Light emitting element substrate and method for manufacturing the same

Abstract

A light emitting element substrate and a manufacturing method thereof, the light emitting element substrate including a substrate and a plurality of light emitting elements disposed on the substrate. The light emitting elements have light emitting surfaces facing away from the substrate. At least one edge of at least some of the light emitting surfaces of the light emitting elements is provided with at least one adhesive pattern.

Description

Technical Field

[0001] This invention relates to a component substrate and a method for manufacturing the same, and particularly to a light-emitting component substrate and a method for manufacturing the same. Background Technology

[0002] In addition to their advantages of low power consumption and long material lifespan, micro-light-emitting element displays also possess excellent optical performance, such as high color saturation, fast response speed, and high contrast. To achieve lower production costs and greater product design margin, the manufacturing technology for micro-light-emitting element displays employs die-transfer methods. For example, mass transfer technology directly transfers pre-fabricated micro-light-emitting element dies from a temporary substrate to the backplane of the driving circuitry.

[0003] A scheme utilizing an adhesive layer to extract micro-light-emitting element (LED) chips, combined with laser lift-off technology, has been proposed. In this scheme, the adhesive layer used to pick up the LED chips loses its adhesiveness after laser irradiation, allowing the chips to detach. However, even after the chips detach, some adhesive material remains on their light-emitting surface (i.e., the extraction surface), causing changes in the light extraction efficiency, light pattern distribution, and even the emission wavelength of the subsequent LEDs, thus affecting their original optical performance. Summary of the Invention

[0004] This invention provides a light-emitting element substrate, wherein the light-emitting element has relatively stable light emission performance.

[0005] This invention provides a method for manufacturing a light-emitting element substrate, which enables the light-emitting element to maintain its original light-emitting characteristics after undergoing a transfer process.

[0006] The light-emitting element substrate of the present invention includes a substrate and a plurality of light-emitting elements disposed on the substrate. Each light-emitting element has a light-emitting surface facing away from the substrate. At least one edge of the light-emitting surface of each of at least a portion of the light-emitting elements is provided with at least one adhesive pattern.

[0007] The present invention provides a method for manufacturing a light-emitting element substrate, comprising providing a temporary substrate and a plurality of light-emitting elements disposed on the temporary substrate, extracting the light-emitting elements from the temporary substrate using a carrier structure, and performing a laser lift-off process to detach the light-emitting elements from the carrier structure and transfer them to a target substrate. The carrier structure includes a carrier plate, a plurality of bumps, and an adhesive layer. The bumps are dispersedly disposed on the carrier plate and each has a receiving surface for receiving any light-emitting element. The area of ​​the receiving surface is smaller than the area of ​​the light-emitting surface of the light-emitting element. The adhesive layer fills the spaces between the bumps and covers at least a portion of the receiving surface of each bump. The extraction step of the light-emitting elements includes applying pressure to the light-emitting elements overlapping the bumps to expel the portion of the adhesive layer overlapping the bumps from the area of ​​the receiving surface, and causing the light-emitting surface of each light-emitting element to contact the receiving surface of a corresponding bump and a portion of the adhesive layer. During the detachment of the light-emitting elements from the carrier structure, the portion of the adhesive layer overlapping at least a portion of the light-emitting surface of each light-emitting element forms at least one adhesive pattern connected to at least one edge of the light-emitting surface.

[0008] Based on the above, in a method for manufacturing a light-emitting element substrate according to an embodiment of the present invention, a carrier structure for extracting the light-emitting element is provided with a plurality of bumps, and an adhesive layer is filled between these bumps. The arrangement of these bumps allows the adhesive layer to be dispersed between the receiving surface of the bump and the light-emitting surface of the light-emitting element during the pressing and adhesion process of the light-emitting element. Furthermore, because the area of ​​the receiving surface is smaller than the area of ​​the light-emitting surface of the light-emitting element, the adhesion between the adhesive layer and the light-emitting element is generally limited to the vicinity of the bumps. After the light-emitting element is transferred to the target substrate and detached from the carrier structure, the degree of adhesive layer residue on its light-emitting surface can be significantly reduced, and it is generally distributed near the edge of the light-emitting surface. Accordingly, residual adhesive material can be avoided from affecting the light extraction efficiency and light emission wavelength of the light-emitting element, helping to ensure the optical performance of the light-emitting element. Attached Figure Description

[0009] Figure 1 This is a top view schematic diagram of the light-emitting element substrate according to the first embodiment of the present invention.

