Wafer auto-alignment bonding apparatus and method

Abstract

This invention relates to an automated wafer alignment and bonding apparatus and method. The automated wafer alignment and bonding apparatus includes: a support stage for placing wafers to be aligned; at least three alignment members arranged circumferentially along the support stage, each alignment member having one end movably connected to the support stage and the other end having an abutment portion; a first pressure detection element electrically connected to the abutment portion for detecting and acquiring the contact pressure between the abutment portion and the wafer to be aligned; a controller electrically connected to both the alignment members and the first pressure detection element, enabling the controller to determine that alignment between the alignment members and the wafer to be aligned is complete based on the contact pressure reaching a preset value; a first driving member; and a pressing member drivenly connected to the first driving member. Multiple wafers are to be aligned, and the pressing member presses the multiple wafers after alignment to bond them together. This invention solves the problem of inaccurate wafer alignment during mass transfer in the prior art.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to an automatic wafer alignment and bonding apparatus and method. Background Technology

[0002] Currently, Micro-LED is an emerging display technology. Compared with conventional display technologies, displays based on Micro-LED technology have the characteristics of fast response speed, self-illumination, high contrast, long lifespan, and high photoelectric efficiency.

[0003] In the Micro-LED industry, mass transfer technology is a core technology that uses high-precision equipment to transfer a large number of Micro-LED chips onto a target substrate (wafer) or circuit. Cost, yield, and precision are crucial to the success of mass transfer.

[0004] Mass transfer involves multiple alignment and bonding operations depending on the process requirements, involving different materials, sizes, and shapes. However, existing bonding equipment often lacks alignment capabilities, and manual alignment can lead to wafer deflection, resulting in significant deviations in subsequent processes and thus affecting process yield.

[0005] Therefore, improving the accuracy of wafer alignment during mass transfer is an urgent problem to be solved. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the purpose of this application is to provide an automatic wafer alignment and bonding apparatus and method, which aims to solve the problem of inaccurate wafer alignment during mass transfer in the prior art.

[0007] An automated wafer alignment and bonding apparatus includes: a carrier stage for placing wafers to be aligned; at least three alignment members arranged circumferentially along the carrier stage, one end of each alignment member being movably connected to the carrier stage to allow displacement relative to the carrier stage, and the other end of each alignment member having an abutment portion for abutting the wafers to be aligned; a first pressure detection element electrically connected to the abutment portion for detecting and acquiring the contact pressure between the abutment portion and the wafers to be aligned; a controller electrically connected to both the alignment members and the first pressure detection element, wherein the first pressure detection element can transmit the contact pressure to the controller so that the controller can determine that the alignment members and the wafers to be aligned are aligned when the contact pressure reaches a preset value; a first driving member; and a pressing member drivenly connected to the first driving member. Multiple wafers are to be aligned, and the pressing member presses the multiple wafers to be aligned after alignment to bond them together.

[0008] The above-described configuration includes a support platform, at least three alignment members arranged circumferentially along the support platform, a first pressure detection element, a controller, a first drive element, and a pressing element. One end of each alignment member is movably connected to the support platform to allow displacement relative to it. The other end of each alignment member has an abutment portion for abutting the wafer to be aligned. The first pressure detection element is electrically connected to the abutment portion to detect and acquire the contact pressure between the abutment portion and the wafer to be aligned. The controller is electrically connected to both the alignment member and the first pressure detection element, transmitting the contact pressure to the controller so that the controller can determine that the alignment member and the wafer to be aligned are aligned when the contact pressure reaches a preset value. The pressing element is driven by the first drive element. Since there are multiple wafers to be aligned, the pressing element presses the multiple wafers after alignment to bond them together. Under the control of the controller, each abutment can automatically adjust the distance between itself and the support stage according to the outer dimensions of different types of wafers to be aligned. The controller determines whether each abutment is aligned with a wafer based on whether the contact pressure between the abutment and the wafer reaches a preset value. Multiple abutments limit and stop the wafer to be aligned from all sides. Then, another wafer to be aligned is placed in the alignment space formed by multiple abutments, so as to accurately align with the previous wafer already placed in the alignment space. This process is repeated to complete the accurate alignment of two or more wafers to be aligned. After alignment, the multiple wafers to be aligned are bonded under the pressure of the pressing component. No manual intervention is required during the alignment process. This method is accurate, saves time and effort, and effectively solves the problem of inaccurate wafer alignment during mass transfer in the prior art.

