A non-contact, high-efficiency wafer precision measurement device

Abstract

This invention belongs to the field of wafer measurement technology and discloses a non-contact, high-efficiency, precise wafer measurement device. It includes a worktable, a top plate positioned above the worktable, and a support frame connecting the worktable and the top plate. A wafer placement rack, a loading assembly, a clamping and fixing assembly, and a measurement assembly are sequentially arranged on the worktable surface. The wafer placement rack is configured to hold wafers; the loading assembly is configured to transfer wafers from the wafer placement rack to the clamping and fixing assembly; and the clamping and fixing assembly is configured to clamp the wafers and transfer them to the measurement assembly for measurement. This non-contact, high-efficiency, precise wafer measurement device eliminates the need for manual wafer movement during use, offering convenient operation, high efficiency, and enabling batch monitoring.

Description

Technical Field

[0001] This invention belongs to the field of wafer measurement technology, specifically relating to a non-contact, high-efficiency, and precise wafer measurement device. Background Technology

[0002] Wafers are the basic material for manufacturing semiconductor chips. The geometric parameters of wafers, such as wafer thickness, shape and flatness, play a crucial role in the quality of wafers. During the wafer manufacturing process, wafer thickness is frequently measured.

[0003] Existing precision measurement devices for wafer processing generally require manual removal of the wafer from the wafer holder and then manual placement onto the wafer measuring instrument for measurement. This increases the labor intensity of workers, reduces work efficiency, and can easily cause damage to the wafer surface due to worker fatigue over time, thereby affecting the wafer's performance and increasing economic losses for enterprises. It is also not conducive to batch testing and requires certain improvements. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a non-contact, high-efficiency wafer precision measurement device.

[0005] To achieve the objectives of this invention, the following technical solution is provided:

[0006] A non-contact, high-efficiency wafer precision measurement device includes a worktable, a top plate disposed above the worktable, and a support frame connecting the worktable and the top plate. A wafer placement rack, a loading assembly, a clamping and fixing assembly, and a measurement assembly are sequentially disposed on the worktable surface.

[0007] The wafer placement rack is configured to place wafers; the loading assembly is configured to transfer the wafers on the wafer placement rack to the clamping and fixing assembly; the clamping and fixing assembly is configured to clamp and transfer the wafers to the measuring assembly for measurement;

[0008] The clamping and fixing assembly includes a fixing block, with a first inner cavity on the top side of the fixing block. A first motor is fixedly connected to the bottom of the first inner cavity, and a first rotating shaft is fixedly connected to the output shaft of the first motor. The top end of the first rotating shaft passes through a first through hole in the fixing block and is fixedly connected to a connecting block. A second motor is fixedly connected to one side of the connecting block, and a reciprocating screw is fixedly connected to the output end of the second motor. The reciprocating screw is located in the second inner cavity of the connecting block, and threaded sleeves are connected to both ends of the reciprocating screw. Clamping blocks are fixedly connected to one side of each of the two threaded sleeves. The two clamping blocks are arranged opposite to each other and are slidably connected in the second through hole of the connecting block. The threads at both ends of the reciprocating screw are in opposite directions. The rotation of the reciprocating screw can drive the two threaded sleeves to move closer or further apart, thereby driving the clamping blocks to clamp or release the wafer. A sixth through hole is opened on both sides of the threaded sleeve, and a first optical rod is slidably connected inside the sixth through hole. The two ends of the first optical rod are fixedly connected to the inner sidewall of the connecting block, respectively.

[0009] Preferably, the feeding assembly includes a fixed box, with its two sides fixedly connected to the workbench 1 and the top plate, respectively. A lead screw is rotatably connected inside the fixed box. The top end of the lead screw passes through the seventh through hole opened in the fixed box and the top plate, and is then fixedly connected to a third motor. A motor mounting bracket is fixedly connected to the outer wall of the third motor. The bottom of the motor mounting bracket is fixedly connected to the top of the top plate. A sliding sleeve is threaded to the bottom end of the lead screw. A ninth through hole is opened on both sides of the sliding sleeve. A second guide rod is slidably connected inside the ninth through hole. The second guide rod is positioned... Both sides of the lead screw and both ends of the second guide rod are fixedly connected to the inner side wall of the fixed box; a fixed plate is fixedly connected to one side of the sliding sleeve, and the fixed plate is slidably connected in the eighth through hole opened in the fixed box. A film picking drive motor is fixedly connected to the end of the fixed plate. The film picking drive motor is located on the side away from the sliding sleeve. An output shaft is set on the top of the film picking drive motor. A film picking hydraulic cylinder 710 is fixedly connected to the output shaft. A film picking suction cup is set on one side of the film picking hydraulic cylinder. Under the drive of the film picking drive motor, the film picking hydraulic cylinder and the film picking suction cup are driven to rotate.

