Limiting structure and chip repair device for chip repair

Abstract

A limiting structure and a chip repair device for chip repair, the limiting structure is in the shape of a ring sleeve, the limiting structure forms an accommodating space and has a first opening and a second opening, the first opening, the accommodating space and the second opening are communicated in sequence, and the limiting structure has viscosity at the second opening. By making the limiting structure have viscosity at the second opening and making the limiting structure tightly contact the surface of the pad on the circuit back plate at the second opening, the welding material enters the accommodating space from the first opening and is stacked on the surface of the pad at the second opening, and the limiting structure limits the welding material in the accommodating space, so that the welding material injected through the limiting structure cannot flow out of the pad, the short circuit problem caused by the overflow of the welding material is avoided, and the repair yield is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a limiting structure and a chip repair device for chip repair. Background Technology

[0002] Micro-LED technology involves thinning, miniaturizing, and arraying LED structures to a size of approximately 1–10 μm. These chips are then mass-transferred onto a circuit backplane, followed by physical deposition of a protective layer and electrodes, and finally encapsulation to complete the Micro-LED display. Micro-LED displays offer excellent stability and long lifespan, while retaining the advantages of LEDs such as low power consumption, high color saturation, fast response time, and strong contrast. They are widely used in wearable devices, ultra-large display screens, and wireless optical communications. During the manufacturing process of a Micro-LED display panel, the LED chips must first be transferred from their respective growth circuit backplanes onto the display panel. However, if any LED chip is damaged or has poor contact, a dead pixel will appear on the display panel after transfer, affecting the image quality.

[0003] Currently, chip repair mainly involves removing defective chips with lasers and then directly injecting conductive solder to re-bond them. However, this method cannot control short circuits and other defects caused by the overflow of conductive solder, thus affecting the repair yield. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a limiting structure and a chip repair device for chip repair, which can prevent conductive solder from overflowing and improve the repair yield.

[0005] This application provides a limiting structure for chip repair. The limiting structure is annular and encloses a receiving space with a first opening and a second opening. The first opening, the receiving space, and the second opening are sequentially connected. The limiting structure has adhesiveness at the second opening so that the limiting structure is tightly attached to the pads on the circuit backplane at the second opening.

[0006] By making the limiting structure adhesive at the second opening, so that the limiting structure is in close contact with the surface of the pad on the circuit backplane at the second opening, the solder enters the receiving space from the first opening and stacks on the surface of the pad at the second opening. The limiting structure restricts the solder within the receiving space, so that the solder injected through the limiting structure will not flow out of the pad, avoiding short circuit problems caused by solder overflow and improving the repair yield.

[0007] In one embodiment, the circuit backplane has a plurality of pads arranged along a first direction. The plane containing the second opening is a first plane. The orthographic projection of the first opening onto the first plane in the first direction has a size D1, and the size of the second opening in the first direction is D2. The limiting structure satisfies the relationship: D2 ≥ D1. When the surface size of the pad is large, the size of the second opening should be large. By making the limiting structure satisfy the above relationship, that is, in the first direction, the orthographic projection of the first opening onto the first plane is smaller than the size of the second opening, and when the size of the second opening is large, the size of the first opening remains small, which helps to facilitate the installation of the first opening with the solder injection device.

[0008] In one embodiment, the distance between two adjacent pads in the first direction is D, and the limiting structure satisfies the relationship: (D2-D1) < D. By making the limiting structure 10 satisfy the above relationship, when solder is injected onto the surfaces of two adjacent pads simultaneously, the second openings of the two adjacent limiting structures can simultaneously adhere to the surface of the pads. When (D2-D1) > D, the width of the second opening is too large, causing the two adjacent limiting structures to not simultaneously and completely adhere to the surface of the pads, thus failing to achieve the purpose of preventing solder overflow. When (D2-D1) = D, if it is necessary for both adjacent limiting structures to adhere to the corresponding pads, the two limiting structures need to be just connected, which requires high operational precision and is not easy to operate.

[0009] In one embodiment, the dimension of the pad in the first direction is D3, and the limiting structure satisfies the relationship: D2≤D3. By making the limiting structure satisfy the above relationship, that is, making the outline of the second opening within the surface of the pad, the solder material is completely stacked on the surface of the pad, preventing it from overflowing to the circuit backplane and causing a short circuit.

