Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Abstract

The present invention provides a substrate processing apparatus capable of detecting whether a substrate has been processed normally, a method of manufacturing a semiconductor device, and a recording medium. The substrate processing apparatus (1) of the present invention includes: a processing chamber (136-139) that performs processing of a substrate (200); a storage section (322) that stores recipe information, process data, deviation quality data, and comparison data; a monitoring section (330) that monitors the process data; an analysis section (329) that compares the deviation quality data and the comparison data, calculates a reproducibility index indicating reproducibility with respect to the comparison data, and calculates a correction value of setting information included in the recipe information when the reproducibility index is lower than a predetermined value; and a control section (320) that is capable of correcting the setting information included in the recipe information using the correction value.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, a method for manufacturing semiconductor devices, and a recording medium. Background Technology

[0002] In substrate processing apparatuses used in the manufacture of semiconductor devices such as LSI (Large Scale Integrated Circuit) and DRAM (Dynamic Random Access Memory), it is known to monitor the operating status of the apparatus to detect various anomalies such as apparatus malfunctions and process abnormalities during various processes performed on semiconductor substrates such as silicon (Si) wafers (hereinafter referred to as "substrate"). Furthermore, Patent Document 1 describes a method for sharing various information of a single substrate processing apparatus in an environment where multiple substrate processing apparatuses are connected via a network, so that the same processing can be performed by each substrate processing apparatus, and the processing performed based on the single substrate processing apparatus can be reproduced in other substrate processing apparatuses.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-194951 Summary of the Invention

[0006] As described in Patent Document 1 above, when other substrate processing devices share information related to the processing of one substrate processing device and reproduce the processing in one substrate processing device in other substrate processing devices, maintaining high reproducibility of the processing based on one substrate processing device in other substrate processing devices is preferable in terms of integrating the production quality of each substrate processing device. Here, as a method for evaluating the production quality of a substrate processing device, for example, a method of evaluating its production quality by performing a film deposition measurement on substrates deposited by each substrate processing device can be listed. However, such a film deposition measurement usually requires the use of a dedicated measuring device. From this perspective, if the production quality can be evaluated at the individual substrate processing device level, the integration of the production quality of each substrate processing device can be easily achieved.

[0007] The purpose of this invention is to provide a substrate processing apparatus, a semiconductor device manufacturing method and procedure capable of evaluating production quality.

[0008] According to one aspect of the present invention, a structure is provided, comprising: a processing chamber for processing a substrate; a storage unit for storing recipe information recording steps of performing substrate processing, process data accumulated during processing of multiple substrates, deviation quality data calculated based on the process data, and comparison data for comparison with the deviation quality data; a monitoring unit for monitoring the process data; an analysis unit for comparing the deviation quality data and the comparison data, determining a reproducibility index representing reproducibility relative to the comparison data, and calculating a correction value for setting information included in the recipe information when the reproducibility index is lower than a predetermined value; and a control unit capable of correcting the setting information included in the recipe information using the correction value.

[0009] Invention Effects

[0010] According to the present invention, it is possible to evaluate the production quality of the processing performed based on the substrate processing apparatus at the substrate processing apparatus side. Attached Figure Description

[0011] Figure 1 This is a schematic structural diagram illustrating an example of a substrate processing apparatus according to one embodiment of the present invention.

[0012] Figure 2 This is a functional block diagram illustrating an example of a control system for a substrate processing apparatus according to one embodiment of the present invention.

[0013] Figure 3 This is a schematic diagram illustrating one aspect of a substrate processing system, including a substrate processing apparatus according to one embodiment of the present invention.

[0014] Figure 4 This is a flowchart illustrating an example of a method for generating deviation quality data in a substrate processing apparatus according to an embodiment of the present invention.

[0015] Figure 5 This is a graph showing an example of temperature variation in baseline process data and the process data of a comparison object compared to the baseline process data after a series of substrate processes have been performed.

