A clamping welding mechanism

Abstract

This invention relates to a clamping and welding mechanism, comprising: a clamping fixture, the clamping fixture including: a first placement plate having a placement area for placing a semiconductor module, and a positioning block provided on one side of the placement area; and a clamping mechanism disposed on opposite sides of the first placement plate, the clamping mechanism being used to clamp the semiconductor module. The clamping and welding mechanism provided by this invention, because the positioning block is provided on the first placement plate, can limit the semiconductor module when it is placed in the placement area, and the clamping mechanism can clamp the semiconductor module. Therefore, it can reduce manual labor and costs, reduce the safety risk of hand injury, and simultaneously achieve positioning of the semiconductor module.

Description

[0001] This application is a divisional application of the patent application filed on March 15, 2022, with application number 202210254970.9 and invention title "An Automatic Welding Machine". Technical Field

[0002] This invention relates to the field of welding machine technology, and in particular to a clamping welding mechanism. Background Technology

[0003] Currently, ultrasonic welding machines offer significant advantages over other traditional processes (such as adhesive bonding, hot stamping, or screw fastening), including high production efficiency, excellent welding quality, and environmental friendliness and energy saving. Ultrasonic plastic welding equipment is widely used in industries such as medical devices, packaging, auto parts, and fishing gear.

[0004] In related technologies, most ultrasonic welding machines are semi-automatic manual feeding welding machines. The welding machines rely on manual assistance, which requires a lot of labor costs and poses a safety risk of hand injury during operation. Currently, the most advanced welding machines in the industry have not yet achieved fully automated production functions; and they cannot position semiconductor modules.

[0005] Therefore, it is necessary to propose a clamping welding mechanism to overcome at least one of the above-mentioned problems. Summary of the Invention

[0006] This invention provides a clamping welding mechanism to solve the problems in related technologies where welding machines rely on manual assistance, require a large amount of labor costs, pose a safety risk of hand injury during operation, and cannot position semiconductor modules.

[0007] In a first aspect, a clamping welding mechanism is provided, comprising a clamping fixture, the clamping fixture comprising: a first placement plate having a placement area for placing a semiconductor module, and a positioning block provided on one side of the placement area; and a clamping mechanism disposed on opposite sides of the first placement plate, the clamping mechanism being used to clamp the semiconductor module.

[0008] In some embodiments, the positioning blocks are provided on both sides of the placement area, and the arrangement direction of the positioning blocks is perpendicular to the arrangement direction of the clamping mechanism.

[0009] In some embodiments, the clamping mechanism includes a clamping cylinder that enables the clamping mechanism to extend and retract along the arrangement direction of the clamping mechanism to automatically clamp and release the semiconductor module in its arrangement direction.

[0010] In some embodiments, the clamping welding mechanism further includes a first drive motor, the clamping fixture is mounted on the first drive motor, and the first drive motor can drive the clamping fixture to move along an arrangement direction perpendicular to the clamping mechanism.

[0011] In some embodiments, a positioning fixture is also mounted on the first drive motor, the positioning fixture being used to fix and position the welding needle; the first drive motor can drive the positioning fixture to move along an arrangement direction perpendicular to the clamping mechanism.

[0012] In some embodiments, the positioning fixture includes: a second placement plate having a vacuum hole therein; and a positioning plate fixed to the second placement plate, the positioning plate having a positioning insertion hole for inserting the welding pin, the positioning insertion hole communicating with the vacuum hole, and the inner diameter of the positioning insertion hole being larger than the inner diameter of the vacuum hole.

[0013] In some embodiments, the positioning fixture further includes a base located at the bottom of the second placement plate, and a vacuum channel is provided inside the base; the vacuum channel and the vacuum hole are connected by a vacuum logic valve, and a sealing ring is provided at the connection between the vacuum logic valve and the vacuum channel; the vacuum logic valve is connected to the controller via an electrical signal.

