LED package structure and LED packaging method

Abstract

The embodiment of the present application discloses an LED packaging structure and an LED packaging method, which comprise a support assembly, an LED chip and a transparent cover plate. The support assembly has a containing groove. The LED chip is arranged in the containing groove and connected with the bottom wall of the containing groove. The transparent cover plate comprises a light emitting part and a conducting part which are connected integrally. The conducting part is arranged in the containing groove, and the end face of the conducting part away from the light emitting part abuts against the LED chip. The LED packaging structure can improve the light emitting rate of the LED chip.

Description

Technical Field

[0001] This application relates to the field of optoelectronic device technology, and in particular to an LED packaging structure and LED packaging method. Background Technology

[0002] Ultraviolet (UV) LEDs have a wide range of applications in sterilization, disinfection, biological detection, and curing. The electro-optical conversion efficiency of UV LEDs is one of the important indicators for measuring their performance. In related technical fields, light extraction efficiency is an important factor affecting electro-optical conversion efficiency. In traditional UV LED packaging methods, during the process of light entering the air environment inside the LED chip, some light undergoes total internal reflection and is dissipated within the chip. This results in lower light extraction efficiency, increases the chip's operating temperature, and reduces the chip's lifespan. Summary of the Invention

[0003] This application provides an LED packaging structure and LED packaging method that can improve the light extraction efficiency of ultraviolet LED chips.

[0004] In a first aspect, embodiments of this application provide an LED packaging structure, including:

[0005] The support assembly has a receiving slot;

[0006] The LED chip is disposed in the receiving groove and connected to the bottom wall of the receiving groove;

[0007] A transparent cover plate includes a light-emitting part and a conductive part. The conductive part is disposed in the receiving groove, and the end face of the conductive part away from the light-emitting part abuts against the LED chip.

[0008] Based on the LED packaging structure of this application embodiment, a receiving groove is constructed by a bracket assembly. After the conductive part is installed in the receiving groove, it abuts against the LED chip located in the receiving groove. The light emitted by the LED chip is directly conducted into the conductive part, and then conducted through the conductive part to the light emitting part, and then from the surface of the light emitting part to the environment around the light emitting part. Compared with the absence of a conductive part, the light emitted by the LED chip first enters the air in the receiving groove and is then conducted to the quartz glass cover. When light enters another medium from one medium, refraction and reflection will occur. In particular, when light travels from a denser medium to a less dense medium (from the chip to the air in the receiving groove), the angle of incidence of the light is greater than the critical angle and total internal reflection is formed. The light reflected by total internal reflection is consumed inside the chip. In this application embodiment, the conductive part abuts against the LED chip. In this way, the light emitted by the LED chip does not need to be conducted through the air in the receiving groove, but is directly conducted into the conductive part, reducing the total internal reflection of the light emitted by the ultraviolet LED chip, that is, reducing the light loss caused by the total internal reflection of the light emitted by the LED chip, and improving the light extraction efficiency of the LED packaging structure.

[0009] In some embodiments of this application, the conductive part is configured as an inverted frustum shape, the apex angle of the axial section of the conductive part is greater than or equal to 105° and less than or equal to 150°; the receiving groove is configured as an inverted frustum-shaped cavity, and a gap is left between the peripheral wall of the conductive part and the peripheral wall of the receiving groove.

[0010] Based on the above embodiments, the inverted frustum-shaped transmission part can automatically slide into the receiving groove of the inverted frustum-shaped cavity under the action of gravity, which facilitates the adaptive assembly of the transmission part and the support assembly.

[0011] In some embodiments of this application, the LED packaging structure further includes:

[0012] A reflective layer is attached to the periphery of the receiving groove.

[0013] Based on the above embodiments, the light emitted by the LED chip can be reflected by the reflective layer to the conductive part after irradiating the reflective layer, thereby improving the light extraction efficiency of the LED packaging structure.

[0014] In some embodiments of this application, the thickness of the reflective layer is greater than or equal to 0.01 mm and less than or equal to 0.50 mm.

[0015] In some embodiments of this application, the LED packaging structure further includes:

[0016] A Zener diode is connected in parallel with the LED chip and is also connected to the bottom wall of the receiving groove.

[0017] Based on the above embodiments, Zener diodes can effectively stabilize voltage and current, thereby improving the lifespan of LED chips.