[0016] Figure 6 It is a schematic representation Figure 4 The diagram shows the method for generating deviation quality data.

[0017] Figure 7 This is a flowchart illustrating an example of a method for calculating the reproducibility index in a substrate processing apparatus according to one embodiment of the present invention.

[0018] Figure 8This is a diagram showing an example of a device parameter table stored in the storage unit of a substrate processing apparatus according to one embodiment of the present invention.

[0019] Figure 9 This is a diagram showing an example of a condition change instruction information table used to modify the setting information contained in the recipe information.

[0020] Explanation of reference numerals in the attached figures

[0021] 1. Substrate processing apparatus

[0022] 100 chip boxes

[0023] 103 Vacuum transfer chamber

[0024] 112 Vacuum Transfer Robot

[0025] 121 Atmospheric Transport Room

[0026] 124 Atmospheric conveying robot

[0027] Processing rooms 136-139

[0028] 200 substrates

[0029] 300 Control System

[0030] 320 Control Department

[0031] 322 Storage Unit

[0032] 323 External Storage Unit

[0033] 327a Display Section

[0034] 327b Operations Section

[0035] 328 Ministry of Communications

[0036] 329 Analysis Section

[0037] 330 Surveillance Department Detailed Implementation

[0038] The following description, with reference to the accompanying drawings, illustrates one or more embodiments for carrying out the present invention. Furthermore, the scope of the description necessary to achieve the objectives of the present invention is schematically shown below, primarily focusing on the scope necessary to describe corresponding parts of the invention; omissions are based on publicly known techniques.

[0039] <Brief Structure of the Substrate Processing Device>

[0040] Figure 1This is a schematic structural diagram illustrating an example of a substrate processing apparatus according to one embodiment of the present invention; more specifically, it is a schematic cross-sectional view of the substrate processing apparatus viewed from above. The substrate processing apparatus 1 of this embodiment can be an apparatus for implementing at least a portion of a method for manufacturing a semiconductor device. For example... Figure 1 As shown, the substrate processing apparatus 1 is a so-called cluster-type substrate processing apparatus 1, which can be divided into a vacuum side region that operates under a negative pressure state lower than atmospheric pressure in a vacuum state. Figure 1 The upper part) and the atmospheric side region that operates at atmospheric pressure ( Figure 1 (the lower part). Furthermore, as the substrate processing apparatus 1 of this embodiment, an apparatus for performing film formation processing on a substrate 200 in a semiconductor device manufacturing method is exemplified.

[0041] In the atmospheric side region, an atmospheric transport chamber 121, two loading chambers (loading interlock chambers) 122 and 123, an atmospheric transport robot 124, a loading port (IO stage) 105, and a notch alignment device 106 may be provided. The atmospheric transport chamber 121 is a space capable of transporting the substrate 200 under atmospheric pressure. The atmospheric transport robot 124 can be installed within this atmospheric transport chamber 121. The two loading chambers 122 and 123 are spaces located at the boundary between the atmospheric side region and the vacuum side region, providing passage for the substrate 200 during loading and unloading between the two regions. The pressure within the two loading chambers 122 and 123 can vary according to the pressure in the atmospheric transport chamber 121 and the pressure in the vacuum transport chamber 103 (described later), thus allowing for a structure that can also withstand negative pressure environments. The two loading chambers 122 and 123 and the atmospheric transport chamber 121 are connected via gate valves 128 and 129. The atmospheric transport robot 124 can be a robot used to transfer the substrate 200 before and after film formation under atmospheric pressure.

