A method and apparatus for measuring semiconductor products

Abstract

This application discloses a method and apparatus for measuring semiconductor products, which avoids the drawbacks of randomly selecting semiconductor products in a chamber for measurement without increasing costs. The method for measuring semiconductor products provided in this application includes: acquiring current process information of the semiconductor product, the current process information including a current process recipe and corresponding machine parameters; acquiring measurement configuration parameters corresponding to the current process information, the measurement configuration parameters including a target chamber for which the machine needs to measure the semiconductor product; and measuring the semiconductor product in the target chamber according to the measurement configuration parameters corresponding to the current process information.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a method and apparatus for measuring semiconductor products. Background Technology

[0002] The furnace tube used for processing semiconductor products is divided into multiple areas, each area is called a chamber (or crystal boat), and each chamber can hold, for example, 25 wafers.

[0003] In existing furnace tube processes, after the products are completed, semiconductor products within the furnace tube are randomly selected for measurement. However, this random selection has several drawbacks. For example, measuring only the semiconductor products in the first chamber each time fails to monitor the quality of semiconductor products in different locations within the chamber. Furthermore, to monitor the quality of semiconductor products in different locations within the chamber, control wafers need to be placed at various positions within the furnace tube, increasing production costs and raising overall production efficiency. Summary of the Invention

[0004] This application provides a method and apparatus for measuring semiconductor products, which avoids the drawbacks caused by randomly selecting semiconductor products in a chamber for measurement without increasing costs.

[0005] This application provides a method for measuring semiconductor products, including:

[0006] Obtain the current process information of the semiconductor product, wherein the current process information includes the current process recipe and the machine parameters corresponding to the current process recipe;

[0007] The measurement configuration parameters corresponding to the current process information are obtained, including the target chamber for semiconductor product measurement by the machine; and the semiconductor products in the target chamber are measured according to the measurement configuration parameters corresponding to the current process information.

[0008] This method obtains the current process information of semiconductor products, including the current process recipe and the corresponding machine parameters; it also obtains the measurement configuration parameters corresponding to the current process information, including the target chamber for semiconductor product measurement by the machine; and, based on the measurement configuration parameters corresponding to the current process information, it measures the semiconductor products in the target chamber, thereby avoiding the drawbacks of randomly selecting semiconductor products in the chamber for measurement. For example, it avoids measuring semiconductor products in the same chamber every time, which would prevent monitoring the quality of semiconductor products in different positions in other chambers. Furthermore, it eliminates the need to place control wafers in different positions within the furnace tube chamber, thus not increasing costs.

[0009] In some embodiments, the instrument requires target chambers for semiconductor product measurement, including multiple target chambers.

[0010] In some embodiments, the measurement configuration parameters further include: the measurement order of the plurality of target chambers.

[0011] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0012] Determine whether the measurement configuration parameters corresponding to the current process information are the same as the measurement configuration parameters corresponding to the already recorded process information. If so, determine the target chamber for semiconductor product measurement in this instance from the multiple target chambers according to the measurement sorting of the multiple target chambers and record it.

[0013] Otherwise, record the measurement configuration parameters corresponding to the current process information, and determine and record the target chamber for semiconductor product measurement from the multiple target chambers according to the measurement sorting of the multiple target chambers;

[0014] Semiconductor product measurements were performed on the target chamber for this semiconductor product measurement.

[0015] In some embodiments, the measurement configuration parameters further include:

[0016] The target location within each target chamber is where semiconductor product measurements need to be performed.

[0017] In some embodiments, the method further includes:

[0018] Obtain the location information of the semiconductor products inside the furnace tube reported by the machine;

[0019] Based on the location information of the semiconductor products in the furnace tube reported by the machine and the measurement configuration parameters, determine the semiconductor products that do not need to be measured;

[0020] For semiconductor products that do not require measurement, transit processing is performed at the measurement station.

[0021] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0022] Based on the location information of the semiconductor product in the furnace tube reported by the machine and the measurement configuration parameters, the semiconductor product that needs to be measured is determined.

[0023] For semiconductor products that require measurement, the measurement is performed at the measurement station, and the measured data is collected at the receiving station.

[0024] In some embodiments, the location information of the semiconductor product within the furnace tube reported by the machine includes the chamber information of the semiconductor product within the furnace tube, or the chamber information of the semiconductor product within the furnace tube and its location within the chamber.

[0025] In some embodiments, before measuring the semiconductor product within the target cavity according to the measurement configuration parameters corresponding to the current process information, the method further includes:

[0026] Set the target semiconductor product for measurement;

[0027] Record the measurement sites for the target semiconductor product and the data collection sites for collecting the measured data.