[0018] In some embodiments of this application, the support assembly includes:

[0019] A dam, wherein the receiving trough is formed in and through the dam, so that the dam forms the perimeter wall of the receiving trough;

[0020] A substrate is connected to the dam to form the receiving groove, so that the substrate forms the bottom wall of the receiving groove. The substrate is made of aluminum nitride ceramic or aluminum oxide ceramic, and the substrate is connected to the LED chip.

[0021] Based on the above embodiments, a peripheral wall of the receiving groove is constructed on the dam, and then the substrate is connected to the dam so that the substrate forms the bottom wall of the receiving groove. The peripheral wall and the bottom wall of the receiving groove are processed separately, which simplifies the processing technology of the receiving groove. At the same time, the substrate material is set as aluminum nitride ceramic or aluminum oxide ceramic. Aluminum nitride ceramic or aluminum oxide ceramic has good insulation and thermal conductivity, which can more efficiently transfer the heat generated by the LED chip to the aluminum substrate on the printed circuit board and improve the life of the LED.

[0022] Secondly, embodiments of this application provide an LED packaging method, comprising the following steps:

[0023] A reflective layer is deposited onto a support assembly that has printed metal lines and has a receiving groove, so as to form a reflective layer on the cavity wall of the receiving groove;

[0024] The LED chip is placed into the receiving slot and soldered to the pads of the metal circuit.

[0025] A transparent cover plate with a light-emitting part and a conductive part is welded to the bracket assembly, so that the conductive part is placed in the receiving groove and abuts against the LED chip, and the light-emitting part protrudes from the surface of the receiving groove.

[0026] Based on the LED packaging structure and method of this application, a receiving groove is constructed by a bracket assembly. After the conductive part is installed in the receiving groove, it abuts against the LED chip located in the receiving groove. The light emitted from the LED chip is directly conducted into the conductive part, and then conducted through the conductive part to the light-emitting part, and then from the surface of the light-emitting part to the environment around the light-emitting part. Compared with no conductive part, the light emitted from the LED chip first enters the air in the receiving groove, and then is conducted to the quartz glass cover. In particular, when the light travels from a denser medium to a less dense medium (from the chip to the air in the receiving groove), the angle of incidence of the light is greater than the critical angle and total internal reflection occurs. The light reflected by total internal reflection is consumed inside the chip. In this application embodiment, the conductive part abuts against the LED chip. In this way, the light emitted from the LED chip does not need to be conducted through the air in the receiving groove, but is directly conducted into the conductive part, reducing the total internal reflection of the light emitted from the ultraviolet LED chip, that is, reducing the light loss caused by the total internal reflection of the light emitted from the LED chip, and improving the light extraction efficiency of the LED packaging structure. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a half-sectional schematic diagram of the LED packaging structure in one embodiment of this application;

[0029] Figure 2 This is a schematic flowchart of an LED packaging method according to an embodiment of this application.

[0030] Reference numerals: 10, support assembly; 11, receiving groove; 12, dam; 13, substrate; 20, LED chip; 30, transparent cover plate; 31, light-emitting part; 32, conductive part; 50, reflective layer; 60, Zener diode. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0032] In related technical fields, light extraction efficiency is an important factor affecting electro-optical conversion efficiency. In traditional LED packaging methods, some of the light emitted from the LED chip is dissipated within the chip due to total internal reflection during the light extraction process, which greatly affects the light extraction efficiency of the LED and reduces the lifespan of ultraviolet LEDs.

[0033] To solve the above technical problems, please refer to Figure 1 As shown, the first aspect of this application proposes an LED packaging structure that can improve the light extraction efficiency of the LED chip 20.

[0034] Please refer to Figure 1 As shown, the LED packaging structure includes a support assembly 10, an LED chip 20, and a transparent cover plate 30. The support assembly 10 has a receiving groove 11. The LED chip 20 is disposed in the receiving groove 11 and connected to the bottom wall of the receiving groove 11. The transparent cover plate 30 includes a light-emitting part 31 and a conductive part 32. The light-emitting part 31 protrudes at least partially from the receiving groove 11 and covers the opening of the receiving groove 11. The conductive part 32 is disposed in the receiving groove 11, and the end face of the conductive part 32 away from the light-emitting part 31 abuts against the LED chip 20.

