Furthermore, the object to be bonded (WK) can be, for example, a single material such as food, resin container, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit board, information recording substrate such as optical disc, glass plate, steel plate, ceramic, wood board, or resin, or a composite material formed from two or more of these. Any type of component or article can be the object. Additionally, the adhesive sheet (AS) can be renamed based on function or application, and can be, for example, any sheet, film, or tape such as an information recording label, decorative label, protective sheet, dicing tape, chip bonding film, chip bonding tape, or recording layer forming resin sheet.

[0046] The driving device in the above embodiments can be: a rotary motor, a direct-drive motor, a linear motor, a single-axis robot, a multi-joint robot with two or more axes, or an actuator such as a cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder. Alternatively, it can be a combination of the above methods directly or indirectly.

[0047] In the above embodiments, when a rotating component such as a roller is used, a drive device for rotating the rotating component can be provided. The surface of the rotating component or the rotating component itself can be made of deformable components such as rubber or resin, or it can be made of non-deformable components. Alternatively, other components such as shafts or blades that rotate or do not rotate can be used instead of rollers. When pressing units or components such as pressing rollers or pressing heads are used to press the object being pressed, components such as rollers, round bars, blade materials, rubber, resin, or sponge can be used instead of the methods illustrated above, or in combination with them. Alternatively, a structure that presses by spraying air or other gases can be used. The pressing component can be made of deformable components such as rubber or resin, or it can be made of non-deformable components. When peeling units or peeling components such as peeling plates or peeling rollers are used to peel off the object being peeled, the following methods can be used instead of the methods illustrated above, or in combination with them: The components used for peeling, such as plate-shaped parts, round bars, and rollers, can be made of deformable parts such as rubber and resin, or they can be made of non-deformable parts. When supporting (holding) units or supporting (holding) components are used to support (hold) the supported part (held part), the structure can be supported (held) by mechanical clamps, chuck cylinders or other holding units, Coulomb force, adhesives (adhesive sheets, adhesive tapes), adhesives (adhesive sheets, adhesive tapes), magnetism, Bernoulli adsorption, suction adsorption, drive equipment, etc. When cutting units or cutting components are used to cut the part to be cut or to form a cut or cutting line on the part to be cut, the following methods can be used instead of the methods exemplified above or in combination with them: cutting by cutting blades, laser cutters, ion beams, fire, heat, water pressure, electric heating wires, jet gas or liquid, etc., or cutting by using a device composed of appropriate drive equipment to move the object to be cut.

[0048] Explanation of reference numerals in the attached figures

[0049] EA - Sheet pasting device; 10 - Sheet supply unit; 20 - Pressing unit; 22 - Pressing roller; 22B - Abutting part; AR - Moving range; AS - Adhesive sheet; SF - Moving plane; SF1 - First plane; SF2 - Second plane; SF3 - Third plane; RL - Release sheet; WK - Adhesive object; WK1 - Adhesive surface.

Claims

1. A sheet pasting device, characterized in that, have: The sheet supply unit supplies adhesive sheets; and A pressing unit includes a pressing roller that presses the adhesive sheet against the object to be bonded and presses the adhesive sheet onto the object to be bonded, which moves relative to the pressing roller, for bonding. The pressing unit is configured such that, before the pressing roller presses the adhesive sheet onto the object to be bonded, the pressing roller abuts against the bonding surface of the object to be bonded and rotates on that bonding surface. The sheet supply unit is configured to peel the adhesive sheet, which is temporarily bonded to the release sheet, from the release sheet and supply it. The adhesive surface of the object being adhered to moves within a specified plane of movement. The moving plane is located between the first plane and the second plane. The first plane is in contact with the pressing roller and parallel to the moving plane at the position closest to the moving plane. The second plane is in contact with the release tab and parallel to the moving plane at the position closest to the moving plane within the moving range of the surface to be bonded. The pressing unit is configured such that the contact portion of the pressing roller that abuts against the surface to be bonded is deformed between the first plane and the second plane, and the pressing roller rotates on the surface to be bonded.

2. The sheet pasting device according to claim 1, characterized in that, The first plane is located below the moving plane, and the second plane is located above the moving plane.

3. A method for pasting sheets, characterized in that, Implementation: The sheet supply process includes supplying adhesive sheets; and In the pressing process, a pressing roller is used to press the adhesive sheet onto the object to be bonded, thus bonding the adhesive sheet to the object which moves relative to the pressing roller. The pressing process includes the following steps: before pressing the adhesive sheet onto the substrate using the pressing roller, the pressing roller is brought into contact with the adhesive surface of the substrate, and the pressing roller is rotated on the adhesive surface. In the sheet supply process, the adhesive sheet temporarily bonded to the release sheet is peeled off from the release sheet and supplied. The adhesive surface of the object being adhered to moves within a specified plane of movement. The moving plane is located between the first plane and the second plane. The first plane is in contact with the pressing roller and parallel to the moving plane at the position closest to the moving plane. The second plane is in contact with the release tab and parallel to the moving plane at the position closest to the moving plane within the moving range of the surface to be bonded. The pressing process includes the following steps: the contact portion of the pressing roller that abuts against the surface to be bonded is deformed between the first plane and the second plane, and the pressing roller rotates on the surface to be bonded.

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