[0042] The loading port 105 is a platform arranged adjacent to the atmospheric transport chamber 121. Multiple storage containers (hereinafter referred to as "chip cassettes") 100, called FOUPs (Front Open Unified Pods), are mounted on this platform. Each chip cassette 100 can store multiple substrates 200 and functions as a substrate transporter. Multiple chip cassettes 100 are mounted on the loading port 105 with their openings matching the substrate loading / unloading outlets 134 located in the atmospheric transport chamber 121. The covers of the openings of the chip cassettes 100 are opened and closed by chip cassette openers 108 that can open and close the substrate loading / unloading outlets 134, thereby enabling the loading and unloading of substrates 200. Furthermore, the chip cassettes 100 are supplied to or discharged from the loading port 105 via transport devices (e.g., OHS (Overhead Shuttle), OHT (Overhead Hoist Transport)) not shown. Furthermore, the transport of wafer cassettes using this transport device can be managed, for example, by a computer host, which will be described later as an external computer. The notch alignment device 105 is a device that uses a notch provided on the substrate 200 to align the position of the substrate 200. Alternatively, a directional plane alignment device can be used instead of the notch alignment device 105.

[0043] The vacuum side region can mainly include a vacuum transfer chamber (transfer module) 103, a vacuum transfer robot 112, and multiple processing chambers 136-139. The vacuum transfer chamber 103 can be a space capable of transferring the substrate 200 under negative pressure. This vacuum transfer chamber 103 can be polygonal in shape when viewed from above (in... Figure 1 The vacuum transfer chamber 105 is constructed in a hexagonal shell shape. Two placement chambers 122 and 123 are connected to two of its sides via gate valves 126 and 127, while multiple processing chambers 136-139 are connected to the other four sides. Gate valves, which airtightly isolate the spaces between the vacuum transfer chamber 103 and each of the processing chambers 136-139 during sealing, can also be installed between them. The shape of the vacuum transfer chamber 105 can be appropriately adjusted according to the number of placement chambers and processing chambers in the substrate processing apparatus 1, the size of the substrate 200 to be processed, etc.

[0044] The vacuum transfer robot 112 can be any mechanism that is positioned approximately in the center of the vacuum transfer chamber 103 and is capable of transferring the substrate 200 between or between the placement chambers 122 and 123 and the processing chambers 136 to 139.

[0045] Able to combine multiple (in) Figure 1The four processing chambers 136-139 are spaces for performing one step in a semiconductor device manufacturing process, such as a film deposition step. The specific structure of each processing chamber 136-139 is not particularly limited, but the processing performed in each processing chamber 136-139 can be, for example, substrate modification or film deposition. The processing method in each processing chamber 136-139 can be either batch processing or leaf processing. Furthermore, the processing performed in each processing chamber 136-139 can be the same or different.

[0046] <Brief Structure of the Control System>

[0047] Figure 2 This is a functional block diagram illustrating an example of a control system for a substrate processing apparatus according to one embodiment of the present invention. The substrate processing apparatus 1 described above can be controlled by a control system 300 that functions as a main controller, controlling a series of its operations. This control system 300 can, for example, be configured as a known computer. This known computer can be configured to include at least volatile or non-volatile memory (e.g., RAM (Random Access Memory), HDD (Hard Disc Drive)) and a processor, represented by a CPU (Central Processing Unit). Furthermore, in this embodiment, the control system 300 is exemplified as the main controller of the substrate processing apparatus 1, but the control system 300 can also coexist with the main controller as a different structural element.

[0048] like Figure 2As shown, the control system 300 may include: a control unit 320, which can control the entire substrate processing apparatus 1 and correct the recipe information described later; a storage unit 322, which stores various information used within the control system 300; an external storage unit 323, which can transmit and receive data by connecting to an external storage medium such as a semiconductor memory; a display unit 327a, which displays various information such as the status of substrate processing; an operation unit 327b, which receives various instructions from operators (specifically, apparatus operators, apparatus managers, apparatus engineers, maintenance personnel, or operators); a communication unit 328, which communicates with an external computer (e.g., a computer host or data server used as a higher-level computer for operating and monitoring multiple substrate processing apparatuses installed in the factory) and other devices; an analysis unit 329, which performs the calculation of deviation quality data and reproducibility index and validity judgment described later; and a monitoring unit 330, which monitors process data from the transport system controller and the process system controller. Here, the monitoring unit 330 may request that the monitoring results be stored in the storage unit 322, or the storage unit 322 may store the monitoring results even without a request from the monitoring unit 330.

