Wireless communication card and its manufacturing method

Abstract

This invention relates to a wireless communication card and a method for manufacturing the same. According to an embodiment of the invention, the wireless communication card and its manufacturing method include: processing an antenna inlay layer comprising an antenna coil; stacking a first cover layer covering the upper portion of the antenna inlay layer; inserting a specific area of ​​the first cover layer into a milled chip-on-board (COB) receiving space; and processing a PVC insert having receiving grooves under the solder pads supporting the COB; connecting the two ends of the antenna coil extending from the antenna inlay layer through the PVC insert to a contact area of ​​the COB; and mounting the COB onto the PVC insert inserted into the COB receiving space.

Description

Technical Field

[0001] This invention relates to a wireless communication card and its manufacturing method. Background Technology

[0002] Generally speaking, credit cards can not only be used as a substitute for cash, but recently, contact or contactless smart cards with built-in IC chip modules capable of storing large amounts of information have been developed. These cards are actively used not only for payments but also for various membership cards. In this smart card market, special cards utilizing various materials are being developed. In particular, for VIP customers, differentiated metal credit cards have been developed, offering a high-end feel with a metallic sheen to special clients.

[0003] However, the properties of metal cards can cause antenna malfunctions during wireless (contactless) communication with card readers, potentially limiting RF functionality and ATM usage. Furthermore, methods using thin metal films or thin coatings of metal powder make it difficult to create patterns and text on the surface of metal cards. Additionally, when made from excessively light materials, the weight of the metal is not noticeable. Therefore, there is an urgent need to develop metal cards that overcome these limitations and offer the unique weight and aesthetic appeal of metal.

[0004] Therefore, to address this issue, a metal card utilizing a SUS material metal sheet and an antenna connection has recently been developed. This has led to investigations into structures that prevent electrical interference between the antenna coil and the metal material, ensuring proper information storage and processing of the wireless communication card, and methods to improve production efficiency by enhancing manufacturing processes. Summary of the Invention

[0005] The present invention is proposed to solve the aforementioned existing problems, and its object is to provide a wireless communication card and its manufacturing method that can store and process information by utilizing the process of blocking interference by inserting an IC chip into a thin sheet of metal and a plastic workpiece.

[0006] A method for manufacturing a wireless communication card according to an embodiment of the present invention for solving the aforementioned problem includes: a step of processing an antenna inlay layer including an antenna coil; a step of stacking a first cover layer covering the upper part of the antenna inlay layer; a step of inserting a specific area of ​​the first cover layer into a milled chip-on-board (COB) receiving space and processing a PVC insert having a receiving groove having a pad under the COB supporting the COB; a step of connecting the two ends of the antenna coil extending from the antenna inlay layer through the PVC insert and to the contact area of ​​the COB; and a step of mounting the COB in the PVC insert inserted into the COB receiving space.

[0007] Furthermore, the wireless communication card according to an embodiment of the present invention for solving the aforementioned problem includes: an antenna inlay layer including an antenna coil; a first cover layer covering the upper part of the antenna inlay layer; and a second cover layer covering the lower part of the antenna inlay layer, firstly inserted into a chip receiving space on a board provided in a specific area of ​​the first cover layer, supporting COB pads, and having a PVC insert having a receiving groove including a receiving groove for receiving a protrusion at the lower end of the COB pad.

[0008] According to embodiments of the present invention, the chip's operating efficiency is improved. In the wireless communication card of the present invention, the antenna coil can be directly connected to the COB without contacting the metal sheet, thereby enabling the manufacture of a wireless communication card that retains the unique characteristics of the metal material while ensuring the normal information storage and processing functions of the card. Furthermore, the COB fragments remaining after perforation are utilized in the manufacturing process to create a plastic workpiece that blocks electrical interference, thereby reducing the complexity of the manufacturing process and improving efficiency, thus potentially leading to increased production efficiency. Attached Figure Description

[0009] Figure 1 This is a perspective view of a wireless communication card according to an embodiment of the present invention.