[0010] Based on the same inventive concept, this application also provides a chip repair apparatus, which includes a transmission channel and a limiting structure as described in any of the above embodiments. The transmission channel and the limiting structure are connected, and the transmission channel is used to transmit the solder to the receiving space. By providing an interconnected transmission channel and the limiting structure provided in the embodiments of this application in the chip repair apparatus, the transmission channel is used to transmit the solder to the limiting structure, and the limiting structure can prevent the solder from overflowing when injected into the pad surface, thereby achieving the purpose of accurately injecting the solder into the pad surface, solving the problem of chip short circuit caused by solder overflow, and improving the chip repair yield.

[0011] In one embodiment, the limiting structure is detachably connected to the transmission channel. By making the limiting structure and the transmission channel detachably connected, the limiting structure can be easily replaced, allowing the shape of the second opening to be adjusted according to the pads. Thus, one transmission channel can be matched with multiple limiting structures of different shapes. When the shape of the pads changes, only different limiting structures need to be replaced, improving the versatility of the chip repair device and saving production costs.

[0012] In one embodiment, the chip repair device further includes a valve disposed between the first opening and the transmission pipe. The valve is used to control the flow rate of the solder into the receiving space. By placing a valve between the first opening and the transmission pipe, the start and stop of solder injection on the pad surface and the flow rate can be limited by the degree of valve opening and closing. Furthermore, the efficiency and volume of solder injection can be controlled, which is beneficial to improving repair yield and efficiency.

[0013] In one embodiment, the chip repair apparatus further includes a storage container and a liquid pump. The storage container, the liquid pump, and the transmission pipeline are connected. The storage container is used to store solder, and the liquid pump is used to pump the solder from the storage container into the transmission pipeline. By setting up a storage container and a liquid pump, and connecting the storage container and the liquid pump to the transmission pipeline, both the solder storage function and the ability to pump the solder into the transmission pipeline via the liquid pump can be achieved, ensuring stable solder delivery during the chip repair process.

[0014] In one embodiment, the chip repair device further includes a high-pressure unit connected to the transmission pipeline. The high-pressure unit applies high pressure to the solder material within the transmission pipeline, causing the solder material to flow into the limiting structure. By incorporating a high-pressure unit into the chip repair device, when the diameter of the transmission pipeline is long, the high-pressure unit can pressurize the solder material, driving it to flow within the transmission pipeline to the limiting structure.

[0015] In one embodiment, the chip repair device further includes a heating element and a controller. The heating element and the controller are electrically connected. The heating element is disposed within the transmission pipe, and the controller controls the heating element to be in a heating or cooling state, so as to melt or solidify the solder material within the transmission pipe. By incorporating a controller and a heating element into the chip repair device, and placing the heating element within the output pipe, and controlling the switching of the heating element between a heating and cooling state by the controller, the solder material within the output pipe can be controlled to transition between a liquid and a solid state, further achieving the purpose of controlling whether solder material is injected into the pads. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a limiting structure for chip repair according to one embodiment;

[0017] Figure 2 A schematic diagram of the structure of a chip repair device according to one embodiment;

[0018] Figure 3 This is a schematic diagram of a limiting structure for chip repair according to another embodiment;

[0019] Figure 4 This is a schematic diagram of a limiting structure for chip repair according to another embodiment;

[0020] Figure 5 This is a schematic diagram of the connection structure between the limiting structure and the transmission pipeline in one embodiment.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10 - Limiting structure; 11 - First opening; 12 - Second opening; 13 - Third opening; 14 - Accommodation space;

[0023] 20 - Circuit backplane;

[0024] 30 - Transmission pipe; 31 - Adsorption pipe; 32 - Output pipe;

[0025] 40 - Valve; 50 - Storage container; 60 - Liquid pump; 70 - High-pressure unit; 80 - Controller;

[0026] 91-Heating element; 92-Temperature sensor; 93-Timer;

[0027] D1 - Size of the first opening; D2 - Size of the second opening; D3 - Size of the pad; D - Spacing between two adjacent pads. Detailed Implementation

