Workpiece machining device

Abstract

The present invention provides a workpiece processing device capable of checking a previously finished region of a workpiece and processing a next processing scheduled region of the workpiece. The workpiece processing device of the present invention includes: a workpiece holding section that positions and holds a workpiece so that a center axis of the workpiece and a reference axis set in advance become coaxial; a surface processing section that sets a finished region by performing surface processing on an outer peripheral surface of the workpiece held by the workpiece holding section; a checking section that is arranged so as to have a circumferential phase difference of an imaginary circle defined with the reference axis as a center with respect to the surface processing section, and that checks whether the finished region of the workpiece is set to satisfy a reference condition set in advance by photographing the finished region of the outer peripheral surface of the workpiece; and a relative rotation section that relatively rotates the workpiece and the surface processing section and the checking section that maintain the circumferential phase difference with the reference axis as a center.

Description

Technical Field

[0001] This invention relates to a workpiece processing apparatus for machining the outer peripheral surface of a workpiece. Background Technology

[0002] As a laser processing apparatus for laser processing and inspecting workpieces, a laser processing apparatus has been proposed (for example, see Patent Document 1) comprising: a plurality of worktables configured to move independently of each other along a first direction; a processing unit configured to move along a second direction orthogonal to the first direction to process a first workpiece held on one of the plurality of worktables; and an inspection unit configured to move independently of the processing unit along the second direction to inspect a second workpiece held on the other of the plurality of worktables. For example, in the case of laser processing and inspection of multiple areas of a workpiece using the laser processing apparatus described in Patent Document 1, firstly, the processing unit is positioned near a predetermined worktable on which the workpiece to be processed is placed, and all multiple areas of the workpiece to be processed are laser processed. Then, the processing unit is moved to another position, and the inspection unit is positioned near a predetermined worktable on which the workpiece to be processed is placed, and all multiple processed areas of the workpiece are inspected.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-061280 Summary of the Invention

[0006] Technical issues

[0007] Even if a defect exists in only one of the multiple processed areas of a workpiece, the workpiece is treated as unqualified during inspection. However, in the laser processing apparatus described in Patent Document 1, even if a defect occurs during intermediate laser processing, the defect can only be identified through subsequent inspection, thus continuously processing all multiple areas of the workpiece with lasers. That is, regardless of whether a defect occurs during intermediate laser processing, the laser processing apparatus described in Patent Document 1 continuously processes all multiple areas of the workpiece with lasers, resulting in poor processing efficiency.

[0008] In view of the actual situation, the present invention provides a workpiece processing apparatus capable of inspecting the current previously completed processing area of ​​a workpiece and processing the next predetermined processing area of ​​the workpiece.

[0009] Technical solution

[0010] The workpiece processing apparatus of the present invention is characterized in that it processes the outer peripheral surface of a workpiece about a central axis. The workpiece processing apparatus includes: a workpiece holding section, which positions and holds the workpiece such that the central axis of the workpiece is coaxial with a predetermined reference axis; a surface processing section, which performs surface processing on the outer peripheral surface of the workpiece held by the workpiece holding section to form a processed area; an inspection section, which is configured to have a circumferential phase difference with respect to the surface processing section when an imaginary circle centered on the reference axis is defined, and the inspection section takes pictures of the processed area of ​​the outer peripheral surface of the workpiece and checks whether the processed area is set to meet a predetermined reference condition; and a relative rotation section, which rotates the workpiece relative to the surface processing section and the inspection section, which maintain the circumferential phase difference, about the reference axis.

[0011] Furthermore, in the workpiece processing apparatus of the present invention, the surface processing unit provides a plurality of processed areas at different positions in the circumferential direction of the outer peripheral surface of the workpiece. When the phase difference in the circumferential direction of the plurality of processed areas adjacent in the circumferential direction is defined as the phase difference of the processed area, the circumferential phase difference between the surface processing unit and the inspection unit is the same as the phase difference of the processed area, or is an integer multiple of the phase difference of the processed area.

[0012] Furthermore, in the workpiece processing apparatus of the present invention, whenever the workpiece is rotated relative to the relative rotation unit by an angle corresponding to the phase difference of the processed area, the surface processing unit performs surface processing on the outer peripheral surface of the workpiece to set the processed area, and the inspection unit takes pictures of the processed area set earlier than the period when the surface processing unit sets the processed area and checks whether the processed area is set to meet the reference condition.

[0013] In addition, the workpiece processing apparatus of the present invention also includes an air supply unit that supplies air to the area of ​​the outer peripheral surface of the workpiece that is surface-processed by the surface processing unit or the area near it.

[0014] Furthermore, in the workpiece processing apparatus of the present invention, the flow direction of the air blown by the air supply unit is set to leave the shooting area, which is sandwiched between the inspection unit and the workpiece and is used to shoot the processed area.

[0015] In addition, the workpiece processing apparatus of the present invention also includes a dust collection unit, which collects dust from debris blown away by the air supply unit during surface processing performed by the surface processing unit.

[0016] In addition, the workpiece processing apparatus of the present invention further includes: a conveying device that conveys the workpiece to the workpiece holding portion; and an inspection device disposed upstream of the conveying path of the conveying device for performing an appearance inspection of the outer peripheral surface of the workpiece.

[0017] Furthermore, in the workpiece processing apparatus of the present invention, the workpiece is a valve seat. Additionally, in the workpiece processing apparatus of the present invention, the workpiece holding portion holds the valve seat.

[0018] In addition, the workpiece processing apparatus of the present invention also includes a phase difference changing mechanism, which changes the circumferential phase difference by changing the relative position of the surface processing part and the inspection part.

[0019] In addition, the workpiece processing apparatus of the present invention also includes a rotary table, which changes the circumferential phase difference by rotating the surface processing section and / or the inspection section about the reference axis.

[0020] Technical effect

[0021] According to the workpiece processing apparatus of the present invention, it is possible to produce the excellent effect of being able to inspect the current previously processed areas of the workpiece and process the next predetermined processing area of ​​the workpiece. Attached Figure Description

[0022] Figure 1 This is a front view of the valve seat processing device in the first embodiment of the present invention.

[0023] Figure 2 This is a top view of the valve seat processing device in the first embodiment of the present invention.

[0024] Figure 3 (A) is a perspective view of the valve seat retaining portion according to the first embodiment of the present invention. Figure 3 (B) is a top view of the valve seat retaining portion in the first embodiment of the present invention.

[0025] Figure 4 (A) Figure 4 (B) is a cross-sectional view of the valve seat holding part in the first embodiment of the present invention, showing the valve seat holding parts that operate in chronological order; Figure 4 (C) Figure 4 (D) is a top view of the valve seat holding part in the first embodiment of the present invention, which are valve seat holding parts arranged in chronological order to operate in a manner that presses and holds the valve seat from the inner circumferential surface side of the valve seat; Figure 4 (E) Figure 4(F) is a top view of the valve seat holding part in the first embodiment of the present invention, which is arranged in chronological order to operate in a manner that presses and holds the valve seat from the outer peripheral surface side of the valve seat.

[0026] Figure 5 (A) Figure 5 (B) are top views of a modified example of the valve seat retaining portion in the first embodiment of the present invention.

[0027] Figure 6 (A) is a top view of a portion of the area surrounding the valve seat holding part of the valve seat processing apparatus in the first embodiment of the present invention. Figure 6 (B) is an enlarged view of the vicinity of the valve seat holding part and the air supply part of the valve seat processing device in the first embodiment of the present invention.

[0028] Figure 7 (A) is a perspective view of a valve seat processed by the valve seat processing apparatus according to the first embodiment of the present invention. Figure 7 (B) is the GG-direction view of (A).

[0029] Figure 8 This is a top view of the rough surface region of the valve seat in the first embodiment of the present invention.

[0030] Figure 9 This is a variation of the valve seat processing apparatus in the first embodiment of the present invention.

[0031] Figure 10 This diagram illustrates how the relative position of the laser irradiation section to the inspection section is changed by the phase difference changing mechanism of the valve seat processing apparatus in the first embodiment of the present invention.

[0032] Figure 11 (A) Figure 11 (D) is a diagram showing, in chronological order, the state of the valve seat processing apparatus of the first embodiment of the present invention, in which a rough surface region is provided on the valve seat and the rough surface region is inspected.

[0033] Figure 12 (A) Figure 12 (D) is a diagram showing, in chronological order, variations of the valve seat processing apparatus according to the first embodiment of the present invention, in which a rough surface region is provided on the valve seat and the rough surface region is inspected.

[0034] Figure 13 This is a top view of the valve seat processing device in the second embodiment of the present invention.

