A digital electronic detonator tail wire injection molding head core tinning equipment

Abstract

This invention relates to a tin-plating equipment for the injection-molded wire core of a digital electronic detonator tail wire. The tin-plating equipment is used to process the tin plating of the terminals of a digital electronic detonator, which includes a wire clamp assembly, a connector assembly, and a cable. The tin-plating equipment includes a frame and a conveyor device, the conveyor device having a continuously rotating conveyor chain. Multiple clamping devices are spaced apart on the conveyor chain, each clamping device including a mounting frame, a rotating component, and a supporting component, the rotating component extending beyond the edge of the conveyor chain. The rotating component is used to fix the connector assembly, and the supporting component is used to fix the wire clamp assembly. It also includes a wire stripping device, a flux immersion device, and a molten metal device. The wire stripping device is used to strip the protective layer of the cable from the connector assembly to expose the wire core; the flux immersion device moves vertically to wet the wire core; and the molten metal device moves vertically to plate a conductive metal layer on the surface of the wire core. The tin-plating equipment achieves automated tin-plating with high processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of tin-dipping equipment technology, and in particular to a tin-dipping equipment for the injection molding head core of a digital electronic detonator tail wire. Background Technology

[0002] Electronic detonators, also known as digital electronic detonators, digital detonators, or industrial digital electronic detonators, are electric detonators that use an electronic control module to control the detonation process. The electronic control module is a dedicated circuit module located inside the digital electronic detonator. It has functions such as controlling the detonation delay time and detonation energy, and contains a built-in detonator identification code and detonation password. It can test its own functions, performance, and the electrical performance of the detonator's ignition element, and can communicate with the detonation controller and other external control devices.

[0003] Chinese patent CN114688927A discloses a permissible electronic detonator, initiation system, and initiation method suitable for underground coal mines. The electronic detonator includes an electronic ignition element and a basic detonator. The electronic ignition element consists of a lead wire, a chip module, and an ignition structure. The chip module employs an intrinsically safe electronic control circuit, and its input terminal is equipped with a safety protection diode. The chip module also has a delay setting unit capable of setting multiple delay times, all less than 130ms. The initiation system includes an initiator with a delay time setting unit. The initiation method is implemented based on the aforementioned initiation system.

[0004] Electronic ignition components require safety and reliability testing during manufacturing. Specifically, the continuity between the wire clamp assembly and the connector assembly must be reliable. Current electronic ignition component processes employ centralized, individual testing, which is inefficient. The connector assembly's wire cores need tin plating, and the plating effect must be tested. Currently, tin plating of connector assemblies is done manually, which is inefficient and the quality is limited by manual skill, leading to poor product consistency. Furthermore, the tin plating process easily generates tin vapor, which is harmful to human health; therefore, improvements are needed. Summary of the Invention

[0005] To overcome the problems existing in related technologies, embodiments of the present invention provide a device for tinning the core of the injection molding head of a digital electronic detonator tail wire.

[0006] According to a first aspect of the present invention, a tin-plating device for the injection-molded core of a digital electronic detonator tail wire is provided for processing tin plating of the terminals of a digital electronic detonator. The digital electronic detonator includes a wire clamp assembly, a connector assembly, and a cable connecting the wire clamp assembly and the connector assembly. The tin-plating device for the injection-molded core of a digital electronic detonator tail wire includes:

[0007] A frame and a conveyor mounted on the frame, the conveyor having a continuously rotating conveyor chain;

[0008] Multiple clamping devices are installed at intervals on the conveyor chain. Each clamping device includes a mounting frame fixed to the conveyor chain, a rotating component rotatably mounted on one end of the mounting frame, and a support component fixed on the other end of the mounting frame. The rotating component extends beyond the edge of the conveyor chain and is used to fix the connector assembly. The support component is used to fix the wire clamp assembly.