[0028] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0030] Micro-LED technology involves thinning, miniaturizing, and arraying LED structures to a size of approximately 1–10 μm. These chips are then mass-transferred onto a circuit backplane, followed by physical deposition of a protective layer and electrodes, and finally encapsulation to complete the Micro-LED display. Micro-LED displays offer excellent stability and long lifespan, while retaining the advantages of LEDs such as low power consumption, high color saturation, fast response time, and strong contrast. They are widely used in wearable devices, ultra-large display screens, and wireless optical communications. During the manufacturing process of a Micro-LED display panel, the LED chips must first be transferred from their respective growth circuit backplanes onto the display panel. However, if any LED chip is damaged or has poor contact, a dead pixel will appear on the display panel after transfer, affecting the image quality.

[0031] Currently, chip repair mainly involves removing defective chips with lasers and then directly injecting conductive solder to re-bond them. However, this method cannot control short circuits and other defects caused by the overflow of conductive solder, thus affecting the repair yield.

[0032] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the following embodiments.

[0033] Please refer to Figure 1 and Figure 2 This application provides a limiting structure 10 for chip repair. The limiting structure 10 is annular and encloses a receiving space 14. It has a first opening 11 and a second opening 12. The first opening 11, the receiving space 14, and the second opening 12 are connected in sequence. The limiting structure 10 has adhesiveness at the second opening 12, so that the limiting structure 10 can be tightly attached to the surface of the pad on the circuit backplane 20 at the second opening 12. The solder enters the receiving space 14 through the first opening 11 and is stacked on the surface of the pad at the second opening 12. The limiting structure 10 restricts the solder within the receiving space 14.

[0034] Specifically, the annular assembly includes circular rings and polygonal rings, meaning the cross-section of the limiting structure 10 along the direction parallel to the circuit backplate 20 can be circular or polygonal, and its specific shape is designed according to the shape of the pad. During chip repair, after the defective chip is removed from the surface of the circuit backplate 20, the original pad location is exposed, which is the solder injection location. The limiting structure 10 can be directly made of an adhesive material to make the second opening 12 adhesive; alternatively, the limiting structure 10 can be made of a non-adhesive material first, and then adhesive can be applied to the second opening 12 to make it adhesive. This embodiment does not specifically limit the method used to make the second opening 12 adhesive. When the limiting structure 10 is tightly attached to the surface of the pad, the outline of the second opening 12 matches the outline of the pad. When liquid solder is injected through the first opening 11, the liquid solder is stacked on the surface of the pad and is completely contained within the receiving space 14 without overflowing. After it cools and solidifies, it separates the limiting structure 10 from the circuit backplate 20, and the solder is completely on the surface of the pad.

[0035] By making the limiting structure 10 adhesive at the second opening 12 and making the limiting structure 10 closely adhere to the surface of the pad on the circuit backplane 20 at the second opening 12, the solder enters the receiving space 14 through the first opening 11 and stacks on the surface of the pad at the second opening 12. The limiting structure 10 restricts the solder within the receiving space 14, so that the solder injected through the limiting structure 10 will not flow out of the pad, avoiding short circuit problems caused by solder overflow and improving the repair yield.

[0036] In one implementation, please refer to Figure 1 and Figure 2 The circuit backplane 20 has multiple pads arranged along the first direction X. The plane where the second opening 12 is located is the first plane. In the first direction X, the orthographic projection of the first opening 11 in the first plane has a size of D1, and the size of the second opening 12 has a size of D2. The limiting structure 10 satisfies the relationship: D2 ≥ D1. Specifically, the first opening 11 is used to connect with the solder injection device, and the shape of the second opening 12 is designed to match the corresponding pad to limit the solder within a suitable range. When the surface size of the pad is large, the size of the second opening 12 should be large. In this case, by making the limiting structure 10 satisfy the above relationship, that is, in the first direction X, the orthographic projection of the first opening 11 in the first plane has a size smaller than the size of the second opening 12, and when the size of the second opening 12 is large, the size of the first opening 11 remains small, which helps to facilitate the installation of the first opening 11 with the solder injection device.

[0037] In another implementation method, please refer to Figure 2 and Figure 3When the size of the pad surface is small, the size D2 of the second opening 12 matches the size of the pad surface. In this case, in order to make it easy for the solder to flow into the receiving space 14, the size of the first opening 11 must maintain a certain opening size, which requires D2 < D1.

