A vertical tinning device and a method for quickly replacing a cable to be tinned

Abstract

The application discloses a vertical tin plating device and a method for quickly replacing a cable to be plated with tin, and belongs to the technical field of cables. The device comprises a tin liquid tank and a positioning device. A bottom hole is formed in the bottom wall of the tin liquid tank, and the positioning device is fixedly installed in the bottom hole. A through hole is formed in the positioning device and is in communication with the inside and outside of the tin liquid tank. A mold is detachably connected to one side of the bottom end of the through hole. The mold is provided with a through hole which is matched with the diameter of the cable to be plated with tin. The device further comprises a cable replacement auxiliary device which is provided with an inner hole matched with the diameter of the cable to be plated with tin. The top surface of the positioning device is provided with a mounting groove matched with the lower end of the cable replacement auxiliary device. When the lower end of the cable replacement auxiliary device is assembled in the mounting groove, the upper end of the cable replacement auxiliary device is exposed from the liquid level of the tin liquid, and the inner hole is axially opposite to the through hole. The application can not only reduce the movement stroke of the cable in the tin liquid, but also quickly replace the cable to be plated with tin, and has wide application range and high universality.

Description

Technical Field

[0001] This invention relates, and more particularly to a vertical tin plating apparatus and a method for quickly replacing cables to be tinned. Background Technology

[0002] Coaxial cables are mainly used in various power industries, urban rail transit industries, data communication industries, shipbuilding, and automotive industries for transmitting high-frequency signals. A coaxial cable generally consists of four parts: an inner conductor, an inner insulation layer, an outer conductor, and a sheath.

[0003] Currently, most coaxial cables, both domestically and internationally, use a horizontal tin-dip process for their outer conductors. The outer conductor (the unsheathed coaxial cable) needs to change direction within the tin bath, requiring it to travel a longer path. This results in a larger tin bath size, and further heating of the tin requires more energy, failing to achieve energy conservation and emission reduction. Furthermore, the outer conductor experiences complex stresses within the tin bath, and the high-frequency electrical performance of the cable significantly deteriorates after hot-dip tinning, making it unsuitable for high-frequency applications.

[0004] Chinese invention patent CN101603166A discloses a vertical tin plating device and method for the shielding layer of semi-flexible coaxial cables, such as... Figure 1 As shown, the equipment includes a cable feeding machine (7e), a cable take-up machine (8e), a tin plating tank (3e), a lower guide wheel (5e) located below the tin plating tank, and an upper guide wheel (6e) located above the tin plating tank (3e). The tin plating tank (3e) is mounted on a frame (10e). The tin plating tank (3e) is divided into two areas: a deep tank and a shallow tank. The shallow tank is the tin plating area, and the deep tank is the tin liquid storage area. A hole is opened at the bottom of the shallow tank, and a cable guide device (4e) is installed in the hole. The cable guide device has a cable guide hole in the middle, and the diameter of the hole is 0.2-1.5 mm larger than the diameter of the cable to be tinned.

[0005] While this invention patent solves the problems of large tin bath size and complex stress on the outer conductor in horizontal tin plating processes, the diameter of the cable inlet hole on the cable inlet device (4e) needs to be determined according to the size of the cable to be tinned. This necessitates manufacturing multiple such cable inlet devices for different cable sizes, allowing for easy replacement as needed. Consequently, when tinning cables of different sizes are required, the cable inlet device (4e) must be fully exposed above the tin bath surface before disassembly and replacement. Furthermore, the tin bath in the deep tank area does not fully participate in the tin plating process, resulting in continuous heat consumption and energy waste. Therefore, there is an urgent need for a device and method that allows tin plating of coaxial cables of different sizes without altering the tin bath or the cable inlet device (4e). Summary of the Invention

[0006] To address the problems of existing coaxial cable tinning devices requiring operation of the cable introduction device when replacing the cable to be tinned and the waste of energy in the tinning process, the present invention aims to provide a vertical tinning device and a method for quickly replacing the cable to be tinned.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows:

[0008] In a first aspect, the present invention provides a vertical tin plating apparatus, including a tin bath tank and a positioning device. The bottom wall of the tin bath tank has a bottom hole, and the positioning device is fixedly installed in the bottom hole. The positioning device has through holes at both ends that are respectively connected to the inner and outer sides of the tin bath tank. A mold is detachably connected to one side of the bottom end of the through hole. The mold has a through hole that matches the diameter of the cable to be tin-plated.