[0035] Figure 14(A) is a top view showing the passage area of ​​the laser irradiation section and the inspection section of the valve seat processing apparatus according to the second embodiment of the present invention. Figure 14 (B) is a front view showing the passage area of ​​the laser irradiation section and the inspection section of the valve seat processing apparatus in the second embodiment of the present invention.

[0036] Symbol Explanation

[0037] 1 Valve seat machining device

[0038] 2 Valve seat retaining part

[0039] 2A Reference Axis

[0040] 3. Laser Processing Department

[0041] 4. Inspection Department

[0042] 5. Relative rotating parts

[0043] 6. Air Supply Department

[0044] 7. Dust Collection Department

[0045] 8. Phase difference changing mechanism

[0046] 9. Control Department

[0047] 30 Laser Irradiation Section

[0048] 31 Laser Control Department

[0049] 40 Filming Department

[0050] 41 Analysis Department

[0051] 42 Judgment Department

[0052] 50 Shaft

[0053] 51 Shaft-side rotating part

[0054] 55 Rotary Table

[0055] 56 Rotary Table Drive Unit

[0056] 57 Rotating side rotating part

[0057] 58 Radial extension

[0058] 60 Air supply source

[0059] 61 Air supply duct

[0060] 62. Air supply side valve

[0061] 70 Dust Collection Main Body

[0062] 71 Dust Collection Pipe

[0063] 100 Valve Seat

[0064] 101 Outer Peripheral Surface

[0065] 102 Uneven parts

[0066] 103 Rough surface region

[0067] 300 Inspection Device

[0068] K Imaginary Circle

[0069] L valve seat circumferential direction

[0070] M valve seat center axis direction

[0071] R1 laser passes through the area

[0072] R2 shooting area

[0073] S Processing Pre-determined Area

[0074] θ circumferential phase difference Detailed Implementation

[0075] The workpiece processing apparatus of the present invention processes a predetermined processing area on the outer peripheral surface of a workpiece around a central axis. The predetermined processing area is processed by the workpiece processing apparatus to become a processed area. In an embodiment of the present invention, the workpiece is a valve seat 100, and the processed area of ​​the outer peripheral surface 101 of the valve seat 100 around the central axis 104 is a rough surface area 103 with uneven portions 102 (see reference). Figure 7 The workpiece processing apparatus described herein is a valve seat processing apparatus 1. However, the workpiece is not limited to the valve seat 100; for example, it may be any of the following: an annular body, a disc-shaped body, a plate-shaped body, a columnar body, a cylindrical body, or a structure formed by combining the above workpieces. Furthermore, the processing method for processing the predetermined area is not limited to the method of setting the rough surface area 103; all other processing methods are also included within the scope of this invention.

[0076] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figures 1 to 14 This is an example of a method of implementing the invention. In the figure, it is marked with... Figure 1 and Figure 2 The same symbol indicates the same thing.

[0077] <First Implementation>

[0078] The following is mainly based on Figure 1 and Figure 2The valve seat processing apparatus 1 according to the first embodiment of the present invention will be described. In this embodiment, the valve seat processing apparatus 1 has a rough surface region 103 with uneven portions 102 provided on the outer peripheral surface 101 of the valve seat 100 (see reference). Figure 7 Furthermore, although the valve seat processing device 1 in this embodiment is set to be located, for example, in the final process downstream of the visual inspection process on the manufacturing line of the valve seat 100, it is not limited to this and may also be located in a process upstream of the final process.

[0079] The valve seat processing apparatus 1 in this embodiment includes a valve seat holding part (workpiece holding part) 2, a surface processing part (laser processing part) 3, an inspection part 4, a relative rotation part 5, an air supply part 6, a dust collection part 7, a phase difference changing mechanism 8, a control part 9, an operation part 10, a display 11, and a housing 12 that houses all the above parts. In addition, the valve seat processing apparatus 1 includes a conveying device (not shown), which moves the valve seat 100 relative to the valve seat holding part 2 by passing it inside and outside the housing 12.

[0080] It should be noted that, for ease of explanation in the following description, an imaginary space is defined with the height direction of the housing 12 as the Z-axis direction, the width direction of the housing 12 as the X-axis direction, and the depth direction of the housing 12 as the Y-axis direction, and these are used appropriately in the description.

[0081] like Figure 1 As shown, the housing 12 has three receiving sections (first receiving section 120, second receiving section 121, and third receiving section 122) along its height direction (Z-axis direction). The first receiving section 120, located in the middle layer along the height direction of the housing 12, houses the valve seat holding section 2, a portion of the laser processing section 3 (laser irradiation section 30), the inspection section 4, the relative rotation section 5, the air supply pipe 61 of the air supply section 6, the dust collection pipe 71 of the dust collection section 7, the phase difference changing mechanism 8, and the valve seat detection section 29. A portion of the side of the first receiving section 120 (in...) Figure 1 The side of the paper (near the front) opens to the outside, through which the valve seat 100 is moved in and out. Additionally, as... Figure 2 As shown, the first receiving portion 120 has a laser-passing area R1 and an imaging area R2 inside. The laser-passing area R1 allows the laser to pass through when the laser processing unit 3 irradiates the outer peripheral surface 101 of the valve seat 100 with a laser. The imaging area R2 is used by the inspection unit 4 to image the rough surface area 103 provided on the outer peripheral surface 101 of the valve seat 100. Laser processing and inspection processing (imaging processing) of the outer peripheral surface 101 of the valve seat 100 are performed through the laser-passing area R1 and the imaging area R2 of the first receiving portion 120.

[0082] In addition, such as Figure 1As shown, the second housing section 121 at the lowest level in the height direction of the housing 12 houses the air supply source 60 of the air supply section 6, the dust collection body 70 of the dust collection section 7, and the remaining part of the laser processing section 3 (laser control section 31). The third housing section 122 at the highest level in the height direction of the housing 12 houses the control section 9 that controls each part, the operation section 10 that receives various operations, and the display 11 that displays various data and / or information related to the operation.

[0083] <Valve seat holding part (workpiece holding part)>

[0084] Main reference Figure 3 and Figure 4 The valve seat holding part (workpiece holding part) 2 will be described. The valve seat holding part 2 positions and holds the valve seat 100 such that its central axis 104 is coaxial with a pre-set reference axis 2A. It should be explained that, for example... Figure 1 and Figure 3 As shown in (A), the reference axis 2A is parallel to the Z-axis direction. Figure 3 As shown in (A), the valve seat holding part 2 has, for example, three chuck plates 20 that radially support the valve seat 100 from three directions along a plane parallel to the XY plane, and a chuck plate moving mechanism 21.

[0085] like Figure 3 As shown in (A), the chuck plate 20 has: a mounting platform 22 having a mounting surface 22A for mounting the valve seat 100 on its upper surface side in the Z-axis direction; and a protrusion 23 that protrudes from the mounting surface 22A toward the upper side in the Z-axis direction. The mounting platform 22 and the protrusion 23 can be separate components or integrally formed. In the case of separate components, the protrusion 23 is mounted on the mounting platform 22.

[0086] like Figure 3 As shown in (B), when an imaginary circle K centered on the reference axis 2A is defined on a plane parallel to the XY plane, each mounting platform 22 is arranged on the chuck moving mechanism 21 such that the angles formed by the radially extending center lines 22C of adjacent mounting platforms 22 at equal distances from the reference axis 2A in the radial direction of the imaginary circle K are equal (120°). As a result, as... Figure 3 As shown in (B), on a plane parallel to the XY plane, the circumscribed circle that is externally tangent to each protrusion 23 of each mounting platform 22 becomes a circle centered on the reference axis 2A.

[0087] The chuck movement mechanism 21 is configured to enable the three chuck plates 20 to move simultaneously back and forth in the radial direction of the imaginary circle K. For example... Figure 4 (A) Figure 4As shown in (B), for example, the chuck plate moving mechanism 21 includes: a cylinder 25; a piston 26 capable of reciprocating within the cylinder 25 along the Z-axis; a cam 27 capable of reciprocating along the Z-axis following the piston 26; a stop 27A; three moving plates 27B that can be pressed by the cam 27 and moved radially outward from the imaginary circle K; a pressure supply section (not shown) that supplies pressure to the cylinder 25; and a chuck plate guide section 28.