[0010] More preferably, the wafer placement rack is a U-shaped structure vertically arranged on the top surface of the workbench for placing wafers, with the opening of the U-shaped structure facing the feeding assembly, and multiple layers of support plates for placing wafers are provided inside the U-shaped structure.

[0011] More preferably, the width of the tack cup is less than the distance between the two side support plates inside the U-shaped structure.

[0012] Preferably, the clamping block has a third inner cavity, a first airbag is provided on one side of the third inner cavity, an elastic element is fixedly connected to the other side of the first airbag, the elastic element is slidably connected in the third through hole of the clamping block, and a fourth inner cavity is provided inside the elastic element, with multiple auxiliary suction cups linearly distributed on both sides of the fourth inner cavity.

[0013] More preferably, a second airbag is fixedly connected to one side of the threaded sleeve, a first connecting pipe is connected to one side of the second airbag, and the other end of the first connecting pipe passes through the fourth through hole opened by the fixing block and the clamping block in sequence and is connected to the fourth inner cavity.

[0014] More preferably, a third airbag is fixedly connected to the other side of the threaded sleeve, and a second connecting pipe is connected to one side of the third airbag. The other end of the second connecting pipe passes through the fifth through hole opened by the fixing block and the clamping block in sequence and is connected to the first airbag.

[0015] Preferably, two measuring components are provided, which are arranged opposite to each other on the top of the worktable and the bottom of the top plate; the measuring components include an X-axis module fixed on the top of the worktable or the bottom of the top plate, a Y-axis module set on the X-axis module, a hydraulic cylinder set on the Y-axis module, and a laser measuring head set on the hydraulic cylinder.

[0016] More preferably, the X-axis module includes a guide rail and side guide rails arranged parallel to the guide rail; the Y-axis module includes a Y-axis base plate, a Y-axis guide rail arranged on the Y-axis base plate, side sliders at both ends of the bottom of the Y-axis base plate, and a T-shaped plate slidably arranged on the Y-axis guide rail, with the two side sliders respectively adapted to the guide rail and the side guide rail; the hydraulic cylinder is arranged on the T-shaped plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) The non-contact high-efficiency wafer precision measurement device of the present invention does not require manual movement of the wafer during use, making it convenient to operate, highly efficient, and capable of batch monitoring.

[0019] (2) The measuring device of the present invention places the wafer on the wafer placement rack, picks up the wafer on the wafer placement rack by the wafer picking hydraulic cylinder and the wafer picking suction cup, and then drives the wafer to rotate by the wafer picking drive motor. The second motor drives the reciprocating screw to rotate, so that the reciprocating screw drives the threaded sleeve and the clamping block to clamp and fix the wafer, which facilitates automatic wafer loading and testing, reduces the labor intensity of the staff, and thus reduces the labor cost of the enterprise.

[0020] (3) The present invention delivers the gas inside the third airbag to the inside of the first airbag through the movement of the threaded sleeve, so that the first airbag drives the elastic element to perform auxiliary flexible clamping of the wafer to be tested, thereby preventing damage to the surface of the wafer. At the same time, the threaded sleeve stretches the second airbag, and the second airbag extracts the gas inside the fourth inner cavity and the auxiliary suction cup through the first connecting tube, further increasing the fixing effect of the clamping block and the elastic element on the wafer, thereby improving the stability of the device during clamping and fixing, preventing poor fixing effect on the wafer during the measurement process, which may cause the wafer to fall during the measurement process, affecting not only the use of the wafer, but also the measuring instrument, thereby increasing the economic cost of the enterprise.