[0009] A wire stripping device, a flux immersion device, and a molten metal device are installed on the frame and arranged sequentially at intervals along the conveying direction of the conveying device. The wire stripping device is used to strip the protective layer of the cable of the connector assembly and expose the wire core. The flux immersion device moves up and down to wet the wire core. The molten metal device moves up and down to plate a conductive metal layer on the surface of the wire core.

[0010] In one embodiment, the wire stripping device includes a pressure head assembly and a wire stripping assembly mounted on the frame. The pressure head assembly moves vertically relative to the frame. The rotating assembly is located in the vertical movement direction of the pressure head assembly. The wire stripping assembly includes a wire stripper and a clamping assembly slidably connected to the wire stripper. The connector assembly is located in the sliding direction of the clamping assembly.

[0011] In one embodiment, a pressing device is further included between the wire stripping device and the flux dipping device. The pressing device voluntarily drives the rotating assembly to flip, so that the wire core of the connector assembly faces a first direction, and the flux dipping device moves up and down parallel to the first direction.

[0012] In one embodiment, the device further includes an upward tilting assembly mounted on the frame, the upward tilting assembly being located behind the molten metal device in the conveying direction of the conveying device, the upward tilting assembly activating to flip the rotating assembly, and the wire core of the connector assembly facing the horizontal direction.

[0013] In one embodiment, a power-on detection device is also included, which is mounted on the frame and is located behind the molten metal device in the conveying direction of the conveying device. The power-on detection device is used to detect the power-on of the wire clamp assembly and the connector assembly.

[0014] In one embodiment, the power-on detection device includes a conductive component and a detection component located on opposite sides of the conveying device. The conductive component presses and conducts two wire cores of the connector assembly installed on the rotating component. The detection component is electrically connected to the wire clamp assembly installed on the support component.

[0015] In one embodiment, a vision inspection device is also included, mounted on the frame, located behind the power-on detection device in the conveying direction of the conveying device, and the vision inspection device is used to detect the outer contour of the connector assembly.

[0016] In one embodiment, a cutting device is also included, mounted on the frame, located between the power-on detection device and the molten metal device, the cutting device being used to cut the wire core to the required size.

[0017] In one embodiment, the molten metal device includes a lifting mechanism mounted on the frame, a metal heating furnace, and a tin-dipping spoon connected to the lifting mechanism. The lifting mechanism drives the tin-dipping spoon to reciprocate between the metal heating furnace and the connector assembly.

[0018] In one embodiment, the flux-immersing device includes a flux furnace mounted on the frame and a flux scoop connected to the lifting mechanism, wherein the lifting mechanism drives the flux scoop to reciprocate between the flux furnace and the joint assembly.

[0019] The technical solutions provided by the embodiments of the present invention can include the following beneficial effects: each clamping device fixes a digital electronic detonator, and the conveyor chain drives multiple clamping devices to move sequentially, so that each digital electronic detonator is processed step by step, resulting in good automatic processing effect. The wire stripping device, flux immersion device, and molten metal device sequentially strip the wires, immerse the connector assembly in flux, and immerse it in hot-melt molten metal, thereby completing the automated tinning effect and achieving high processing efficiency.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0022] Figure 1 This is a first-view structural schematic diagram of a tin-immersion apparatus according to an exemplary embodiment.

[0023] Figure 2 This is a second-view structural schematic diagram of a tin-immersion apparatus according to an exemplary embodiment.

[0024] Figure 3 This is a schematic diagram illustrating the structure of a digital electronic detonator mounted on a clamping device according to an exemplary embodiment.

[0025] Figure 4 This is a schematic diagram of the structure of a wire stripping device according to an exemplary embodiment.

[0026] Figure 5 This is a schematic diagram of the structure of a liquid metal device according to an exemplary embodiment.

[0027] Figure 6 This is a schematic diagram of a flux-immersing apparatus according to an exemplary embodiment.

[0028] Figure 7 This is a schematic diagram of the structure of a cutting device according to an exemplary embodiment.

[0029] Figure 8 This is a schematic diagram of the structure of an energization detection device according to an exemplary embodiment.

