功率半导体冷却组件
By designing a general-purpose modular power semiconductor cooling assembly, using single-device press-fitting and pre-reserved threaded interface connection, the problems of large component size and difficult material management in existing technologies are solved. This enables flexible component installation and transportation to adapt to different working conditions and customer requirements, facilitating management and cost control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUZHOU CRRC TIMES SEMICON CO LTD
- Filing Date
- 2022-09-15
- Publication Date
- 2026-07-17
AI Technical Summary
When multiple power semiconductor devices are connected in series, the components are bulky and difficult to transport and install, and material management and cost control are difficult, making it impossible to flexibly adapt to different application conditions and customer requirements.
The power semiconductor cooling assembly is designed as a general-purpose module. It uses single device press-fitting and achieves flexible series or parallel connection through the combination of press plate and heat sink. The reserved threaded interface facilitates component connection, and the combination of flexible connection parts ensures press-fitting quality and structural stability.
It enables flexible assembly, disassembly, and transportation of components, facilitating management, reducing material and production costs, ensuring press-fit quality and structural stability, and adapting to different working conditions and customer needs.
Smart Images
Figure CN115588654B_ABST