Organic device and method for manufacturing an organic device

Abstract

The present application relates to an organic device and a method for manufacturing an organic device. The organic device has an outer edge, a wiring region, and a display region. The display region includes a first electrode, an organic layer on the first electrode, and a second electrode on the organic layer. The wiring region includes a reference electrode electrically connected to the second electrode and defining a reference potential. The display region includes a first display region and a second display region adjacent to the first display region. The second display region includes a standard region including the second electrode and a transmission region not including the second electrode and arranged in a first direction. The second electrode of the standard region includes a plurality of connection portions connected to the second electrode of the first display region. The plurality of connection portions includes a first connection portion on a first side in a second direction. The first connection portion includes a facing connection portion between the transmission regions in the first direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to organic devices and methods for manufacturing organic devices. Background Technology

[0002] In recent years, the market has demanded high-resolution display devices in electronic devices such as smartphones and tablets. These display devices typically have a component density of 400ppi or higher, or even 800ppi or higher.

[0003] Organic EL display devices have attracted attention due to their good responsiveness and / or high contrast. As a method for forming elements of an organic EL display device, a method of attaching the material constituting the element to a substrate by vapor deposition is known. For example, first, a substrate with an anode formed in a pattern corresponding to the element is prepared. Next, an organic material is attached to the anode through through-holes in a mask, thereby forming an organic layer on the anode. Then, a conductive material is attached to the organic layer through through-holes in the mask, thereby forming a cathode on the organic layer.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 6500082

[0007] Patent Document 2: Japanese Patent Application Publication No. 2021-9355 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] In organic devices such as OLED displays, if a voltage is applied between the anode and cathode, current flows from the anode to the organic layer, which emits light that forms the image. The current flowing through the organic layer flows through the cathode to a reference electrode at a predetermined reference potential. Here, depending on the deposition pattern of the cathode, the current resistance value in the cathode of each element changes, and the amount of current flowing to each element can vary. As a result, brightness differences occur between the elements of the organic device, and display uniformity may deteriorate.

[0010] The purpose of this invention is to provide an organic device that can effectively solve this problem.

[0011] Methods for solving problems

[0012] An organic device according to one embodiment of the present invention may include: an outer edge comprising a first side and a second side extending in a first direction and facing each other in a second direction orthogonal to the first direction, and a third side and a fourth side extending in a direction from the first side toward the second side; a wiring region extending along the first side; and a display region connected to the wiring region. The display region may include a first electrode, an organic layer located on the first electrode, and a second electrode located on the organic layer. The wiring region may include a reference electrode electrically connected to the second electrode and defining a reference potential. The display region may include a first display region and a second display region connected to the first display region. The second display region may include: a standard region containing the second electrode, and a transmissive region not containing the second electrode and arranged in the first direction. The second electrode of the standard region may include a plurality of connecting portions connected to the second electrode of the first display region. The plurality of connecting portions may include a first connecting portion located on the first side in the second direction. The first connecting portion may include opposing connecting portions located between the transmissive regions in the first direction.

[0013] The effects of the invention

[0014] According to one embodiment of the present invention, the current flowing to each element of an organic device can be made uniform. Attached Figure Description

[0015] Figure 1 This is a top view illustrating an example of an organic device according to one embodiment of the present invention.

[0016] Figure 2 It is Figure 1 An enlarged top view of the area enclosed by the double-dotted line labeled A1 in the organic device.

[0017] Figure 3 It is Figure 2 An enlarged top view of the area enclosed by the double-dotted line labeled B1 in the organic device.

[0018] Figure 4 It shows from Figure 3 A top view of the organic device after the second electrode has been removed.

[0019] Figure 5 It is along Figure 3 A cross-sectional view of the CC line of an organic device.

[0020] Figure 6 It is along Figure 3 A cross-sectional view of the DD line of an organic device.

[0021] Figure 7 It is Figure 1 An enlarged top view of the area enclosed by the double-dotted line labeled A2 in the organic device.

[0022] Figure 8 This is a diagram showing an example of a vapor deposition apparatus equipped with a mask device.

[0023] Figure 9 Is Figure 8 The first mask used in the mask assembly will be with Figure 3 The corresponding part is shown in an enlarged top view.

[0024] Figure 10 This is a top view showing the organic device of the first embodiment.

[0025] Figure 11 This is a top view showing the organic device of the second embodiment.

[0026] Figure 12 It is Figure 11 An enlarged top view of the area enclosed by the double-dotted line labeled C2 in the organic device.

[0027] Figure 13 This is a top view showing the organic device of the third embodiment.

[0028] Figure 14 It is Figure 13 An enlarged top view of the area enclosed by the double-dotted line labeled C3 in the organic device.

[0029] Figure 15 This is a top view showing the organic device of the comparative example.

[0030] Figure 16 It is Figure 15 An enlarged top view of the area enclosed by the double-dotted line labeled C4 in the organic device.

[0031] Figure 17 This is a top view showing an organic device as an example.

[0032] Figure 18 This is a table showing the simulation results of each embodiment. Detailed Implementation

[0033] In this specification and accompanying drawings, unless otherwise specified, the terms “substrate,” “material,” “plate,” “sheet,” or “film,” etc., which refer to the material that forms the basis of a structure, are not distinguished from each other merely based on different names.

[0034] In this specification and accompanying drawings, unless otherwise specified, terms such as “parallel”, “orthogonal”, or values ​​of length and angle that define shape, geometric conditions, and their degree are not limited to their strict meaning, but are interpreted to include the range of degrees to which the same function can be expected.

[0035] In this specification and accompanying drawings, unless otherwise specified, the terms "above" or "below," "on the upper side" or "on the lower side," or "above" or "below" refer to situations where a component or region is in direct contact with other structures. This also includes situations where one structure is indirectly in contact with another structure, where another structure is involved between them. Furthermore, unless otherwise specified, the vertical direction in terms such as "above," "on the upper side," "above," "below," "below," or "below" can be reversed.

[0036] In this specification and accompanying drawings, unless otherwise specified, the same or similar reference numerals are used to denote the same part or parts with the same function, and sometimes repeated descriptions are omitted. Additionally, for ease of explanation, the dimensions in the drawings may differ from the actual scale, and sometimes a part of the structure may be omitted from the drawings.

[0037] In this specification and accompanying drawings, unless otherwise specified, other embodiments or modifications can be combined within a scope that does not create contradiction. Furthermore, other embodiments can also be combined with each other, or with other embodiments and modifications, within a scope that does not create contradiction. Additionally, modifications can also be combined with each other within a scope that does not create contradiction.

[0038] In this specification and accompanying drawings, unless otherwise specified, when multiple steps are disclosed regarding manufacturing methods or other methods, other undisclosed steps may be performed between the disclosed steps. Furthermore, the order of the disclosed steps is arbitrary as long as it does not create contradictions.

[0039] In this specification and accompanying drawings, unless otherwise specified, the numerical range indicated by the symbol “~” includes the numerical values ​​placed before and after the symbol “~”. For example, the numerical range defined by the expression “34 to 38% by mass” is the same as the numerical range defined by the expression “more than 34% by mass and less than 38% by mass”.

[0040] The first aspect of the present invention is an organic device comprising:

[0041] The outer edge includes a first side and a second side extending in a first direction and facing each other in a second direction orthogonal to the first direction, and a third side and a fourth side extending in a direction from the first side toward the second side;

[0042] The wiring area extends along the first side mentioned above; and

[0043] The display area is connected to the aforementioned wiring area.

[0044] The aforementioned display area includes a first electrode, an organic layer located on the first electrode, and a second electrode located on the organic layer.

[0045] The aforementioned wiring area includes a reference electrode that is electrically connected to the second electrode and defines a reference potential.

[0046] The aforementioned display area includes a first display area and a second display area adjacent to the first display area.

[0047] The second display area includes: a standard area containing the second electrode, and a transmission area excluding the second electrode and arranged in the first direction.

[0048] The second electrode in the aforementioned standard area includes a plurality of connection portions that are connected to the second electrode in the aforementioned first display area.

[0049] The plurality of the aforementioned connecting portions are included in the first connecting portion located on the first side in the second direction.

[0050] The first connecting portion mentioned above includes opposing connecting portions located between the transmission regions in the first direction.

[0051] In the second aspect of the present invention, in the organic device of the first aspect described above,

[0052] Multiple of the aforementioned connecting portions may be included in the second connecting portion located on the second side in the second direction.

[0053] In the third aspect of the present invention, in the organic device of the second aspect described above,

[0054] The aforementioned standard region includes the portion of the second electrode extending in the second direction from the second connection portion to the first connection portion.

[0055] The aforementioned opposing connection portion may be located at the end of the first side of the second direction of the aforementioned second direction portion.

[0056] In the fourth aspect of the present invention, in the organic device of the third aspect described above,

[0057] The aforementioned transmissive area can extend from the end that connects to the first display area on the second side in the second direction to the end that connects to the first display area on the first side in the second direction.

[0058] In the fifth aspect of the present invention, in the organic device of the third aspect described above,

[0059] The aforementioned standard region may include a first-direction portion of the second electrode extending in the first direction, so as to connect two adjacent second-direction portions in the first direction respectively.

[0060] In the sixth aspect of the present invention, in each of the organic devices described in the first to fifth aspects,

[0061] The aforementioned standard area may include the area where the second electrode and the organic layer do not overlap when viewed from above.

[0062] In the seventh aspect of the present invention, in each of the organic devices described in the first to sixth aspects,

[0063] The aforementioned transmission region may include the area where the substrate of the aforementioned organic device and the aforementioned organic layer do not overlap when viewed from above.

[0064] In the eighth aspect of the present invention, in each of the organic devices described in the first to seventh aspects,

[0065] The first connecting part may include two or more of the aforementioned opposing connecting parts.

[0066] In the ninth aspect of the present invention, in each of the organic devices described in the first to eighth aspects,

[0067] The dimensions of the first connecting portion in the first direction can be 5 μm or more and 500 μm or less.

[0068] In the tenth aspect of the present invention, in each of the organic devices described in the first to ninth aspects, the first connecting portions may be arranged in the first direction at intervals of 10 μm to 550 μm.

[0069] In the eleventh aspect of the present invention, in each of the organic devices described in the first to tenth aspects,

[0070] The second electrode in the aforementioned standard area may include a first layer and a second layer that partially overlaps with the first layer when viewed from above.

[0071] In the 12th aspect of the present invention, in the organic device of the 11th aspect described above,

[0072] The second electrode in the aforementioned standard area may be included in a third layer that partially overlaps with the first or second layer when viewed from above.

[0073] In the 13th aspect of the present invention, in each of the organic devices described in the first to 12th aspects,

[0074] The occupancy of the second electrode in the second display area can be more than 40% and less than 95%.

[0075] In the 14th aspect of the present invention, in each of the organic devices described in the 1st to 13th aspects,

[0076] The first electrode mentioned above contains a metal oxide.

[0077] The second electrode mentioned above may contain metal.

[0078] The 15th aspect of the present invention is a method for manufacturing an organic device, which is a method for manufacturing each of the organic devices described in the 1st to 14th aspects above.

