A charging and discharging power supply and formation and capacity equipment

Abstract

The application relates to the technical field of power supplies, and particularly provides a charging and discharging power supply and a formation and capacity grading device. The charging and discharging power supply comprises a box body, a circuit board and a cooling device in the box body, the circuit board comprises or is a first circuit board, and the cooling device comprises: an exhaust cooler comprising an exhaust device and a cooling box at an air inlet or an air outlet of the exhaust device; and a liquid cooling device arranged along a first direction of the first circuit board and located at least one side of a first target area of a first element on the first circuit board. The charging and discharging power supply has good heat dissipation performance, the cooling device in the box body combines the two heat dissipation modes of liquid cooling and air cooling, can effectively dissipate heat of the circuit board with large power, and greatly avoids local high temperature and damage of the power supply due to overheating.

Description

Technical Field

[0001] This application relates to the field of power supply technology, specifically to a charging and discharging power supply and a capacity-forming device. Background Technology

[0002] The heat dissipation performance of charging and discharging power supplies is particularly important. For example, formation and capacity testing equipment is used to perform formation (the process of stabilizing the performance of the battery during its first charge) and / or capacity testing (the process of charging and discharging the battery, detecting and determining its capacity, and screening or grading it according to its capacity). The charging and discharging power supply on this equipment needs to be adjusted with different parameters for different batches and specifications of the batteries being charged and discharged. Therefore, the circuit board of this power supply is large, contains many components, and generates a lot of heat. If the heat dissipation effect is poor, it will lead to overheating and damage to the power supply. Summary of the Invention

[0003] In view of this, the present application aims to provide a charging and discharging power supply equipped with a cooling device, which effectively dissipates heat from the circuit board inside the power supply box through a combination of air cooling and liquid cooling, thereby improving heat dissipation performance and effectively preventing the power supply from being damaged due to overheating. This power supply can be applied to the formation and capacity testing process to solve the problem that the heat dissipation effect of the power supply on the formation and capacity testing equipment in the prior art needs to be improved.

[0004] This application provides a charging and discharging power supply, including a housing, a circuit board and a cooling device located inside the housing, the circuit board including or being a first circuit board, and the cooling device including: an exhaust cooler, including an exhaust device and a cooling box located at the air inlet or air outlet of the exhaust device; and a liquid cooling radiator, arranged with the exhaust cooler along a first direction of the first circuit board, located on at least one side of a first target area where a first element is located on the first circuit board.

[0005] In one possible implementation, in the first direction, the liquid cooling radiator is located at the first end of the first circuit board, the exhaust cooler is located at the second end of the first circuit board, and the exhaust outlet of the exhaust device faces the first end of the first circuit board.

[0006] In one possible implementation, the liquid cooling radiator extends along the first direction, with a first side facing the first target area and a second side opposite to the first side in contact with at least one second element on the first circuit board; and / or, at least two liquid cooling radiators are provided, arranged on both sides of the first target area.

[0007] In one possible implementation, the cooling box is located on the air inlet side of the exhaust device and is opposite to the air inlet; and / or, the liquid cooling radiator and / or the cooling box are provided with a plurality of interconnected liquid flow channels.

[0008] In one possible implementation, the system further includes an air guide assembly connected to the first circuit board. The air guide assembly is located on the air outlet side of the exhaust device, guides the airflow generated by the exhaust device to flow on the front side of the first circuit board, and directs the airflow to the area where the target component is located on the first circuit board.

[0009] In one possible implementation, the air guiding assembly includes any one or any combination of a first air guiding plate, a second air guiding plate, and a third air guiding plate. The first air guiding plate extends along the first direction and at least two are provided and arranged at both ends of the first circuit board in a second direction. The second air guiding plate is mounted above the front surface of the first circuit board and is inclined opposite to the air outlet of the exhaust device to guide airflow to the area where the target component is located. The third air guiding plate is erected on the first circuit board and is inclined opposite to the air outlet of the exhaust device to guide airflow to the area where the target component is located.

[0010] In one possible implementation, the air guiding assembly includes a fourth air guiding plate and two first air guiding plates, the fourth air guiding plate, the two first air guiding plates and the exhaust cooler forming an annular flow-guiding baffle ring, the flow-guiding baffle ring at least surrounding the area where the target component is located.

[0011] In one possible implementation, the area where the target component is located includes a second target area and a first target area spaced apart along the first direction, and a third component is provided in the second target area; wherein, at least two second air guide plates are provided, one of which is located upstream of the first target area and directs airflow to the first target area, and the other is located upstream of the second target area and directs airflow to the area where the second target area is located; and / or, a portion of the surface of the third air guide plate extends to the leeward side of the third component to direct airflow to the leeward side of the third component; and / or, at least two third air guide plates are provided and arranged along the second direction of the first circuit board, and an air outlet is formed between the opposing third air guide plates, the first target area is located downstream of the air outlet and opposite to the air outlet.

[0012] In one possible implementation, the circuit board includes at least two first circuit boards, each of which is provided with the liquid cooling radiator, the exhaust cooler, and the air guide assembly; and / or, the liquid supply pipeline of the cooling device includes an inlet manifold and an outlet manifold, wherein the inlets of the liquid cooling radiator and the cooling tank are both connected to the inlet manifold and the outlets are connected to the outlet manifold.

[0013] In one possible implementation, at least one panel is detachably covered on the box cavity and is detachably connected to the remaining panels via a plug-in structure. The plug-in structure has an elastic sealing element in the plug-in groove to make the box a sealed box.

[0014] A formulation and capacity device includes a needle bed and a charging / discharging power supply as described in any of the preceding claims.

[0015] In one possible implementation, a cabinet is provided to house the charging / discharging power supply and the needle bed, the charging / discharging power supply being connected to the frame of the needle bed and electrically connected to a bypass board located inside the needle bed.

[0016] According to the charging and discharging power supply provided in this application, a cooling device is provided inside the housing to dissipate heat from the target circuit board, i.e., the first circuit board. The cooling device includes a liquid cooling radiator and an exhaust cooler arranged along a first direction of the first circuit board. The exhaust device of the exhaust cooler generates airflow, and the cooling box is located at the air inlet or outlet of the exhaust device, which can cool the air near the exhaust device and the airflow generated by the exhaust device. Thus, the airflow blown from the exhaust device to other areas, especially the first circuit board, is a low-temperature airflow, which can efficiently absorb the heat generated by the first circuit board. The liquid cooling radiator is located at least on one side of the area where the first component is located on the first circuit board, which can effectively absorb the heat of the first target area and strongly and efficiently cool the first target area where the components on the first circuit board are small or have a large heat dissipation and are concentrated. At the same time, the outer wall of the liquid cooling radiator is also in contact with the second component on the first circuit board, effectively cooling the second component. Thus, the liquid cooling radiator can effectively and significantly cool the components on the first circuit board that are not easy to dissipate heat.