[0028] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0029] When the target semiconductor product arrives at the measurement station of the target semiconductor product, the target semiconductor product in the target chamber is measured according to the measurement configuration parameters corresponding to the current process information; and the measured data is collected at the receiving station of the target semiconductor.

[0030] In some embodiments, after measuring the semiconductor product within the target chamber, the method further includes:

[0031] Based on the data obtained from measuring the semiconductor products in the target chamber, it is determined whether it is necessary to add more measurements of semiconductor products to the target chamber.

[0032] In some embodiments, when the current process of a semiconductor product is completed, the current process information of the semiconductor product is obtained.

[0033] Another embodiment of this application provides a measurement device for a semiconductor product, which includes a memory and a processor, wherein the memory is used to store program instructions, and the processor is used to call the program instructions stored in the memory and execute any of the methods described above according to the obtained program.

[0034] Furthermore, according to embodiments, for example, a computer program product for a computer is provided, which includes software code portions that, when the product is run on the computer, perform the steps of the methods defined above. The computer program product may include a computer-readable medium on which the software code portions are stored. Furthermore, the computer program product may be directly loaded into the computer's internal memory and / or sent via a network through at least one of an upload process, a download process, and a push process.

[0035] Another embodiment of this application provides a computer-readable storage medium storing computer-executable instructions for causing the computer to perform any of the methods described above. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic diagram of the overall flow of a semiconductor product measurement method provided in this application embodiment;

[0038] Figure 2 A schematic diagram of the furnace tube chamber provided in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram illustrating the effect of random measurement methods in existing technologies.

[0040] Figure 4 This is a schematic diagram illustrating the effect of the measurement method provided in the embodiments of this application;

[0041] Figure 5 A schematic flowchart illustrating a method for measuring semiconductor products provided in this application embodiment;

[0042] Figure 6 This is a schematic diagram of the structure of a semiconductor product measurement device provided in an embodiment of this application;

[0043] Figure 7 This is a schematic diagram of the structure of another semiconductor product measurement device provided in an embodiment of this application. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0045] This application provides a method and apparatus for measuring semiconductor products, which avoids the drawbacks of randomly selecting semiconductor products in a chamber for measurement without increasing costs.

[0046] The method and apparatus are based on the same concept of the application. Since the methods and apparatus solve problems in similar ways, the implementation of the apparatus and methods can refer to each other, and the repeated parts will not be described again.

[0047] The terms "first," "second," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0048] The following examples and embodiments are to be understood as illustrative only. While this specification may refer to "a," "an," or "some" examples or embodiments in several places, this does not mean that every such reference relates to the same example or embodiment, nor does it mean that the feature applies only to a single example or embodiment. Individual features of different embodiments may also be combined to provide other embodiments. Furthermore, terms such as "comprising" and "including" should be understood not to limit the described embodiments to consisting only of those features mentioned; such examples and embodiments may also include features, structures, units, modules, etc., not specifically mentioned.

[0049] The various embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that the order in which the embodiments are presented in this application represents only a chronological order and does not represent the superiority or inferiority of the technical solutions provided by the embodiments.

[0050] This application provides intelligent sampling rules for furnace tube machine product measurement in semiconductor manufacturing. During semiconductor product manufacturing, to monitor the semiconductor product quality at each chamber location within the furnace tube, it is necessary to set up orderly measurements for furnace tube chamber groups (CH1, CH2, ...). Furthermore, to save on control lot (i.e., non-production lot) and directly monitor semiconductor product quality, semiconductor product inline (i.e., production lot) measurement needs to replace control lot (also called process monitor, a non-production lot used to measure the quality of semiconductor products in the current process). This application sets intelligent sampling rules for furnace tube machine chambers and uses these rules to sample and measure semiconductor product inline, thereby achieving timely monitoring of semiconductor product quality.

[0051] In other words, the technical solution provided in this application can measure semiconductor products in a specified chamber according to preset rules for different process equipment, or measure semiconductor products in a specified chamber in a specified order, or measure a specified semiconductor product.

[0052] See Figure 1 This application provides a method for measuring semiconductor products, which can be applied, for example, to a Manufacturing Execution System (MES) in the semiconductor field. The method includes:

[0053] S101. Obtain the current process information of the semiconductor product, wherein the current process information includes the current process recipe and the corresponding machine parameters.

