A wafer sliding alignment device

Abstract

This invention provides a wafer sliding alignment device, relating to the technical field of wafer sliding alignment devices. A detection disk is located above a base, with the large-edge alignment line outside the contour line of the detection disk. In the sliding alignment mechanism, a sliding groove is disposed on the base, located on the side of the detection disk. A slider stands within the sliding groove, and a sliding rod is mounted in the sliding groove and passes through the slider. The slider moves along the sliding rod in a direction perpendicular to the large-edge detection line, which is coplanar with the side of the sliding groove near the detection disk. Compared with the prior art, this invention has the following technical advantages: the wafer is placed on the detection disk, and the wafer is aligned using the sliding alignment mechanism; after alignment, the slider retracts, and when measuring different positions of the same wafer, only the detection disk on the device needs to be rotated to measure the wafer again, eliminating the need for repeatedly inserting and removing the wafer.

Description

Technical Field

[0001] This invention relates to the field of wafer sliding alignment device technology, and particularly to a wafer sliding alignment device. Background Technology

[0002] After semiconductor crystals are sliced, the wafers are usually chamfered at the edges in order to meet the processing requirements of subsequent processes. In the wafer chamfering process, the edge width ratio of the wafer is a very important performance parameter, so the edge width ratio of the wafer is usually strictly controlled.

[0003] During the chamfering process, after the wafer is chamfered, its edge width is measured, with five measurement points chosen for averaging. During measurement, the wafer is in direct contact with the worktable. After each measurement, the wafer is picked up and rotated to the next measurement point for remeasurement, repeating this process until all measurement points are completed. This process is tedious and complex for each wafer, requiring highly skilled production personnel. It is time-consuming and labor-intensive, hindering production efficiency. Furthermore, because the measurement platform is completely flat, the wafer, placed flat on it, may slide and rub against the platform during picking and placing, causing irreparable scratches and other damage to the wafer surface, leading to wafer scrap. This results in raw material waste and reduced production yield. Given the high cost of raw materials, this significantly increases production costs and reduces economic efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer sliding alignment device that facilitates inspection while reducing damage to the wafer and lowering production costs.

[0005] The specific technical solution is a wafer sliding alignment device, including: a base and a detection disk for supporting the wafer to be inspected. The detection disk is located above the base. The large-edge alignment line is the line that the large edge of the wafer to be inspected needs to be aligned during inspection. The large-edge alignment line is located outside the outline of the detection disk. The device also includes: a sliding alignment mechanism. In the sliding alignment mechanism, a sliding groove is disposed on the base, located on the side of the detection disk. A slider stands in the sliding groove. A sliding rod is mounted in the sliding groove and passes through the slider. The slider moves along the sliding rod in a direction perpendicular to the large-edge detection line. The large-edge detection line is coplanar with the side of the sliding groove near the detection disk. In use, the base is mounted on the microscope inspection stage. When placing the wafer to be inspected, the slider in the sliding groove is moved until it is in contact with the side of the sliding groove near the detection disk. The wafer to be inspected is gently pushed so that its large edge is aligned with the slider. The objective lens of the high-power microscope is aligned with the inspection position of the wafer to be inspected, and the edge width of the wafer to be inspected is measured.

[0006] Preferably, the slider is made of magnetic material, and the sliding groove has magnetic properties on both the side near the detection disk and the side away from the detection disk, and the magnetic poles are opposite to those of the corresponding surface of the slider.

[0007] Preferably, the base is provided with a rotating shaft for driving the detection disk to rotate, and the rotating shaft is fixed to the base by bearings.

[0008] Preferably, the rotating shaft is hollow inside and has a hollow tube, the upper part of which is connected to a hole on the detection plate and the lower part is connected to a vacuum system.

[0009] Preferably, the sliding alignment mechanism is provided with a clamping drive device that drives the slider to move along the slide bar.

[0010] Preferably, two arc-shaped baffles are symmetrically distributed on the base, the sliding groove is located in the middle of the two arc-shaped baffles, and the large side detection line is located inside the arc contour formed by the extension of the arc-shaped baffles.

[0011] Preferably, there are two slide rods, which are arranged in parallel within the sliding groove and pass through the slider respectively.

[0012] Compared with the prior art, the present invention has the following technical advantages: the wafer is placed on the detection plate and aligned by the sliding alignment mechanism; after alignment, the slider is withdrawn. When measuring different positions of the same wafer, the detection plate on the device can be rotated to measure the wafer again. There is no need to repeatedly put in and take out the wafer, which saves labor costs and greatly reduces the surface scratches caused by repeated contact and friction between the wafer surface and the detection platform, which is conducive to saving production costs. Attached Figure Description

[0013] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0014] Figure 1 This is a schematic diagram of the wafer inspection device.

