A carrier frame for micro-LED transfer

Abstract

This invention discloses a carrier frame for transferring micro-sized LEDs. The carrier frame is used to mount a first substrate with micro-sized LED chips adhered to it. The carrier frame has a mounting opening that extends through the carrier frame along its thickness direction. Along the thickness direction of the carrier frame, one side has a support structure, and the other side has mounting clips. Multiple mounting clips are spaced circumferentially along the mounting opening, and each mounting clip is rotatably connected to the carrier frame. The carrier frame also includes an elastic element to provide the force required for the mounting clips to rotate toward the mounting opening. This carrier frame has a simple structure, reliable installation, and can stably hold the first substrate.

Description

[0001] This application is a divisional application of the invention application filed on September 13, 2022, with application number 2022111068816 and titled "A miniature LED transfer device, transfer method and carrier frame". Technical Field

[0002] This invention relates to the field of semiconductor chip manufacturing technology, and in particular to a carrier frame for transferring micro-sized LEDs. Background Technology

[0003] Light-emitting diodes (LEDs) are commonly used light-emitting devices that release energy through the recombination of electrons and holes, and are widely used in lighting, flat panel displays, medical devices, and other fields. Currently, LEDs are increasingly being miniaturized. With the emergence of MiniLEDs (chip size approximately 100–300 μm) and MicroLEDs (chip size approximately 50–100 μm), the technology of directly using LEDs for displays is gradually entering the market. Displays made with miniature LEDs, with their smaller pixels and higher quality images, are becoming the future direction of display technology. In existing technologies, miniature LEDs are typically manufactured using wafer fabrication processes. First, LEDs are fabricated on a wafer, then the wafer is diced into a large number of individual miniature LED chips, and finally these miniature LEDs are transferred to target substrates such as circuit boards, wafer tapes, blue films, and white films.

[0004] In the aforementioned process, the efficiency of transferring the diced micro-LEDs to the target substrate is one of the key factors limiting the production efficiency of micro-LED displays. Due to the small size and large quantity of micro-LEDs, the transfer efficiency is extremely low if traditional nozzles are used to pick them up one by one. Some improved transfer devices combine multiple nozzles for pick-up and mounting, improving the overall speed to some extent, but this also leads to a significant increase in the size of the transfer device and increased difficulty in operation, making it difficult to achieve a significant breakthrough in transfer speed. The needle-punching transfer method, which has emerged in recent years, is a faster approach. The principle of this method is as follows: the diced micro-LEDs are first adhered to a substrate with a certain degree of adhesiveness (such as PVC film), and then one LED is punctured to detach from the substrate and contact the target substrate, which also has a certain degree of adhesiveness, allowing the LED to be transferred to the target substrate through adhesion. In the needle-punching transfer method, the needle travels a very short distance, thus achieving a very high reciprocating motion frequency. However, existing needle-punching transfer devices still suffer from one or more problems, such as large device size, poor flexibility, and low transfer accuracy. Summary of the Invention

[0005] The purpose of this invention is to provide a carrier frame suitable for the transfer of miniature LEDs. To achieve the above objective, the technical solution adopted by this invention is:

[0006] A carrier frame for transferring micro-sized LEDs is provided. The carrier frame is used to mount a first substrate to which a micro-sized LED chip is adhered. The carrier frame has a mounting opening that extends through the carrier frame along its thickness direction. Along the thickness direction of the carrier frame, a support structure is provided on one side and a mounting clip is provided on the other side. The mounting clip has multiple clips spaced circumferentially along the mounting opening. Each mounting clip is rotatably connected to the carrier frame. The carrier frame also has an elastic element for providing the force required for the mounting clip to rotate toward the mounting opening.

[0007] In some embodiments, the support frame is generally in the shape of a flat rectangular plate, and the thickness direction of the support frame extends vertically during operation. The mounting clips are four of them located at the four corners of the support frame. The four mounting clips are equidistant from each other, and the rotation center line of each mounting clip extends horizontally. Each elastic element is a torsion spring wound around the rotation axis of the corresponding mounting clip.

[0008] In some embodiments, the mounting opening is circular, and the supporting structure is an annulus with an inner diameter smaller than that of the mounting opening.

[0009] In some embodiments, the support frame has a mounting surface located on one side of the support frame in the thickness direction, and the mounting surface is provided with a first positioning structure, which has a plurality of first positioning structures spaced apart on the mounting surface, each of the first positioning structures being a pin or a slot.

[0010] In some embodiments, the support frame is placed horizontally during operation, the mounting surface is located on the upper side of the support frame, and the first positioning structure includes two structures respectively disposed on both sides of the mounting opening.

[0011] In some embodiments, the mounting surface is provided with magnetic elements, and there are multiple magnetic elements, which are spaced apart circumferentially along the mounting opening.

[0012] In some embodiments, the support frame has a clamping sidewall with a plurality of clamping openings spaced apart on the clamping sidewall, and each clamping opening has a limiting protrusion at its opening.

[0013] In some embodiments, the clamping sidewall is located on one side of the length direction of the support frame.

[0014] In some embodiments, the clamping sidewall has two clamping openings symmetrically arranged along the width direction of the bearing frame. The inner cavity of each clamping opening is approximately rectangular. Each clamping opening has two limiting protrusions on both sides at its opening. The two limiting protrusions reduce the opening width of the clamping opening, making the opening width smaller than the inner cavity width.

