Shunt resistor and method of manufacturing the same

Abstract

A shunt resistor. A shunt resistor (1) includes a resistor body (3); first and second electrodes (5A, 5B) connected to both sides of the resistor body (3); first and second thermally conductive adhesive materials (6A, 6B) electrically connected to the first and second electrodes (5A, 5B), respectively; and a substrate (10) connected to the first and second electrodes (5A, 5B) by the first and second thermally conductive adhesive materials (6A, 6B). The first thermally conductive adhesive material (6A) is disposed in a first through-hole (7A) formed in the first electrode (5A) or the substrate (10), and the second thermally conductive adhesive material (6B) is disposed in a second through-hole (7B) formed in the second electrode (5B) or the substrate (10).

Description

Technical Field

[0001] This invention relates to a shunt resistor for current sensing, and more particularly to a voltage sensing terminal of a shunt resistor. Furthermore, this invention relates to a method for manufacturing such a shunt resistor. Background Technology

[0002] Traditionally, shunt resistors have been widely used for high-current sensing applications, such as monitoring the charging and discharging current of automotive batteries. Such a shunt resistor comprises a resistive element made of a low-resistivity material, electrodes connected to both ends of the resistive element, and voltage sensing terminals electrically connected to the electrodes. The voltage sensing terminals are used to measure the voltage (potential difference) applied across the resistive element.

[0003] With the increasing demand for higher currents as a market requirement, the thickness and width of the electrodes sandwiching the resistive element tend to increase. Along with this increase in electrode size, the construction of the voltage detector connected to the electrodes may itself affect the accuracy of current detection. Therefore, as shown in Patent Documents 1 to 3, various constructions of voltage detectors have been proposed in the past.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-009419

[0007] Patent Document 2: Japanese Patent Application Publication No. 2014-085245

[0008] Patent Document 3: Japanese Patent Application Publication No. 2015-184206 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] Patent Document 1 discloses a technique for vertically mounting a pin as a voltage detection terminal on an electrode. Specifically, a through hole is first formed on the electrode, then the pin is inserted into the through hole, thereby fixing the pin to the electrode. However, the machining accuracy of the through hole receiving the pin has a significant impact on the current detection accuracy.

[0011] Patent Document 2 discloses a technique for fixing the circuit board of a voltage sensing IC to a busbar using screws. However, this technique in Patent Document 2 requires forming threaded holes for inserting screws. Furthermore, the screw fixing requires a relatively large area, which may affect the accuracy of current detection.

[0012] Patent document 3 discloses a technique for connecting a pair of bonding wires used for voltage detection to a resistor. However, the bonding strength of the bonding wires is low, posing a risk that the accuracy of current detection will decrease over time.

[0013] Therefore, the present invention provides a shunt resistor having a voltage detection terminal that ensures high current detection accuracy and a method for manufacturing the same.

[0014] The means to solve the problem

[0015] In one embodiment, a shunt resistor is provided, comprising a resistive element, a first electrode and a second electrode, a first thermal adhesive material and a second thermal adhesive material, and at least one substrate. The first electrode and the second electrode are connected to both sides of the resistive element. The first thermal adhesive material and the second thermal adhesive material are electrically connected to the first electrode and the second electrode, respectively, and are conductive. The at least one substrate is connected to the first electrode and the second electrode by the first thermal adhesive material and the second thermal adhesive material. The first thermal adhesive material is disposed in a first through-hole formed on the first electrode or the substrate, and the second thermal adhesive material is disposed in a second through-hole formed on the second electrode or the substrate.

[0016] In one embodiment, the first through-hole and the second through-hole are formed on the substrate.

[0017] In one embodiment, the substrate further comprises a conductive layer forming the inner walls of the first through-hole and the second through-hole.

[0018] In one embodiment, the first thermal adhesive material and the second thermal adhesive material comprise solder.

[0019] In one embodiment, the aforementioned substrate is a wiring substrate having a first wiring and a second wiring that are electrically connected to the first thermal adhesive material and the second thermal adhesive material, respectively.

[0020] In one embodiment, an insulating plate is further provided between the substrate and the first electrode and the second electrode.