[0010] Figure 2 This is a cross-sectional view of a wireless communication card according to an embodiment of the present invention.

[0011] Figure 3 is a flowchart illustrating a method for manufacturing a wireless communication card according to an embodiment of the present invention.

[0012] Figures 4 to 7 This is a cross-sectional view of the main processes of a manufacturing method for a wireless communication card according to an embodiment of the present invention.

[0013] Figure 8 and Figure 9 This is an example diagram illustrating the apparatus and structural elements used in a method for manufacturing a wireless communication card according to an embodiment of the present invention.

[0014] Explanation of reference numerals in the attached figures

[0015] 100: Wireless communication card; 110: First coverage layer

[0016] 111: Metal layer; 112: Insulating layer

[0017] 120: Antenna inlay layer; 121: Antenna coil

[0018] 130: Second capping layer; 131: Epoxy layer

[0019] 132: Printed layer; 133: Antibacterial layer

[0020] 134: Magnetic stripe coating layer; 134a: Magnetic stripe

[0021] 140: COB 141: COB solder pad

[0022] 142: COB chip 143: COB contact area

[0023] 144: COB junction area 145: Step section

[0024] 150: PVC insert; 151: Receiving slot

[0025] 160: COB Containment Space 200: COB Fragments

[0026] 300: Hot melt adhesive tape Detailed Implementation

[0027] The following content is merely illustrative of the principles of the invention. Therefore, although not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the invention and invent various devices included in the concept and scope of the invention. Furthermore, all terms, conditions, and embodiments listed in this specification are intended only for the purpose of understanding the concept of the invention and should be understood as not being limited to the embodiments and states specifically listed.

[0028] For example, in the entire specification, when certain parts are "connected" to another part, this includes not only "direct connection" but also "indirect connection" with another component in between. Furthermore, when certain parts "include" certain structural elements, unless otherwise stated otherwise, this does not exclude other structural elements, but rather implies that other structural elements may also be present.

[0029] Furthermore, it should be understood that not only the principles, viewpoints, and embodiments of the present invention, but also all detailed descriptions listing specific embodiments include structural and functional equivalents of such matters. Moreover, it should be understood that these equivalents include not only currently known equivalents, but also equivalents to be developed in the future, i.e., all devices invented to perform the same function regardless of structure.

[0030] The objectives, features, and advantages described herein become clearer through the accompanying drawings and the following detailed description, thereby enabling those skilled in the art to readily implement the technical concept of the invention. Furthermore, in describing the invention, detailed descriptions of well-known techniques relevant to the invention are omitted if they are deemed to obscure the main points of the invention.

[0031] The terminology used in this application is for illustrative purposes only and is not intended to limit the invention. The singular expressions include multiple expressions unless clearly distinguished in the context. In this application, terms such as "comprising" or "having" designate the presence of features, numbers, steps, operations, structural elements, components, or combinations thereof as described in the specification, and should be understood not to preclude the presence or additional possibilities of one or more other features or numbers, steps, operations, structural elements, components, or combinations thereof.

[0032] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. In describing the present invention, for ease of overall understanding, the same reference numerals are used for the same structural elements in the drawings, and repeated descriptions of the same structural elements are omitted.

[0033] Figure 1 This is an example diagram illustrating a wireless communication card 100 according to an embodiment of the present invention.

[0034] Reference Figure 1 According to an embodiment of the present invention, a wireless communication card 100 may include one or more sheets or layers.

[0035] The wireless communication card 100 according to an embodiment of the present invention may include a first cover layer 110, an antenna inlay layer 120 and a second cover layer 130.

[0036] The wireless communication card 100 may be stacked by a first cover layer 110 covering the upper part of an antenna inlay layer 120 including an antenna coil and a second cover layer 130 covering the lower part of the antenna inlay layer 120.