[0038] In another implementation method, please refer to Figure 2 and Figure 4 The limiting structure 10 can also be a cylindrical structure, wherein the size of the first opening 11 is equal to the size of the second opening 12, and the size of the second opening 12 is equal to the size of the pad surface. In this case, the limiting structure 10 satisfies the relationship: D1 = D2.

[0039] In one implementation method, please refer to Figure 1 and Figure 2 In the first direction X, the distance between two adjacent pads is D, and the limiting structure 10 satisfies the relationship: (D2-D1) < D. Since the distance D between two adjacent pads is typically 10 μm, in this embodiment, the size of the orthographic projection of the first opening 11 in the first plane in the first direction X is smaller than the size of the second opening 12 in the first direction X, and the size of D is designed to be 10 μm to make it applicable to most chip backplanes, thereby improving versatility. That is, this embodiment satisfies the relationship: (D2-D1) < 10 μm. In other embodiments, the size of (D2-D1) can also be designed according to the positional relationship of two adjacent pads, and this application does not specifically limit it. By making the limiting structure 10 satisfy the above relationship, when solder is injected onto the surfaces of two adjacent pads simultaneously, the second openings 12 of the two adjacent limiting structures 10 can simultaneously adhere to the surface of the circuit backplane 20. When (D2-D1) is greater than 10μm, the width of the second opening 12 is too large, causing the two adjacent limiting structures 10 to not be able to fully adhere to the pad surface at the same time, thus failing to achieve the purpose of preventing solder overflow. When (D2-D1) is equal to 10μm, if it is required that the two adjacent limiting structures 10 are both adhered to the corresponding pads, the two limiting structures 10 need to be just connected, which requires high operational precision and is not easy to operate.

[0040] In one implementation method, please refer to Figure 1 and Figure 2 In the first direction X, the pad size is D3, and the limiting structure 10 satisfies the relationship: D2 ≤ D3. When the limiting structure 10 is attached to the pad surface, the second opening 12 is also attached to the pad surface. Therefore, the size of the second opening 12 determines the area of ​​solder stacked on the pad surface. By making the limiting structure 10 satisfy the above relationship, that is, by making the outline of the second opening 12 within the pad surface, the solder is completely stacked on the pad surface, preventing it from overflowing to the circuit backplane 20 and causing a short circuit.

[0041] In another implementation method, please refer to Figure 1 and Figure 2 The limiting structure 10 is elastic at the second opening 12. Specifically, the limiting structure 10 can be made directly from an elastic material, thus making the second opening 12 elastic. Alternatively, the limiting structure 10 can be made from a rigid material, and then an annular sleeve made of elastic material can be fitted over the second opening 12 to make the second opening 12 elastic. By making the limiting structure 10 elastic at the second opening 12, the strong resilience of the elastic material can reduce the wear and deformation of the limiting structure 10 during repeated use, which helps to extend the service life of the limiting structure 10.

[0042] Based on the same inventive concept, this application also provides a chip repair device, please refer to... Figure 1 and Figure 2 The chip repair device includes a transmission channel 30 and a limiting structure 10, which are connected. The transmission channel 30 is used to transmit solder to a receiving space 14. The transmission channel 30 provides a flow path for the solder, allowing it to flow precisely into the receiving space 14. Furthermore, the length of the transmission channel 30 is designed according to requirements; when the solder is located far from the circuit backplane 20, the length of the transmission channel 30 can be increased to achieve solder injection. Additionally, the transmission channel 30 includes a third opening 13 facing away from the limiting structure 10, and the shape of the third opening 13 can be designed to allow solder to flow into the limiting structure 10. Figure 5 As shown, when the size of the first opening 11 is small, to prevent solder from overflowing during the injection of solder from the first opening 11 into the receiving space 14, the size of the third opening 13 can be increased. By providing interconnected transmission channels 30 and limiting structures 10 provided in this embodiment of the application in the chip repair device, the transmission channels 30 are used to transmit solder to the limiting structures 10, and the limiting structures 10 can prevent solder from overflowing when injected into the pad surface on the circuit backplane 20, thereby achieving the purpose of accurately injecting solder into the pad surface, solving the problem of chip short circuit caused by solder overflow, and improving the chip repair yield.