[0021] In one embodiment, a method for manufacturing a shunt resistor is provided, wherein at least one substrate having a first through-hole and a second through-hole is prepared, a first thermally adhesive material and a second thermally adhesive material having conductivity are disposed in the first through-hole and the second through-hole, and with the first through-hole and the second through-hole facing a first electrode and a second electrode connected to both sides of a resistor, the first thermally adhesive material and the second thermally adhesive material are heated to melt the first thermally adhesive material and the second thermally adhesive material, thereby connecting the substrate to the first electrode and the second electrode.

[0022] In one embodiment, the first thermal adhesive material and the second thermal adhesive material comprise solder.

[0023] In one embodiment, a method for manufacturing a shunt resistor is provided, wherein a first electrode and a second electrode are prepared to be connected to both sides of a resistor body; a first thermally adhesive material and a second thermally adhesive material having conductivity are disposed in a first through-hole and a second through-hole respectively formed on the first electrode and the second electrode; with the substrate facing the first through-hole and the second through-hole, the first thermally adhesive material and the second thermally adhesive material are heated to melt the first thermally adhesive material and the second thermally adhesive material, thereby connecting the substrate to the first electrode and the second electrode.

[0024] In one embodiment, the first thermal adhesive material and the second thermal adhesive material comprise solder.

[0025] The effects of the invention

[0026] According to the present invention, the first and second thermally adhesive materials themselves function as voltage sensing terminals. Unlike conventional voltage sensing terminals, the present invention eliminates the need for pins, connecting wires, screws, and other components, thus preventing a decrease in current sensing accuracy due to improper installation of these components. Therefore, the shunt resistor of the present invention achieves high current sensing accuracy. Attached Figure Description

[0027] Figure 1 This is a perspective view showing one implementation of a shunt resistor.

[0028] Figure 2 yes Figure 1 A sectional view along line AA.

[0029] Figure 3 This is a cross-sectional view showing the shunt resistor before the first and second thermal adhesive materials melt.

[0030] Figure 4It means Figure 1 and Figure 2 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0031] Figure 5 It means Figure 1 and Figure 2 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0032] Figure 6 It means Figure 1 and Figure 2 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0033] Figure 7 This is a cross-sectional view showing another implementation of the shunt resistor.

[0034] Figure 8 This is a cross-sectional view showing another implementation of a shunt resistor.

[0035] Figure 9 This is a cross-sectional view showing another implementation of a shunt resistor.

[0036] Figure 10 This is a cross-sectional view showing another implementation of a shunt resistor.

[0037] Figure 11 This is a cross-sectional view showing another implementation of a shunt resistor.

[0038] Figure 12 It means Figure 11 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0039] Figure 13 It means Figure 11 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0040] Figure 14 It means Figure 11 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor.

[0041] Figure 15 It means Figure 11 A diagram illustrating one embodiment of the manufacturing method of the shunt resistor. Detailed Implementation

[0042] In order to implement the invention

[0043] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0044] Figure 1This is a perspective view showing one implementation of a shunt resistor. Figure 2 yes Figure 1 A sectional view along line AA. The shunt resistor 1 includes a resistive body 3; a first electrode 5A and a second electrode 5B connected to both sides of the resistive body 3; a first thermal adhesive material 6A and a second thermal adhesive material 6B electrically connected to the first electrode 5A and the second electrode 5B, respectively; and a substrate 10 connected to the first electrode 5A and the second electrode 5B by the first thermal adhesive material 6A and the second thermal adhesive material 6B.

[0045] Examples of materials for the resistive element 3 include nickel-chromium alloys, copper-nickel alloys, copper-manganese alloys, and copper-manganese-nickel alloys. However, the material of the resistive element 3 is not particularly limited, as long as it achieves its intended purpose. Examples of materials for the first electrode 5A and the second electrode 5B include copper (Cu). However, the materials for the first electrode 5A and the aforementioned second electrode 5B are also not particularly limited, as long as they achieve their intended purpose. The first electrode 5A and the second electrode 5B each have bolt holes 9A and 9B for fixing the entire shunt resistor 1.