[0015] In some embodiments, the support frame has a mounting surface and a clamping sidewall. The mounting surface is located on one side of the thickness direction of the support frame, and the clamping sidewall is perpendicular to the mounting surface. The mounting surface is provided with a magnetic element and a first positioning structure, and the clamping sidewall is provided with a clamping opening for clamping.

[0016] Due to the application of the above technical solutions, the micro-LED transfer device provided by this invention, through the setting of a feeding mechanism, a first carrier mechanism, a second carrier mechanism, and an LED transfer mechanism, makes the entire transfer device compact in structure, and the various mechanisms can cooperate efficiently, flexibly, and orderly. Specifically, the seat in the first movable base and the adjustment platform can be finely adjusted. During use, not only can the angle of the adjustment platform be rotated to ensure precise alignment of the micro-LED chips on the first substrate with the second substrate, accurately transferring each micro-LED chip to its corresponding position on the second substrate, but the height and level of the adjustment platform can also be finely adjusted, further improving the transfer accuracy of the micro-LED chips from details. Furthermore, the carrier frames in this invention can be quickly installed onto the adjustment platform using a magnetic structure, making the assembly and disassembly of the carrier frames convenient, reliable, and highly automated. In particular, the electromagnet in this invention is made of a permanent magnet. The permanent magnet is magnetic in the normal de-energized state, maintaining the attraction of the carrier frames; while in the energized state, a reverse electromagnetic field is applied to the permanent magnet electromagnet, causing it to lose its magnetic field for a short time, thereby achieving rapid disassembly of the carrier frames. The above design helps reduce the energy consumption of the first load-bearing mechanism, while improving its operational stability and simplifying the control method.

[0017] The micro-LED transfer method provided by this invention uses a single positioning camera to acquire images and position information of a first substrate and a second substrate, enabling flexible alignment between the two substrates. This allows each micro-LED chip to be precisely transferred to its target location on the second substrate. The carrier frame provided by this invention has a flat structure, which stably clamps the first substrate, further improving the efficiency and accuracy of micro-LED chip transfer. Attached Figure Description

[0018] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0019] Appendix Figure 1This is a three-dimensional schematic diagram of a micro-sized LED transfer device in a specific embodiment of the present invention;

[0020] Appendix Figure 2 This is a top view of the micro-LED transfer device in this embodiment;

[0021] Appendix Figure 3 This is a schematic diagram illustrating the working principle of the micro-LED transfer device in this embodiment;

[0022] Appendix Figure 4 This is a three-dimensional schematic diagram of the feeding mechanism in this embodiment, wherein the clamping component does not clamp the bearing frame;

[0023] Appendix Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0024] Appendix Figure 6 This is a partial three-dimensional schematic diagram of the feeding mechanism in this embodiment, wherein the clamping component clamps the bearing frame;

[0025] Appendix Figure 7 This is a three-dimensional schematic diagram of the support frame in this embodiment;

[0026] Appendix Figure 8 This is a three-dimensional schematic diagram of the first bearing mechanism in this embodiment;

[0027] Appendix Figure 9 This is a partial three-dimensional schematic diagram of the first bearing mechanism in this embodiment;

[0028] Appendix Figure 10 for Figure 9 Front view diagram;

[0029] Appendix Figure 11 for Figure 10 Schematic diagram of the BB section;

[0030] Appendix Figure 12 for Figure 11 Enlarged view of point C in the middle;

[0031] Appendix Figure 13 This is a three-dimensional schematic diagram of the second bearing mechanism in this embodiment;

[0032] Appendix Figure 14 This is a partial three-dimensional schematic diagram of the second bearing mechanism in this embodiment;

[0033] Appendix Figure 15 for Figure 14 Front view diagram;

[0034] Appendix Figure 16 This is a three-dimensional schematic diagram of the LED transfer mechanism in this embodiment;

[0035] Wherein: 1. First substrate; 2. Second substrate; 3. Micro-sized LED chip;

[0036] 100, Support frame; 101, Mounting port; 102, Mounting surface; 103, Clamping sidewall; 104, Clamping opening; 105, Limiting protrusion; 110, Mounting clamp; 120, Elastic element; 130, Magnetic element; 140, First positioning structure;

[0037] 200. Base; 210. Third track;

[0038] 300. Feeding mechanism; 310. Storage bin; 320. Feeding assembly; 321. Feeding support; 322. Feeding movable seat; 323. Clamping component; 324. Pushing component; 325. Clamping head; 325a. Head; 325b. Neck; 326. Supporting guide rail; 330. Photoelectric sensor;

[0039] 400, First bearing mechanism; 410, First support seat; 411, First support rail; 420, First movable seat; 421, Seat body; 4211, Connecting part; 4212, Mounting part; 422, Adjusting platform; 422a, Mounting groove; 430, Leveling assembly; 431, First leveling component; 432, Second leveling component; 433, Roller; 440, First rail; 441, Rack; 450, Electromagnet; 460, Rotary adjusting motor;

[0040] 500, Second bearing mechanism; 501, Lifting space; 510, Second movable seat; 511, Vacuum suction port; 520, Second track; 530, Lifting assembly; 531, Drive seat; 531a, Drive inclined surface; 532, Lifting seat; 532a, Mating inclined surface; 533, Drive track; 534, Drive motor;

[0041] 600, LED transfer mechanism; 610, third support; 611, third support rail; 620, third movable seat; 630, transfer punch; 640, positioning camera; 650, laser rangefinder; 660, voice coil motor;

[0042] X, first direction; Y, second direction; Z, up and down direction; 1001, first rotation center line; 1002, second rotation center line. Detailed Implementation

[0043] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more readily understood by those skilled in the art.