[0035] The receiving groove 11 is used to receive the LED chip 20 and the conductive part 32. In this embodiment, the shape, size, depth and hole forming process of the receiving groove 11 are not limited. The size of the receiving groove 11 should be set to correspond to the size of the LED chip 20 and the conductive part 32, so that the LED chip 20 and the conductive part 32 can be put into the receiving groove 11. As for the depth of the receiving groove 11, the depth of the receiving groove 11 should be equal to the sum of the heights of the LED chip 20 and the conductive part 32 along the axis of the conductive part 32, so that the conductive part 32 can abut against the LED chip 20 after being placed in the receiving groove 11.

[0036] The transparent cover plate 30 is used to encapsulate the LED chip 20 and conduct the light emitted from the LED chip 20. The conductive part 32 is connected to the peripheral wall of the receiving groove 11 to achieve a seal on the receiving groove 11. Both the conductive part 32 and the light-emitting part 31 are used to conduct the light emitted from the LED chip 20. In some embodiments of this application, the conductive part 32 and the light-emitting part 31 are made of quartz glass. In this way, the conductive part 32 and the light-emitting part 31 can be integrally set without seams. This can reduce the influence of seams on the light emitted by the LED during conduction within the transparent cover plate 30, thereby improving the light extraction efficiency of the LED packaging structure. To further improve the light extraction efficiency of the LED packaging structure, in some embodiments of this application, the light-emitting part 31 is set as a hemispherical shape. The hemispherical light-emitting part 31 can avoid total internal reflection of light, thereby improving the light extraction efficiency of the LED structure.

[0037] Based on the LED packaging structure of this application embodiment, a receiving groove 11 is constructed by the support assembly 10. After the conductive part 32 is installed in the receiving groove 11, it abuts against the LED chip 20 located in the receiving groove 11. The light emitted by the LED chip 20 will be directly conducted into the conductive part 32. The refractive index of the conductive part 32 is greater than that of air, that is, the critical angle of the conductive part 32 is greater than that of air. Therefore, the portion of the light emitted by the LED chip 20 that undergoes total emission is reduced, thereby reducing the loss of the light emitted by the LED chip 20 and improving the light extraction efficiency of the LED packaging structure. Subsequently, the light emitted from the LED chip 20 is conducted through the conduction part 32 to the light emitting part 31, and then from the surface of the light emitting part 31 to the environment around the light emitting part 31. In this way, the light emitted from the LED chip 20 can be conducted to the light emitting part 31 without refraction. Compared with the case where the conduction part 32 is not provided in the receiving groove 11, the number of reflections of the light emitted from the LED chip 20 in the conduction part 32 is reduced, that is, the light loss caused by the reflection of the light emitted from the LED chip 20 is reduced, and the light extraction efficiency of the LED packaging structure is improved.

[0038] To facilitate the installation between the conductive part 32 and the periphery of the receiving groove 11 and to improve the light extraction efficiency of the LED chip 20, please refer to some embodiments of this application. Figure 1As shown, the transmission part 32 is configured as an inverted frustum shape. The vertex angle of the axial section of the transmission part 32 is greater than or equal to 105° and less than or equal to 150°. Here, the axial section refers to the section passing through the axis of the geometric body. For example, the section passing through the axis of a cylinder, a cone, and a frustum is called the axial section of the cylinder, the cone, and the frustum, respectively. The axial section of the frustum is an isosceles trapezoid.

[0039] In some embodiments of this application, please refer to Figure 1 As shown, the LED packaging structure includes a reflective layer 50, which is attached to the peripheral wall of the receiving groove 11.

[0040] The reflective layer 50 is used to reflect light transmitted to the reflective layer 50 back to the transparent cover plate 30. In some embodiments of this application, the reflective layer 50 is a reflective coating. In other embodiments of this application, the reflective layer 50 is a reflective film and is coated on the peripheral wall of the receiving groove 11. Regarding the material of the reflective layer 50, in some embodiments of this application, the reflective layer 50 is made of aluminum. Compared with gold, silver or copper, aluminum has the highest reflectivity for ultraviolet light with low electro-optic conversion rate and has a high reflectivity from the ultraviolet region to the infrared region.