[0079] It includes a second electrode forming process in which the second electrode is formed on the organic layer on the first electrode.

[0080] The aforementioned second electrode comprises a first layer and a second layer that partially overlaps with the first layer when viewed from above.

[0081] The second electrode forming process described above includes:

[0082] The process of forming the first layer using a vapor deposition method with a first mask; and

[0083] The process of forming the second layer described above by using a vapor deposition method with a second mask.

[0084] In the 16th aspect of the present invention, in the method for manufacturing the organic device of the 15th aspect described above,

[0085] The second electrode mentioned above includes a third layer that partially overlaps with the first or second layer when viewed from above.

[0086] The second electrode forming process described above can include a process of forming the third layer by using a vapor deposition method with a third mask.

[0087] Referring to the accompanying drawings, one embodiment of the present invention will be described in detail. It should be noted that the embodiments shown below are examples of embodiments of the present invention, and the present invention is not limited to these embodiments.

[0088] The organic device 100 of this embodiment will now be described. Figure 1 This is a top view showing an example of the organic device 100 when viewed along the normal direction of the substrate of the organic device 100. In the following description, the view viewed along the normal direction of the surface of the substrate or other base material is also referred to as a top view.

[0089] like Figure 1 As shown, the organic device 100 has a generally rectangular planar shape. The organic device 100, when viewed from above, has an outer edge 100L, which is contained within a first direction D1 (…). Figure 1The first side 100La and the second side 100Lb extend along the left and right directions of the first direction D1, and the second side D2 extends along the left and right directions of the second direction D2 (orthogonal to the first direction D1). Figure 1 The third side 100Lc and the fourth side 100Ld extend along the vertical direction (D2). The first side 100La and the second side 100Lb face each other along the second direction D2. The first side 100La is located on one side of the second direction D2 (D2). Figure 1 The lower side of the middle), the second side 100Lb is located on the other side of the second direction D2 ( Figure 1 (The upper side of the middle). The third side 100Lc and the fourth side 100Ld extend in the direction from the first side 100La toward the second side 100Lb. The third side 100Lc and the fourth side 100Ld face each other in the first direction D1. The third side 100Lc is located on one side of the first direction D1 ( Figure 1 (left side), the 4th side 100Ld is located on the other side of the 1st direction D1 ( Figure 1 (The right side of the middle).

[0090] like Figure 1 As shown, the organic device 100, when viewed from above, has a wiring area 100W and a display area 100D. The wiring area 100W extends along a first side 100La. Figure 1 As shown, the wiring area 100W can be located on the side closer to the second direction D2 than the display area 100D. Figure 1 (Lower side of the display area 100D). The display area 100D is connected to the wiring area 100W. For example... Figure 1 As shown, the display area 100D can be connected to the wiring area 100W in the second direction D2. The display area 100D can be located on the opposite side of the wiring area 100W, closer to the second direction D2. Figure 1 (The upper side of the middle). The display area 100D can have an area larger than the wiring area 100W.

[0091] Display area 100D includes a plurality of elements 115 arranged along the in-plane direction of the substrate. Elements 115 are, for example, pixels. Display area 100D, when viewed from above, includes a first display area 101 and a second display area 102. The second display area 102 is adjacent to the first display area 101. The second display area 102 may have an area smaller than that of the first display area 101. Figure 1 As shown, the second display area 102 can be surrounded by the first display area 101. For example... Figure 1As shown, the second display area 102 can have a circular or elliptical outline. Although not shown, a portion of the outer edge of the second display area 102 can overlap with a portion of the outer edge of the first display area 101. Additionally, although not shown, the second display area 102 can have a rectangular outline. In this case, for example, the outer edge of the second side 100Lb of the second display area 102 can be on the same straight line as the outer edge of the second side 100Lb of the first display area 101.

[0092] Figure 2 It is Figure 1 An enlarged top view of the area enclosed by the double-dotted line labeled A1 in the organic device 100. In the first display area 101, the elements 115 can be arranged in two different directions. (As shown...) Figure 1 and Figure 2 As shown, two or more elements 115 in the first display area 101 can be arranged along the first direction D1. Alternatively, two or more elements 115 in the first display area 101 can also be arranged along the second direction D2.

[0093] like Figure 2 As shown, display area 100D includes a second electrode 140. The second electrode 140 is located on the organic layer 130, which will be described later. The second electrode 140 is electrically connected to the organic layer 130. The second electrode 140 located in the first display area 101 is also referred to as the second electrode 140X. The second electrode 140 located in the second display area 102 is also referred to as the second electrode 140Y.

[0094] The second electrode 140X has a first occupancy rate. The first occupancy rate is calculated by dividing the total area of ​​the second electrodes 140X located in the first display area 101 by the area of ​​the first display area 101. The second electrode 140Y has a second occupancy rate. The second occupancy rate is calculated by dividing the total area of ​​the second electrodes 140Y located in the second display area 102 by the area of ​​the second display area 102. The second occupancy rate can be less than the first occupancy rate. For example, as... Figure 2 As shown, the second display area 102 may include a standard area 103 and a transmissive area 104. The standard area 103 is the area that includes the second electrode 140Y. The transmissive area 104 is the area that does not include the second electrode 140Y.

[0095] The second market share can be, for example, 20% or more, 40% or more, or 50% or more. The second market share can be, for example, below 60%, below 80%, or below 95%. The range of the second market share can be defined by a first group consisting of 20%, 40%, and 50% and / or a second group consisting of 60%, 80%, and 95%. The range of the second market share can be defined by a combination of any one value from the first group and any one value from the second group. The range of the second market share can be defined by a combination of any two values ​​from the first group. The range of the second market share can be defined by a combination of any two values ​​from the second group. For example, it can be 20% or more but less than 95%, 20% or more but less than 80%, 20% or more but less than 60%, 20% or more but less than 50%, 20% or more but less than 40%, 40% or more but less than 95%, 40% or more but less than 80%, 40% or more but less than 60%, 40% or more but less than 50%, 50% or more but less than 95%, 50% or more but less than 80%, 50% or more but less than 60%, 60% or more but less than 95%, 60% or more but less than 80%, or 80% or more but less than 95%.

[0096] The ratio of the second market share to the first market share can be, for example, 0.2 or more, 0.4 or more, or 0.5 or more. The ratio of the second market share to the first market share can be, for example, 0.6 or less, 0.8 or less, or 0.95 or less. The range of the ratio of the second market share to the first market share can be defined by a first group consisting of 0.2, 0.4, and 0.5 and / or a second group consisting of 0.6, 0.8, and 0.95. The range of the ratio of the second market share to the first market share can be defined by a combination of any one value from the first group and any one value from the second group. The range of the ratio of the second market share to the first market share can be defined by a combination of any two values ​​from the first group. The range of the ratio of the second market share to the first market share can be defined by a combination of any two values ​​from the second group. For example, it can be 0.2 or higher than 0.95, 0.2 or higher than 0.8, 0.2 or higher than 0.6, 0.2 or higher than 0.5, 0.2 or higher than 0.4, 0.4 or higher than 0.95, 0.4 or higher than 0.8, 0.4 or higher than 0.6, 0.4 or higher than 0.5, 0.5 or higher than 0.95, 0.5 or higher than 0.8, 0.5 or higher than 0.6, 0.6 or higher than 0.95, 0.6 or higher than 0.8, or 0.8 or higher than 0.95.

[0097] The transmittance of the standard region 103 is also referred to as the first transmittance TR1. The transmittance of the transmission region 104 is also referred to as the second transmittance TR2. Since the transmission region 104 does not contain the second electrode 140Y, the second transmittance TR2 is higher than the first transmittance TR1. Therefore, in the second display region 102 including the transmission region 104, light reaching the organic device 100 can pass through the transmission region 104 and reach optical components, etc., on the back side of the substrate. Optical components are, for example, cameras, etc., which perform certain functions by detecting light. Since the second display region 102 includes the standard region 103, when the element 115 is a pixel, an image can be displayed in the second display region 102. In this way, the second display region 102 can detect light and display images. The function of the second display region 102, which is realized by detecting light, is, for example, a camera, a fingerprint sensor, a face recognition sensor, etc. The higher the second transmittance TR2 and the lower the second occupancy of the transmission region 104 of the second display region 102, the more light received by the sensor can be increased.

[0098] When either the dimensions of the standard region 103 in the first direction D1 and the second direction D2, or the dimensions of the transmission region 104 in the first direction D1 and the second direction D2, are less than 1 mm, the first transmittance TR1 and the second transmittance TR2 can be measured using a microspectrophotometer. As a microspectrophotometer, either the OSP-SP200 manufactured by Olympus Corporation or the LCF series manufactured by Otsuka Electronics Co., Ltd. can be used. Any microspectrophotometer can measure transmittance in the visible light region from 380 nm to 780 nm. Quartz, borosilicate glass for TFT liquid crystal displays, or alkali-free glass for TFT liquid crystal displays can be used as a reference. The measurement results at 550 nm can be used as the first transmittance TR1 and the second transmittance TR2.

[0099] When the dimensions of the standard region 103 in both the first direction D1 and the second direction D2, and the dimensions of the transmission region 104 in both the first direction D1 and the second direction D2, are both greater than 1 mm, the first transmittance TR1 and the second transmittance TR2 can be measured using a spectrophotometer. As the spectrophotometer, either the UV-2600i or UV-3600i Plus UV-Vis spectrophotometer manufactured by Shimadzu Corporation can be used. By installing a small beam aperture unit on the spectrophotometer, the transmittance of a region with a maximum size of 1 mm can be measured. Atmosphere can be used as a reference. The measurement results at 550 nm can be used as the first transmittance TR1 and the second transmittance TR2.

[0100] The ratio of the second transmittance TR2 to the first transmittance TR1, TR2 / TR1, can be, for example, 1.2 or more, 1.5 or more, or 1.8 or more. TR2 / TR1 can, for example, be 2 or less, 3 or less, or 4 or less. The range of TR2 / TR1 can be defined by a first group consisting of 1.2, 1.5, and 1.8 and / or a second group consisting of 2, 3, and 4. The range of TR2 / TR1 can be defined by a combination of any one value from the first group and any one value from the second group. The range of TR2 / TR1 can be defined by a combination of any two values ​​from the first group. The range of TR2 / TR1 can be defined by a combination of any two values ​​from the second group. For example, it can be 1.2 or higher than 4, 1.2 or higher than 3, 1.2 or higher than 2, 1.2 or higher than 1.8, 1.2 or higher than 1.5, 1.5 or higher than 4, 1.5 or higher than 3, 1.5 or higher than 2, 1.5 or higher than 1.8, 1.8 or higher than 4, 1.8 or higher than 3, 1.8 or higher than 2, 2 or higher than 4, 2 or higher than 3, or 3 or higher than 4.

[0101] like Figure 2 As shown, the transmission regions 104 are arranged in the first direction D1. The transmission regions 104 may be located between the standard regions 103 in the first direction D1. That is, the standard regions 103 and the transmission regions 104 may be arranged alternately in the first direction D1.

