Semiconductor package structure and method of forming the same

Abstract

The present application relates to a semiconductor package structure and a method of forming the same. The semiconductor package structure includes a substrate including a first substrate portion, a second substrate portion, and a bending portion, the second substrate portion being connected to the first substrate portion by the bending portion and a fixing member on the bending portion, such that the second substrate portion is at an angle to the first substrate portion, wherein an exposed circuit is provided at a surface of the second substrate portion facing away from the first substrate portion.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a semiconductor packaging structure and a method for forming the same. Background Technology

[0002] In common package structures, external I / O (input / output) connections are typically located on only one side, which limits the number of I / O ports in the package. Therefore, to increase the number of I / O ports in a package, such as... Figure 1A As shown, the prior art vertically bonds the substrate / package 11 using through-hole pads on the side to expose the externally connected lateral I / O 13 in the vertical direction. However, as Figure 1B and Figure 1C As shown, the dimensions of the through-hole pads 18 exposed by the saw process 15 may be inconsistent due to errors in the saw process 15. This will seriously affect the flatness of the solder joint and the accuracy of the lateral I / O external connection of the substrate.

[0003] To solve the above problems, existing technologies utilize a metal lid 21 ( Figure 2A ) or bondwire 22 ( Figure 2B These methods can solve the above problems, but the large pitch of the lateral I / O means that the number of I / Os is still limited. Summary of the Invention

[0004] To address the aforementioned problems in related technologies, this invention proposes a semiconductor packaging structure and a method for forming the same.

[0005] According to one aspect of the present invention, a semiconductor packaging structure is provided. The semiconductor packaging structure includes a substrate, the substrate including a first substrate portion, a second substrate portion and a bending portion, the second substrate portion being connected to the first substrate portion via the bending portion and a fixing member located on the bending portion, such that the second substrate portion is at an angle to the first substrate portion, wherein exposed lines are present on the surface of the second substrate portion facing away from the first substrate portion.

[0006] In the above semiconductor packaging structure, the bending portion has a groove that is recessed relative to the upper surface of the first substrate portion and the upper surface of the second substrate portion.

[0007] In the above semiconductor packaging structure, the fixing element is filled in the groove.

[0008] In the above semiconductor packaging structure, the groove has a first sidewall and a second sidewall that are respectively adjacent to the first substrate portion and the second substrate portion. The first sidewall forms an acute angle with the plane containing the upper surface of the first substrate portion, and the second sidewall forms an acute angle with the plane containing the upper surface of the second substrate portion.

[0009] In the above semiconductor packaging structure, the second sidewall is opposite to a portion of the bottom surface of the groove and there is a gap between the second sidewall and the portion of the bottom surface, wherein the fixing member fills the gap.

[0010] The semiconductor packaging structure described above also includes: a molding compound covering the upper surface of the first substrate portion and the surface of the second substrate portion facing the first substrate portion.

[0011] In the above semiconductor packaging structure, the molding compound also covers the sidewall of the second substrate portion away from the first substrate portion.

[0012] In the above semiconductor packaging structure, the angle is 90 degrees.

[0013] In the above semiconductor packaging structure, the fixing element includes a colloid.

[0014] According to another aspect of the present invention, a method for forming a semiconductor package structure is provided, comprising: forming a groove on the upper surface of a substrate to form a first substrate portion and a second substrate portion separated by the groove; bending the substrate from the groove such that the second substrate portion is at an angle to the first substrate portion; and filling the bent groove with a fastener connecting the first substrate portion and the second substrate portion.

[0015] In the above method, after filling the fixing member, a molding is formed, wherein the molding is used to cover the upper surface of the first substrate portion and the surface of the second substrate portion facing the first substrate portion.

[0016] In the above method, a molding material is also used to cover the sidewall of the second substrate portion away from the first substrate portion.

[0017] In the above method, forming a groove on the upper surface of the substrate includes: forming the groove using a laser, wherein a shielding component is embedded in the substrate, and the groove is formed above the shielding component using a laser.

[0018] In the above method, bending the substrate from the groove includes: providing an opening on a carrier plate below the substrate; and bending the substrate by applying force to the second substrate portion through a bending tool passing through the opening.