[0017] As can be seen, the charging and discharging power supply provided in this application combines liquid cooling and air cooling. On the one hand, it can generate low-temperature airflow to efficiently dissipate heat from the target circuit board that needs cooling, and due to the fluidity of the airflow, it can effectively dissipate heat from a large area inside the power supply box. On the other hand, the liquid cooling radiator can effectively and intensively dissipate heat from areas where target components with high heat generation or difficult heat dissipation are located, effectively preventing local high temperatures. Moreover, the cooling device combining liquid cooling and air cooling can also effectively dissipate heat from the circuit board in high-temperature environments, and the influence of ambient temperature on the heat dissipation effect is significantly reduced. Thus, the charging and discharging power supply has good heat dissipation performance, can effectively dissipate heat from circuit boards with high power and high heat generation, avoid damage to the power supply due to overheating, extend the effective service life of such power supplies, and ensure the normal operation of devices using such power supplies. Attached Figure Description

[0018] Figure 1The diagram shown is a structural schematic of the first circuit board and the cooling device at a first angle in some embodiments of this application;

[0019] Figure 2 The diagram shown is a structural schematic of the first circuit board and the cooling device from a second angle in some embodiments of this application;

[0020] Figure 3 The diagram shown is a schematic representation of the liquid cooling radiator and the first circuit board in an embodiment of this application.

[0021] Figure 4 The diagram shown is a schematic diagram of the liquid cooling radiator in an embodiment of this application;

[0022] Figure 5 The diagram shown is a structural schematic of the exhaust cooler in an embodiment of this application;

[0023] Figure 6 The diagram shown is a schematic of a first circuit board and a cooling device in some other embodiments of this application;

[0024] Figure 7 The diagram shown is a schematic representation of the first angle inside the housing in an embodiment of this application;

[0025] Figure 8 The diagram shown is a schematic representation of the second angle inside the housing in an embodiment of this application;

[0026] Figure 9 The diagram shown is a schematic representation of the third angle inside the box in an embodiment of this application;

[0027] Figure 10 The diagram shown is a schematic diagram of the box in an embodiment of this application;

[0028] Figure 11 The image shown is a cross-sectional view of the box body from a first angle in an embodiment of this application;

[0029] Figure 12 The image shown is a cross-sectional view of the box body from a second angle in an embodiment of this application;

[0030] Figure 13 The diagram shown is a structural schematic of the chemical composition and capacity device from a first angle in an embodiment of this application.

[0031] Figure 14 The diagram shown is a structural schematic of the chemical composition and capacity device from a second angle in an embodiment of this application.

[0032] Figure 1-14 middle:

[0033] 1. Housing; 2. First circuit board; 3. Second circuit board; 4. Exhaust cooler; 5. Liquid radiator; 6. Air guide assembly; 7. First component; 8. Second component; 9. Third component; 10. Liquid inlet connector; 11. Liquid outlet connector; 12. Connecting terminal; 13. Liquid inlet main pipe; 14. Liquid outlet main pipe; 15. Second connecting pipe; 16. Base plate; 17. Top plate; 18. Side plate; 19. Corner profile; 20. Elastic seal; 21. Supporting protrusion; 22. Probe module; 23. Charging and discharging power supply; 24. Bypass plate; 25. Needle bed; 26. Cabinet; 41. Exhaust device; 42. Cooling box; 51. First liquid flow channel; 61. First air guide plate; 62. Second air guide plate; 63. Third air guide plate; 64. Fourth air guide plate. Detailed Implementation

[0034] The embodiments of this application aim to provide a charging and discharging power supply with excellent heat dissipation performance. Its internal cooling device combines liquid cooling and air cooling methods, effectively dissipating heat from high-power circuit boards, greatly preventing localized high temperatures and power supply damage due to overheating. Applying this power supply to a formation and capacity testing device can, to some extent, solve the problem of overheating and damage to power supplies used in existing formation and capacity testing technologies. The embodiments of this application also aim to provide a formation and capacity testing device including this charging and discharging power supply, enabling effective heat dissipation of the power supply within the device and extending its service life.

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] Please refer to the attached document. Figure 1-14This application provides a charging and discharging power supply, including a housing 1 and a circuit board and cooling device located inside the housing 1. The circuit board includes or may be a first circuit board 2, which has multiple components. The cooling device includes a liquid cooling radiator 5 and an exhaust cooler 4. The liquid cooling radiator 5 has a housing for containing a cooling medium, such as coolant, and the housing is provided with a medium inlet and a medium outlet for replacing the cooling medium. The exhaust cooler 4 includes an exhaust device 41 and a cooling box 42. The exhaust device 41 is a device capable of generating airflow, such as a fan or blower. The cooling box 42 is used to hold the cooling medium, and its housing also has a medium inlet and a medium outlet. The liquid cooling radiator 5 and the cooling box 42 act as cooling sources within the housing 1, continuously and efficiently absorbing heat from within the housing 1. The exhaust outlet of the exhaust device 41 can be directed towards the first circuit board 2, so that the generated airflow is focused on the first circuit board 2, emphasizing heat dissipation for the first circuit board 2, and due to the flow of the airflow, large-area heat dissipation is achieved within the housing 1.

[0037] The cooling box 42 is located at the air inlet or outlet of the exhaust device 41, which can efficiently cool the air near the exhaust device 41 and the airflow generated by the exhaust device 41. In addition, the liquid cooling radiator 5 can also cool the air inside the box 1. Thus, the airflow flowing inside the box 1 is a low-temperature airflow. The low-temperature airflow flows through the first circuit board 2, which can effectively cool the many components on the first circuit board 2. Flowing through other areas inside the box 1, it can effectively dissipate heat over a large area. The liquid cooling radiator 5 and the exhaust cooler 4 are arranged along the first direction of the first circuit board 2. The first direction is the length direction or the width direction. The exhaust cooler 4 and the liquid cooling radiator 5 focus on different circuit board sections. The circuit board section near the exhaust cooler 4 will come into contact with the strong, lower-temperature airflow, which can dissipate heat more effectively. After absorbing some heat, the low-temperature airflow continues to flow to the area where the liquid cooling radiator 5 is located. It will be affected by the cooling effect of the liquid cooling radiator 5, and its temperature will be lowered. It will continue to effectively absorb heat from the first target area over a large area, so that the entire circuit board can dissipate heat effectively.