[0049] The display unit 327a and the operation unit 327b can be configured with various user interfaces, particularly a graphical user interface (GUI). Furthermore, the display unit 327a can display the editing status of device data and recipe information, process data during substrate processing, the status of the transport system, or other required messages. Additionally, the analysis unit 329 can be configured as a computational mechanism for generating deviation quality data and calculating the reproduction index. The methods for generating deviation quality data and calculating the reproduction index will be described later.

[0050] The transport system controller, connected to the monitoring unit 330, can be configured as a controller for controlling components such as the vacuum transport robot 112 and the atmospheric transport robot 124 that transport the substrate 200. Additionally, the process system controller can be configured as a controller for controlling the structures within the processing chambers 136-139, such as pumps and valves for vacuum exhaust within the chambers, valves for supplying specified gases (e.g., processing gases, inactive gases used as purge gases) to the chambers, or heaters for heating the substrate 200, etc., used when processing the substrate 200. Of course, these controllers can include various sensors (e.g., temperature sensors, pressure sensors, gas flow sensors).

[0051] The information stored in the storage unit 322 mainly includes recipe information that records the steps of processing the substrate 200, device parameters, process data monitored and accumulated by the monitoring unit 330 during the processing of one or more substrates 200, deviation quality data calculated based on the process data, and comparison data for comparison with the deviation quality data.

[0052] Process data refers to device monitoring data collected during formulation execution. This data may include, for example, raw waveform data detected by various sensors from the start to the end of the formulation-based processing, and statistical data (maximum, minimum, average, etc.) for each step within the formulation. The process data may include process data for the conveying system obtained from the conveying system controller, and process data for the process system obtained from the process system controller. Specifically, in this embodiment, the process data at least includes waveform data of temperature, gas flow rate, and pressure during processing in processing chambers 136-139, which are used for calculating the reproducibility index, described later.

[0053] The device parameters may include data related to substrate processing, such as processing temperature, processing pressure, and processing gas flow rate when the substrate processing device 1 processes the substrate 200; data related to the quality of the manufactured substrate (e.g., the thickness of the film after film formation and the cumulative value of the film thickness); or data related to the structural elements of the substrate processing device 1 (quartz reaction tube, heater, valve, mass flow controller, etc.) (e.g., its set values ​​and measured values).

[0054] Deviation quality data is data indicating the degree of deviation of the substrate processing apparatus 1 from a reference quality, and can be data that can be calculated. When calculating this deviation quality data, process data monitored by the monitoring unit 330 and stored in the storage unit 322, and reference process data as a comparison source are used. Here, the reference process data can be process data obtained when the substrate is processed at a quality level higher than a specified level. Furthermore, this reference process data is process data extracted from a comparison apparatus (e.g., an apparatus with the best quality) or from prior experiments, and can consist of process data accumulated during the processing of one substrate 200. As the comparison apparatus, for example, an apparatus that initially has excellent quality data, or a reference apparatus (main apparatus) initially delivered to the factory, etc., can be used. Additionally, data extracted from experiments can be, for example, the best data extracted through various experiments. Furthermore, the specific calculation method for this deviation quality data will be described later.

[0055] The comparison data is data used for comparison with the aforementioned deviation quality data, and can be composed of deviation quality data calculated using data extracted from the device used for comparison (e.g., the device with the best quality) or from previously conducted experiments. Furthermore, although this comparison data and the aforementioned reference process data are data pre-stored in storage unit 322 before determining the validity of the reproducibility index, etc., they can be obtained via a network when the device containing this data is connected to a network, or copied to storage unit 322 via external storage unit 323 using an external storage medium. In the embodiment shown below, the comparison data is obtained from the device used for comparison via a network, and the aforementioned reference process data is obtained from data obtained from previously conducted experiments, etc., via external storage unit 323 or from an external computer connected via a network via communication unit 326 and stored in storage unit 322.

