Printed circuit board with segmented gold fingers and method of making same

Abstract

This application relates to the field of printed circuit board (PCB) technology, and discloses a printed circuit board with segmented gold fingers and its manufacturing method. The PCB includes a substrate and a gold finger structure. The substrate has a first electroplated lead, a second electroplated lead, a conductive pattern, and at least one power lead. Both the first and second electroplated leads are connected to the power lead, and the second electroplated lead is also connected to the conductive pattern. The gold finger structure includes edge-segment fingers and inner-segment fingers disposed on the substrate. The edge-segment fingers are connected to the first electroplated lead, and the inner-segment fingers are connected to the second electroplated lead. The PCB with segmented gold fingers and its manufacturing method provided in this application, by improving the electroplating design on the PCB and the connection structure between the electroplated leads and the gold fingers, can solve the technical problem of exposed and suspended copper at the break points of the segmented gold fingers.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a printed circuit board with segmented gold fingers and a method for manufacturing the same. Background Technology

[0002] Some printed circuit boards (PCBs) have a row of gold-colored conductive contacts, commonly known as "gold fingers." These gold fingers act as ports for connecting the board to external networks, enabling the connection of circuits and signal transmission between different PCBs. For example... Figure 1 As shown, gold fingers can be divided into conventional gold fingers (a), long and short gold fingers (b), and segmented gold fingers (c). Among them, segmented gold fingers are square pads with varying finger lengths located at the edge of the board, and the finger tips are disconnected.

[0003] To ensure superior conductivity and wear resistance, the fingers are typically electroplated with hard gold. Electroplating requires maintaining electrical conductivity between the finger and an external power source. Therefore, when creating segmented gold fingers, electroplating leads are first designed at one end of the standard finger pattern to connect to the external power source. Pre-defined segmented areas and areas to be plated are then marked on the surface of the standard finger pattern. Power is then applied, and hard gold is electroplated onto the areas to be plated. After electroplating is complete, the electroplating leads and the pre-defined segmented finger pattern are etched away.

[0004] When using the above method to manufacture segmented gold fingers, the etching speed of the etching solution is difficult to control. This can easily lead to exposed copper and suspended copper at the break points of the segmented gold fingers, resulting in risks such as burrs, peeling, detachment, and short circuits when inserting or removing the fingers, thus affecting the performance of the gold fingers. Summary of the Invention

[0005] The purpose of this application is to provide a printed circuit board with segmented gold fingers and a method for manufacturing the same, which can solve the technical problem that exposed copper and suspended copper are easy to occur at the break points of segmented gold fingers.

[0006] To address the aforementioned problems, in a first aspect, this application provides a printed circuit board with segmented gold fingers, comprising:

[0007] A substrate having a first electroplated lead, a second electroplated lead, a conductive pattern, and at least one power lead, wherein the first electroplated lead and the second electroplated lead are both connected to the power lead, and the second electroplated lead is also connected to the conductive pattern;

[0008] The gold finger structure includes edge-section fingers and inner-section fingers disposed on the substrate. The edge-section fingers are connected to the first electroplating lead, and the inner-section fingers are connected to the second electroplating lead through the conductive pattern.

[0009] In one embodiment, the substrate includes an inner layer circuit and an outer layer circuit, the first electroplated lead is disposed on the inner layer circuit, and the second electroplated lead, the power lead and the gold finger structure are disposed on the outer layer circuit;

[0010] The outer layer circuit is also provided with a first through hole and a second through hole. The first through hole is provided on the edge segment finger of the board and is used to connect the edge segment finger of the board and the first electroplated lead. The second through hole is used to connect the first electroplated lead and the power lead.

[0011] In one embodiment, the substrate includes a circuit area and a board edge area surrounding the circuit area, the first via and the second via are both disposed in the circuit area, and the power lead is disposed in the board edge area;

[0012] The outer layer circuit is also provided with a third electroplated lead, which is partially located in the circuit area and partially located in the board edge area. One end of the third electroplated lead is connected to the second through hole, and the other end is connected to the power lead.

[0013] In one embodiment, the conductive pattern is disposed on the outer layer circuit and connected to the side of the inner segment finger away from the edge segment finger.

[0014] In one embodiment, the conductive pattern is disposed on the inner layer circuit, and the outer layer circuit is further provided with a third through hole and a fourth through hole. The third through hole is disposed on the inner segment finger and is used to conduct the inner segment finger and the conductive pattern, and the fourth through hole is used to conduct the conductive pattern and the second electroplated lead.

[0015] The printed circuit board with segmented gold fingers provided in this application includes a substrate and a gold finger structure disposed on the substrate. On one hand, the gold finger structure includes edge segment fingers and inner segment fingers. The substrate is provided with a first electroplating lead connected to the edge segment fingers and a second electroplating lead connected to the inner segment fingers. The first and second electroplating leads can be used to electroplat the edge segment fingers and the inner segment fingers respectively. With this arrangement, since the different segment finger patterns of the segmented gold fingers are electroplated by different electroplating leads, when processing the gold fingers, the segmented fingers can be etched and shaped first in the pattern circuit stage, and then gold is plated on the different segment finger patterns by different electroplating leads. Thus, each surface of the edge segment fingers and the inner segment fingers can be electroplated with a gold layer, thereby solving the problems of exposed copper and suspended gold at the cut sections of the segmented gold fingers. On the other hand, the inner segment fingers are connected to the second electroplating lead by the original conductive pattern on the substrate, which helps to reduce the design length of the second electroplating lead and improve the rationality of the wiring on the substrate surface.