[0014] In some embodiments, the clamping and welding mechanism further includes: a pick-and-place unit, the pick-and-place unit including a first pick-and-place mechanism, the first pick-and-place mechanism including a first lead screw module and an electric gripper mounted on the first lead screw module, the electric gripper being used to grip the semiconductor module; and a second drive motor, the second drive motor being capable of driving the first pick-and-place mechanism to move in a direction perpendicular to the first lead screw module.

[0015] In some embodiments, the clamping welding mechanism further includes a pick-and-place unit, which includes a second pick-and-place mechanism. The second pick-and-place mechanism includes: a vertical spindle, on which a rotary motor is mounted, the output shaft of which is horizontally arranged and has a suction nozzle for picking up the welding needle, the vertical spindle being rotatable about its axis; and a second lead screw module, which is connected to the vertical spindle via a connecting block.

[0016] In some embodiments, the clamping welding mechanism further includes a flexible vibratory feeder system, which includes a flexible vibratory feeder and an attitude camera. The flexible vibratory feeder is used to place the welding needle, and the attitude camera has a light to illuminate the flexible vibratory feeder and to take pictures of the welding needle inside the flexible vibratory feeder.

[0017] The beneficial effects of the technical solution provided by this invention include:

[0018] This invention provides a clamping welding mechanism. Since a positioning block is provided on the first placement plate, when the semiconductor module is placed in the placement area, the positioning block can limit the semiconductor module, and the clamping mechanism can clamp the semiconductor module. Therefore, it can reduce the use of manual labor and costs, reduce the safety risk of pinching hands, and also achieve positioning of the semiconductor module. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of an automatic welding machine provided in an embodiment of the present invention;

[0021] Figure 2 A left-side view of an automatic welding machine provided in an embodiment of the present invention;

[0022] Figure 3 This is a top view schematic diagram of an automatic welding machine provided in an embodiment of the present invention;

[0023] Figure 4 This is a three-dimensional structural diagram of an automatic welding machine housing provided in an embodiment of the present invention;

[0024] Figure 5 This is a three-dimensional structural schematic diagram of another automatic welding machine provided in an embodiment of the present invention;

[0025] Figure 6 A top view schematic diagram of another automatic welding machine provided in an embodiment of the present invention;

[0026] Figure 7 This is a three-dimensional structural diagram of the first picking and placing mechanism provided in an embodiment of the present invention;

[0027] Figure 8 A three-dimensional structural schematic diagram of the first drive motor provided in an embodiment of the present invention;

[0028] Figure 9 This is a three-dimensional structural diagram of the clamping fixture provided in an embodiment of the present invention;

[0029] Figure 10 This is a three-dimensional structural diagram of the positioning fixture provided in an embodiment of the present invention.

[0030] In the picture:

[0031] 1. Rack;

[0032] 2. Transmission unit; 21. Transmission line; 23. Blocking mechanism; 24. Lifting and positioning mechanism; 26. Barcode scanner;

[0033] 3. Welding unit; 32. Welding shaft; 33. Positioning camera;

[0034] 4. Drive unit; 42. First linear motor; 43. First drive motor; 44. Second drive motor; 45. Third drive motor;

[0035] 5. Picking and placing unit; 51. First picking and placing mechanism; 511. First lead screw module; 512. Electric gripper; 52. Second picking and placing mechanism;

[0036] 6. Flexible vibratory feeder system; 61. Flexible vibratory feeder; 62. Attitude camera; 63. Welding pin;

[0037] 7. Tray; 71. Semiconductor module;

[0038] 8. Clamping fixture; 81. First placement plate; 82. Positioning block; 83. Clamping mechanism; 84. Clamping cylinder;

[0039] 9. Positioning fixture; 91. Second placement plate; 92. Positioning plate; 921. Positioning socket; 93. Base; 94. Vacuum connector; 95. Vacuum logic valve. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] This invention provides a clamping welding mechanism that solves the problems in related technologies where welding machines rely on manual assistance, require a large amount of labor costs, pose a safety risk of hand injury during operation, and cannot position semiconductor modules.