[0009] Optionally, at least three alignment members are evenly arranged along the circumference of the support stage. In this way, the alignment members can play an adjustment and alignment role in the circumference of the support stage, ensuring that the wafer to be aligned can be effectively limited and stopped in all directions, thereby achieving accurate alignment of the wafer to be aligned.

[0010] Optionally, a guide ramp is provided on the side of the abutment facing the support platform. The guide ramp is used for the placement transition of the wafer to be aligned. By providing the guide ramp, one or more wafers to be aligned can smoothly enter the alignment space enclosed by multiple abutments, thereby accurately aligning with the previous wafer already placed in the alignment space. Furthermore, the wafer to be aligned will not come into contact with sharp objects during the process of entering the alignment space, preventing damage to the wafer to be aligned.

[0011] Optionally, the side of the abutting portion that abuts against the wafer to be aligned is used as the abutting surface, which may be a plane or a curved surface.

[0012] Optionally, the height of the contact surface along the direction perpendicular to the support stage is greater than or equal to the height of the wafer to be aligned along the direction perpendicular to the support stage. In this way, with one wafer to be aligned already housed in the alignment space, after one or more wafers to be aligned enter the alignment space, the contact surfaces of the multiple contact portions still have sufficient height to contact the wafers to be aligned that have entered the alignment space, thereby forming a limiting stop and ensuring the accuracy of wafer alignment.

[0013] Optionally, the abutment part is an abutment cylinder, and the side of the abutment cylinder serves as the abutment surface. The cylindrical abutment part allows it to fit and abut against the wafer to be aligned in any position on the support stage without the need to adjust the angle or position, making it convenient, quick, and highly applicable.

[0014] Optionally, the automated wafer alignment and bonding apparatus further includes a second pressure detection element, which is electrically connected to both the pressing component and the controller. This second pressure detection element detects and acquires the extrusion pressure applied by the pressing component to multiple wafers to be aligned and transmits it to the controller. The controller is also electrically connected to a first drive component to control the extrusion pressure of the pressing component. With the above configuration, under the control of the controller, the pressing component can extrude multiple aligned wafers with a suitable extrusion pressure, ensuring a tight bond between the wafers without damaging them.

[0015] Optionally, the first driving component includes: a first motor; a cantilever, which is driven and connected to the first motor, with one end of the cantilever connected to a pressing component to drive the pressing component to press the wafer to be aligned. Through the above configuration, the first motor, under the control of the controller, drives the cantilever to move, which in turn drives the pressing component to move, thereby pressing the aligned wafer with appropriate pressure. This ensures a tight bond between the aligned wafers without damaging them, achieving automatic bonding of the aligned wafers.

[0016] Optionally, the alignment component can be movably connected to the support stage via a drive connection. This drive connection allows the alignment component to be easily moved away from or closer to the support stage, enabling convenient and quick adjustment of the distance between the alignment component and the wafer to be aligned, while also ensuring a strong connection with the support stage and guaranteeing the accuracy of wafer alignment.

[0017] Optionally, the alignment component further includes a second driving component, which is fixedly connected to the support platform, and the abutting part is movably connected to the support platform via the second driving component. The controller is electrically connected to the second driving component to control the length of the alignment component. With the above configuration, the abutting part can automatically move away from or towards the support platform under the control of the controller and driven by the second driving component. Thus, after the wafer to be aligned is placed on the support platform, the abutting part can automatically adjust the distance between itself and the wafer according to the wafer's dimensions until it abuts against the wafer. No manual intervention is required during the alignment process, ensuring accurate alignment while saving time and effort.