[0016] Secondly, this application provides a method for manufacturing a printed circuit board with segmented gold fingers, comprising:

[0017] A substrate is provided, wherein the substrate is provided with a gold finger structure, a first electroplated lead, a second electroplated lead, a conductive pattern and at least one power lead, and the gold finger structure includes edge-section fingers and inner-section fingers.

[0018] Connect the edge segment finger, the first electroplated lead, and the power lead; and connect the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead.

[0019] The power lead is energized, and gold plating is performed on the surface of the gold finger structure.

[0020] Disconnect the first electroplating lead from the power supply lead, and remove the second electroplating lead.

[0021] In one embodiment, the substrate includes an inner layer circuit and an outer layer circuit, the first electroplated lead is disposed on the inner layer circuit, the gold finger structure and the power lead are disposed on the outer layer circuit, the outer layer circuit is further provided with a first through hole and a second through hole, and the first through hole is disposed on the finger of the board edge segment;

[0022] The connection between the edge segment finger, the first electroplated lead, and the power lead includes: connecting the first through hole and the first electroplated lead, and connecting the first electroplated lead, the second through hole, and the power lead.

[0023] In one embodiment, the substrate includes a circuit area and a board edge area surrounding the circuit area, the first via and the second via are both disposed in the circuit area, the power lead is disposed in the board edge area, and the outer layer circuit is further provided with a third electroplated lead;

[0024] The connection between the first electroplated lead, the second through hole, and the power lead includes: connecting the first electroplated lead to the second through hole, connecting the second through hole to the third electroplated lead, and connecting the third electroplated lead to the power lead.

[0025] In one embodiment, the conductive pattern is disposed on the outer layer circuitry and connected to the inner segment finger of the board;

[0026] The connection between the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead includes: connecting the conductive pattern to the second electroplated lead, and connecting the second electroplated lead to the power lead.

[0027] In one embodiment, the conductive pattern is disposed on the inner layer circuit, and the outer layer circuit is further provided with a third through hole and a fourth through hole, wherein the third through hole is disposed on the inner segment finger of the board;

[0028] The connection between the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead includes: connecting the third through hole to the conductive pattern, connecting the conductive pattern to the fourth through hole, connecting the fourth through hole to the second electroplated lead, and connecting the second electroplated lead to the power lead.

[0029] The method for manufacturing a printed circuit board with segmented gold fingers provided in this application optimizes the processing flow of segmented gold fingers. By first etching the segmented fingers into shape during the pattern circuit stage, and designing first and second electroplating lead structures for the edge segmented fingers and the inner segmented fingers respectively, and then using different electroplating leads to plate gold on different segmented finger patterns, it is possible to electroplat gold on all surfaces of the edge segmented fingers and the inner segmented fingers, thereby solving the problems of exposed copper and suspended copper at the cut-off sections of the segmented gold fingers. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the existing gold finger structure;

[0032] Figure 2 This is a schematic diagram of the structure of a printed circuit board provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of another printed circuit board structure provided in an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of another printed circuit board structure provided in an embodiment of this application;

[0035] Figure 5 for Figure 3 A cross-sectional view of the printed circuit board shown;

[0036] Figure 6 A flowchart illustrating a method for manufacturing a printed circuit board according to an embodiment of this application.

[0037] Explanation of key component symbols:

[0038] 100. Printed circuit boards;

[0039] 1. Substrate; 11. Inner layer circuitry; 12. Outer layer circuitry;

[0040] 21. First electroplated lead; 22. Second electroplated lead; 23. Third electroplated lead;

[0041] 3. Conductive patterns; 31. Patterned circuits; 32. Pads;

[0042] 4. Power supply leads;

[0043] 5. Gold finger structure; 51. Edge section fingers; 52. Inner section fingers;

[0044] 61. First through hole; 62. Second through hole; 63. Third through hole; 64. Fourth through hole. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0046] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are for descriptive convenience only, not indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the patent. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0047] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0048] Example 1:

[0049] like Figure 2 As shown, this application provides a printed circuit board 100 with segmented gold fingers, including a substrate 1 and a gold finger structure 5. The substrate 1 has a first electroplated lead 21, a second electroplated lead 22, a conductive pattern 3, and at least one power lead 4. Both the first electroplated lead 21 and the second electroplated lead 22 are connected to the power lead 4, and the second electroplated lead 22 is also connected to the conductive pattern 3. The gold finger structure 5 includes edge-segment fingers 51 and inner-segment fingers 52 disposed on the substrate 1. The edge-segment fingers 51 are connected to the first electroplated lead 21, and the inner-segment fingers 52 are connected to the second electroplated lead 22.

[0050] The edge segment finger 51 is a finger pattern close to the edge of the substrate 1, and the inner segment finger 52 is a finger pattern away from the edge of the substrate 1. The edge segment finger 51 and the inner segment finger 52 are distributed at intervals to form a segmented structure. The edge segment finger 51 and the inner segment finger 52 are not electrically connected to each other.

[0051] Power lead 4 connects to an external power source to power the gold finger electroplating. One end of the first electroplating lead 21 is connected to power lead 4, and the other end is connected to the edge finger 51. The first electroplating lead 21 is used to electroplat the edge finger 51. The conductive pattern 3 is a functional circuit on the substrate 1, including patterned lines 31 and pads 32 on the patterned lines 31. The patterned lines 31 are connected to the inner finger 52. One end of the second electroplating lead 22 is connected to the patterned lines 31 or pads 32 of the conductive pattern 3, and the other end is connected to power lead 4. The second electroplating lead 22 is used to electroplat the inner finger 52. The first electroplating lead 21 and the second electroplating lead 22 can be connected to the same power lead 4 or to different power leads 4, depending on the circuit board's wiring requirements.