[0009] It also includes a cable replacement auxiliary device, which has an inner hole that matches the diameter of the cable to be tinned. The top surface of the positioning device is provided with a mounting groove that matches the lower end of the cable replacement auxiliary device. When the lower end of the cable replacement auxiliary device is assembled in the mounting groove, the upper end of the cable replacement auxiliary device is exposed above the surface of the molten tin, and the inner hole is axially opposite to the through hole.

[0010] In a preferred embodiment, the cable replacement auxiliary device includes a desoldering rod and a hollow cylinder, wherein the outer wall of the desoldering rod is adapted to the inner wall of the hollow cylinder, and the inner hole of the cable replacement auxiliary device is formed on the desoldering rod, and the lower outer wall of the hollow cylinder is adapted to the inner wall of the mounting groove.

[0011] In a preferred embodiment, the device further includes a mold fixing device, which is detachably and fixedly connected to the tin bath. The top surface of the mold fixing device faces the bottom surface of the positioning device. The top surface of the mold fixing device is provided with a lower mounting step that matches the lower end of the mold, and the bottom surface of the positioning device is provided with an upper mounting step that matches the upper end of the mold, so that the mold is fixed between the mold fixing device and the positioning device. The mold fixing device has a cable hole that connects to a through hole in the mold and allows the cable to be tinned to pass through.

[0012] In a preferred embodiment, the device further includes a solder scraping mold located above the positioning device. The solder scraping mold has a solder scraping hole adapted to the cable to be soldered, and the solder scraping hole is axially opposite to the through hole on the positioning device. The solder scraping mold is detachably and fixedly connected to the lifting platform. The lifting platform moves along a guide fixedly installed on the solder bath, and a locking structure for locking the position of the lifting platform is provided between the lifting platform and the guide.

[0013] In a preferred embodiment, the locking structure is a locking screw.

[0014] In a preferred embodiment, the diameter of the inner hole in the mold is 0.1 to 0.3 mm larger than the diameter of the cable to be tinned.

[0015] On the other hand, the present invention also provides a method for quickly replacing a cable to be tinned, applied to the vertical tinning apparatus described above, comprising the following steps:

[0016] S1. Cut the cable to be tinned above the surface of the tin liquid;

[0017] S2. Slide the lower end of the cable replacement auxiliary device onto the cable to be tinned from the break point of the cable to be tinned, and immerse the lower end of the cable replacement auxiliary device in the molten solder until it is assembled into the mounting groove on the top surface of the positioning device.

[0018] S3. Pull the cable to be tinned out of the vertical tinning device;

[0019] S4. Disassemble and replace with a new mold, which is adapted to the new cable to be tinned;

[0020] S5. Insert the new cable to be tinned from the mold into the cable replacement auxiliary device;

[0021] S6. After removing the cable replacement auxiliary device, connect the new cable to be tinned to the take-up device.

[0022] In a preferred embodiment, the cable replacement auxiliary device includes a solder removal rod and a hollow cylinder;

[0023] In step S2, the desoldering rod is first placed on the cable to be tinned, and then the hollow cylinder is placed on the desoldering rod and assembled in the mounting groove.

[0024] In step S5, the desoldering rod is first removed from the hollow cylinder, and then the new cable to be tinned is inserted from the mold into the hollow cylinder.

[0025] In step S6, removing the cable replacement auxiliary device means removing the hollow cylinder.