[0010] Figure 2 yes Figure 1 A side view of the light-emitting element substrate.

[0011] Figures 3A to 3E yes Figure 1 A cross-sectional schematic diagram of the manufacturing process of the light-emitting element substrate.

[0012] Figure 4 yes Figure 3C A bottom view of the carrier plate structure and multiple light-emitting elements.

[0013] Figure 5 This is a top view schematic diagram of the light-emitting element substrate according to the second embodiment of the present invention.

[0014] Figure 6 yes Figure 5 A side view of the light-emitting element substrate.

[0015] Figure 7 yes Figure 5 The bottom view of the light-emitting element is extracted from the carrier plate structure during the manufacturing process of the light-emitting element substrate.

[0016] Figure 8 This is a top view schematic diagram of the light-emitting element substrate according to the third embodiment of the present invention.

[0017] Figure 9 yes Figure 8 The bottom view of the light-emitting element is extracted from the carrier plate structure during the manufacturing process of the light-emitting element substrate.

[0018] Figure 10 This is a bottom view of the carrier structure extracting the light-emitting element in the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention.

[0019] Figures 11A to 11D This is a cross-sectional schematic diagram of the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention.

[0020] Figure 12 This is a bottom view of the carrier structure extracting the light-emitting element during the manufacturing process of the light-emitting element substrate in the fifth embodiment of the present invention.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10, 10A, 10B: Light-emitting element substrate

[0023] 80: Temporary substrate

[0024] 100: Light-emitting element

[0025] 100e1, BPe1: First edge

[0026] 100e2, BPe2: Second edge

[0027] 100e3, BPe3: Third Edge

[0028] 100e4, BPe4: Fourth Edge

[0029] 100es: Emitting light surface

[0030] 200, 200A, 200B: Adhesive layer

[0031] 200P-A: Adhesive Pattern

[0032] 200P1, 200P1-B: First adhesive pattern

[0033] 200P2, 200P2-B: Second adhesive pattern

[0034] 200P3-B: Third Adhesive Pattern

[0035] 200P4-B: Fourth Adhesive Pattern

[0036] BP, BP-A, BP-B, BP-C: Bump

[0037] BPn1, BPn2, BPn3, BPn4: Gap

[0038] BPs: bearing surface

[0039] CS: Carrier board

[0040] D1, D2, D3, X, Y, Z: Direction

[0041] E1: First electrode

[0042] E2: Second electrode

[0043] ES: Epitaxial Structure

[0044] LB: Laser

[0045] OP, OP”: Opening

[0046] PSR: Pressure

[0047] SUB: Substrate

[0048] w1a, w2a, w1b, w2b, w1b", w2b", w3a, w3b: width Detailed Implementation

[0049] As used herein, “about,” “approximately,” “essentially,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or, for example, within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” “essentially,” or “substantially” herein may be chosen to select a more acceptable range of deviations or standard deviations depending on the nature of the measurement, the cutting nature, or other properties, and may not require a single standard deviation to apply to all properties.

[0050] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, an "electrical connection" may mean the presence of other elements between two elements.

[0051] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being “down” to another element will be oriented “up” to that element. Thus, the exemplary term “down” can include both “down” and “up” orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being “below” or “under” another element will be oriented “above” that element. Thus, the exemplary terms “above” or “below” can include both “up” and “down” orientations.

[0052] This document describes exemplary embodiments with reference to cross-sectional views as schematic diagrams of idealized embodiments. Therefore, variations in the shape of the illustrations can be expected as a result of, for example, manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0053] The present invention will now be described in detail with reference to exemplary embodiments thereof, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0054] Figure 1 This is a top view schematic diagram of the light-emitting element substrate according to the first embodiment of the present invention. Figure 2 yes Figure 1 A side view of the light-emitting element substrate. Figures 3A to 3E yes Figure 1 A cross-sectional schematic diagram of the manufacturing process of the light-emitting element substrate. Figure 4 yes Figure 3CA bottom view of the carrier plate structure and multiple light-emitting elements.

[0055] Please refer to Figure 1 and Figure 2 The light-emitting element substrate 10 includes a substrate SUB and a plurality of light-emitting elements 100. For example, these light-emitting elements 100 can be arranged in multiple columns and multiple rows along the X and Y directions, respectively, that is, the light-emitting elements 100 can be arranged in an array on the substrate SUB, but are not limited thereto.