[0044] See Figures 1 to 3As shown, a miniature LED transfer device is used to transfer miniature LED chips 3 adhered to a first substrate 1 to a second substrate 2. The transfer device mainly includes a base 200, and a feeding mechanism 300, a first supporting mechanism 400, a second supporting mechanism 500, and an LED transfer mechanism 600 disposed on the base 200. The transfer device further includes a control unit (not shown in the figure), which is connected to the aforementioned mechanisms via signals, thereby enabling unified control and automated management of the entire transfer device.

[0045] See Figure 1 As shown, to facilitate the description and understanding of the specific structure of the transfer device, a three-dimensional XYZ coordinate system is established in this embodiment with the base 200 as a reference. The first direction X, the second direction Y, and the vertical direction Z are mutually perpendicular. The first direction X and the second direction Y extend horizontally, and the vertical direction Z extends vertically. It should be noted that the directional terms such as "up," "down," "left," "right," "front," "back," "horizontal," and "vertical" used in this embodiment are defined based on the orientation shown in the attached drawings. They are only used to describe the relative positions and connections of the components in this embodiment and do not imply that the components in the transfer device must have a specific orientation or placement. Therefore, they should not be construed as limiting the invention.

[0046] See Figure 3 The diagram illustrates the basic working principle of the transfer device in this embodiment. A first substrate 1 is fixed within a support frame 100. The first substrate 1 can be a carrier material with certain adhesion and elasticity, such as wafer tape, blue film, or white film. A large number of micro-LED chips 3 to be transferred are adhered to the first substrate 1. Specifically, the micro-LED chips 3 can be Mini LEDs, Micro LEDs, etc. A second substrate 2 is fixed to a second movable seat 510, which remains fixed during the transfer of the micro-LED chips 3. The second substrate 2 can be a rigid or flexible material such as a circuit board, FPC, wafer tape, blue film, or white film. The second substrate 2 is coated with an adhesive coating such as glue, solder paste, or silver paste, which allows the micro-LED chips 3 transferred from the first substrate 1 to adhere. In this embodiment, the transfer device includes at least a transfer punch 630 and a positioning camera 640. The positioning camera 640 is used for visual inspection and positioning of the first substrate 1, the second substrate 2, and each micro-LED chip 3, enabling the LED transfer process to be carried out efficiently and accurately. The transfer punch 630 is used to move at high speed in the first direction X, the second direction Y and the up and down direction Z to apply a certain pressure to each micro LED chip 3 from above the first substrate 1, so that the micro LED chip 3 can quickly detach from the first substrate 1 and transfer to the corresponding position on the second substrate 2.

[0047] See Figure 1 and Figure 2 As shown, in this embodiment, a third track 210 is fixed on the base 200. The third track 210 has two tracks spaced apart along the second direction Y, and each third track 210 extends along the first direction X. The feeding mechanism 300 includes a storage bin 310 and a feeding assembly 320. The storage bin 310 is used to store one or more carrier frames 100, and the feeding assembly 320 is used to transfer the carrier frames 100 between the storage bin 310 and the first carrier mechanism 400. The first carrier mechanism 400 is used to fix and adjust the position of the carrier frames 100. It includes a first support 410 and a first movable seat 420. The first support 410 is movably disposed on the base 200 along the first direction X. Specifically, the first support 410 is slidably disposed on the two third tracks 210 along the first direction X, and the first movable seat 420 is movably disposed on the first support 410 along the second direction Y. The second supporting mechanism 500 is used to fix and adjust the position of the second substrate 2. The second supporting mechanism 500 includes a second movable seat 510, which is movable relative to the base 200 in both the second direction Y and the vertical direction Z. The second movable seat 510 is used to fix and install the second substrate 2. The LED transfer mechanism 600 includes a third support 610, a third movable seat 620, and a transfer punch 630. The third support 610 is movable relative to the base 200 in the first direction X. Specifically, the third support 610 is slidably mounted on two third tracks 210 in the first direction X. The third movable seat 620 is movable relative to the third support 610 in the second direction Y. The transfer punch 630 is movable relative to the third movable seat 620 in the vertical direction Z.

[0048] See Figure 7 As shown in the figure, in this embodiment, each carrier frame 100 is generally a flat rectangular plate. During operation, the carrier frames 100 are placed horizontally in the orientation shown in the figure. Therefore, in this embodiment, the structure of the carrier frame 100 is still described with reference to the XYZ three-dimensional coordinate system. It should be noted that since each carrier frame 100 is an independent component, when it is not in operation or located outside the transfer device, the carrier frame 100 can also be placed in any other orientation. In this embodiment, the carrier frame 100 has a mounting opening 101, which extends through the carrier frame 100 along its thickness direction (here, the vertical Z direction). The mounting opening 101 is used to mount the first substrate 1 and allows the transfer punch 630 to press the first substrate 1 from above. In this embodiment, corresponding to the circular first substrate 1, the mounting opening 101 is specifically circular; in other embodiments, depending on the shape of the first substrate 1 or the second substrate 2, the mounting opening 101 can also be set to other geometric shapes.