[0041] Combining the fact that the apex angle of the axial section of the aforementioned conductive part 32 is greater than or equal to 105° and less than or equal to 150°, that is, the peripheral wall of the receiving groove 11 is set at an angle to the axial section, that is, the light emitted from the side wall of the LED chip 20 is set at an angle to the peripheral wall of the receiving groove 11. The light emitted from the side of the LED chip 20 will be reflected into the conductive part 32 after irradiating the reflective layer 50; while for the light emitted from the top surface of the LED chip 20, due to the divergence of the light, the light emitted from the top surface of the LED chip 20 may be conducted to the reflective layer 50 through the conductive part 32, and then the reflective layer 50 can reflect this part of the light back into the conductive part 32. In this way, the light extraction efficiency of the LED packaging structure is improved.

[0042] In order to ensure the installation relationship between the conductive part 32 and the periphery of the receiving groove 11, in some embodiments of this application, the thickness of the reflective layer 50 is greater than or equal to 0.01 mm and less than or equal to 0.50 mm. Within this range, the reflective layer 50 can not only reflect the light transmitted to the reflective layer 50, but also has a suitable thickness so that the reflective layer 50 is located between the periphery of the conductive part 32 and the periphery of the receiving groove 11. In a specific embodiment of this application, the thickness of the reflective layer 50 is 0.05 mm.

[0043] In some embodiments of this application, please refer to Figure 1 As shown, the LED packaging structure also includes a Zener diode 60, which is connected in reverse parallel with the LED chip 20 and connected to the bottom wall of the receiving groove 11; the Zener diode 60 has the function of stabilizing voltage and current for the ultraviolet LED.

[0044] Please refer to Figure 1 As shown, in some embodiments of this application, the support assembly 10 includes a dam 12 and a substrate 13. A receiving groove 11 is formed in and through the dam 12 so that the dam 12 forms the periphery of the receiving groove 11. The substrate 13 is connected to the dam 12 to form the receiving groove 11. The substrate 13 is made of aluminum carbide ceramic or aluminum oxide ceramic, and the substrate 13 is connected to the LED chip 20 and the Zener diode 60.

[0045] The dam 12 is used to construct the periphery of the receiving groove 11 and together with the substrate 13, forms a support assembly 10. Specifically, the receiving groove 11 forms a circular first opening and a circular second opening on opposite sides of the dam 12. Combined with the fact that the receiving groove 11 is an inverted frustum-shaped cavity, the diameters of the first opening and the second opening are not equal to make the receiving groove 11 an inverted frustum-shaped cavity. In this embodiment, the size, shape, and material of the dam 12 are not limited. The size of the dam 12 is only required to construct the periphery of the receiving groove 11. As for the shape of the dam 12, it can be cylindrical, rectangular, polygonal, or any irregular shape. As for the material of the dam 12, it can be aluminum carbide ceramic or aluminum oxide ceramic. In this case, the dam 12 and the substrate 13 can be integrally formed.

[0046] The substrate 13 is used to form the bottom wall of the receiving groove 11 and together with the dam 12, it forms the support assembly 10. In this embodiment, the size, shape, and material of the substrate 13 are not limited. The size of the substrate 13 only needs to be able to cover the smaller diameter of the first opening and the second opening. After the substrate 13 is connected to the dam 12, a portion of the surface of the substrate 13 connected to the dam 12 will form the bottom wall of the receiving groove 11. As for the shape of the substrate 13, it can be cylindrical, rectangular, polygonal, or any irregular shape. As for the material of the substrate 13, it can be aluminum carbide ceramic or aluminum oxide ceramic. Aluminum carbide ceramic or aluminum oxide ceramic has good insulation and thermal conductivity, which can more efficiently transfer the heat generated by the LED chip 20 to the aluminum substrate 13 on the printed circuit board and improve the life of the LED.

[0047] Secondly, please refer to Figure 2 As shown in the figure, this application provides an LED packaging method, including the following steps:

[0048] S10, a reflective layer 50 is deposited on the support assembly 10, which has printed metal lines and has a receiving groove 11, to form a reflective layer 50 on the cavity wall of the receiving groove 11.

[0049] S20, the LED chip is placed into the receiving groove and soldered to the pads of the metal circuit; specifically, solder is filled at the joint between the LED chip 20 and the pads of the metal circuit, the encapsulation structure is heat-treated at high temperature to melt the solder, and after the solder cools and solidifies, the connection between the LED chip 20 and the bracket assembly 10 is realized, as well as the electrical connection between the LED chip 20 and the metal circuit is realized.