[0018] Optionally, the second driving component includes: a second motor, which is fixedly connected to the support platform; and a movable shaft, which is driven by the second motor, with one end of the movable shaft connected to the abutment portion to drive the abutment portion away from or towards the support platform. With this configuration, the abutment portion can automatically adjust its distance from the wafer under the control of the controller and driven by the second driving component, thereby completing the automatic abutment alignment of the abutment portion. No manual intervention is required during the alignment process, ensuring accurate alignment while saving time and effort.

[0019] Based on the same inventive concept, this application also provides an automatic wafer alignment and bonding method. The automatic wafer alignment and bonding method is implemented using the aforementioned automatic wafer alignment and bonding apparatus. The automatic wafer alignment and bonding method includes: setting the initial position of the abutment portion according to the size of the wafer to be aligned, so that the wafer to be aligned does not contact the abutment portion; placing one wafer to be aligned on a carrier stage; controlling multiple abutment portions to move toward the carrier stage at a preset speed until all abutment portions abut with the wafer to be aligned to complete the alignment; stacking one or more other wafers to be aligned on the wafer to be aligned that abuts with the multiple abutment portions; and controlling a pressing component to press the stacked wafers to be aligned with a preset pressing pressure to bond the multiple wafers to be aligned.

[0020] Optionally, the controller controls multiple abutment parts to move toward the carrier stage at a preset speed until all abutment parts abut with the wafer to be aligned, including: the controller controls multiple abutment parts to move toward the carrier stage at a preset speed; a first pressure detection element detects and acquires the contact pressure between the abutment parts and the wafer to be aligned and transmits it to the controller; when the abutment parts abut with the wafer to be aligned and the contact pressure reaches a preset value, the controller determines that the alignment member and the wafer to be aligned are aligned and controls the alignment member to stop moving. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an automated wafer alignment and bonding device according to one embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the alignment member according to one embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the abutment portion according to one embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the wafer to be aligned after alignment according to one embodiment of the present invention.

[0025] Figure 5 This is a flowchart of an automated wafer alignment and bonding method according to one embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures:

[0027] 10-Supporting platform; 20-Alignment component; 21-Second driving component; 211-Second motor; 212-Moving shaft; 22-Abutting part; 221-Guide inclined surface; 30-First driving component; 31-First motor; 32-Cantilever; 40-Pressure component; 50-Controller; 60-First pressure detection element; 70-Wafer to be aligned. Detailed Implementation

[0028] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0030] As described in the background section, there is a problem of inaccurate wafer alignment during mass transfer in the prior art.

[0031] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments. Figures 1 to 4 As shown, the automated wafer alignment and bonding apparatus includes a carrier stage 10, at least three alignment members 20 arranged circumferentially along the carrier stage 10, a first pressure detection element 60, a controller 50, a first drive element 30, and a pressing element 40. The carrier stage 10 is used to place the wafer 70 to be aligned. One end of each alignment member 20 is movably connected to the carrier stage 10 so that it can be displaced relative to the carrier stage 10, and the other end of each alignment member 20 is provided with an abutment portion 22 for abutting the wafer 70 to be aligned. The first pressure detection element 60 is electrically connected to the abutment portion 22 and is used to detect and obtain the contact pressure between the abutment portion 22 and the wafer 70 to be aligned. The controller 50 is electrically connected to both the alignment members 20 and the first pressure detection element 60. The first pressure detection element 60 can transmit the contact pressure to the controller 50, so that the controller 50 can determine that the alignment member 20 and the wafer 70 to be aligned are aligned when the contact pressure reaches a preset value. The pressing component 40 is driven to connect with the first driving component 30. There are multiple wafers 70 to be aligned. After the multiple wafers 70 to be aligned are aligned, the pressing component 40 squeezes the multiple wafers 70 to be aligned so that the multiple wafers 70 to be aligned are bonded.

[0032] It should be noted that in this embodiment, the semiconductor element to be aligned is a wafer. Of course, it can also be a substrate, a chip, or a circuit, etc., and the wafer automatic alignment and bonding device in this embodiment can be used for alignment and bonding.