[0026] In a preferred embodiment, the vertical tin plating apparatus includes a tin scraper, a lifting platform, and a locking structure disposed between the tin scraper and the lifting platform;

[0027] Before step S2, the method further includes the step of raising and locking the position of the solder squeegee so that the broken end of the cable to be tinned comes out of the solder squeegee.

[0028] In step S6, before connecting the new cable to be tinned to the take-up device, the steps include: lowering the position of the tin-scraping die and passing the new cable to be tinned through the tin-scraping hole, and adjusting and fixing the tin-scraping die to a position suitable for tinning.

[0029] In a preferred embodiment, the suitable position for soldering in S6 is: one side of the bottom surface of the soldering mold is submerged below the surface of the molten solder, and the top surface of the soldering mold is exposed above the surface of the molten solder.

[0030] By adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0031] 1. Because the cable to be tinned moves vertically, the size of the tin bath tank can be made smaller, which can effectively save raw tin and the electricity required during production, thus achieving energy conservation and emission reduction;

[0032] 2. Because the cable to be tinned moves vertically, this reduces the time the cable spends in the high-temperature molten solder. This helps to reduce the gas generated by the evaporation and decomposition of the flux coated on the outside of the cable due to prolonged stay in the high-temperature molten solder.

[0033] 3. Since 255-265℃ is an ideal temperature for molten tin, the coating obtained at this temperature has a moderate thickness, is dense and free of pinhole defects, and can reduce the voltage standing wave ratio of the cable and improve its electrical performance.

[0034] 4. Due to the installation of the cable replacement auxiliary device, when replacing a new cable to be tinned, the tin liquid can be isolated with the assistance of the cable replacement auxiliary device, and then the replacement operation of the cable to be tinned can be carried out. Compared with the existing technology, it is not necessary to transfer the tin liquid back and forth between the deep tank and the shallow tank, so less tin liquid is required in the tin liquid tank, which can reduce energy consumption during the tinning process and avoid the tin liquid cooling when replacing the tinned cable; at the same time, it also improves the versatility of the vertical tinning device, which is suitable for tinning operations of coaxial cables of different sizes and specifications. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of a vertical tin plating device in the prior art;

[0036] Figure 2 This is a schematic diagram of the tin plating process using the vertical tin plating device in this invention.

[0037] Figure 3 This is a schematic diagram illustrating the use of the desoldering rod in the operation of replacing the cable to be tinned in Embodiment 2 of the present invention;

[0038] Figure 4 This is a schematic diagram illustrating the use of the hollow cylinder in the operation of replacing the cable to be tinned in Embodiment 2 of the present invention;

[0039] Figure 5 This is a schematic diagram of the process of inserting a new cable to be tinned during the replacement of the cable to be tinned in Embodiment 2 of the present invention.

[0040] In the diagram: 1-Solder tank, 2-Positioning device, 21-Through hole, 22-Mounting slot, 3-Mold, 31-Perforation, 4-Cable replacement auxiliary device, 41-Solder removal rod, 42-Hollow cylinder, 5-Mold fixing device, 51-Cable hole, 6-Solder removal mold, 61-Solder removal hole, 7-Lifting platform, 8-Guide component, 9-Locking structure, 10-Cable to be tinned. Detailed Implementation

[0041] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the description of the structure of this invention shown in the accompanying drawings. They are only for the convenience of describing this invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] The terms "first" and "second" in this technical solution are merely designations for corresponding structures that are identical or similar, or that perform similar functions. They do not represent an arrangement of the importance of these structures, nor do they imply any ranking, comparison of size, or other meaning.

[0044] Furthermore, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two structures. Those skilled in the art can understand the specific meaning of the above terms in this invention by considering the overall concept of the invention and the specific context of the solution.