[0037] Specifically, the first cover layer may include a metal layer 111 and an insulating layer 112. The second cover layer may include an epoxy layer 131, a printed layer 132, an antibacterial layer 133, and a magnetic stripe overlay 134 (MS O / L).

[0038] At this time, a COB receiving space 160, milled to a depth that penetrates the first cover layer 110 and exposes the antenna coil 121 of the antenna inlay layer 120, is inserted and installed to provide contact or contactless communication and transaction functions. Thus, the wireless communication card 100 can be a card that, depending on the card issuing function of a card company or the operating system of a card reader, can handle credit card payments, debit card payments, postpaid payments, etc., based on the on-board chip 140, enabling contact or contactless information storage and processing.

[0039] The accompanying drawings are not limited to the structural elements described herein. Other structural elements may be added to realize additional functions or design aesthetics of the wireless communication card 100. In order to realize additional functions, a display unit, a biosensor unit, etc. may also be included.

[0040] Furthermore, the wireless communication card 100 of the present invention can be manufactured according to the specifications of size and thickness based on a predefined electronic card manufacturing standard, and the size and thickness of each sheet are determined to be combined to meet the optimal thickness of the operation of the wireless communication card 100 and related devices such as card readers.

[0041] Furthermore, the sheet (layer) constituting the wireless communication card 100 of the present invention is not a sheet for manufacturing a single card, but can be configured as a large sheet of the size of multiple cards that can be mass-produced.

[0042] First, according to an embodiment of the present invention, the metal layer 111 is a thin sheet that exhibits the unique material and weight of a metal layer, and may be formed of stainless steel (SUS: steel use stainless). Alternatively, the metal layer 111 may be formed of a solid metal such as copper, copper alloy, or silver, which have antibacterial properties.

[0043] The metal material constituting the metal layer 111 is selected not only considering the material and weight used to express metallic properties, but also the durability, abrasion resistance, and degree of deformation to withstand processing steps. As an example, the metal layer 111 made of SUS can be a corrosion-resistant raw material that can be heat-treated. Heat treatment refers to the process of heating metal to certain temperatures and improving its properties or microstructure to a specific purpose based on the cooling rate. The metal layer 111 may have uneven surfaces on a portion or entirely to achieve adhesion. Furthermore, during the manufacture of the wireless communication card 100, the metal layer 111 can be processed through a heat treatment process to improve its strength and resilience.

[0044] As one embodiment, the metal layer 111 of the present invention can be configured as a large sheet comprising multiple cards. After a lamination process in which multiple sheets are bonded together and heat and pressure are applied to form a single sheet, multiple cards can be produced by machining. The machining of such a metal sheet comprising multiple cards can utilize special processing materials, coolants, and cutting tools based on the properties of the metal material.

[0045] The insulating layer 112 serves to block interference with the metal layer 111, allowing the antenna in the antenna inlay layer 120 to operate. For the NFC antenna to function, it needs to communicate with the antenna reader on the opposite side. In this case, the antenna coil 121 in the antenna inlay layer 120 generates a magnetic field. Since the antenna coil 121 and the metal layer 111 are made of similar metal materials, the metal material alters the self-resonant frequency (SRF) of the antenna coil 121, exacerbating losses and reducing the inductance coefficient of the antenna coil 121, ultimately causing communication problems. This phenomenon is caused by eddy currents generated in the metal due to the magnetic field. To eliminate these eddy currents, a material with high permeability and high resistance is needed between the metal and the antenna, thereby allowing for bidirectional adjustment of the magnetic field lines. The insulating layer 112 is used for this purpose and can also be a ferrite sheet. Ferrite is made by oxidizing iron powder to achieve insulation and can be shaped under pressure. The metal layer 111 and the insulating layer 112 can be bonded using a hot melt adhesive. The hot melt adhesive, characterized by melting upon heating and then solidifying upon cooling, can be used as a thin-film type hot melt adhesive.