[0054] S102. Obtain the measurement configuration parameters corresponding to the current process information, the measurement configuration parameters including the target chamber for which the machine needs to perform semiconductor product measurement; and, according to the measurement configuration parameters corresponding to the current process information, perform measurement on the semiconductor product in the target chamber.

[0055] The measurement configuration parameters are equivalent to the intelligent sampling rules or preset rules. In other words, the method obtains the preset intelligent sampling rules for the furnace tube chamber corresponding to the current process. Through these preset rules, the semiconductor products in the target chamber are measured, thereby avoiding the drawbacks of randomly selecting semiconductor products in the chamber for measurement. For example, the semiconductor products in the same chamber are not measured every time, which would prevent the quality of semiconductor products in different positions in other chambers from being monitored. Furthermore, there is no need to place the accompanying control wafers in different positions in the furnace tube chamber, thus not increasing the cost.

[0056] It should be noted that different rules can be set in advance for different manufacturing processes. In other words, when performing actual measurements, the target chambers that actually need to be measured for semiconductor products can be measured according to the characteristics of different manufacturing processes, which is more in line with actual needs and improves the monitoring effect of product quality.

[0057] In some embodiments, the instrument requires target chambers for semiconductor product measurement, including multiple target chambers.

[0058] Therefore, the embodiments of this application can realize the measurement of multiple chambers, avoiding the possibility that randomly selecting products in the chambers for measurement may result in only measuring one chamber and failing to monitor the product quality of other chambers.

[0059] In some embodiments, the measurement configuration parameters further include: the measurement order of the plurality of target chambers.

[0060] For example, see Figure 2 In this embodiment, measurements are performed in an orderly manner according to the top-to-bottom order of CH1, CH2, CH3... in the furnace tube chambers, thereby ensuring that all chambers can be measured and that the chances of measurement are equal.

[0061] It should be noted that, Figure 2 The diagram shown is used to explain the division of furnace tube chambers. This is just one type of machine and does not specifically refer to a machine with only 4 chambers. Figure 2 The numbers on the left indicate that 25 wafers can be placed in each chamber.

[0062] See Figure 3If the existing random measurement method is used, a certain chamber of a tool in the process station may not be measured for a long time. For example, a tool has 4 chambers, each with a 25% probability. In the first measurement, one furnace tube measures 4 lots, and the probability of CH1 being measured is 25%. In the second measurement, one furnace tube measures 4 lots, and the probability of measuring the other 3 chambers is 75%. In the third measurement, the probability of the remaining two chambers not being measured is 50%. In the fourth measurement, the probability of the last chamber not being measured is 25%. There are a total of 16 lots in 4 measurements. The probability of measuring all chambers in 16 lots is 25% * 75% * 50% * 25%, or approximately 23.4%. Furthermore, if control sheets are used for measurement, 4 control sheets need to be placed on each furnace tube.

[0063] The measurement method provided in the embodiments of this application, such as Figure 4 As shown, after applying the intelligent sampling rules for furnace tube chambers, cyclic measurements are performed according to CH1, CH2, CH3, and CH4. The probability of measuring all chambers in 16 batches is 100%, and it is known which chamber is being measured. The measurement method provided in this application uses product inline measurement instead of ProcessMonitor, which can save 4 pieces per furnace tube and reduce measurement costs.

[0064] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0065] Determine whether the measurement configuration parameters corresponding to the current process information are the same as the measurement configuration parameters corresponding to the already recorded process information. If so, determine the target chamber for semiconductor product measurement in this instance from the multiple target chambers according to the measurement sorting of the multiple target chambers and record it.

[0066] Otherwise, record the measurement configuration parameters corresponding to the current process information, and determine and record the target chamber for semiconductor product measurement from the multiple target chambers according to the measurement sorting of the multiple target chambers;

[0067] Semiconductor product measurements were performed on the target chamber for this semiconductor product measurement.

[0068] In some embodiments, the measurement configuration parameters further include:

[0069] The target location within each target chamber is where semiconductor product measurements need to be performed.

[0070] This allows you to specify which locations within the chamber (e.g., where the wafer is placed within the chamber) to measure the product.

[0071] For example, in the embodiments of this application, the measurement station can perform orderly measurements on the furnace tube chamber. It can select the specific position of the wafer to be measured, that is, the actual position corresponding to the wafer. For example, there are 4 lots and a total of 100 wafers. Then, starting from the 10th position in the furnace tube (each position corresponds to one wafer), the selected wafer position is the 10th to 109th position. Any wafer at these positions can be selected for measurement.