[0038] The liquid cooling radiator 5 is disposed on the first circuit board 2, located on at least one side of the first target area where the first component 7 is located, close to multiple first components 7 within the target area, effectively absorbing the heat dissipated by the first components 7 and the entire first target area. The first component 7 can be a component on the circuit board that generates a large amount of heat or is small in size and difficult to dissipate heat. The area on the first circuit board 2 where the first components 7 are concentrated can be used as the target area, or the first components 7 and other heat-generating components can be concentrated in one area and the concentrated area can be used as the first target area. Of course, the side of the liquid cooling radiator 5 close to the first target area, such as the first side, can also contact the first component 7 adjacent to the liquid cooling radiator 5 within the first target area, effectively and efficiently dissipating heat from the first target area with high heat generation. This arrangement of the liquid cooling radiator 5 can provide targeted and powerful heat dissipation for components with high heat generation and difficult heat dissipation, effectively avoiding localized high temperatures.

[0039] As can be seen, the charging and discharging power supply provided in this application combines liquid cooling and air cooling. On the one hand, it can generate low-temperature airflow to efficiently dissipate heat from the target circuit board that needs cooling, and due to the fluidity of the airflow, it can effectively dissipate heat from a large area within the power supply housing 1. On the other hand, the liquid cooling radiator 5 can effectively and intensively dissipate heat from areas containing target components that generate a lot of heat or are difficult to dissipate, effectively preventing localized high temperatures. Moreover, the combined liquid and air cooling device can effectively dissipate heat from the circuit board even in high-temperature environments, significantly reducing the impact of ambient temperature on the heat dissipation effect. With this configuration, the charging and discharging power supply has excellent heat dissipation performance, effectively dissipating heat from circuit boards with high power and high heat generation, preventing the power supply from being damaged due to overheating, extending the effective service life of such power supplies, and ensuring the normal operation of equipment using such power supplies. This power supply can be applied to formation and capacity testing equipment to power the formation and capacity testing processes of batteries, and can solve to a certain extent the problem of overheating and damage of power supplies used in formation and capacity testing in the prior art.

[0040] On the other hand, it can also be said that the charging and discharging power supply provided in this embodiment, because the above-mentioned cooling device is provided in its housing 1, its housing 1 can be a closed or sealed housing. Unlike the power supply that uses a fan for heat dissipation in the prior art, it does not need to open a ventilation port on the housing 1, thereby improving the heat dissipation performance of the power supply. It can still effectively dissipate heat in high temperature environment and prevent overheating damage. At the same time, it can also make the housing 1 closed or even sealed, better preventing the internal components from getting damp and affecting the working quality.

[0041] In some embodiments, the first circuit board 2 is a power board, and a second circuit board 3 is also provided inside the housing 1. The second circuit board 3 is a control board. This arrangement distributes the circuit components on two circuit boards, reducing the thermal impact of the power board, which generates more heat, on the control board. Furthermore, targeted cooling of the power board using a cooling device not only improves heat dissipation efficiency but also more comprehensively prevents overheating and damage to the various circuit components.

[0042] In some embodiments, the liquid cooling radiator 5 and the exhaust cooler 4 are arranged along a first direction of the first circuit board 2. In this first direction, the liquid cooling radiator 5 is located at the first end of the first circuit board 2, and the exhaust cooler 4 is located at the second end of the first circuit board 2. The exhaust outlet of the exhaust device 41 faces the first end of the first circuit board 2. The low-temperature airflow primarily provides strong cooling to the second end of the first circuit board 2, while the liquid cooling radiator 5 provides focused cooling to the area at the first end. After passing the second end, the low-temperature airflow flows back to the first end, and combined with the cold air near the liquid cooling radiator 5, it can continue to effectively cool the components in the first end area. The entire first circuit board 2 can achieve efficient and significant cooling. The first direction is preferably the length direction of the first circuit board 2.

[0043] In some embodiments, both the liquid cooling radiator 5 and the first target region extend along a first direction of the first circuit board 2, such as along the length or width direction of the first circuit board 2, so that the first target region can be close to the larger cooling surface on the liquid cooling radiator 5. For example, as Figure 1 and Figure 3 As shown, the liquid cooling radiator 5 is plate-shaped, with its thickness direction consistent with the width direction of the first circuit board 2 and its length direction consistent with the length direction of the first circuit board 2. The plate surface on the first side faces the first target area and is close to or in contact with the components in the first target area adjacent to the first side plate 18.

[0044] Simultaneously, the outer wall of the liquid cooling radiator 5 also contacts the second component 8 on the first circuit board 2. For example, the second component 8 is connected to the second side of the liquid cooling radiator 5 opposite to the first side, i.e., the side facing away from the first target area. In this way, the liquid cooling radiator 5 can not only effectively dissipate heat in the first target area where multiple heat-generating components are concentrated and at least the first component 7 is present, but it can also effectively dissipate heat from the small but high-heat-generating or difficult-to-dissipate second component 8 on the first circuit board 2. This fully utilizes the effective heat absorption area of ​​the liquid cooling radiator 5, allowing it to approach or contact as many heat-generating components as possible, maximizing heat absorption, and significantly improving the heat dissipation efficiency of the liquid cooling radiator 5 for components that are difficult to dissipate heat.

[0045] In some embodiments, the first element 7 is a capacitor, such as... Figure 3As shown, multiple capacitors are centrally located in the first target area. These capacitors are small in size, cylindrical in shape, generate a lot of heat, and are not easy to dissipate. They are cooled by a liquid cooling radiator 5, which is more effective than using a fan for heat dissipation.

[0046] In addition to the first element 7, other components such as relays may be provided in the first target area. The relays may be located on one side of the capacitor and close to or in contact with the first side of the liquid cooling radiator 5.

[0047] The second element 8 can be bonded to the liquid cooler radiator 5 with thermally conductive adhesive to increase thermal conductivity. The second element 8 can also be connected to the liquid cooler radiator 5 with fasteners or welded to the liquid cooler radiator 5.

[0048] In some embodiments, a heat-conducting plate is further disposed between the second element 8 and the liquid cooling radiator 5, and the second heating element is connected to the heat-conducting plate, which is connected to the outer wall of the liquid cooling radiator 5, for example, the second side of the liquid cooling radiator 5 as described above. In some embodiments, the second element 8 is a MOSFET, which is in the shape of a thin plate and is attached to the outer wall of the liquid cooling radiator 5, with a large contact area with the liquid cooling radiator 5, which can maximize heat dissipation.