[0088] The cam 27 is configured such that, when advancing along the Z-axis, it simultaneously presses down on the three movable plates 27B from below the three chuck plates 20 in the Z-axis direction, causing the three movable plates 27B to move radially outward from the imaginary circle K. Each of the three movable plates 27B is fixed with a chuck plate 20. It should be noted that the movable plates 27B and the chuck plates 20 can be separate components or integrally formed. Furthermore, the chuck plates 20 move together with the movable plates 27B. The chuck plate guide 28 guides the movable plates 27B radially along the imaginary circle K. The pressure supply unit, for example, includes an air compressor, which supplies air to the cylinder 25 through an air supply pipe on the piston advance side and an air supply pipe on the piston retraction side. It should be noted that the pressure supply unit may also apply pressure using fluid instead of air.

[0089] If pressure is supplied from the pressure supply unit to the cylinder 25 in a manner that causes the piston 26 to advance along the Z-axis, the cam 27 also advances along with the piston 26, simultaneously pressing the three movable plates 27B, thereby moving them radially outward along the chuck guide 28 towards the imaginary circle K. A stop 27A is positioned in front of the cam 27 in its direction of travel. The cam 27 advances until its front end reaches the stop 27A. Conversely, if pressure is supplied from the pressure supply unit to the cylinder 25 in a manner that causes the piston 26 to retract, the cam 27 also retracts along with the piston 26. At this time, the three movable plates 27B move simultaneously radially inward along the chuck guide 28 towards the imaginary circle K via a (not shown) return mechanism, returning to their initial positions.

[0090] In addition, such as Figure 1 and Figure 2 As shown, a valve seat detection unit 29 is arranged around the valve seat holding part 2. The valve seat detection unit 29 detects whether the valve seat 100 is held in the valve seat holding part 2. If the valve seat detection unit 29 does not detect that the valve seat 100 is held, the laser processing part 3 and the inspection part 4, which will be described later, are controlled by the control unit 9 to not operate.

[0091] <The holding action of the valve seat in the valve seat holding section>

[0092] Next, refer to Figure 4 (C)~ Figure 4(F) will now explain the holding operation of the valve seat 100 in the valve seat holding section 2. First, as... Figure 4 As shown in (C), the chuck plate moving mechanism 21 positions the three chuck plates 20 such that the valve seat 100 can be placed on the mounting surface 22A, which is radially outer of the protrusions 23 of the three chuck plates 20 (the diameter of the circumscribed circle of the three protrusions 23 centered on the reference axis 2A is smaller than the inner diameter of the valve seat 100). In this state, the valve seat 100 is positioned such that it is placed on the mounting surface 22A of each of the three mounting platform portions 22.

[0093] Next, the chuck plate moving mechanism 21 is used to move the three chuck plates 20 radially outward from the imaginary circle K (refer to...). Figure 4 Move in the direction of the arrow (C). During movement, such as... Figure 4 As shown in (D), the protrusions 23 of each of the three chuck plates 20 contact the inner peripheral surface 105 of the valve seat 100, pressing the inner peripheral surface 105 of the valve seat 100 in three directions from the inside to the outside. Furthermore, the circumscribed circles of the protrusions 23 of each of the three chuck plates 20 are centered on the reference axis 2A. Therefore, when the three protrusions 23 press the valve seat 100 from three directions, the valve seat 100 becomes centered with reference to the reference axis 2A, and the central axis 104 of the valve seat 100 is coaxial with the reference axis 2A. Thus, if the chuck plates 20 support the inner peripheral surface 105 of the valve seat 100, the entire outer peripheral surface 101 of the valve seat 100 is opened. Therefore, when processing is performed by the laser processing unit 3 described later, the chuck plates 20, including the protrusions 23, will not become an obstacle, thereby increasing the degree of freedom in processing. In addition, the airflow along the outer peripheral surface 101 formed by the air supply section 6 described later will not stagnate, thus preventing dust from being trapped on the outer peripheral surface 101 (chuck plate 20) of the valve seat 100 during processing.

[0094] It should be noted that, as described above, the valve seat 100 is positioned by pressing the protrusion 23 against the inner circumferential surface 105 of the valve seat 100 to center it. However, this invention is not limited to this method; other methods may also be used. Figure 4 (E) Figure 4 As shown in (F), after the valve seat 100 is placed on the mounting platform 22 with the three chuck plates 20 positioned such that the diameter of the inscribed circle of the three protrusions 23 centered on the reference axis 2A is larger than the outer diameter of the valve seat 100, the valve seat 100 is centered by moving the chuck plates 20 radially inward toward the imaginary circle K and pressing the outer peripheral surface 101 of the valve seat 100 in three directions, thereby positioning the valve seat 100.

[0095] The length of the mounting platform 22 of the chuck plate 20 along its long side, the position of the protrusion 23 on the mounting surface 22A, the shape of the protrusion 23, and the range of movement of the chuck plate 20 in the chuck plate moving mechanism 21 can be set in various ways depending on the outer or inner diameter of the valve seat 100. Furthermore, the valve seat holding part 2 can also be configured to have a changing mechanism that can change the position of the protrusion 23 along the mounting surface 22A. If configured in this way, for example, it is possible to... Figure 4 (C) Figure 4 The convex portion 23 at position (D) is changed to Figure 4 (E) Figure 4 The position shown in (F).

[0096] Alternatively, it can be like Figure 5 As shown in (A), the valve seat holding portion 2 is configured to have a base portion 200 and an air intake portion (not shown), the base portion 200 having a plurality of holes 201. Assuming that the valve seat 100 is placed on the base portion 200, the plurality of holes 201 are arranged below the valve seat 100 and along the shape of the valve seat 100. It should be noted that it can also be as follows... Figure 5 As shown in (A), multiple sets of holes 201 are arranged according to the diameter of the valve seat 100, with a first set 203A and a second set 203B. The first set 203A is arranged corresponding to valve seats 100 with a first diameter, and the second set 203B is arranged corresponding to valve seats 100 with a second diameter. An air intake section (not shown) generates an air intake flow through the multiple holes 201. The air intake section (not shown) may also be configured to generate an air intake flow according to different sets of the multiple holes 201. If the valve seat holding section 2 is configured as described above, the valve seat 100 is held in the base section 200 by air adsorption. It should be noted that the valve seat holding section 2 may also be other structures that use air adsorption to hold the valve seat 100 in the base section 200.

[0097] Alternatively, it can be like Figure 5 As shown in (B), the valve seat holding portion 2 is configured to have a base portion 200 and a magnetic force generating portion (not shown) that generates magnetic force in a predetermined region of the base portion 200. Assuming that the valve seat 100 is placed on the base portion 200, the magnetic force generating portion (not shown) generates magnetic force only in an annular region located below the valve seat 100 and along the shape of the valve seat 100. The center of this annular region coincides with the reference axis 2A. Figure 5 As shown in (B), multiple annular regions along the shape of valve seat 100 can also be provided according to the diameter of valve seat 100 (see reference). Figure 5(B) Annular regions F1 and F2). Additionally, the magnetic force generating section (not shown) can be composed of a permanent magnet that generates magnetic force across the entire surface or annular region of the pedestal section 200; however, when the valve seat 100 is removed from the valve seat holding section 2, demagnetization is performed using a demagnetizing device. It should be noted that the valve seat holding section 2 can also be any other structure that uses magnetic force to hold the valve seat 100 within the pedestal section 200.

[0098] It should be noted that, in the modified examples of the two valve seat holding portions 2 described above, it is preferable to further provide a centering mechanism (not shown) such that the central axis 104 of the valve seat 100 is coaxial with the reference axis 2A. This is because, regardless of whether it is attracted by air or by magnetic force, the valve seat 100 can be centered with higher precision.

[0099] <Surface Processing Department (Laser Processing Department)>

[0100] Main reference Figure 1 and Figure 6 The surface processing section 3 will be described. The surface processing section 3 performs surface processing on the outer peripheral surface 101 of the valve seat 100 (workpiece) held by the valve seat holding section 2 to create a processed area. In this embodiment, as... Figure 6 As shown in (A), the surface processing unit 3 irradiates the outer peripheral surface 101 of the valve seat 100 with a laser via a pre-set laser passage region R1 of the first receiving unit 120, thereby creating a rough surface region 103 on the outer peripheral surface 101 of the valve seat 100. In this sense, for convenience, the surface processing unit 3 is referred to as the laser processing unit 3 in this embodiment. Figure 1 As shown, the laser processing unit 3 includes a laser irradiation unit 30 and a laser control unit 31.