[0049] Further, see Figure 7 As shown, in this embodiment, along the thickness direction of the support frame 100, a support structure (not shown in the figure) is provided on one side of the support frame 100, and a mounting clip 110 is provided on the other side. Specifically, the support structure can be an annulus with an inner diameter slightly smaller than the mounting opening 101, so that the support structure and the mounting clip 110 cooperate to stably clamp the first substrate 1 in the mounting opening 101. In this embodiment, the mounting clip 110 has multiple clips spaced circumferentially along the mounting opening 101. Each mounting clip 110 is rotatably connected to the support frame 100. The support frame 100 also has an elastic element 120 for providing the force required for the mounting clip 110 to rotate toward the mounting opening 101. Specifically, in this embodiment, four mounting clips 110 are located at the four corners of the rectangular support frame 100, equidistantly distributed. The rotation center line of each mounting clip 110 extends horizontally. The elastic element 120 is specifically a torsion spring wound around the rotation axis of the corresponding mounting clip 110. See also... Figure 7 As shown, each mounting clip 110 only clamps the edge of the first substrate 1, so it does not hinder the normal operation of the transfer punch 630 during the LED transfer process.

[0050] See Figure 7As shown, in this embodiment, the carrier frame 100 has a mounting surface 102 and a clamping side wall 103. The mounting surface 102 is located on one side of the carrier frame 100 in the thickness direction, and the clamping side wall 103 is perpendicular to the mounting surface 102. In this embodiment, the mounting surface 102 is specifically located on the upper side of the carrier frame 100, and the clamping side wall 103 is located on one side in the first direction X. As can be seen from the figure, since there are uneven structures such as reinforcing ribs above the carrier frame 100, the mounting surface 102 is not a flat horizontal plane. In this embodiment, a magnetic member 130 and a first positioning structure 140 are provided on the mounting surface 102, and the magnetic member 130 and the first positioning structure 140 respectively have a plurality of them spaced apart on the mounting surface 102. In this embodiment, the magnetic member 130 can be a structure such as an iron block or a magnet that can be adsorbed by magnetic force. Specifically, three magnetic members 130 are shown spaced along the circumference of the mounting opening 101 in the figure. Each first positioning structure 140 can specifically be a plug or a slot. In the figure, two slot-type first positioning structures 140 are shown spaced along the second direction Y, and the two first positioning structures 140 are respectively arranged on both sides of the mounting opening 101. Further, a plurality of clamping openings 104 are spaced on the clamping side wall 103, and a limiting protrusion 105 is provided at the opening of each clamping opening 104. In this embodiment, specifically, two clamping openings 104 are provided on the clamping side wall 103 and are symmetrically arranged along the second direction Y. The inner cavity of each clamping opening 104 is generally rectangular. The two limiting protrusions 105 on both sides of the opening of the clamping opening 104 reduce the opening width of the clamping opening 104, making the opening width smaller than the width of the inner cavity, so that each clamping opening 104 is generally in a "convex" shape as a whole.

[0051] See Figure 4 As shown, in this embodiment, the storage bin 310 is used to store a plurality of carrier frames 100 stacked in the vertical direction Z. The feeding mechanism 300 further includes a photoelectric sensor 330 for detecting whether a carrier frame 100 is stored at a certain height in the storage bin 310. There are a plurality of photoelectric sensors 330 stacked in the vertical direction Z, and the plurality of photoelectric sensors 330 correspond to a plurality of heights in the storage bin 310 one by one. The plurality of photoelectric sensors 330 are arranged in parallel on one side of the storage bin 310 in the second direction Y. Thus, when the photoelectric sensor 330 detects that a carrier frame 100 is stored at a certain height in the storage bin 310, it can feedback the detection signal to the control unit. The feeding component 320 receives the instruction of the control unit and can quickly take out the carrier frame 100 from the storage bin 310 and transfer it to the first carrying mechanism 400.

[0052] See Figures 4 to 6As shown, in this embodiment, the feeding assembly 320 includes a feeding support 321 and a feeding movable seat 322. The feeding support 321 is movably mounted on the base 200, and the feeding movable seat 322 is movably mounted on the feeding support 321 along the vertical direction Z. In this embodiment, the feeding support 321 is movably mounted on the base 200 at least along the first direction X and the second direction Y, and is rotatably mounted on the base 200 about a vertical rotation center line, thereby accurately transferring and fixing the carrier frame 100 supported by the feeding movable seat 322 onto the first movable seat 420 of the first carrier mechanism 400. In this embodiment, the feeding support 321 is provided with a clamping member 323 and a pushing member 324, which are movably mounted on the feeding support 321 along the horizontal direction. In this embodiment, when the feeding support 321 and the storage bin 310 are engaged (e.g.) Figure 4 As shown, the clamping member 323 and the pushing member 324 are respectively movably mounted on the loading support 321 along the first direction X. The loading movable seat 322 is also provided with a supporting guide rail 326, the extension direction of which is parallel to the movement direction of the clamping member 323. In this embodiment, when the loading support 321 cooperates with the storage compartment 310, the supporting guide rail 326 has two rails spaced apart along the second direction Y, and each supporting guide rail 326 extends along the first direction X, thereby providing more stable support for the carrier frame 100 clamped by the clamping member 323.