[0049] In some embodiments, at least two liquid cooling radiators 5 are provided, arranged on both sides of the first target area. This effectively sandwiches the heat-generating components within the first target area between the two liquid cooling radiators 5, thereby enabling more efficient heat dissipation. The liquid cooling radiators 5 extend along a first direction of the first circuit board 2, and the two liquid cooling radiators 5 are arranged along a second direction of the first circuit board 2. For example, the two liquid cooling radiators are distributed on both sides of the width direction of the first circuit board 2. Thus, the first target area is located between the two liquid cooling radiators 5, providing a larger area for component placement. Furthermore, the length direction of the liquid cooling radiators 5 is consistent with the length direction of the first circuit board 2, facilitating the setting of the length of the liquid cooling radiators 5. This allows the length of the liquid cooling radiators 5 to be determined based on the length of the first target area, and also allows the length of the liquid cooling radiators 5 to be greater than the length of the first target area.

[0050] In some embodiments, such as Figure 4 As shown, the liquid cooling radiator 5 has multiple interconnected liquid channels, referred to as first liquid channels 51. At least some of the first liquid channels 51 extend in the same direction as the arrangement of the first component 7. For example, some of the first liquid channels 51 extend along the height direction of the liquid cooling radiator 5, and some extend along the length direction of the liquid cooling radiator 5. In this way, the arrangement of multiple first liquid channels 51 in the liquid cooling radiator 5 can prolong the time for the coolant to flow through. Compared to the liquid cooling radiator 5 having a large cavity, the coolant newly entering the liquid cooling radiator 5 will not mix rapidly with the coolant already in the liquid cooling radiator 5, which is more conducive to quickly absorbing heat and quickly cooling down the first circuit board 2.

[0051] The first circuit board 2 also has a third component 9, such as an inductor. The inductor is relatively large. In some embodiments, one end of the liquid cooling radiator 5 along its length is close to or in contact with the third component. In other words, the third component is located at one end of the liquid cooling radiator 5 along its length.

[0052] The cooling box 42 is located at the air inlet or outlet of the exhaust device 41. Specifically, in some embodiments, the cooling box 42 is located on one side of the axial direction of the fan blades of the exhaust device 41, such as the leeward side or the air inlet side, and is positioned opposite to the air inlet or outlet of the exhaust device 41. In other words, the axial projection of the exhaust device 41 (referring to the axial direction of the fan blades) and the projection of the cooling box 42 in that direction at least partially coincide. In a preferred embodiment, the cooling box 42 is located on the air inlet side of the exhaust device 41 and is positioned opposite to the air inlet, such as... Figure 5 As shown.

[0053] The cooling box 42 can also be connected to the exhaust device 41. This reduces the distance between the two, facilitating heat transfer. Furthermore, the connection between the cooling box 42 and the exhaust device 41 forms an exhaust cooler module 4. The exhaust cooler 4 can be arranged as a whole, or its position can be changed, disassembled, and repaired, making it easy to operate. For example, the exhaust device 41 is a fan, including fan blades and a housing for fixing the fan blades. The housing is connected to the box body 1 of the cooling box 42; in other words, the housing is connected to the box wall of the cooling box 42.

[0054] The exhaust device 41 and the cooling box 42 can be detachably connected by fasteners.

[0055] In some embodiments, at least two exhaust devices 41 are connected to one side wall of the cooling box 42. This arrangement can increase the generated airflow and enhance the heat dissipation effect.

[0056] In some embodiments, multiple interconnected liquid channels are also arranged inside the cooling tank 42, which can be referred to as second liquid channels. For example, multiple second liquid channels extend along the length direction of the cooling tank 42 and are arranged along the width direction, with their ends connected in sequence or one end connected in sequence.

[0057] The body 1 of the cooling box 42 is made of metal. For example, at least one side of the box wall connected to or close to the exhaust device 41 is made of metal, or the entire body 1 can be made of metal, which is more conducive to heat conduction and exchange and enhances the cooling efficiency of the cooling box 42 to the surrounding air.

[0058] To enhance the flow rate and duration of the cryogenic airflow on the first circuit board 2, some embodiments, such as Figure 1 , Figure 2 , Figure 6 and Figure 7As shown, the housing 1 also includes an air guide assembly 6, located on the outlet side of the exhaust device 41. The air guide assembly 6 guides the airflow generated by the exhaust device 41, allowing the low-temperature airflow to flow along one side of the front surface of the first circuit board 2 where multiple components are located, and directs the low-temperature airflow to the area where the target components are located on the first circuit board 2. The air guide assembly 6 directs the low-temperature airflow to focus on the first circuit board 2 and along it, reducing airflow loss and allowing more low-temperature airflow to focus on the area where the first circuit board 2 is located, thus enhancing the heat dissipation efficiency for the components. The target components include at least components on the first circuit board 2 that generate a large amount of heat, and may also include large components with a large leeward side and therefore poor heat dissipation, as well as small components that generate a large amount of heat and are therefore poorly dissipated. By guiding the airflow to the area where the target component is located through the air guide component 6, the airflow can be gathered and more low-temperature airflow can be strongly blown toward and flow through the target component, thereby enhancing the heat dissipation of the target component that is not easy to dissipate heat. This can not only improve the heat dissipation efficiency of the entire first circuit board 2 and enhance the heat dissipation effect, but also effectively prevent local high temperature on the first circuit board 2 and avoid the circuit board from being damaged by overheating due to local high temperature.

[0059] Meanwhile, on the other hand, by setting the air guide component 6 inside the power supply housing 1, the heat dissipation effect is effectively improved, and the volume or number of exhaust devices 41 can be reduced to a certain extent. This has the beneficial effect of making the overall structure of the power supply more compact and simple, and can also reduce costs to a certain extent.

[0060] In a preferred embodiment, when the exhaust device 41 is located at one end of the first circuit board 2, the air guide assembly 6 can be connected to the first circuit board 2 to better guide more airflow.

[0061] Specifically, the target component includes multiple components, which may be of different or the same type. Depending on the distribution of the multiple components, the area where the target component is located can be a single, unified area, or it can be two, three, or more dispersed areas spaced apart. The size of the area where the target component is located can also be determined based on the distribution of the components; it can be formed by a portion of the first circuit board 2, or it can be formed by the entire area of ​​the first circuit board 2.

[0062] In some embodiments, the air guiding assembly 6 includes a first air guiding plate 61. At least two first air guiding plates 61 are provided and distributed on opposite sides of the first circuit board 2, for example, at both ends of the first circuit board 2 in a second direction. When the exhaust device 41 is located at one end of the first circuit board 2 in a first direction, the first air guiding plates 61 are positioned on both sides of the exhaust outlet of the exhaust device 41, extending along the first direction of the first circuit board 2. This arrangement allows the first air guiding plates 61 to concentrate the airflow generated by the exhaust device 41 onto the front surface of the first circuit board 2, preventing excessive diffusion of the airflow to the outside of the first circuit board 2, reducing wind loss, allowing more airflow to flow along the extension direction of the first circuit board 2, and more efficiently dissipating heat from the components on the first circuit board 2. It also directs more airflow to the area where the target component is located on the first circuit board 2. In this embodiment, the target component is located between the two first air guiding plates 61, on the exhaust outlet side of the exhaust device 41, and in the airflow path. After the airflow is concentrated by the first air guiding plates 61, it can be subjected to a stronger airflow.