[0101] like Figure 6 As shown in (A), the laser irradiation unit 30 has a laser irradiation port 30A from which laser light is irradiated. Furthermore, the laser irradiation unit 30 (laser irradiation port 30A) is positioned opposite the outer peripheral surface 101 of the valve seat 100 held by the valve seat holding unit 2 (e.g., radial direction of the valve seat 100 held by the valve seat holding unit 2 or radial direction of the imaginary circle K) across the laser passage region R1. Additionally, the laser irradiation unit 30 has a laser scanning mechanism (not shown) that shifts the irradiation position of the laser on the outer peripheral surface 101 of the valve seat 100 within the laser passage region R1. This laser scanning mechanism enables the formation of a desired rough surface region 103 without moving the valve seat 100.

[0102] It should be noted that the laser passage area R1 is a three-dimensional space region sandwiched between the laser irradiation section 30 (laser irradiation port 30A) and the valve seat 100 held by the valve seat holding section 2. It is a region that allows the laser to pass through when a rough surface region 103 is provided on the outer peripheral surface 101 of the valve seat 100. Therefore, no component is provided in the laser passage area R1 to block the passage of the laser.

[0103] The laser control unit 31 controls the operation of the laser irradiation unit 30. Specifically, the laser control unit 31 controls the operation of the laser irradiation unit 30 based on processing data received from an external terminal (not shown) so that the laser irradiates the outer peripheral surface 101 of the valve seat 100 according to the processing data. In this embodiment, the processing data is related to the rough surface region 103 described below.

[0104] Furthermore, a light shield 32 is provided in the laser processing section 3, which forms the peripheral wall of the cylindrical space in the laser transmission area R1. It should be noted that the light shield 32 may also be omitted, and such a structure is included within the scope of this invention.

[0105] Furthermore, in the valve seat processing apparatus 1 of the present invention, the surface processing unit 3 is not limited to the laser processing unit 3. For example, the surface processing unit 3 may be composed of a shot peening processing unit (not shown) that processes the outer peripheral surface 101 of the valve seat 100 by blowing shot into it, or it may be composed of a component that performs surface processing (e.g., cutting) on ​​the outer peripheral surface 101 of the valve seat 100 using a tool such as a cutting tool. In addition, the surface processing in the surface processing unit 3 includes not only the processing of setting the rough surface region 103 as described below, but also all other processing including processing of setting a specific pattern.

[0106] <Rough surface area>

[0107] Next, refer to Figure 7 The rough surface region 103 will be described below. When the valve seat 100 is pressed into the cylinder head, the rough surface region 103 increases the engagement force between the valve seat 100 and the cylinder head and prevents the valve seat 100 from detaching from the cylinder head. For example... Figure 7 As shown in (A), the rough surface region 103 constitutes a portion of the outer peripheral surface 101 of the valve seat 100. In this embodiment, as... Figure 7As shown in (A), when viewed from a direction perpendicular to the outer peripheral surface 101 of the valve seat 100 (radial direction of the valve seat 100), the rough surface region 103 is formed in, for example, a triangular shape. It should be noted that the triangular shape described here is not limited to a strictly defined triangle; for example, the portion corresponding to the apex of the triangle may be rounded, and the sides of the triangle may contain curves. It should also be noted that the shape of the rough surface region 103 when viewed from a direction perpendicular to the outer peripheral surface 101 can be any shape; for example, quadrilaterals, semicircles, and star shapes are listed as examples.

[0108] In addition, such as Figure 7 As shown in (A), multiple rough surface regions 103 can be provided along the circumferential direction L of the valve seat 100. When multiple rough surface regions 103 are provided, each rough surface region 103 is arranged at equal intervals along the circumferential direction L of the valve seat 100, and adjacent rough surface regions 103 have the same circumferential phase difference. It should be noted that, in order to distinguish between the circumferential phase difference of the laser processing unit 3 and the circumferential phase difference of the inspection unit 4 described later, the circumferential phase difference of adjacent rough surface regions 103 will be referred to as the rough surface region phase difference (processed area phase difference, the same below). In this embodiment, the rough surface region phase difference is set to 90 degrees. It should be noted that the present invention is not limited to this; each rough surface region 103 may also be arranged at unequal intervals along the circumferential direction L of the valve seat 100, and adjacent rough surface regions 103 may have different circumferential phase differences depending on the selected adjacent pairs of rough surface regions 103.

[0109] like Figure 7 As shown in (B), the rough surface region 103 has a protrusion / recess 102. The protrusion / recess 102 is a rough portion formed on the outer peripheral surface 101 of the valve seat 100. Figure 7 As shown in (B), the rough surface region 103 has a plurality of protrusions 102 and a plurality of recesses 102B adjacent to the protrusions 102A along the central axis direction M of the valve seat 100. The protrusions 102A are portions that bulge radially toward the valve seat 100, based on the outer peripheral surface of the valve seat 100 excluding the rough surface region 103 (hereinafter referred to as the reference outer peripheral surface) 101A. The recesses 102B are portions that are recessed radially toward the valve seat 100, based on the reference outer peripheral surface 101A. The protrusions 102A and recesses 102B are arranged alternately along the central axis direction of the valve seat 100.

[0110] <Method for forming rough surface regions by laser processing>

[0111] Reference Figure 8Taking the case where a rough surface region 103 in the shape of a triangle is formed when viewed from a direction perpendicular to the outer peripheral surface 101 of the valve seat 100, the case where the rough surface region 103 is formed by the laser processing unit 3 will be explained.

[0112] First, under the control of the laser control unit 31, the laser irradiation unit 30, starting from the endpoint 103EA of the bottom edge 103E of the triangular rough surface region 103, moves the laser irradiation position towards the endpoint 103EB of the bottom edge 103E in the positive direction of the circumferential L of the valve seat 100 via the laser scanning mechanism. As a result, the outer peripheral surface 101 of the valve seat 100 is laser-processed, thereby creating the lowest-level groove-shaped recess 102B1 extending in the circumferential L.

[0113] Next, the laser irradiation unit 30, starting from the first position J1, shifts the laser irradiation position in the negative direction of the circumferential L of the valve seat 100 to the second position J2 via the laser scanning mechanism. The first position J1 is a position offset by a predetermined distance Δh from the bottommost recess 102B1 towards the positive side of the valve seat 100's central axis direction M, and offset by a predetermined distance Δt from the endpoint 103EB towards the negative side of the circumferential L of the valve seat 100. The second position J2 is a position offset by a predetermined distance Δt from the endpoint 103EA towards the positive side of the circumferential L of the valve seat 100. Thus, the outer peripheral surface 101 of the valve seat 100 is laser-processed, thereby creating the groove-shaped recess 102B2 extending circumferentially along the uppermost layer. It should be noted that the laser irradiation unit 30 can also start from the second position J2 and shift the laser irradiation position in the positive direction of the circumferential L of the valve seat 100 to the first position J1 via the laser scanning mechanism.

[0114] During the process of setting the lowest recess 102B1 and the uppermost recess 102B2, material from the valve seat 100 will scatter between the lowest recess 102B1 and the uppermost recess 102B2. The scattered material accumulates on the reference outer peripheral surface 101A of the valve seat 100, which becomes the lowest circumferentially extending protrusion 102A1.

[0115] That is, as described above, the laser irradiation unit 30, between the starting point and the ending point of the imaginary triangle (the triangle corresponding to the rough surface region 103) on the outer peripheral surface 101 of the valve seat 100, shifts the laser irradiation position along the positive or negative direction of the circumferential direction L of the valve seat 100 while performing laser processing on the outer peripheral surface 101 of the valve seat 100 to form a groove-shaped concave (or convex) extending along the circumferential direction L. Then, after reaching the ending point, the laser irradiation unit 30 shifts the laser irradiation position towards the positive side of the central axis direction M of the valve seat 100, and then turns back from there, shifting the laser irradiation position along the positive or negative direction of the circumferential direction L of the valve seat 100. It should be noted that after reaching the endpoint, the laser irradiation unit 30 can also shift the laser irradiation position a predetermined distance towards the positive side of the central axis M of the valve seat 100 and return to the side of the starting point of the imaginary triangle, thereby shifting the laser irradiation position along the positive or negative direction of the circumferential L of the valve seat 100. If the above steps are repeated until the vertex 103F of the triangular rough surface region 103, a triangular rough surface region 103 is formed. It should be noted that, in the above description, the triangular rough surface region 103 is formed by processing from the base 103E towards the vertex 103F, but it is also possible to form the triangular rough surface region 103 by processing from the vertex 103F towards the base 103E. Furthermore, even if the rough surface region 103 is of a shape other than a triangle, the rough surface region 103 is formed by the laser processing unit 3 as described above.

[0116] <Inspection Department>

[0117] Reference Figure 1 , Figure 2 as well as Figure 6 The inspection unit 4 will be described. The inspection unit 4 captures images of the rough surface region 103 through the imaging area R2 of the first receiving unit 120 and checks whether the rough surface region 103 is set to meet preset reference conditions. For example... Figure 2 As shown, the inspection unit 4 includes, for example, an imaging unit 40, an analysis unit 41, and a determination unit 42.