[0019] In the above method, before forming the groove, the method further includes providing a substrate, wherein the substrate has exposed lines located on the lower surface of the second substrate portion.

[0020] In the above method, the substrate is bent so that the second substrate portion is perpendicular to the first substrate portion.

[0021] In the above method, the groove has inclined sidewalls.

[0022] In the above method, after bending the substrate, a gap is formed between the sidewall of the groove adjacent to the second substrate portion and a portion of the bottom surface of the groove, wherein the fastener fills the gap.

[0023] In the above method, the fastener includes a colloid. Attached Figure Description

[0024] The various aspects of the invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to standard industrial practice, the components are not drawn to scale. In fact, the dimensions of the components may be arbitrarily increased or decreased for clarity of discussion.

[0025] Figure 1A This is a schematic diagram of the existing vertical bonding of substrates / packages;

[0026] Figure 1B Is and Figure 1C This is a schematic diagram of the existing cutting process;

[0027] Figure 2A and Figure 2B These are schematic diagrams of existing lateral I / O;

[0028] Figure 3A This is a schematic diagram of a semiconductor packaging structure according to an embodiment of the present invention;

[0029] Figure 3B yes Figure 3A Side view in the AA direction;

[0030] Figure 3C This is a schematic diagram of the connection between a semiconductor packaging structure and an external device according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of a semiconductor packaging structure according to an embodiment of the present invention;

[0032] Figures 5A to 5G This is a schematic diagram of the various stages of a method for forming a semiconductor package structure according to an embodiment of the present invention. Detailed Implementation

[0033] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the invention. These are merely examples and are not intended to limit the invention. For example, in the following description, forming a first component above or on a second component can include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated throughout the various instances. Such repetition is for brevity and clarity only and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0034] Figure 3A This is a schematic diagram of a semiconductor packaging structure according to an embodiment of the present invention. Figure 3B yes Figure 3A Side view in the AA direction. (Example) Figure 3A and Figure 3B As shown, the semiconductor package structure provided by the present invention has a substrate 110, which includes a first substrate portion 111, a second substrate portion 112, and a bending portion 113. The second substrate portion 112 has exposed wiring 115. The second substrate portion 112 is connected to the first substrate portion 111 via the bending portion 113 and a fixing member 120 located on the bending portion 113, such that the second substrate portion 112 forms an angle with the first substrate portion 111. In the illustrated embodiment, the angle between the second substrate portion 112 and the first substrate portion 111 is 90 degrees. Exposed wiring 115 is present on the surface of the second substrate portion 112 facing away from the first substrate portion 111. Thus, the exposed wiring 115 of the second substrate portion 112 is located on the surface of the second substrate portion 112 in the vertical direction. The exposed wiring 115 of the second substrate portion 112 can be used as I / O for external connection. In one embodiment, a schematic diagram of the connection between the exposed wiring 115 of the second substrate portion 112 and a first external device 210 is shown. Figure 3C As shown, the substrate 110 is also connected to the second external device 220 via the I / O 116 at the bottom of the first substrate portion 111.

[0035] The semiconductor packaging structure of the present invention utilizes a substrate with a bend 113 such that the first substrate portion 111 and the second substrate portion 112 of the substrate are at an angle, such that the exposed lines 115 of the second substrate portion 112 are located laterally and serve as lateral external connection points, thereby eliminating the need for additional components as external connection points. Furthermore, the exposed lines 115 can be formed using the substrate's circuit fabrication process, and the linewidth / pitch of the lines 115 can reach less than 15 / 15 μm, achieving high density and quantity of I / O. To maintain the angle between the second substrate portion 112 and the first substrate portion 111, i.e., to maintain the geometric characteristics (position and / or angle) of the lateral I / O, it must be able to resist molding without deformation; therefore, a fixing member 120 is provided between the second substrate portion 112 and the first substrate portion 111 for connection.

[0036] Continue to refer to Figure 3A The bent portion 113 has a groove 119 that is recessed relative to the upper surface of the first substrate portion 111 and the upper surface of the second substrate portion 112. The fastener 120 is filled in the groove 119. In some embodiments, the fastener 120 includes an adhesive, such as conductive adhesive, solder, or other material that can fix the second substrate portion 112 and the first substrate portion 111.