[0056] The substrate SUB is, for example, a circuit board having a driving element layer (not shown), wherein the driving element layer may include various signal lines (e.g., data lines, power lines, and scan lines), multiple active elements (e.g., thin-film transistors), and multiple pad groups. Each light-emitting element 100 is adapted to be bonded to a corresponding pad group for electrical connection to the circuit board. At least one active element is adapted to receive switching signals, data signals, or drive signals from different signal lines to control the corresponding light-emitting element 100 to emit light. That is, these light-emitting elements 100 bonded to the substrate SUB can individually emit light via the control of their corresponding active elements to achieve the effect of displaying an image.

[0057] However, the present invention is not limited thereto. In other embodiments, the substrate SUB may also be a temporary substrate with an adhesion layer, serving as an intermediate substrate for the light-emitting elements 100 before they are transferred to the aforementioned circuit board.

[0058] In this embodiment, the light-emitting element 100 is, for example, a lateral-type light-emitting diode (LPD), which may include an epitaxial structure ES and a first electrode E1 and a second electrode E2 disposed on the same side of the epitaxial structure ES. The first electrode E1 and the second electrode E2 are electrically connected to different semiconductor layers of the epitaxial structure ES (e.g., a P-type semiconductor layer and an N-type semiconductor layer, not shown). For example, the electrical connection between the light-emitting element 100 and the substrate SUB can be achieved through the bonding relationship between the two electrodes of the light-emitting element 100 and the two pads of the aforementioned pad group, but this is not a limitation.

[0059] Of particular note is that the light-emitting element 100 has a light-emitting surface 100es facing away from the substrate SUB, and at least one edge of the light-emitting surface 100es is provided with at least one adhesive pattern. For example, the light-emitting surface 100es of the light-emitting element 100 has a first edge 100e1 and a second edge 100e2 arranged along the Y direction, and a third edge 100e3 and a fourth edge 100e4 connecting the first edge 100e1 and the second edge 100e2 and arranged along the X direction.

[0060] In this embodiment, the first edge 100e1 and the second edge 100e2 of the light-emitting surface 100es are respectively provided with a first adhesive pattern 200P1 and a second adhesive pattern 200P2, while the third edge 100e3 and the fourth edge 100e4 are not provided with any adhesive patterns. The extension direction of the first adhesive pattern 200P1 is parallel to the extension direction of the first edge 100e1, and the extension direction of the second adhesive pattern 200P2 is parallel to the extension direction of the second edge 100e2. Accordingly, the influence of the adhesive pattern on the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100 can be significantly reduced, which helps to ensure the optical performance of the light-emitting element 100 after the transfer process.

[0061] To more clearly illustrate how the aforementioned adhesive pattern is formed on the edge of the light-emitting surface 100es of the light-emitting element 100, the manufacturing method of the light-emitting element substrate 10 will be described exemplarily below. Please refer to... Figure 3A First, a temporary substrate 80 is provided, on which the aforementioned plurality of light-emitting elements 100 are disposed, wherein the light-emitting surfaces 100es of the light-emitting elements 100 face away from the temporary substrate 80. The light-emitting elements 100 on the temporary substrate 80 are extracted using a carrier structure consisting of a carrier plate CS, a plurality of bumps BP, and an adhesive layer 200, wherein the bumps BP are dispersedly disposed on the carrier plate CS, and the adhesive layer 200 fills the spaces between the bumps BP. The bumps BP are made of materials such as polymers, photoresists, metals, or any material having flatness and thickness.

[0062] In this embodiment, the adhesive layer 200 may selectively and completely cover the bumps BP used to receive the receiving surfaces BPs of the light-emitting element 100, but is not limited thereto. Figure 3B As shown, when the carrier structure touches the multiple light-emitting elements 100 on the temporary substrate 80, its adhesive layer 200 contacts the light-emitting surface 100es of the light-emitting element 100. To expel a portion of the adhesive layer 200 existing between the bump BP and the light-emitting element 100 from the area of ​​the receiving surface BPs of the bump BP, pressure PSR is applied to the carrier structure, causing the multiple bumps BP overlapping the multiple light-emitting elements 100 along direction D3 to continue moving towards these light-emitting elements 100. During this process, the portion of the adhesive layer sandwiched between the overlapping bumps BP and the light-emitting element 100 is squeezed and expelled around the bump BP, causing the light-emitting surface 100es of the light-emitting element 100 to contact the receiving surface BPs of the bump BP and a portion of the adhesive layer 200, such as... Figure 3C As shown.