[0053] See Figures 5 to 6 As shown, in this embodiment, the clamping member 323 has clamping heads 325, each clamping head 325 having multiple clamping openings 104 corresponding to multiple clamping ports 104, specifically two spaced apart along the second direction Y. When the carrier frame 100 is located in the storage compartment 310, the multiple clamping heads 325 and the openings of the multiple clamping ports 104 are arranged opposite each other along the first direction X. Each clamping head 325 can be inserted into a corresponding clamping port 104 along the vertical direction Z. A limiting structure is provided between the clamping head 325 and the clamping port 104 to prevent the clamping head 325 from disengaging from the clamping port 104 along the first direction X. In this embodiment, each clamping head 325 includes a head 325a and a neck 325b, wherein the head 325a is located on the side closer to the clamping port 104, the width of the head 325a is greater than that of the neck 325b, and the width of the head 325a is greater than the opening width of the corresponding clamping port 104. Therefore, the head 325a of each clamping head 325 and the limiting protrusion 105 of the corresponding clamping opening 104 constitute the limiting structure between the clamping head 325 and the clamping opening 104. See Figure 6As shown, each head 325a can be engaged in the clamping opening 104 on the same side along the vertical direction Z. At this time, the neck 325b is exactly located in the narrow opening between the two limiting protrusions 105, and the clamping head 325 cannot disengage from the clamping opening 104 along the first direction X. Furthermore, when the clamping member 323 clamps a carrier frame 100, multiple clamping heads 325 are inserted into multiple clamping openings 104 in a one-to-one correspondence, and the pushing member 324 abuts against the clamping side wall 103. Here, the pushing member 324 is specifically located between two clamping heads 325, so that the clamping member 323 can stably clamp the carrier frame 100 and is not easy to loosen. Furthermore, when the clamping member 323 clamps a carrier frame 100, both supporting guide rails 326 are supported below the carrier frame 100. When the clamping member 323 drags the carrier frame 100 horizontally, the carrier frame 100 can move relative to the supporting guide rails 326 along their extension direction.

[0054] In this embodiment, the feeding action of the feeding assembly 320 is as follows: First, the feeding support 321 moves along the base 200 to a position close to the storage compartment 310; then, the feeding movable seat 322 moves up and down along the feeding support 321 to align with the height of the carrier frame 100 to be removed; next, the clamping member 323 moves along the first direction X until the clamping member 323 moves below the target carrier frame 100, and the feeding movable seat 322 moves slightly upward so that the two clamping heads 325 can be inserted into the corresponding two clamping ports 104; at this time, the pushing member 324 moves along the first direction X. The clamping member 323 moves and presses against the clamping side wall 103 of the target support frame 100, so that the clamping member 323 fully clamps the support frame 100; thereafter, the clamping member 323 and the pushing member 324 move in the opposite direction along the first direction X, pulling the support frame 100 out of the storage compartment 310 and all the way to the two supporting guide rails 326; finally, the support frame 100 is completely removed from the loading movable seat 322 and can move together with the loading movable seat 322 and the loading support seat 321 to the designated loading position. In this embodiment, the loading position is specifically at the first movable seat 420 of the first support mechanism 400.

[0055] See Figures 8 to 12As shown, in this embodiment, the first support 410 is generally a long arm extending along the second direction Y. The two ends of the first support 410 are respectively mounted on the third rails 210 on both sides of the base 200. The first support 410 is fixedly provided with a first support rail 411 extending along the second direction Y. The first movable seat 420 includes a seat body 421 and an adjustment platform 422. The seat body 421 is movably mounted on the first support 410 along the second direction Y. The adjustment platform 422 is rotatable relative to the seat body 421 around the first rotation center line 1001. The first rotation center line 1001 extends along the vertical direction Z. The adjustment platform 422 is also movably mounted relative to the seat body 421 along the vertical direction Z. In this embodiment, the seat 421 specifically includes an integrally formed connecting part 4211 and a mounting part 4212. The connecting part 4211 and the mounting part 4212 are respectively flat, and the extension directions of the connecting part 4211 and the mounting part 4212 are perpendicular to each other. The connecting part 4211 extends in the vertical direction Z and is directly slidably connected to the first support rail 411. The mounting part 4212 extends horizontally from the lower end of the connecting part 4211. The adjusting platform 422 is connected to the lower part of the connecting part 4211 and is used to directly fix the support frame 100.

[0056] See Figure 9 As shown, in this embodiment, a circular mounting groove 422a is provided on the adjustment platform 422, and a first annular track 440 is provided on the inner sidewall of the mounting groove 422a. The axis of the mounting groove 422a coincides with the first rotation center line 1001. In this embodiment, a circular groove is also provided on the connecting part 4211. The position and size of the circular groove correspond to the mounting groove 422a, and further correspond to the position and size of the mounting opening 101 of the support frame 100 installed below the adjustment platform 422. Thus, a cavity penetrating in the vertical direction Z is provided on the first movable seat 420. This cavity allows the transfer punch 630 to extend from above and press down onto the first substrate 1 and the micro-LED chip 3 in the mounting opening 101.