[0021] (4) In this invention, the hydraulic cylinder drives the laser measuring head to move upward, and the two laser measuring heads detect the distance between them. Then, the hydraulic cylinder drives the laser measuring head to move downward, and the laser measuring head tests the distance between the two surfaces of the wafer. Finally, the total distance is subtracted from the distance between the two laser measuring heads and the wafer, so the absolute distance of the wafer can be directly measured, thereby improving the thickness detection accuracy of the device. Then, the X-axis module and Y-axis module move the laser measuring head in the X and Y directions respectively, which facilitates the measurement of different positions of the wafer, thereby improving the accuracy of the device during measurement. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the measuring device of the present invention;

[0024] Figure 2 This is a three-dimensional structural diagram of the clamping and fixing component in the measuring device of the present invention;

[0025] Figure 3 In the measuring device of the present invention Figure 2 A partially enlarged structural diagram;

[0026] Figure 4 This is a top view of the clamping and fixing assembly in the measuring device of the present invention.

[0027] Figure 5 This is a top view of the clamping block in the measuring device of the present invention.

[0028] Figure 6 This is a schematic diagram of the structure of the fixing block in the measuring device of the present invention;

[0029] Figure 7This is a three-dimensional structural diagram of the feeding component in the measuring device of the present invention.

[0030] Figure 8 This is a schematic diagram of the structure of the measuring component in the measuring device of the present invention;

[0031] Wherein: 1—Workbench, 2—Support frame, 3—Top plate, 4—Clamping and fixing assembly, 401—Fixing block, 402—First motor, 403—First rotating shaft, 404—Connecting block, 405—Second motor, 406—Reciprocating screw, 407—Threaded sleeve, 408—Clamping block, 409—Third inner cavity, 410—First airbag, 411—Elastic element, 412—Fourth inner cavity, 413—Auxiliary suction cup, 414—Second airbag, 415—First connecting pipe, 416—Third airbag, 417—Second Connecting pipe, 418—First optical rod, 5—Measuring component, 51—X-axis module, 52—Y-axis module, 53—Hydraulic cylinder, 54—Guide rail, 55—T-shaped plate, 56—Side slider, 57—Side guide rail, 6—Wafer placement rack, 7—Loading component, 701—Fixing box, 702—Lead screw, 703—Second optical rod, 704—Sliding sleeve, 705—Fixing plate, 706—Wafer pick drive motor, 707—Wafer pick suction cup, 708—Third motor, 709—Motor mounting bracket, 710—Wafer pick hydraulic cylinder. Detailed Implementation

[0032] To facilitate understanding of the present invention, the present invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of protection of the present invention is not limited to the following specific embodiments.

[0033] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of the invention.

[0034] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this invention can be purchased from the market or prepared by existing methods.

[0035] Example

[0036] See Figures 1-8 This embodiment provides a non-contact, high-efficiency wafer precision measurement device, including a worktable 1, a top plate 3 disposed above the worktable 1, and a support frame 2 connecting the worktable 1 and the top plate 3. On the worktable 1, a wafer placement rack 6 for placing wafers, a feeding assembly 7, a clamping and fixing assembly 4, and a measurement assembly 5 are arranged in sequence.

[0037] The wafer placement rack 6 is a U-shaped structure that is vertically installed on the top surface of the workbench 1 for placing wafers. The opening of the U-shaped structure faces the feeding assembly 7, and multiple layers of support plates for placing wafers are installed inside the U-shaped structure.

[0038] The feeding assembly 7 includes a fixed box 701. The fixed box 701 is fixedly connected to the workbench 1 and the top plate 3 on both sides, respectively. A lead screw 702 is rotatably connected inside the fixed box 701. The top end of the lead screw 702 passes through the seventh through hole opened in the fixed box 701 and the top plate 3, and is then fixedly connected to a third motor 708. A motor mounting bracket 709 is fixedly connected to the outer wall of the third motor 708. The bottom of the motor mounting bracket 709 is fixedly connected to the top of the top plate 3 by screws. A sliding sleeve 704 is threaded to the bottom end of the lead screw 702. A ninth through hole is opened on both sides of the sliding sleeve 704. A second guide rod 703 is slidably connected inside the ninth through hole. The second guide rod 703 is located on both sides of the lead screw 702, and both ends of the second guide rod 703... The slide sleeve 704 is fixedly connected to the inner wall of the fixed box 701. A fixed plate 705 is fixedly connected to one side of the slide sleeve 704. The fixed plate 705 is slidably connected in the eighth through hole opened in the fixed box 701. A film picking drive motor 706 is fixedly connected to the end of the fixed plate 705. The film picking drive motor 706 is located on the side away from the slide sleeve 704. An output shaft is set on the top of the film picking drive motor 706. A film picking hydraulic cylinder 710 is fixedly connected to the output shaft. A film picking suction cup 707 is set on one side of the film picking hydraulic cylinder 710. Under the drive of the film picking drive motor 706, the film picking hydraulic cylinder 710 and the film picking suction cup 707 are driven to rotate to a suitable position. Since the width of the film picking suction cup 707 is smaller than the distance between the two support plates inside the U-shaped structure. The wafer-retrieving hydraulic cylinder 710 starts and controls the wafer-retrieving chuck 707 to extend to the bottom of the wafer to be measured. Then, the third motor 708, the hydraulic cylinder 710, and the wafer-retrieving drive motor 706 are controlled to realize the wafer-retrieving chuck 707 to pick up and transfer the wafer.