[0102] The two ends of the transmission region 104 in the second direction D2 can be connected to the first display region 101. The transmission region 104 can be connected from the second side 100Lb side in the second direction D2. Figure 2 The end of the first display area 101 that is connected to the upper side of the first display area 101 extends to the first side 100La side in the second direction D2. Figure 2 The end of the first display area 101 that is connected to the lower side of the middle section.

[0103] like Figure 2 As shown, the transmission region 104 has a first transmission dimension TD1 in the first direction D1 and a second transmission dimension TD2 in the second direction D2.

[0104] The second transmission dimension TD2 can be larger than the first transmission dimension TD1. The ratio TD2 / TD1 of the second transmission dimension TD2 to the first transmission dimension TD1 can, for example, be 2 or more, 5 or more, 10 or more, or 20 or more. TD2 / TD1 can, for example, be 50 or less, 100 or less, 200 or less, or 500 or less. The range of TD2 / TD1 can be defined by a first group consisting of 2, 5, 10, and 20 and / or a second group consisting of 50, 100, 200, and 500. The range of TD2 / TD1 can be defined by a combination of any one value from the first group and any one value from the second group. The range of TD2 / TD1 can be defined by a combination of any two values ​​from the first group. The range of TD2 / TD1 can be defined by a combination of any two values ​​from the second group. For example, it can be 2 or more but less than 500, 2 or more but less than 200, 2 or more but less than 100, 2 or more but less than 50, 2 or more but less than 20, 2 or more but less than 10, 2 or more but less than 5, 5 or more but less than 500, 5 or more but less than 200, 5 or more but less than 100, 5 or more but less than 50, 5 or more but less than 20, 5 or more but less than 10, 10 or more but less than 500, 10 or more but less than 100, 10 or more but less than 50, 10 or more but less than 20, 20 or more but less than 500, 20 or more but less than 200, 20 or more but less than 100, 20 or more but less than 50, 50 or more but less than 500, 50 or more but less than 200, 50 or more but less than 100, 100 or more but less than 500, 100 or more but less than 200, or 200 or more but less than 500.

[0105] The first transmission dimension TD1 of the transmission region 104 can be, for example, 5 μm or more, 20 μm or more, or 100 μm or more. The first transmission dimension TD1 can be, for example, 300 μm or less, 350 μm or less, or 550 μm or less. The range of the first transmission dimension TD1 of the transmission region 104 can be defined by a first group consisting of 5 μm, 20 μm, and 100 μm and / or a second group consisting of 300 μm, 350 μm, and 550 μm. The range of the first transmission dimension TD1 of the transmission region 104 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the first transmission dimension TD1 of the transmission region 104 can be defined by a combination of any two values ​​from the first group. The range of the first transmission dimension TD1 of the transmission region 104 can be defined by a combination of any two values ​​from the second group. For example, it can be 5μm or higher than 550μm, 5μm or higher than 350μm, 5μm or higher than 300μm, 5μm or higher than 100μm, 5μm or higher than 20μm, 20μm or higher than 550μm, 20μm or higher than 350μm, 20μm or higher than 300μm, 20μm or higher than 100μm, 100μm or higher than 550μm, 100μm or higher than 350μm, 100μm or higher than 300μm, 300μm or higher than 550μm, 300μm or higher than 350μm, or 350μm or higher than 550μm.

[0106] like Figure 2 As shown, the second electrode 140Y of the standard area 103 includes a plurality of connection portions 105 that are connected to the second electrode 140X of the first display area 101. Through these connection portions 105, the second electrode 140Y of the standard area 103 and the second electrode 140X of the first display area 101 are electrically connected. The connection portion 105 may be formed by the second electrode 140Y of the standard area 103 located at the boundary with the first display area 101.

[0107] Multiple connecting parts 105 are included on the first side 100La side in the second direction D2. Figure 2 The first connecting portion 105a on the lower side of the middle, and the second side 100Lb on the second direction D2 ( Figure 2 The second connecting portion 105b (on the upper side) is located on the side opposite to the first connecting portion 105a in the second direction D2. Figure 2As shown, among the plurality of connecting portions 105, the connecting portion located on the lower half of the second display area 102 can constitute the first connecting portion 105a, and the connecting portion located on the upper half of the second display area 102 can constitute the second connecting portion 105b. Although not shown, if the second display area 102 has a rectangular outline and the outer edge of the second side 100Lb of the second display area 102 is on the same straight line as the outer edge of the second side 100Lb of the first display area 101, the second electrode 140Y may not include the second connecting portion 105b.

[0108] The first connecting portion 105a includes opposing connecting portions 106. The opposing connecting portions 106 are located between the transmission regions 104 in the first direction D1. Therefore, the opposing connecting portions 106 face the reference electrode 150, which will be described later. That is, the connecting portions in the first connecting portion 105a that face the reference electrode 150 constitute the opposing connecting portions 106. Here, the term "facing" is not used in a strict sense, meaning that they face each other in a manner parallel to each other's horizontal planes relative to the object, but rather in the sense that they are generally facing towards the object. The opposing connecting portion 106 is defined as the connecting portion in the first connecting portion 105a located between the transmission regions 104 in the first direction D1. The first connecting portion 105a may include two or more opposing connecting portions 106. Figure 2 As shown, the first connecting portion 105a can constitute the opposing connecting portion 106, or a portion of the first connecting portion 105a can constitute the opposing connecting portion 106.

[0109] like Figure 2 As shown, the first connecting portion 105a has a connecting dimension CD1 in the first direction D1. The first connecting portions 105a can be arranged along the first direction D1 with a connecting period CC1.

[0110] The connection size CD1 of the first connection portion 105a can be, for example, 5 μm or more, 20 μm or more, or 100 μm or more. The connection size CD1 of the first connection portion 105a can be, for example, 250 μm or less, 300 μm or less, or 500 μm or less. The range of the connection size CD1 of the first connection portion 105a can be defined by a first group consisting of 5 μm, 20 μm, and 100 μm and / or a second group consisting of 250 μm, 300 μm, and 500 μm. The range of the connection size CD1 of the first connection portion 105a can be defined by a combination of any one value from the first group and any one value from the second group. The range of the connection size CD1 of the first connection portion 105a can be defined by a combination of any two values ​​from the first group. The range of the connection size CD1 of the first connection portion 105a can be defined by a combination of any two values ​​from the second group. For example, it can be 5μm or higher than 500μm, 5μm or higher than 300μm, 5μm or higher than 250μm, 5μm or higher than 100μm, 5μm or higher than 20μm, 20μm or higher than 500μm, 20μm or higher than 300μm, 20μm or higher than 250μm, 20μm or higher than 100μm, 100μm or higher than 500μm, 100μm or higher than 300μm, 100μm or higher than 250μm, 250μm or higher than 500μm, 250μm or higher than 300μm, or 300μm or higher than 500μm.

[0111] The connection period CC1 of the first connector 105a can be, for example, 10 μm or more, 30 μm or more, or 150 μm or more. The connection period CC1 of the first connector 105a can be, for example, 300 μm or less, 350 μm or less, or 550 μm or less. The range of the connection period CC1 of the first connector 105a can be defined by a first group consisting of 10 μm, 30 μm, and 150 μm and / or a second group consisting of 300 μm, 350 μm, and 550 μm. The range of the connection period CC1 of the first connector 105a can be defined by a combination of any one value from the first group and any one value from the second group. The range of the connection period CC1 of the first connector 105a can be defined by a combination of any two values ​​from the first group. The range of the connection period CC1 of the first connector 105a can be defined by a combination of any two values ​​from the second group. For example, it can be 10μm or higher than 550μm, 10μm or higher than 350μm, 10μm or higher than 300μm, 10μm or higher than 150μm, 10μm or higher than 30μm, 30μm or higher than 550μm, 30μm or higher than 350μm, 30μm or higher than 300μm, 30μm or higher than 150μm, 150μm or higher than 550μm, 150μm or higher than 350μm, 150μm or higher than 300μm, 300μm or higher than 550μm, 300μm or higher than 350μm, or 350μm or higher than 550μm.

[0112] The connection dimension of the second connecting portion 105b in the first direction D1 can be the same as the connection dimension CD1 of the first connecting portion 105a in the first direction D1. Alternatively, the connection dimension of the second connecting portion 105b in the first direction D1 can be larger or smaller than the connection dimension CD1 of the first connecting portion 105a in the first direction D1. For example, the connection dimension of the second connecting portion 105b in the first direction D1 can be 5 μm or more, 20 μm or more, or 100 μm or more. Furthermore, the connection dimension of the second connecting portion 105b in the first direction D1 can be, for example, 250 μm or less, 300 μm or less, or 500 μm or less.

[0113] The connection period of the second connector 105b in the first direction D1 can be the same as the connection period CC1 of the first connector 105a in the first direction D1. Alternatively, the connection period of the second connector 105b in the first direction D1 can be greater than or less than the connection period CC1 of the first connector 105a in the first direction D1. For example, the connection period of the second connector 105b in the first direction D1 can be 10 μm or more, 30 μm or more, or 150 μm or more. Furthermore, the connection period of the second connector 105b in the first direction D1 can be, for example, 300 μm or less, 350 μm or less, or 550 μm or less.

[0114] like Figure 2 As shown, the standard region 103 may include a second-direction portion 103L in which the second electrode 140Y extends from the second connection portion 105b to the first connection portion 105a in the second direction D2. That is, the second electrode 140Y included in the second-direction portion 103L extends from the second connection portion 105b to the first connection portion 105a in the second direction D2. In this case, the opposing connection portion 106 is located on the first side 100La side of the second-direction portion 103L in the second direction D2. Figure 2 The end of the lower side of the middle part. That is, the end of the first side 100La on the second direction D2 of the second direction portion 103L constitutes the aforementioned opposing connection portion 106.

[0115] The size DD1 of the second display area 102 on the first direction D1 can be, for example, 0.5 mm or more, 3 mm or more, or 5 mm or more. The size DD1 of the second display area 102 on the first direction D1 can be, for example, less than 10 mm, less than 20 mm, or less than 30 mm. The range of the size DD1 of the second display area 102 on the first direction D1 can be defined by a first group consisting of 0.5 mm, 3 mm, and 5 mm and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of the size DD1 of the second display area 102 on the first direction D1 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the size DD1 of the second display area 102 on the first direction D1 can be defined by a combination of any two values ​​from the first group. The range of the size DD1 of the second display area 102 on the first direction D1 can be defined by a combination of any two values ​​from the second group. For example, it can be 0.5mm to 30mm, 0.5mm to 20mm, 0.5mm to 10mm, 0.5mm to 5mm, 0.5mm to 3mm, 3mm to 30mm, 3mm to 20mm, 3mm to 10mm, 3mm to 5mm, 5mm to 30mm, 5mm to 20mm, 5mm to 10mm, 10mm to 30mm, 10mm to 20mm, or 20mm to 30mm.