[0046] The antenna inlay layer 120 may be a thin sheet including a radio frequency (RF) antenna coil 121. The number of turns of the antenna coil 121 can be determined through RF communication (e.g., NFC, RFID) sensitivity tests to achieve optimal sensitivity. Furthermore, the antenna coil 121 of the present invention can be directly connected to the contact areas 143, 144 of the COB disposed on the lower end face of the IC chip of the COB 140 attached to the first cover layer 110 via the receiving slot 151.

[0047] The printed layer 132 is a sheet representing information from a printed card, or information from a printed card, or images such as textures or patterns, which may be attached to the lower end face of the epoxy layer 131.

[0048] Furthermore, the antibacterial layer 133 can be a sheet processed by coating or adding substances that provide antibacterial function.

[0049] Finally, the magnetic stripe covering layer 134 may be a sheet including the magnetic stripe 134a.

[0050] The antibacterial layer 133 can be synthesized by coating or adding substances that provide antibacterial function to the magnetic strip covering layer 134, so that the magnetic strip area can be exposed to the outside.

[0051] Figure 2 This is a cross-sectional view of a wireless communication card 100 according to an embodiment of the present invention.

[0052] Reference Figure 2 According to an embodiment of the present invention, the wireless communication card 100 is formed in a form in which, from top to bottom, a metal layer 111, an insulating layer 112 and an antenna inlay layer 120 are included in a first cover layer 110, and an epoxy layer 131, a printed layer 132, an antibacterial layer 133 and a magnetic stripe cover layer 134 are stacked.

[0053] The metal layer 111, the insulating layer 112, the antenna inlay layer 120, the epoxy layer 131, the printed layer 132, the antibacterial layer 133, and the magnetic stripe covering layer 134 can be attached to the various thin sheets laminated according to conventional lamination processes.

[0054] As a preferred thickness of each layer according to an embodiment of the present invention, the metal layer 111 may be configured to be 0.30 mm, the insulating layer 112 may be configured to be 0.06 mm, the antenna inlay layer 120 may be configured to be 0.13 mm, the epoxy layer 131 may be configured to be 0.15 mm, the printed layer 132 may be configured to be 0.10 mm, and the antibacterial layer 133 may be configured to be 0.06 mm.

[0055] Meanwhile, the wireless communication card 100 may include an on-board chip 140. The on-board chip 140 may be divided into a COB chip 142 protruding from the COB pad 141 and bonded to the antenna inlay layer 120, and contact areas 143 and 144 of the COB connected to both ends of the antenna coil 121. Furthermore, the on-board chip 140 may include a stepped portion 145 formed by the combination of the COB pad 141 and the COB chip 142.

[0056] Additionally, the wireless communication card 100 may include a COB receiving space 160, which penetrates a specific area of ​​the first cover layer 110 with an area corresponding to the COB pad 141 and is milled to the depth to which the antenna coil 121 of the antenna inlay layer 120 is exposed. The on-board chip 140 has its lower end face of the COB chip 142 facing the exposed face of the antenna inlay layer 120 and can be inserted into the COB receiving space 160 for mounting.

[0057] Furthermore, the wireless communication card 100 may include a PVC insert 150 that is first inserted into the COB receiving space 160. The PVC insert 150 may include a receiving groove 151 that supports a stepped portion 145 formed by the COB pad 141 and the COB chip 142, allowing the protrusion of the COB chip 142 forming the lower end of the COB pad 141 to pass through, and may be configured to face the antenna inlay layer 120.

[0058] Regarding the PVC insert 150, when the chip 140 on the board is inserted into the COB receiving space 160, it can be configured with a thickness such that the chip 140 on the board does not protrude to the outside. Preferably, the PVC insert 150 can be made of a PVC film having a thickness in the range of 0.1 to 0.3 mm.