[0033] The above-described configuration includes a support platform 10, at least three alignment members 20 arranged circumferentially along the support platform 10, a first pressure detection element 60, and a controller 50. The support platform 10 is used to place the wafer 70 to be aligned. One end of each alignment member 20 is movably connected to the support platform 10 so that it can be displaced relative to the support platform 10. The other end of each alignment member 20 is provided with an abutment portion 22 for abutting the wafer 70 to be aligned. The first pressure detection element 60 is electrically connected to the abutment portion 22 and is used to detect and obtain the abutment portion 22 and the wafer 70 to be aligned. The contact pressure between wafers 70 is controlled by the controller 50, which is electrically connected to the alignment member 20 and the first pressure detection element 60. The first pressure detection element 60 transmits the contact pressure to the controller 50, allowing the controller 50 to determine that the alignment member 20 and the wafers 70 to be aligned are aligned based on the contact pressure reaching a preset value. The pressing member 40 is drivenly connected to the first driving member 30. Multiple wafers 70 are to be aligned. After the multiple wafers 70 are aligned, the pressing member 40 presses them together to achieve the desired alignment. Multiple wafers 70 to be aligned are bonded together. Under the control of the controller 50, the distance between each abutment 22 and the support stage 10 can be automatically adjusted according to the outer dimensions of different types of wafers 70 to be aligned. The controller determines whether each abutment 22 is aligned with one wafer 70 based on whether the contact pressure between the abutment 22 and the wafer 70 reaches a preset value. Multiple abutment 22s limit and stop the wafers 70 to be aligned from all sides, and then another... One wafer 70 to be aligned is placed in the alignment space formed by multiple abutment portions 22, thereby accurately aligning with the previous wafer 70 already placed in the alignment space. This process is repeated to achieve accurate alignment of two or more wafers 70 to be aligned. After alignment, the multiple wafers 70 to be aligned are bonded under the pressure of the pressing component 40. No manual intervention is required during the alignment process, which is both accurate and time-saving, effectively solving the problem of inaccurate wafer alignment during mass transfer in the prior art.

[0034] In this embodiment, at least three alignment members 20 are evenly arranged along the circumference of the support platform 10. That is, at least three alignment members 20 are arranged at equal intervals along the circumference of the support platform 10. In this way, the alignment members 20 can play an adjustment and alignment role in the circumference of the support platform 10, ensuring that the wafer 70 to be aligned can be effectively limited and stopped in all directions, thereby achieving accurate alignment of the wafer 70 to be aligned.

[0035] In this embodiment, the size of the support stage 10 is smaller than the size of the wafer 70 to be aligned. That is, after the wafer 70 to be aligned is placed on the support stage 10, the wafer 70 to be aligned extends beyond the support stage 10 in all directions.

[0036] In this embodiment, the support platform 10 is square. At least three alignment members 20 are provided on one side of the support platform 10. Of course, the support platform 10 can also be other shapes, and more alignment members 20 can be provided in each direction of the support platform 10, which can make the alignment of the wafer 70 to be aligned more accurate.

[0037] like Figure 3 As shown, the abutment portion 22 has a guide slope 221 on the side facing the support platform 10. The guide slope 221 is used for the placement transition of the wafer 70 to be aligned. By setting the guide slope 221, one or more wafers 70 to be aligned can smoothly enter the alignment space enclosed by the multiple abutment portions 22, thereby accurately aligning with the previous wafer 70 to be aligned that has been accommodated in the alignment space. Furthermore, the wafer 70 to be aligned will not come into contact with sharp objects during the process of entering the alignment space, thus preventing damage to the wafer 70 to be aligned.

[0038] In this embodiment, the side of the abutting portion 22 that abuts against the wafer 70 to be aligned is used as the abutting surface. Specifically, the abutting portion 22 is an abutting cylinder, and the side of the abutting cylinder serves as the abutting surface. That is, the abutting surface is curved. The cylindrical abutting portion 22 allows it to fit and abut against the wafer 70 to be aligned in any position on the support platform 10 without the need to adjust the angle or position, making it convenient, quick, and highly applicable. Of course, the abutting surface can also be planar, that is, the abutting portion 22 can be an abutting rectangular column, which can be selected according to actual needs.