[0043] In one implementation method, please refer to Figure 1 and Figure 2The chip repair device also includes a valve 40, which is located between the first opening 11 and the transmission pipe 30. The valve 40 is used to control the flow rate of solder into the receiving space 14. In this embodiment, the valve 40 is a solenoid valve, and its opening degree is controllable. When solder needs to be injected into the circuit backplane 20, the valve 40 opens, and the solder flows into the receiving space 14 from the transmission pipe 30. The greater the degree to which the valve 40 is opened, the greater the flow rate of solder into the receiving space 14, and the faster the solder injection speed, thus resulting in higher repair efficiency. When the solder pad requires less solder, the flow rate of solder entering the receiving space 14 can be reduced by decreasing the degree of opening of the valve 40, thereby facilitating the control of the volume of solder injected onto the circuit backplane 20. When the injection is complete, the valve 40 is closed, and the transmission pipe 30 and the limiting structure 10 are no longer connected, preventing further solder injection. By setting a valve 40 between the first opening 11 and the transmission pipe 30, the start and stop of solder injection on the surface of the solder pad and the flow rate can be controlled by the degree of opening and closing of the valve 40. Furthermore, the efficiency and volume of solder injection can be controlled, which is beneficial to improving the repair yield and efficiency.

[0044] In one implementation method, please refer to Figure 2 The device employs multiple transmission channels 30 and multiple limiting structures 10, with each channel 30 and limiting structure 10 connected in a one-to-one correspondence. The dimensions of the multiple limiting structures 10 can be the same or different; correspondingly, the lengths and dimensions of the multiple transmission channels 30 can also be the same or different. By simultaneously setting multiple transmission channels 30 and multiple limiting structures 10 in the chip repair device, and ensuring that each channel 30 and limiting structure 10 is connected in a one-to-one correspondence, solder can be injected into multiple pads at a unified time, which improves chip repair efficiency.

[0045] In one implementation method, please refer to Figure 1 and Figure 2The limiting structure 10 is detachably connected to the transmission channel 30, so that the shape of the second opening 12 can be circular or polygonal. Specifically, in this embodiment, one transmission channel 30 can be matched with multiple limiting structures 10 of different shapes and sizes. When the shape and size of the pad change, the shape and size of the second opening 12 change accordingly. At this time, it is only necessary to replace the limiting structure 10 in the chip repair device. For example, when the shape of the pad is circular, the shape of the second opening 12 is circular; when the shape of the pad is rectangular, the matching purpose with the pad can be achieved by replacing the limiting structure 10 with a rectangular shape for the second opening 12. It should be noted that since the first opening 11 of the limiting structure 10 is matched and connected to the transmission channel 30, for the same transmission channel 30, the shape of the first opening 11 of the limiting structure 10 matched and connected to it is the same as the shape of the transmission channel 30, while the shape of the second opening 12 can be changed according to the shape of the pad. By making the limiting structure 10 detachably connected to the transmission channel 30, the limiting structure 10 can be easily replaced, and the size of the second opening 12 can be adjusted according to the pad. Thus, one transmission channel 30 can be matched with multiple different limiting structures 10. When the shape of the pad changes, only different limiting structures 10 need to be replaced, which improves the versatility of the chip repair device and saves production costs.

[0046] In one implementation method, please refer to Figure 2 The chip repair device also includes a storage container 50 and a liquid pump 60. The storage container 50, the liquid pump 60, and the transmission pipe 30 are connected. The storage container 50 is equipped with a heating unit. The storage container 50 is used to store solder, and the heating unit is used to heat and melt the solder in the storage container 50 into a liquid state. Specifically, the storage container 50 is a container made of high-temperature resistant material. The heating unit can be an electric heating element, such as an electric heating rod or electric heating plate, installed inside or attached to the storage container 50. When the heating unit is energized, its temperature rises and it conducts heat to the storage container 50. Furthermore, the solder in the storage container 50 absorbs heat and rises in temperature. When the temperature of the solder rises to its melting point, the solder melts from a solid state into a liquid state and flows through the transmission pipe 30 to be injected onto the circuit backplane 20. By setting up a storage container 50 and equipping it with a heating unit, both solder storage and heating / melting of the solder can be achieved, making the chip repair device more functional.