[0045] Example 1

[0046] A vertical tin plating apparatus for tin plating the outer conductor of a coaxial cable, such as... Figure 2 As shown, the device includes a molten tin tank 1, a positioning device 2, and a mold 3.

[0047] The molten solder tank 1 is an open-top container structure, made of metal profiles through welding or casting. A bottom hole is provided in the bottom wall of the molten solder tank 1. The positioning device 2 is a solid metal structure, fixedly installed in this bottom hole, for example, by threaded connection or welding. The positioning device 2 has vertically arranged through holes, the upper end of which communicates with the space inside the molten solder tank 1, and the lower end of which communicates with the external space of the molten solder tank 1.

[0048] The mold 3 is arranged on one side of the bottom surface of the tin bath 1. The upper end of the mold 3 is detachably connected to the lower end of the through hole in the positioning device 2, for example, by a threaded connection or a flange connection. The mold 3 is configured as a metal columnar structure, and an axially arranged through hole 31 is provided on the mold 3. The diameter of the through hole 31 is adapted to the diameter of the cable 10 to be tinned. Typically, the diameter of the through hole 31 is 0.1-0.3 mm larger than the diameter of the cable 10 to be tinned, thereby ensuring that the cable 10 to be tinned can pass through the mold 3, while also ensuring that the tin liquid cannot leak from the gap between the cable 10 to be tinned and the through hole 31.

[0049] During the tin plating operation, the cable 10 to be tinned (a coaxial cable without an outer sheath, i.e., tin plating on the outer conductor) is passed through the mold 3 and then through the positioning device 2 into the tin bath tank 1 before being connected to the take-up device. When tin bath suitable for tin plating is added to the tin bath tank 1, the cable 10 to be tinned passes through the tin bath tank 1 from bottom to top under the drive of the take-up device, and the tin bath in the tin bath tank 1 is plated onto the cable 10 to be tinned. Compared to the traditional horizontal tin plating process, the above solution allows for a smaller tin bath tank 1 due to the vertical movement of the cable 10, effectively saving tin and electricity during production, thus achieving energy conservation and emission reduction. The vertical movement of the cable 10 also reduces its dwell time in the high-temperature tin bath, minimizing the evaporation and decomposition of flux coated on the outside of the cable 10 due to prolonged exposure to the high-temperature tin bath. Furthermore, the ideal tin bath temperature of 255–265°C results in a well-formed, dense plating without pinholes, exhibiting moderate thickness. Finally, it reduces the voltage standing wave ratio (VSWR) of the cable, improving its electrical performance.

[0050] However, when the above-mentioned vertical tin plating device needs to perform tin plating operations on cables 10 of different sizes or another cable of the same size (a new cable to be tin plating), there are still some inconveniences: for example, it is necessary to pull out the cable 10 to be tin plating and replace it with a new mold 3 (the diameter of the perforation 31 is adapted to the new cable to be tin plating). However, after the cable 10 to be tin plating is separated from the mold 3, it will cause the molten tin to leak. Based on this, the vertical tin plating device of this embodiment is further configured to include a cable replacement auxiliary device. The cable replacement auxiliary device is used to isolate the molten tin when replacing the cable 10 to be tin plating, thereby preventing the molten tin from leaking through the positioning device 2.

[0051] In this embodiment, the cable replacement auxiliary device 4 is configured as a columnar structure, and the cable replacement auxiliary device 4 has an inner hole along its axial direction that matches the diameter of the cable 10 to be tinned. The top surface of the positioning device 2 is provided with a mounting groove 22 that matches the lower end of the cable replacement auxiliary device 4. When the lower end of the cable replacement auxiliary device 4 is installed in the mounting groove 22, the upper end of the cable replacement auxiliary device 4 is exposed above the surface of the molten tin, and its inner hole is opposite to the through hole on the positioning device 2, so that the inner hole, through hole, and through hole 31 form a vertical channel for the cable 10 to be tinned to pass through.