[0039] In this embodiment, the height of the contact surface along the direction perpendicular to the support stage 10 is greater than or equal to the height of the wafer 70 to be aligned along the direction perpendicular to the support stage 10. Thus, even when one wafer 70 to be aligned is already housed in the alignment space, after one or more wafers 70 to be aligned enter the alignment space, the contact surfaces of the multiple contact portions 22 still have sufficient height to contact the wafer 70 entering the alignment space, thereby forming a limiting stop and ensuring the accuracy of the alignment of the wafer 70.

[0040] Specifically, in this embodiment, there are two alignment wafers 70. After one alignment wafer 70 is placed in the alignment space, another alignment wafer 70 is placed in the alignment space and attached to the first alignment wafer 70. At this time, the overall height of the two alignment wafers 70 is less than the height of the contact surface. That is, the second alignment wafer 70 is also completely contained in the alignment space, and the height of the top surface of the second alignment wafer 70 is less than the height of the top of the contact surface. Similarly, when there are more than two alignment wafers 70, the overall height of the multiple alignment wafers 70 placed in the alignment space is less than the height of the contact surface. The height of the top surface of the last alignment wafer 70 entering the alignment space is less than the height of the top of the contact surface. It can be understood that the top of the contact surface is the connection point between the contact surface and the guide slope 221.

[0041] like Figure 1 As shown, the automated wafer alignment and bonding apparatus also includes a second pressure detection element. The second pressure detection element is electrically connected to both the pressing member 40 and the controller 50, and is used to detect and acquire the extrusion pressure applied by the pressing member 40 to multiple wafers 70 to be aligned, and transmit this information to the controller 50. The controller 50 is also electrically connected to the first drive member 30 to control the extrusion pressure of the pressing member 40. Thus, an appropriate extrusion pressure is set according to the physical properties of the wafers 70 to be aligned. When the second pressure detection element detects that the extrusion pressure of the pressing member 40 on the wafers 70 to be aligned reaches a preset value, the controller 50 can control the pressing member 40 to stop extruding, preventing damage to the wafers 70 to be aligned. This allows the pressing member 40 to extrude multiple aligned wafers 70 with appropriate extrusion pressure, ensuring a tight bond between the wafers 70 to be aligned without damaging them.

[0042] like Figure 1 As shown, the first driving component 30 includes a first motor 31 and a cantilever 32. The cantilever 32 is driven by the first motor 31, and one end of the cantilever 32 is connected to the pressing component 40 to drive the pressing component 40 to press the wafer 70 to be aligned. With the above configuration, the first motor 31 drives the cantilever 32 to move under the control of the controller 50, which in turn drives the pressing component 40 to move, thereby pressing the aligned wafer 70 with appropriate pressing pressure. This ensures that the aligned wafer 70 is tightly bonded without damaging it, thus realizing the automatic bonding of the aligned wafer 70.

[0043] In this embodiment, the alignment member 20 is movably connected to the support stage 10 via a drive connection. This drive connection allows the alignment member 20 to easily move away from or closer to the support stage 10, enabling convenient and quick adjustment of the distance between the alignment member 20 and the wafer 70 to be aligned, while also ensuring a strong connection with the support stage 10 and guaranteeing the accuracy of the alignment of the wafer 70.

[0044] Specifically, such as Figure 2 As shown, the alignment member 20 also includes a second driving member 21. The second driving member 21 is fixedly connected to the support platform 10. The abutment part 22 is movably connected to the support platform 10 through the second driving member 21. The controller 50 is electrically connected to the second driving member 21 to control the length of the alignment member 20, and the abutment part 22 abuts against the wafer 70 to be aligned. With the above configuration, the abutment part 22 can automatically move away from or towards the support platform 10 under the control of the controller 50 and driven by the second driving member 21. Thus, after the wafer 70 to be aligned is placed on the support platform 10, the abutment part 22 can automatically adjust the distance between itself and the wafer 70 to be aligned according to the outer dimensions of the wafer 70 until it abuts against the wafer 70. Specifically, the first pressure detection element 60 is electrically connected to the abutment part 22 and is used to detect and acquire the contact pressure between the abutment part 22 and the wafer 70 to be aligned. When the contact part 22 comes into contact with the wafer 70 to be aligned and the contact pressure between them reaches a preset value, the controller 50 determines that the contact part 22 and the wafer 70 to be aligned are aligned. Then, it controls the second driving member 21 to stop moving, thereby stopping the contact part 22 from moving, thus completing the alignment of the contact part 22 and the wafer 70 to be aligned. The above alignment process requires no manual intervention, which is both accurate and saves time and effort.