[0072] In some embodiments, the method further includes:

[0073] Obtain the location information of the semiconductor products inside the furnace tube reported by the machine;

[0074] Based on the location information of the semiconductor products in the furnace tube reported by the machine and the measurement configuration parameters, determine the semiconductor products that do not need to be measured;

[0075] For semiconductor products that do not require measurement, transit processing is performed at the measurement station.

[0076] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0077] Based on the location information of the semiconductor product in the furnace tube reported by the machine and the measurement configuration parameters, the semiconductor product that needs to be measured is determined.

[0078] For semiconductor products that require measurement, the measurement is performed at the measurement station, and the measured data is collected at the receiving station.

[0079] In some embodiments, the location information of the semiconductor product within the furnace tube reported by the machine includes the chamber information of the semiconductor product within the furnace tube, or the chamber information of the semiconductor product within the furnace tube and its location within the chamber.

[0080] For example, the machine reports the location of the corresponding area of ​​the lot at a preset time (25 wafers per chamber, which can be one or more batches of lots; here it refers to the chamber area where the lot is located). Specifically, the TCS (machine control system) can also report the chamber wafer position history record (i.e., the chamber position of the wafer) and report it to the Manufacturing Execution System (MES) before the end of the process completion (OpeComp) for subsequent station pass determination.

[0081] MES can record the chamber position for each measurement and the chamber position for the next measurement in real time.

[0082] For lots that do not require measurement, use lot sampling for station-to-station sampling.

[0083] The wafer locations of measurement stations and data collection stations (sites for collecting measured data) are set using the Basic Record (BR) system. The BR is a preset system used to configure specifications used by the MES (Manufacturing Execution System). This system provides settings for process steps and machine parameters. The BR can be integrated into the MES or set up independently outside of it.

[0084] If the current furnace cavity contains a non-Production Lot (work-in-process wafer) or the location is empty, the forced measurement function should not be applied. However, the furnace cavity currently being measured is set to remain unchanged, meaning that the product in the current furnace cavity can still be measured next time.

[0085] For the measurement wafers corresponding to the lot that need to be measured, a random interval sampling method is adopted, in which multiple wafers are sampled at intervals for measurement. The specific interval can be determined according to actual needs.

[0086] The BR system determines which lots need to be measured and which do not. For example, if the current furnace tube machine is set to measure the location of the chamber and wafer, then the current station lot will be measured within the set range.

[0087] It should be noted that the process information (Recipe and machine Recipe Parameters) of the semiconductor products described in this application embodiment, as well as the measurement configuration parameters (rules) corresponding to the process information, can be preset in the BR system.

[0088] In some embodiments, before measuring the semiconductor product within the target cavity according to the measurement configuration parameters corresponding to the current process information, the method further includes:

[0089] Set the target semiconductor product for measurement; that is, mark the semiconductor product that needs to be measured so that measurement can be performed on the specified product.

[0090] Record the measurement sites for the target semiconductor product and the data collection sites for collecting the measured data.

[0091] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0092] When the target semiconductor product arrives at the measurement station of the target semiconductor product, the target semiconductor product in the target chamber is measured according to the measurement configuration parameters corresponding to the current process information; and the measured data is collected at the receiving station of the target semiconductor.

[0093] In other words, for example, a BR system (used to set specifications for MES, etc.) can set recipes and machine parameters. This BR system can determine which chambers need to be measured by the machine, and simultaneously set which wafers within each chamber will be selected for subsequent measurements. After setting this up, when the process is complete, the relevant parameters set in the BR system are retrieved. Based on the set chambers and locations to be measured, the corresponding actual wafer IDs in the lot information are found, and forced labeling is performed (the labeled wafers record the measurement and receiving stations). When this batch of lots arrives at the measurement stations, the labeled wafers will be measured. Other unlabeled wafers will be determined according to the lot sample rules (required rules) to decide whether to be measured.

[0094] In some embodiments, after measuring the semiconductor product within the target chamber, the method further includes:

[0095] Based on the data obtained from measuring the semiconductor products in the target chamber, it is determined whether it is necessary to add more measurements of semiconductor products to the target chamber.

[0096] For example, the measured wafer will determine the current quality based on the upper and lower limits set by the parameters. If it does not meet the standard, it will automatically determine that the chamber needs to be increased.

[0097] In other words, in this embodiment, it can be determined whether the same chamber needs to be repeatedly measured based on the measurement status of each furnace chamber. Users can adjust the number of ordered measurement furnace chambers and the number of wafers based on the actual measurement results to minimize the load on the measurement equipment while maintaining stable yield. Furthermore, this process reduces production costs and the use of control wafers.