[0118] like Figure 2 and Figure 6 As shown in (A), the imaging unit 40 has a lens 40A and generates imaging data by imaging the rough surface region 103 via the imaging region R2. Furthermore, the imaging unit 40 (lens 40A) is positioned opposite the outer peripheral surface 101 of the valve seat 100, separated by the imaging region R2. In this embodiment, the imaging unit 40 (lens 40A) is positioned opposite the valve seat 100, separated by the imaging region R2 (for example, in the radial direction of the valve seat 100 held by the valve seat holding part 2 or in the radial direction of the imaginary circle K).

[0119] It should be explained that, for example Figure 6 As shown in (A), the shooting area R2 is a three-dimensional space sandwiched between the shooting unit 40 (lens 40A) and the valve seat 100 held by the valve seat holding unit 2, and is a region capable of shooting the rough surface region 103 of the outer peripheral surface 101 of the valve seat 100. Therefore, in the shooting area R2, there are no obstacles on the outer peripheral surface 101 of the valve seat 100 that would hinder the shooting of the rough surface region 103.

[0120] The analysis unit 41 analyzes the rough surface region 103 based on the captured data. As an analysis result, for example, it obtains data related to the position, shape, and size of the rough surface region 103 on the outer peripheral surface 101 of the valve seat 100. As specific content of this data, for example, if the rough surface region 103 is triangular in shape, it includes, as an example, the length of the base of the triangle, the position of the base in the outer peripheral surface 101 of the valve seat 100, the height of the triangle, the position of the vertex of the triangle in the outer peripheral surface 101 of the valve seat 100, and the relative position of the vertex of the triangle with respect to the base.

[0121] The determination unit 42 determines whether the data analyzed by the analysis unit 41 meets preset benchmark conditions. The preset benchmark conditions refer to the conditions corresponding to the analyzed data. For example, regarding the length of the base of a triangle, the benchmark conditions are upper and lower threshold values ​​for the base length; regarding the height of the triangle, the benchmark conditions are upper and lower threshold values ​​for the height. Valve seats 100 that the determination unit 42 determines meet the benchmark conditions are treated as qualified valve seats and shipped as products. On the other hand, valve seats 100 that the determination unit 42 determines do not meet the benchmark conditions are discarded even during processing by the laser processing unit 3. Therefore, meaningless processing of valve seats 100 by the laser processing unit 3 can be eliminated, and the processing of valve seats 100 can be performed efficiently.

[0122] In addition, such as Figure 6As shown in (A), when viewing the valve seat processing apparatus 1 from above in the Z-axis direction, with the circumference of the valve seat 100 as a reference, the inspection unit 4 (image capturing unit 40) is positioned with a predetermined circumferential phase difference θ relative to the downstream side of the laser processing unit 3 (laser irradiation unit 30) in the relative rotation direction N. It should be noted that the reference for the circumferential phase difference θ in the inspection unit 4 is, for example, the optical axis 40AB of the lens 40A of the image capturing unit 40, and the reference for the circumferential phase difference θ in the laser processing unit 3 is, for example, the optical axis 30AB of the laser irradiated from the laser irradiation port 30A. These optical axes 40AB and 30AB are pre-positioned to intersect with the reference axis 2A in the Z direction. The angle formed by these optical axes 40AB and 30AB on a plane parallel to the XY plane is called the circumferential phase difference θ. This circumferential phase difference θ preferably coincides with the phase difference of the rough surface regions 103 of the valve seat 100. As described later, if the circumferential phase difference θ is made to match the phase difference of the rough surface region, then when the valve seat 100 (valve seat holding part 2) is rotated relative to the rough surface region phase difference using the relative rotation part 5, one of the rough surface regions 103 that has been pre-processed by laser processing will stop in the imaging area R2 downstream of the relative rotation direction N. Of course, the next predetermined processing area Q in the outer peripheral surface 101 of the valve seat 100 will simultaneously stop in the laser passage area R1. Then, the inspection of the rough surface region 103 by the inspection part 4 and the laser processing of the predetermined processing area Q by the laser processing part 3 can be performed simultaneously. It should be noted that in this embodiment, the circumferential phase difference θ and the phase difference of the rough surface region are 90 degrees. As a result, the rough surface region 103 newly processed by the laser processing part 3 is immediately positioned in the imaging area R2 in the next relative rotation. On the other hand, the circumferential phase difference θ can also be an integer multiple of the phase difference of the rough surface region. For example, in this embodiment, it can be 180 degrees or 270 degrees, but the check time is delayed accordingly.

[0123] <Relative Rotating Part>

[0124] Reference Figure 1 The relative rotation section 5 will now be explained. The relative rotation section 5 causes the valve seat holding section 2 (valve seat 100) to rotate relative to the laser processing section 3 (laser irradiation section 30) and the inspection section 4, which maintain a circumferential phase difference θ, about a reference axis 2A. In this embodiment, with the laser processing section 3 and the inspection section 4 stationary, the valve seat holding section 2 is rotated by the relative rotation section 5. As a result, the relative rotation section 5 causes the valve seat 100 to rotate together with the valve seat holding section 2.

[0125] In this embodiment, the relative rotating part 5 includes a shaft part 50 and a shaft-side rotating part 51. The central axis of the shaft part 50 is coaxial with the reference axis 2A. The valve seat holding part 2 is fixed to the shaft part 50 such that its own central axis is coaxial with the central axis of the shaft part 50. Under the control of the control unit 9, the shaft part 50 rotates about the reference axis 2A. In this embodiment, the shaft-side rotating part 51 is controlled by the control unit 9 to operate, for example, by rotating the shaft part 50 to the phase difference of the rough surface region and stopping for a predetermined time, and then rotating the phase difference of the rough surface region again and stopping for a predetermined time. During the predetermined time, laser processing and / or inspection processing are performed. Then, when the laser processing and / or inspection processing is completed, the shaft-side rotating part 51 rotates.

[0126] <Air Supply Department>

[0127] Reference Figure 1 , Figure 6 as well as Figure 9 The air supply unit 6 will now be described. The air supply unit 6 supplies air to the laser passage region R1 at least during the laser processing unit 3's laser processing of the outer peripheral surface 101 of the valve seat 100. In this embodiment, the air supply unit 6 specifically supplies air to the predetermined processing area Q or its vicinity, which is included in the laser passage region R1 and is the object of laser processing of the outer peripheral surface 101 of the valve seat 100. The predetermined processing area Q or its vicinity, which receives the air supply, intersects with the laser passage region R1. The air supply blows away debris generated during laser processing. The blown-away debris is collected by the dust collection body 70 through the dust collection pipe 71 of the dust collection unit 7.

[0128] During the process of photographing the rough surface area 103 using the photographing unit 40 of the inspection unit 4, it is necessary to prevent debris blown away by the air supply unit 6 from flying towards the photographing area R2. Therefore, the airflow direction generated by the air supply unit 6 is preferably directed towards the predetermined processing area Q, and is set to leave the photographing area R2 (where the rough surface area 103 is waiting).

[0129] like Figure 6 As shown in (A), when viewing the valve seat 100 held by the valve seat holder 2 from the Z-axis direction, the air supply unit 6 supplies air towards the laser-passing region R1 (towards the relative rotation direction N of the valve seat 100) starting from a position in the X-axis direction that is closer to the imaging region R2 than the laser-passing region R1. More specifically, it supplies air towards the processing predetermined region Q of the valve seat 100 or its vicinity, starting from a region that is further downstream of the relative rotation direction N than the optical axis 30AB of the laser and closer to the laser irradiation unit 30 (laser-passing region R1) than the tangent X of the center of the processing predetermined region Q of the outer peripheral surface 101 of the valve seat 100. Figure 6As shown in (B), the air supply direction intersects the tangent X from the radial outside to the inside at a predetermined inclination α (where 0° < α < 90°).

[0130] Alternatively, it can be like Figure 9 As shown, when viewing the valve seat 100 held by the valve seat holder 2 from the Y-axis elevation, the air supply unit 6 supplies air in the Z-axis direction from a side that is vertically above (upper Z-axis side) than the laser passage area R1 (or the laser optical axis 30AB) towards the predetermined processing area Q or its vicinity, and from the imaging area R2 towards a side that is vertically below (lower Z-axis side). Alternatively, as shown by the dashed line in the elevation view above, the air supply unit 6 can start from a region in the Z-axis direction that is higher than the laser passage area R1 (or the laser optical axis 30AB) and closer to the inspection unit 4 (imaging area R2) than the laser passage area R1 (or the laser optical axis 30AB), and supply air towards the predetermined processing area Q or its vicinity.