[0042] See Figure 8 and Figure 9As shown, a clamping welding mechanism provided in an embodiment of the present invention may include a clamping fixture 8. The clamping fixture 8 may include: a first placement plate 81, which may be placed on the surface of a first drive motor 43. The first placement plate 81 may have a placement area, and a positioning block 82 is provided on one side of the placement area. Preferably, positioning blocks 82 may be provided at the four corners of the placement area. When the semiconductor module 71 is placed in the placement area, the positioning blocks 82 at the four corners may limit the semiconductor module 71 in the Y-axis direction; and a clamping mechanism 83, which is provided on opposite sides of the first placement plate 81. In this embodiment, two sets of clamping mechanisms 83 are provided, and are respectively provided on opposite sides of the first placement plate 81 along the X-axis direction. The clamping mechanism 83 is used to clamp the semiconductor module 71 along the X-axis direction. The clamping mechanism 83 is equipped with a clamping cylinder 84, which allows the clamping mechanism 83 to extend and retract along the X-axis direction (that is, the arrangement direction of the clamping mechanism 83), thereby automatically clamping and releasing the semiconductor module 71 in the X-axis direction.

[0043] Since the positioning block 82 is provided on the first placement plate, when the semiconductor module 71 is placed in the placement area, the positioning block 82 can limit the semiconductor module 71, and the clamping mechanism 83 can clamp the semiconductor module 71. Therefore, it can reduce the use of manual labor and costs, reduce the safety risk of pinching hands, and also achieve positioning of the semiconductor module 71.

[0044] See Figure 9 As shown, in some embodiments, the positioning blocks 82 are provided on both sides of the placement area, and the arrangement direction of the positioning blocks 82 is perpendicular to the arrangement direction of the clamping mechanism 83; that is, the positioning blocks 82 are arranged on both sides of the placement area along the Y-axis direction, and the clamping mechanism 83 is arranged on both sides of the first placement plate 81 along the X-axis direction.

[0045] Furthermore, the clamping welding mechanism also includes a drive unit 4, which may include a first drive motor 43. The clamping fixture 8 is mounted on the first drive motor 43, and the first drive motor 43 can drive the clamping fixture 8 to move along the arrangement direction perpendicular to the clamping mechanism 83 (i.e., the X-axis direction).

[0046] Furthermore, a positioning fixture 9 is also installed on the first drive motor 43, which is used to fix and position the welding needle 63; the first drive motor 43 can drive the positioning fixture 9 to move along the arrangement direction perpendicular to the clamping mechanism 83.

[0047] See Figure 1 , Figure 2 and Figure 5As shown, an automatic welding machine provided in an embodiment of the present invention may include: a frame 1; and a transmission unit 2, which may be installed on the frame 1. The transmission unit 2 may include a main body and a transmission line 21 installed on the main body. The transmission line 21 may be a belt or chain, etc. The transmission line 21 may move relative to the main body along the X-axis. In this embodiment, the extension direction along the transmission line 21 is defined as the X-axis, the direction perpendicular to the X-axis in the horizontal plane is defined as the Y-axis, and the direction perpendicular to both the X-axis and the Y-axis is defined as the Z-axis. The Z-axis is also the height direction of the frame 1, i.e., the vertical direction. The transmission line 21 is used to transmit the semiconductor module 71 to be welded. That is, the semiconductor module 71 can be placed directly on the transmission line 21, or the semiconductor module 71 can be placed on the transmission line 21. The semiconductor module 71 is placed in a tray 7, which is then placed on a transmission line 21. Two semiconductor modules 71 can be placed in one tray 7. A welding unit 3 is included, which has a welding head for picking up welding pins 63 and welding them to the semiconductor module 71. After the welding head contacts the welding pin 63, it can use vacuum to attract and fix the welding pin 63, move it to the welding position on the semiconductor module 71, and then weld it to the semiconductor module 71. A drive unit 4 is also included, connected to both the transmission unit 2 and the welding unit 3. The drive unit 4 can be a motor or a hydraulic device to provide power to the transmission unit 2 and the welding unit 3.