[0056] Figure 3 This is a schematic diagram illustrating one aspect of a substrate processing system including a substrate processing apparatus according to one embodiment of the present invention. The substrate processing apparatus 1 of this embodiment can be, for example... Figure 3 As shown, through multiple (in) Figure 3 The seven substrate processing devices 1(0) to 1(6) are interconnected via a network and are configured to transmit and receive data, forming a substrate processing system S installed in a factory or the like. Furthermore, these multiple substrate processing devices 1(0) to 1(6) can have a common hardware structure and can perform common processing steps. Figure 3 One of the substrate processing devices in the substrate processing system S shown, such as substrate processing device 1 (0), is the main device that is initially delivered to the factory, etc., and has standard device data. The other substrate processing devices, namely the other six substrate processing devices 1 (1) to 1 (6), are devices delivered to the factory, etc., after the main device, and are repeating devices that perform the same processing as the main device by receiving various information from the main device directly or from an external computer (not shown) connected to the network via a network. In the following description, the substrate processing device 1 of this embodiment will be described as a device corresponding to one of the repeating devices (e.g., substrate processing device 1 (1)) among the aforementioned multiple substrate processing devices. Alternatively, the substrate processing device 1 of this embodiment can also be described as a device corresponding to the main device. In this case, the comparison data can be data extracted from experiments, etc.

[0057] In the substrate processing apparatus 1 constituting the repetitive processing unit described above, deviation quality data calculated in the processing chamber of a main apparatus that performs the same processing as that performed in the processing chamber of the substrate processing apparatus 1 can be used as the comparison data. In this way, by using the deviation quality data from the processing chamber of the main apparatus as comparison data, the reproducibility of the processing in the repetitive processing unit relative to the main apparatus can be evaluated. Furthermore, by comparing the deviation quality data calculated in the repetitive processing unit with the deviation quality data calculated in the main apparatus, the production quality in both units can be made consistent. Therefore, the quality of the manufactured substrates produced in the factory can be integrated, thereby improving their manufacturing yield.

[0058] <Semiconductor Device Manufacturing Methods>

[0059] Before explaining the method for generating deviation quality data, an example of a semiconductor device manufacturing method implemented in the substrate processing apparatus 1 of this embodiment will be described. Furthermore, the semiconductor device manufacturing method (substrate processing method) referred to herein will be explained below as referring to the substrate film deposition process, which constitutes a part of it. The semiconductor device manufacturing method using the substrate processing apparatus 1 of this embodiment is not limited to the substrate film deposition process and may include other processes.

[0060] First, in order to implement the semiconductor device manufacturing method described above, recipe information (process recipe) including the desired substrate processing content is expanded into a memory such as RAM (not shown) within the process system controller. Then, as needed, operation instructions are issued from the control system 300 to the process system controller and the transport system controller. The semiconductor device manufacturing method implemented in this way can include at least a loading process, a film deposition process, and a unloading process.

[0061] First, the control system 300 sends a drive instruction to the transfer system controller, pointing to the atmospheric transfer robot 124, etc., to start the transfer process. Thereby, the atmospheric transfer robot 124 begins the transfer process of the substrate 200 from the wafer cassette 100 to the placement chambers 122 and 123. After the substrate 200 is placed in the placement chambers 122 and 123, and the negative pressure in the placement chambers 122 and 123 is adjusted to the same level as that in the vacuum transfer chamber 103, the substrate 200 is then transferred (loaded) into the desired processing chamber (e.g., processing chamber 136) by the vacuum transfer robot 112.