[0030] In the diagram, 10 is the frame; 11 is the pressing device; 12 is the tilting assembly; 13 is the unloading robot; 20 is the conveying device; 21 is the conveying chain; 22 is the conveying drive; 30 is the clamping device; 31 is the mounting frame; 32 is the support assembly; 33 is the rotating assembly; 331 is the positioning frame; 332 is the positioning groove; 40 is the wire stripping device; 41 is the pressing head assembly; 411 is the protrusion; 42 is the wire stripping assembly; 421 is the telescopic cylinder; 422 is the clamping drive; 423 is the sliding blade; 424 is the fixed blade; 50 is the flux dipping device; 51 is the flux furnace; and 52 is the flux spoon. 52; molten metal device; 60; metal heating furnace; 61; lifting mechanism; 62; tin dipping spoon; 63; sliding frame; 64; cutting device; 70; cutting drive component; 71; sliding shears; 72; fixed shears; cutting frame; 74; power-on detection device; 80; conductive component; 81; contact connector; 811; detection component; 82; visual inspection device; 90; camera component; 91; focusing component; 92; digital electronic detonator; 100; wire clip component; 101; conductive component; 1011; connector component; 102; wire core; 1021; cable; 103. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0032] like Figures 1 to 3As shown, this invention provides a device for tinning the core of a digital electronic detonator tail wire injection molding head, used to process the tinning of the terminals of a digital electronic detonator 100. The digital electronic detonator 100 includes a wire clamp assembly 101, a connector assembly 102, and a cable 103 connecting the wire clamp assembly 101 and the connector assembly 102. The wire clamp assembly 101 includes a junction box and two conductive parts 1011 located inside the junction box. The wires of the cable 103 are connected to the corresponding conductive parts 1011. The connector assembly 102 is located at the other end of the cable 103, and an injection molding head is injection molded on the outside of the cable 103, with the end of the wire protruding from the injection molding head.

[0033] After the digital electronic detonator 100 is assembled, a tin-plating process is performed on the connector assembly 102. In this invention, a device specifically designed for tin plating the connector assembly 102 is used. The tin-plating device includes a frame 10 and a conveying device 20 mounted on the frame 10. It has a circulating conveyor chain 21 and a conveying drive component 22 that drives the conveyor chain 21. Multiple clamping devices 30 are installed at intervals on the conveyor chain 21. The clamping devices 30 are used to fix the digital electronic detonator 100.

[0034] The frame 10 is a frame structure that supports the components on the tin-dipping equipment. The conveyor chain 21 is driven by the conveyor drive 22 to rotate cyclically, driving multiple clamping devices 30 to pass through different processing devices in turn, thereby realizing assembly line operation. Optionally, the conveyor chain 21 consists of two spaced transmission chains, and the clamping devices 30 are connected to the two transmission chains to achieve planar movement.

[0035] The clamping device 30 includes a mounting frame 31 fixed to the conveyor chain 21, a rotating component 33 rotatably mounted on one end of the mounting frame 31, and a support component 32 fixed to the other end of the mounting frame 31. The mounting frame 31 is connected to the conveyor chain 21 so that the clamping device 30 can be moved as a whole via the conveyor chain 21. Optionally, guide rollers are provided at the bottom of the mounting frame 31, and two parallel guide rails are mounted on the frame 10. The guide rollers slide between the two guide rails to improve the sliding stability of the mounting frame 31.

[0036] The rotating component 33 extends beyond the edge of the conveyor chain 21. The rotating component 33 is used to fix the connector assembly 102, and the support component 32 is used to fix the wire clamp assembly 101. The support component 32 and the rotating component 33 are located at both ends of the mounting bracket 31 and respectively define both ends of the digital electronic detonator 100, resulting in good positioning.