[0015] Figure 2 This is a schematic diagram of the internal structure of a wafer inspection device.

[0016] in:

[0017] 1-Base; 2-Arc-shaped baffle; 3-Chip to be inspected; 4-Sliding groove; 5-Slider; 6-Slide rod; 7-Detection disc; 8-Rotating shaft; 9-Bearing; 10-Hollow tube. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the embodiments and accompanying drawings. Here, the illustrative embodiments and descriptions of this invention are used to explain the invention, but are not intended to limit the invention.

[0019] In the description of this invention, it should be noted that the terms "inner", "outer", "left", and "right" indicate the orientation or positional relationship based on the positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] Combination Figure 1-2 A wafer sliding alignment device includes: a base 1, a detection disk 7 for supporting a wafer 3 to be inspected, and a sliding alignment mechanism. The detection disk 7 is located above the base 1. The large-edge alignment line is the line that the large edge of the wafer 3 to be inspected needs to be aligned during inspection. The large-edge alignment line is located outside the outline of the detection disk 7. The sliding alignment mechanism is disposed on the base 1 and located on the side of the detection disk 7. In the sliding alignment mechanism, a sliding groove 4 is disposed on the base 1 and located on the side of the detection disk 7. A slider 5 stands in the sliding groove 4. A sliding rod 6 is mounted in the sliding groove 4 and passes through the slider 5. The slider 5 moves along the sliding rod 6 and the direction of movement is perpendicular to the large-edge detection line. The large-edge detection line is coplanar with the side of the sliding groove 4 near the detection disk 7.

[0021] In use, the base 1 is mounted on the microscope inspection stage. When placing the wafer 3 to be inspected, the slider 5 within the sliding groove 4 is moved until it is in contact with the side of the sliding groove 4 near the inspection disk 7. The wafer 3 to be inspected is gently pushed so that its larger edge is aligned with the slider 5. The objective lens of the high-power microscope is aligned with the inspection position of the wafer 3 to be inspected, and the edge width of the wafer 3 is measured. It should be noted that the slider 5 moves along the slide rod 6 towards or away from the inspection disk 7, and the range of movement of the slider 5 is limited within the sliding groove 4.

[0022] In one embodiment, the slider 5 is made of magnetic material, and the sides of the sliding groove 4 near the detection disk 7 and away from the detection disk 7 are magnetic, with their magnetic poles opposite to those of the corresponding surfaces of the slider 5. During alignment, the slider 5 is magnetically attracted and fixed to the side of the sliding groove 4 near the detection disk 7.

[0023] In one embodiment, a rotating shaft 8 is provided on the base 1 to drive the detection disk 7 to rotate. The rotating shaft 8 is fixed to the base 1 by a bearing 9. The top end of the rotating shaft 8 is fixedly connected to the detection disk 7. After alignment, the slider 5 retracts to a position close to and away from the side of the sliding groove 4 near the detection disk 7. When measuring different positions of the same wafer, the detection disk 7 and the wafer 3 to be inspected are rotated by the rotating shaft 8. When rotating to the next detection point, the rotation stops, and the measurement and rotation operation is repeated. During the measurement, it is not necessary to repeatedly put in and take out the wafer 3 to be inspected. The operation is automated, saves labor costs, and greatly reduces surface scratches caused by repeated contact and friction between the wafer surface and the detection platform, which is conducive to saving production costs.

[0024] In one embodiment, the rotating shaft 8 is hollow and has a hollow tube 10 inside. The hollow tube 10 is connected to the hole on the detection plate 7 at the top and to a vacuum system at the bottom. After alignment and bonding, the vacuum system is turned on to generate negative pressure inside the hollow tube 10, and the hole on the detection plate 7 sucks up the wafer 3 to be tested. After measuring all the data, the vacuum system is turned off and the wafer 3 to be tested is removed.

[0025] In one embodiment, the sliding alignment mechanism includes a clamping drive device that drives the slider 5 to move along the slide bar 6. The movement of the slider 5 along the slide bar 6 is accomplished by the clamping drive device. The clamping drive device includes a clamp for clamping the slider 5, which can be a telescopic cylinder or a direct-drive motor as the driving component (details omitted in the illustration). In the scheme where the slider 5 is magnetically fixed, the clamp releases the slider 5 when it approaches the front or rear end of the sliding groove 4, and the slider 5 can complete the engagement action by magnetic force. The stroke of the clamp and the stroke of the slider 5 have a high degree of overlap, but are not completely identical.

[0026] In one embodiment, two arc-shaped baffles 2 are symmetrically distributed on the base 1, the sliding groove 4 is located in the middle of the two arc-shaped baffles 2, and the large-edge detection line is located inside the arc contour formed by the extension of the arc-shaped baffles 2. The arc-shaped baffles 2 are used to restrict the placement position of the wafer to be inspected 3 on the detection disk 7.