[0047] In other embodiments, the storage container 50 may also include a display screen, which can display the temperature of the storage container 50 and the remaining amount of solder in real time, so as to facilitate users to obtain solder information and realize real-time control of the state and volume of solder in the storage container 50.

[0048] The transfer pipe 30 includes an adsorption pipe 31 and an output pipe 32 that are interconnected. A liquid pump 60 is connected to a storage container 50 via the adsorption pipe 31, and the output pipe 32 is connected to a limiting structure 10. The liquid pump 60 pumps the liquid solder from the storage container 50 into the adsorption pipe 31 and then transfers it to the limiting structure 10 via the output pipe 32. In the chip repair process, the solder needs to go through two stages: adsorption and injection. The forces acting on the solder in these two stages are opposite, and the adsorption and injection times are also different. By dividing the transfer pipe 30 into an adsorption pipe 31 and an output pipe 32, segmented control of the solder can be achieved. Furthermore, by installing a liquid pump 60 in the chip repair device and connecting the liquid pump 60 to the adsorption pipe 31, which in turn is connected to the storage container 50, when the liquid pump 60 is started, the solder in the storage container 50 is drawn out through the adsorption pipe 31. When the liquid pump 60 is turned off, the solder in the storage container 50 no longer enters the adsorption pipe 31, thereby achieving the connection between the solder in the storage container 50 and the transmission pipe 30.

[0049] By setting up a storage container 50 and a liquid pump 60, and connecting the storage container 50 and the liquid pump 60 to the transmission pipeline 30, the solder storage function can be realized, and the solder can also be pumped into the transmission pipeline 30 by the liquid pump 60, so that the solder can be stably transmitted during the chip repair process.

[0050] In one implementation method, please refer to Figure 2 The chip repair device also includes a high-pressure unit 70, which is connected to both the adsorption pipe 31 and the output pipe 32. The high-pressure unit 70 applies high pressure to the solder flowing into the adsorption pipe 31, causing the solder to flow into the output pipe 32. In this embodiment, the high-pressure unit 70 uses a pressure cylinder including a pressure sensor. The pressure cylinder includes an inlet, a pressurizing chamber, and an outlet. Its inlet is connected to the adsorption pipe 31, and its outlet is connected to the output pipe 32. The solder in the adsorption pipe 31 flows into the pressurizing chamber through the inlet. Furthermore, when the pressure sensor detects that the air pressure in the adsorption pipe 31 is too low, preventing the solder from being transferred to the output pipe 32, the piston of the cylinder in the pressurizing chamber changes its stroke to increase the air pressure, thereby further transferring the solder in the chamber from the outlet to the output pipe 32. By setting the high-pressure unit 70 in the chip repair device, when the path of the transmission pipe 30 is long, the high-pressure unit 70 can pressurize the solder, driving the solder to flow within the transmission pipe 30 and be transferred to the limiting structure 10.

[0051] In one implementation method, please refer to Figure 2The chip repair device also includes a controller 80 and a heating element 91, which are electrically connected. The heating element 91 is disposed within the output pipe 32. The controller 80 controls the heating element 91 to be in a heating or cooling state, so that the solder in the output pipe 32 melts or solidifies. In this embodiment, the heating element 91 is a heating wire, which is housed within the output pipe 32 and in direct contact with the solder in the output pipe 32. When solder needs to be injected into the circuit backplane 20, the controller 80 controls the heating element 91 to be in a heating state, the temperature of the heating element 91 rises, and the heat is conducted to the solder in the output pipe 32. The solder absorbs heat and melts into a liquid state, flowing into the limiting structure 10. When it is not necessary to inject solder into the circuit backplane 20, the controller 80 controls the heating element 91 to stop heating, the heating element 91 is in a cooling state, and the solder cools and solidifies into a solid state, thereby stopping the flow to the limiting structure 10. By setting a controller 80 and a heating element 91 in the chip repair device, and placing the heating element 91 inside the output pipe 32, the controller 80 controls the heating element 91 to switch between heating and cooling states, thereby controlling the conversion of the solder material in the output pipe 32 between liquid and solid states, and further achieving the purpose of controlling whether to inject solder material into the pad.