[0052] The printed circuit board 100 with segmented gold fingers provided in this application includes a substrate 1 and a gold finger structure 5 disposed on the substrate 1. The gold finger structure 5 includes edge-mounted fingers 51 and inner-mounted fingers 52. The substrate 1 is provided with a first electroplating lead 21 connecting to the edge-mounted fingers 51 and a second electroplating lead 22 connecting to the inner-mounted fingers 52. The first electroplating lead 21 and the second electroplating lead 22 can be used to electroplate the edge-mounted fingers 51 and the inner-mounted fingers 52 respectively. With this configuration, the different segments of the segmented gold fingers rely on different... When electroplating the leads, the segmented fingers can be etched and shaped during the pattern circuit stage. Then, different electroplating leads are used to plate gold on different segments of the finger pattern. This allows gold plating to be applied to all surfaces of the edge segment fingers 51 and the inner segment fingers 52, thus solving the problems of exposed copper and suspended gold at the cut sections of the segmented gold fingers. On the other hand, the inner segment fingers 52 are connected to the second electroplating lead 22 by the existing conductive pattern 3 on the substrate 1, which helps to reduce the design length of the second electroplating lead 22 and improve the rationality of the wiring on the surface of the substrate 1.

[0053] It should be noted that the printed circuit board 100 mentioned above is a circuit board to be processed, and it will need to go through electroplating, etching and other steps to become a finished circuit board.

[0054] In the embodiments provided in this application, the substrate 1 includes an inner layer circuit 11 and an outer layer circuit 12. A first electroplated lead 21 is disposed on the inner layer circuit 11, and a second electroplated lead 22, a power lead 4, and a gold finger structure 5 are disposed on the outer layer circuit 12. The outer layer circuit 12 is also provided with a first through hole 61 and a second through hole 62. The first through hole 61 is disposed on the edge segment finger 51 and is used to conduct the connection between the edge segment finger 51 and the first electroplated lead 21. The second through hole 62 is used to conduct the connection between the first electroplated lead 21 and the power lead 4.

[0055] The first electroplated lead 21 is located on the inner layer circuit 11 and is opposite to the edge finger 51. Since the first electroplated lead 21, the edge finger 51, and the power lead 4 are distributed on different layers, a via is required to achieve cross-layer connection. The first via 61 is located on the edge finger 51, and its diameter must be smaller than the length and width of the finger pattern. The smaller the size, the better, so as to avoid affecting the performance and appearance of the gold finger.

[0056] It is understandable that the circuit board can be a multilayer board, and the number of inner layer circuits 11 is not unique. The first electroplated lead 21 is designed on any inner layer circuit 11.

[0057] With the above design, the wiring of the first electroplated lead 21 and the second electroplated lead 22 is reasonable, with good conductivity, and the subsequent processing is easy.

[0058] In the embodiments provided in this application, substrate 1 includes a circuit region and surrounding areas (such as...). Figure 2 The plate edge area (as shown in area A) is set (e.g.) Figure 2 In the area shown in B, the first via 61 and the second via 62 are both located within the circuit area, and the power lead 4 is located within the board edge area. A third electroplated lead 23 is also provided on the outer circuit 12. Part of the third electroplated lead 23 is located within the circuit area, and part is located within the board edge area. One end of the third electroplated lead 23 is connected to the second via 62, and the other end is connected to the power lead 4.

[0059] Specifically, the first electroplating lead 21 is disposed on the inner layer circuit 11, the third electroplating lead 23 and the board edge gold finger are disposed on the outer layer circuit 12, the board edge finger 51 is connected to the first electroplating lead 21 across layers through the first through hole 61, the first electroplating lead 21 is connected to the third electroplating lead 23 across layers through the second through hole 62, and the third electroplating lead 23 is directly connected to the power lead 4.

[0060] It should be noted that the inner layer circuit 11 and the outer layer circuit 12 belong to the interlayer structure of the substrate 1, while the circuit area and the board edge area belong to the board surface structure of the substrate 1. It can be understood that structures such as the gold finger structure 5 and the conductive pattern 3 are also located within the circuit area.

[0061] With the above design, the third electroplating lead 23 is easy to remove in subsequent processing. Thus, by setting the third electroplating lead 23, the processing difficulty of gold fingers and circuit board products can be further reduced, and the problem of exposed copper on the edge of the circuit board can be solved, which is conducive to further improving the product quality of gold fingers and circuit boards.

[0062] It is understood that in some embodiments, such as Figure 3 and Figure 5 As shown, the first via 61 is located in the circuit area of ​​the substrate 1, and the second via 62 is located in the edge area of ​​the substrate 1. The first electroplated lead 21 is directly connected to the power lead 4 through the second via 62. The wiring method of the first electroplated lead 21 can be designed according to the actual situation and is not limited here.

[0063] In the embodiments provided in this application, such as Figure 2 As shown, the conductive pattern 3 is disposed on the outer layer circuit 12 and connected to the side of the inner segment finger 52 away from the edge segment finger 51.

[0064] Conductive pattern 3 is a functional circuit, mainly designed within the circuit area and distributed in the region at the rear end of the finger 52 on the board. The second electroplated lead 22 can be understood as a connecting lead added to conductive pattern 3.

[0065] With the above design, the conductive pattern 3 and the second electroplated lead 22 have reasonable wiring, simple connection structure, and are easy to process and manufacture.