[0046] The first thermal adhesive material 6A and the second thermal adhesive material 6B are made of a conductive material, and in this embodiment, they are made of solder. Figure 2 As shown, a first thermal adhesive material 6A is disposed within a first through-hole 7A formed on the substrate 10. The first thermal adhesive material 6A, made of solder, is in a hardened state after being heated and melted. The end of the first thermal adhesive material 6A is in contact with the first electrode 5A. A second thermal adhesive material 6B is disposed within a second through-hole 7B formed on the substrate 10. The second thermal adhesive material 6B, also made of solder, is in a hardened state after being heated and melted, similar to the first thermal adhesive material 6A. The end of the second thermal adhesive material 6B is in contact with the second electrode 5B.

[0047] In this embodiment, the substrate 10 used is a wiring substrate (or printed circuit board) with printed wiring. The substrate 10 has a base plate 12 and an insulating layer 14 covering the upper and lower surfaces of the base plate 12. Examples of materials for the base plate 12 include resins such as epoxy glass, ceramics, metals such as aluminum, and combinations thereof. The upper and lower surfaces of the substrate 10 are formed by the insulating layer 14, and the insulating layer 14 forming the lower surface of the substrate 10 is in contact with the first electrode 5A, the second electrode 5B, and the resistor 3. Although not shown, the substrate 10 also includes an amplifier, an A / D converter, a temperature sensor, etc. Figure 1 and Figure 2 The substrate 10 shown is an example; it is sufficient to have a base plate 12, a first through hole 7A, and a second through hole 7B. The structure of the substrate 10 is not limited to... Figure 1 and Figure 2 The implementation method shown.

[0048] The first through-hole 7A faces the first electrode 5A, and the second through-hole 7B faces the second electrode 5B. The substrate 10 also includes a first conductive layer 15A forming the inner wall of the first through-hole 7A; a second conductive layer 15B forming the inner wall of the second through-hole 7B; and a first boss 16A and a second boss 16B respectively connected to the first conductive layer 15A and the second conductive layer 15B. The first conductive layer 15A and the first boss 16A forming the inner wall of the first through-hole 7A are integral. The second conductive layer 15B and the second boss 16B forming the inner wall of the second through-hole 7B are integral. Examples of the first boss 16A, the second boss 16B, the first conductive layer 15A, and the second conductive layer 15B include conductive materials such as copper foil, gold foil, and silver foil. Copper foil or gold foil can be formed on the substrate 12 by plating. The first boss 16A and the second boss 16B are electrically connected to the first wiring 17A and the second wiring 17B disposed on the base plate 12. In this embodiment, the first wiring 17A and the second wiring 17B are printed wirings. Furthermore, the first wiring 17A and the second wiring 17B may also be located inside (inner layer pattern), on the surface, or on the back of the base plate 12, without limitation.

[0049] The horizontal cross-sectional shape of the first through hole 7A and the second through hole 7B is not particularly limited, but examples of horizontal cross-sectional shapes include circles and semicircles. In the case of circles, the diameter of the first through hole 7A and the second through hole 7B is made to be 10 mm or less.

[0050] The first thermal adhesive material 6A contacts the first conductive layer 15A and the first electrode 5A forming the inner wall of the first through-hole 7A. Therefore, the first thermal adhesive material 6A establishes an electrical connection between the first conductive layer 15A and the first electrode 5A. Similarly, the second thermal adhesive material 6B contacts the second conductive layer 15B and the second electrode 5B forming the inner wall of the second through-hole 7B. Therefore, the second thermal adhesive material 6B establishes an electrical connection between the second conductive layer 15B and the second electrode 5B. Furthermore, for mechanical connection of the substrate 10 and the first electrode 5A and the second electrode 5B, mechanical connecting elements such as screws, bolts, and resin materials may be provided.

[0051] Figure 2 The first thermal adhesive material 6A and the second thermal adhesive material 6B, which are made of solder, are in a hardened state after being heated and melted. Figure 3 This is a cross-sectional view of the shunt resistor 1 before the first thermal bonding material 6A and the second thermal bonding material 6B are melted. (See attached image.) Figure 3 As shown, a first thermal bonding material 6A and a second thermal bonding material 6B, both made of solder, are disposed (filled) in the first through hole 7A and the second through hole 7B.