[0052] In another implementation method, please refer to Figure 2 The repair device also includes a temperature sensor 92, which is electrically connected to the controller 80. One end of the temperature sensor 92 is connected to the output pipe 32 to sense the temperature of the solder material inside the output pipe 32 and feeds the sensed temperature back to the controller 80. The controller 80 has a melting point temperature. After receiving the temperature sensed by the temperature sensor 92, the controller 80 compares it with the melting point temperature. When solder material needs to be injected into the circuit backplane 20, if the temperature is lower than the melting point temperature, the controller 80 controls the heating element 91 to heat. When the temperature reaches the melting point temperature, the controller 80 controls the heating element 91 to stop heating. By setting the temperature sensor 92, the heating element 91 can be controlled in real time according to the temperature of the solder material, thereby avoiding energy waste caused by continuous heating after the solder material reaches the melting point and helping to save repair costs.

[0053] In another implementation method, please refer to Figure 2The chip repair device also includes a timer 93, which is electrically connected to the controller 80. The timer 93 is used to control the heating time of the heating element 91. Specifically, the timer 93 can be preset with a heating time. When the controller 80 controls the heating element 91 to start heating, the controller 80 transmits a first time signal to the timer 93, and the timer 93 starts counting. When the time counted by the timer 93 equals the preset heating time, the timer 93 transmits a second time signal to the controller 80, and the controller 80 controls the heating element 91 to stop heating. By setting the timer 93 in the chip repair device, the heating time of the heating element 91 can be precisely controlled, avoiding unnecessary waste caused by excessive heating time and helping to save repair costs.

[0054] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A limiting structure for chip repair, characterized in that, The limiting structure is in the shape of a ring, and the limiting structure encloses and forms an accommodating space with a first opening and a second opening. The first opening, the accommodating space, and the second opening are connected in sequence. The limiting structure has adhesiveness at the second opening so that the limiting structure is tightly attached to the pad of a single chip on the circuit backplane at the second opening. Liquid solder is injected into the first opening and contained in the containing space. After the liquid solder cools and solidifies, the limiting structure separates from the circuit backplate. The circuit backplane is provided with a plurality of pads arranged along a first direction. The plane where the second opening is located is the first plane. The orthographic projection of the first opening in the first plane is D1 in the first direction. The size of the second opening in the first direction is D2. The spacing between two adjacent pads in the first direction is D. The limiting structure satisfies the following relationship: D2>D1, (D2-D1)<D, (D2-D1)<10μm. The limiting structure is elastic at the second opening.

2. The limiting structure as described in claim 1, characterized in that, The dimension of the pad in the first direction is D3, and the limiting structure satisfies the relationship: D2≤D3.

3. A chip repair device, characterized in that, The chip repair device includes a transmission pipe and a limiting structure as described in any one of claims 1-2, wherein the transmission pipe and the limiting structure are connected, and the transmission pipe is used to transmit solder to the receiving space.

4. The chip repair apparatus as described in claim 3, characterized in that, The limiting structure is detachably connected to the transmission pipe.

5. The chip repair apparatus as described in claim 4, characterized in that, The chip repair device also includes a valve disposed between the first opening and the transmission pipe, the valve being used to control the flow rate of the solder into the receiving space.

6. The chip repair apparatus as described in claim 5, characterized in that, The chip repair device also includes a storage container and a liquid pump, the storage container, the liquid pump and the transmission pipeline are connected, the storage container is used to store solder, and the liquid pump is used to pump the solder in the storage container into the transmission pipeline.

7. The chip repair apparatus as described in claim 6, characterized in that, The chip repair device also includes a high-voltage unit connected to a transmission pipeline. The high-voltage unit applies high pressure to the solder in the transmission pipeline to cause the solder to flow into the limiting structure.

8. The chip repair apparatus as described in claim 7, characterized in that, The chip repair device also includes a heating element and a controller. The heating element and the controller are electrically connected. The heating element is disposed in the transmission pipe. The controller is used to control the heating element to be in a heating state or a cooling state so that the solder in the transmission pipe melts or solidifies.

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