[0066] Some printed circuit board products have high requirements for circuit design. After the gold fingers are gold plated, the electroplated leads on the circuit board need to be processed. Depending on the wiring structure of the electroplated leads on the substrate 1, the subsequent processing methods are also different.

[0067] In one embodiment, the electroplating leads include a first electroplating lead 21 and a second electroplating lead 22. The first electroplating lead 21 is disposed on the inner layer circuitry 11, mainly distributed at the edge of the board and not exposed on the surface of the substrate 1. After electroplating, the edge area can be removed with a milling cutter and the first electroplating lead 21 can be cut off. Since the cutting position is a certain distance from the edge of the edge segment finger 51, cutting off the first electroplating lead 21 will not damage the integrity of the edge segment finger 51. The surface of the edge segment finger 51 is fully gold-plated and there are no issues of exposed copper or suspended copper. The second electroplated lead 22 is disposed on the outer layer circuit 12 and exposed on the surface of the substrate 1. After electroplating, the second electroplated lead 22 can be removed by etching solution. Since the second electroplated lead 22 is directly connected to the pattern circuit 31 or pad 32 of the conductive pattern 3, etching to remove the second electroplated lead 22 will not damage the integrity of the inner segment finger 52 and the pattern circuit 31 of the conductive pattern 3. The inner segment finger 52 is fully gold-plated and there will be no exposed copper or suspended copper problems. The conductive pattern 3 can be used normally.

[0068] In some embodiments, the electroplated leads include a first electroplated lead 21, a second electroplated lead 22, and a third electroplated lead 23. The first electroplated lead 21 and the third electroplated lead 23 work together. The first electroplated lead 21 is disposed on the inner layer circuit 11, and the third electroplated lead 23 is disposed on the outer layer circuit 12. After electroplating, the third electroplated lead 23 can be etched away using an etching solution to disconnect the electrical connection between the third electroplated lead 23 and the first electroplated lead 21. Since the third electroplated lead 23 is indirectly connected to the board edge finger 51 through the first electroplated lead 21, etching away the third electroplated lead 23 will not damage the integrity of the board edge finger 51. The surface of the board edge finger 51 is fully gold-plated without exposed copper or suspended copper issues. The arrangement and removal method of the second electroplated lead 22 are the same as in the above embodiments, and will not be described again here.

[0069] In the embodiments provided in this application, the first electroplated lead 21 is retained on the inner layer circuit 11 and cannot be removed. To ensure that the electrical performance of other circuit patterns is not affected, the first electroplated lead 21 should avoid the functional circuit design and be as short as possible. In addition, the second via 62 should be designed in a blank area on the substrate 1 and avoid the gold finger structure 5 to ensure that the second via 62 will not affect the normal use of other circuit patterns and the gold finger structure 5.

[0070] In the embodiments provided in this application, the substrate 1 is provided with a first through-hole 61 and a second through-hole 62, which are used to realize cross-layer electrical connection. After the gold finger electroplating is completed, in order to disconnect the electrical connection between the electroplated leads and other structures on the substrate 1, the through-holes located outside the gold finger structure 5 need to be processed. Specifically, the conductive metal layer inside the through-hole can be removed by etching with an etching solution, or a larger opening can be drilled at the through-hole using a drilling machine to remove the conductive metal layer inside the through-hole.

[0071] In the embodiments provided in this application, the substrate 1 is provided with a first through-hole 61 and a second through-hole 62, which can be blind holes or through holes. To ensure the appearance integrity and reliability of the gold fingers and circuit board products, the through holes also need to be filled during the processing. Specifically, when the through hole is designed as a blind hole, copper filling can be performed on the blind hole subsequently; when the through hole is designed as a through hole, resin plugging and copper plating on the resin surface can be performed on the through hole subsequently.

[0072] In summary, the printed circuit board 100 provided in this application, by improving the design of the electroplating leads on the circuit board and the connection structure between the electroplating leads and the gold fingers, can solve the technical problems of exposed copper and suspended copper that easily occur at the disconnection points of segmented gold fingers and at the connection points between gold fingers and electroplating leads, thereby effectively improving the product quality of segmented gold fingers and circuit boards.

[0073] Example 2:

[0074] like Figure 4 As shown, this application provides a printed circuit board 100 with segmented gold fingers, including a substrate 1 and a gold finger structure 5. The substrate 1 has a first electroplated lead 21, a second electroplated lead 22, a conductive pattern 3, and at least one power lead 4. Both the first electroplated lead 21 and the second electroplated lead 22 are connected to the power lead 4, and the second electroplated lead 22 is also connected to the conductive pattern 3. The gold finger structure 5 includes edge-segment fingers 51 and inner-segment fingers 52 disposed on the substrate 1. The edge-segment fingers 51 are connected to the first electroplated lead 21, and the inner-segment fingers 52 are connected to the second electroplated lead 22.

[0075] The substrate 1 includes an inner layer circuit 11 and an outer layer circuit 12. A first electroplated lead 21 and a conductive pattern 3 are disposed on the inner layer circuit 11, and a second electroplated lead 22, a power lead 4, and a gold finger structure 5 are disposed on the outer layer circuit 12. The outer layer circuit 12 is also provided with a first through hole 61, a second through hole 62, a third through hole 63, and a fourth through hole 64. The first through hole 61 is disposed on the edge finger 51 and is used to conduct the edge finger 51 and the first electroplated lead 21. The second through hole 62 is used to conduct the first electroplated lead 21 and the power lead 4. The third through hole 63 is disposed on the inner finger 52 and is used to conduct the inner finger 52 and the conductive pattern 3. The fourth through hole 64 is used to conduct the conductive pattern 3 and the second electroplated lead 22.

