一种拓扑结构优化后的大规模波束形成矩阵
By using LTCC 3D stacking technology and topology optimization, the problem of excessive size and weight of large-scale beamforming matrices was solved, achieving high-density integrated design and miniaturization.
CN115621736BActive Publication Date: 2026-07-17SUZHOU BOHAI CHUANGYE MICRO SYST
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU BOHAI CHUANGYE MICRO SYST
- Filing Date
- 2022-09-29
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The size and weight of large-scale beamforming matrices are difficult to miniaturize, mainly due to the excessive number of cables and RF connectors between circuit boards.
Method used
By employing LTCC three-dimensional stacking technology and topology optimization, the beam power distribution board and feed power combining board are stacked in three dimensions, and the topology of the beamforming matrix is optimized to reduce the number of cables and substrates.
Benefits of technology
The size and weight of the beamforming matrix have been reduced to about 25% of that of conventional solutions. This fully utilizes the advantages of LTCC three-dimensional stacked microwave circuit design, reducing the number of substrate layers, area, and number of connecting cables.
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Figure CN115621736B_ABST
Abstract
本发明提供一种拓扑结构优化后的大规模波束形成矩阵，充分利用了LTCC三维叠层微波电路设计的优势，波束功率分配电路在LTCC基板的正面按行设计，馈源功率合成电路在LTCC基板的背面按列进行设计，使得波束端功率分配电路和馈源端功率合成电路通过正反两面正交结构实现了高密度集成设计，可实现最短且长度一致的微波信号连接，并且不会出现传输线交叉现象，减少了基板层数、面积和连接电缆的数量。
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