[0037] The rotating assembly 33 can be bent relative to the mounting bracket 31 under external force, thereby causing the connector assembly 102 to change direction, thus facilitating soldering operations on the connector assembly 102. Optionally, the rotating assembly 33 includes a rotating frame, a positioning frame 331 fixed to the rotating frame, and a spring connecting the rotating frame and the mounting bracket 31. The positioning frame 331 has a positioning groove 332, and the connector assembly 102 is confined within the positioning groove 332. Further, the positioning groove 332 is configured with a limiting groove that matches the injection head to prevent the injection head from being pulled out.

[0038] like Figures 3 to 6 As shown, different processing devices for different processes and functions are installed on the frames 10 on both sides of the conveying device 20. The tin-immersion equipment includes a wire stripping device 40, a flux immersion device 50, and a liquid metal device 60 arranged sequentially and at intervals along the transmission direction of the conveying device 20. The wire stripping device 40 is used to strip the protective layer of the cable 103 of the connector assembly 102 and expose the wire core 1021. The flux immersion device 50 moves up and down to wet the wire core 1021. The liquid metal device 60 moves up and down to plate a conductive metal layer on the surface of the wire core 1021.

[0039] The wire stripping device 40 peels off the protective layer from the end of the wire extending from the rotating assembly 33, exposing the internal metal core 1021. This exposed portion of the core 1021 is the part that needs to be plated with a metal conductive layer. Optionally, this metal conductive layer is a tin layer.

[0040] The wire stripping device 40 can remove the protective layer by cutting or clamping. In one embodiment, the wire stripping device 40 includes a pressure head assembly 41 and a wire stripping assembly 42 mounted on the frame 10. The pressure head assembly 41 moves vertically relative to the frame 10, and the rotating assembly 33 is located in the vertical movement direction of the pressure head assembly 41. Specifically, the pressure head assembly 41 moves towards the rotating assembly 33 and presses against the cable 103 to keep the cable 103 separate.

[0041] Optionally, the pressure head assembly 41 is mated with the rotating assembly 33. For example, the pressure head assembly 41 is pressed against the positioning frame 331 to press the connector assembly 102 into the positioning groove 332. Further, the pressure head assembly 41 is provided with a protrusion 411, the end face of which has a clearance groove. The protrusion 411 is inserted into the positioning groove 332 to further press against the connector assembly 102, preventing the connector assembly 102 from moving under the pulling force of the wire stripping assembly 42.

[0042] The wire stripping assembly 42 includes a stripping frame and a clamping assembly slidably connected to the stripping frame. The connector assembly 102 is located in the sliding direction of the clamping assembly. The stripping frame is fixed to the frame 10, and the clamping assembly slides relative to the connector assembly 102, clamping the protective layer outside the stripped wire. The clamping portion of the clamping assembly has a cutting edge to cut the protective layer and peel it off after the clamping assembly moves. Optionally, the sliding direction of the clamping assembly intersects the lifting direction of the pressure head assembly 41; specifically, the sliding direction of the clamping assembly and the lifting direction of the pressure head assembly 41 are perpendicular to each other.

[0043] In an optional embodiment, the clamping assembly includes a telescopic cylinder 21, a clamping drive 422 mounted on the telescopic cylinder 21, a fixed blade 423 mounted on the clamping drive 422, and a sliding blade 423 slidably connected to the clamping drive 422. The sliding blade 423 moves closer to or further away from the fixed blade 423 under the drive of the clamping drive 422.

[0044] In an optional embodiment, the tin-dip equipment further includes a pre-pressing device located in front of the wire stripping device 40. The pre-pressing device pre-presses the connector assembly 102 into the positioning groove 332 by telescopic movement to maintain the accurate assembly position of the connector assembly 102 and the rotating assembly 33.