[0131] like Figure 1 As shown, the air supply unit 6 described above includes, for example, an air supply source 60, an air supply duct 61, and an air supply side valve 62. The air supply source 60 is composed of, for example, a compressor and an air supply mechanism. Moreover, the air supply source 60 is housed, for example, in the second housing portion 121 of the housing 12. The air supply duct 61 is fitted with the air supply side valve 62 midway and connected to the air supply source 60. The air supply side valve 62 is controlled to open and close by the control unit 9. The opening of the air supply duct 61 faces the predetermined machining area Q of the outer peripheral surface 101 of the valve seat 100 or its vicinity, and is arranged in the first housing portion 120 of the housing 12 in an orientation that allows air to be supplied in the direction described above.

[0132] <Dust Collection Department>

[0133] Reference Figure 1 , Figure 2 , Figure 6 as well as Figure 9 The dust collection unit 7 will be explained below. The dust collection unit 7 collects dust generated during laser processing that is blown away by the airflow from the air supply unit 6. For example... Figure 6 As shown, the dust collection unit 7 has a dust collection pipe 71, the opening 71A of which faces the opening 61A of the air supply pipe 61 across the processing predetermined area Q. In this embodiment, the opening 71A of the dust collection pipe 71 is arranged toward the inspection unit 4 (photographing unit 40) across the processing predetermined area Q. Furthermore, a valve seat retaining part 2 is sandwiched between the opening 71A of the dust collection pipe 71 and the inspection unit 4 (photographing unit 40).

[0134] It should be noted that, in this embodiment, it is also possible to... Figure 9As shown, the dust collection pipe 71 is configured in the following manner: when viewed from the Y-axis elevation, the valve seat 100 is held in a state where it is positioned by the valve seat holding part 2, the opening 71A of the dust collection pipe 71 itself is located on the lower side in the Z-axis direction than the valve seat holding part 2, and is opposite to the opening 61A of the air supply pipe 61 across the processing predetermined area Q or the area near the laser passage area R1 of the outer peripheral surface 101 of the valve seat 100.

[0135] In addition, such as Figure 1 As shown, the dust collection unit 7 has a dust collection body 70, which is connected to the dust collection pipe 71 and generates an airflow that draws air inward. When the dust collection body 70 is activated, a suction airflow is generated towards the interior of the dust collection body 70. As a result, debris generated during processing enters through the opening 71A of the dust collection pipe 71 and is collected inside the dust collection body 70. The dust collection body 70 is housed, for example, in a second housing portion 121 of the housing 12.

[0136] <Phase Difference Changing Mechanism>

[0137] Reference Figure 10 The phase difference changing mechanism 8 will be described below. The phase difference changing mechanism 8 changes the relative position between the laser processing unit 3 (laser irradiation unit 30) and the inspection unit 4, thereby changing the circumferential phase difference θ between the laser processing unit 3 (laser irradiation unit 30) and the inspection unit 4.

[0138] In this embodiment, with the inspection unit 4 fixed, the phase difference changing mechanism 8 rotates the laser irradiation unit 30 of the laser processing unit 3 in the circumferential direction of an imaginary circle K centered on the reference axis 2A. This changes the relative position of the laser irradiation unit 30 of the laser processing unit 3 with respect to the inspection unit 4, and also changes the aforementioned circumferential phase difference θ.

[0139] Specifically, the phase difference changing mechanism 8 includes, for example, a rotary table 80 on which the laser irradiation unit 30 is mounted. This rotary table 80 rotates circumferentially in an imaginary circle K centered on the reference axis 2A. As a result, even when the rotary table 80 is rotated, the optical axis 30AB of the laser generated by the laser irradiation unit 30 can always maintain an orientation intersecting the reference axis 2A. It should be noted that, in order to automate the movement of the rotary table 80, a movement mechanism (not shown) may also be specifically provided. It should be noted that, although the case of rotating the laser irradiation unit 30 via the rotary table 80 is shown here, the present invention is not limited to this; the circumferential phase difference θ can also be freely changed by rotating the inspection unit 4 using the rotary table 80. Furthermore, the phase difference changing mechanism 8 also includes all structures other than those described above that can change the circumferential phase difference θ by changing the relative position between the laser processing unit 3 (laser irradiation unit 30) and the inspection unit 4.

[0140] Furthermore, it is preferable that even when the laser irradiation unit 30 is rotated using the rotary table 80 to change the laser passage area R1, the air supply pipe 61 of the air supply unit 6 is positioned such that its opening 61A faces the predetermined processing area Q or its vicinity contained in the laser passage area R1. In this case, the air supply pipe 61 may also be configured to have a first deformation mechanism that allows it to deform in a manner that can change its own orientation. The air supply pipe 61 can change its orientation by bending, zigzagging, or the like using the first deformation mechanism. As a result, the air supply pipe 61 can be positioned such that its opening 61A faces the predetermined processing area Q or its vicinity contained in the laser passage area R1 using the first deformation mechanism. In addition, the air supply pipe 61 can also change its orientation using a first moving mechanism that allows it to move in a manner that can change the orientation of its opening 61A. Moreover, it may also be configured such that the first moving mechanism includes the rotary table 80 or other rotary table, the air supply pipe 61 is fixed to the rotary table 80 or other rotary table, and can rotate together with the laser irradiation unit 30 about the reference axis 2A.

[0141] Furthermore, preferably, when the opening 61A of the air supply duct 61 changes orientation, the dust collection tube 71 of the dust collection unit 7 is configured to adopt the following posture: with the processing predetermined area Q or its vicinity included in the laser passage area R1 as the boundary, the opening 71A of the dust collection tube 71 is directed in the X-axis direction from the side opposite to the opening 61A of the air supply duct 61 toward the processing predetermined area Q or its vicinity included in the laser passage area R1. In this case, the dust collection tube 71 may also be configured to have a second deformation mechanism that can deform in a way that can change its posture. The dust collection tube 71 can change its posture by bending, zigzagging, or the like through the second deformation mechanism. As a result, the dust collection tube 71 can be oriented so that its opening 71A faces the processing predetermined area Q or its vicinity included in the laser passage area R1 through the second deformation mechanism. In addition, the dust collection tube 71 can also change its posture through a second moving mechanism that can move in a way that can change the orientation of its opening 71A. Furthermore, the second moving mechanism can be configured such that a rotary table 80 or other rotary table is included, the dust collection pipe 71 is fixed to the rotary table 80 or other rotary table, and can rotate together with the laser irradiation unit 30 and the air supply pipe 61 around the reference axis 2A. Based on the above, even if the laser irradiation unit 30 rotates, and the position of the predetermined processing area Q or its vicinity in the laser passage area R1 changes, the dust collection treatment of debris generated during laser processing can continue.

[0142] <Control Department>

[0143] The control unit 9 controls the operation of the valve seat holding unit 2, the laser processing unit 3, the inspection unit 4, the relative rotation unit 5, the air supply unit 6, the dust collection unit 7, and the phase difference changing mechanism 8. For example... Figure 1As shown, the control unit 9 is housed, for example, in the third housing unit 122. It should be noted that the timing of each operation will be explained in the following section, <Operation of the Valve Seat Machining Device>.

[0144] It should be noted that the control unit 9 is composed of a computer having a CPU, RAM, ROM, and storage media. The CPU is responsible for the overall processing within the computer, using RAM as its working area. The ROM contains programs such as those for starting the computer, the operating system (OS) for implementing the basic operations of the computer, and various other programs. The storage media stores various data and / or programs, and is composed of non-volatile memory such as flash memory, hard disk drives (HDDs), or solid-state drives (SSDs). Commands are sent from the CPU to the laser processing unit 3, inspection unit 4, relative rotation unit 5, air supply unit 6, dust collection unit 7, and phase difference changing mechanism 8 according to the programs stored in the ROM or storage media, causing them to operate. Specifically, the computer can be, for example, a dedicated computer or a general-purpose personal computer (desktop personal computer, portable personal computer).

[0145] <Operation of the valve seat machining device>

[0146] Reference Figure 11 The operation of the valve seat machining apparatus 1 when rough surface regions 103 are provided on the valve seat 100 will be described below. In this embodiment, the case in which four rough surface regions 103 (first rough surface region 103A to fourth rough surface region 103D) are provided on the outer peripheral surface 101 of the valve seat 100 will be described as an example. It should be noted that the four rough surface regions 103 are provided at equal intervals with a rough surface region phase difference of 90° along the circumferential direction of the outer peripheral surface 101 of the valve seat 100. The machining predetermined regions Q of the four rough surface regions 103 on the outer peripheral surface 101 of the valve seat 100 are defined as the first machining predetermined region Q1 to the fourth machining predetermined region Q4, respectively.

