Multilayer electronic component

Abstract

The present invention provides a multilayer electronic component, the multilayer electronic component comprising: a body including a dielectric layer and alternatingly stacked first inner electrode and second inner electrode, wherein the corresponding dielectric layer is disposed between the first inner electrode and the second inner electrode; the body including a first surface and a second surface opposite to each other in the direction of stacking the first inner electrode and the second inner electrode, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; a moisture-proof layer disposed on at least one of the first surface, the second surface, the fifth surface and the sixth surface and comprising rare earth oxide; a first outer electrode disposed on the third surface and connected to the first inner electrode; and a second outer electrode disposed on the fourth surface and connected to the second inner electrode.

Description

[0001] This application is a divisional application of the invention patent application filed on May 25, 2020, with application number 202010449063.0 and entitled "Multilayer Electronic Components". Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are a type of chip capacitor that is mounted on printed circuit boards (PCBs) of various electronic products such as imaging devices (or video equipment) (e.g., liquid crystal displays (LCDs), plasma display panels (PDPs)), computers, smartphones, and mobile phones) to charge and discharge them.

[0004] Due to its miniaturized size, high capacity, and ease of installation, this type of MLCC can be used as a component in a variety of electronic devices.

[0005] Furthermore, with the recent increase in interest in automotive electronic components, MLCCs are required to have high reliability and high mechanical strength in order to be used in automotive or infotainment systems.

[0006] Specifically, considering the environment in which automotive electronic components are used, defects such as chip cracks and breakdowns caused by moisture penetration are considered fatal, thus requiring methods to ensure higher moisture resistance and reliability.

[0007] Furthermore, existing methods have encountered problems with performance or reliability degradation due to thinning, thus increasing the need for new methods to address these issues. Summary of the Invention

[0008] One aspect of this disclosure is to provide a multilayer electronic component with improved moisture resistance reliability.

[0009] Another aspect of this disclosure is to provide a multilayer electronic component that can ensure high capacitance.

[0010] However, the above aspects are not limited to the previous description and will be more clearly understood through the following embodiments.

[0011] According to embodiments of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and alternatingly stacked first and second inner electrodes, wherein a corresponding dielectric layer is disposed between the first and second inner electrodes; the body includes a first surface and a second surface opposite to each other in the direction in which the first and second inner electrodes are stacked; a third surface and a fourth surface connected to the first and second surfaces and opposite to each other; and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other; a moisture-proof layer disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface and comprising a rare earth oxide; a first outer electrode disposed on the third surface and connected to the first inner electrode; and a second outer electrode disposed on the fourth surface and connected to the second inner electrode. Attached Figure Description

[0012] The above and other aspects, features and other advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0013] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure;

[0014] Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I';

[0015] Figure 3 It is along Figure 1 A cross-sectional view taken from line II-II';

[0016] Figure 4 It is shown schematically. Figure 1 A perspective view of the main body;

[0017] Figure 5 This is a diagram illustrating the process of forming a moisture-proof layer in the body;

[0018] Figure 6 It is shown Figure 1 A diagram showing the main body with a moisture-proof layer formed therein;

[0019] Figure 7 This is a schematic perspective view of the main body based on the modified example;

[0020] Figure 8 This is a schematic perspective view showing the main body and moisture-proof layer according to a modified example. Detailed Implementation

[0021] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully communicate the present disclosure to those skilled in the art. Therefore, for clarity, the shape and size of the elements in the drawings may be exaggerated, and the same reference numerals will always be used to indicate the same or similar elements.

[0022] For convenience or clarity, the thickness and dimensions of each layer shown in the accompanying drawings may be enlarged, omitted, or drawn schematically. Throughout the drawings, the same reference numerals will designate the same elements. Furthermore, when a part "includes" a component in this specification, it should be understood that other components may be included, but not excluded, unless otherwise specifically indicated.

[0023] In the accompanying drawings, "X direction" can be defined as "second direction", "L direction" or "length direction", "Y direction" can be defined as "third direction", "W direction" or "width direction", and "Z direction" can be defined as "first direction", "stack direction", "T direction" or "thickness direction".

[0024] Multilayer electronic components

[0025] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The cross-sectional view taken by line I-I', and Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II', and Figure 4 It is shown schematically. Figure 1 A perspective view of the main body.