[0045] In one embodiment, the tin-dipping equipment further includes a pressing device 11 located between the wire stripping device 40 and the flux-dipping device 50. The pressing device 11 volutes the rotating assembly 33 to rotate. The pressing device 11 drives the rotating frame to rotate and bend relative to the mounting frame 31 so that the wire core 1021 of the connector assembly 102 faces a first direction, and the flux-dipping device 50 moves up and down parallel to the first direction. Specifically, the rotating frame is pressed down so that the connector assembly 102 faces downward. The flux-dipping device 50 moves upward so that flux adheres to the surface of the wire core 1021 of the connector assembly 102. In a specific embodiment, the pressing device 11 includes a pressing cylinder and a pressing head mounted on the pressing cylinder. The pressing head pushes the rotating frame to rotate under the drive of the pressing cylinder.

[0046] After the connector assembly 102 faces downwards, flux is applied. A lifting mechanism 62 is installed on the frame 10. The flux immersion device 50 includes a flux furnace 51 mounted on the frame 10 and a flux scoop 52 connected to the lifting mechanism 62. The lifting mechanism 62 drives the flux scoop 52 to reciprocate between the flux furnace 51 and the connector assembly 102. The flux in the flux furnace 51 remains liquid. The flux scoop 52 is immersed in the flux furnace 51 by the lifting mechanism 62 to scoop up the flux. The lifting mechanism 62 continues to raise the flux scoop 52 until the wire core 1021 of the connector assembly 102 is immersed in the flux in the flux scoop 52. The lifting mechanism 62 then lowers the flux scoop 52 to move the connector assembly 102 away from the flux immersion device 50.

[0047] The conveying device 20 moves the clamping device 30 above the molten metal device 60. In one embodiment, the molten metal device 60 includes a metal heating furnace 61 and a soldering ladle 63 connected to a lifting mechanism 62. The lifting mechanism 62 drives the soldering ladle 63 to reciprocate between the metal heating furnace 61 and the connector assembly 102. The metal heating furnace 61 heats and maintains the temperature to keep the molten metal in the metal heating furnace 61 in a stable molten state. The soldering ladle 63 is immersed in the metal heating furnace 61 under the drive of the lifting mechanism 62 to scoop up the molten metal. The lifting mechanism 62 continues to drive the soldering ladle 63 upward until the wire core 1021 of the connector assembly 102 is immersed in the molten metal in the soldering ladle 63. The lifting mechanism 62 then drives the soldering ladle 63 downward to move the connector assembly 102 away from the soldering ladle 63.

[0048] Preferably, the tin-dipping spoon 63 and the flux spoon 52 are both connected to the same sliding frame 64 of the lifting mechanism 62 for synchronous movement. Accordingly, the spacing between two adjacent clamping devices 30 on the conveyor chain 21 is adapted to the spacing between the tin-dipping spoon 63 and the flux spoon 52 to achieve synchronous movement, which simplifies the structure and ensures high synchronization.

[0049] After the tinning process of connector assembly 102 is completed, it needs to be flipped back to a horizontal position. The tinning equipment also includes an upward-flipping assembly 12 mounted on the frame 10, located behind the molten metal device 60 in the conveying direction of the conveying device 20. The upward-flipping assembly 12 moves to drive the rotating assembly 33 to flip, so that the wire core 1021 of connector assembly 102 faces the horizontal direction.

[0050] The upward-flipping assembly 12 drives the rotating frame to rotate and bends relative to the mounting frame 31, so that the wire core 1021 of the connector assembly 102 is in a horizontal state. Specifically, the upward-flipping assembly 12 drives the rotating frame to flip upward, so that the connector assembly 102 is in a horizontal state. In a specific embodiment, the upward-flipping assembly 12 includes an upward-flipping frame that fixes the frame 10, an upward-flipping crankshaft rotatably connected to the upward-flipping frame, and an upward-flipping cylinder connecting the frame 10 and one end of the upward-flipping crankshaft. The other end of the upward-flipping crankshaft is configured as a curved surface. The upward-flipping cylinder extends to push the upward-flipping crankshaft to rotate, and the upward-flipping crankshaft pushes the mounting frame 31 to elastically reset.