[0037] Figure 4 This is a schematic diagram of a semiconductor package structure according to another embodiment of the present invention. Figure 4 In the semiconductor package structure, the molding compound 130 also includes a molding compound 130, which covers the upper surface of the first substrate portion 111 and the surface 1121 of the second substrate portion 112 facing the first substrate portion 111. The molding compound 130 may also cover the sidewall 1122 of the second substrate portion 112 away from the first substrate portion 111.

[0038] According to embodiments of the present invention, a method for forming a semiconductor package structure is also provided. Figures 5A to 5G This is a schematic diagram of the various stages of a method for forming a semiconductor package structure according to an embodiment of the present invention.

[0039] like Figure 5A As shown, a substrate is provided. Electronic components 150 can be placed on the upper surface of the substrate 110'. Exposed wiring 115 is present on at least a portion of the lower surface of the substrate 110'. Exposed wiring 115 may also be present on the upper surface of the substrate.

[0040] like Figure 5BAs shown, a single substrate 110 can be formed by cutting the substrate 110' using a laser 152. In other embodiments, a single substrate 110 can be provided, omitting the cutting process. Furthermore, a portion of the dielectric layer of the substrate 110 is also removed using a laser 152 to form a groove 119, thereby forming a first substrate portion 111 and a second substrate portion 112 separated by the groove 119. In some embodiments, the groove 119 can be formed on the upper surface of the substrate using a laser. The groove 119 may have inclined sidewalls. Specifically, the groove 119 has a first sidewall 1191 adjacent to the first substrate portion 111 and a second sidewall 1192 adjacent to the second substrate portion 112. The first sidewall 1191 and the second sidewall 1192 are inclined, and the width of the groove 119 gradually decreases in the direction from the top to the bottom of the groove 119. That is, the plane containing the first sidewall 1191 and the upper surface of the first substrate portion 111 forms an acute angle, and the plane containing the second sidewall 1192 and the upper surface of the second substrate portion 112 forms an acute angle.

[0041] In some embodiments, a shielding member 118 may be embedded in the substrate 110, and a groove 119 may be formed above the shielding member 118 using a laser 152. Furthermore, the shielding member 118 can control the depth to which the laser 152 removes a portion of the dielectric material from the substrate, and can be used as a stop layer, meaning the process of forming the groove 119 can stop when it reaches the shielding member 118. Additionally, the exposed wiring 115 on the upper surface of the substrate 110 can be used to block the laser 152 to control the size of the groove 119, thereby preventing it from affecting the subsequent bending process.

[0042] like Figure 5C As shown, a carrier plate 140 is provided below the substrate 110, and the carrier plate 140 may have an opening 312 located below the second substrate portion 112. Then as... Figure 5D As shown, the substrate 110 is bent by applying force to the second substrate portion 112 through the bending tool 314 passing through the opening 312. The substrate 110 is bent from the groove 119, with the bend occurring at the bottom surface of the groove 119, so that the second substrate portion 112 can form an angle with the first substrate portion 111. Specifically, the substrate can be bent so that the second substrate portion 112 is perpendicular to the first substrate portion 111. In other embodiments, other suitable methods can also be used to bend the substrate.

[0043] Figure 5E yes Figure 5D A magnified view of a portion of the image. For example... Figure 5E As shown, after bending the substrate 110, the second sidewall 1192 of the groove 119 adjacent to the second substrate portion 112 faces a portion of the bottom surface of the groove 119, and there is a gap 1195 between the second sidewall 1192 and the portion of the bottom surface of the groove 119.

[0044] like Figure 5F As shown, a fastener 120 is filled in the bent groove 119, connecting the first substrate portion 111 and the second substrate portion 112. The fastener 120 can contact and connect with exposed lines 115 on the surface of the second substrate portion 112 adjacent to the fastener 120, which strengthens the fixed connection between the first substrate portion 111 and the second substrate portion. The fastener 120 also fills the gap 1195. Figure 5E In some embodiments, the fastener 120 comprises an adhesive. The fastener 120 can resist molding pressure applied during subsequent molding of the molded article, preventing deformation of the structure.