[0147] After the valve seat 100 is manufactured, it is inspected, for example, by an inspection device 300 (see reference). Figure 2It should be noted that the inspection of the valve seat 100 includes at least one of the following: the outer diameter, inner diameter, height, inner circumferential surface, and outer circumferential surface of the valve seat 100. The valve seat 100 that passes inspection is transported to the valve seat holding part 2 of the valve seat processing apparatus 1 by a transport device (not shown). That is, an inspection device 300 is provided upstream of the transport path along which the transport device transports the valve seat 100, and a valve seat processing apparatus 1 is provided downstream of the transport path. In this embodiment, the valve seat 100 undergoes a visual inspection before laser processing of its outer circumferential surface 101. With this configuration, laser processing can be performed on the outer circumferential surface 101 of the valve seat 100, which has high dimensional accuracy and no visual defects, thus improving the accuracy of laser processing.

[0148] If used Figure 1 and Figure 2 If the valve seat detection unit 29 detects that the valve seat 100 is disposed in the valve seat holding unit 2, then... Figure 11 As shown in (A), the control unit 9 identifies a state where the laser passes through the region R1, which includes the first predetermined processing region Q1 of the valve seat 100 (hereinafter referred to as the first state). Then, the control unit 9 instructs the laser processing unit 3 (laser irradiation unit 30) to perform laser processing. The laser processing unit 3 (laser irradiation unit 30) receives the instruction from the control unit 9 and irradiates the first predetermined processing region Q1 of the valve seat 100 with laser light, thus creating a rough surface region (hereinafter referred to as the first rough surface region) 103A in the first predetermined processing region Q1 of the valve seat 100.

[0149] If the laser processing unit 3 (laser irradiation unit 30) finishes laser processing on the first predetermined processing area Q1 and a first rough surface area 103A is provided in the first predetermined processing area Q1 of the valve seat 100, then the control unit 9 instructs the relative rotation unit 5 to stop after rotating the rough surface area clockwise by 90°. Figure 11 As shown in (B), the relative rotation unit 5 receives an instruction from the control unit 9, causing the valve seat holding unit 2 to rotate clockwise by 90° to stop the rough surface region. Thus, as... Figure 11 As shown in (B), the second processing predetermined region Q2 of the valve seat 100 is included in the laser passing region R1, and the first rough surface region 103A of the first processing predetermined region Q1 of the valve seat 100 is included in the imaging region R2 (hereinafter referred to as the second state).

[0150] like Figure 11As shown in (B), if the second state is reached, the control unit 9 instructs the laser processing unit 3 (laser irradiation unit 30) to perform laser processing on the second processing predetermined area Q2, and instructs the inspection unit 4 to perform inspection processing on the first rough surface area 103A. The laser processing unit 3 (laser irradiation unit 30), receiving instructions from the control unit 9, irradiates the second processing predetermined area Q2 of the valve seat 100 with laser light, and sets a rough surface area (hereinafter referred to as the second rough surface area) 103B in the second processing predetermined area Q2 of the valve seat 100. During the period when the laser processing unit 3 (laser irradiation unit 30) sets the second rough surface area 103B, the inspection unit 4, receiving instructions from the control unit 9, uses the imaging unit 40 to photograph the first rough surface area 103A, and checks whether the first rough surface area 103A meets the reference conditions. It should be noted that the time when the inspection unit 4 performs the inspection processing is preferably any time during the period when the laser processing unit 3 (laser irradiation unit 30) performs laser processing, but more preferably simultaneously with the time when laser processing is performed.

[0151] If the reference conditions are not met in the first rough surface region 103A, the control unit 9 instructs the transport device (not shown) to discard the valve seat 100. The transport device receives the instruction from the control unit 9 and transports the valve seat 100 to a predetermined location for disposal.

[0152] It should be noted that if the first rough surface region 103A does not meet the reference conditions, the valve seat 100 is discarded. Therefore, the second rough surface region 103B can be set after the inspection unit 4 determines that the first rough surface region 103A meets the reference conditions. That is, after the state becomes the second state, the inspection process in the inspection unit 4 can be performed before the laser processing process in the laser processing unit 3 (laser irradiation unit 30). In this case, there is the advantage of not having to perform meaningless processing on the valve seat 100, but the laser processing cannot be performed if the inspection process is not completed. Therefore, compared with the case where the laser processing and inspection process are performed simultaneously, in the above-mentioned laser processing process after the inspection process, it takes time to complete one laser processing process and one inspection process.

[0153] If the laser processing and inspection are completed, and the determination unit 42 determines that the first rough surface region 103A meets the reference conditions, then the control unit 9 instructs the relative rotation unit 5 to stop after rotating the rough surface region clockwise by 90°. Figure 11 As shown in (C), the relative rotating part 5 receives an instruction from the control part 9, causing the valve seat holding part 2 to rotate clockwise by 90° to stop the rough surface region. Thus, as... Figure 11As shown in (C), the third processing predetermined region Q3 of the valve seat 100 is included in the laser passing region R1, and the second rough surface region 103B of the second processing predetermined region Q2 of the valve seat 100 is included in the imaging region R2 (hereinafter referred to as the third state).

[0154] like Figure 11 As shown in (C), if the third state is reached, the control unit 9 instructs the laser processing unit 3 (laser irradiation unit 30) to perform laser processing on the third predetermined processing area Q3, and instructs the inspection unit 4 to perform inspection processing on the second rough surface area 103B. The laser processing unit 3 (laser irradiation unit 30), receiving the instruction from the control unit 9, irradiates the valve seat 100 with laser light on the third predetermined processing area Q3. Figure 11 As shown in (C), a rough surface region (hereinafter referred to as the third rough surface region) 103C is provided in the third predetermined processing area Q3 of the valve seat 100. During the period when the third rough surface region 103C is provided in the laser processing unit 3 (laser irradiation unit 30), the inspection unit 4 receives an instruction from the control unit 9 and performs an inspection to check whether the second rough surface region 103B meets the reference conditions. It should be noted that the time when the inspection unit 4 performs the inspection process is preferably any time during the period when the laser processing unit 3 (laser irradiation unit 30) performs laser processing, but it is more preferably simultaneous with the time when the laser processing process is performed.

[0155] If the second rough surface region 103B does not meet the reference conditions, similarly to the above, the control unit 9 instructs the transport device (not shown) to discard the valve seat 100. The transport device receives the instruction from the control unit 9 and discards the valve seat 100. If the laser processing and imaging processes are completed, and the determination unit 42 determines that the second rough surface region 103B meets the reference conditions, the control unit 9 instructs the relative rotation unit 5 to stop after rotating the rough surface region clockwise by 90°. Figure 11 As shown in (D), the relative rotating part 5 receives an instruction from the control part 9, causing the valve seat holding part 2 to rotate further clockwise by 90° to stop the rough surface region. Thus, as... Figure 11 As shown in (D), the state is that the fourth processing predetermined region Q4 of the valve seat 100 is included in the laser passing region R1, and the third rough surface region 103C of the third processing predetermined region Q3 of the valve seat 100 is included in the imaging region R2 (hereinafter referred to as the fourth state).

[0156] In the fourth state, the same processing as in the second and third states is performed. A rough surface region (hereinafter referred to as the fourth rough surface region) 103D is provided in the fourth processing predetermined area Q4 of the valve seat 100, and an inspection process is performed on the third rough surface region 103C. Then, if the laser processing and inspection process in the fourth state are completed without problems, the valve seat holding part 2 rotates the rough surface region by 90° clockwise via the relative rotation part 5, resulting in a state where the first rough surface region 103A of the valve seat 100 is included in the laser passage area R1, and the fourth rough surface region 103D of the valve seat 100 is included in the imaging area R2 (hereinafter referred to as the fifth state). It should be noted that the fifth state is not shown. In the fifth state, since the first rough surface region 103A is already provided in the processing predetermined area of ​​the laser processing part 3, the laser processing performed by the laser processing part 3 is not performed, and only the inspection process of the inspection part 4 on the fourth rough surface region 103D is performed. Finally, if the determination unit 42 determines in the inspection unit 4 that the fourth rough surface region 103D of the fourth pre-processed area Q4 of the valve seat 100 meets the reference conditions, the valve seat 100 is transported to the predetermined location by the transport device as a product that can be shipped.

