一种隧穿型忆阻器及其制备方法和应用

By introducing an active metal-doped silicon oxide percolation layer into a tunneling memristor, the problems of cyclic fluctuations in conductive filament memristors and slow migration speed and depolarization in tunneling memristors are solved, achieving memristor performance with high stability, fast switching and long data retention, suitable for information storage and neuromorphic computing.

CN115589772BActive Publication Date: 2026-07-17GUANGZHOU UNIVERSITY

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGZHOU UNIVERSITY
Filing Date
2022-09-14
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing conductive filament memristors suffer from large cyclic variability due to random growth and fracture in the resistive switching layer. They have fast switching speeds but poor stability. Meanwhile, tunneling memristors suffer from slow oxygen vacancy migration and depolarization issues, resulting in slow switching speeds and short data retention times. It is difficult to achieve low cyclic variability, high switching speed, long data retention time, and continuous conductance adjustment simultaneously on a single memristor.

Method used

The tunneling memristor employs a top-down structure, comprising a top electrode, a percolation layer, and a bottom electrode. The percolation layer is an active metal-doped silicon oxide layer with a thickness of 70-150 nm, while the tunneling layer is SiOx or TiOx with a thickness of 3.5-4.5 nm. It is fabricated using a combination of reactive co-sputtering and thermal evaporation processes. The active metal-doped silicon oxide layer provides active metal clusters with low activation energy and fast migration speed to regulate the potential barrier of the tunneling layer.

Benefits of technology

It achieves high cyclic stability, fast switching speed and long data retention time, while also having continuous conductivity regulation capability, making it suitable for information storage devices and neuromorphic computing hardware.

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Abstract

本发明属于电子器件领域,公开了一种隧穿型忆阻器及其应用,该隧穿型忆阻器自上至下依次由顶电极、渗流层、隧穿层和底电极组成,其中,所述渗流层为活性金属掺杂的氧化硅层。本发明采用活性金属掺杂的氧化硅层提供的活化能低、迁移速度快、不存在退极化问题的活性金属团簇充当调节隧穿层势垒的媒介,有效解决传统隧穿型忆阻器中氧空位迁移速度慢、容易退极化的问题,在保持了传统隧穿型忆阻器循环稳定性高、连续电导调节能力强的优势外,还赋予了器件开关速度快、数据保持时间长等导电细丝型忆阻器才具备的优点。
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