[0045] like Figure 5G As shown, a molding compound 130 is formed. The molding compound 130 can cover the upper surface of the first substrate portion 111 and the surface of the second substrate portion 112 facing the first substrate portion 111. The molding compound 130 can also cover the sidewall of the second substrate portion 112 away from the first substrate portion 111. The carrier plate 140 can then be removed to obtain a semiconductor package structure.

[0046] The foregoing summary outlines features of several embodiments that enable those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that other processes and structures can be readily designed or modified based on this invention to achieve the same objectives and / or benefits as the embodiments described herein. Those skilled in the art should also recognize that these equivalent structures do not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of the invention.

Claims

1. A semiconductor packaging structure, characterized in that, include: The substrate includes a first substrate portion, a second substrate portion, and a bent portion. The second substrate portion is connected to the first substrate portion via the bent portion and a fastener located on the bent portion. The bent portion has a groove recessed relative to the upper surfaces of the first substrate portion and the second substrate portion. The groove has a first sidewall and a second sidewall respectively adjacent to the first substrate portion and the second substrate portion. The second sidewall faces a portion of the bottom surface of the groove, and a gap exists between the second sidewall and the portion of the bottom surface. The edge of the second sidewall that contacts the upper surface of the second substrate portion is located below the upper surface of the first substrate portion, such that the upper surface of the second substrate portion forms a perpendicular angle with the upper surface of the first substrate portion on which electronic components are disposed. The second substrate has exposed lines on its surface opposite to the first substrate.

2. The semiconductor packaging structure according to claim 1, characterized in that, The fastener is filled into the groove.

3. The semiconductor packaging structure according to claim 1, characterized in that, The first sidewall forms an acute angle with the plane containing the upper surface of the first substrate portion, and the second sidewall forms an acute angle with the plane containing the upper surface of the second substrate portion.

4. The semiconductor packaging structure according to claim 3, characterized in that, The fastener fills the gap.

5. The semiconductor packaging structure according to claim 1, characterized in that, Also includes: A molded material that covers the upper surface of the first substrate portion and the surface of the second substrate portion facing the first substrate portion.

6. The semiconductor packaging structure according to claim 5, characterized in that, The molded material also covers the sidewall of the second substrate portion away from the first substrate portion.

7. A method for forming a semiconductor package structure, characterized in that, include: A groove is formed on the upper surface of the substrate to form a first substrate portion and a second substrate portion separated by the groove, the groove having a first sidewall and a second sidewall respectively adjacent to the first substrate portion and the second substrate portion; The substrate is bent from the groove such that the upper surface of the second substrate portion is perpendicular to the upper surface of the first substrate portion where the electronic components are located. After the substrate is bent, the second sidewall is opposite to a portion of the bottom surface of the groove, a gap is formed between the second sidewall and a portion of the bottom surface of the groove, and the edge of the second sidewall that meets the upper surface of the second substrate portion is located below the upper surface of the first substrate portion. The groove after bending is filled with a fastener that connects the first substrate portion and the second substrate portion.

8. The method according to claim 7, characterized in that, After filling the fastener, the following is also included: A molding is formed, wherein the molding is used to cover the upper surface of the first substrate portion and the surface of the second substrate portion facing the first substrate portion.

9. The method according to claim 8, characterized in that, The molding material is also used to cover the sidewall of the second substrate portion away from the first substrate portion.

10. The method according to claim 7, characterized in that, Forming the groove on the upper surface of the substrate includes: The groove is formed using a laser, wherein a shielding component is embedded in the substrate, and the groove is formed above the shielding component using a laser.

11. The method according to claim 7, characterized in that, Bending the substrate from the groove includes: An opening is provided on the carrier plate below the substrate; The substrate is bent by applying force to the second substrate portion through a bending tool that passes through the opening.

12. The method according to claim 7, characterized in that, The process includes the following steps prior to forming the groove: The substrate is provided, wherein the substrate has exposed lines located on the lower surface of the second substrate portion.

13. The method according to claim 7, characterized in that, The fastener fills the gap.

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