[0076] Since the conductive pattern 3, the inner segment finger 52 and the second electroplated lead 22 are distributed on different layers, it is necessary to rely on vias to achieve cross-layer connection.

[0077] Specifically, the conductive pattern 3 is disposed on the inner layer circuit 11, the inner segment finger 52 and the second electroplated lead 22 are disposed on the outer layer circuit 12. The inner segment finger 52 is connected to the conductive pattern 3 across layers through the third through-hole 63, and the conductive pattern 3 is connected to the second electroplated lead 22 across layers through the fourth through-hole 64. The second electroplated lead 22 is directly connected to the power lead 4. The third through-hole 63 is disposed on the inner segment finger 52, and its diameter must be smaller than the length and width of the finger pattern, and the smaller the size design, the better, so as to avoid affecting the performance and appearance of the gold finger as much as possible.

[0078] The circuit board can be a multilayer board, and the number of inner layer lines 11 is not unique. The conductive pattern 3 is designed on any inner layer line 11.

[0079] The printed circuit board 100 with segmented gold fingers provided in this application has the following advantages. First, since the different segments of the gold fingers are electroplated using different electroplating leads, the segmented fingers can be etched and shaped during the pattern circuit stage, and then gold can be plated onto the different segments of the gold fingers using different electroplating leads. This allows the gold layer to be electroplated onto the surfaces of the edge segment fingers 51 and the inner segment fingers 52, thereby solving the problems of exposed copper and suspended gold at the cut-off sections of the segmented gold fingers. Second, the inner segment fingers 52 are connected to the second electroplating lead 22 by the existing conductive pattern 3 on the substrate 1, which helps to reduce the design length of the second electroplating lead 22 and improve the rationality of the wiring on the surface of the substrate 1.

[0080] In the embodiments provided in this application, the fourth via 64 can be considered as part of the second electroplated lead 22 and is used to achieve cross-layer electrical connection. After electroplating, the fourth via 64 needs to be processed to avoid affecting the electrical connection between the conductive pattern 3 and other structures on the substrate 1. Specifically, the conductive metal layer in the fourth via 64 can be removed by etching with an etching solution, or a larger opening can be drilled at the fourth via 64 using a drilling machine to remove the conductive metal layer in the fourth via 64.

[0081] In the embodiments provided in this application, the substrate 1 is provided with a third via 63 and a fourth via 64, which can be blind vias or through-holes. To ensure the appearance integrity and reliability of the gold fingers and circuit board products, the vias also need to be filled during the processing. Specifically, when the via is designed as a blind via, copper filling can be performed on the blind via; when the via is designed as a through-hole, resin plugging and copper plating on the resin surface can be performed on the through-hole.

[0082] Example 3:

[0083] This application provides a method for manufacturing a printed circuit board with segmented gold fingers, such as... Figure 2 and Figure 6 As shown, it includes:

[0084] S1. A substrate 1 is provided, on which a gold finger structure 5, a first electroplating lead 21, a second electroplating lead 22, a conductive pattern 3 and at least one power lead 4 are provided. The gold finger structure 5 includes edge segment fingers 51 and inner segment fingers 52.

[0085] The edge segment finger 51 is a finger pattern close to the edge of the substrate 1, and the inner segment finger 52 is a finger pattern away from the edge of the substrate 1. The edge segment finger 51 and the inner segment finger 52 are distributed at intervals to form a segmented structure. The edge segment finger 51 and the inner segment finger 52 are not electrically connected to each other.

[0086] S2, connecting plate edge finger 51, first electroplated lead 21 and power lead 4, and connecting plate inner finger 52, conductive pattern 3, second electroplated lead 22 and power lead 4.

[0087] The conductive pattern 3 is a functional circuit disposed on the substrate 1, including patterned circuit 31 and pad 32 structures disposed on the patterned circuit 31. A first electroplating lead 21 is connected to the edge finger 51 of the board for electroplating the edge finger 51. A second electroplating lead 22 is connected to the inner finger 52 of the board for electroplating the inner finger 52. The first electroplating lead 21 and the second electroplating lead 22 can be connected to the same power lead 4 or to different power leads 4, depending on the circuit board's wiring requirements.

[0088] S3. Power on the power lead 4 and perform gold plating on the surface of the gold finger structure 5.

[0089] Specifically, power lead 4 is connected to an external power source, and turning on the external power source will provide power for the gold finger electroplating.

[0090] S4. Disconnect the first electroplating lead 21 from the power supply lead 4, and remove the second electroplating lead 22.

[0091] Depending on the wiring structure of the electroplated leads, the subsequent processing methods will also differ, including but not limited to cutting and etching.

[0092] The method for manufacturing a printed circuit board with segmented gold fingers provided in this application optimizes the segmented gold finger processing flow. By first etching the segmented fingers into shape during the pattern circuit stage, and designing the first electroplating lead 21 and the second electroplating lead 22 structure for the edge segmented fingers 51 and the inner segmented fingers 52 respectively, and then using different electroplating leads to plate gold on different segmented finger patterns, it is possible to electroplat gold on each surface of the edge segmented fingers 51 and the inner segmented fingers 52, thereby solving the problems of exposed copper and suspended copper at the cut-off section of the segmented gold fingers.

[0093] In the embodiments provided in this application, the substrate 1 includes inner layer circuitry 11 and outer layer circuitry 12. A first electroplated lead 21 is disposed on the inner layer circuitry 11, and the gold finger structure 5 and power lead 4 are disposed on the outer layer circuitry 12. The outer layer circuitry 12 also has a first via 61 and a second via 62, with the first via 61 located on the edge finger 51. It is understood that the circuit board can be a multilayer board, and the number of inner layer circuitry 11 is not unique; the first electroplated lead 21 can be designed on any inner layer circuitry 11. Furthermore, to ensure that the electrical performance of other circuit patterns is not affected, the first electroplated lead 21 should avoid functional circuit designs and be as short as possible.