[0052] By heating the first thermal adhesive material 6A and the second thermal adhesive material 6B, the first thermal adhesive material 6A and the second thermal adhesive material 6B are melted. The result is as follows: Figure 2 As shown, the first thermal adhesive material 6A and the second thermal adhesive material 6B melt within the first through-hole 7A and the second through-hole 7B, respectively, and come into contact with the first electrode 5A and the second electrode 5B. As the temperature of the first thermal adhesive material 6A and the second thermal adhesive material 6B decreases, they harden. The hardened first thermal adhesive material 6A bonds to both the first electrode 5A and the first conductive layer 15A forming the inner wall of the first through-hole 7A, and the hardened second thermal adhesive material 6B bonds to both the second electrode 5B and the second conductive layer 15B forming the inner wall of the second through-hole 7B. Thus, the substrate 10 is electrically connected to the first electrode 5A and the second electrode 5B through the first thermal adhesive material 6A and the second thermal adhesive material 6B.

[0053] According to this embodiment, Figure 2 The first thermally bonded material 6A and the second thermally bonded material 6B shown function electrically as voltage detection terminals. Unlike conventional voltage detection terminals, this embodiment eliminates the need for pins, connecting wires, screws, etc., thus preventing a decrease in current detection accuracy due to improper installation of these components. Therefore, the shunt resistor 1 of this embodiment achieves high current detection accuracy. Furthermore, according to this embodiment, since it is not necessary to form through holes or threaded holes on the first electrode 5A and the second electrode 5B, a decrease in current detection accuracy due to the machining accuracy of the holes caused by electrical functional requirements can be prevented.

[0054] Examples of solder used as the first thermal adhesive material 6A and the second thermal adhesive material 6B, disposed in the first through-hole 7A and the second through-hole 7B before heating, include solder paste and wire solder. The first thermal adhesive material 6A and the second thermal adhesive material 6B can also be materials other than solder if they are conductive and have adhesive or bonding functions. For example, copper paste or conductive adhesives can also be used.

[0055] In the above embodiments, a single substrate 10 having both a first through-hole 7A and a second through-hole 7B is used, but the present invention is not limited to the above embodiments. In one embodiment, the substrate 10 may also include a first substrate having a first through-hole 7A and a second substrate having a second through-hole 7B. Even with this structure, the first substrate can be connected to the first electrode 5A by a first thermal adhesive material 6A disposed in the first through-hole 7A, and the second substrate can be connected to the second electrode 5B by a second thermal adhesive material 6B disposed in the second through-hole 7B.

[0056] Next, regarding Figure 1 and Figure 2The manufacturing method of the shunt resistor 1 shown is referred to Figures 4 to 6 Please provide an explanation.

[0057] First, such as Figure 4 As shown, a substrate 10 having a first through-hole 7A and a second through-hole 7B is prepared. Furthermore, an assembly 20 including a resistor 3 and a first electrode 5A and a second electrode 5B connected to both sides of the resistor 3 is prepared.

[0058] like Figure 5 As shown, the substrate 10 is disposed on the assembly 20 with the first through hole 7A and the second through hole 7B facing the first electrode 5A and the second electrode 5B connected to both sides of the resistor 3, respectively.

[0059] For reference Figure 3 As described, unmelted first thermal adhesive material 6A and second thermal adhesive material 6B are respectively disposed (filled) in the first through hole 7A and the second through hole 7B.

[0060] In one embodiment, after the substrate 10 is disposed on the assembly 20, the unmelted first thermal adhesive material 6A and the second thermal adhesive material 6B may be disposed (filled) in the first through hole 7A and the second through hole 7B, respectively.

[0061] like Figure 6 As shown, with the substrate 10 in contact with the assembly 20, the first thermal adhesive material 6A and the second thermal adhesive material 6B are heated to melt them. The heating temperature is above the melting point of the first thermal adhesive material 6A and the second thermal adhesive material 6B. The heating of the first thermal adhesive material 6A and the second thermal adhesive material 6B can be applied to the entire substrate 10 and the assembly 20, including the first thermal adhesive material 6A and the second thermal adhesive material 6B, or it can be applied to a localized area of ​​the first thermal adhesive material 6A and the second thermal adhesive material 6B. For example, the heating of the first thermal adhesive material 6A and the second thermal adhesive material 6B can be performed using a countercurrent device, a laser heater, or the like.