[0048] In this embodiment, since the driving unit 4 is connected to the transmission unit 2 and the welding unit 3, the driving unit 4 can provide power to the transmission unit 2 and the welding unit 3, thereby driving the transmission line 21 to move and automatically convey the semiconductor module 71 to the preset position. It also drives the welding unit 3 to automatically move the welding pin 63 to the welding position of the semiconductor module 71 and weld the welding pin 63 to the semiconductor module 71. This achieves full automation of the feeding and welding of the semiconductor module 71 and the welding pin 63. The entire processing is completed by automated equipment, and there is basically no need for manual assistance. The semiconductor module 71 can be placed in the inlet, saving labor costs and eliminating the need to consider the safety risks of personnel during the operation.

[0049] For details, see Figure 3 and Figure 5 As shown, the drive unit 4 may include a transmission motor connected to the transmission line 21, so that the transmission motor can drive the transmission line 21 to move along the X-axis. The drive unit 4 may also include a first linear motor 42, which can extend along the X-axis. The welding unit 3 may be mounted on the first linear motor 42, so that the first linear motor 42 can drive the welding unit 3 to move along the X-axis.

[0050] Further, see Figure 1 and Figure 5As shown, a flexible vibratory feeder system 6 can be installed on the frame 1. The flexible vibratory feeder system 6 can include a flexible vibratory feeder 61 and an attitude camera 62. Multiple welding pins 63 are placed inside the flexible vibratory feeder 61. The attitude camera 62 has a light that can illuminate the flexible vibratory feeder 61, so that the attitude camera 62 can take pictures of the welding pins 63 inside the flexible vibratory feeder 61. The attitude of each welding pin 63 can be determined based on the pictures. During the process of picking up or grabbing welding pins 63, welding pins 63 with suitable attitudes can be selected for material picking.

[0051] See Figure 4 and Figure 5 As shown, in some embodiments, the transmission unit 2 may further include a detection sensor and a blocking mechanism 23 disposed on the adjacent side of the transmission line 21. When the detection sensor detects the tray 7 on which the semiconductor module 71 is placed, in this embodiment, taking the semiconductor module 71 placed in the tray 7 as an example, the tray 7 is placed on the transmission line 21 and moves with the transmission line 21. The detection sensor can directly detect whether the tray 7 is in position. When the semiconductor module 71 is directly placed on the transmission line 21, the detection sensor can also directly detect whether the semiconductor module 71 has reached a preset position. The blocking mechanism 23 may have a blocking cylinder. When the detection sensor detects the tray 7, the blocking cylinder lifts up to stop the tray 7.

[0052] Further, see Figure 1 As shown, the transmission unit 2 may further include a lifting and positioning mechanism 24, which is located at the bottom of the transmission line 21. The lifting and positioning mechanism 24 may have a positioning pin, and the tray 7 may be provided with a positioning hole. When the tray 7 is in place and the blocking mechanism blocks the tray 7, the cylinder of the lifting and positioning mechanism 24 lifts, so that the positioning pin is inserted into the positioning hole of the tray 7 to position the tray 7 and prevent the tray 7 from moving in subsequent operations. The lifting and positioning mechanism 24 also lifts the tray 7.