[0098] In some embodiments, when the current process of a semiconductor product is completed, the current process information of the semiconductor product is obtained.

[0099] In summary, for a detailed explanation of the process, please refer to [link / example]. Figure 5 As shown, it includes:

[0100] Based on the BR settings, for the furnace tube station, the current measurement chamber region (CH1, CH2...) is determined according to the process recipe and machine process recipe parameters defined by the BR.

[0101] The wafer location for measurement and reception is determined using the BR selection logic;

[0102] According to the orderly measurement of the chambers, record the position of the chamber and the wafer of the previous tube measurement;

[0103] When the furnace tube machine completes the process (OpeComplete), it matches the position of the lot in the chamber with the BR selection record, finds the corresponding wafer, and marks it with a forced measurement flag (Force Measurement by wafer flag).

[0104] The corresponding Lot and Wafer for the measurement will be marked with a Force Measurement Flag, which will be required for the measurement site (this lot cannot be passed by the gate unless the corresponding Force Measurement Flag is deleted first).

[0105] Other lots in the batch follow the original sampling rule of the measurement site (if a sampling rate is set, the determination of whether to leave the measurement in the lot will be based on the sampling rate);

[0106] Based on the specifications of the data collection items (DC items) pre-set in the BR system, the system automatically determines whether to increase the measurement in the current measurement chamber area, and the chamber and location of the increased measurement are recorded.

[0107] The wafer of the particle collection site Particle Data Collection OpeNo (site number Operation No) is consistent with the wafer measured by the particle measurement site Particle OpeNo (last two digits of the wafer ID), and is synchronously recorded on the Force Measurement by wafer flag.

[0108] As can be seen, in this embodiment, semiconductor products are inlined instead of measured, directly monitoring quality while eliminating the need for on-demand control wafers, effectively reducing the use of non-production wafers, saving time and costs; directly using in-process wafers for measurement more directly reflects the quality of semiconductor products; precise measurement chambers ensure 100% measurement of all positions within the chamber; the BR processing flow is linked with this developed function, enabling automation; the furnace tube is measured in an orderly manner by region, completely covering all areas; areas with poor measurement results from the previous measurement can be increased, and the measurement chamber and wafer positions can be automatically determined based on measurement history.

[0109] The following describes the device or apparatus provided in the embodiments of this application, and the explanations or examples of the same or corresponding technical features as those described in the above methods will not be repeated hereafter.

[0110] See Figure 6 A measuring device for semiconductor products, comprising:

[0111] Processor 600 is used to read the program from memory 620 and execute the following procedures:

[0112] Obtain the current process information of the semiconductor product, wherein the current process information includes the current process recipe and the machine parameters corresponding to the current process recipe;

[0113] The measurement configuration parameters corresponding to the current process information are obtained, including the target chamber for semiconductor product measurement by the machine; and the semiconductor products in the target chamber are measured according to the measurement configuration parameters corresponding to the current process information.

[0114] In some embodiments, the instrument requires target chambers for semiconductor product measurement, including multiple target chambers.

[0115] In some embodiments, the measurement configuration parameters further include: the measurement order of the plurality of target chambers.

[0116] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0117] Determine whether the measurement configuration parameters corresponding to the current process information are the same as the measurement configuration parameters corresponding to the already recorded process information. If so, determine the target chamber for semiconductor product measurement in this instance from the multiple target chambers according to the measurement sorting of the multiple target chambers and record it.

[0118] Otherwise, record the measurement configuration parameters corresponding to the current process information, and determine and record the target chamber for semiconductor product measurement from the multiple target chambers according to the measurement sorting of the multiple target chambers;

[0119] Semiconductor product measurements were performed on the target chamber for this semiconductor product measurement.

[0120] In some embodiments, the measurement configuration parameters further include:

[0121] The target location within each target chamber is where semiconductor product measurements need to be performed.

[0122] In some embodiments, the processor 600 is further configured to read a program from the memory 620 and execute the following processes:

[0123] Obtain the location information of the semiconductor products inside the furnace tube reported by the machine;

[0124] Based on the location information of the semiconductor products in the furnace tube reported by the machine and the measurement configuration parameters, determine the semiconductor products that do not need to be measured;

[0125] For semiconductor products that do not require measurement, transit processing is performed at the measurement station.

[0126] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0127] Based on the location information of the semiconductor product in the furnace tube reported by the machine and the measurement configuration parameters, the semiconductor product that needs to be measured is determined.