[0062] If the molten first thermal adhesive material 6A and the second thermal adhesive material 6B are cooled, then as per reference... Figure 2As described, the first thermal adhesive material 6A and the second thermal adhesive material 6B are hardened. The hardened first thermal adhesive material 6A is bonded to both the first electrode 5A and the first conductive layer 15A forming the inner wall of the first through hole 7A, and the hardened second thermal adhesive material 6B is bonded to both the second electrode 5B and the second conductive layer 15B forming the inner wall of the second through hole 7B. The substrate 10 is connected to the first electrode 5A and the second electrode 5B by the first thermal adhesive material 6A and the second thermal adhesive material 6B. Since the hardened first thermal adhesive material 6A and the second thermal adhesive material 6B are in contact with the first electrode 5A and the second electrode 5B respectively, the first thermal adhesive material 6A and the second thermal adhesive material 6B function as voltage detection terminals of the shunt resistor 1.

[0063] Figure 7 This is a cross-sectional view showing another embodiment of the shunt resistor 1. Unless otherwise specified, the structure and manufacturing method of this embodiment are similar to those described in the reference stencil. Figures 1 to 6 The implementation methods described are the same, so repeated descriptions are omitted.

[0064] In this embodiment, a flexible substrate is used as the substrate 10. The substrate 10, which is made of a flexible substrate, includes a base plate 12 made of a flexible sheet. The base plate 12 in this embodiment is thinner than a typical base plate made of epoxy glass. Thus, the thickness and material of the substrate 10 used in the shunt resistor 1 are not particularly limited.

[0065] Figure 8 This is a cross-sectional view showing another embodiment of the shunt resistor 1. Unless otherwise specified, the structure and manufacturing method of this embodiment are similar to those described in the reference numerator. Figures 1 to 6 The implementation methods described are the same, so repeated descriptions are omitted.

[0066] In this embodiment, with two substrates 10 and 11 overlapping, these substrates 10 and 11 are connected to the first electrode 5A and the second electrode 5B by a first thermal adhesive material 6A and a second thermal adhesive material 6B. Each of the two substrates 10 and 11 has a first through-hole 7A and a third through-hole 22A, which are arranged in series. The first thermal adhesive material 6A is disposed within the first through-hole 7A and the third through-hole 22A. Similarly, each of the two substrates 10 and 11 has a second through-hole 7B and a fourth through-hole 22B, which are arranged in series. The second thermal adhesive material 6B is disposed within the second through-hole 7B and the fourth through-hole 22B. The two substrates 10 and 11 are connected to each other by the first thermal adhesive material 6A and the second thermal adhesive material 6B, and further connected to the first electrode 5A and the second electrode 5B by the first thermal adhesive material 6A and the second thermal adhesive material 6B. Two substrates, 10 and 11, respectively have the same characteristics as... Figure 2The substrate 10 shown has the same structure, so its detailed description is omitted.

[0067] Substrates 10 and 11 are printed circuit boards having wiring electrically connected to a first thermally adhesive material 6A and a second thermally adhesive material 6B, which serve as voltage detection terminals. The wiring 17A and 17B of one of the two substrates 10, as described above, can be used for measuring voltage (potential difference) for current detection. Furthermore, the wiring 23A and 23B of the other substrate 11 can be used for measuring current or voltage as control signals. Thus, the shunt resistor 1, equipped with multiple substrates 10 and 11 having wiring 17A, 17B, 23A, and 23B electrically connected to the first thermally adhesive material 6A and the second thermally adhesive material 6B, can be used in a variety of applications, including current detection. Figure 8 In the embodiment shown, two substrates 10 and 11 overlap each other, but three or more substrates may also overlap each other.

[0068] Figure 9 This is a cross-sectional view showing another embodiment of the shunt resistor 1. Unless otherwise specified, the structure and manufacturing method of this embodiment are described using reference to... Figures 1 to 6 The implementation methods described are the same, so repeated descriptions are omitted.