[0116] The size DD2 of the second display area 102 in the second direction D2 can be, for example, 0.5 mm or more, 3 mm or more, or 5 mm or more. The size DD2 of the second display area 102 in the second direction D2 can be, for example, less than 10 mm, less than 20 mm, or less than 30 mm. The range of the size DD2 of the second display area 102 in the second direction D2 can be defined by a first group consisting of 0.5 mm, 3 mm, and 5 mm and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of the size DD2 of the second display area 102 in the second direction D2 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the size DD2 of the second display area 102 in the second direction D2 can be defined by a combination of any two values ​​from the first group. The range of the size DD2 of the second display area 102 in the second direction D2 can be defined by a combination of any two values ​​from the second group. For example, it can be 0.5mm to 30mm, 0.5mm to 20mm, 0.5mm to 10mm, 0.5mm to 5mm, 0.5mm to 3mm, 3mm to 30mm, 3mm to 20mm, 3mm to 10mm, 3mm to 5mm, 5mm to 30mm, 5mm to 20mm, 5mm to 10mm, 10mm to 30mm, 10mm to 20mm, or 20mm to 30mm.

[0117] Figure 3 It is Figure 2 An enlarged top view of the area enclosed by the double-dotted line labeled B1 in the organic device 100. Figure 4 It shows from Figure 3 A top view of the organic device 100 after the second electrode 140 has been removed. Figure 5 It is along Figure 3 A cross-sectional view of the CC line of the first display area 101 of the organic device 100.

[0118] like Figure 5 As shown, the organic device 100 includes a substrate 110 and an element 115 located on the substrate 110. More specifically, the display area 100D of the organic device 100 includes the substrate 110 and the element 115 located on the substrate 110. The element 115 has a first electrode 120, an organic layer 130 located on the first electrode 120, and a second electrode 140 located on the organic layer 130.

[0119] The organic device 100 may include an insulating layer 160 located between two adjacent first electrodes 120 when viewed from above. The insulating layer 160 may, for example, comprise polyimide. The insulating layer 160 may overlap with the ends of the first electrodes 120.

[0120] Organic device 100 can be an active matrix type. For example, although not shown, organic device 100 can include switches electrically connected to a plurality of elements 115 respectively. The switches are, for example, transistors. The switches are capable of controlling the on / off switching of voltage or current to the corresponding elements 115.

[0121] The substrate 110 may be a plate-shaped component with insulating properties. The substrate 110 preferably has transparency that allows light to pass through.

[0122] When the substrate 110 has a specified transparency, the transparency of the substrate 110 can be such that light emitted from the organic layer 130 can pass through for display. For example, the transmittance of the substrate 110 in the visible light region can be 80% or more, or it can be 90% or more. The transmittance of the substrate 110 can be determined by the test method for the total transmittance of plastic-transparent materials according to JIS K7361-1.

[0123] The substrate 110 may or may not be flexible. The substrate 110 may be selected appropriately according to the application of the organic device 100.

[0124] The substrate 110 can be made of rigid materials that are not flexible, such as quartz glass, Pyrex glass, or synthetic quartz sheets, or flexible materials that are flexible, such as resin films, optical resin sheets, or thin glass. Alternatively, the substrate can be a laminate with barrier layers on one or both sides of the resin film.

[0125] The thickness of the substrate 110 can be appropriately selected based on the material used in the substrate 110 and the application of the organic device 100. For example, the thickness of the substrate 110 can be 0.005 mm or more. Alternatively, the thickness of the substrate 110 can be 5 mm or less.

[0126] Element 115 is configured to perform certain functions by applying a voltage between the first electrode 120 and the second electrode 140 and allowing current to flow between them. For example, if element 115 is a pixel of an organic EL display device, element 115 can emit light that constitutes an image.

[0127] The first electrode 120 comprises a conductive material. For example, the first electrode 120 comprises a metal, a conductive metal oxide, or other conductive inorganic materials. The first electrode 120 may comprise a permeable and conductive metal oxide such as indium tin oxide.

[0128] Materials constituting the first electrode 120 can include: metals such as Au, Cr, Mo, Ag, and Mg; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. These conductive materials can be used individually or in combination. When using two or more materials, layers composed of each material can be laminated. Alternatively, alloys containing two or more materials can be used. For example, magnesium alloys such as MgAg can be used.

[0129] Organic layer 130 contains organic materials. When an electric current is applied to organic layer 130, organic layer 130 can perform certain functions. Applying an electric current means applying a voltage to organic layer 130 or allowing current to flow through organic layer 130. As organic layer 130, a light-emitting layer that emits light when an electric current is applied, or a layer that changes the transmittance or refractive index of light when an electric current is applied, etc., can be used. Organic layer 130 may contain organic semiconductor materials.

[0130] like Figure 4 and Figure 5 As shown, organic layer 130 may include a first organic layer 130A and a second organic layer 130B. Additionally, as... Figure 4 As shown, organic layer 130 may further include a third organic layer 130C. The first organic layer 130A, the second organic layer 130B, and the third organic layer 130C may, for example, be a red emitting layer, a blue emitting layer, and a green emitting layer. In the following description, the term "organic layer 130" will be used when describing the common structure of the first organic layer 130A, the second organic layer 130B, and the third organic layer 130C.

[0131] The laminated structure comprising the first electrode 120, the first organic layer 130A, and the second electrode 140 is also referred to as the first element 115A. The laminated structure comprising the first electrode 120, the second organic layer 130B, and the second electrode 140 is also referred to as the second element 115B. The laminated structure comprising the first electrode 120, the third organic layer 130C, and the second electrode 140 is also referred to as the third element 115C. In the case where the organic device 100 is an organic EL display device, the first element 115A, the second element 115B, and the third element 115C are each a sub-pixel.

[0132] In the following description, when describing the configuration shared by the first element 115A, the second element 115B, and the third element 115C, the term "element 115" will be used. Figure 4 In the top view, the outline of element 115 can be the outline of organic layer 130 that overlaps with the first electrode 120 and the second electrode 140 when viewed from above. When the organic device 100 has an insulating layer 160, the outline of element 115 can be the outline of organic layer 130 that overlaps with the first electrode 120 and the second electrode 140 but does not overlap with insulating layer 160 when viewed from above.

[0133] The configurations of the first element 115A, the second element 115B, and the third element 115C are described. For example... Figure 4 As shown, in the display area 100D, the first element 115A, the second element 115B, and the third element 115C can be arranged along the first direction D1. In addition, the first element 115A, the second element 115B, and the third element 115C can be arranged along the second direction D2.

[0134] like Figure 4 As shown, the display area 100D may contain multiple element columns 115L arranged in the first direction D1. The multiple element columns 115L may include a first element column 115La and a second element column 115Lb that are adjacent to each other in the first direction D1. The first element column 115La and the second element column 115Lb may be arranged alternately in the first direction D1. The first element column 115La may be arranged with a period EC1 along the first direction. The second element column 115Lb may also be arranged with a period EC1 along the first direction.

[0135] In the first display area 101, the first element column 115La and the second element column 115Lb may include a first element 115A, a second element 115B, and a third element 115C arranged along the second direction D2 with a period of EC2. That is, in the first element column 115La and the second element column 115Lb, the first element 115A may be arranged along the second direction D2 with a period of EC2, the second element 115B may be arranged along the second direction D2 with a period of EC2, and the third element 115C may be arranged along the second direction D2 with a period of EC2.

[0136] The first element column 115La and the second element column 115Lb can be staggered by period ED2 in the second direction D2. That is, the first element 115A of the first element column 115La can exist in the second direction D2, staggered by period ED2 from the first element 115A of the second element column 115Lb. The second element 115B of the first element column 115La can exist in the second direction D2, staggered by period ED2 from the second element 115B of the second element column 115Lb. The third element 115C of the first element column 115La can exist in the second direction D2, staggered by period ED2 from the third element 115C of the second element column 115Lb. Period ED2 can be half the period EC2. Thus, as Figure 4 As shown, in the second direction D2, the second element 115B of the second element column 115Lb can be located between the first element 115A and the third element 115C of the first element column 115La. A single element 115 can be formed by these first elements 115A, second elements 115B, and third elements 115C. Additionally, in the second direction D2, the second element 115B of the first element column 115La can be located between the first element 115A and the third element 115C of the second element column 115Lb. A single element 115 can be formed by these first elements 115A, second elements 115B, and third elements 115C.

[0137] When a voltage is applied between the first electrode 120 and the second electrode 140, current flows to the organic layer 130 located between them. If the organic layer 130 is a light-emitting layer, light is emitted from the organic layer 130 and emitted to the outside from either the side of the second electrode 140 or the side of the first electrode 120.

[0138] If the organic layer 130 includes a light-emitting layer that emits light when an electric current is applied, the organic layer 130 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc.

[0139] For example, when the first electrode 120 is the anode, the organic layer 130 may have a hole injection and transport layer between the light-emitting layer and the first electrode 120. The hole injection and transport layer may be a hole injection layer with hole injection function, a hole transport layer with hole transport function, or a layer with both hole injection and hole transport functions. Alternatively, the hole injection and transport layer may be a laminate containing both a hole injection layer and a hole transport layer.

[0140] When the second electrode 140 is a cathode, the organic layer 130 may have an electron injection transport layer between the light-emitting layer and the second electrode 140. The electron injection transport layer may be an electron injection layer with electron injection function, an electron transport layer with electron transport function, or a layer with both electron injection and electron transport functions. Alternatively, the electron injection transport layer may be a laminate containing both an electron injection layer and an electron transport layer.

[0141] The luminescent layer contains luminescent materials. The luminescent layer may contain additives to improve leveling properties.

[0142] As luminescent materials, known materials can be used, such as pigment-based materials, metal complex-based materials, and polymer-based materials. Pigment-based materials can include, for example, cyclopentadiene derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, stilbeneylbenzene derivatives, stilbeneylarylene derivatives, thiophene derivatives, thiophene ring compounds, pyridine ring compounds, violet ring ketone derivatives, perylene derivatives, oligothiophene derivatives, oxadiazole dimers, and pyrazoline dimers. As metal complex materials, metal complexes with a central metal such as Al, Zn, Be, or rare earth metals such as Tb, Eu, Dy, and oxadiazole, thiazolium, azomethyl zinc, porphyrin zinc, europium, etc., and ligands with structures such as oxadiazole, thiazolium, phenylpyridine, phenylbenzimidazole, quinoline, etc., can be used. As polymeric materials, poly(p-phenylenevinylene) derivatives, polythiophene derivatives, poly(p-phenylene) derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole derivatives, polyfluorene derivatives, polyquinoxaline derivatives, and copolymers thereof can be used.

[0143] To improve luminescence efficiency or alter the wavelength of emitted light, the luminescent layer may contain dopants. Examples of dopants include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squaric acid lacton salt derivatives, porphyrin derivatives, styrene-based pigments, tetraphenylbenzene derivatives, pyrazoline derivatives, decacycloene, phenoxazinone, quinoxaline derivatives, carbazole derivatives, and fluorene derivatives. Additionally, organometallic complexes exhibiting phosphorescence and containing heavy metal ions such as platinum or iridium at their center can be used as dopants. One or more dopants can be used alone.

[0144] In addition, as luminescent materials and dopants, for example, the materials described in Japanese Patent Application Publication No. 2010-272891

[0094] to

[0099] or International Publication No. 2012 / 132126

[0053] to

[0057] can be used.