[0052] With this setup, when a new cable to be tinned needs to be replaced, the following operations can be performed with the assistance of the cable replacement auxiliary device 4: Cut the cable 10 to be tinned above the tin liquid level; place the lower end of the cable replacement auxiliary device 4 onto the cut end of the cable 10, and immerse the lower end of the cable replacement auxiliary device 4 into the tin liquid until it is assembled in the mounting groove 22 on the top surface of the positioning device 2. At this time, the cable 10 to be tinned is separated from the tin liquid by the cable replacement auxiliary device 4; completely pull the cable 10 to be tinned out of the vertical tinning device; after disassembling the mold 3 in use, replace it with a new mold 3 (if the size of the new cable to be tinned has changed). The new mold 3 is adapted to the new cable to be tinned; insert the new cable to be tinned through the new mold 3 into the cable replacement auxiliary device 4; after removing the cable replacement auxiliary device 4, connect the new cable to the take-up device to continue the tinning operation.

[0053] As can be seen, compared with the prior art, the device in this embodiment, with the cooperation of the cable replacement auxiliary device 4, does not need to transfer the molten solder back and forth between the deep tank and the shallow tank, so that the amount of molten solder required in the molten solder tank 1 is less, thereby reducing energy consumption during the tin plating process, and reducing the temperature impact on the molten solder (preventing it from cooling) during the replacement of the cable to be tinned. The whole process is convenient and easy to operate.

[0054] Understandably, for ease of assembly, the cable replacement auxiliary device 4 is further designed to be cylindrical, with its inner hole located at its center. Correspondingly, the cross-section of the mounting groove 22 is also circular, and the through hole is also located at the center of the mounting groove 22. This design allows the cable replacement auxiliary device 4 to be installed directly into place without needing to adjust its orientation. Furthermore, to reduce the size of the positioning device 2, the aforementioned through hole (mounting groove 22) is further positioned at the center of the positioning device 2. Simultaneously, to ensure that the through hole 31 on the mold 3 aligns with the through hole 21 on the positioning device 2 during rotation (e.g., during threaded connection), the through hole 31 is also located at the center of the mold 3. This ensures that when replacing the cable 10 to be tinned, the inner hole on the cable replacement auxiliary device 4, the through hole 21 on the positioning device 2, and the through hole 31 on the mold 3 are coaxial.

[0055] Example 2

[0056] Based on Embodiment 1, this embodiment configures a cable replacement auxiliary device 4, which includes a desoldering rod 41 and a hollow cylinder 42, both of which are columnar in structure. The outer wall of the desoldering rod 41 is adapted to the inner wall of the hollow cylinder 42 (the outer diameter of the desoldering rod 41 is slightly smaller than the inner diameter of the hollow cylinder 42) so that the desoldering rod 41 and the hollow cylinder 42 can move relative to each other along the axial direction. The aforementioned inner hole is formed at the center of the desoldering rod 41, and the lower outer wall of the hollow cylinder 42 is adapted to the inner wall of the mounting groove 22 on the top surface of the positioning device 2.

[0057] This design allows for several advantages. First, when replacing cables 10 of different sizes and specifications to be tinned, the hollow cylinder 42 in the cable replacement auxiliary device 4 does not need to be replaced; only the desoldering rod 41 with a different inner diameter needs to be replaced. Compared to the cable replacement auxiliary device 4 with an integral structure, this reduces the overall material consumption of the components. Second, compared to the cable replacement auxiliary device 4 with an integral structure, the weight of each desoldering rod 41 and hollow cylinder 42 can be reduced, making them easier to handle.

[0058] In the operation of replacing the cable 10 to be tinned as described in Embodiment 1, the desoldering rod 41 needs to be first placed on the cable 10 to be tinned, such as... Figure 3 As shown, the hollow cylinder 42 is then fitted onto the space excluding the solder rod 41, and the lower outer wall of the hollow cylinder 42 is fitted into the mounting groove 22 on the top surface of the positioning device 2, as shown. Figure 4 As shown; then pull out the cable 10 to be tinned. At this point, the molten solder is completely isolated, thus preventing leakage. The desoldering rod 41 can then be removed. Figure 5 As shown, after that, replace the appropriate mold 3, insert the new cable to be tinned, and then take out the hollow cylinder 41.