[0063] In some embodiments, the air guiding assembly 6 includes a second air guiding plate 62, which is mounted above and spaced apart from the front surface of the first circuit board 2. Simultaneously, the second air guiding plate 62 is inclined opposite to the air outlet of the exhaust device 41, and its surface is also inclined relative to the front surface of the first circuit board 2. Figure 1 and Figure 2 As shown, in the air outlet direction of the exhaust device 41, the distance between the surface of the second air guide plate 62 and the front surface of the first circuit board 2 gradually decreases. Conversely, in the direction gradually approaching the first circuit board 2, the distance between the surface of the second air guide plate 62 and the exhaust device 41 gradually increases. This is equivalent to the second air guide plate 62 tilting towards the first circuit board 2. Since the surface of the second air guide plate 62 is opposite to the air outlet of the exhaust device 41, the second air guide plate 62 can guide the airflow of the exhaust device 41 downwards and concentrate it against the front surface of the first circuit board 2. This allows the airflow to converge and closely adhere to the front surface of the first circuit board 2, flowing more powerfully and closer to the area where the target component is located on the first circuit board 2, thus enhancing the heat dissipation efficiency and effect. In this embodiment, the target component can be located downstream of the second air guide plate 62, i.e., on the downwind side, or the air outlet side (the same applies below), or it can be positioned close to the second air guide plate 62. When the second air guide plate 62 presses the airflow against the first circuit board 2, it guides the airflow towards the area where the target component is located.

[0064] like Figure 1 and Figure 3As shown, in some embodiments, the target components on the first circuit board 2 include at least a first element 7 and a third element 9, such as a capacitor and an inductor. The area where the target components are located includes a first target area and a second target area. The first target area is the aforementioned first target area, where at least the first element 7, such as a capacitor, is provided. The second target area is where the third element 9, such as an inductor, is provided. Alternatively, the third element 9 can be said to be spaced apart from the first element 7, and the area where the third element 9 is located is the second target area.

[0065] The first and second target areas are spaced apart along the first direction of the first circuit board 2 of the exhaust device 41, which is also the air outlet direction. At least two second air guide plates 62 are also spaced apart along the first direction of the first circuit board 2, which is also the air outlet direction of the exhaust device 41. At least one is located upstream of the first target area, guiding the airflow to the first target area, and the other is located upstream of the second target area, guiding the airflow to the second target area. This separate arrangement of target components facilitates the layout of components on the circuit board. Furthermore, if the circuit board is an existing product, the second air guide plates 62 enhance the heat dissipation of multiple or various types of heat-generating target components, effectively ensuring good overall heat dissipation of the first circuit board 2.

[0066] The second air guide plate 62 is mounted above the front surface of the first circuit board 2. It can be supported and fixed by a bracket or support. Alternatively, when the air guide assembly 6 also includes the aforementioned first air guide plate 61, the two ends of the second air guide plate 62 are respectively connected to two opposing first air guide plates 61. The second air guide plate 62 and the first air guide plate 61 can be detachably connected by fasteners, or they can be connected by welding or bonding.

[0067] In some embodiments, the air guiding assembly 6 includes a third air guiding plate 63, which is vertically mounted on the first circuit board 2. The surface of the third air guiding plate 63 is inclined and opposite to the air outlet of the exhaust device 41. Along the second direction of the first circuit board 2, the distance between the surface of the third air guiding plate 63 and the exhaust device 41 gradually increases. In this way, the third air guiding plate 63 guides the airflow at an angle, which can direct the airflow to the leeward side of the target component. For some large components, such as inductors, the leeward side has less contact with the airflow and is not easy to dissipate heat. However, the charging and discharging power supply provided in this application, by setting the third air guiding plate 63, can direct the airflow to the leeward side of such components, enhance the heat dissipation efficiency of such components, avoid heat dissipation blind spots, and enhance the overall heat dissipation of the power supply.

[0068] For example, the third air guide plate 63 is located in the area where the third element 9 is located, and part of the plate extends to the leeward side of the third element 9 to guide the airflow to the leeward side of the third element 9, so that the airflow flows between the leeward side of the third element 9 and the third air guide plate 63, and performs large-area and efficient heat dissipation on the third element 9.

[0069] In some embodiments, at least two third air guide plates 63 are provided, arranged on both sides of the air outlet of the exhaust device 41, along the second direction of the first circuit board 2. At least two third air guide plates 63 are spaced apart and opposite each other, forming an air outlet convergence port between them. The third air guide plates 63 are positioned upstream of the first target area, which is located downstream of and opposite the air outlet convergence port. This arrangement allows the third air guide plates 63 to converge and collect the airflow, which is then blown from the air outlet convergence port between the two rows of third air guide plates 63 towards the first target area, providing strong air cooling for the first component 7 and the area. The second component 8 can be a capacitor. On a circuit board, if multiple capacitors are arranged together, they form a concentrated heat-generating area that is difficult to dissipate heat. In this application, the airflow is converged and guided to this concentrated heat-generating area by the third air guide plates 63, resulting in good heat dissipation for this area. Combined with the cooling effect of the liquid cooling radiator 5, the area on the first circuit board 2 with high heat generation and difficult heat dissipation can be efficiently cooled and dissipated.

[0070] When the air guiding assembly 6 includes the first air guiding plate 61 and the aforementioned third air guiding plate 63, the exhaust device 41 is located at one end of the first circuit board 2 in a first direction, and the first air guiding plate 61 is located at both ends of the first circuit board 2 in a second direction, extending along the first direction of the first circuit board 2 to form a barrier. The third air guiding plate 63 stands upright on the first circuit board 2, located between the two first air guiding plates 61. In some embodiments, one end of the third air guiding plate 63 is connected to the first air guiding plate 61, and the other end extends inward toward the first circuit board 2 and to the leeward side of the third element 9. In this way, the airflow can be better concentrated and guided. The third air guiding plate 63 and the first air guiding plate 61 can be detachably connected by fasteners, or they can be welded or bonded.