[0145] Regarding the thickness of the light-emitting layer, there is no particular limitation as long as the thickness can provide a site for the recombination of electrons and holes to exhibit the function of light emission. For example, it can be set to 1 nm or more, or it can be set to 500 nm or less.

[0146] Known materials can be used as hole injection transport materials for the hole injection transport layer. Examples of hole injection transport materials include triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolineone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, mesitylene derivatives, silazane derivatives, polythiophene derivatives, polyaniline derivatives, polypyrrole derivatives, phenylamine derivatives, anthracene derivatives, carbazole derivatives, fluorene derivatives, stilbene benzene derivatives, polyphenylacetylene derivatives, porphyrin derivatives, and styrylamine derivatives. Spirocyclic compounds, phthalocyanine compounds, and metal oxides are also examples. Alternatively, compounds described in, for example, Japanese Patent Application Publication No. 2011-119681, International Publication No. 2012 / 018082, Japanese Patent Application Publication No. 2012-069963, and International Publication No. 2012 / 132126

[0106] may be appropriately selected.

[0147] It should be noted that when the hole injection and transport layer is a laminate formed by stacking a hole injection layer and a hole transport layer, the hole injection layer can contain additive A, the hole transport layer can contain additive A, or both the hole injection layer and the hole transport layer can contain additive A. Additive A can be a low-molecular-weight compound or a high-molecular-weight compound. Specifically, it can be a fluorine-based compound, an ester-based compound, a hydrocarbon-based compound, etc.

[0148] As electron injection transport materials for the electron injection transport layer, known materials can be used. Examples include alkali metals, alkali metal alloys, alkali metal halides, alkaline earth metals, alkaline earth metal halides, alkaline earth metal oxides, organic complexes of alkali metals, magnesium halides or oxides, and alumina. Additionally, as electron injection transport materials, examples include copper hydroxide, phenanthroline, phenanthroline derivatives, triazole derivatives, oxadiazole derivatives, pyridine derivatives, nitro-substituted fluorene derivatives, anthraquinone dimethane derivatives, diphenylquinone derivatives, thiamethane dioxide derivatives, aromatic ring tetracarboxylic anhydrides such as naphthalene or perylene, carbodiimide, fluorenemethane derivatives, anthraquinone dimethane derivatives, anthrone derivatives, quinoxaline derivatives, hydroxyquinoline complexes, phthalocyanine compounds, and stilbene pyrazine derivatives.

[0149] Alternatively, an alkali metal or alkaline earth metal doped layer can be formed in an electron-transporting organic material to serve as an electron injection transport layer. As an electron-transporting organic material, metal complexes such as copper hydroxide, phenanthrene-3-hydroxychlorophyll, phenanthrene-3-hydroxychlorophyll derivatives, triazole derivatives, oxadiazole derivatives, pyridine derivatives, tris(8-hydroxyquinoline)aluminum (Alq3), and their polymeric derivatives can be used. Furthermore, Li, Cs, Ba, and Sr can be used as the doping metal.

[0150] The second electrode 140 comprises a conductive material such as a metal. The second electrode 140 is formed on the organic layer 130 by a mask vapor deposition method described later. Materials constituting the second electrode 140 may include platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, chromium, carbon, etc. These materials may be used individually or in combination. When using two or more materials, layers composed of each material can be laminated. Alternatively, alloys containing two or more materials may be used. For example, magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, alkali metal alloys, and alkaline earth metal alloys may be used.

[0151] like Figure 3 and Figure 5 As shown, the second electrode 140 may include a first layer 140A on the first organic layer 130A, a second layer 140B on the second organic layer 130B, and a third layer 140C on the third organic layer 130C. The first layer 140A is formed by vapor deposition using the first mask 50A described later. The second layer 140B is formed by vapor deposition using the second mask 50B described later. The third layer 140C is formed by vapor deposition using the third mask 50C described later.

[0152] Layer 140A can cover layer 130A. That is, the size of layer 140A in direction D1 can be larger than the size of layer 130A in direction D1, and the size of layer 140A in direction D2 can be larger than the size of layer 130A in direction D2. Layer 140B can cover layer 130B. That is, the size of layer 140B in direction D1 can be larger than the size of layer 130B in direction D1, and the size of layer 140B in direction D2 can be larger than the size of layer 130B in direction D2. Layer 140C can cover layer 130C. That is, the size of the third layer 140C on the first direction D1 is greater than the size of the third organic layer 130C on the first direction D1, and the size of the third layer 140C on the second direction D2 is greater than the size of the third organic layer 130C on the second direction D2.

[0153] The thickness of the first 140A layer can be, for example, 10 nm or more, 20 nm or more, 50 nm or more, or 100 nm or more. The thickness of the first 140A layer can be, for example, less than 200 nm, less than 500 nm, less than 1 μm, or less than 100 μm. The range of the thickness of the first 140A layer can be defined by a first group consisting of 10 nm, 20 nm, 50 nm, and 100 nm and / or a second group consisting of 200 nm, 500 nm, 1 μm, and 100 μm. The range of the thickness of the first 140A layer can be defined by a combination of any one value from the first group and any one value from the second group. The range of the thickness of the first 140A layer can be defined by a combination of any two values ​​from the first group. The range of the thickness of the first 140A layer can be defined by a combination of any two values ​​from the second group. For example, it can be 10nm to 100μm, 10nm to 1μm, 10nm to 500nm, 10nm to 200nm, 10nm to 100nm, 10nm to 50nm, 10nm to 20nm, 20nm to 100μm, 20nm to 1μm, 20nm to 500nm, 20nm to 200nm, 20nm to 100nm, 20nm to 50nm, 50nm to 100μm, etc. It can be 50nm or higher and less than 1μm, or 50nm or higher and less than 500nm, or 50nm or higher and less than 200nm, or 50nm or higher and less than 100nm, or 100nm or higher and less than 100μm, or 100nm or higher and less than 1μm, or 100nm or higher and less than 500nm, or 100nm or higher and less than 200nm, or 200nm or higher and less than 100μm, or 200nm or higher and less than 1μm, or 1μm or higher and less than 100μm.

[0154] The thickness of the second layer 140B can be the same as the thickness of the first layer 140A. Alternatively, the thickness of the second layer 140B can be greater or less than the thickness of the first layer 140A. The thickness of the second layer 140B can be defined, similarly to the thickness of the first layer 140A, by a first group consisting of 10nm, 20nm, 50nm, and 100nm, and / or a second group consisting of 200nm, 500nm, 1μm, and 100μm.

[0155] The thickness of the third layer 140C can be the same as the thickness of the first layer 140A and the second layer 140B. Alternatively, the thickness of the third layer 140C can be greater or less than the thickness of the first layer 140A and the second layer 140B. The thickness of the third layer 140C can be defined similarly to the thickness of the first layer 140A and the second layer 140B by a first group consisting of 10nm, 20nm, 50nm, and 100nm, and / or a second group consisting of 200nm, 500nm, 1μm, and 100μm.

[0156] like Figure 3 and Figure 5 As shown, the two layers of the second electrode 140 can partially overlap. The region where multiple layers of the second electrode 140 overlap when viewed from above is also referred to as the electrode overlap region 145. The electrode overlap region 145 includes the region where the first layer 140A overlaps with the second layer 140B, the region where the first layer 140A overlaps with the third layer 140C, or the region where the second layer 140B overlaps with the third layer 140C. Through the overlap of the layers of the second electrode 140, the layers can be electrically connected.

[0157] When viewed from above, the area of ​​the electrode overlap region 145 may be smaller than the area of ​​the first layer 140A. The ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A may, for example, be 0.02 or more, 0.05 or more, or 0.10 or more. The ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A may, for example, be 0.20 or less, 0.30 or less, or 0.40 or less. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A can be defined by a first group consisting of 0.02, 0.05, and 0.10 and / or a second group consisting of 0.20, 0.30, and 0.40. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A can be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A can be defined by a combination of any two values ​​included in the first group described above. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A can be defined by a combination of any two values ​​included in the second group described above. For example, it can be 0.02 or higher than 0.40, 0.02 or higher than 0.30, 0.02 or higher than 0.20, 0.02 or higher than 0.10, 0.02 or higher than 0.05, 0.05 or higher than 0.40, 0.05 or higher than 0.30, 0.05 or higher than 0.20, 0.05 or higher than 0.10, 0.10 or higher than 0.40, 0.10 or higher than 0.30, 0.10 or higher than 0.20, 0.20 or higher than 0.40, 0.20 or higher than 0.30, or 0.30 or higher than 0.40.

[0158] When viewed from above, the area of ​​the electrode overlap region 145 can be smaller than the area of ​​the second layer 140B. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the second layer 140B can be the range of the "ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A" mentioned above.

[0159] When viewed from above, the area of ​​the electrode overlap region 145 can be smaller than the area of ​​the third layer 140C. The range of the ratio of the area of ​​the electrode overlap region 145 to the area of ​​the third layer 140C can be the range of the "ratio of the area of ​​the electrode overlap region 145 to the area of ​​the first layer 140A" mentioned above.

[0160] Figure 6 It is along Figure 3A cross-sectional view of the DD line of the second display area 102 of the organic device 100.

[0161] like Figure 3 and Figure 6 As shown, the second display area 102 includes a region containing the second electrode 140Y and a region not containing the second electrode 140Y. The standard area 103 described above is defined as the region containing the second electrode 140Y. The transmission area 104 described above is defined as the region not containing the second electrode 140Y.

[0162] like Figure 3 and Figure 4 As shown, the standard region 103, when viewed from above, may have a region 103a containing the element 115 and a region 103b not containing the element 115. That is, the standard region 103, when viewed from above, may include a region 103a where the second electrode 140Y overlaps with the organic layer 130, and a region 103b where the second electrode 140Y does not overlap with the organic layer 130. Region 103a includes the second electrode 140Y, which overlaps with the substrate 110, the first electrode 120, and the organic layer 130 when viewed from above. Region 103b includes the second electrode 140Y, which overlaps with the substrate 110 when viewed from above. Such regions 103a and 103b can be continuously connected from the second connection portion 105b to the first connection portion 105a in the second direction D2, forming the aforementioned second direction portion 103L. In addition, the aforementioned connection portion 105 can be formed by the second electrode 140Y of region 103b. It should be noted that standard region 103 may exclude region 103b. That is, all the second electrodes 140Y in standard region 103 may overlap with organic layer 130 when viewed from above.

[0163] like Figure 3 and Figure 6 As shown, the transmission region 104 may include areas where the substrate 110 and the organic layer 130 do not overlap. Figure 6 As shown, the transmission region 104 may not include the first electrode 120, the organic layer 130, and the second electrode 140. Additionally, as... Figure 6 As shown, the transmission region 104 may include a portion of the insulating layer 160.

[0164] like Figure 4As shown, in standard region 103, the first element column 115La may not include the second element 115B. That is, the first element column 115La may be composed of the first element 115A and the third element 115C arranged along the second direction D2 with a period EC2. Similarly, in standard region 103, the second element column 115Lb may not include the first element 115A and the third element 115C. That is, the second element column 115Lb may be composed of the second element 115B arranged along the second direction D2 with a period EC2. In standard region 103, a single element 115 may be formed by the first element 115A and the third element 115C of the first element column 115La, and the second element 115B of the second element column 115Lb.