[0059] Furthermore, the PVC insert 150 has a hot melt adhesive tape 300 on its lowest end face and can be attached to the antenna mounting layer 120. The PVC insert 150 can be processed to have the same area as the upper part of the chip 140 on the board exposed to the outside.

[0060] In the receiving groove 151, the COB chip 142 area, which is a protrusion of the chip 140 on the board, and the contact areas 143 and 144 of the COB at both ends of the antenna connecting the antenna coil 121, can be perforated opposite to the antenna inlay layer 120. The receiving groove 151 is machined by computer numerical control (CNC) and can be milled to a depth corresponding to the antenna inlay layer 120 exposed by the antenna coil.

[0061] Figure 3 is a flowchart illustrating a method for manufacturing a wireless communication card 100 according to an embodiment of the present invention.

[0062] Referring to Figure 3, in the manufacturing method of the wireless communication card 100, the first step is to process the antenna inlay layer (S101).

[0063] The antenna inlay layer 120 can be fabricated as a sheet including an antenna coil 121, the number of turns of which is determined by RF communication (e.g., NFC, RFID) sensitivity tests in order to present optimal sensitivity.

[0064] Furthermore, the step of stacking the first overlay layer is performed (S103).

[0065] The first cover layer 110 covering the upper part of the antenna inlay layer 120 can be stacked in such a way as to cover the upper part of the antenna inlay layer 120. The step of stacking the first cover layer (S103) may include the step of stacking an insulating layer 112 on the upper part of the antenna inlay layer 120 (not shown). The step of stacking the first cover layer (S103) may also include the step of stacking a heat-treated SUS metal layer 111 on the upper part of the insulating layer 112 to improve strength and resilience (not shown).

[0066] Simultaneously, the step of stacking a second cover layer may be included (not shown). The step of stacking the second cover layer may include stacking a second cover layer 130 that covers the lower part of the antenna inlay layer 120.

[0067] Furthermore, the step of laminating the second cover layer may include the step of laminating an epoxy layer 131 (not shown) under the antenna inlay layer 120. The epoxy layer 131 minimizes card bending and reduces traces that may be generated by the antenna coil.

[0068] Furthermore, the step of laminating the second cover layer may also include the step of laminating a printed layer 132 (not shown) beneath the epoxy layer 131. The step of laminating the second cover layer may also include the step of laminating an antibacterial layer 133 (not shown) made of antibacterial functional raw materials beneath the printed layer 132. The step of laminating the second cover layer may also include the step of laminating a magnetic strip cover layer 134 (not shown) beneath the antibacterial layer 133.

[0069] The metal layer 111, the insulating layer 112, the antenna inlay layer 120, the epoxy layer 131, the printed layer 132, the antibacterial layer 133, and the magnetic stripe covering layer 134 are closely attached to each of the laminated surfaces according to the lamination process, which can form and fix a body.

[0070] Furthermore, according to the execution of the PVC insert processing step (S105), a PVC insert 150 can be processed into a COB receiving space 160 that is milled in a specific area of ​​the first cover layer 110 and has a receiving groove 151 that supports the lower part of the solder pad of the chip 140 on the board.

[0071] Specifically, in the PVC insert processing step S105, a PVC insert 150 is processed in the COB chip 142 located on the lower end face of the COB pad 141, supporting the stepped portion 145 formed by the COB chip 142. This includes a receiving groove 151 with perforated ends for connecting to the ground, raised by removing the antenna coil 121, in the COB contact areas 143 and 144 located around the COB chip 142. The PVC insert 150 is preferably made of a PVC film with a thickness of 0.1 to 0.3 mm.

[0072] Subsequently, according to step (S107) of connecting the two ends of the antenna coil 121, the two ends of the antenna coil 121 led out from the antenna inlay layer 120 are connected to the contact areas 143 and 144 of the COB respectively via the receiving groove 151 provided inside the PVC insert 150.