[0026] Figure 5 This is a diagram illustrating the process of forming a moisture-proof layer in the body.

[0027] Figure 6 It is shown Figure 1 The diagram shows the main body with a moisture-proof layer.

[0028] Reference Figures 1 to 6 A detailed description of the multilayer electronic component according to an embodiment.

[0029] A multilayer electronic component 100 according to an embodiment of the present disclosure includes: a body 110 including a dielectric layer 111 and alternatingly stacked first inner electrode 121 and second inner electrode 122, with a corresponding dielectric layer between the first inner electrode 121 and the second inner electrode 122; the body 110 includes a first surface 1 and a second surface 2 opposite to each other in the direction (Z direction) of the inner electrode stacking, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4; a moisture-proof layer 117 disposed on at least one of the first surface, the second surface, the fifth surface and the sixth surface and comprising rare earth oxides; a first outer electrode 131 disposed on the third surface 3 and connected to the first inner electrode; and a second outer electrode 132 disposed on the fourth surface 4 and connected to the second inner electrode.

[0030] The main body 110 includes a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 stacked alternately.

[0031] The shape of the main body 110 is not specifically limited, but it may have a hexahedral shape as shown in the figure or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder included in the main body 110 during calcination, the main body 110 may not have a hexahedral shape with perfectly straight lines, but may have a generally hexahedral shape.

[0032] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in the thickness direction (Z direction), a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction (X direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction (Y direction).

[0033] The multiple dielectric layers 111 forming the body 110 are in a calcined state and can be integrated in a single body, making the boundaries between adjacent dielectric layers 111 not easily discernible without the use of a scanning electron microscope (SEM).

[0034] According to the embodiments, the material forming the dielectric layer 111 is not limited, as long as sufficient capacitance can be obtained therefrom, and can be, for example, a barium titanate (BaTiO3)-based material, a lead-based perovskite composite material, a strontium titanate-based material, etc. The BaTiO3-based material may include BaTiO3 ceramic powder, and an example of BaTiO3 ceramic powder is (Ba... 1-x Ca x TiO3, Ba(Ti 1-y Ca y O3、(Ba 1-x Cax (Ti) 1-y Zr y O3, Ba(Ti 1-y Zr y O3, etc.

[0035] For the purposes of this disclosure, the material forming the dielectric layer 111 may include various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., added to BaTiO3 powder, etc.

[0036] Furthermore, the thickness of dielectric layer 111 is not specifically limited.

[0037] However, when the thickness of the dielectric layer is less than 0.6 μm, specifically, when the thickness of the dielectric layer is 0.4 μm or less, the moisture resistance reliability will decrease.

[0038] The thickness of dielectric layer 111 may refer to the average thickness of dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0039] The average thickness of dielectric layer 111 can be measured by scanning the length-thickness (LT) cross section of body 110 with SEM.

[0040] For example, the average thickness can be obtained by measuring the thickness of any dielectric layer at 30 equidistant points along the length direction extracted from the LT cross-sectional image of the body 110, and then averaging the measured thicknesses, wherein the LT cross-sectional image is obtained by cutting the central portion of the body 110 in the width direction and scanning it using SEM.

[0041] The thickness can be measured at 30 equidistant points in the capacitance generation section, which refers to the area where the first inner electrode 121 and the second inner electrode 122 overlap.

[0042] The main body 110 includes: a capacitance generating section disposed inside the main body 110 and generating capacitance by including a first inner electrode 121 and a second inner electrode 122 configured to be opposite to each other and a dielectric layer 111 therebetween; and an upper cover portion 112 and a lower cover portion 113 formed on the upper and lower portions of the capacitance generating section.

[0043] The capacitance generating section helps to generate capacitance in the capacitor, and capacitance can be generated by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a corresponding dielectric layer 111 between them.

[0044] The upper cover portion 112 and the lower cover portion 113 can be formed by vertically stacking a single dielectric layer or at least two dielectric layers on the upper and lower surfaces of the capacitance generating portion, respectively, and can substantially prevent the internal electrode from being damaged by physical or chemical stress.

[0045] The upper cover 112 and the lower cover 113 do not include internal electrodes, but may contain the same material as the dielectric layer 111.