[0165] like Figure 4 As shown, in the transmission region 104, the first element column 115La may not include the first element 115A, the second element 115B, and the third element 115C. Similarly, in the transmission region 104, the second element column 115Lb may not include the first element 115A, the second element 115B, and the third element 115C.

[0166] Figure 7 It is Figure 1 An enlarged top view of the area enclosed by the double-dotted line labeled A2 in the organic device 100.

[0167] like Figure 7 As shown, the wiring area 100W includes a reference electrode 150 and a terminal 152. The reference electrode 150 can be located on the substrate 110. The reference electrode 150 can be located in the second direction D2 between the second electrode 140 and the terminal 152. Figure 7 As shown, the reference electrode 150 can be a solid pattern. The reference electrode 150 is electrically connected to the second electrode 140 of each element 115 via a connection wiring 154. The connection wiring 154 can be formed from a portion of the second electrode 140 or a portion of the reference electrode 150. Terminal 152 includes a reference terminal 156 connected to earth or ground. The reference electrode 150 is electrically connected to this reference terminal 156, defining a reference potential. Therefore, when a voltage is applied between the first electrode 120 and the second electrode 140, the current flowing from the first electrode 120 through the organic layer 130 to the second electrode 140 can flow to the reference electrode 150. The reference potential can be, for example, 0V, a positive value, or a negative value.

[0168] The reference electrode 150 comprises a conductive material. For example, the reference electrode 150 may comprise a metal, a conductive metal oxide, or other conductive inorganic materials. Materials constituting the reference electrode 150 may include metals such as Al, Mo, and Ta; and inorganic oxides such as indium tin oxide (ITO). These conductive materials may be used individually or in combination. When using two or more materials, a layer composed of each material can be laminated. Alternatively, an alloy containing two or more materials may be used.

[0169] The dimensions and spacing of each component of the organic device 100, such as DD1, DD2, EC1, EC2, ED2, TD1, and TD2, can be determined by observing cross-sectional images of the organic device 100 using a scanning electron microscope.

[0170] The thickness of each component of the organic device 100, such as the thickness of the substrate 110 and the thickness of the second electrode 140, can be determined by observing a cross-sectional image of the organic device 100 using a scanning electron microscope.

[0171] Next, the method for forming the second electrode 140 of the organic device 100 described above by vapor deposition will be explained. Figure 8 This is a diagram showing a vapor deposition apparatus 10 for performing a vapor deposition process that deposits vapor deposition material onto an object.

[0172] like Figure 8 As shown, the vapor deposition apparatus 10 may internally include a vapor deposition source 6, a heater 8, and a mask assembly 40. Furthermore, the vapor deposition apparatus 10 may further include an exhaust unit for creating a vacuum atmosphere inside the apparatus. The vapor deposition source 6 is, for example, a crucible containing a vapor deposition material 7, such as an organic light-emitting material. The heater 8 heats the vapor deposition source 6, causing the vapor deposition material 7 to evaporate under a vacuum atmosphere. The mask assembly 40 is arranged facing the crucible 6.

[0173] like Figure 8 As shown, the mask assembly 40 may include: at least one mask 50; and a frame 41 supporting the mask 50. The frame 41 may include a first frame surface 41a on which the mask 50 is fixed; and a second frame surface 41b located on the opposite side of the first frame surface 41a. Additionally, the frame 41 may include an opening 42 extending from the first frame surface 41a to the second frame surface 41b. The mask 50 may be fixed to the frame 41 in a manner that, when viewed from above, traverses the opening 42. Furthermore, the frame 41 may support the mask 50 in a stretched state along its surface to suppress deflection of the mask 50.

[0174] The mask 50, which is the mask device 40, may be the first mask 50A, the second mask 50B, and the third mask 50C, which will be described later. In the following description, the term "mask 50" will be used when describing the configuration shared by the first mask 50A, the second mask 50B, and the third mask 50C.

[0175] like Figure 8 As shown, the mask assembly 40 is arranged within the vapor deposition apparatus 10 such that the mask 50 faces the substrate 110 to which the vapor deposition material 7 is attached. The mask 50 includes a plurality of through holes 53 through which the vapor deposition material 7, which flies from the vapor deposition source 6, passes. In the following description, the surface of the mask 50 located on the substrate 110 side is referred to as the first surface 51a, and the surface located on the opposite side of the first surface 51a is referred to as the second surface 51b.

[0176] like Figure 8 As shown, the vapor deposition apparatus 10 may include a substrate holder 2 for holding the substrate 110. The substrate holder 2 may be movable in the thickness direction of the substrate 110. Additionally, the substrate holder 2 may be movable in the surface direction of the substrate 110. Furthermore, the substrate holder 2 may be configured to control the tilting of the substrate 110. For example, the substrate holder 2 may include a plurality of chucks mounted on the outer edge of the substrate 110, each chuck being movable independently in both the thickness direction and the surface direction of the substrate 110.

[0177] like Figure 8 As shown, the vapor deposition apparatus 10 may include a mask holder 3 for holding the mask assembly 40. The mask holder 3 may be movable in the thickness direction of the mask 50. In addition, the mask holder 3 may be movable in the surface direction of the mask 50. For example, the mask holder 3 may include a plurality of chucks mounted on the outer edge of the frame 41, each chuck being movable independently in the thickness direction and the surface direction of the mask 50.

[0178] By moving at least one of the substrate holder 2 or the mask holder 3, the position of the mask 50 of the mask device 40 relative to the substrate 110 can be adjusted.

[0179] like Figure 8 As shown, the vapor deposition apparatus 10 may include a cooling plate 4 located on the side opposite to the mask assembly 40 side, i.e., the first surface 111, i.e., the second surface 112, of the surface of the substrate 110. The cooling plate 4 may have a flow path for circulating refrigerant within the cooling plate 4. The cooling plate 4 is capable of suppressing the temperature rise of the substrate 110 during the vapor deposition process.

[0180] like Figure 8As shown, the vapor deposition apparatus 10 may include a magnet 5 located on the surface of the substrate 110 opposite to the mask apparatus 40, i.e., the second surface 112 side. Figure 8 As shown, the magnet 5 can be disposed on the side of the cooling plate 4 opposite to the mask assembly 40. The magnet 5 can attract the mask 50 of the mask assembly 40 towards the substrate 110 by magnetic force. This reduces or eliminates the gap between the mask 50 and the substrate 110. Consequently, shading during the vapor deposition process can be suppressed, and the dimensional and positional accuracy of the organic layer 130 can be improved. Here, shading refers to the phenomenon where the vapor deposition material 7 enters the gap between the mask 50 and the substrate 110, causing uneven thickness of the organic layer 130. Alternatively, an electrostatic chuck utilizing electrostatic force can be used to attract the mask 50 towards the substrate 110.

[0181] When forming the second electrode 140 using the vapor deposition apparatus 10 described above, firstly, in the vapor deposition apparatus 10, a first layer 140A of the second electrode 140 is formed on the substrate 110 using a first mask apparatus 40A including a first mask 50A. Next, in the vapor deposition apparatus 10, a second layer 140B of the second electrode 140 is formed on the substrate 110 using a second mask apparatus 40B including a second mask 50B. Next, in the vapor deposition apparatus 10, a third layer 140C of the second electrode 140 is formed on the substrate 110 using a third mask apparatus 40C including a third mask 50C. Thus, multiple masks 50, such as the first mask 50A, the second mask 50B, and the third mask 50C, are used sequentially. The group of multiple masks 50 used to form the second electrode 140 of the organic device 100 is also referred to as a "mask group".

[0182] In the vapor deposition method using mask 50, vapor deposition material 7, passing through through hole 53 from the second surface 51b side to the first surface 51a side, is attached to substrate 110, thereby forming the aforementioned first layer 140A, second layer 140B, third layer 140C, etc., on substrate 110. The outline of the layers formed on substrate 110 in the in-plane direction of substrate 110 is defined by the outline of through hole 53 of mask 50 when viewed from above.

[0183] Figure 9 Is Figure 8 The first mask 50A used in the mask assembly will be with Figure 3 The corresponding portion is shown in an enlarged top view. Mask 50 has a first mask direction E1 and a second mask direction E2 orthogonal to the first mask direction E1. The first mask direction E1 may correspond to the first direction D1, and the second mask direction E2 may correspond to the second direction D2.

[0184] like Figure 9As shown, the through-hole 53 of the first mask 50A is located at a position corresponding to the first layer 140A of the second electrode 140. Although not shown, the same applies to the second mask 50B, where the through-hole 53 is located at a position corresponding to the second layer 140B of the second electrode 140. Similarly, the through-hole 53 of the third mask 50C is located at a position corresponding to the third layer 140C of the second electrode 140.

[0185] The area outside the through-hole 53 of the mask 50 can shield the vapor-deposited material 7 facing the substrate 110. This area outside the through-hole 53 of the mask 50 is also referred to as the shielding area 54. Figure 9 In the top view of the first mask 50A shown, a diagonal shading is applied to the shading area 54.

[0186] The thickness T of the mask 50 can be, for example, 5 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more. The thickness T of the mask 50 can be, for example, less than 25 μm, less than 30 μm, less than 50 μm, or less than 100 μm. The range of the thickness T of the mask 50 can be defined by a first group consisting of 5 μm, 10 μm, 15 μm, and 20 μm and / or a second group consisting of 25 μm, 30 μm, 50 μm, and 100 μm. The range of the thickness T of the mask 50 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the thickness T of the mask 50 can be defined by a combination of any two values ​​from the first group. The range of the thickness T of the mask 50 can be defined by a combination of any two values ​​from the second group. For example, it can be 5μm or larger than 100μm, 5μm or larger than 50μm, 5μm or larger than 30μm, 5μm or larger than 25μm, 5μm or larger than 20μm, 5μm or larger than 15μm, 5μm or larger than 10μm, 10μm or larger than 100μm, 10μm or larger than 50μm, 10μm or larger than 30μm, 10μm or larger than 25μm, 10μm or larger than 20μm, 10μm or larger than 15μm, 15μm or larger than 100μm, etc. 15μm and above 50μm, can be 15μm and above 30μm, can be 15μm and above 25μm, can be 15μm and above 20μm, can be 20μm and above 100μm, can be 20μm and above 50μm, can be 20μm and above 30μm, can be 20μm and above 25μm, can be 25μm and above 100μm, can be 25μm and above 50μm, can be 25μm and above 30μm, can be 30μm and above 50μm, can also be 50μm and above 100μm.

[0187] As a method for measuring the thickness T of mask 50, a contact measurement method can be used. As a contact measurement method, the HEIDENHAIM-METRO "MT1271" length gauge, which is equipped with a spherical bushing-guided plunger, can be used.