[0045] like Figure 2 As shown, the second driving component 21 includes a second motor 211 and a moving shaft 212. The second motor 211 is fixedly connected to the support platform 10. The moving shaft 212 is driven by the second motor 211, and one end of the moving shaft 212 is connected to the abutment part 22 to drive the abutment part 22 away from or towards the support platform 10. With the above configuration, the abutment part 22 can automatically adjust the distance between itself and the wafer 70 to be aligned under the control of the controller 50 and driven by the second driving component 21, thereby completing the automatic abutment alignment of the abutment part 22. No manual intervention is required during the alignment process, which is both accurate and saves time and effort.

[0046] like Figure 5 As shown, this application also provides an automatic wafer alignment and bonding method. The automatic wafer alignment and bonding method is implemented using the above-mentioned automatic wafer alignment and bonding device. The automatic wafer alignment and bonding method includes: setting the initial position of the abutment portion 22 according to the size of the wafer 70 to be aligned, so that the wafer 70 to be aligned does not contact the abutment portion 22; placing one wafer 70 to be aligned on the carrier stage 10; the controller 50 controls multiple abutment portions 22 to move toward the carrier stage 10 at a preset speed until all multiple abutment portions 22 abut with the wafer 70 to be aligned to complete the alignment; stacking one or more other wafers 70 to be aligned on the wafer 70 to be aligned that abuts with multiple abutment portions 22; and the controller 50 controls the pressing member 40 to press the stacked multiple wafers 70 to be aligned with a preset pressing pressure to bond the multiple wafers 70 to be aligned.

[0047] In this embodiment, the controller 50 controls multiple abutment parts 22 to move toward the support platform 10 at a preset speed until all abutment parts 22 abut against the wafer 70 to be aligned. This includes: the controller 50 controls multiple abutment parts 22 to move toward the support platform 10 at a preset speed; the first pressure detection element 60 detects and obtains the contact pressure between the abutment parts 22 and the wafer 70 to be aligned and transmits it to the controller 50; when the abutment parts 22 abut against the wafer 70 to be aligned and the contact pressure reaches a preset value, the controller 50 determines that the alignment member 20 and the wafer 70 to be aligned are aligned and controls the alignment member 20 to stop moving.

[0048] Specifically, such as Figure 4 As shown, the wafer 70 to be aligned may be circular or irregular in shape. Based on the specific dimensions and material of the wafer 70, preset values ​​for the extrusion pressure and contact pressure are set for the wafer 70 to be aligned, and multiple abutment portions 22 are moved outside the size range of the wafer 70 to be aligned. When a wafer 70 to be aligned is placed on the support stage 10, the controller controls and adjusts the distance between each abutment portion 22 and the wafer 70 to be aligned until the abutment surfaces of each abutment portion 22 are in contact with the sidewalls of the wafer 70 to be aligned and the contact pressure reaches the preset value. The controller then determines that the alignment member 20 and the wafer 70 to be aligned are aligned and controls the abutment portion 22 to stop moving. Then, another wafer 70 to be aligned is placed in the alignment space, and so on, stacking all the wafers 70 to be aligned. The controller 50 then controls the pressing member 40 to press the stacked wafers 70 to be aligned with a preset extrusion pressure, thereby completing the bonding.