[0046] In addition, the main body 110 may include edge portions 114 and 115 respectively disposed on two side surfaces of the capacitor generating portion.

[0047] like Figure 3 As shown, the edges 114 and 115 refer to the regions between the two ends of the first inner electrode 121 and the second inner electrode 122 and the boundary surface of the body 110 in a cross section taken in the WT direction of the body 110.

[0048] Edges 114 and 115 can substantially prevent damage to the internal electrodes from physical or chemical stress.

[0049] Edge portions 114 and 115 do not include internal electrodes, but may contain the same material as dielectric layer 111.

[0050] Multiple internal electrodes 121 and 122 are configured to be opposite each other and with corresponding dielectric layers 111 therebetween.

[0051] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 configured to be opposite each other, and a corresponding dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122.

[0052] The first internal electrode 121 and the second internal electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0053] based on Figures 2 to 4 The first inner electrode 121 is spaced apart from the fourth surface 4 and exposed through the third surface 3, while the second inner electrode 122 is spaced apart from the third surface 3 and exposed through the fourth surface 4. A first outer electrode 131 is disposed on the third surface 3 to connect to the first inner electrode 121, and a second outer electrode 132 is disposed on the fourth surface 4 to connect to the second inner electrode 122. The first inner electrode 121 is also spaced apart from the fifth surface 5 and the sixth surface 6, and the second inner electrode 122 is also spaced apart from the fifth surface 5 and the sixth surface 6.

[0054] The first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0055] The main body 110 can be formed by alternately stacking dielectric layers 111 on which a first internal electrode 121 is printed and dielectric layers 111 on which a second internal electrode 122 is printed in the thickness direction (Z direction) to form a laminate, and then calcining the laminate.

[0056] The materials forming the first internal electrode 121 and the second internal electrode 122 are not specifically limited, and can be conductive pastes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0057] Methods for printing conductive paste include screen printing, gravure printing, etc., but are not limited to these.

[0058] The thickness of the first inner electrode 121 and the second inner electrode 122 does not need to be particularly limited; however, it is preferred that the thickness of each of the first inner electrode 121 and the second inner electrode 122 is 0.4 μm or less, so as to easily realize miniaturized and high-capacitance multilayer electronic components.

[0059] The thickness of the first inner electrode 121 and the thickness of the second inner electrode 122 can refer to the average thickness of the first inner electrode 121 and the average thickness of the second inner electrode 122, respectively.

[0060] The average thickness of the first inner electrode 121 and the average thickness of the second inner electrode 122 can be measured by using SEM to scan the LT section of the body 110.

[0061] For example, the average thickness can be obtained by measuring the thickness of any first inner electrode and second inner electrode at 30 equidistant points in the length direction extracted from the LT cross-sectional image of the body 110, and then averaging the measured thicknesses, wherein the LT cross-sectional image is obtained by cutting the central portion of the body 110 in the width direction and scanning it using SEM.

[0062] The thickness can be measured at 30 equidistant points in the capacitance generation section, which refers to the area where the first inner electrode 121 and the second inner electrode 122 overlap.

[0063] The moisture-proof layer 117 is disposed on at least one of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 and contains rare earth oxides.

[0064] The moisture-proof layer 117 covers tiny pores and cracks to prevent moisture from penetrating into the body through the outer surface of the body. Furthermore, because the moisture-proof layer 117 is hydrophobic due to the rare earth oxides it contains, it more effectively prevents moisture from penetrating into the body through the outer surface of the body.

[0065] Rare earth oxides exhibit low interaction with water molecules due to their outermost electron shell (orbital) reaching the octet state, thus preventing the formation of hydrogen bonds and making them hydrophobic. Furthermore, by incorporating rare earth oxides, the moisture-proof layer 117 not only improves moisture resistance reliability but also inhibits ion migration, further enhancing overall reliability.

[0066] Traditionally, methods such as coating the surface of a substrate with silicone resin or fluorinated waterproofing agents are used to improve moisture resistance reliability. In contrast, the moisture-proof layer 117 containing rare earth oxides according to this disclosure has the advantage of very low moisture permeability and excellent adhesion to the substrate 110 compared to conventional coating materials such as silicone resin or fluorinated waterproofing agents.