[0188] As a material constituting the mask 50, a nickel-containing iron alloy can be used, for example. The iron alloy may also contain cobalt in addition to nickel. For example, as a material for the mask 50, an iron alloy with a combined nickel and cobalt content of 30% to 54% by mass and a cobalt content of 0% to 6% by mass can be used. As a nickel-containing or nickel-and-cobalt-containing iron alloy, an Invar alloy containing 34% to 38% by mass of nickel, a super Invar alloy containing cobalt in addition to 30% to 34% by mass of nickel, or a low-thermal-expansion Fe-Ni plating alloy containing 38% to 54% by mass of nickel can be used. By using such an iron alloy, the coefficient of thermal expansion of the mask 50 can be reduced. For example, when a glass substrate is used as the substrate 110, the coefficient of thermal expansion of the mask 50 can be set to a value as low as that of the glass substrate. Therefore, during the vapor deposition process, the dimensional and positional accuracy of the vapor-deposited layer formed on the substrate 110 can be suppressed from decreasing due to the difference in the coefficients of thermal expansion between the mask 50 and the substrate 110.

[0189] Next, the manufacturing method of the organic device 100 will be described. The manufacturing method of the organic device 100 may include a substrate preparation process, an organic layer formation process, and a second electrode formation process.

[0190] First, a substrate preparation process is performed. In this process, a substrate 110 is prepared having a first electrode 120 and a reference electrode 150 formed thereon. The first electrode 120 and the reference electrode 150 can be formed, for example, by patterning the conductive layer on the substrate 110 after a conductive layer has been formed on the substrate 110 using a sputtering method or the like, followed by a photolithography method or the like. Furthermore, an insulating layer 160, located between two adjacent first electrodes 120 when viewed from above, can be formed on the substrate 110.

[0191] Next, the organic layer formation process is performed. In the organic layer formation process, such as... Figure 4 As shown, an organic layer 130 comprising a first organic layer 130A, a second organic layer 130B, and a third organic layer 130C is formed on the first electrode 120. The first organic layer 130A can be formed, for example, by vapor deposition using a mask having through-holes corresponding to the first organic layer 130A. For example, the first organic layer 130A can be formed by vapor deposition of an organic material or the like onto the first electrode 120 corresponding to the first organic layer 130A via a mask. The second organic layer 130B can also be formed by vapor deposition using a mask having through-holes corresponding to the second organic layer 130B. The third organic layer 130C can also be formed by vapor deposition using a mask having through-holes corresponding to the third organic layer 130C.

[0192] Next, the second electrode formation process is performed. In the second electrode formation process, the second electrode 140 is formed on the organic layer 130 using the aforementioned mask set. First, it can be performed by using... Figure 9 The process of forming the first layer 140A of the second electrode 140 using the vapor deposition method of the first mask 50A shown. For example, a conductive material such as a metal is vapor-deposited onto the organic layer 130 via the first mask 50A, thereby forming the first layer 140A. Next, a process of forming the second layer 140B of the second electrode 140 using the vapor deposition method of the second mask 50B can be performed. For example, a conductive material such as a metal is vapor-deposited onto the organic layer 130 via the second mask 50B, thereby forming the second layer 140B. Next, a process of forming the third layer 140C of the second electrode 140 using the vapor deposition method of the third mask 50C can be performed. For example, a conductive material such as a metal is vapor-deposited onto the organic layer 130 via the third mask 50C, thereby forming the third layer 140C. Thus, as Figure 3 As shown, a second electrode 140 comprising a first layer 140A, a second layer 140B, and a third layer 140C can be formed.

[0193] It should be noted that there is no particular restriction on the order in which the first layer 140A, the second layer 140B, and the third layer 140C are formed. For example, the first layer 140A can be formed after the second layer 140B, or the first layer 140A and the second layer 140B can be formed after the third layer 140C.

[0194] Next, the effects that can be achieved by the aforementioned organic device 100 will be explained.

[0195] The second electrode 140Y of the standard region 103 includes a plurality of connection portions 105 connected to the second electrode 140X of the first display region 101. The plurality of connection portions 105 include a first connection portion 105a located on the first side 100La in the second direction D2, and the first connection portion 105a includes opposing connection portions 106 located between the transmission regions 104 in the first direction D1. The wiring region 100W containing the reference electrode 150 extends along the first side 100La; therefore, the opposing connection portions 106 face the reference electrode 150. This shortens the path of the current flowing through the second electrode 140Y of the standard region 103 to the reference electrode 150 via the opposing connection portions 106. Therefore, it is possible to suppress the increase in current resistance relative to the current flowing through the second electrode 140Y of the standard region 103. More specifically, when a voltage is applied between the first electrode 120 and the second electrode 140, current flows from the first electrode 120 to the organic layer 130, and the current flowing through the organic layer 130 flows through the second electrode 140 to the reference electrode 150. Here, the current flowing through the second electrode 140Y of the standard region 103 flows through the connection 105 to the second electrode 140X of the first display region 101, toward the reference electrode 150. However, depending on the position of the connection 105, the current from the standard region 103 may sometimes bypass the connection and flow to the first display region 101. In this case, the path of the current to the reference electrode 150 increases, and the current resistance value increases. In contrast, the first connection portion 105a includes a counter-connection portion 106. Current flowing through the second electrode 140Y of the standard region 103 flows through the counter-connection portion 106, which faces the reference electrode 150, to the second electrode 140X of the first display region 101, and can then flow towards the reference electrode 150. Therefore, the path of current to the reference electrode 150 can be shortened, and the increase in the resistance value of the current can be suppressed. This suppresses the difference between the current flowing through each element 115 of the first display region 101 and the current flowing through each element 115 of the standard region 103. As a result, the current flowing through each element 115 of the organic device 100 can be made uniform.

[0196] Furthermore, multiple connection portions 105 include a second connection portion 105b located on the second side 100Lb in the second direction D2. As a result, current flowing through each element 115 in the portion of the first display area 101 closer to the second side 100Lb than in the second display area 102 can flow from the second connection portion 105b into the standard area 103, and then through the opposing connection portion 106 to the second electrode 140X of the first display area 101. Therefore, the path of current to the reference electrode 150 can be shortened, and the increase in the resistance value of the current can be suppressed. Consequently, the amount of current flowing to each element 115 of the organic device 100 can be made uniform.

[0197] Furthermore, the standard region 103 includes a second electrode 140Y extending from the second connection portion 105b to the first connection portion 105a in the second direction D2, with the opposing connection portion 106 located at the end of the second direction portion 103L on the side of the first edge 100La in the second direction D2. Thus, current flowing in from the second connection portion 105b can flow through the second direction portion 103L along the second direction D2, and from the opposing connection portion 106 to the second electrode 140X of the first display region 101. Therefore, the path of current to the reference electrode 150 can be further shortened, and the increase in the resistance value of the current can be further suppressed. As a result, the amount of current flowing to each element 115 of the organic device 100 can be more uniform.

[0198] Furthermore, the transmissive region 104 extends from the end in the second direction D2 that connects to the first display region 101 on the second side 100Lb side to the end in the second direction D2 that connects to the first display region 101 on the first side 100La side. Thus, the transmissive region 104 can exist over a large area within the second display region 102. This increases the amount of light transmitted through the transmissive region 104. Consequently, it increases the amount of light received by the sensor located on the back side of the substrate 110.

[0199] Furthermore, the transmission region 104, when viewed from above, includes an area where the substrate 110 and the organic layer 130 do not overlap. This increases the transmittance of the transmission region 104. Consequently, the amount of light received by the sensor located on the back side of the substrate 110 can be increased.

[0200] Furthermore, the second electrode 140Y in standard region 103 includes a first layer 140A and a second layer 140B that partially overlaps with the first layer 140A when viewed from above. Thus, the overlap of the first layer 140A and the second layer 140B of the second electrode 140Y forms an electrode overlap region 145. The second electrode 140Y can have a thicker thickness in this electrode overlap region 145 than in other portions. Therefore, the current resistance value can be reduced in this electrode overlap region 145. This suppresses differences in the amount of current flowing through each element 115. As a result, the amount of current flowing to each element 115 of the organic device 100 becomes uniform.

[0201] Furthermore, the second electrode 140Y in standard region 103 includes a third layer 140C that partially overlaps with either the first layer 140A or the second layer 140B when viewed from above. Thus, the third layer 140C of the second electrode 140Y overlaps with either the first layer 140A or the second layer 140B, forming an electrode overlap region 145. Therefore, the second electrode 140Y can have a thicker thickness in the electrode overlap region 145, further reducing the current resistance value. As a result, the current flowing to each element 115 of the organic device 100 can be more uniform.

[0202] Furthermore, the occupancy rate (second occupancy rate) of the second electrode 140Y in the second display area 102 is 40% to 95%. By making the second occupancy rate 40% or more, the current flowing through the second electrode 140Y in the standard area 103 can be increased. This suppresses the difference between the current flowing through each element 115 in the first display area 101 and the current flowing through each element 115 in the standard area 103. As a result, the current flowing to each element 115 of the organic device 100 becomes more uniform. Additionally, by making the second occupancy rate 95% or less, a transmission area 104 can exist over a large area in the second display area 102. This increases the amount of light transmitted through the transmission area 104. Therefore, the amount of light received by the sensor located on the back side of the substrate 110 can be increased.

[0203] It should be noted that, in the above embodiment, an example of a standard region 103 including a second direction portion 103L in which the second electrode 140Y extends from the second connection portion 105b to the first connection portion 105a in the second direction D2 has been described (see reference). Figure 2 and Figure 3 However, this is not a limitation. As long as the first connection portion 105a includes the opposing connection portion 106, the standard region 103 may not include the second direction portion 103L. That is, the second electrode 140Y of the standard region 103 may not extend in the second direction D2. For example, the second electrode 140Y of the standard region 103 may extend obliquely relative to the second direction D2, or it may be serrated. In this case, the transmission region 104 may also extend obliquely relative to the second direction D2, or it may be serrated. In this case, by including the opposing connection portion 106 in the first connection portion 105a, the path of current to the reference electrode 150 can be shortened, and the increase in the resistance value of the current can be suppressed. As a result, the amount of current flowing to each element 115 of the organic device 100 can be made uniform.

[0204] Additionally, in the above embodiment, the standard region 103 may also include a first direction portion 103W extending from the second electrode 140Y in the first direction D1, so as to connect two adjacent second direction portions 103L in the first direction D1 respectively (see reference). Figure 11 and Figure 12 The first direction portion 103W can be viewed from one side of the first direction D1 of the second display area 102 (). Figure 11 The left end of the middle extends to the other side in the first direction D1. Figure 11The right end of the device (in the middle). In this case, the transmission regions 104 can be arranged in the first direction D1 and simultaneously in the second direction D2. In this case, by including the opposing connection portion 106 in the first connection portion 105a, the path of current to the reference electrode 150 can be shortened, and the increase in the resistance value of the current can be suppressed. As a result, the amount of current flowing to each element 115 of the organic device 100 can be made uniform.

[0205] Furthermore, in the above embodiments, an example was described in which the transmission region 104 does not include the first electrode 120, the organic layer 130, and the second electrode 140. However, it is not limited to this, and the transmission region 104 may include the first electrode 120 and the organic layer 130. In addition, the transmission region 104 may include an insulating layer 160.