[0053] In some embodiments, see Figure 6 and Figure 8As shown, the drive unit 4 may further include a first drive motor 43, on which a clamping fixture 8 and a positioning fixture 9 are mounted. The first drive motor 43 can drive the clamping fixture 8 and the positioning fixture 9 to move along the Y-axis. One, two, or more of the first drive motor 43, clamping fixture 8, and positioning fixture 9 may be provided. The first drive motor 43 is used to drive the clamping fixture 8 and the positioning fixture 9 to move to the welding unit 3. That is, the first drive motor 43 can drive the clamping fixture 8 and the positioning fixture 9 to move along the Y-axis from near the transmission line 21 to near the welding unit 3 to facilitate subsequent welding operations. The automatic welding machine may also include... The system includes a pick-and-place unit 5 located on one side of the transmission unit 2. The pick-and-place unit 5 is used to move the semiconductor module 71 from the transmission line 21 to the clamping fixture 8 and to move the welding pin 63 to the positioning fixture 9. Specifically, after the tray 7 moves to a preset position on the transmission line 21, the pick-and-place unit 5 can transfer the semiconductor module 71 in the tray 7 to the clamping fixture 8 to fix and position the semiconductor module 71. The pick-and-place unit 5 can also move the welding pin 63 in the flexible vibratory feeder 61 to the positioning fixture 9 to fix and position the welding pin 63. This ensures that the semiconductor module 71 and the welding pin 63 will not move or fall off during the process of moving to the vicinity of the welding unit 3. In this embodiment, two first drive motors 43 are provided on the frame 1. Each first drive motor 43 can be equipped with a clamping fixture 8 and a positioning fixture 9. When the semiconductor module 71 on one of the first drive motors 43 is performing welding operations, the other first drive motor 43 can perform preparatory work, that is, move the semiconductor module 71 and the welding pin 63 from the transmission line 21 to the welding unit 3 side. With this configuration, the welding unit 3 can perform alternating welding on the two first drive motors 43, thereby improving the welding efficiency.

[0054] In some alternative embodiments, see Figure 8 and Figure 9As shown, the clamping fixture 8 may include: a first placement plate 81, which can be placed on the surface of the first drive motor 43. The first placement plate 81 may have a placement area, and a positioning block 82 is provided on one side of the placement area. Preferably, positioning blocks 82 can be provided at all four corners of the placement area. When the semiconductor module 71 is placed in the placement area, the positioning blocks 82 at the four corners can limit the semiconductor module 71 in the Y-axis direction; and a clamping mechanism 83, which is provided on opposite sides of the first placement plate 81. In this embodiment, two sets of clamping mechanisms 83 are provided, and they are respectively provided on opposite sides of the first placement plate 81 along the X-axis direction. The clamping mechanism 83 is used to clamp the semiconductor module 71 along the X-axis direction. The clamping mechanism 83 is provided with a clamping cylinder 84, so that the clamping mechanism 83 can extend and retract along the X-axis direction, thereby automatically clamping and releasing the semiconductor module 71 in the X-axis direction.

[0055] In some embodiments, see Figure 10 As shown, the positioning fixture 9 may include: a second placement plate 91, the second placement plate 91 having a vacuum hole; and a positioning plate 92 fixed to the second placement plate 91, wherein the positioning plate 92 may be located above the second placement plate 91, the positioning plate 92 having a positioning insertion hole 921 for inserting the welding pin 63, the positioning insertion hole 921 penetrating the positioning plate 92 vertically, the positioning insertion hole 921 communicating with the vacuum hole, and the positioning insertion hole 921 corresponding one-to-one with the vacuum hole. In this embodiment, each positioning plate 92 is provided with The system includes 24 positioning holes 921. The inner diameter of each positioning hole 921 can be larger than the inner diameter of the vacuum hole, and slightly larger than the outer diameter of the welding needle 63. This facilitates the insertion of the welding needle 63 into the positioning holes 921 and provides a certain positioning function for the welding needle 63. In this embodiment, by setting a vacuum hole with a smaller inner diameter, it is ensured that the bottom surface of the welding needle 63 can completely cover the opening of the vacuum hole after it is placed in the positioning hole 921, thereby adsorbing and fixing the welding needle 63 in the positioning hole 921. In this embodiment, the inner diameter of the vacuum hole is preferably 1 mm, and the inner diameter of the positioning hole 921 is preferably 2.1 mm.