[0057] See Figure 11As shown, in this embodiment, the adjustment platform 422 is equipped with an electromagnet 450, which has an energized state and an de-energized state. When the electromagnet 450 is de-energized, the adjustment platform 422 can engage and attract a carrier frame 100; when the electromagnet 450 is energized, the adjustment platform 422 disengages from the carrier frame 100. In this embodiment, the electromagnet 450 is specifically made of permanent magnet material. This permanent magnet material is magnetic in its naturally de-energized state and can maintain the attraction of the carrier frame 100. Therefore, during normal LED transfer operations, the electromagnet 450 does not need to be energized, which is more energy-efficient and eliminates concerns about the carrier frame 100 falling off. When a set of LED transfer operations is completed, the electromagnet 450 is energized. The current generated generates an electromagnetic field opposite to the magnetic field of the permanent magnet itself, thereby achieving a temporary demagnetization effect. At this time, the used carrier frame 100 can be quickly removed from the adjustment platform 422. In this embodiment, the adjustment platform 422 has multiple electromagnets 450, and the positions and numbers of the multiple electromagnets 450 correspond one-to-one with the multiple magnetic components 130 on the support frame 100, thereby enabling the support frame 100 to be stably attracted. In this embodiment, the bottom of the adjustment platform 422 is provided with a second positioning structure (not shown in the figure). The second positioning structure has multiple components that cooperate with the multiple first positioning structures 140 on the support frame 100. When the first positioning structure 140 is a slot, the second positioning structure corresponds to a pin. Thus, when the adjustment platform 422 is used to attract a support frame 100, the mounting surface 102 of the support frame 100 faces upward, and the multiple first positioning structures 140 on the mounting surface 102 cooperate one-to-one with the multiple second positioning structures of the adjustment platform 422, with each pin inserted into the corresponding slot. In this way, the first positioning structure 140 and the second positioning structure play a role in positioning the support frame 100 in the first direction X and the second direction Y, so that each support frame 100 can be quickly and accurately installed on the adjustment platform 422.

[0058] See Figures 8 to 12 As shown, in this embodiment, a leveling mechanism is provided between the base 421 and the adjusting platform 422 for adjusting the levelness of the first substrate 1. The leveling mechanism includes at least three sets of leveling components 430, which are spaced apart in the horizontal plane. Each set of leveling components 430 includes a first leveling member 431 and a second leveling member 432. The first leveling member 431 is fixed on the base 421, and the second leveling member 432 is connected to the adjusting platform 422. In each set of leveling components 430, the second leveling member 432 can be relatively movable with the first leveling member 431 in the vertical direction Z. The multiple sets of leveling components 430 are equidistantly distributed along the circumference of the adjusting platform 422. In this embodiment, there are specifically three sets of leveling components 430, which are equidistantly distributed along the circumference of the mounting groove 422a, with the included angle between the centers of each two adjacent sets of leveling components 430 being approximately 120°.

[0059] See Figures 11 to 12 As shown, in this embodiment, in each set of leveling components 430, one of the first leveling component 431 and the second leveling component 432 is a pin, and the other has a slot. The pin can be inserted into the slot in a relative vertical direction Z. The outer peripheral wall of the pin and the inner side wall of the slot are fitted with a clearance, so that each pin can tilt within a certain angle, thereby adjusting the level of the adjustment platform 422. In this embodiment, the first leveling component 431 is specifically a nut fixed on the mounting part 4212, and the second leveling component 432 is specifically a bolt. The bolt and the nut are threadedly connected, so that by rotating the nut, the amount of recess between the first leveling component 431 and the second leveling component 432 can be changed. In this embodiment, by comprehensively adjusting the recess of the three sets of leveling components 430, the support frame 100 under the adjustment platform 422 can be adjusted to be completely level.

[0060] See Figures 9 to 12 As shown, each leveling assembly 430 further includes a roller 433, each roller 433 being movable relative to the first track 440 along its extension direction. The roller 433 is fixedly disposed with the second leveling member 432, or the roller 433 and the second leveling member 432 are rotatably connected about a second rotation center line 1002, which extends in the vertical direction Z. In this embodiment, in each leveling assembly 430, the roller 433 is rotatably connected to the lower end of the second leveling member 432 about the second rotation center line 1002. A circular groove is formed on the circumference of the roller 433, and the side edge of the first track 440 is fitted into the groove, allowing the roller 433 to roll and engage with the first track 440, thus guiding the rotation of the adjustment platform 422 relative to the seat 421.

[0061] See Figure 9 As shown, in this embodiment, a rack 441 and a rotary adjustment motor 460 are further provided between the base 421 and the adjustment platform 422, so that the angle of rotation of the adjustment platform 422 around the first rotation center line 1001 can be automatically and precisely controlled, so that the micro-sized LED chip 3 can be transferred to the second substrate 2 in the correct direction and angle.

[0062] See Figures 13 to 15 As shown in this embodiment, the second movable seat 510 is provided with an installation mechanism for fixing and installing the second substrate 2. The installation mechanism specifically includes a vacuum adsorption port 511. Multiple vacuum adsorption ports 511 are spaced apart on the second movable seat 510. The multiple vacuum adsorption ports 511 are all connected to a vacuum pumping device (not shown in the figure) through a vacuum pipe, so that the second substrate 2 can be flatly and firmly adsorbed on the upper surface of the second movable seat 510.