[0051] like Figures 7 to 8As shown, the wire core 1021 has a pre-existing length exceeding the design length before tinning to meet tinning requirements and improve tinning quality. After the clamping device 30, having completed the tinning operation, is reset via the flip-up assembly 12, the tinning equipment needs to trim the wire core 1021 of the connector assembly 102 to conform to the design length. The tinning equipment also includes a trimming device 70 mounted on the frame 10, used to trim the dimensions of the wire core 1021. After completing the tinning process, the trimming device 70 trims off any excess wire core 1021.

[0052] In an optional embodiment, the cutting device 70 includes a cutting frame 74 and a cutting assembly mounted on the cutting frame 74, the cutting assembly being located in the direction of movement of the connector assembly 102. The cutting frame 74 is fixed to the frame 10, and the cutting assembly closes relative to the connector assembly 102 to cut off excess wire core 1021. The clamping portion of the cutting assembly has a blade to cut the wire core 1021. In a specific embodiment, the cutting assembly includes a cutting drive 71, a fixed shear 73 mounted on the cutting drive 71, and a sliding shear 72 slidably connected to the cutting drive 71, the sliding shear 72 moving closer to or further away from the fixed shear 73 under the drive of the cutting drive 71. In the initial state, the fixed shear 73 and the sliding shear 72 are relatively separated, allowing the excess wire core 1021 to move into the space between the fixed shear 73 and the sliding shear 72.

[0053] After the excess wire core 1021 is trimmed, the tinning effect and overall conductivity of the digital electronic detonator 100 need to be tested to meet the detonation conductivity requirements of the electronic detonator. The tinning equipment also includes a power-on detection device 80 mounted on the rack 10, which is used to test the power-on of the wire clamp assembly 101 and the connector assembly 102. The trimming device 70 is located between the power-on detection device 80 and the molten metal device 60, so that the trimmed clamping device 30 can be moved to the corresponding station of the power-on detection device 80.

[0054] In an optional embodiment, the power-on detection device 80 includes a conductive component 81 and a detection component 82 located on opposite sides of the conveying device 20, respectively, and the conductive component 81 and the detection component 82 are respectively mounted on the frame 10. The detection component 82 is connected to contact terminals 811 of the positive and negative terminals of the power supply, and the contact terminals 811 respectively connect to two conductive elements 1011 within the wire clamp assembly 101 to achieve a conductive connection.

[0055] The conductive component 81 presses together the two wire cores 1021 of the connector assembly 102 mounted on the rotating component 33 to conduct electricity, thus putting them in a conductive state. The detection component 82 conducts the two wire cores 1021 when energized to achieve online monitoring, resulting in good automated monitoring performance.

[0056] like Figures 1 to 3 As shown, the digital electronic detonator 100 can be directly discharged after completing the power-on test for storage or transfer. After the power-on test, the digital electronic detonator 100 can also undergo further online monitoring of the appearance of the injection head and wire core 1021 to further improve the pass rate of the digital electronic detonator 100. The tin-dipping equipment also includes a vision inspection device 90 installed on the frame 10. The vision inspection device 90 is located behind the power-on test device 80 in the conveying direction of the conveying device 20. The vision inspection device 90 is used to inspect the outer contour of the connector assembly 102. The vision inspection device 90 includes a camera assembly 91 and a control module connected to the camera assembly 91. The control module uses a built-in program to determine whether the image information captured by the camera assembly 91 meets the tolerance requirements of the injection head and wire core 1021, thereby improving the stability of the digital electronic detonator 100.

[0057] Optionally, the visual inspection device 90 includes an adjustable frame mounted on the rack 10, a camera assembly 91 mounted on top of the adjustable frame, and a rotating assembly 33 located within the field of view of the camera assembly 91. Further, the visual inspection device 90 includes a focusing element 92 mounted on the adjustable frame, the focusing element 92 having a through hole in the center. The optical axes of the rotating assembly 33, the through hole, and the camera assembly 91 are aligned. The camera assembly 91 captures image information of the connector assembly 102 on the rotating assembly 33 through the through hole, thereby reducing interference from other factors and ensuring accurate data acquisition and analysis.