[0059] Example 3

[0060] Based on Embodiment 1, this embodiment further includes a mold fixing device 5 for the vertical tin plating device, such as... Figure 2 As shown, the mold fixing device 5 is detachably and fixedly connected to the solder bath 1. For example, a cavity is provided on the bottom surface of the solder bath 1, which is connected to a bottom hole. That is, the lower end of the positioning device 2 extends to the bottom side of the cavity, and the outer wall of the mold fixing device 5 is threaded to the inner wall of the cavity, so that the top surface of the mold fixing device 5 is opposite to the bottom surface of the positioning device 2. Alternatively, a flange can be provided on the outer wall of the mold fixing device 5, so that the bottom surface of the solder bath 1 is connected.

[0061] In this embodiment, the top surface of the mold fixing device 5 is further provided with a lower mounting step that matches the lower end of the mold 3, and the bottom surface of the positioning device 2 is provided with an upper mounting step that matches the upper end of the mold 3 (the upper mounting step is arranged coaxially around the through hole 21). Thus, after the mold fixing device 5 is installed in the cavity, the mold 3 can be fixed between the top surface of the mold fixing device 5 and the bottom surface of the positioning device 2. At this time, the through hole 31 on the mold 3 is opposite to the through hole 21 on the positioning device 2. In addition, the mold fixing device 5 also has a cable hole 51 for the tin-plated cable 10 to pass through (the cable hole 51 has a relatively large diameter so that cables of different sizes and specifications can pass through smoothly). This cable hole 51 is also directly opposite the through hole 31 on the mold 3.

[0062] It is understandable that since the mold 3 will rotate as the mold fixing device 5 is installed, in order to ensure that the through hole 31 on the mold 3 can be aligned with the through hole 21 on the positioning device 2, the cable hole 51 and the lower mounting step are further configured to be located at the center of the mold fixing device 5. At the same time, the mold 3 is also configured to be cylindrical and the through hole 31 is opened at the center of the mold 3, so that the through hole 31 on the mold 3 can always be aligned with the through hole 21 on the positioning device 2.

[0063] Example 4

[0064] In this embodiment, the vertical tin plating device also includes a tin scraper 6, such as... Figure 2 As shown, the solder scraper 6 is positioned above the positioning device 2 during use. The solder scraper 6 has a solder scraping hole 61 that matches the cable 10 to be soldered. The function of the solder scraper 6 is to remove excess solder from the cable 10 after it is fitted onto it. Typically, to maintain the perpendicularity of the cable 10, the solder scraping hole is also required to be coaxial with the through hole 21 on the positioning device 2.

[0065] It is understood that the solder squeegee 6 should not be placed below the surface of the molten solder (so it cannot achieve the effect of solder squeegee) or far away from the surface of the molten solder (so it will cause the molten solder to splash). Therefore, in this embodiment, the solder squeegee 6 is preferably positioned such that the upper part of the solder squeegee 6 in the axial direction (thickness direction) is exposed above the surface of the molten solder, and the lower part is submerged 5-15mm below the surface of the molten solder.

[0066] According to the replacement procedure of the cable 10 to be tinned disclosed in Embodiment 1, the cable replacement auxiliary device 4 needs to be installed into the cable 10 to be tinned from the break point (usually away from the liquid surface). Therefore, the tin scraper 6 needs to be removable. Therefore, in this embodiment, the tin scraper 6 is detachably and fixedly connected (e.g., fixed by screws) to the lifting platform 7, and the lifting platform 7 moves along the guide member 8 (vertically / vertically arranged) fixedly installed on the tin liquid tank 1. For example, the guide member 8 is configured as a rod-shaped structure, and a guide sleeve that cooperates with the rod-shaped structure is fixedly installed on the lifting platform 7 so that the lifting platform 7 can slide axially along the guide member 8. Furthermore, a locking structure 9 for locking the position of the lifting platform 7 is provided between the lifting platform 7 and the guide member 8. For example, the locking structure 9 is configured as a locking screw.