[0128] For semiconductor products that require measurement, the measurement is performed at the measurement station, and the measured data is collected at the receiving station.

[0129] In some embodiments, the location information of the semiconductor product within the furnace tube reported by the machine includes the chamber information of the semiconductor product within the furnace tube, or the chamber information of the semiconductor product within the furnace tube and its location within the chamber.

[0130] In some embodiments, before measuring the semiconductor product in the target chamber according to the measurement configuration parameters corresponding to the current process information, the processor 600 is further configured to read the program in the memory 620 and execute the following process:

[0131] Set the target semiconductor product for measurement;

[0132] Record the measurement sites for the target semiconductor product and the data collection sites for collecting the measured data.

[0133] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0134] When the target semiconductor product arrives at the measurement station of the target semiconductor product, the target semiconductor product in the target chamber is measured according to the measurement configuration parameters corresponding to the current process information; and the measured data is collected at the receiving station of the target semiconductor.

[0135] In some embodiments, after measuring the semiconductor product within the target chamber, the processor 600 is further configured to read the program from the memory 620 and execute the following process:

[0136] Based on the data obtained from measuring the semiconductor products in the target chamber, it is determined whether it is necessary to add more measurements of semiconductor products to the target chamber.

[0137] In some embodiments, when the current process of a semiconductor product is completed, the current process information of the semiconductor product is obtained.

[0138] In some embodiments, a transceiver 610 is also included for receiving and sending data under the control of the processor 600.

[0139] Among them, Figure 6 In this context, the bus architecture can include any number of interconnected buses and bridges, specifically linking various circuits together, represented by one or more processors (processor 600) and memory (memory 620). The bus architecture can also link together various other circuits such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and therefore will not be described further herein. The bus interface provides an interface. The transceiver 610 can be multiple elements, including a transmitter and a receiver, providing a unit for communicating with various other devices over a transmission medium.

[0140] In some embodiments, a user interface 630 is also included. The user interface 630 may be an interface that can connect to external or internal devices, including but not limited to keypads, displays, speakers, microphones, joysticks, etc.

[0141] The processor 600 is responsible for managing the bus architecture and general processing, while the memory 620 can store the data used by the processor 600 when performing operations.

[0142] In some embodiments, the processor 600 may be a CPU (Central Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a CPLD (Complex Programmable Logic Device).

[0143] See Figure 7 Corresponding to the above method, another embodiment of this application provides a semiconductor product measurement device, including:

[0144] The first unit 11 is used to obtain the current process information of the semiconductor product, the current process information including the current process recipe and the machine parameters corresponding to the current process recipe;

[0145] The first unit 11 is, for example, the BR system described above;

[0146] The second unit 12 is used to obtain the measurement configuration parameters corresponding to the current process information, the measurement configuration parameters including the target chamber for which the machine needs to measure semiconductor products; and, according to the measurement configuration parameters corresponding to the current process information, to measure the semiconductor products in the target chamber.

[0147] The second unit 12 is, for example, the MES system described above.

[0148] In some embodiments, the instrument requires target chambers for semiconductor product measurement, including multiple target chambers.

[0149] In some embodiments, the measurement configuration parameters further include: the measurement order of the plurality of target chambers.

[0150] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0151] Determine whether the measurement configuration parameters corresponding to the current process information are the same as the measurement configuration parameters corresponding to the already recorded process information. If so, determine the target chamber for semiconductor product measurement in this instance from the multiple target chambers according to the measurement sorting of the multiple target chambers and record it.

[0152] Otherwise, record the measurement configuration parameters corresponding to the current process information, and determine and record the target chamber for semiconductor product measurement from the multiple target chambers according to the measurement sorting of the multiple target chambers;

[0153] Semiconductor product measurements were performed on the target chamber for this semiconductor product measurement.

[0154] In some embodiments, the measurement configuration parameters further include:

[0155] The target location within each target chamber is where semiconductor product measurements need to be performed.

[0156] In some embodiments, the second unit 12 is further configured to:

[0157] Obtain the location information of the semiconductor products inside the furnace tube reported by the machine;

[0158] Based on the location information of the semiconductor products in the furnace tube reported by the machine and the measurement configuration parameters, determine the semiconductor products that do not need to be measured;

[0159] For semiconductor products that do not require measurement, transit processing is performed at the measurement station.

[0160] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0161] Based on the location information of the semiconductor product in the furnace tube reported by the machine and the measurement configuration parameters, the semiconductor product that needs to be measured is determined.