[0067] Rare earth oxides are not specifically limited and can be, for example, dysprosium oxide (Dy₂O₃), cerium oxide (CeO₂), praseodymium oxide (Pr₆O₃), etc. 11 It can be selected from neodymium oxide (Nd2O3), samarium oxide (Sm2O3), europium oxide (Eu2O3), gadolinium oxide (Gd2O3), terbium oxide (Tb4O7), holmium oxide (Ho2O3), erbium oxide (Er2O3), thulium oxide (Tm2O3), ytterbium oxide (Yb2O3), and lutetium oxide (Lu2O3).

[0068] Furthermore, when the rare earth oxide is Dy2O3, it can improve compatibility with the host 110 compared to other rare earth oxides. In this respect, Dy2O3 may be more preferred.

[0069] The thickness of the moisture-proof layer 117 can be at least 100 nm.

[0070] When the thickness of the moisture-proof layer 117 is less than 100 nm, it may not be able to effectively improve the moisture resistance reliability.

[0071] There is no special limit to the upper limit of the thickness of the moisture-proof layer 117, and it can be determined by taking into account factors such as the capacitance and size of the capacitor. For example, the thickness of the moisture-proof layer 117 can be 100 μm or less.

[0072] Furthermore, the method for forming the moisture-proof layer 117 containing rare earth oxides is not specifically limited, and can be, for example, atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc.

[0073] A more preferred method for forming the moisture-proof layer 117 containing rare earth oxides includes preparing rare earth oxides in sheet form and setting them on the body 110.

[0074] based on Figures 4 to 6 Once the body 110 is prepared, sheets 117a, 117b, 117c and 117d containing rare earth oxides are formed on the body 110 to form a moisture-proof layer 117.

[0075] The sheet containing rare earth oxides may also contain raw materials forming dielectric layer 111, and various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., which are added to BaTiO3 powder, etc., may be added to the sheet according to the purposes of this disclosure.

[0076] The advantage of a moisture-proof layer 117 containing the same material as dielectric layer 111 is that it improves adhesion to the body 110 and allows for easier control of the shape of the moisture-proof layer 117. In one example, dielectric layer 111 may not include rare earth oxides contained in moisture-proof layer 117. In this case, rare earth oxides may be contained only in moisture-proof layer 117, while dielectric layer 111 may not contain rare earth oxides. In another example, even if dielectric layer 111 includes rare earth oxides contained in moisture-proof layer 117, the weight percentage of rare earth oxides in dielectric layer 111 relative to the total weight of dielectric layer 111 is less than the weight percentage of rare earth oxides in moisture-proof layer 117 relative to the total weight of moisture-proof layer 117.

[0077] External electrodes 131 and 132 are disposed outside the main body 110 and are connected to internal electrodes 121 and 122, respectively. For example... Figure 2 As shown, it may include a first external electrode 131 and a second external electrode 132 respectively connected to the first internal electrode 121 and the second internal electrode 122.

[0078] In order to generate capacitance, the first external electrode 131 and the second external electrode 132 can be electrically connected to the first internal electrode 121 and the second internal electrode 122, respectively, and the second external electrode 132 can be connected to a potential different from that to which the first external electrode 131 is connected.

[0079] The first external electrode 131 may be disposed on the third surface 3 to be connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 to be connected to the second internal electrode 122.

[0080] The first external electrode 131 may extend from the third surface 3 to cover a portion of the moisture-proof layer 117, and the second external electrode 132 may extend from the fourth surface 4 to cover a portion of the moisture-proof layer 117.

[0081] Furthermore, the outer electrodes 131 and 132 can be formed from any conductive material such as metal. The specific material can be determined considering electrical properties, structural stability, etc. Additionally, the outer electrodes 131 and 132 can have a multilayer structure.

[0082] For example, the external electrodes 131 and 132 can be calcined electrodes containing conductive metal and glass, or resin electrodes containing conductive metal and resin.

[0083] In addition, the external electrodes 131 and 132 can be formed by ALD, MLD, CVD, sputtering, etc.

[0084] External electrodes 131 and 132 can also be formed by providing a sheet containing conductive metal on the body 110.

[0085] based on Figure 2 As a more specific example, the first external electrode 131 may include a first electrode layer 131a configured to contact the first internal electrode 121 and a first conductive resin layer 131b disposed on the first electrode layer 131a, and the second external electrode 132 may include a second electrode layer 132a configured to contact the second internal electrode 122 and a second conductive resin layer 132b disposed on the second electrode layer 132a.