[0157] It should be noted that, unlike the above, the circumferential phase difference θ can also be an integer multiple of the phase difference of the rough surface region. In this case, such as Figure 12 (A) Figure 12 As shown in (D), when the circumferential phase difference θ is twice the 90° phase difference of the rough surface region, becoming 180°, when the third rough surface region 103C is set using the laser processing unit 3, the first rough surface region 103A initially set by the laser processing unit 3 is inspected in the inspection unit 4. That is, when the circumferential phase difference θ is an integer multiple of the phase difference of the rough surface region, the rough surface region is set using the laser processing unit 3, and at the same time, the rough surface region previously set by the laser processing unit 3 is inspected in the inspection unit 4. This method is also included within the scope of the present invention.

[0158] <Second Implementation>

[0159] Reference Figure 13 and Figure 14 The valve seat processing apparatus 1 according to the second embodiment of the present invention will be described. The valve seat processing apparatus 1 in this embodiment differs from the valve seat processing apparatus 1 in the first embodiment in that the relative rotation unit 5 does not rotate the valve seat holding unit 2, but instead rotates the laser irradiation unit 30 and the inspection unit 4 about the reference axis 2A. Furthermore, the relative rotation unit 5 maintains the circumferential phase difference θ between the laser irradiation unit 30 and the inspection unit 4 while rotating the laser irradiation unit 30 and the inspection unit 4 about the reference axis 2A.

[0160] like Figure 13 As shown, the relative rotation unit 5 in this embodiment includes a rotary table 55 and a rotary table drive unit 56. The rotary table 55 maintains the laser irradiation unit 30 and the inspection unit 4 at positions and orientations with a circumferential phase difference θ between them.

[0161] like Figure 14 As shown in (B), the rotary table drive unit 56 rotates the rotary table 55 about the reference axis 2A. The rotary table drive unit 56 has: a rotation-side rotating part 57, which includes a motor having a drive shaft coaxial with the reference axis 2A; and a radial extension part 58, which extends radially from the rotation-side rotating part 57 along a circle centered on the reference axis 2A and is connected to the rotary table 55.

[0162] In this embodiment, the relative rotation section 5, configured as described above, maintains the circumferential phase difference θ between the laser irradiation section 30 and the inspection section 4 while the valve seat 100 and the valve seat holding section 2 are fixed together, and causes the laser irradiation section 30 and the inspection section 4 to rotate (twist) about the reference axis 2A. It should be noted that the structure of the relative rotation section 5 described above is one example; other structures capable of maintaining the circumferential phase difference θ between the laser irradiation section 30 and the inspection section 4 and causing the laser irradiation section 30 and the inspection section 4 to rotate (twist) about the reference axis 2A are also included within the scope of this invention.

[0163] In addition, the relative rotation unit 5 can also rotate the laser irradiation unit 30 and the inspection unit 4 around the reference axis 2A while maintaining the circumferential phase difference θ between the laser irradiation unit 30 and the inspection unit 4, and make the valve seat holding unit 2 rotate together with the valve seat 100.

[0164] It should be noted that in this embodiment, the laser irradiation unit 30 and the inspection unit 4 rotate (twist) about the reference axis 2A. Therefore, when the laser irradiation unit 30 and the inspection unit 4 rotate, the air supply pipe 61 of the air supply unit 6 and the dust collection pipe 71 of the dust collection unit 7 need to be configured so as not to interfere with the laser irradiation unit 30 and the inspection unit 4. That is, the air supply pipe 61 of the air supply unit 6 and the dust collection pipe 71 of the dust collection unit 7 need to avoid the passage area U (refer to) that may be passed through when the laser irradiation unit 30 and the inspection unit 4 rotate. Figure 14 The configuration is based on (A) and (B). For example, when viewing the valve seat machining device 1 from the elevation view along the Y-axis, as shown... Figure 14As shown in (B), the air supply duct 61 of the air supply unit 6 needs to be positioned higher in the Z-axis direction than the passage area U (laser irradiation unit 30 and inspection unit 4) so ​​that the air supply duct 61 of the air supply unit 6 and the dust collection duct 71 of the dust collection unit 7 do not interfere with the rotating laser irradiation unit 30 and inspection unit 4. Furthermore, the dust collection duct 71 of the dust collection unit 7 needs to be positioned lower in the Z-axis direction than the passage area U (laser irradiation unit 30 and inspection unit 4). Additionally, as... Figure 14 As shown in (A), when the valve seat machining device 1 is viewed from above in the Z-axis direction, the air supply pipe 61 of the air supply section 6 and the dust collection pipe 71 of the dust collection section 7 can also be arranged in a region further outward than the passage area U.

[0165] Alternatively, the air supply duct 61 of the air supply unit 6 and the dust collection duct 71 of the dust collection unit 7 can also be configured such that, while maintaining the relative position between the laser irradiation unit 30 and the inspection unit 4, they rotate together with the laser irradiation unit 30 and the inspection unit 4 around the reference axis 2A via the relative rotation unit 5. In this case, the air supply duct 61 of the air supply unit 6 and the dust collection duct 71 of the dust collection unit 7 are preferably fixed to the aforementioned rotary table 55.

[0166] It should be noted that the workpiece processing apparatus of the present invention, and the valve seat processing apparatus 1, which is an example of a workpiece processing apparatus, are not limited to the above-described embodiments. All structures formed by appropriately combining the constituent elements of each embodiment are included within the scope of the present invention, and various modifications can of course be made to them without departing from the spirit of the present invention.

Claims

1. A workpiece processing apparatus, characterized in that, The workpiece machining apparatus comprises: machining the outer circumferential surface of a workpiece around its central axis; A workpiece holding part that positions and holds the workpiece in such a way that the central axis of the workpiece is coaxial with a pre-set reference axis; A surface processing section performs surface processing on the outer peripheral surface of the workpiece held by the workpiece holding section to form a processed area; An inspection unit is configured to have a circumferential phase difference with respect to the surface processing unit when an imaginary circle centered on the reference axis is defined, and the inspection unit takes pictures of the processed area of ​​the outer peripheral surface of the workpiece and checks whether the processed area is set to meet a preset reference condition. as well as The relative rotation part causes the workpiece to rotate relative to the surface processing part and the inspection part, which maintain the circumferential phase difference, about the reference axis. The surface processing section provides multiple processed areas at different positions along the circumferential direction of the outer peripheral surface of the workpiece. When the phase difference in the circumferential direction of a plurality of adjacent processed regions along the circumferential direction is defined as the phase difference of the processed region, the circumferential phase difference between the surface processing part and the inspection part is the same as the phase difference of the processed region, or an integer multiple of the phase difference of the processed region.

2. The workpiece processing apparatus according to claim 1, characterized in that, Whenever the workpiece is rotated relative to the machining area by an angle corresponding to the phase difference between the relative rotating part and the machining area, the surface machining part performs surface machining on the outer peripheral surface of the workpiece to form the machining area. During the period when the surface processing unit sets the processed area, the inspection unit takes a picture of the processed area set earlier than that period and checks whether the processed area is set to meet the reference condition.

3. The workpiece processing apparatus according to claim 1 or 2, characterized in that, The workpiece processing apparatus includes an air supply unit that supplies air to the area of ​​the outer peripheral surface of the workpiece that is being surface-processed by the surface processing unit or to the area near it.

4. The workpiece processing apparatus according to claim 3, characterized in that, The airflow direction of the air blown by the air supply unit is set to leave the shooting area, which is sandwiched between the inspection unit and the workpiece and is used to shoot the processed area.

5. The workpiece processing apparatus according to claim 3 or 4, characterized in that, The workpiece processing device includes a dust collection unit, which collects dust from debris blown away by the air supply unit during surface processing performed by the surface processing unit.

6. The workpiece processing apparatus according to any one of claims 1 to 5, characterized in that, The workpiece processing device includes: A conveying device that conveys the workpiece to the workpiece holding part; and An inspection device, configured on the upstream side of the transport path of the transport device, performs a visual inspection of the outer peripheral surface of the workpiece.

7. The workpiece processing apparatus according to any one of claims 1 to 6, characterized in that, The workpiece is a valve seat.

8. The workpiece processing apparatus according to any one of claims 1 to 7, characterized in that, The workpiece processing device includes a phase difference changing mechanism, which changes the relative position of the surface processing part and the inspection part to change the circumferential phase difference.

9. The workpiece processing apparatus according to any one of claims 1 to 8, characterized in that, The workpiece processing apparatus has a rotary table that changes the circumferential phase difference by rotating the surface processing section and / or the inspection section about the reference axis.

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