[0162] For semiconductor products that require measurement, the measurement is performed at the measurement station, and the measured data is collected at the receiving station.

[0163] In some embodiments, the location information of the semiconductor product within the furnace tube reported by the machine includes the chamber information of the semiconductor product within the furnace tube, or the chamber information of the semiconductor product within the furnace tube and its location within the chamber.

[0164] In some embodiments, before measuring the semiconductor product in the target cavity according to the measurement configuration parameters corresponding to the current process information, the second unit 12 is further configured to:

[0165] Set the target semiconductor product for measurement;

[0166] Record the measurement sites for the target semiconductor product and the data collection sites for collecting the measured data.

[0167] In some embodiments, the semiconductor product within the target cavity is measured according to the measurement configuration parameters corresponding to the current process information, including:

[0168] When the target semiconductor product arrives at the measurement station of the target semiconductor product, the target semiconductor product in the target chamber is measured according to the measurement configuration parameters corresponding to the current process information; and the measured data is collected at the receiving station of the target semiconductor.

[0169] In some embodiments, after measuring the semiconductor product within the target cavity, the second unit 12 is further configured to:

[0170] Based on the data obtained from measuring the semiconductor products in the target chamber, it is determined whether it is necessary to add more measurements of semiconductor products to the target chamber.

[0171] In some embodiments, when the current process of a semiconductor product is completed, the current process information of the semiconductor product is obtained.

[0172] It should be noted that the division of units in the embodiments of this application is illustrative and only represents one logical functional division. In actual implementation, other division methods may be used. Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated units described above can be implemented in hardware or as software functional units.

[0173] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0174] This application provides a computing device, which may specifically be a desktop computer, portable computer, smartphone, tablet computer, personal digital assistant (PDA), etc. The computing device may include a central processing unit (CPU), memory, input / output devices, etc. Input devices may include a keyboard, mouse, touchscreen, etc., and output devices may include display devices, such as a liquid crystal display (LCD) or a cathode ray tube (CRT).

[0175] The memory may include read-only memory (ROM) and random access memory (RAM), and provides the processor with program instructions and data stored in the memory. In the embodiments of this application, the memory may be used to store the program of any of the methods provided in the embodiments of this application.

[0176] The processor executes any of the methods described in the embodiments of this application according to the program instructions stored in the memory.

[0177] This application also provides a computer program product or computer program that includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform any of the methods described in the above embodiments. The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0178] This application provides a computer-readable storage medium for storing computer program instructions used in the apparatus provided in the above-described embodiments, including a program for performing any of the methods provided in the above-described embodiments. The computer-readable storage medium may be a non-transitory computer-readable medium.

[0179] The computer-readable storage medium can be any available medium or data storage device that a computer can access, including but not limited to magnetic storage (e.g., floppy disks, hard disks, magnetic tapes, magneto-optical disks (MOs), etc.), optical storage (e.g., CDs, DVDs, BDs, HVDs, etc.), and semiconductor storage (e.g., ROMs, EPROMs, EEPROMs, non-volatile memory (NAND flash), solid-state drives (SSDs)).

[0180] It should be understood that:

[0181] The access technology used by entities in a communication network to transmit traffic can be any suitable current or future technology, such as WLAN (Wireless Local Access Network), WiMAX (Microwave Access Global Interoperability), LTE, LTE-A, 5G, Bluetooth, infrared, etc.; in addition, embodiments may also apply wired technologies, such as IP-based access technologies, such as wired networks or fixed lines.

[0182] An embodiment suitable for implementation as software code or as part thereof and for operation using a processor or processing function is independent of the software code and can be specified using any known or future-developed programming language, such as high-level programming languages ​​such as Objective-C, C, C++, C#, Java, Python, Javascript, other scripting languages, etc., or low-level programming languages ​​such as machine language or assembler.

[0183] The implementation of the embodiments is hardware-independent and can be implemented using any known or future-developed hardware technology or any combination thereof, such as microprocessors or CPUs (central processing units), MOS (metal-oxide-semiconductor), CMOS (complementary MOS), BiMOS (bipolar MOS), BiCMOS (bipolar CMOS), ECL (emitter-coupled logic), and / or TTL (transistor-transistor logic).

[0184] The embodiments may be implemented as individual devices, apparatuses, units, components or functions, or in a distributed manner. For example, one or more processors or processing functions may be used or shared in the process, or one or more processing segments or processing portions may be used and shared in the process, wherein one or more physical processors may be used to implement one or more processing portions dedicated to a particular process as described.