[0056] Based on the above technical solutions, see [link to relevant documentation]. Figure 10As shown, the positioning fixture 9 may further include a base 93, which is located at the bottom of the second placement plate 91. The second placement plate 91 may be located above the base 93 or may partially overlap the base 93 in the horizontal direction. The base 93 may have a vacuum channel, and the side of the base 93 may have a vacuum connector 94 communicating with the vacuum channel. The vacuum connector 94 can be connected to a vacuum generating device. The vacuum channel and the vacuum hole can be connected by a vacuum logic valve 95, and a sealing ring is provided at the connection between the vacuum logic valve 95 and the vacuum channel. The vacuum logic valve 95 is connected to the controller via an electrical signal. In this embodiment, the vacuum logic valve 95 can control the opening and closing of the vacuum channel and the vacuum hole. When the controller controls the vacuum logic valve 95 to open, the vacuum channel and the vacuum hole are connected, and a vacuum can be formed in the vacuum hole. When the controller controls the vacuum logic valve 95 to close, the vacuum channel and the vacuum hole are disconnected, and no vacuum is formed in the vacuum hole. By setting the vacuum logic valve 95, the welding pin 63 in the positioning socket 921 can be automatically attracted and disconnected without manual operation.

[0057] In some embodiments, see Figure 7 As shown, the pick-and-place unit 5 may include a first pick-and-place mechanism 51, which may include a first lead screw module 511 and an electric gripper 512 mounted on the first lead screw module 511. The electric gripper 512 is used to grip the semiconductor module 71, wherein the first lead screw module 511 can drive the electric gripper 512 to move up and down along the Z-axis. The drive unit 4 may also include a second drive motor 44, which can drive the first pick-and-place mechanism 51 to move in a direction perpendicular to the first lead screw module. The second drive motor 44 may be a linear motor along the X-axis or a linear motor along the Y-axis, such that the second drive motor 44 can... The entire pick-and-place unit 5 is driven to move along the X-axis or Y-axis. In this embodiment, taking the second drive motor 44 as a linear motor along the X-axis as an example, two pick-and-place units 5 can be set on the second drive motor 44 to respectively pick up the semiconductor modules 71 in the two trays 7 on the transmission line 21. Then, the drive unit 4 can also include two third drive motors 45. Both third drive motors 45 are linear motors along the Y-axis, and the two third drive motors 45 are arranged opposite each other at intervals. The two ends of the second drive motor 44 are respectively installed on the two third drive motors 45, so that the two third drive motors 45 synchronously drive the first drive motor 43 to move along the Y-axis on both sides, thereby realizing the movement of the pick-and-place unit 5 along the Y-axis.

[0058] In some alternative embodiments, see Figure 3 and Figure 5As shown, the pick-and-place unit 5 may further include a second pick-and-place mechanism 52. The second pick-and-place mechanism 52 may include: a vertical main shaft, on which a rotary motor is mounted. The output shaft of the rotary motor is horizontally positioned, and the output shaft is provided with a suction nozzle. This allows the rotary motor to drive the output shaft to rotate while simultaneously rotating the suction nozzle in a vertical plane. The suction nozzle is used to pick up the welding pin 63. When the suction nozzle picks up the welding pin 63, the welding pin 63 is in a horizontal state. When the suction nozzle rotates 90° in the vertical plane, the welding pin 63 can be adjusted to a vertical state, making it convenient to place the welding pin 63 vertically onto the positioning fixture 9 or onto the semiconductor module 71. The vertical main shaft can rotate around its axis, that is... The vertical spindle is vertical. When the vertical spindle rotates around its axis, it can drive the rotary motor and the suction nozzle to rotate in the horizontal plane to adjust the direction of the welding needle 63. The second lead screw module is connected to the vertical spindle via a connecting block. The second lead screw module includes a lead screw motor and a second lead screw connected to the motor. The lead screw motor can drive the second lead screw to move up and down and rotate around its axis. The second lead screw is connected to the vertical spindle via the connecting block, so that when the second lead screw moves up and down, it can drive the vertical spindle, the rotary motor, and the suction nozzle to move up and down together. After the suction nozzle picks up the welding needle 63, it can move downwards to insert the welding needle 63 into the positioning fixture 9.