[0073] Furthermore, according to step (S109) of installing the on-board chip 140, the on-board chip 140 can be installed in the PVC insert 150 inserted into the COB receiving space 160. The on-board chip 140 is clamped in the receiving slot 151 provided in the PVC insert 150, thereby allowing the COB chip 142 and the contact areas 143, 144 of the COB to be opposite each other without obstructing the antenna inlay layer 120 and the structure.

[0074] At this time, hot melt adhesive tape 300 is laminated on the lower end face of the PVC insert 150 and can be attached to the antenna inlay layer 120. Furthermore, the protrusion of the COB chip 142 region and the contact regions 143 and 144 of the COB are received in the receiving groove 151 and can be opposite to the antenna inlay layer 120.

[0075] The COB containment space 160 can be milled to a depth that penetrates the first cover layer 110 and exposes the antenna coil 121 of the antenna inlay layer 120.

[0076] The PVC insert processing step (S105) may include a first bonding step (S1051). In the first bonding step (S1051), COB fragments 200, after being perforated from the arranged on-board chips 140 and wound onto a first reel, are drawn out, and a PVC film (not shown) wound onto a second reel is drawn out, generating a first laminate (not shown) that bonds the PVC film to cover the perforated areas of the COB fragments 200. At this time, the COB fragments 200 are laminated with hot melt adhesive tape 300 in the areas contacting the PVC film, and the bonding force can be maintained according to the applied heat and pressure. As another embodiment, the COB fragments 200 are coated with a pre-molten hot melt in the areas contacting the PVC film, which can bond them when the PVC film is laminated.

[0077] Furthermore, the PVC insert processing step (S105) may also include a second bonding step (S1053). The second bonding step (S1053) may include, for the first laminate, drawing out a hot melt adhesive tape 300 wound on a third reel, and generating a second laminate (not shown) by layering the PVC surfaces of the first laminate.

[0078] Furthermore, the PVC insert processing step (S105) may also include an attachment step (S1055). The attachment step (S1055) may also include applying specific heat and pressure to the second adhesive to attach the COB fragment 200, the PVC film, and the hot melt adhesive tape 300.

[0079] Furthermore, the PVC insert processing step (S105) may also include a step of obtaining the PVC insert 150 (S1057). The step of obtaining the PVC insert 150 (S1057) may include obtaining the PVC insert 150 from the second adhesive obtained in the attachment step (S1055) through a perforation in the same area as the COB removal area of ​​the COB fragment 200.

[0080] Furthermore, the second bonding step (S1053) may also include a hot melt receiving groove generation step (S1053a). The hot melt receiving groove generation step (S1053a) may include, for the extended hot melt adhesive tape 300, at intervals corresponding to the perforated areas of the COB fragments 200, the area corresponding to the receiving groove 151 of the receiving point areas 143, 144 that can accommodate the COB and the COB chip 142 area that is the protrusion of the chip 140 on the board.

[0081] Furthermore, the step of installing the chip 140 on the board (S109) may also include the step of inserting the PVC insert 150 into the COB receiving space 160 (S1091). In the insertion step (S1091), the PVC insert 150 is inserted into the COB receiving space 160 in such a way that the hot melt adhesive tape 300 contacts the antenna inlay layer 120.

[0082] Furthermore, the step of installing the chip 140 on the board (S109) may also include a milling step (S1093). In the milling step (S1093), for the area corresponding to the receiving groove 151, the PVC insert 150 is milled and perforated by CNC machining in such a way that the COB chip 142 area, which is the protrusion of the chip 140 on the board, and the contact areas 143, 144 of the COB connecting the two ends of the antenna coil 121 can be opposite to the antenna inlay layer 120, until the depth point corresponding to the antenna inlay layer 120.