[0185] The device can be implemented by a semiconductor chip, a chipset, or a (hardware) module that includes such a chip or chipset.

[0186] The implementation can also be implemented as any combination of hardware and software, such as ASIC (Application-Specific IC (Integrated Circuit)) components, FPGA (Field Programmable Gate Array) or CPLD (Complex Programmable Logic Device) components or DSP (Digital Signal Processor) components.

[0187] The embodiments can also be implemented as computer program products, including a computer-usable medium in which computer-readable program code is embodied, the computer-usable program code being adapted to perform the processes described in the embodiments, wherein the computer-usable medium may be a non-transitory medium.

[0188] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage and optical storage) containing computer-usable program code.

[0189] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0190] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0191] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0192] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A method for measuring semiconductor products, characterized in that, The method includes: Obtain the current process information of the semiconductor product, wherein the current process information includes the current process recipe and the machine parameters corresponding to the current process recipe; The measurement configuration parameters corresponding to the current process information are obtained, including the target chamber for semiconductor product measurement by the machine; and the semiconductor products in the target chamber are measured according to the measurement configuration parameters corresponding to the current process information. Obtain the location information of the semiconductor products inside the furnace tube reported by the machine; Based on the location information of the semiconductor products in the furnace tube reported by the machine and the measurement configuration parameters, determine the semiconductor products that do not need to be measured; For semiconductor products that do not require measurement, pass-through processing is performed at the measurement station; Based on the measurement configuration parameters corresponding to the current process information, the semiconductor product within the target cavity is measured, including: Based on the location information of the semiconductor product in the furnace tube reported by the machine and the measurement configuration parameters, the semiconductor product that needs to be measured is determined. For semiconductor products that require measurement, the measurement is performed at the measurement site, and the measured data is collected at the receiving site.

2. The method according to claim 1, characterized in that, The instrument requires target chambers for measuring semiconductor products, including multiple target chambers.

3. The method according to claim 1, characterized in that, The measurement configuration parameters also include: the measurement order of the multiple target chambers.

4. The method according to claim 3, characterized in that, Based on the measurement configuration parameters corresponding to the current process information, the semiconductor product within the target cavity is measured, including: Determine whether the measurement configuration parameters corresponding to the current process information are the same as the measurement configuration parameters corresponding to the already recorded process information. If so, determine the target chamber for semiconductor product measurement in this instance from the multiple target chambers according to the measurement sorting of the multiple target chambers and record it. Otherwise, record the measurement configuration parameters corresponding to the current process information, and determine and record the target chamber for semiconductor product measurement from the multiple target chambers according to the measurement sorting of the multiple target chambers; Semiconductor product measurements were performed on the target chamber for this semiconductor product measurement.

5. The method according to claim 1, characterized in that, The measurement configuration parameters also include: The target location within each target chamber is where semiconductor product measurements need to be performed.

6. The method according to claim 1, characterized in that, The location information of the semiconductor product in the furnace tube reported by the machine includes the chamber information of the semiconductor product in the furnace tube, or the chamber information of the semiconductor product in the furnace tube and its location information within the chamber.

7. The method according to claim 1, characterized in that, Before measuring the semiconductor product in the target cavity according to the measurement configuration parameters corresponding to the current process information, the method further includes: Set the target semiconductor product for measurement; Record the measurement sites for the target semiconductor product and the data collection sites for collecting the measured data.

8. The method according to claim 7, characterized in that, Based on the measurement configuration parameters corresponding to the current process information, the semiconductor product within the target cavity is measured, including: When the target semiconductor product arrives at the measurement station of the target semiconductor product, the target semiconductor product in the target chamber is measured according to the measurement configuration parameters corresponding to the current process information; and the measured data is collected at the receiving station of the target semiconductor.

9. The method according to claim 1, characterized in that, After measuring the semiconductor product within the target chamber, the method further includes: Based on the data obtained from measuring the semiconductor products in the target chamber, it is determined whether it is necessary to add more measurements of semiconductor products to the target chamber.

10. The method according to claim 1, characterized in that, When the current process of a semiconductor product is completed, the current process information of the semiconductor product is obtained.

11. A measuring device for semiconductor products, characterized in that, include: Memory, used to store program instructions; A processor is configured to invoke program instructions stored in the memory and execute the method according to any one of claims 1 to 10.

12. A computer program product for use in a computer, characterized in that, Includes a software code portion that, when the product is run on the computer, is used to perform the method according to any one of claims 1 to 10.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing the computer to perform the method according to any one of claims 1 to 10.

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