[0071] Depending on the distribution of the target components, the air guide assembly 6 includes any one or any combination of the first air guide plate 61, the second air guide plate 62, and the third air guide plate 63. For example, it includes the first air guide plate 61 and the second air guide plate 62, or the first air guide plate 61 and the third air guide plate 63, or the second air guide plate 62 and the third air guide plate 63, or the first air guide plate 61, the second air guide plate 62, and the third air guide plate 63. When the air guide assembly 6 includes a first air guide plate 61, a second air guide plate 62, and a third air guide plate 63, the first air guide plate 61 first gathers the airflow blown out by the exhaust device 41 from both sides, causing more airflow to flow along the extension direction of the first circuit board 2, blowing from one end of the first circuit board 2 to the other end. The second air guide plate 62 presses the airflow down from above, making the airflow closer to the components on the first circuit board 2, and also directs the gathered airflow to the area where the target components are located, enhancing the heat dissipation of the target components with high heat generation. The third air guide plate 63 directs the airflow to the leeward side of the large components, providing large-area and efficient heat dissipation for the large components that are difficult to dissipate heat.

[0072] In some embodiments, such as Figure 6 As shown, the air guiding assembly 6 includes the aforementioned first air guiding plate 61, i.e., the exhaust device 41 is located at one end of the first circuit board 2 in the first direction, and the two first air guiding plates 61 are respectively located at both ends of the first circuit board 2 in the second direction, extending along the first direction of the first circuit board 2. The air guiding assembly 6 also includes a fourth air guiding plate 64, which is located at the other end of the first direction of the first circuit board 2, forming a U-shaped or similar U-shaped baffle ring with the two fourth air guiding plates 64. This baffle ring is not a complete ring, but has an air inlet. The exhaust device 41 is located at the air inlet, which means that the exhaust device 41, the two first air guiding plates 61, and the fourth air guiding plate 64 form a complete ring-shaped air diversion baffle ring around the first circuit board 2. This air diversion baffle ring at least surrounds the area where the target component of the first circuit board 2 is located, or it can surround the entire first circuit board 2. For example, the exhaust device 41 is located at one end of the first direction of the first circuit board 2, the fourth air guiding plate 64 is located at the other end of the first direction of the first circuit board 2, and the two first air guiding plates 61 are respectively located at both ends of the second direction of the first circuit board 2.

[0073] With this configuration, constrained by the flow-guiding ring, most of the airflow generated by the exhaust device can only flow on the front surface of the first circuit board 2, without overflowing or being lost. In addition, with the cooling effect of the cooling box 42 and the liquid cooling radiator 5, the low-temperature airflow will focus on and be able to flow through all areas of the first circuit board 2, providing sufficient and efficient heat dissipation for all components and effectively preventing heat dissipation blind spots.

[0074] When the air guide assembly 6 is combined with the liquid cooling radiator 5 and the exhaust cooler 4, with the exhaust cooler 4 located at one end of the first circuit board 2 and the liquid cooling radiator 5 at the other end, the air guide assembly 6 guides the airflow on the first circuit board 2 and directs it to the second target area, and then to the area where the liquid cooling radiator 5 is located. The overall arrangement is reasonable, combining air cooling and liquid cooling, and combining low-temperature airflow with the cooling source, which can not only dissipate heat from all areas of the first circuit board 2, but also enhance the heat dissipation of the target area with high heat generation.

[0075] In some embodiments, the first circuit board 2 inside the housing 1 is provided with two, three, or more, such as Figure 7 As shown, taking two as an example, two first circuit boards 2 and one second circuit board 3 are arranged side by side inside the housing 1, for example, along the width direction of the housing 1. Each first circuit board 2 is equipped with the aforementioned liquid cooling radiator 5, exhaust cooler 4, and air guide assembly 6.

[0076] The liquid supply pipeline for supplying liquid to the cooling device is arranged inside the housing 1. Pipe joints are provided on the walls of the housing 1. The liquid supply pipeline is connected to the liquid supply system outside the housing 1 through the pipe joints on the housing 1, and provides a continuous flow of coolant to the liquid cooling radiator 5 and the cooling tank 42.

[0077] In some embodiments, the liquid supply pipeline includes an inlet manifold 13 and an outlet manifold 14. The liquid inlets of the liquid radiator 5 and the cooling tank 42 are both connected to the inlet manifold 13, and their outlets are both connected to the outlet manifold 14. Thus, only two main pipe connectors are needed on the housing 1, such as an inlet manifold 10 and an outlet manifold 11. Figure 7 As shown.

[0078] The liquid cooling radiators 5 and cooling tanks 42 on different first circuit boards 2 can be connected in series or in parallel. Similarly, the liquid cooling radiators 5 and cooling tanks 42 on the same first circuit board 2 can also be connected in series or in parallel. To simplify the piping within the housing 1, in some embodiments, each liquid cooling radiator 5 and cooling tank 42 is connected in series within the piping. For example... Figure 7 and Figure 9As shown, taking an example where the housing contains two first circuit boards, denoted as first circuit board A and first circuit board B. First circuit board A has a first cooling tank and first and second liquid cooling radiators located on either side of the first target area. First circuit board B has a second cooling tank and third and fourth liquid cooling radiators. One end of the liquid inlet manifold 13 is connected to the liquid inlet connector 10, and the other end is connected to the first cooling tank on first circuit board A. The first cooling tank is connected to the second cooling tank on second circuit board B via a first connecting pipe. The second cooling tank is connected to the third liquid cooling radiator on second circuit board B via a second connecting pipe 15. The third liquid cooling radiator is connected to the fourth liquid cooling radiator via a fourth connecting pipe. The fourth liquid cooling radiator is connected to the first liquid cooling radiator via a fifth connecting pipe. The first liquid cooling radiator is connected to the second liquid cooling radiator via a sixth connecting pipe. One end of the second liquid cooling radiator is connected to the liquid outlet manifold 14, and the other end of the liquid outlet manifold 14 is connected to the liquid outlet connector on housing 1.

[0079] The main outlet pipe 14 and the second connecting pipe 15 are both relatively long, extending from one end of the circuit board to the other. Therefore, the main outlet pipe 14 and the second connecting pipe 15 are located between the two first connecting plates and are positioned on adjacent sides of the two first circuit boards 2. When a second circuit board 3 is provided between the two first circuit boards 2, the main outlet pipe 14 and the second connecting pipe 15 are distributed on both sides of the second circuit board 3.

[0080] In some embodiments, the inlet manifold 13 and the outlet manifold 14 are detachably connected to the pipe fittings on the housing 1, and the connections between the pipe sections in the supply pipeline and the liquid cooling radiator 5 and the cooling tank 42 are also detachably connected. The liquid cooling radiator 5 and the cooling tank 42 are equipped with inlet and outlet fittings. Both ends of each pipe section of the supply pipeline are detachably connected to fittings for inlet or outlet liquid. This facilitates the arrangement of the pipe sections.