[0059] Furthermore, the pick-and-place unit 5 also includes a spline motor. The spline motor meshes with a gear on the vertical spindle through a spline, so that when the spline motor rotates, the spline motor can drive the gear to rotate through the spline, and the gear can then drive the vertical spindle to rotate around its axis, thereby realizing the rotation of the vertical spindle in the horizontal plane.

[0060] Preferred, see Figure 5 As shown, the welding unit 3 may include a welding shaft 32, on which the welding head is fixed. The welding shaft 32 can move vertically, allowing the welding head to move up and down with it. A positioning camera 33 may also be provided on one side of the welding head. When the semiconductor module 71 moves near the welding head, or when the welding head moves near the semiconductor module 71, the positioning camera 33 can take a picture of the semiconductor module 71 to check if the welding position on the semiconductor module 71 exceeds a preset range. If it exceeds the preset range, the semiconductor module 71 can be removed from the welding machine; if it does not exceed the preset range, the subsequent normal welding procedure can proceed. In this embodiment, by setting the positioning camera 33, it can be ensured that the welding pin 63 can be accurately welded to the corresponding welding position of the semiconductor module 71.

[0061] Furthermore, the welding machine may also include a housing located outside the frame 1, and the transmission unit 2, welding unit 3 and pick-and-place unit 5 may all be located inside the housing. The housing may have an inlet and outlet corresponding to one end of the transmission unit 2 for the tray 7 to enter and exit, and the housing may be equipped with a three-color light, an emergency stop button and a display.

[0062] Preferably, the semiconductor module 71 in this embodiment is an IGBT (Insulated Gate Bipolar Transistor) module. Each semiconductor module 71 has 3 substrates, and each substrate has 8 welding positions, that is, 8 welding pins 63 are welded to each substrate. The welding head adopts ultrasonic welding with a welding frequency of 40KHZ. Welding begins when the welding pressure reaches 180N and the welding time is 0.15s. During the welding process, the welding shaft 32 needs to move downward by 0.03-0.04mm. The welding pressure can be monitored during the welding process, and time-displacement and time-pressure curves can be generated. After welding is completed, the clamping fixture 8 and the positioning fixture 9 can be moved from the welding unit 3 to the transmission unit 2 by the first drive motor 43. Then, the semiconductor module 71 can be moved to the original tray 7 by the electric gripper 512, and returned to the inlet and outlet of the tray 7 along the original path through the transmission line 21 to realize the discharge. Based on the time displacement and time pressure curves, it can be analyzed that the time required to weld a single welding pin 63 is 1.95s. Welding one semiconductor module 71 requires welding 24 pins, t = 24 * 1.95 + 2.1 = 48.9s. The time to place the welding pin 63 is 50.4s, the time to pick up and place the module is 6.3s, and the time for the tray 7 to enter or exit is 2.5s. The time to place the welding pin 63 is 50.4s > 48.9s. The time required to weld one semiconductor module 71 is 50.4s + 6.3 + 3 / 2 = 57.95s (two semiconductor modules 71 in one tray 7). The maximum UPH of a single automatic welding machine is 3600s / 57.95 (s / PCS) = 62PCS / H > 60PCS / H, which meets the requirements.