[0027] In one embodiment, there are two slide rods 6, which are arranged parallel to each other within the sliding groove 4 and pass through the slider 5 respectively. Using two slide rods 6 ensures smooth movement of the slider 5.

[0028] Example 1: A wafer sliding alignment device includes: a base 1, a detection disk 7 for supporting a wafer 3 to be inspected, and a sliding alignment mechanism. The detection disk 7 is located above the base 1. The large edge alignment line is the line that the large edge of the wafer 3 to be inspected needs to be aligned during inspection. The large edge alignment line is located outside the outline of the detection disk 7. In the sliding alignment mechanism, a sliding groove 4 is provided on the base 1 and located on the side of the detection disk 7. A slider 5 stands in the sliding groove 4. A pair of sliding rods 6 are horizontally parallel and mounted in the sliding groove 4 and pass through the slider 5 respectively. The slider 5 moves along the sliding rods 6 and the direction of movement is perpendicular to the large edge detection line. The large edge detection line is coplanar with the side of the sliding groove 4 near the detection disk 7.

[0029] Example 2: Based on the structure of Example 1, the slider 5 is made of magnetic material. The sides of the sliding groove 4 near the detection disk 7 and away from the detection disk 7 are magnetic, and their magnetic poles are opposite to those of the corresponding surfaces of the slider 5. The sliding alignment mechanism is equipped with a clamping drive device to drive the slider 5 to move along the slide rod 6. The clamping drive device is equipped with a clamp for clamping the slider 5. The movement of the slider 5 along the slide rod 6 is driven by the clamping drive device. When it approaches the front or rear end of the sliding groove 4, the clamp releases the slider 5, and the slider 5 can complete the fitting action by magnetic force. The rotating shaft 8 is hollow inside and is equipped with a hollow tube 10. The upper part of the hollow tube 10 is connected to the hole on the detection disk 7, and the lower part is connected to the vacuum system. The base 1 is equipped with a rotating shaft 8 for driving the detection disk 7 to rotate. The rotating shaft 8 is fixed to the base 1 by bearings 9.

[0030] Example 3: Based on the structure of Example 1, two arc-shaped baffles 2 are symmetrically distributed on the base 1, the sliding groove 4 is located in the middle of the two arc-shaped baffles 2, and the large side detection line is located inside the arc contour formed by the extension of the arc-shaped baffles 2.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any other way. Any person skilled in the art may make changes or modifications to the disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A wafer slide alignment apparatus comprising: The base (1) and the detection disc (7) for carrying the wafer (3) to be detected, the detection disc (7) is above the base (1), the large edge alignment line is the line that the large edge of the wafer (3) to be detected needs to align in detection, characterized in that, The large edge alignment line is outside the contour line of the detection disc (7), Further comprising: a sliding alignment mechanism, in which a sliding groove (4) is arranged on the base (1) at the side of the detection disc (7), a sliding block (5) is erected in the sliding groove (4), a sliding rod (6) is arranged in the sliding groove (4) and passes through the sliding block (5), the sliding block (5) moves along the sliding rod (6) and the moving direction is perpendicular to the large edge alignment line, and the large edge alignment line is coplanar with the side of the sliding groove (4) close to the detection disc (7).

2. The wafer slide alignment apparatus of claim 1, wherein The sliding block (5) is made of magnetic material, the side of the sliding groove (4) close to the detection disc (7) and the side away from the detection disc (7) are both magnetic and the magnetic poles of the corresponding surfaces of the sliding block (5) are opposite.

3. The wafer slide alignment apparatus of claim 2, wherein, The base (1) is provided with a rotating shaft (8) for driving the detection disc (7) to rotate, and the rotating shaft (8) is fixedly installed on the base (1) through a bearing (9).

4. The wafer slide alignment apparatus of claim 3, wherein The rotating shaft (8) is hollow and provided with a hollow pipe (10), the upper part of the hollow pipe (10) is communicated with the hole on the detection disc (7), and the lower part is connected with a vacuum system.

5. The wafer slide alignment apparatus of claim 2, wherein, The sliding alignment mechanism is provided with clamping driving devices for driving the sliding block (5) to move along the sliding rod (6).

6. The wafer slide alignment apparatus of claim 1, wherein, The base (1) is provided with two circular arc baffles (2) symmetrically distributed, the sliding groove (4) is located between the two circular arc baffles (2), and the large edge alignment line is located inside the circular arc contour formed by the extension of the circular arc baffles (2).

7. The wafer slide alignment apparatus of claim 1 wherein, The sliding rod (6) has two roots, and the two sliding rods (6) are arranged in parallel and pass through the sliding block (5).

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