[0081] The enclosure 1 is also equipped with connection terminals 12, which are connected to various circuit boards via wiring to input or output current. In some embodiments, all connection terminals 12 and pipe connectors are located on the same side wall of the enclosure 1, such as the first side plate of the enclosure 1. In this way, the external power supply and liquid supply system can be connected to the power source from one side of the enclosure 1, which is convenient for operation.

[0082] By installing a cooling device inside the enclosure 1, not only can the high-power circuit board be effectively cooled, but the enclosure 1 can also be a sealed enclosure. Therefore, in some embodiments, the enclosure 1 is a sealed enclosure, and at least one panel is detachably fitted onto the enclosure cavity to facilitate later maintenance of the components inside the enclosure 1.

[0083] Specifically, such as Figure 10As shown, the housing 1 is composed of multiple panels, at least one of which is detachably fitted onto the cavity of housing 1. This allows for the repair or replacement of components within housing 1 by removing this panel. Furthermore, this at least one panel is connected to the other panels via a plug-in structure, rather than a complex connection structure, achieving a detachable connection between the two parts. The plug-in structure is simple and facilitates insertion and connection operations. At the detachable connection points, the plug-in groove of the plug-in structure is equipped with an elastic sealing element 20, using an elastic sealant 20 instead of sealant to seal the connection, reducing disassembly difficulty and making the at least one panel easy to disassemble. The elastic sealant 20 is located between the two detachably connected panels; when the panel is reconnected to the other panels, the seal is restored by compressing the elastic sealant 20, thus restoring a good seal to housing 1 simultaneously. The operation of restoring the sealed connection is convenient. The elastic sealant 20, when compressed, provides a good seal at the connection and can withstand multiple or repeated disassembly and reconnection operations, maintaining good sealing performance. As can be seen, the housing 1 provided in this embodiment is easy to disassemble, easy to restore the sealing connection, and can restore and maintain good sealing performance.

[0084] Specifically, in some embodiments, the housing 1 includes a frame, a bottom plate 16, and a top plate 17. A circuit board is located inside the housing 1 and fixedly mounted on the bottom plate 16, with the frame surrounding the outside of the circuit board. The top plate 17 and the bottom plate 16 are arranged opposite to each other and respectively cover the two sides of the frame to form the housing 1. The remaining panels are frames, and at least one panel includes a top plate 17 and a bottom plate 16. Both the top plate 17 and the bottom plate 16 are detachably connected to the frame; that is, the bottom plate 16 is detachably inserted into the frame, and the top plate 17 is detachably inserted into the frame. At least two elastic fasteners are provided, one of which is arranged circumferentially around the frame at the insertion point between the bottom plate 16 and the frame, and the other is arranged circumferentially around the frame at the insertion point between the top plate 17 and the frame. With this design, during disassembly, only the connecting piece between the top plate 17 and the frame can be loosened or removed to detach the top plate 17 and adjust the components inside the housing 1. Alternatively, the top plate 17, bottom plate 16, and frame can be separated for easier component replacement or repair. Furthermore, the housing 1 has a simple structure and is easy to manufacture.

[0085] Regarding the connection between the top plate 17 and the frame, and the connection between the bottom plate 16 and the frame, for example... Figure 11As shown, in some embodiments, the connecting surfaces of the base plate 16 and the top plate 17 are provided with insertion slots, and the connecting part of the frame is embedded in the insertion slots for connection. Simultaneously, the top plate 17 and the frame, as well as the base plate 16 and the frame, are connected by detachable connectors or adjustable tensioning components. Therefore, when the base plate 16 and the top plate 17 are fastened together with the frame, the connecting part of the frame is embedded in the insertion slot and will compress the elastic sealing element 20. Compared to the frame directly abutting against the plate surface, the insertion-type sealing connection structure does not significantly increase manufacturing and operational difficulty, while achieving better sealing and improving the sealing effect.

[0086] In some embodiments, the connector is a fastener, such as a screw or stud, to facilitate disassembly and connection operations, to facilitate multiple or repeated disassembly and connection operations, and to ensure that the two parts being disassembled and connected are tightly pressed against the elastic seal 20, so that the housing 1 maintains a good seal. The tensioning element can be a type of device that enables tension adjustment, such as a snap fastener or a clamp.

[0087] like Figure 10 As shown, a support protrusion 21 is provided on the outer wall of the frame. The support protrusion 21, the bottom plate 16, and the top plate 17 all have connection holes for fasteners to pass through. The support protrusion 21 can be welded to the frame, or it can be connected to the frame by fastening or bonding. This eliminates the need to drill holes in the frame body, such as the side plate 18, thus preventing damage to the frame's strength.

[0088] Multiple support protrusions 21 are provided and arranged along the circumference of the frame. The connecting parts are fasteners, which makes it very easy to connect the top plate 17 and the bottom plate 16 to the frame.

[0089] The connecting part inside the insertion slot of the frame can be a part of the frame's protrusion or the entire end of the frame.

[0090] The frame can be a single, integrally molded component, or it can be assembled from connected parts. In some embodiments, such as... Figure 12 As shown, the frame includes side panels 18 and corner profiles 19. There are four side panels 18 and four corner profiles 19. The ends of two adjacent side panels 18 are connected and sealed at the joint through the corner profiles 19, which is a sealed connection. Both side panels 18 and corner profiles 19 are common materials, and the connection between the two is simple. As a result, the cost of manufacturing the frame is low. Compared with manufacturing a one-piece frame, it can save manufacturing costs to a certain extent.

[0091] In some embodiments, the corner profile 19 is provided with a positioning groove for the connecting end of the side plate 18 to be inserted. Positioning and connecting the side plate 18 by inserting its connecting end into the positioning groove of the corner profile 19 facilitates quick positioning, securely holds the side plate 18 in place, and improves installation accuracy. A sealing element can be provided in the positioning groove to seal the connection between the side plate 18 and the corner profile 19. Alternatively, the side plate 18 can be inserted into the positioning groove and welded or bonded to the corner profile 19 for sealing.

[0092] Both the side panel 18 and the corner profile 19 can be metal products. For example, the corner profile 19 can be an aluminum profile. The side panel 18 and the corner profile 19 can be welded together, which makes the connection operation easy to complete and provides a stable and well-sealed connection.

[0093] The connecting part of the frame is a side plate 18, with both ends of the side plate 18 protruding from the corner profile 19. The insertion groove is correspondingly provided with the side plate 18. The elastic seal 20 can be laid on the bottom of the insertion groove, or it can be laid on the side wall of the insertion groove.