[0067] This configuration allows the tin-scraping mold 6 to be raised and locked by the cooperation of the lifting platform 7 and the locking structure 9 when the cable to be tinned 10 needs to be replaced. This allows the broken end of the cable to be tinned 10 to be removed from the tin-scraping mold 6. Then, the cable replacement auxiliary device 4 is fitted onto the cable to be tinned 10. Before the new cable to be tinned is connected to the take-up device, the position of the tin-scraping mold 6 is lowered and the new cable to be tinned is passed through the tin-scraping hole 61. Then, the tin-scraping mold 6 is adjusted to a suitable position for tinning.

[0068] Example 5

[0069] A method for quickly replacing cables to be tinned, applied to the vertical tinning apparatus disclosed in the above embodiments, includes the following steps:

[0070] S1. Cut the cable to be tinned above the surface of the tin liquid;

[0071] S2. Slide the lower end of the cable replacement auxiliary device onto the cable to be tinned from the break point of the cable to be tinned, and immerse the lower end of the cable replacement auxiliary device in the molten solder until it is assembled into the mounting groove on the top surface of the positioning device.

[0072] S3. Pull the cable to be tinned out of the vertical tinning device;

[0073] S4. Disassemble and replace with a new mold, which is adapted to the new cable to be tinned;

[0074] S5. Insert the new cable to be tinned from the mold into the cable replacement auxiliary device;

[0075] S6. After removing the cable replacement auxiliary device, connect the new cable to be tinned to the guide wheel and the take-up device (e.g., take-up machine).

[0076] When the cable replacement auxiliary device includes a desoldering rod and a hollow cylinder, in step S2, the desoldering rod is first placed on the cable to be tinned, such as... Figure 3 As shown, the hollow cylinder is then fitted over the solder bar and assembled into the mounting slot, as follows. Figure 4 As shown; in S5, first remove the desoldering rod from the hollow cylinder, as... Figure 5 As shown, the new cable to be tinned is then inserted from the mold into the hollow cylinder; in S6, the cable replacement auxiliary device is removed, which is equivalent to removing the hollow cylinder.

[0077] In the vertical tin plating device, when the device includes a tin scraper, a lifting platform, and a locking structure between the tin scraper and the lifting platform, the step before S2 is: raising and locking the position of the tin scraper to allow the broken end of the cable to be tinned to disengage from the tin scraper. In S6, before connecting the new cable to be tinned to the take-up device, the step is: lowering the position of the tin scraper and allowing the new cable to be tinned to pass through the tin scraper hole 61, adjusting and fixing the tin scraper to a suitable position for tin plating. In S6, the suitable position for tin plating is: one side of the bottom surface of the tin scraper is submerged 5-15mm below the surface of the molten tin, and the top surface of the tin scraper is exposed above the surface of the molten tin.

[0078] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A vertical tin plating apparatus, comprising a tin bath tank and a positioning device, wherein the bottom wall of the tin bath tank has a bottom hole, the positioning device is fixedly installed in the bottom hole, and the positioning device has through holes at both ends respectively communicating with the inner and outer sides of the tin bath tank, a mold is detachably connected to one side of the bottom end of the through hole, the mold has a through hole adapted to the diameter of the cable to be tinned; further comprising a cable replacement auxiliary device, the cable replacement auxiliary device having an inner hole adapted to the diameter of the cable to be tinned, the top surface of the positioning device having a mounting groove adapted to the lower end of the cable replacement auxiliary device, and when the lower end of the cable replacement auxiliary device is assembled in the mounting groove, the upper end of the cable replacement auxiliary device is exposed above the surface of the tin bath, and the inner hole is axially opposite to the through hole; characterized in that: The cable replacement auxiliary device includes a desoldering rod and a hollow cylinder, wherein the outer wall of the desoldering rod is adapted to the inner wall of the hollow cylinder, and the inner hole of the cable replacement auxiliary device is formed on the desoldering rod, and the lower outer wall of the hollow cylinder is adapted to the inner wall of the mounting groove.