[0050] S30, a transparent cover plate with a light-emitting part and a conductive part is welded to the bracket assembly, so that the conductive part is placed in the receiving groove and abuts against the LED chip, and the light-emitting part protrudes from the surface of the receiving groove.

[0051] In some embodiments of this application, step S30, which involves welding the transparent cover plate 30, which has a light-emitting portion 31 and a light-conducting portion 32, to the support assembly 10, includes:

[0052] The conductive part 32 is placed into the receiving groove 11. Solid annular inorganic solder is placed into the receiving groove 11 from the top of the light-emitting part 31. The inorganic solder will automatically slide down into the annular groove formed by the light-emitting part 31 and the periphery of the receiving groove 11. The LED packaging structure is heat-treated at high temperature so that the inorganic solder melts and penetrates into the gap formed by the conductive part 31 and the receiving groove 11. After the molten inorganic solder cools, it forms a eutectic, thus completing the welding of the conductive part 31 and the receiving groove 11.

[0053] Inorganic solder refers to solder whose components are entirely inorganic. The weld seam formed after the molten inorganic solder cools and solidifies is also composed entirely of inorganic materials. Therefore, the light emitted by the LED chip 20 will not cause the weld seam to age or harden, ensuring the airtightness of the encapsulation joint between the conductive part 32 and the periphery of the receiving groove 11, and improving the reliability of the LED encapsulation structure. Eutectic refers to the reaction in which a liquid of a certain composition crystallizes into two solid phases of a certain composition at a certain temperature. The two solid phases generated are mechanically mixed together to form a basic structure with a fixed chemical composition, which is collectively referred to as eutectic. When a eutectic reaction occurs, three phases coexist, and their respective compositions are determined. The reaction proceeds in equilibrium at a constant temperature.

[0054] In some embodiments of this application, the inorganic solder is solid and arranged in a ring shape, and the inner diameter of the inorganic solder is ±0.3 mm of the maximum diameter of the light-emitting part 31.

[0055] In the embodiments of this application, since the shape of the conductive part 32 is consistent with the shape of the receiving groove 11 and both are inverted frustum shapes, only approximate positioning is required during the assembly process to allow the conductive part 32 to automatically slide into the receiving groove 11 and complete self-positioning, thereby reducing the positioning requirements during the assembly process and reducing the assembly difficulty.

[0056] Similarly, in the embodiments of this application, since the inorganic solder and the diameter of the light-emitting part 31 are close to each other, only approximate positioning is required during the assembly process to allow the inorganic solder to automatically slide into the annular groove between the light-emitting part 31 and the receiving groove 11, thereby completing self-positioning, reducing the positioning requirements during the assembly process, and reducing the assembly difficulty.

[0057] In other embodiments of this application, when the inorganic solder is omitted, in step S30, a transparent cover plate 30 having a light-emitting portion 31 and a conductive portion 32 is welded to the support assembly 10, including:

[0058] The conductive part 32 is placed into the receiving groove 11. The bonding surface between the conductive part 32 and the reflective layer 50 is heated by laser, so that the conductive part 32 and the support assembly 10 at the bonding surface melt. After the melted part of the conductive part 32 and the support assembly 10 cools and solidifies, the connection between the support assembly 10 and the transparent cover plate 30 is achieved.

[0059] In some embodiments of this application, the laser heats the bonding area between the conductive part 32 and the reflective layer 50, including positioning the laser focal point within the bonding surface and moving the laser 1 to 50 times around the circumference of the receiving groove 11 within the bonding surface; in a specific embodiment of this application, the laser moves 30 times around the circumference of the receiving groove 11 within the bonding surface.

[0060] In some embodiments of this application, step S10, depositing a reflective layer 50 onto the support assembly 10, which has printed metal lines and a receiving groove 11, to form the reflective layer 50 within the receiving groove 11, includes:

[0061] The support assembly 10, which has printed metal lines and a receiving groove 11, is placed in a magnetron sputtering coating machine. The target material is an aluminum target. After the aluminum target is evaporated at high temperature, it is deposited on the support assembly 10, forming a reflective layer 50 on the support assembly 10 and in the receiving groove 11.