[0063] See Figure 1 As shown, a barcode scanner 26 can be installed on one side of the transmission line 21. When the semiconductor module 71 is soldered to the solder pin 63 and is transmitted on the transmission line 21, the barcode scanner 26 can scan and record the semiconductor module 71 and the corresponding tray 7, and can establish a corresponding matching relationship between the semiconductor module 71 and the tray 7 on the computer.

[0064] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0065] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0066] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A clamping welding mechanism, characterized in that, It includes a clamping fixture (8), said clamping fixture (8) comprising: A first placement plate (81) has a placement area for placing a semiconductor module (71), and a positioning block (82) is provided on one side of the placement area. And a clamping mechanism (83) is provided on opposite sides of the first placement plate (81), the clamping mechanism (83) is used to clamp the semiconductor module (71), and the clamping mechanism (83) is provided with a clamping cylinder (84). The clamping welding mechanism further includes a welding unit (3), which has a welding head for picking up the welding needle (63) and welding the welding needle (63) to the semiconductor module (71) for fixation; The clamping welding mechanism further includes a first drive motor (43), the clamping fixture (8) is mounted on the first drive motor (43), and a positioning fixture (9) is also mounted on the first drive motor (43). The positioning fixture (9) is used to fix and position the welding needle (63). The first drive motor (43) can drive the clamping fixture (8) and the positioning fixture (9) to move to the welding unit (3). The clamping and welding mechanism further includes a pick-and-place unit (5), which is used to move the semiconductor module (71) to the clamping fixture (8) and move the welding pin (63) to the positioning fixture (9). The positioning fixture (9) includes: a second placement plate (91) having a vacuum hole; a positioning plate (92) fixed to the second placement plate (91), the positioning plate (92) having a positioning insertion hole (921) for inserting the welding pin (63), the positioning insertion hole (921) communicating with the vacuum hole, and the inner diameter of the positioning insertion hole (921) being larger than the inner diameter of the vacuum hole; and a base (93) located at the bottom of the second placement plate (91), the base (93) having a vacuum channel; the vacuum channel communicating with the vacuum hole via a vacuum logic valve (95); The pick-and-place unit (5) includes a first pick-and-place mechanism (51), which includes a first lead screw module (511) and an electric gripper (512) mounted on the first lead screw module (511). The electric gripper (512) is used to grip the semiconductor module (71). And a second drive motor (44), which can drive the first pick-and-place mechanism (51) to move in a direction perpendicular to the first lead screw module (511).

2. The clamping and welding mechanism as described in claim 1, characterized in that: The positioning blocks (82) are provided on both sides of the placement area, and the arrangement direction of the positioning blocks (82) is perpendicular to the arrangement direction of the clamping mechanism (83).

3. The clamping and welding mechanism as described in claim 1, characterized in that: The clamping cylinder (84) enables the clamping mechanism (83) to extend and retract along the arrangement direction of the clamping mechanism (83) to automatically clamp and release the semiconductor module (71) in its arrangement direction.

4. The clamping and welding mechanism as described in claim 1, characterized in that: The vacuum logic valve (95) is provided with a sealing ring at the connection between itself and the vacuum channel, and the vacuum logic valve (95) is connected to the controller via an electrical signal.

5. The clamping and welding mechanism as described in claim 1, characterized in that, The pick-and-place unit (5) includes a second pick-and-place mechanism (52), which includes: A vertical spindle is equipped with a rotary motor. The output shaft of the rotary motor is horizontally positioned and has a suction nozzle for picking up welding needles (63). The vertical spindle can rotate around its axis. And a second lead screw module, which is connected to the vertical main shaft via a connecting block.

6. The clamping and welding mechanism as described in claim 5, characterized in that: The clamping welding mechanism also includes a flexible vibratory plate system (6), which includes a flexible vibratory plate (61) and an attitude camera (62). The flexible vibratory plate (61) is used to place the welding needle (63), and the attitude camera (62) has a light to illuminate the flexible vibratory plate (61) and to take pictures of the welding needle (63) inside the flexible vibratory plate (61).

Images