[0063] When the bearing surface BPs of the protrusion BP of the carrier plate structure contacts the light-emitting surface 100es of the light-emitting element 100, the carrier plate structure is moved away from the temporary substrate 80 in direction D2. During this process, the carrier plate structure can move the light-emitting element 100 away from the temporary substrate 80 through the connection between the adhesive layer 200 and the edge region of the light-emitting surface 100es of the light-emitting element 100. That is to say, the carrier plate structure does not rely on the entire surface contact between the adhesive layer 200 and the light-emitting surface 100es of the light-emitting element 100 to form the adhesive force for extracting the light-emitting element 100.

[0064] To achieve the above connection method, the area of ​​the receiving surface BPs of the bump BP is smaller than the area of ​​the light-emitting surface 100es of the light-emitting element 100. Please refer to the above. Figure 4 In this embodiment, the width w1a of the receiving surface BPs of the bump BP along direction D1 is smaller than the width w2a of the light emitting surface 100es of the light-emitting element 100 along direction D1. However, the width w1b of the receiving surface BPs of the bump BP along direction D2 can be approximately equal to the width w2b of the light emitting surface 100es of the light-emitting element 100 along direction D2, but is not limited thereto.

[0065] In other words, in this embodiment, during the extraction of the light-emitting element 100, the carrier plate structure generally uses two parts of the adhesive layer 200, which overlap the light-emitting surface 100es along the direction D3 and are arranged in the direction D1 and far apart, to adhere the light-emitting element 100.

[0066] Please refer to Figure 3D Next, multiple light-emitting elements 100 are transferred to a target substrate (e.g., substrate SUB) using a carrier plate structure. For example, in this embodiment, after the alignment step of multiple light-emitting elements 100 on the carrier plate CS with multiple pad groups (not shown) on the substrate SUB is completed, a thermal bonding process can be performed to electrically bond the first electrode E1 and the second electrode E2 of the light-emitting element 100 to the corresponding pad groups and fix them on the substrate SUB.

[0067] A laser lift-off process is performed to separate the light-emitting elements 100 from the carrier structure. Specifically, the steps may include irradiating the adhesive layer 200 with a laser (LB) to weaken the connection between the adhesive layer 200 and the light-emitting elements 100 (e.g., adhesive failure). That is, the adhesive layer 200, for example, is a polymer material layer, which can be modified by heating, laser irradiation, or other suitable processing methods to achieve the purpose of transferring the light-emitting elements 100. However, during the process of the light-emitting elements 100 detaching from the carrier structure, a portion of the adhesive layer 200 will remain on the light-emitting surface 100es of the light-emitting element 100, forming a first adhesive pattern 200P1 and a second adhesive pattern 200P2 connecting the first edge 100e1 and the second edge 100e2 of the light-emitting surface 100es, such as... Figure 3E As shown. Thus, the fabrication of the light-emitting element substrate 10 of this embodiment is completed.

[0068] Because the carrier plate CS of the carrier structure has multiple bumps BP corresponding to the positions of multiple light-emitting elements 100, the contact surface between the adhesive layer 200 and the light-emitting element 100 can be largely limited to the vicinity of the edge of the light-emitting surface 100es of the light-emitting element 100. Therefore, during the separation process of the light-emitting element 100 from the carrier structure, excessive adhesive material remaining on its light-emitting surface 100es can be avoided, which would affect the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100 in subsequent operations. In other words, it can be ensured that the light-emitting element 100 can maintain its original optical performance after the transfer process.

[0069] Other embodiments will be listed below to illustrate this disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and they will not be repeated below.

[0070] Figure 5 This is a top view schematic diagram of the light-emitting element substrate according to the second embodiment of the present invention. Figure 6 yes Figure 5 A side view of the light-emitting element substrate. Figure 7 yes Figure 5 The bottom view of the light-emitting element is extracted from the carrier plate structure during the manufacturing process of the light-emitting element substrate.