2. The vertical tin plating apparatus according to claim 1, characterized in that: It also includes a mold fixing device, which is detachably and fixedly connected to the tin bath; wherein, the top surface of the mold fixing device is opposite to the bottom surface of the positioning device, the top surface of the mold fixing device is provided with a lower mounting step that matches the lower end of the mold, and the bottom surface of the positioning device is provided with an upper mounting step that matches the upper end of the mold, so that the mold is fixed between the mold fixing device and the positioning device; the mold fixing device has a cable hole that is connected to the through hole in the mold and allows the cable to be tinned to pass through.

3. The vertical tin plating apparatus according to claim 1, characterized in that: It also includes a solder scraping mold, which is located above the positioning device. The solder scraping mold has a solder scraping hole adapted to the cable to be soldered, and the solder scraping hole is axially opposite to the through hole on the positioning device. The solder scraping mold is detachably and fixedly connected to the lifting platform. The lifting platform moves along the guide fixedly installed on the solder bath, and a locking structure for locking the position of the lifting platform is provided between the lifting platform and the guide.

4. The vertical tin plating apparatus according to claim 3, characterized in that: The locking structure is a locking screw.

5. The vertical tin plating apparatus according to claim 1, characterized in that: The diameter of the inner hole in the mold is 0.1~0.3mm larger than the diameter of the cable to be tinned.

6. A method for quickly replacing a cable to be tinned, applied to the vertical tinning apparatus as described in any one of claims 1-5, characterized in that: Includes the following steps: S1. Cut the cable to be tinned above the surface of the tin liquid; S2. Place the lower end of the cable replacement auxiliary device onto the cable to be tinned from the break point, and then... The lower end of the device is submerged in molten solder until it is assembled into the mounting groove on the top surface of the positioning device; S3. Pull the cable to be tinned out of the vertical tinning device; S4. Disassemble and replace with a new mold, which is adapted to the new cable to be tinned; S5. Insert the new cable to be tinned from the new mold into the cable replacement auxiliary device; S6. After removing the cable replacement auxiliary device, connect the new cable to be tinned to the take-up device.

7. The method according to claim 6, characterized in that: When the cable replacement auxiliary device includes a desoldering rod and a hollow cylinder; in step S2, the desoldering rod is first placed on the cable to be tinned, and then the hollow cylinder is placed on the desoldering rod and assembled in the mounting groove. In step S5, the desoldering rod is first removed from the hollow cylinder, and then the new cable to be tinned is inserted from the mold into the hollow cylinder; in step S6, the operation of removing the cable replacement auxiliary device is to remove the hollow cylinder.

8. The method according to claim 6, characterized in that: When the vertical tin plating device includes a tin scraper, a lifting platform, and a locking structure disposed between the tin scraper and the lifting platform; before step S2, the device further includes the step of raising and locking the position of the tin scraper so that the broken end of the cable to be tinned comes out of the tin scraper; in step S6, before connecting the new cable to be tinned to the take-up device, the device further includes the step of lowering the position of the tin scraper so that the new cable to be tinned passes through the tin scraper hole, and adjusting and fixing the tin scraper to a position suitable for tin plating.

9. The method according to claim 8, characterized in that: In step S6, the suitable position for soldering is: one side of the bottom surface of the soldering mold is submerged below the surface of the molten solder, and the top surface of the soldering mold is exposed above the surface of the molten solder.

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