[0069] In this embodiment, the inner walls forming the first through hole 7A and the second through hole 7B are formed by the base plate 12 itself. That is, the first through hole 7A and the second through hole 7B are holes formed on the base plate 12, and no conductive layer is provided to cover the inner walls of these holes. The opening ends of the first through hole 7A and the second through hole 7B are respectively surrounded by a first boss 16A and a second boss 16B, which are made of conductive materials such as copper foil or gold foil.

[0070] The first thermal adhesive material 6A and the second thermal adhesive material 6B fill the entirety of the first through hole 7A and the second through hole 7B. One end of the first thermal adhesive material 6A and the second thermal adhesive material 6B contacts the first electrode 5A and the second electrode 5B, respectively, and the other end of the first thermal adhesive material 6A and the second thermal adhesive material 6B contacts the first boss 16A and the second boss 16B, respectively. The first boss 16A and the second boss 16B are connected to the first wiring 17A and the second wiring 17B, respectively. In this embodiment, the first wiring 17A and the second wiring 17B are printed wirings, but they can also be wirings composed of conductive wires. The first electrode 5A is electrically connected to the first wiring 17A through the first thermal adhesive material 6A and the first boss 16A, and the second electrode 5B is electrically connected to the second wiring 17B through the second thermal adhesive material 6B and the second boss 16B. In addition, the positions of the first boss 16A and the second boss 16B can also be the surface or back of the base plate 12, and their positions are not particularly limited.

[0071] Figure 10 This is a cross-sectional view showing another embodiment of the shunt resistor 1. Unless otherwise specified, the structure and manufacturing method of this embodiment are similar to those described in the reference numerator. Figures 1 to 6 The implementation methods described are the same, so repeated descriptions are omitted.

[0072] In this embodiment, the shunt resistor 1 includes an insulating plate 25 disposed between the substrate 10 and the first electrode 5A and the second electrode 5B. The insulating plate 25 has through holes 26A and 26B arranged in series with the first through hole 7A and the second through hole 7B, respectively. A first thermal adhesive material 6A is disposed within the first through hole 7A and the through hole 26A of the insulating plate 25, and a second thermal adhesive material 6B is disposed within the second through hole 7B and the through hole 26B of the insulating plate 25. Marks, labels, etc., that can be visually identified by the user can be attached to the insulating plate 25.

[0073] Figure 10 The shunt resistor 1 shown is basically the same as the reference resistor. Figures 1 to 6 The described implementation is the same. That is, a substrate 10 having a first through hole 7A and a second through hole 7B is prepared; an insulating plate 25 having through holes 26A and 26B is prepared; and an assembly 20 including a resistor 3 and a first electrode 5A and a second electrode 5B connected to both sides of the resistor 3 is prepared.

[0074] Next, the unmelted first thermal adhesive material 6A is placed (filled) in the first through hole 7A and the through hole 26A of the insulating plate 25, and the unmelted second thermal adhesive material 6B is placed (filled) in the second through hole 7B and the through hole 26B of the insulating plate 25.

[0075] Then, with the insulating plate 25 positioned between the substrate 10 and the assembly 20, the first thermal adhesive material 6A and the second thermal adhesive material 6B are heated to melt them. If the temperature of the first thermal adhesive material 6A and the second thermal adhesive material 6B decreases, the substrate 10 is connected to the first electrode 5A and the second electrode 5B by the hardened first thermal adhesive material 6A and the second thermal adhesive material 6B, and the first thermal adhesive material 6A and the second thermal adhesive material 6B function as voltage detection terminals.

[0076] Figure 11 This is a cross-sectional view showing another embodiment of the shunt resistor 1. Unless otherwise specified, the structure and manufacturing method of this embodiment are similar to those described in the reference numerator. Figures 1 to 6 The implementation methods described are the same, so repeated descriptions are omitted.

[0077] In this embodiment, a first through-hole 7A and a second through-hole 7B are formed on the first electrode 5A and the second electrode 5B, respectively. The substrate 10 does not have through-holes. A first wiring 17A and a second wiring 17B of the substrate 10 face the first electrode 5A and the second electrode 5B. A first thermal adhesive material 6A is disposed within the first through-hole 7A formed on the first electrode 5A, and a second thermal adhesive material 6B is disposed within the second through-hole 7B formed on the second electrode 5B. The first thermal adhesive material 6A is in contact with both the first electrode 5A and the first wiring 17A, and the second thermal adhesive material 6B is in contact with both the second electrode 5B and the second wiring 17B. The substrate 10 is connected to the first electrode 5A and the second electrode 5B by the first thermal adhesive material 6A and the second thermal adhesive material 6B. In this embodiment, the first thermal adhesive material 6A and the second thermal adhesive material 6B also function as voltage detection terminals.