[0039] The clamping and fixing assembly 4 includes a fixing block 401. A first inner cavity is formed on the top side of the fixing block 401. A first motor 402 is fixedly connected to the bottom of the first inner cavity. A first rotating shaft 403 is fixedly connected to the output shaft of the first motor 402. The top end of the first rotating shaft 403 passes through a first through hole in the fixing block 401 and is fixedly connected to a connecting block 404. A second motor 405 is fixedly connected to one side of the connecting block 404. A reciprocating screw 406 is fixedly connected to the output end of the second motor 405. The reciprocating screw 406 is disposed within the second inner cavity of the connecting block 404. Both ends of the reciprocating screw 406 are connected to threaded sleeves 407. The threads at both ends of the reciprocating screw 406 are in opposite directions, allowing the two threaded sleeves 407 to move closer or further apart. Clamping blocks 408 are fixedly connected to one side of each of the two threaded sleeves 407. The two clamping blocks 408 are arranged opposite to each other and are slidably connected within the second through hole of the connecting block 404.

[0040] Both clamping blocks 408 have a third inner cavity 409 inside. A first airbag 410 is provided on one side of the third inner cavity 409. An elastic element 411 is fixedly connected to the other side of the first airbag 410. The elastic element 411 is slidably connected in the third through hole of the clamping block 408. A fourth inner cavity 412 is provided inside the elastic element 411. Multiple auxiliary suction cups 413 are linearly distributed on both sides of the fourth inner cavity 412.

[0041] A second airbag 414 is fixedly connected to one side of the threaded sleeve 407. A first connecting tube 415 is connected to one side of the second airbag 414. The other end of the first connecting tube 415 passes through the fourth through hole opened by the fixing block 401 and the clamping block 408 in sequence and is connected to the fourth inner cavity 412. A third airbag 416 is fixedly connected to the other side of the threaded sleeve 407. A second connecting tube 417 is connected to one side of the third airbag 416. The other end of the second connecting tube 417 passes through the fifth through hole opened by the fixing block 401 and the clamping block 408 in sequence and is connected to the first airbag 410. A sixth through hole is opened on both sides of the threaded sleeve 407. A first smooth rod 418 is slidably connected inside the sixth through hole. The two ends of the first smooth rod 418 are fixedly connected to the inner side wall of the connecting block 404 respectively.

[0042] The measuring component 5 includes two X-axis modules, two Y-axis modules, two second hydraulic cylinders, and two laser measuring heads. The two X-axis modules are fixedly connected to the top of the worktable 1 and the bottom of the top plate 3, respectively. The Y-axis module is located on top of the X-axis modules. The second hydraulic cylinders are fixedly connected to the Y-axis modules by screws. The laser measuring heads are fixedly connected to the second hydraulic cylinders and are located on the side away from the Y-axis modules. The laser measuring head consists of a laser and a detector. A CCD vision imaging component is provided on one side of the bottom of the top plate 3 and is located above the clamping block 408.

[0043] The specific implementation method of the measuring device in this embodiment is as follows:

[0044] The wafer is placed on the wafer placement rack 6. Then, the third motor 708, hydraulic cylinder 710, and wafer pick-up drive motor 706 drive the wafer pick-up chuck 707 to move and pick up the wafer from the wafer placement rack 6. Then, the wafer pick-up drive motor 706 drives the wafer pick-up hydraulic cylinder 710 and wafer pick-up chuck 707 to rotate, rotating the wafer 180 degrees. At this time, the control device controls the second motor 405 to start working, so that the second motor 405 drives the reciprocating screw 406 to rotate. Utilizing the thread effect between the reciprocating screw 406 and the threaded sleeve 407, the threaded sleeve 407 is driven to move inward. Utilizing the linkage effect between the threaded sleeve 407 and the clamping block 408, the clamping block 408 is driven to move, and the clamping block 408 clamps and fixes the wafer, which facilitates automatic wafer loading and inspection, reduces the labor intensity of workers, and thus reduces the company's labor costs.

