一种铝线键合方法
By moving the bonding head out of the welding area during the aluminum wire bonding process using the set height and length, the chamfered burrs on the aluminum wire cutting surface are smoothed or bent by friction with the pin surface, thus solving the cratering phenomenon, improving product yield, and making it suitable for a variety of bonding equipment.
CN115621141BActive Publication Date: 2026-07-17CHONGQING PINGCHUANG SEMICON RES INST CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHONGQING PINGCHUANG SEMICON RES INST CO LTD
- Filing Date
- 2022-10-13
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the existing aluminum wire bonding process, cratering occurs frequently, affecting product yield, and existing technologies are difficult to effectively avoid.
Method used
When the bonding head moves out of the welding area at a set height and length, the chamfered burrs on the aluminum wire cut surface rub against the pin surface, making it flat or bend in the opposite direction, thus preventing the chamfered burrs from wedging into the chip aluminum pad layer. The solder joint is formed by using a front cutter or a rear cutter combined with ultrasonic bonding.
Benefits of technology
It effectively reduces the probability of cratering, improves product yield, and has strong equipment versatility, requiring no modification to existing equipment.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN115621141B_ABST
Abstract
本发明涉及芯片封装技术领域，具体公开了一种铝线键合方法，包括如下步骤：铝线切断：切刀根据设定的切割深度，将铝线切断；移出焊接区：键合头按设定高度及长度移出焊接区域，其中，设定的高度为0。本发明的技术方案具有较强的通用性，能够进一步降低出现弹坑现象的概率，提高产品良率。
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