[0071] Please refer to Figure 5 and Figure 6 In this embodiment, the light-emitting element substrate 10A and Figure 1 The difference in the light-emitting element substrate 10 is that the adhesive pattern 200P-A in this embodiment also extends and is distributed on the third edge 100e3 and the fourth edge 100e4 of the light-emitting surface 100es of the light-emitting element 100. More specifically, the adhesive pattern 200P-A in this embodiment is disposed around the light-emitting surface 100es.

[0072] To form the aforementioned adhesive pattern 200P-A distribution, during the manufacturing process of the light-emitting element substrate 10A, the carrier plate structure used to transfer the light-emitting element 100 has a bearing surface BPs of bump BP-A that, in addition to having a width w1a along direction D1 that is smaller than the width w2a along direction D1 of the light-emitting element 100 (or the light-emitting surface 100es), also has a width w1b” along direction D2 that is smaller than the width w2b” of the light-emitting element 100 along direction D2. Figure 7 As shown. In this embodiment, direction D1 intersects with direction D2 (e.g., they are perpendicular to each other).

[0073] Therefore, during the transfer of the light-emitting element 100, the contact surface between the adhesive layer and the light-emitting element 100 is generally limited to the vicinity of the four edges 100e1 to 100e4 of the light-emitting surface 100es of the light-emitting element 100. After the light-emitting element 100 is transferred to the target substrate and detached from the carrier structure, the degree of residue of the adhesive layer on its light-emitting surface 100es can be significantly reduced, and the residual adhesive pattern 200P-A is generally distributed near the four edges of the light-emitting surface 100es (e.g., ...). Figure 5 (As shown). Accordingly, residual adhesive material can be avoided from affecting the light emission efficiency and light emission wavelength of the light-emitting element 100, which helps to ensure the optical performance of the light-emitting element 100.

[0074] Figure 8 This is a top view schematic diagram of the light-emitting element substrate according to the third embodiment of the present invention. Figure 9 yes Figure 8 The bottom view of the light-emitting element is extracted from the carrier plate structure during the manufacturing process of the light-emitting element substrate. Please refer to... Figure 8 and Figure 9 In this embodiment, the light-emitting element substrate 10B and Figure 5 The difference of the light-emitting element substrate 10A is that the multiple adhesive patterns in this embodiment are located only at the four corners of the light-emitting surface 100es of the light-emitting element 100.

[0075] Specifically, in this embodiment, four adhesive patterns remain on the light-emitting element 100: a first adhesive pattern 200P1-B, a second adhesive pattern 200P2-B, a third adhesive pattern 200P3-B, and a fourth adhesive pattern 200P4-B. The first adhesive pattern 200P1-B is located at the junction of the first edge 100e1 and the third edge 100e3. The second adhesive pattern 200P2-B is located at the junction of the second edge 100e2 and the third edge 100e3. The third adhesive pattern 200P3-B is located at the junction of the first edge 100e1 and the fourth edge 100e4. The fourth adhesive pattern 200P4-B is located at the junction of the second edge 100e2 and the fourth edge 100e4.

[0076] To form the aforementioned distribution of four adhesive patterns, during the manufacturing process of the light-emitting element substrate 10B, the carrier plate structure used to transfer the light-emitting element 100 has a notch at each of the four corners of the receiving surface BPs-B of the bump BP-B. For example, the receiving surface BPs-B of the bump BP-B has a first edge BPe1 and a second edge BPe2 arranged along direction D1, a third edge BPe3 and a fourth edge BPe4 arranged along direction D2, a first notch BPn1 adjacent to the first edge BPe1 and the third edge BPe3, a second notch BPn2 adjacent to the second edge BPe2 and the third edge BPe3, a third notch BPn3 adjacent to the first edge BPe1 and the fourth edge BPe4, and a fourth notch BPn4 adjacent to the second edge BPe2 and the fourth edge BPe4 (e.g., ...). Figure 9 (As shown). In this embodiment, direction D1 intersects with direction D2 (e.g., they are perpendicular to each other).