[0045] As the threaded sleeve 407 moves, it compresses the third airbag 416, transferring the gas inside to the first airbag 410 via the second connecting pipe 417. This causes the first airbag 410 to drive the elastic element 411 to provide auxiliary flexible clamping of the wafer to be tested, thereby preventing damage to the wafer surface. Simultaneously, the threaded sleeve 407 stretches the second airbag 414, which extracts gas from the fourth inner cavity 412 via the first connecting pipe 415. As the elastic element 411 contacts the side of the wafer... As the gas inside the auxiliary suction cup 413 decreases, the gas between the auxiliary suction cup 413 and the wafer is extracted through the first connecting pipe 415 and the fourth inner cavity 412. This further enhances the fixing effect of the clamping block 408 and the elastic element 411 on the wafer, thereby improving the stability of the device during clamping and fixing. This prevents the wafer from falling off during the measurement process due to poor fixing effect, which would not only affect the use of the wafer but also the measuring instrument, thus increasing the economic cost of the enterprise.

[0046] Before the wafer enters the measurement area of ​​the measurement component 5, the distance between the two laser measurement heads is tested.

[0047] After the clamping block 408 and the elastic element 411 clamp and fix the wafer, the connecting block 404 is rotated 180 degrees by the first motor 402, which in turn drives the wafer to rotate and enter the measurement area of ​​the measurement component 5. The distance between the two surfaces of the wafer is measured by two laser measuring heads. Finally, the absolute distance of the wafer can be directly measured by subtracting the distance between the two laser measuring heads and the wafer from the total distance. Then, the X-axis module 51 and the Y-axis module 52 are used to move the laser measuring heads in the X and Y directions, respectively, to facilitate the measurement of different positions of the wafer, thereby improving the accuracy of the device during measurement. As one of the preferred options, the device can also be equipped with a CCD vision imaging component to directly measure the diameter and surface of the wafer, which improves the applicability of the device during measurement and effectively reduces the clamping time required for wafer measurement, thereby improving the economic cost and processing measurement efficiency of enterprises.

Claims

1. A non-contact, high-efficiency wafer precision measurement device, characterized in that, Includes a workbench (1), a top plate (3) set above the workbench (1), and a support frame (2) connecting the workbench (1) and the top plate (3). On the workbench (1), a wafer placement rack (6), a feeding assembly (7), a clamping and fixing assembly (4), and a measuring assembly (5) are arranged in sequence. The wafer placement rack (6) is configured to place wafers; the loading assembly (7) is configured to transfer the wafers on the wafer placement rack (6) to the clamping and fixing assembly (4); the clamping and fixing assembly (4) is configured to clamp the wafers and transfer them to the measuring assembly (5) for measurement; Wherein: the clamping and fixing assembly (4) includes a fixing block (401), the top side of the fixing block (401) is provided with a first inner cavity, the bottom of the first inner cavity is fixedly connected to a first motor (402), the output shaft of the first motor (402) is fixedly connected to a first rotating shaft (403), the top end of the first rotating shaft (403) passes through the first through hole opened in the fixing block (401) and is fixedly connected to a connecting block (404), one side of the connecting block (404) is fixedly connected to a second motor (405), the output end of the second motor (405) is fixedly connected to a reciprocating screw (406), the reciprocating screw (406) is set in the second inner cavity opened in the connecting block (404), and both ends of the reciprocating screw (406) are connected to The threaded sleeves (407) are connected to a clamping block (408) on one side of each of the two threaded sleeves (407). The two clamping blocks (408) are arranged opposite to each other and are slidably connected in the second through hole of the connecting block (404). The threads at both ends of the reciprocating screw (406) are in opposite directions. The rotation of the reciprocating screw (406) can drive the two threaded sleeves (407) to move closer or further away from each other, thereby driving the clamping block (408) to clamp or release the wafer. The threaded sleeves (407) are provided with a sixth through hole on both sides. A first optical rod (418) is slidably connected inside the sixth through hole. The two ends of the first optical rod (418) are respectively fixedly connected to the inner side wall of the connecting block (404).