[0058] Furthermore, after the visual inspection device 90 completes the inspection, the tin-dipping equipment also includes a material unloading robot device 13, which picks up the digital electronic detonator 100 from the clamping device 30 and disengages it so that the clamping device 30 moves with the conveying device 20 to the next cycle.

[0059] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0060] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A device for tinning the injection-molded core of a digital electronic detonator tail wire, used for tinning the terminals of a digital electronic detonator, wherein the digital electronic detonator includes a wire clamp assembly, a connector assembly, and a cable connecting the wire clamp assembly and the connector assembly, characterized in that... The digital electronic detonator tail wire injection molding head core tinning equipment includes: A frame and a conveyor mounted on the frame, the conveyor having a continuously rotating conveyor chain; Multiple clamping devices are installed at intervals on the conveyor chain. Each clamping device includes a mounting frame fixed to the conveyor chain, a rotating component rotatably mounted on one end of the mounting frame, and a support component fixed on the other end of the mounting frame. The rotating component extends beyond the edge of the conveyor chain and is used to fix the connector assembly. The support component is used to fix the wire clamp assembly. A wire stripping device, a flux immersion device, and a molten metal device are installed on the frame and arranged sequentially at intervals along the conveying direction of the conveying device. The wire stripping device is used to strip the protective layer of the cable of the connector assembly and expose the wire core. The flux immersion device moves up and down to wet the wire core. The molten metal device moves up and down to plate a conductive metal layer on the surface of the wire core. The wire stripping device includes a pressure head assembly and a wire stripping assembly mounted on the frame. The pressure head assembly moves up and down relative to the frame. The rotating assembly is located in the direction of the up and down movement of the pressure head assembly. The wire stripping assembly includes a wire stripping frame and a clamping assembly slidably connected to the wire stripping frame. The connector assembly is located in the sliding direction of the clamping assembly. The equipment also includes a pressing device located between the wire stripping device and the flux dipping device. The pressing device voluntarily drives the rotating assembly to flip, so that the wire core of the connector assembly faces a first direction, and the flux dipping device moves up and down parallel to the first direction.

2. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 1, characterized in that, It also includes an upward tilting assembly installed on the frame, which is located behind the molten metal device in the conveying direction of the conveying device. The upward tilting assembly movably pushes the rotating assembly to tilt, and the wire core of the connector assembly faces the horizontal direction.

3. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 1, characterized in that, It also includes an electrical detection device installed on the frame, which is located behind the molten metal device in the conveying direction of the conveying device, and is used to detect the electrical connection of the wire clamp assembly and the connector assembly.

4. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 3, characterized in that, The power-on detection device includes a conductive component and a detection component located on opposite sides of the conveying device. The conductive component presses and conducts two wire cores of the connector component installed on the rotating component. The detection component is electrically connected to the wire clamp component installed on the support component.

5. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 3, characterized in that, It also includes a vision inspection device mounted on the frame, which is located behind the power-on detection device in the conveying direction of the conveying device, and is used to inspect the outer contour of the connector assembly.

6. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 3, characterized in that, It also includes a cutting device installed on the frame, the cutting device being located between the power-on detection device and the molten metal device, the cutting device being used to cut the size of the wire core.

7. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 1, characterized in that, The molten metal device includes a lifting mechanism installed on the frame, a metal heating furnace, and a tin-dipping spoon connected to the lifting mechanism. The lifting mechanism drives the tin-dipping spoon to reciprocate between the metal heating furnace and the connector assembly.

8. The equipment for tinning the core of the injection-molded head of a digital electronic detonator tail wire according to claim 7, characterized in that, The flux-immersing device includes a flux furnace mounted on the frame and a flux scoop connected to the lifting mechanism. The lifting mechanism drives the flux scoop to reciprocate between the flux furnace and the joint assembly.

Images