[0094] The insertion slot can be arranged circumferentially around the frame, and the elastic seal 20 can also be arranged circumferentially around the frame. Alternatively, the length and position of the insertion slot can match the length and position of the insertion plate.

[0095] In some embodiments, the resilient seal 20 is a rubber sealing ring. Of course, in other embodiments, the resilient seal 20 can also be a rubber material such as a sealing strip or a sealing gasket.

[0096] Embodiments of this application also provide a formulation and capacity preparation device, such as... Figure 13 and Figure 14 As shown, the device includes the charging / discharging power supply 23 described in any of the above embodiments, and also includes a needle bed 25. This formation and capacity testing device uses the charging / discharging power supply with the above structure to perform formation or capacity testing on the battery. Because the charging / discharging power supply has high heat dissipation performance, it is not prone to generating localized high temperatures, effectively avoiding overheating and damage, extending the effective service life of the power supply, and also extending the effective service life of the formation and capacity testing device. The derivation process of this beneficial effect is consistent with the derivation process of the beneficial effects of the charging / discharging power supply described above, and will not be repeated here.

[0097] The formation and capacity testing equipment includes a cabinet 26, with a charging / discharging power supply 23 and a needle bed 25 all located within the cabinet 26 for performing formation and capacity testing operations. For example, the charging / discharging power supply 23 is connected to the frame of the needle bed 25 and electrically connected to a bypass board 24 within the needle bed 25. A probe module 22 is mounted on the needle bed 25, and the bypass board 24 is electrically connected to the probe module 22. The probe module 22 is used to connect to the positive and negative terminals of the battery to charge or discharge it. Thus, compared to existing formation and capacity testing equipment with the power supply located outside the cabinet, the formation and capacity testing equipment of this embodiment has a neat structure, high integration, and a stable connection between the power supply and the bypass board within the needle bed, offering advantages in terms of ease of handling and placement.

[0098] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. The components and devices involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the accompanying drawings. As those skilled in the art will recognize, these components and devices can be connected, arranged, and configured in any manner. Words such as "comprising," "including," "having," etc., are open-ended terms meaning "including but not limited to," and are used interchangeably with them. The terms "or" and "and" as used herein refer to the terms "and / or," and are used interchangeably with them unless the context explicitly indicates otherwise. The term "such as" as used herein refers to the phrase "such as but not limited to," and is used interchangeably with it.

[0099] It should also be noted that in the apparatus and equipment of this application, the components can be disassembled and / or reassembled. These disassemblies and / or reassemblies should be considered as equivalent solutions of this application.

[0100] It should be understood that the qualifying terms "first", "second", and "third" used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0101] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A charging and discharging power supply, characterized in that, It includes a housing, and a circuit board and a cooling device located within the housing, the circuit board including or being a first circuit board, and the cooling device including: An exhaust cooler includes an exhaust device and a cooling box located at the air inlet or air outlet of the exhaust device. The liquid cooling radiator, along with the exhaust cooler, is arranged along a first direction of the first circuit board and is located on at least one side of the first target area where the first component is located on the first circuit board; It also includes an air guide assembly, which is located on the air outlet side of the exhaust device, guides the airflow generated by the exhaust device to flow on the front side of the first circuit board, and directs the airflow to the area where the target component is located on the first circuit board; The air guiding assembly includes a first air guiding plate and a third air guiding plate. The first air guide plate extends along the first direction, and at least two of them are provided and are arranged at both ends of the first circuit board in the second direction; The third air guide plate is erected on the first circuit board and is tilted opposite to the air outlet of the exhaust device to guide the airflow to the area where the target component is located. The area where the target component is located includes a second target area and a first target area that are spaced apart along the first direction, and a third component is provided in the second target area; A portion of the surface of the third air guide plate extends to the leeward side of the third element to guide airflow to the leeward side of the third element, and / or, at least two third air guide plates are provided and arranged along the second direction of the first circuit board, and an air outlet is formed between the opposing third air guide plates, with the first target area located downstream of the air outlet and opposite to the air outlet.

2. The charging and discharging power supply as described in claim 1, characterized in that, The air guiding assembly also includes a second air guiding plate; the second air guiding plate is mounted above the front surface of the first circuit board and is inclined opposite to the air outlet of the exhaust device to guide the airflow to the area where the target component is located.

3. The charging and discharging power supply as described in claim 2, characterized in that, The second air guide is provided in at least two parts, one of which is located upstream of the first target area and directs the airflow to the first target area, and the other is located upstream of the second target area and directs the airflow to the area where the second target area is located.

4. The charging and discharging power supply as described in claim 1, characterized in that, In the first direction, the liquid cooling radiator is located at the first end of the first circuit board, the exhaust cooler is located at the second end of the first circuit board, and the exhaust outlet of the exhaust device faces the first end of the first circuit board.

5. The charging and discharging power supply as described in claim 1, characterized in that, The liquid cooling radiator extends along the first direction, with a first side facing the first target area and a second side opposite to the first side in contact with at least one second element on the first circuit board; And / or, at least two liquid cooling radiators are provided, arranged on both sides of the first target area.

6. The charging and discharging power supply as described in claim 1, characterized in that, The cooling box is located on the air inlet side of the exhaust device and is opposite to the air inlet. And / or, the liquid cooling radiator and / or the cooling tank are provided with multiple interconnected liquid flow channels.

7. The charging and discharging power supply as described in claim 1, characterized in that, The air guiding assembly includes a fourth air guiding plate and two first air guiding plates. The fourth air guiding plate, the two first air guiding plates, and the exhaust cooler form an annular flow-guiding baffle ring, which at least surrounds the area where the target component is located.

8. The charging and discharging power supply as described in claim 1, characterized in that, The circuit board includes at least two first circuit boards, and each first circuit board is provided with the liquid cooling radiator, the exhaust cooler and the air guide assembly; And / or, the liquid supply pipeline of the cooling device includes a main inlet pipe and a main outlet pipe, the liquid inlet of the liquid radiator and the cooling tank are both connected to the main inlet pipe, and the outlet of the liquid radiator is also connected to the main outlet pipe.

9. The charging and discharging power supply as described in claim 1, characterized in that, At least one panel is detachably covered on the box cavity and is detachably connected to the other panels via a plug-in structure. The plug-in structure has an elastic sealing element in the plug-in groove to make the box a sealed box.

10. A chemical composition and capacity testing device, characterized in that, It includes a needle bed and a charging / discharging power supply as described in any one of claims 1-9.

11. The formulation and capacity preparation device as described in claim 10, characterized in that, The cabinet is provided to house the charging and discharging power supply and the needle bed. The charging and discharging power supply is connected to the bed frame of the needle bed and electrically connected to a bypass board located inside the needle bed.

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