[0078] Next, regarding Figure 11 The manufacturing method of the shunt resistor 1 shown is referred to Figures 12 to 15 Please provide an explanation.

[0079] First, such as Figure 12 As shown, a substrate 10 having a first wiring 17A and a second wiring 17B is prepared; and an assembly 20 including a resistor 3 and a first electrode 5A and a second electrode 5B connected to both sides of the resistor 3 is prepared. The first electrode 5A and the second electrode 5B respectively have a first through hole 7A and a second through hole 7B.

[0080] Next, as Figure 13 As shown, the first thermal adhesive material 6A and the second thermal adhesive material 6B are disposed in (filled) the first through hole 7A and the second through hole 7B.

[0081] like Figure 14As shown, the substrate 10 is arranged such that the first wiring 17A of the substrate 10 faces the first through hole 7A and the second wiring 17B of the substrate 10 faces the second through hole 7B.

[0082] In one embodiment, after the substrate 10 is disposed on the assembly 20, the unmelted first thermal adhesive material 6A and the second thermal adhesive material 6B may be disposed (filled) in the first through hole 7A and the second through hole 7B, respectively.

[0083] like Figure 15 As shown, with the substrate 10 in contact with the assembly 20, the first thermal adhesive material 6A and the second thermal adhesive material 6B are heated to melt them. The heating temperature is above the melting point of the first thermal adhesive material 6A and the second thermal adhesive material 6B. The heating of the first thermal adhesive material 6A and the second thermal adhesive material 6B can be applied to the entire substrate 10 and the assembly 20, including the first thermal adhesive material 6A and the second thermal adhesive material 6B, or it can be applied to a localized area of ​​the first thermal adhesive material 6A and the second thermal adhesive material 6B. For example, the heating of the first thermal adhesive material 6A and the second thermal adhesive material 6B can be performed using a countercurrent device, a laser heater, or the like.

[0084] If the molten first thermal adhesive material 6A and second thermal adhesive material 6B are cooled, they harden. The hardened first thermal adhesive material 6A bonds to both the first electrode 5A and the first conductive layer 15A forming the inner wall of the first through hole 7A, and the hardened second thermal adhesive material 6B bonds to both the second electrode 5B and the second conductive layer 15B forming the inner wall of the second through hole 7B. The substrate 10 is connected to the first electrode 5A and the second electrode 5B by the first thermal adhesive material 6A and the second thermal adhesive material 6B. Since the first thermal adhesive material 6A and the second thermal adhesive material 6B are in contact with the first electrode 5A and the second electrode 5B respectively, they function as voltage detection terminals of the shunt resistor 1.

[0085] The shunt resistor 1 of each of the above embodiments can be used for current measurement such as 4-terminal measurement. By using the shunt resistor 1 of the above embodiments, high-precision current detection can be achieved.

[0086] The embodiments described above are intended to enable those skilled in the art to implement the present invention. Various modifications to the above embodiments can, of course, be made by those skilled in the art, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but can be interpreted within the widest scope of the technical concept defined by the claims.

[0087] Industrial utilization potential

[0088] This invention relates to a shunt resistor for current sensing, and is particularly applicable to the voltage sensing terminal of a shunt resistor. Furthermore, this invention can be applied to a method for manufacturing such a shunt resistor.

[0089] Explanation of symbols

[0090] 1: Shunt resistor

[0091] 3: Resistor

[0092] 5A: First electrode

[0093] 5B: Second electrode

[0094] 6A: First thermal adhesive material

[0095] 6B: Second thermal adhesive material

[0096] 7A: First through hole

[0097] 7B: Second through hole

[0098] 9A, 9B: Bolt holes

[0099] 10, 11: substrate

[0100] 12:Abutment board

[0101] 14: Insulation layer

[0102] 15A: First conductive layer

[0103] 15B: Second conductive layer

[0104] 16A: First boss

[0105] 16B: Second boss

[0106] 17A: First wiring

[0107] 17B: Second wiring

[0108] 20: Assembly

[0109] 22A: Third through hole

[0110] 22B: Fourth through hole

[0111] 23A, 23B: Wiring

[0112] 25: Insulation board

[0113] 26A, 26B: Through holes.