[0094] In step S2, the connection between the edge finger 51 of the connecting board, the first electroplating lead 21, and the power lead 4 includes:

[0095] S211, Connect the first through hole 61 to the first electroplating lead 21.

[0096] S212, connect the first electroplating lead 21, the second through hole 62 and the power lead 4.

[0097] It is understood that steps S211 and 212 are only used to indicate the processing content included in step S2. In actual design, the processing sequence of each layer of circuits and vias needs to be adjusted according to the actual structure of the circuit board.

[0098] It should be noted that the first electroplated lead 21 is located on the inner layer circuit 11 and is opposite to the edge finger 51. Since the first electroplated lead 21, the edge finger 51, and the power lead 4 are distributed on different layers, a via is required to achieve cross-layer connection. The first via 61 is located on the edge finger 51, and its diameter must be smaller than the length and width of the finger pattern. The smaller the size, the better, in order to minimize the impact on the performance and appearance of the gold finger.

[0099] With the above design, the first electroplated lead 21 has a reasonable wiring, good conductivity, and low difficulty in subsequent processing.

[0100] In the embodiments provided in this application, the substrate 1 includes a circuit area and a board edge area surrounding the circuit area. The first through hole 61 and the second through hole 62 are both located in the circuit area. The power lead 4 is located in the board edge area. The outer layer circuit 12 is also provided with a third electroplating lead 23.

[0101] It should be noted that the inner layer circuit 11 and the outer layer circuit 12 belong to the interlayer structure of the substrate 1, while the circuit area and the board edge area belong to the board surface structure of the substrate 1. It can be understood that structures such as the gold finger structure 5 and the conductive pattern 3 are also located within the circuit area.

[0102] Step S212 includes: connecting the first electroplating lead 21 to the second through hole 62, connecting the second through hole 62 to the third electroplating lead 23, and connecting the third electroplating lead 23 to the power lead 4.

[0103] Further, in step S4, disconnecting the first electroplated lead 21 from the power supply lead 4 includes etching away the third electroplated lead 23. Specifically, the third electroplated lead 23 can be removed by etching with an etching solution to disconnect the electrical connection between the third electroplated lead 23 and the first electroplated lead 21.

[0104] With the above design, the third electroplating lead 23 is easy to remove in subsequent processing. Thus, by setting the third electroplating lead 23, the processing difficulty of gold fingers and circuit board products can be further reduced, and the problem of exposed copper on the edge of the circuit board can be solved, which is conducive to further improving the product quality of gold fingers and circuit boards.

[0105] It is understood that in some embodiments, such as Figure 3 and Figure 5As shown, the first via 61 is located in the circuit area of ​​the substrate 1, and the second via 62 is located in the edge area of ​​the substrate 1. The first electroplated lead 21 is directly connected to the power lead 4 through the second via 62. Step S212 includes: connecting the first electroplated lead 21 to the second via 62, and connecting the second via 62 to the power lead 4. In subsequent processing, the edge area can be removed and the first electroplated lead 21 can be cut using a router. The wiring method and processing steps of the first electroplated lead 21 can be designed according to the actual situation and are not limited here.

[0106] In the embodiments provided in this application, the conductive pattern 3 is disposed on the outer layer circuit 12 and connected to the inner segment finger 52.

[0107] In step S2, the connecting plate inner segment finger 52, conductive pattern 3, second electroplated lead 22, and power lead 4 include:

[0108] S221, Connect the conductive pattern 3 to the second electroplating lead 22.

[0109] The conductive pattern 3 includes a pattern line 31 and a pad 32 structure disposed on the pattern line 31. The pattern line is directly connected to the side of the inner segment finger 52 away from the edge segment finger 51. The second electroplated lead 22 is connected to the pattern line 31 or the pad 32.

[0110] S222, Connect the second electroplating lead 22 to the power lead 4

[0111] The second electroplating lead 22 can be understood as a connecting lead added to the conductive pattern 3.

[0112] It is understood that steps S221 and 222 are only used to indicate the processing content included in step S2. In actual design, the processing sequence of each layer of circuits and vias needs to be adjusted according to the actual structure of the circuit board.

[0113] With the above design, the conductive pattern 3 and the second electroplated lead 22 have reasonable wiring, simple connection structure, and are easy to process and manufacture.

[0114] In the embodiments provided in this application, before energizing the power lead 4 and gold plating the surface of the gold finger structure 5, the manufacturing method further includes: fabricating an anti-gold plating protective layer on the substrate 1. Specifically, an anti-gold plating wet film or an anti-gold plating dry film is fabricated on the board surface, such that the anti-gold plating wet film or dry film at least covers the second electroplating lead 22 and the third electroplating lead 23.

[0115] It should be noted that since wet film cannot seal holes well, when using anti-gold plating wet film as a protective layer, blue glue needs to be applied to the non-gold plating area before electroplating the fingers to seal various vias on the circuit board surface.

[0116] In the embodiments provided in this application, the substrate 1 is provided with a first through-hole 61 and a second through-hole 62, which are used to realize cross-layer electrical connection. After the gold finger electroplating is completed, in order to disconnect the electrical connection between the electroplated leads and other structures on the substrate 1, the through-holes located outside the gold finger structure 5 need to be processed. Specifically, the conductive metal layer inside the through-hole can be removed by etching with an etching solution, or a larger opening can be drilled at the through-hole using a drilling machine to remove the conductive metal layer inside the through-hole.