[0049] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for automated wafer alignment and bonding, characterized in that, The automatic wafer alignment and bonding method is implemented using an automatic wafer alignment and bonding apparatus, wherein the automatic wafer alignment and bonding apparatus includes: A support stage, used to place the wafer to be aligned; At least three alignment members are arranged circumferentially along the support platform. One end of each alignment member is movably connected to the support platform so that it can be displaced relative to the support platform. The other end of each alignment member is provided with an abutment portion for abutting the wafer to be aligned. A first pressure sensing element is electrically connected to the abutment portion and is used to detect and acquire the contact pressure between the abutment portion and the wafer to be aligned. The controller is electrically connected to both the alignment component and the first pressure detection element. The first pressure detection element can transmit the contact pressure to the controller, so that the controller can determine that the alignment component and the wafer to be aligned are aligned based on the contact pressure reaching a preset value. First driving component; A pressing component is driven and connected to the first driving component. There are multiple wafers to be aligned. After the multiple wafers to be aligned are aligned, the pressing component squeezes the multiple wafers to be aligned so that the multiple wafers to be aligned are bonded. The abutment portion has a guide slope on the side facing the support platform, and the guide slope is used for the placement transition of the wafer to be aligned; The automated wafer alignment and bonding method includes: The initial position of the abutment portion is set according to the size of the wafer to be aligned, so that the wafer to be aligned does not contact the abutment portion; Place one of the wafers to be aligned on the support stage; The controller controls multiple abutment parts to move toward the support platform at a preset speed until all abutment parts abut against the wafer to be aligned to complete the alignment. One or more of the wafers to be aligned are stacked on the wafers to be aligned, which abut against the plurality of abutting portions, by means of the guide ramp; The controller controls the pressing component to press the stacked wafers to be aligned with a preset extrusion pressure, so as to bond the multiple wafers to be aligned.

2. The wafer auto-alignment bonding method as described in claim 1, characterized in that, The controller controls multiple abutment parts to move toward the support platform at a preset speed until all abutment parts abut against the wafer to be aligned to complete the alignment, including: The controller controls multiple abutment parts to move toward the support platform at the preset speed. The first pressure detection element detects and acquires the contact pressure between the abutment part and the wafer to be aligned and transmits it to the controller. When the abutment part abuts the wafer to be aligned and the contact pressure reaches the preset value, the controller determines that the alignment member and the wafer to be aligned are aligned and controls the alignment member to stop moving.

3. The wafer automatic alignment and bonding method as described in claim 1 or 2, characterized in that, At least three of the alignment members are evenly arranged along the circumference of the support platform.

4. The wafer auto-alignment bonding method as described in claim 1 or 2, characterized in that, The side of the abutting portion that abuts against the wafer to be aligned is called the abutting surface, which may be a plane or a curved surface.

5. The wafer automatic alignment and bonding method as described in claim 4, characterized in that, The height of the contact surface along the direction perpendicular to the support platform is greater than or equal to the height of the entire wafer to be aligned along the direction perpendicular to the support platform.

6. The wafer automatic alignment and bonding method as described in claim 4, characterized in that, The abutting part is an abutting cylinder, and the side of the abutting cylinder serves as the abutting surface.

7. The wafer auto-alignment bonding method as described in claim 1 or 2, characterized in that, The automated wafer alignment and bonding apparatus further includes: The second pressure detection element is electrically connected to both the pressing component and the controller. It is used to detect and acquire the extrusion pressure applied by the pressing component to the plurality of wafers to be aligned and transmit it to the controller. The controller is also electrically connected to the first drive component to control the extrusion pressure of the pressing component.

8. The wafer auto-alignment bonding method as described in claim 1 or 2, characterized in that, The first driving element includes: First motor; A cantilever is connected to the first motor drive, and one end of the cantilever is connected to the pressing member to drive the pressing member to press the wafer to be aligned.

9. The wafer auto-alignment bonding method as described in claim 1 or 2, characterized in that, The alignment member is movably connected to the support platform via a drive connection.

10. The wafer auto-alignment bonding method as described in claim 9, characterized in that, The alignment component also includes: The second driving member is fixedly connected to the support platform, and the abutting part is movably connected to the support platform through the second driving member. The controller is electrically connected to the second driving member to control the length of the alignment member.

11. The wafer auto-alignment bonding method as described in claim 10, characterized in that, The second driving element includes: The second motor is fixedly connected to the support platform; A movable shaft is connected to the second motor for driving. One end of the movable shaft is connected to the abutment part to drive the abutment part away from or towards the support platform.

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