[0077] Therefore, during the transfer of the light-emitting element 100, the contact surface between the adhesive layer and the light-emitting element 100 is roughly limited to the four corners of the light-emitting surface 100es of the light-emitting element 100. After the light-emitting element 100 is transferred to the target substrate and detached from the carrier structure, the degree of residue of the adhesive layer on its light-emitting surface 100es is relatively low compared to... Figure 5 The embodiment can be further reduced, and the four remaining adhesive patterns 200P1-B to 200P4-B are roughly distributed in the four corners of the light-emitting surface 100es (e.g. Figure 8 (As shown). Accordingly, residual adhesive material can be avoided from affecting the light emission efficiency and light emission wavelength of the light-emitting element 100, which helps to ensure the optical performance of the light-emitting element 100.

[0078] Figure 10 This is a bottom view of the carrier structure extracting the light-emitting element in the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. Figures 11A to 11D This is a cross-sectional schematic diagram illustrating the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. Please refer to... Figure 10 The main difference between the carrier plate structure of this embodiment and the carrier plate structure of the previous embodiment is that the adhesive layer 200A of the carrier plate structure of this embodiment has multiple openings OP corresponding to multiple protrusions BP-C.

[0079] It is particularly noteworthy that, in this embodiment, the width w3b of the opening OP along direction D2 is greater than the width w1b of the protrusion BP-C along direction D2. Accordingly, the carrier structure can increase the overflow space of the adhesive layer 200A when it is compressed by the light-emitting element 100 during the extraction of the light-emitting element 100 (e.g., ...). Figure 11C and Figure 11DAs shown in the diagram, this design prevents the adhesive layer 200A from overflowing along direction D2 or its reverse direction to the interface between the light-emitting surface 100es of the light-emitting element 100 and the receiving surface BPs of the bump BP-C. Therefore, after the light-emitting element 100 detaches from the carrier structure, the adhesive material remaining on the light-emitting surface 100es of the light-emitting element 100 can be confined to the edge region of the light-emitting surface 100es to avoid affecting the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100, thus helping to ensure the optical performance of the light-emitting element 100.

[0080] To obtain the aforementioned carrier structure, the manufacturing method of the light-emitting element substrate may optionally include: after the formation step of the adhesive layer 200, performing a patterning process on the adhesive layer 200 to form an adhesive layer 200A having the aforementioned plurality of openings OP (e.g., Figure 11A and Figure 11B Patterning processes include, but are not limited to, photolithography, microcontact printing, screen printing, or nanoimprinting.

[0081] Figure 12 This is a bottom view of the carrier structure extracting the light-emitting element during the manufacturing process of the light-emitting element substrate according to the fifth embodiment of the present invention. Please refer to... Figure 12 The carrier plate structure in this embodiment is similar to... Figure 10 The difference in carrier plate structure lies in the different opening configurations of the adhesive layer. Compared to Figure 10 In the carrier plate structure of this embodiment, the width w3b of the opening OP” of the adhesive layer 200B is greater than the width w1b of the protrusion BP-C along the direction D2, and the width w3a of the opening OP” along the direction D1 is also greater than the width w1a of the protrusion BP-C along the direction D1.

[0082] Therefore, during the extraction of the light-emitting element 100, the carrier structure increases the overflow space of the adhesive layer 200B when it is squeezed by the light-emitting element 100, while preventing the adhesive layer 200B from overflowing to the interface between the light-emitting surface 100es of the light-emitting element 100 and the receiving surface BPs of the bump BP-C. Thus, after the light-emitting element 100 is detached from the carrier structure, the adhesive material remaining on the light-emitting surface 100es of the light-emitting element 100 can be confined to the edge region of the light-emitting surface 100es, thereby avoiding affecting the light extraction efficiency and wavelength of the light-emitting element 100 and helping to ensure the optical performance of the light-emitting element 100.

[0083] In summary, in one embodiment of the light-emitting element substrate and its manufacturing method of the present invention, a carrier structure for extracting the light-emitting element is provided with a plurality of bumps, and an adhesive layer is filled between these bumps. The arrangement of these bumps allows the adhesive layer to be dispersed between the receiving surface of the bump and the light-emitting surface of the light-emitting element during the pressing and adhesion process. Furthermore, because the area of ​​the receiving surface is smaller than the area of ​​the light-emitting surface of the light-emitting element, the adhesion between the adhesive layer and the light-emitting element is largely confined to the vicinity of the bumps. After the light-emitting element is transferred to the target substrate and detached from the carrier structure, the degree of adhesive layer residue on its light-emitting surface can be significantly reduced, and it remains primarily near the edge of the light-emitting surface. Accordingly, residual adhesive material can be avoided from affecting the light extraction efficiency and wavelength of the light-emitting element, thus helping to ensure the optical performance of the light-emitting element.