[0063] In this embodiment, the second supporting mechanism 500 further includes a second track 520 and a lifting assembly 530. The second track 520 extends along a second direction Y, and the second movable seat 510 is movably mounted on the second track 520 along the second direction Y. A lifting space 501 exists between the lower part of the second movable seat 510 and the base 200, and the lifting assembly 530 is disposed within the lifting space 501. Specifically, in this embodiment, the second track 520 has two tracks spaced apart along a first direction X. The two sides of the second movable seat 510 respectively cooperate with the two second tracks 520, and the lifting assembly 530 is disposed between the two second tracks 520.

[0064] See Figures 14 to 15 As shown, in this embodiment, the lifting assembly 530 includes a drive seat 531 and a lifting seat 532. The drive seat 531 is located below the lifting seat 532 and is movably mounted on the base 200 along the second direction Y. The lifting seat 532 is movably mounted on the base 200 along the vertical direction Z. The lifting seat 532 is supported below the second movable seat 510 and can raise or lower the second movable seat 510. In this embodiment, the drive seat 531 has a driving inclined surface 531a, and the lifting seat 532 has a mating inclined surface 532a. The driving inclined surface 531a and the mating inclined surface 532a abut against each other, and the driving inclined surface 531a and the mating inclined surface 532a gradually extend downwards along the second direction Y. The lifting assembly 530 also includes a drive mechanism for driving the drive seat 531 to move relative to the second direction Y. In this embodiment, the driving mechanism specifically includes a driving rail 533 and a driving motor 534. The driving rail 533 extends along the second direction Y, and the driving seat 531 is movably mounted on the driving rail 533. Thus, by controlling the operation of the driving motor 534, the driving seat 531 can be controlled to move horizontally along the second direction Y, thereby realizing the vertical movement of the lifting seat 532 along the vertical direction Z. The overall height of the lifting assembly 530 is significantly reduced, and it occupies less space.

[0065] See Figure 16As shown, in this embodiment, similar to the first support 410, the third support 610 is generally a long arm extending along the second direction Y. The two ends of the third support 610 are respectively mounted on the third rails 210 on both sides of the base 200. The third support 610 is fixedly provided with a third support rail 611 extending along the second direction Y, and the third movable seat 620 is slidably mounted on the third support rail 611 along the second direction Y. The LED transfer mechanism 600 also includes a positioning camera 640, a laser rangefinder 650 and a voice coil motor 660 disposed on the third movable seat 620. The positioning camera 640 and the laser rangefinder 650 are used to guide the transfer punch 630 to accurately align with the micro-sized LED chip 3 on the first substrate 1, and the voice coil motor 660 is used to drive the transfer punch 630 to reciprocate at high speed along the vertical direction Z, thereby improving the transfer efficiency of the micro-sized LED chip 3.

[0066] See Figure 2 As shown, in this embodiment, the first support 410 and the third support 610 are spaced apart along the first direction X, while the first movable seat 420 and the third movable seat 620 are arranged opposite each other along the first direction X. Therefore, when the transfer device performs LED transfer operations, the first movable seat 420, the third movable seat 620, and the second movable seat 510 can approach each other and work together. In the idle state, along the first direction X, the first bearing mechanism 400 and the LED transfer mechanism 600 are located on one side of the second bearing mechanism 500, and the feeding mechanism 300 is located on the other side of the second bearing mechanism 500. This minimizes interference when the transfer device is started, making operation more flexible.

[0067] This embodiment also provides a method for transferring miniature LEDs based on the above-described transfer device, the method comprising the following steps:

[0068] Step S1: The positioning camera 640 collects one or more reference point information on the second substrate 2 and sends the reference point information to the control unit. The control unit determines the real position of the second substrate 2 based on the reference point information and determines the real coordinate position of the position on the second substrate 2 where the micro-LED chip 3 to be transferred is to be determined.

[0069] Step S2: Positioning camera 640 acquires image information of the micro-sized LED chip 3 on the first substrate 1;

[0070] Step S3: Based on the real coordinate position in step S1 and the image information in step S2, control the first substrate 1 to move above the second substrate 2, so that the micro-LED chip 3 is located directly above the real coordinate position, and control the transfer punch 630 to move to the real coordinate position and directly above the micro-LED chip 3.

[0071] Step S4: The transfer punch 630 transfers the micro-LED chip 3 from the first substrate 1 to the second substrate 2.

[0072] Thus, in the transfer method of this embodiment, it is not necessary to strictly control the coordinate position of the second substrate 2 on the base 200 from the beginning. Only after the second substrate 2 is roughly transferred into place, image acquisition is performed by the positioning camera 640. The control unit can then determine the true position of the second substrate 2 on the base 200 and further determine the true coordinate position of the micro-LED chip 3 to be transferred on the second substrate 2. Furthermore, in this embodiment, the same positioning camera 640 is used to acquire image information of the micro-LED chip 3 on the first substrate 1. The control unit compares the position information contained in this image with the aforementioned true coordinate position in the second substrate 2 to plan the movement path of the first substrate 1, achieving precise alignment between the first substrate 1 and the second substrate 2. The entire alignment method is more flexible and more operable.