[0117] In the embodiments provided in this application, the substrate 1 is provided with a first through-hole 61 and a second through-hole 62, which can be blind holes or through holes. To ensure the appearance integrity and reliability of the gold fingers and circuit board products, the through holes need to be filled after the gold fingers are electroplated. Specifically, when the through hole is designed as a blind hole, copper filling can be performed on the blind hole; when the through hole is designed as a through hole, resin plugging and copper plating on the resin surface can be performed on the through hole.

[0118] In addition to the steps described above, the manufacturing method provided in this application also includes pre-process and post-process. A complete manufacturing process should include at least the following steps: pre-process, drilling, hole metallization, fabrication of outer layer circuit 12, fabrication of anti-gold dry film / wet film, electroplating of gold fingers, etching of leads, and post-process.

[0119] Specifically, the preceding processes include engineering design, material cutting, inner layer circuit pattern fabrication 11, inner layer AOI, browning, and lamination. It is important to note that during the engineering design phase, various leads need to be added to the corresponding circuit fabrication data, and the metallized holes connecting the board edge fingers 51 to the inner layers need to be added to the drilling data. When fabricating the electroplated leads corresponding to the board edge fingers 51, the electroplated leads need to be etched simultaneously. Drilling includes processing various holes within the board using laser drilling or mechanical milling. This stage requires simultaneously processing all vias on the substrate 1, and drilling the vias at the finger patterns directly to the layer containing the corresponding electroplated leads or conductive patterns 3. Hole metallization includes metallizing the vias that are pre-designed to connect to the circuitry of each layer. For example, the holes can be metallized using methods such as copper plating or electroplating, resulting in a copper plating layer adhering to the hole walls to achieve electrical conductivity. Fabricating the outer layer circuitry 12 involves a pattern transfer method, using processes such as film application, exposure, development, and etching to transfer the pre-defined circuitry to the PCB board surface. This step directly etches the segmented gold fingers into shape and simultaneously etches the electroplated leads on the board surface. Fabricating the anti-gold plating dry / wet film involves applying an anti-gold plating dry film or coating a wet film onto the board surface. After exposure and development, this covers and protects the circuit patterns, leads, and vias in non-gold plating areas from being electroplated with gold. It should be noted that in actual processing, due to the poor sealing effect of wet film, after developing the wet film, blue adhesive is often printed in the non-gold plating areas inside the board to better protect the internal circuitry and vias that do not require gold plating. Electroplating the gold fingers involves connecting the electroplated leads and power leads 4 to an external power source to complete the gold plating operation. Etching the leads involves etching away the electroplated leads on the non-board surface. It should be noted that the first via 61 drilled on the edge segment fingers 51 does not require etching. The subsequent processes include conventional processes such as solder resist and electroplating of the in-board pads 32 with gold, which will not be described in detail.

[0120] In summary, the manufacturing method provided in this application, by improving the manufacturing process of the gold fingers and the design of the electroplating leads, can solve the technical problems of exposed copper and suspended copper that easily occur at the break points of segmented gold fingers and at the connection points between the gold fingers and the electroplating leads, thereby effectively improving the product quality of segmented gold fingers and circuit boards.

[0121] Example 4:

[0122] This application provides a method for manufacturing a printed circuit board with segmented gold fingers, such as... Figure 4 and Figure 6 As shown, it includes:

[0123] S1. A substrate 1 is provided, on which a gold finger structure 5, a first electroplating lead 21, a second electroplating lead 22, a conductive pattern 3 and at least one power lead 4 are provided. The gold finger structure 5 includes edge segment fingers 51 and inner segment fingers 52.

[0124] S2, connecting plate edge finger 51, first electroplated lead 21 and power lead 4, and connecting plate inner finger 52, conductive pattern 3, second electroplated lead 22 and power lead 4.

[0125] S3. Power on the power lead 4 and perform gold plating on the surface of the gold finger structure 5.

[0126] S4. Disconnect the first electroplating lead 21 from the power supply lead 4, and remove the second electroplating lead 22.

[0127] Furthermore, the substrate 1 includes an inner layer circuit 11 and an outer layer circuit 12. The first electroplated lead 21 and the conductive pattern 3 are disposed on the inner layer circuit 11, and the gold finger structure 5 and the power lead 4 are disposed on the outer layer circuit 12. The outer layer circuit 12 is also provided with a first through hole 61, a second through hole 62, a third through hole 63 and a fourth through hole 64. The first through hole 61 is disposed on the edge finger 51 of the board, and the third through hole 63 is disposed on the inner finger 52 of the board.

[0128] In step S2, the connection of the inner segment finger 52, conductive pattern 3, second electroplating lead 22 and power lead 4 includes: connecting the third through hole 63 to the conductive pattern 3, connecting the conductive pattern 3 to the fourth through hole 64, connecting the fourth through hole 64 to the second electroplating lead 22, and connecting the second electroplating lead 22 to the power lead 4.

[0129] The method for manufacturing a printed circuit board with segmented gold fingers provided in this application optimizes the segmented gold finger processing flow. By first etching the segmented fingers into shape during the pattern circuit stage, and designing the first electroplating lead 21 and the second electroplating lead 22 structure for the edge segmented fingers 51 and the inner segmented fingers 52 respectively, and then using different electroplating leads to plate gold on different segmented finger patterns, it is possible to electroplat gold on each surface of the edge segmented fingers 51 and the inner segmented fingers 52, thereby solving the problems of exposed copper and suspended copper at the cut-off section of the segmented gold fingers.