[0086] Electrode layers 131a and 132a may contain conductive metal and glass.

[0087] The conductive metal contained in electrode layers 131a and 132a is not specifically limited, as long as its material can be electrically connected to the inner electrode to generate capacitance. For example, the conductive metal used in electrode layers 131a and 132a can be at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0088] The conductive resin layers 131b and 132b may contain a conductive metal and a matrix resin.

[0089] The conductive metal contained in the conductive resin layers 131b and 132b promotes electrical connection with the electrode layers 131a and 132a.

[0090] The conductive metal contained in the conductive resin layers 131b and 132b is not specifically limited, as long as its material can be electrically connected to the electrode layers 131a and 132a, and can be at least one of, for example, nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0091] The conductive metal contained in the conductive resin layers 131b and 132b may include at least one of spherical powder particles and sheet-shaped powder particles. That is, the conductive metal may be composed of only sheet-shaped powder particles, only spherical powder particles, or a mixture of both sheet-shaped and spherical powder particles.

[0092] Spherical powder particles may not have a perfectly spherical shape; for example, they may have a shape in which the ratio of the length of the major axis to the minor axis (major axis / minor axis) is 1.45 or less.

[0093] Flake-shaped powder particles refer to powders with a flat and long shape, although not specifically limited, but may have a major axis to minor axis length ratio of 1.95 or greater.

[0094] The lengths of the major and minor axes of spherical and flake-shaped powder particles can be measured by scanning an image of the XZ-direction cross-section (LT section) obtained by cutting the central portion of a multilayer electronic component in the width (Y) direction using SEM.

[0095] The matrix resin contained in the conductive resin layers 131b and 132b is not specifically limited, as long as it has adhesive properties and impact absorption and can be mixed with conductive metal powder to prepare a paste. For example, the matrix resin can be an epoxy resin.

[0096] In addition, the external electrodes 131 and 132 may also include plating layers 131c and 132c respectively disposed on the conductive resin layers 131b and 132b to improve mounting performance. Plating layers 131c and 132c may be conductive layers.

[0097] The plating layers 131c and 132c are not specifically limited in type and can be plating layers containing at least one of Ni, Sn, Pd and alloys thereof. The plating layers 131c and 132c can have a multilayer structure.

[0098] For example, coatings 131c and 132c may include a Ni coating and a Sn coating disposed on the Ni coating.

[0099] Furthermore, the moisture-proof layer 117 can be disposed on all surfaces of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6 of the main body 110. By disposing of the moisture-proof layer 117 on all surfaces of the first, second, fifth, and sixth surfaces of the main body 110, the moisture-proof layer 117 can have greatly improved moisture resistance reliability.

[0100] However, in this disclosure, the moisture-proof layer 117 is not limited to being disposed on all of the first, second, fifth, and sixth surfaces of the body 110, but may be disposed only on the first surface, only on the first and second surfaces, or only on the fifth and sixth surfaces.

[0101] Figure 7 This is a schematic perspective view of the main body 110' according to the modified example. Figure 8 This is a schematic perspective view showing the main body 110' and the moisture-proof layer 117 according to a modified example.

[0102] based on Figure 7 and Figure 8 The moisture-proof layer 117 can be disposed on the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110', and the first inner electrode 121' can be spaced apart from the fourth surface 4 and exposed through the third surface 3, the fifth surface 5 and the sixth surface 6, while the second inner electrode 122' can be spaced apart from the third surface 3 and exposed through the fourth surface 4, the fifth surface 5 and the sixth surface 6.

[0103] Accordingly, the first inner electrode 121' and the second inner electrode 122' exposed on the fifth surface 5 and the sixth surface 6 of the body 110' are covered by a moisture-proof layer 117 and are thus protected from external influences on the multilayer electronic components.

[0104] In other words, the moisture-proof layer 117 performs the function of the edge portions 114 and 115 or the covering portions 112 and 113, thereby preventing the inner electrode from being damaged by physical or chemical stress.

[0105] Furthermore, since the moisture-proof layer 117 performs the functions of the edge portions 114 and 115 or the covering portions 112 and 113, the overlapping surface area of ​​the first inner electrode 121' and the second inner electrode 122' is maximized, and the capacitance per unit volume is increased.