[0073] Specifically, before step S1, the second movable seat 510 first moves along the second track 520 to one side of the base 200, and the second substrate 2 to be processed is fixed to the second movable seat 510. At the same time, the loading assembly 320 removes a carrier frame 100 from the storage compartment 310 and transfers and fixes it to the bottom of the adjustment table 422.

[0074] Next, the second movable seat 510 moves along the second direction Y to the center of the base 200, and the lifting assembly 530 lifts the second movable seat 510. At this time, the second movable seat 510 disengages from the second track 520. Depending on the thickness of the second substrate 2, the second movable seat 510 can have different lifting heights. After the second movable seat 510 is lifted to the preset height, it remains stationary, waiting for the LED transfer process.

[0075] In step S1, the third support 610 moves along the first direction X and the third movable seat 620 moves along the second direction Y, so that the positioning camera 640 can move above the second substrate 2, thereby enabling the positioning camera 640 to acquire images of the upper surface of the second substrate 2.

[0076] In step S2, at least one of the LED transfer mechanism 600 and the first support mechanism 400 moves, so that the positioning camera 640 can move above the adjustment table 422 to acquire images of the first substrate 1 to be transferred.

[0077] In step S3, the first movable seat 420, on which the support frame 100 is mounted, moves in the first direction X and / or the second direction Y to directly above the second movable seat 510. At this time, the transfer punch 630 is also moved by the third support seat 610 and the third movable seat 620 to above the adjustment table 422, and the transfer punch 630, the first substrate 1, and the second substrate 2 are precisely aligned from top to bottom.

[0078] In step S4, once the first substrate 1, the second substrate 2, and the transfer punch 630 are all in place, the LED transfer mechanism 600 can drive the LED transfer process. During the transfer process, the first substrate 1 and the second substrate 2 remain fixed, and the transfer punch 630 moves continuously in the first direction X and the second direction Y, while reciprocating at high speed in the up-down direction Z, thereby transferring the micro-sized LED chips 3 on the lower surface of the first substrate 1 one by one to the upper surface of the second substrate 2.

[0079] After all the micro-LED chips 3 have been transferred, the feeding assembly 320 removes the carrier frame 100, and at the same time the second movable seat 510 moves along the second track 520 to the other side of the base 200, so that the second substrate 2 that has been transferred can continue to be transported to the downstream process.

[0080] In summary, the micro-miniature LED transfer device provided in this embodiment, with its various mechanisms working in coordination, can efficiently and effectively transfer a large number of micro-miniature LED chips 3.

[0081] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A carrier frame for transferring micro-miniature LEDs, the carrier frame being used to mount a first substrate to which micro-miniature LED chips are adhered, characterized in that: The support frame has a mounting opening that extends through the support frame along its thickness direction. Along the thickness direction of the support frame, one side has a support structure, and the other side has a mounting clip. Multiple mounting clips are spaced circumferentially along the mounting opening, and each mounting clip is rotatably connected to the support frame. The support frame also has an elastic element for providing the force required for the mounting clips to rotate toward the mounting opening. The support frame has a mounting surface located on one side of the support frame in the thickness direction. The mounting surface is provided with magnetic elements, and there are multiple magnetic elements, which are spaced apart circumferentially along the mounting opening.

2. The carrier frame for micro-LED transfer according to claim 1, wherein: The support frame is generally in the shape of a flat rectangular plate. The thickness of the support frame extends vertically during operation. The mounting clips are four in number, located at the four corners of the support frame. The four mounting clips are equidistant. The rotation center line of each mounting clip extends horizontally. Each elastic element is a torsion spring wound around the rotation axis of the corresponding mounting clip.

3. The carrier frame for micro-LED transfer according to claim 1, wherein: The mounting opening is circular, and the supporting structure is an annulus with an inner diameter smaller than that of the mounting opening.

4. The carrier frame for micro-LED transfer according to claim 1, wherein: The mounting surface is provided with a first positioning structure, which has a plurality of positions spaced apart on the mounting surface, each of which is a pin or a slot.

5. The carrier frame for micro-LED transfer according to claim 4, wherein: The support frame is placed horizontally during operation, and the mounting surface is located on the upper side of the support frame. The first positioning structure includes two structures respectively located on both sides of the mounting opening.

6. The carrier frame for transferring miniature LEDs according to claim 1, characterized in that: The support frame has a clamping sidewall, and a plurality of clamping openings are provided on the clamping sidewall at intervals. Each clamping opening has a limiting protrusion at its opening.

7. The carrier frame for micro-LED transfer according to claim 6, wherein: The clamping sidewall is located on one side of the length direction of the bearing frame.

8. The carrier frame for micro-LED transfer according to claim 7, wherein: The clamping sidewall has two clamping openings symmetrically arranged along the width direction of the bearing frame. The inner cavity of each clamping opening is rectangular. Each clamping opening has two limiting protrusions on both sides at its opening. The two limiting protrusions reduce the opening width of the clamping opening, making the opening width smaller than the inner cavity width.

9. The carrier frame for micro-LED transfer according to any one of claims 1 to 8, wherein: The support frame also has a clamping sidewall, which is perpendicular to the mounting surface. The mounting surface is provided with a magnetic component and a first positioning structure. The clamping sidewall has a clamping opening for clamping.

Images