Claims

1. A shunt resistor, wherein, It comprises a resistive element, a first electrode and a second electrode, a first thermal adhesive material and a second thermal adhesive material, and at least one substrate. The first electrode and the second electrode are connected to both sides of the aforementioned resistive element; The first thermal adhesive material and the second thermal adhesive material are electrically connected to the first electrode and the second electrode, respectively, and are conductive. The at least one substrate is connected to the first electrode and the second electrode by the first thermal adhesive material and the second thermal adhesive material. The aforementioned first thermal adhesive material is disposed within the first through-hole formed on the aforementioned substrate. The second thermal adhesive material is disposed in the second through hole formed on the substrate.

2. The shunt resistor according to claim 1, wherein, The substrate further comprises a conductive layer forming the inner wall of the first through hole and the second through hole.

3. The shunt resistor according to claim 1 or 2, wherein, The aforementioned first thermal adhesive material and the aforementioned second thermal adhesive material include solder.

4. The shunt resistor according to claim 1 or 2, wherein, The aforementioned substrate is a wiring substrate having a first wiring and a second wiring that are electrically connected to the first thermal adhesive material and the second thermal adhesive material, respectively.

5. The shunt resistor according to claim 1 or 2, wherein, It also includes an insulating plate disposed between the substrate and the first electrode and the second electrode.

6. A shunt resistor, wherein, It comprises a resistive element, a first electrode and a second electrode, a first thermal adhesive material and a second thermal adhesive material, and at least one substrate. The first electrode and the second electrode are connected to both sides of the aforementioned resistive element; The first thermal adhesive material and the second thermal adhesive material are electrically connected to the first electrode and the second electrode, respectively, and are conductive. The at least one substrate is connected to the first electrode and the second electrode by the first thermal adhesive material and the second thermal adhesive material. The aforementioned first thermal adhesive material is disposed within the first through-hole formed on the aforementioned first electrode. The aforementioned second thermal adhesive material is disposed within the second through hole formed on the aforementioned second electrode.

7. The shunt resistor according to claim 6, wherein, The aforementioned first thermal adhesive material and the aforementioned second thermal adhesive material include solder.

8. The shunt resistor according to claim 6 or 7, wherein, The aforementioned substrate is a wiring substrate having a first wiring and a second wiring that are electrically connected to the first thermal adhesive material and the second thermal adhesive material, respectively.

9. The shunt resistor according to claim 6 or 7, wherein, It also includes an insulating plate disposed between the substrate and the first electrode and the second electrode.

10. A method for manufacturing a shunt resistor, wherein, Prepare at least one substrate having a first through hole and a second through hole. A first thermal adhesive material and a second thermal adhesive material having electrical conductivity are disposed in the first through hole and the second through hole. With the first through hole and the second through hole facing the first electrode and the second electrode connected to both sides of the resistor, respectively, the first thermal adhesive material and the second thermal adhesive material are heated to melt them. The substrate is connected to the first electrode and the second electrode by the first thermal adhesive material and the second thermal adhesive material.

11. The method for manufacturing a shunt resistor according to claim 10, wherein, The aforementioned first thermal adhesive material and the aforementioned second thermal adhesive material include solder.

12. A method for manufacturing a shunt resistor, wherein, Prepare the first and second electrodes to be connected to both sides of the resistor. A first thermally conductive adhesive material and a second thermally conductive adhesive material are disposed within a first through hole and a second through hole respectively formed on the first electrode and the second electrode. With the substrate facing the first through hole and the second through hole, the first thermal adhesive material and the second thermal adhesive material are heated to melt them. The substrate is connected to the first electrode and the second electrode by the first thermal adhesive material and the second thermal adhesive material.

13. The method for manufacturing a shunt resistor according to claim 12, wherein, The aforementioned first thermal adhesive material and the aforementioned second thermal adhesive material include solder.

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