[0130] In the embodiments provided in this application, the fourth via 64 can be considered as part of the second electroplated lead 22 and is used to achieve cross-layer electrical connection. After the gold finger electroplating is completed, the fourth via 64 needs to be processed to avoid affecting the electrical connection between the conductive pattern 3 and other structures on the substrate 1. Specifically, the conductive metal layer in the fourth via 64 can be removed by etching with an etching solution, or a larger opening can be drilled at the fourth via 64 using a drilling machine to remove the conductive metal layer in the fourth via 64.

[0131] In the embodiments provided in this application, the substrate 1 is provided with a third via 63 and a fourth via 64, which can be blind vias or through-holes. To ensure the appearance integrity and reliability of the gold fingers and circuit board products, the vias need to be filled after the gold fingers are electroplated. Specifically, when the via is designed as a blind via, copper filling can be performed on the blind via; when the via is designed as a through-hole, resin plugging and copper plating on the resin surface can be performed on the through-hole.

[0132] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A printed circuit board having a segmented gold finger, characterized by, include: A substrate having a first electroplated lead, a second electroplated lead, a conductive pattern, and at least one power lead, wherein the first electroplated lead and the second electroplated lead are both connected to the power lead, and the second electroplated lead is also connected to the conductive pattern; The gold finger structure includes edge-section fingers and inner-section fingers disposed on the substrate. The edge-section fingers are connected to the first electroplating lead, and the inner-section fingers are connected to the second electroplating lead through the conductive pattern. The substrate includes an inner layer circuit and an outer layer circuit. The first electroplated lead is disposed on the inner layer circuit, and the power lead and the gold finger structure are disposed on the outer layer circuit. The second electroplated lead is disposed on the outer layer circuit and exposed on the surface of the substrate. After electroplating, the second electroplated lead is etched away. The outer layer circuit is also provided with a first through hole and a second through hole. The first through hole is provided on the edge segment finger of the board and is used to conduct the edge segment finger of the board and the first electroplated lead. The second through hole is used to conduct the first electroplated lead and the power lead. The substrate includes a circuit area and a board edge area surrounding the circuit area. The first through hole and the second through hole are both located in the circuit area, and the power lead is located in the board edge area. The outer layer circuit is also provided with a third electroplated lead. The third electroplated lead is partially located in the circuit area and partially located in the board edge area. One end of the third electroplated lead is connected to the second through hole, and the other end is connected to the power lead. After electroplating is completed, the third electroplated lead is etched away to disconnect the electrical connection between the third electroplated lead and the first electroplated lead.

2. The printed circuit board having segmented gold fingers of claim 1, wherein, The conductive pattern is disposed on the outer layer circuit and connected to the side of the inner segment finger away from the edge segment finger.

3. The printed circuit board with segmented gold fingers according to claim 1, characterized in that, The conductive pattern is disposed on the inner layer circuit, and the outer layer circuit is further provided with a third through hole and a fourth through hole. The third through hole is disposed on the inner segment finger and is used to conduct the inner segment finger and the conductive pattern. The fourth through hole is used to conduct the conductive pattern and the second electroplated lead.

4. A method of fabricating a printed circuit board having a segmented gold finger, the method comprising: include: A substrate is provided, wherein the substrate is provided with a gold finger structure, a first electroplated lead, a second electroplated lead, a conductive pattern and at least one power lead, and the gold finger structure includes edge-section fingers and inner-section fingers. Connect the edge segment finger, the first electroplated lead, and the power lead; and connect the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead. The power lead is energized, and gold plating is performed on the surface of the gold finger structure. Disconnect the first electroplating lead from the power supply lead, and remove the second electroplating lead; The substrate includes inner layer circuitry and outer layer circuitry. The first electroplated lead is disposed on the inner layer circuitry, and the gold finger structure and power lead are disposed on the outer layer circuitry. The outer layer circuitry also has a first via and a second via, with the first via disposed on the edge finger. Connecting the edge finger, the first electroplated lead, and the power lead includes: connecting the first via to the first electroplated lead, and connecting the first electroplated lead, the second via, and the power lead. The second electroplated lead is disposed on the outer layer circuitry and exposed on the substrate surface. After electroplating, the second electroplated lead is etched away. The substrate includes a circuit area and a board edge area surrounding the circuit area. The first through hole and the second through hole are both located in the circuit area. The power lead is located in the board edge area. A third electroplating lead is also provided on the outer layer circuit. The connection between the first electroplated lead, the second via, and the power lead includes: connecting the first electroplated lead to the second via, connecting the second via to the third electroplated lead, and connecting the third electroplated lead to the power lead. After electroplating is completed, the third electroplated lead is etched away to disconnect the electrical connection between the third electroplated lead and the first electroplated lead.

5. The method of manufacturing according to claim 4, wherein, The conductive pattern is disposed on the outer layer circuit and connected to the inner segment finger of the board; The connection between the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead includes: connecting the conductive pattern to the second electroplated lead, and connecting the second electroplated lead to the power lead.

6. The method of manufacturing according to claim 4, wherein, The conductive pattern is disposed on the inner layer circuit, and the outer layer circuit is further provided with a third through hole and a fourth through hole, and the third through hole is disposed on the inner segment finger of the board; The connection between the inner segment finger, the conductive pattern, the second electroplated lead, and the power lead includes: connecting the third through hole to the conductive pattern, connecting the conductive pattern to the fourth through hole, connecting the fourth through hole to the second electroplated lead, and connecting the second electroplated lead to the power lead.

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