[0106] One of the many effects of this disclosure is to improve moisture resistance reliability by setting a moisture-proof layer containing rare earth oxides in the body.

[0107] However, the various advantages of this disclosure are not limited to the foregoing description and will be more clearly understood through the examples.

[0108] Although embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and alternating layers of a first inner electrode and a second inner electrode, with the corresponding dielectric layer between the first inner electrode and the second inner electrode. The body also includes a first surface and a second surface opposite to each other in the direction in which the first inner electrode and the second inner electrode are stacked, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other. A moisture-proof layer covers at least one of the first surface, the second surface, the fifth surface, and the sixth surface and is formed of rare earth oxides; A first external electrode is disposed on the third surface and connected to the first internal electrode; as well as The second external electrode is disposed on the fourth surface and connected to the second internal electrode.

2. The multilayer electronic assembly of claim 1, wherein, The rare earth oxide is at least one selected from dysprosium oxide, cerium oxide, praseodymium oxide, neodymium oxide, samarium oxide, europium oxide, gadolinium oxide, terbium oxide, holmium oxide, erbium oxide, thulium oxide, ytterbium oxide, and lutetium oxide.

3. The multilayer electronic assembly of claim 1, wherein, The rare earth oxide is dysprosium oxide.

4. The multilayer electronic assembly of claim 1, wherein, The thickness of the moisture-proof layer is at least 100 nm.

5. The multilayer electronic assembly of claim 4, wherein, The thickness of the moisture-proof layer is 100 μm or less.

6. The multilayer electronic assembly of claim 1, wherein, The content of rare earth oxides in the moisture-proof layer is higher than that in the dielectric layer.

7. The multilayer electronic assembly of claim 1, wherein, The moisture-proof layer is disposed on all of the first surface, the second surface, the fifth surface, and the sixth surface.

8. The multilayer electronic assembly of claim 7, wherein, The first internal electrode is spaced apart from the fourth surface of the body and exposed through the third, fifth, and sixth surfaces, and The second inner electrode is spaced apart from the third surface and exposed through the fourth, fifth and sixth surfaces.

9. The multilayer electronic assembly of claim 7, wherein, The first internal electrode is spaced apart from the fourth, fifth, and sixth surfaces of the body and exposed through the third surface; and The second inner electrode is spaced apart from the third, fifth and sixth surfaces and exposed through the fourth surface.

10. The multilayer electronic assembly of claim 1, wherein, The first external electrode includes a first electrode layer in contact with the first internal electrode and a first conductive resin layer disposed on the first electrode layer. The second external electrode includes a second electrode layer that contacts the second internal electrode and a second conductive resin layer disposed on the second electrode layer.

11. The multilayer electronic assembly of claim 10, wherein, The first electrode layer and the second electrode layer comprise conductive metal and glass.

12. The multilayer electronic assembly of claim 10, wherein, The first conductive resin layer and the second conductive resin layer comprise a conductive metal and a matrix resin.

13. The multilayer electronic component according to claim 10, wherein the multilayer electronic component further comprises conductive layers respectively disposed on the first conductive resin layer and the second conductive resin layer.

14. The multilayer electronic assembly according to claim 1, wherein, The moisture-proof layer is hydrophobic.

15. The multilayer electronic assembly of claim 1, wherein, In the dielectric layer and the moisture-proof layer, rare earth oxides are contained only in the moisture-proof layer.

16. The multilayer electronic assembly of claim 1, wherein, The dielectric layer contains rare earth oxides, and the weight percentage of the rare earth oxides in the dielectric layer relative to the total weight of the dielectric layer is less than the weight percentage of the rare earth oxides in the moisture-proof layer relative to the total weight of the moisture-proof layer.

17. The multilayer electronic assembly of claim 1, wherein, The average thickness of the dielectric layer is 0.4 μm or less.

18. The multilayer electronic assembly of claim 1, wherein, The average thickness of the first inner electrode and the second inner electrode is 0.4 μm or less.

19. The multilayer electronic assembly of claim 1, wherein, The dielectric layer has an average thickness of 0.4 μm or less, and The average thickness of the first inner electrode and the second inner electrode is 0.4 μm or less.

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