[0083] Furthermore, the step of installing the chip 140 on the board (S109) may also include the step of bonding the antenna coil 121 (S1095). In the bonding step (S1095), one end of each antenna coil 121 may be bonded to one or more contact areas 143, 144 of the COB formed on the lower end surface of the chip 140 on the board, which is sandwiched into the PVC insert 150, by spot welding. Although various bonding methods can be used, spot welding is preferred.

[0084] The wireless communication card 100 manufactured in this way can block electrical interference and improve production efficiency by improving the effectiveness of the process.

[0085] Figures 4 to 7 This is a cross-sectional view of the main steps in a method for manufacturing a wireless communication card according to an embodiment of the present invention.

[0086] Reference Figure 4 For the wireless communication card 100, after the various thin sheets are stacked and attached, a COB receiving space 160 can be formed by milling using CNC machining. The COB receiving space 160 penetrates the first cover layer 110 and can be formed by milling to a depth that exposes the antenna coil 121 of the antenna inlay layer 120.

[0087] Reference Figure 5 The PVC insert 150 can be inserted into the COB receiving space 160 of the wireless communication card 100 for the first time. The PVC insert 150 can maintain its bonding force with the antenna inlay layer 120 by the hot melt adhesive tape 300 attached to the lower end face.

[0088] Reference Figure 6 For the wireless communication card 100, a receiving slot 151 can be provided in the PVC insert 150 inserted into the COB receiving space 160 by milling using CNC machining. The receiving slot 151 can be perforated such that the COB chip 142 area, which is a protrusion of the chip 140 on the board, and the contact areas 143, 144 of the COB connecting the two ends of the antenna are opposite to the antenna mounting layer 120.

[0089] Reference Figure 7 The wireless communication card 100 can be connected to the contact areas 143 and 144 of the COB located at the lower end of the chip 140 on the board and to both ends of the antenna coil 121. After that, the chip 140 on the board is clipped into the receiving slot 151 of the PVC insert 150 and can be inserted into the COB receiving space 160.

[0090] Figure 8 and Figure 9This is an example diagram illustrating the apparatus and structural elements used in a method for manufacturing a wireless communication card according to an embodiment of the present invention.

[0091] Reference Figure 8 The wireless communication card 100 is a frame for making the PVC insert 150, which can utilize COB fragments 200. The COB fragments 200 are the remaining parts of multiple on-board chips 140 arranged by punching holes, which can be used to extract PVC inserts 150 with the same area as the on-board chips 140.

[0092] Reference Figure 9 The hot melt adhesive tape 300, which is used to bond the PVC insert 150 (which is inserted into the wireless communication card 100) to the antenna inlay layer 120 with a bonding force, can be perforated with the same area as the receiving slot 151. At this time, the hot melt adhesive tape 300 can be perforated at intervals corresponding to the openings of the COB fragments 200. Thus, the hot melt adhesive tape 300 is fitted to one side of the PVC insert 150's receiving slot 151 without obstructing a portion of the opening, and can be grounded to the antenna inlay layer 120.

[0093] Furthermore, although the preferred embodiments of the present invention have been illustrated above, the present invention is not limited to the specific embodiments described. Of course, those skilled in the art can make various modifications without departing from the spirit of the invention as claimed in the claims, and these modifications should not be understood solely from the technical concept or prospect of the present invention.

Claims

1. A method for manufacturing a wireless communication card, characterized in that, include: The step of stacking a first cover layer on top of an antenna inlay layer including an antenna coil; The step of penetrating a specific area of ​​the first overlay to form an on-board chip receiving space for inserting on-board chips that provide contact or contactless communication functions; The step of inserting a polyvinyl chloride insert into the chip receiving space formed on the board; The steps of allowing the two ends of the antenna coil extending from the antenna inlay layer to pass through the polyvinyl chloride insert and connect to the contact area formed on the chip on the board; and The step of mounting the chip on the board onto the polyvinyl chloride insert inserted into the chip receiving space on the board. A receiving groove is formed in the polyvinyl chloride insert for inserting a chip portion that protrudes towards the lower end of the chip on the board. The PVC insert is processed by bonding a chip fragment with an opening formed by perforating the chip on the board to a PVC film. After attaching hot melt adhesive tape with a perforated area corresponding to the receiving groove to the bonded composite, perforating the same area as the opening formed on the chip fragment to have the same area as the chip on the board.