Claims

1. A method for manufacturing a light-emitting element substrate, comprising: A temporary substrate and a plurality of light-emitting elements disposed on the temporary substrate are provided; The light-emitting elements on a temporary substrate are extracted using a carrier plate structure. The carrier plate structure includes a carrier plate, a plurality of bumps, and an adhesive layer. The bumps are dispersedly disposed on the carrier plate, each bump having a receiving surface for receiving any of the light-emitting elements. The area of ​​the receiving surface is smaller than the area of ​​a light-emitting surface of each light-emitting element. The adhesive layer fills the spaces between the bumps and covers at least a portion of the receiving surface of each bump. The extraction step of the light-emitting elements includes applying pressure to the bumps overlapping the light-emitting elements to expel the portion of the adhesive layer overlapping each bump from the area of ​​the receiving surface, and to contact the light-emitting surface of each light-emitting element with the receiving surface of a corresponding bump and a portion of the adhesive layer; and A laser lift-off process is performed to detach the light-emitting elements from the carrier structure and transfer them to a target substrate. During the detachment of the light-emitting elements from the carrier structure, the adhesive layer overlaps at least a portion of the light-emitting surface of each of the light-emitting elements to form at least one adhesive pattern connected to at least one edge of the light-emitting surface.

2. The method for manufacturing a light-emitting element substrate as claimed in claim 1, wherein the width of the receiving surface of each of the bumps along a first direction is smaller than the width of the light-emitting surface of each of the light-emitting elements along the first direction.

3. The method for manufacturing a light-emitting element substrate as claimed in claim 2, wherein the width of the receiving surface of each of the bumps along a second direction is smaller than the width of the light-emitting surface of each of the light-emitting elements along the second direction.

4. The method for manufacturing a light-emitting element substrate as claimed in claim 1, wherein the receiving surface of each of the bumps has a first edge and a second edge arranged along a first direction, a third edge and a fourth edge arranged along a second direction, a first notch adjacent to the first edge and the third edge, a second notch adjacent to the second edge and the third edge, a third notch adjacent to the first edge and the fourth edge, and a fourth notch adjacent to the second edge and the fourth edge, wherein the first direction intersects the second direction.

5. The method for manufacturing a light-emitting element substrate as described in claim 1, further comprising: A patterning process is performed to give the adhesive layer multiple openings corresponding to the protrusions.

6. The method of manufacturing a light-emitting element substrate as claimed in claim 5, wherein the width of each of the openings along the first direction is greater than the width of the receiving surface of each of the protrusions along the first direction.

7. The method of manufacturing a light-emitting element substrate as claimed in claim 6, wherein the width of each of the openings along the second direction is greater than the width of the receiving surface of each of the protrusions along the second direction.

8. A light-emitting element substrate manufactured by the manufacturing method of claim 1, comprising: One substrate; as well as Multiple light-emitting elements are disposed on the substrate, each of the light-emitting elements having a light-emitting surface facing away from the substrate, wherein at least a portion of the light-emitting elements have at least one adhesive pattern on at least one edge of each light-emitting surface.

9. The light-emitting element substrate of claim 8, wherein the at least one adhesive pattern is an adhesive pattern surrounding the light-emitting surface.

10. The light-emitting element substrate of claim 8, wherein the at least one edge includes a first edge and a second edge arranged along a first direction, and the at least one adhesive pattern includes a first adhesive pattern disposed on the first edge and a second adhesive pattern disposed on the second edge.

11. The light-emitting element substrate of claim 10, wherein the extension direction of the first adhesive pattern is parallel to the extension direction of the first edge, and the extension direction of the second adhesive pattern is parallel to the extension direction of the second edge.

12. The light-emitting element substrate of claim 10, wherein the at least one edge further includes a third edge and a fourth edge arranged along a second direction, the second direction intersecting the first direction, and the at least one adhesive pattern further includes a third adhesive pattern disposed on the first edge and a fourth adhesive pattern disposed on the second edge, the first adhesive pattern being located at the junction of the first edge and the third edge, the second adhesive pattern being located at the junction of the second edge and the third edge, the third adhesive pattern being located at the junction of the first edge and the fourth edge, and the fourth adhesive pattern being located at the junction of the second edge and the fourth edge.

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