[0062] In other embodiments of this application, step S10, depositing a reflective layer 50 onto the support assembly 10, which has printed metal lines and a receiving groove 11, to form the reflective layer 50 within the receiving groove 11, includes:

[0063] The bracket assembly 10, which has printed metal lines and a receiving groove 11, is placed in a vacuum coating machine. The target material is an aluminum target. After the aluminum target is evaporated at high temperature, it is deposited on the bracket assembly 10, forming a reflective layer 50 in the bracket assembly 10 and the receiving groove 11.

[0064] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0065] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED packaging structure, characterized in that, include: The support assembly has a receiving slot; The LED chip is disposed in the receiving groove and connected to the bottom wall of the receiving groove; A transparent cover plate includes an integrally connected light-emitting part and a conductive part. The conductive part is disposed within the receiving groove. The end face of the conductive part away from the light-emitting part abuts against the LED chip. The conductive part is configured as an inverted frustum shape, the light-emitting part is configured as a hemisphere shape, and the receiving groove is configured as an inverted frustum-shaped cavity. The light-emitting part converges within the opening range of the receiving groove. A gap is left between the peripheral wall of the conductive part and the peripheral wall of the receiving groove. The conductive part can slide into the receiving groove under the action of gravity. A reflective layer is provided on the peripheral wall of the receiving groove. The conductive part and the receiving groove are connected by inorganic solder or laser welding so that the transparent cover plate is welded to the support assembly.

2. In the LED packaging structure as described in claim 1, the apex angle of the axial section of the conductive part is greater than or equal to 105° and less than or equal to 150°.

3. The LED packaging structure as described in claim 1, characterized in that, The thickness of the reflective layer is greater than or equal to 0.01 mm and less than or equal to 0.50 mm.

4. The LED packaging structure as described in claim 1, characterized in that, The LED packaging structure also includes: A Zener diode is connected in reverse parallel with the LED chip and is connected to the bottom wall of the receiving groove.

5. The LED packaging structure according to any one of claims 1-4, characterized in that, The support assembly includes: A dam, wherein the receiving trough is disposed on and penetrates the dam, so that the dam forms the perimeter wall of the receiving trough; A substrate is connected to the dam to form the receiving groove, so that the substrate forms the bottom wall of the receiving groove. The substrate is made of aluminum carbide ceramic or aluminum oxide ceramic, and the substrate is connected to the LED chip.

6. An LED packaging method, characterized in that, Includes the following steps: A reflective layer is deposited onto a support assembly printed with metal lines and having a receiving groove to form a reflective layer on the cavity wall of the receiving groove, the receiving groove being configured as an inverted frustum-shaped cavity; The LED chip is placed into the receiving slot and soldered to the pads of the metal circuit. A transparent cover plate with a light-emitting part and a conductive part is welded to the bracket assembly, so that the conductive part is placed in the receiving groove and abuts against the LED chip, and the light-emitting part protrudes from the surface of the receiving groove. The conductive part is configured as an inverted frustum shape, and the light-emitting part is configured as a hemisphere shape. The light-emitting part converges within the opening range of the receiving groove. A gap is left between the peripheral wall of the conductive part and the peripheral wall of the receiving groove. The conductive part can slide into the receiving groove under the action of gravity. A reflective layer is provided on the peripheral wall of the receiving groove. The conductive part and the receiving groove are connected by inorganic solder or laser welding so that the transparent cover plate is welded to the bracket assembly.

7. The LED packaging method as described in claim 6, characterized in that, The step of welding a transparent cover plate having a light-emitting portion and a light-conducting portion to the bracket assembly includes: The conductive part is placed into the receiving groove, and a solid, closed-loop inorganic solder is placed in the receiving groove. High-temperature heat treatment is then performed to melt the inorganic solder and allow it to penetrate the gap between the conductive part and the receiving groove, thereby connecting the conductive part to the support assembly; or... The conductive part is placed into the receiving groove, and the bonding surface between the conductive part and the reflective layer is heated by laser, so that the conductive part and the support assembly at the bonding surface melt. After the melted part of the conductive part and the support assembly cools and solidifies, the connection between the support assembly and the transparent cover plate is achieved.

8. The LED packaging method as described in claim 7, characterized in that, The method of heating the bonding surface between the conductive part and the reflective layer by laser includes: The laser is positioned within the bonding surface, and the laser moves 1 to 50 revolutions within the bonding surface along the circumference of the receiving groove.

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