2. The measuring device as described in claim 1, characterized in that, The feeding assembly (7) includes a fixed box (701). The two sides of the fixed box (701) are fixedly connected to the workbench (1) and the top plate (3) respectively. A lead screw (702) is rotatably connected inside the fixed box (701). The top of the lead screw (702) passes through the seventh through hole opened in the fixed box (701) and the top plate (3) and is then fixedly connected to a third motor (708). A motor mounting bracket (709) is fixedly connected to the outer wall of the third motor (708). The bottom of the motor mounting bracket (709) is fixedly connected to the top of the top plate (3). A sliding sleeve (704) is threaded to the bottom end of the lead screw (702). A ninth through hole is opened on both sides of the sliding sleeve (704). A second guide rod (703) is slidably connected inside the ninth through hole. The second guide rod (703) is set on the lead screw. Both sides of the rod (702) and both ends of the second light rod (703) are fixedly connected to the inner side wall of the fixed box (701); a fixed plate (705) is fixedly connected to one side of the sliding sleeve (704), the fixed plate (705) is slidably connected in the eighth through hole opened in the fixed box (701), the end of the fixed plate (705) is fixedly connected to the film picking drive motor (706), the film picking drive motor (706) is located on the side away from the sliding sleeve (704), the top of the film picking drive motor (706) is provided with an output shaft, the output shaft is fixedly connected to the film picking hydraulic cylinder (710), the side of the film picking hydraulic cylinder (710) is provided with a film picking suction cup (707), under the drive of the film picking drive motor (706), the film picking hydraulic cylinder (710) and the film picking suction cup (707) are driven to rotate.

3. The measuring device as described in claim 2, characterized in that, The wafer placement rack (6) is a U-shaped structure that is vertically set on the top surface of the workbench (1) for placing wafers. The opening of the U-shaped structure faces the loading assembly (7), and multiple layers of wafer support plates are set inside the U-shaped structure.

4. The measuring device as described in claim 3, characterized in that, The width of the tweezers (707) is less than the distance between the two side support plates inside the U-shaped structure.

5. The measuring device as described in claim 1, characterized in that, The clamping block (408) has a third inner cavity (409) inside. A first airbag (410) is provided on one side of the third inner cavity (409). An elastic element (411) is fixedly connected to the other side of the first airbag (410). The elastic element (411) is slidably connected in the third through hole of the clamping block (408). A fourth inner cavity (412) is provided inside the elastic element (411). Multiple auxiliary suction cups (413) are linearly distributed on both sides of the fourth inner cavity (412).

6. The measuring device as described in claim 5, characterized in that, The threaded sleeve (407) is fixedly connected to a second airbag (414) on one side, and a first connecting pipe (415) is connected to one side of the second airbag (414). The other end of the first connecting pipe (415) passes through the fourth through hole opened by the fixing block (401) and the clamping block (408) in sequence and is connected to the fourth inner cavity (412).

7. The measuring device as described in claim 6, characterized in that, The third airbag (416) is fixedly connected to the other side of the threaded sleeve (407). The third airbag (416) is connected to a second connecting pipe (417) on one side. The other end of the second connecting pipe (417) passes through the fifth through hole opened by the fixing block (401) and the clamping block (408) in sequence and is connected to the first airbag (410).

8. The measuring device as described in claim 1, characterized in that, Two measuring components (5) are provided, and the two measuring components (5) are arranged opposite each other on the top of the workbench (1) and the bottom of the top plate (3); The measuring component (5) includes an X-axis module (51) fixed to the top of the worktable (1) or the bottom of the top plate (3), a Y-axis module (52) set on the X-axis module (51), a hydraulic cylinder (53) set on the Y-axis module (52), and a laser measuring head set on the hydraulic cylinder (53).

9. The measuring device as described in claim 8, characterized in that, The X-axis module (51) includes a guide rail (54) and a side guide rail (57) arranged parallel to the guide rail (54). The Y-axis module (52) includes a Y-axis base plate, a Y-axis guide rail set on the Y-axis base plate, side sliders (56) at both ends of the bottom of the Y-axis base plate, and a T-shaped plate (55) slidably set on the Y-axis guide rail. The two side sliders (56) are respectively adapted to the guide rail (54) and the side guide rail (57); the hydraulic cylinder (53) is set on the T-shaped plate (55).

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