[0206] Furthermore, in the above embodiment, an example of the second electrode 140 comprising three layers has been described. However, this is not a limitation; the second electrode 140 may comprise one layer, two layers, or four or more layers. For example, if the second electrode 140 is composed of one layer, the second electrode 140 may be formed by a solid pattern. Additionally, the arrangement pattern of the element 115 described above is also an example; the element 115 may be arranged by any other arbitrary arrangement pattern.

[0207] According to the embodiments described above, the current flowing to each element of the organic device can be made uniform.

[0208] Example

[0209] Next, embodiments and comparative examples will be used to illustrate implementations of the present invention in more detail. However, the embodiments of the present invention are not limited to those described in the following examples, provided that they do not depart from the essential points.

[0210] Figure 10 This is a top view showing the organic device 100X according to the first embodiment. As the first embodiment, the flow rate is calculated through simulation. Figure 10 The current values ​​of each element 115 of the organic device 100X shown.

[0211] and Figure 2 Similarly, the organic device 100 shown, Figure 10The organic device 100X shown has a display area 100D including a first display area 101 and a second display area 102. The first display area 101 has a square outline with one side of 5 mm. That is, the size W of the first display area 101 in the first direction D1 is 5 mm, and the size L of the first display area 101 in the second direction D2 is also 5 mm. In addition, the second display area 102 has a circular outline. The diameter R of the second display area 102 is 3 mm. The occupancy (second occupancy) of the second electrode 140Y in the second display area 102 is 52%. One side of the first display area 101 in the second direction D2 ( Figure 10 The lower side of the [structure] is connected to ground GN at a specified reference potential. The reference potential is 0V. Figure 10 Other components of the organic device 100X and Figure 2 The organic devices are roughly the same as those in 100. Figure 10 An enlarged view of the area enclosed by the double-dotted line labeled C1 in the organic device 100X. Figure 3 same.

[0212] Figure 11 This is a top view showing the organic device 100Y of the second embodiment. Figure 12 It is Figure 11 An enlarged top view of the area enclosed by the double-dotted line labeled C2 in the organic device 100Y. As a second embodiment, the flow is calculated via simulation... Figure 11 and Figure 12 The current values ​​of each element 115 of the organic device 100Y shown.

[0213] Figure 11 and Figure 12 The organic device 100Y shown is Figure 10 The organic device 100X of the first modified example shown has a substantially similar configuration, except that the standard region 103 includes the aforementioned first direction portion 103W. The first direction portion 103W is such that the second electrode 140Y extends in the first direction D1 to connect two adjacent second direction portions 103L in the standard region 103 in the first direction D1. Figure 11 and Figure 12 In the organic device 100Y shown, the first direction portion 103W extends from one side of the second display area 102 in the first direction D1 ( Figure 11 The left end of the middle extends to the other side in the first direction D1. Figure 11The second electrode 140Y included in the first direction portion 103W extends from one end in the first direction D1 to the other end in the first direction D1. It should be noted that the occupancy rate (second occupancy rate) of the second electrode 140Y in the second display area 102 is 57%.

[0214] Figure 13 This is a top view showing the organic device 100Z of the third embodiment. Figure 14 It is Figure 13 An enlarged top view of the area enclosed by the double-dotted line labeled C3 in the organic device 100Z. As a third embodiment, the flow is calculated via simulation... Figure 13 and Figure 14 The current values ​​of each element 115 of the organic device 100Z shown.

[0215] Figure 13 and Figure 14 The organic device 100Z shown is Figure 10 The organic device 100X shown in the first modified example has a substantially similar configuration, but differs in that the second occupancy is smaller compared to the first modified example. More specifically, the occupancy (second occupancy) of the second electrode 140Y in the second display area 102 is 26%. Figure 13 and Figure 14 In the organic device 100Z shown, the spacing of the second direction portion 103L on the first direction D1 is twice that of the first modified example.

[0216] Figure 15 This is a top view showing the organic device 100C, a comparative example. Figure 16 It is Figure 14 An enlarged top view of the area enclosed by the double-dotted line labeled C4 in the organic device 100C. As a comparative example, the flow to... (The sentence is incomplete and requires further context to translate accurately.) Figure 15 and Figure 16 The current values ​​of each element 115 of the organic device 100C shown.

[0217] Figure 15 and Figure 16 The organic device 100C shown is Figure 10 The organic device 100X shown in the first modified example has a substantially similar configuration, but differs in that the standard region 103 does not include the second direction portion 103L described above, but includes the first direction portion 103C. The first direction portion 103C is one side of the standard region 103 along the first direction D1 from the second display region 102. Figure 15 The left end of the middle extends to the other side in the first direction D1. Figure 15 The portion at the right end of the middle. Therefore, in Figure 15 and Figure 16 In the organic device 100C shown, the first connection portion 105a does not include the aforementioned opposing connection portion 106. It should be noted that the occupancy rate (second occupancy rate) of the second electrode 140Y in the second display area 102 is 57%.

[0218] Figure 17 This is a top view of the organic device 100R, illustrating a reference example. As a reference example, the simulation calculation flow is... Figure 17 The current values ​​of each element 115 of the organic device 100R shown.

[0219] Figure 17 The organic device 100R shown is Figure 10 The organic device 100X shown in the first modified example has a substantially similar configuration, except that the second display area 102 does not contain the transmissive area 104. That is, the second display area 102 is composed of the standard area 103. In this case, the occupancy rate (second occupancy rate) of the second electrode 140Y in the second display area 102 is 100%. It should be noted that in Figure 17 In the organic device 100R shown, for convenience, the region at the same location as the second display region 102 in the first modified example is referred to as the second display region 102. Furthermore, in Figure 17 In the organic device 100R shown, the second electrode 140 is composed of a single layer, and the second electrode 140 is formed by a solid pattern. That is, the second electrode 140 is composed of a first layer 140A, excluding the second layer 140B and the third layer 140C that overlap with the first layer 140A when viewed from above. Therefore, no electrode overlap region 145 is formed.

[0220] In the simulation, the current flowing to each component 115 when a specified voltage is applied is calculated. The largest current value among all current values ​​is denoted as the maximum current value I. max The minimum current value is denoted as the minimum current value I. min The difference is denoted as the current difference I. diff The simulation results of each embodiment, comparative example, and reference example are shown below. Figure 18 It should be noted that, in Figure 18 In the middle, the current difference I diff The value in parentheses in the column represents the current difference I. diff Relative to the maximum current value I max The proportion.

[0221] like Figure 18 As shown, the current difference I in the first embodiment, the second embodiment, and the third embodiment can be confirmed. diff Less than the current difference I in the comparative example diffThus, it can be confirmed that when the first connection portion 105a includes the opposing connection portion 106, the amount of current flowing to each element 115 can be made uniform.

[0222] In particular, the current difference I in the first embodiment and the second embodiment can be confirmed. diff The current difference I is less than that in the reference example. diff That is, it was confirmed that although the first and second embodiments include the transmission region 104, the current difference I is different from that of the reference example without the transmission region 104. diff The reduction is believed to be due to the fact that, in the first and second embodiments, an electrode overlap region 145 is formed, and in the electrode overlap region 145, the thickness of the second electrode 140Y increases, resulting in a decrease in current resistance. It has been confirmed that when the first connection portion 105a includes an opposing connection portion 106 and the second electrode 140 includes multiple layers 140A, 140B, and 140C, the current flowing to each element 115 can be made more uniform.

[0223] Furthermore, it can be confirmed that the current difference I between the first embodiment and the second embodiment... diff The current difference I is less than that in the third embodiment. diff This is believed to be because, in the first and second embodiments, the occupancy rate of the second electrode is greater than that in the third embodiment, resulting in an increase in the current flowing through the second electrode 140Y in the standard region 103. Therefore, let the current difference be I... diff When the threshold is 0.26nA, and the second occupancy rate is above 40%, the current difference I diff The threshold value is below 100. This confirms that when the first connection portion 105a includes the opposing connection portion 106 and the second occupancy rate is 40% or more, the current flowing to each element 115 can be made more uniform.

Claims

1. An organic device comprising: The outer edge includes a first side and a second side extending in a first direction and facing each other in a second direction orthogonal to the first direction, and a third side and a fourth side extending in a direction from the first side toward the second side; The wiring area extends along the first side; and The display area is connected to the wiring area. The display area includes a first electrode, an organic layer on the first electrode, and a second electrode on the organic layer. The wiring area includes a reference electrode that is electrically connected to the second electrode and defines a reference potential. The display area includes a first display area and a second display area connected to the first display area. The second display area includes: a standard area containing the second electrode, and a transmissive area excluding the second electrode and arranged in the first direction. The second electrode in the standard area includes a plurality of connection portions that are connected to the second electrode in the first display area. The plurality of said connecting portions are included in the first connecting portion located on the first side in the second direction. The first connecting portion includes opposing connecting portions located between the transmission regions in the first direction. The plurality of said connecting portions are included in a second connecting portion located on the second side in the second direction. The standard region includes the portion in the second direction in which the second electrode extends linearly from the second connection portion to the first connection portion. The opposing connection portion is located at the end of the first side in the second direction of the second direction portion.

2. The organic device as claimed in claim 1, wherein, The transmissive region extends from the end in the second direction that connects with the first display region on the second side to the end in the second direction that connects with the first display region on the first side.

3. The organic device as described in claim 1, wherein, The standard region includes a first-direction portion of the second electrode extending in the first direction, so as to connect two adjacent second-direction portions in the first direction.

4. The organic device as claimed in claim 1, wherein, The standard region includes the area where the second electrode does not overlap with the organic layer when viewed from above.

5. The organic device as claimed in claim 1, wherein, The transmission region includes the area where the substrate of the organic device and the organic layer do not overlap when viewed from above.

6. The organic device as claimed in claim 1, wherein, The first connecting part includes two or more of the opposing connecting parts.

7. The organic device as claimed in claim 1, wherein, The dimension of the first connecting part in the first direction is more than 5 μm and less than 500 μm.

8. The organic device as claimed in claim 1, wherein, The first connecting portions are arranged in the first direction at intervals of 10 μm to 550 μm.

9. The organic device as claimed in claim 1, wherein, The second electrode in the standard region comprises a first layer and a second layer that partially overlaps with the first layer when viewed from above.

10. The organic device of claim 9, wherein, The second electrode in the standard area is contained in a third layer that partially overlaps with the first or second layer when viewed from above.

11. The organic device of claim 1, wherein, The occupancy rate of the second electrode in the second display area is more than 40% and less than 95%.

12. The organic device of claim 1, wherein, The first electrode contains a metal oxide. The second electrode contains metal.

13. A method for manufacturing an organic device, wherein the method for manufacturing the organic device according to any one of claims 1 to 12 is [method name missing]. It includes a second electrode forming process for forming the second electrode on the organic layer on the first electrode. The second electrode comprises a first layer and a second layer that partially overlaps with the first layer when viewed from above. The second electrode forming process includes: The process of forming the first layer by vapor deposition using a first mask; and The process of forming the second layer by using a vapor deposition method with a second mask.

14. The method for manufacturing an organic device as described in claim 13, wherein, The second electrode is contained in a third layer that partially overlaps with the first or second layer when viewed from above. The second electrode forming process includes a step of forming the third layer by using a vapor deposition method with a third mask.

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