2. The method for manufacturing a wireless communication card according to claim 1, characterized in that, The polyvinyl chloride insert is made of a polyvinyl chloride film with a thickness of 0.1 to 0.3 mm.

3. The method for manufacturing a wireless communication card according to claim 1, characterized in that, The PVC insert is obtained by laminating the hot melt adhesive tape onto the PVC film of the laminate and applying heat and pressure to adhere the chip fragments, the PVC film, and the hot melt adhesive tape to the board.

4. The method for manufacturing a wireless communication card according to claim 1, characterized in that, The polyvinyl chloride insert is attached to the antenna inlay layer using the hot melt adhesive tape.

5. The method for manufacturing a wireless communication card according to claim 1, characterized in that, It also includes the step of stacking a second cover layer that covers the lower part of the antenna inlay layer; The step of stacking the first cover layer further includes: The step of stacking an insulating layer on top of the antenna inlay layer; and A heat-treated SUS metal layer is laminated on top of the insulating layer to improve strength and resilience. The step of laminating the second cover layer also includes: The step of stacking an epoxy layer on the lower part of the antenna inlay layer; The step of laminating a printed layer on the underside of the epoxy layer; and The step of laminating an antibacterial layer using an antibacterial functional material at the bottom of the printed layer; The step of laminating the metal layer, the insulating layer, the antenna inlay layer, the epoxy layer, the printed layer and the antibacterial layer.

6. A wireless communication card, characterized in that, include: Antenna inlay layer, including antenna coil; A first covering layer covers the upper part of the antenna inlay layer; and The second cover layer covers the lower part of the antenna inlay layer. Specifically, an on-board chip receiving space is formed by penetrating a specific area of ​​the first cover layer to accommodate on-board chips that provide contact or contactless communication functions. A polyvinyl chloride insert with a receiving groove for inserting a chip portion protruding toward the lower end of a chip on the board is inserted into the chip receiving space on the board. The chip portion of the chip on the board is inserted into the receiving groove of the polyvinyl chloride insert, so that the chip on the board is mounted on the polyvinyl chloride insert inserted into the chip receiving space on the board. The PVC insert includes a hot melt adhesive tape perforated with an area corresponding to the receiving groove of the PVC insert, and is attached to the antenna inlay layer by means of the hot melt adhesive tape formed on the lowermost end face.

7. The wireless communication card according to claim 6, characterized in that, The polyvinyl chloride insert is made of a polyvinyl chloride film with a thickness of 0.1 to 0.3 mm.

8. The wireless communication card according to claim 6, characterized in that, The two ends of the antenna coil, which extend from the antenna inlay layer, pass through the receiving groove of the polyvinyl chloride insert and connect to the contact area of ​​the chip formed on the board. The receiving groove of the polyvinyl chloride insert is machined and perforated by computer numerical control to accommodate the chip portion protruding towards the lower end of the chip on the board and the contact area formed on the chip on the board.

9. The wireless communication card according to claim 7, characterized in that, The first overlay layer includes: An insulating layer is stacked on top of the antenna inlay layer; and A heat-treated stainless steel metal layer is stacked on top of the insulating layer to improve strength and resilience. The second covering layer includes: An epoxy layer covers the lower part of the antenna inlay layer; A printed layer, stacked beneath the epoxy layer; and An antibacterial layer, made of antibacterial functional materials, is laminated on the underside of the printed layer.

10. A wireless communication card, characterized in that, Manufactured by the manufacturing method according to any one of claims 1 to 5.

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