[0062] After the substrate 200 is moved into the processing chamber 136, the control system 300 issues a drive instruction based on the formula information to the process system controller, sealing the entry path of the substrate 200 and making the processing chamber 136 airtight, thus initiating the film formation process according to the aforementioned formula information. As part of the film formation process, for example, the processing chamber 136 is first evacuated at a predetermined film formation pressure (vacuum). Then, the processing chamber 136 is heated to a predetermined temperature using a heater. Next, while maintaining the processing chamber 136 at the predetermined pressure and temperature, a predetermined gas (processing gas) is supplied to the surface of the substrate 200 while the substrate 200 is rotated, and film formation is performed on the substrate 200. Furthermore, adjustments can be made before the subsequent removal process, such as lowering the temperature inside the processing chamber 136 from the processing temperature or stopping the rotation of the substrate 200.

[0063] After the film deposition process is completed, the control system 300 sends a drive instruction to the transfer system controller, pointing to the vacuum transfer robot 112, etc., to start the unloading process. In the unloading process, the processed substrate 200 in the processing chamber 136 is unloaded from the vacuum transfer chamber 103. After being cooled, the unloaded processed substrate 200 is returned to the wafer cassette 100 via the placement chambers 122 and 123 and the atmospheric transfer robot 124 and is transferred there.

[0064] Here, in the aforementioned film-forming process, process data is monitored in parallel with the film-forming process by the monitoring unit 330, and the obtained data is sequentially stored in the storage unit 322. Furthermore, deviation quality data is generated (calculated) using this process data. Additionally, a reproducibility index is calculated by comparing this deviation quality data with comparison data stored in the storage unit 322. If the reproducibility index does not meet the desired value, a correction value for the setting information included in the executed formulation information is calculated and corrected. Therefore, the following describes in detail each step of the aforementioned deviation quality data generation, reproducibility index calculation, reproducibility index validity determination, and setting information correction within the formulation information.

[0065] <Methods for generating deviation quality data>

[0066] Figure 4This is a flowchart illustrating an example of a method for generating deviation quality data in a substrate processing apparatus according to one embodiment of the present invention. The deviation quality data can be generated in the substrate processing apparatus 1, which is a repeating device, for example, when the power is turned on, or when the substrate 200 is moved (loaded) into any processing chamber and placed on a susceptor or boat within the processing chamber, allowing processing operations such as a film deposition process to begin. Furthermore, in the following description, a leaf-shaped processing chamber capable of performing a prescribed film deposition process on the substrate 200 is illustrated. Detailed descriptions of specific structural elements within this processing chamber, which are well-known, are omitted. Moreover, the following description illustrates a structure for generating deviation quality data based on data obtained from a process system controller during substrate processing performed within the processing chamber, but the present invention is not limited to this. Specifically, a structure for generating deviation quality data based on data from a transport system controller can also be used, and can be appropriately adjusted depending on the object of data generation.

[0067] When generating deviation quality data begins, the control system 300 first acquires reference process data y1 (S1) via the communication unit 328. This reference process data y1 can, for example, consist of waveform data from an ideal processing procedure stored in an external computer. Specifically, the waveform data can consist of at least one of the following: waveform data related to temperature changes during process execution, waveform data related to pressure changes, and waveform data related to gas flow rate (including inflow and outflow). In the following description, the case where the reference process data y1 consists of waveform data showing temperature changes in the substrate (or processing chamber) is illustrated.

[0068] After acquiring the reference process data y1, in order to generate deviation quality data, a film deposition process is started on a substrate 200 that has been moved into the processing chamber, following the formulation information. Correspondingly, the monitoring unit 330 operates to monitor the process data during this process. Furthermore, after the film deposition process on the substrate 200 is completed in the substrate processing apparatus 1, waveform data (hereinafter also referred to as "process waveform data") y2, which is related to the processing of the substrate 200, is acquired (S2). The acquired process data y2 can consist of waveform data common to the previously acquired reference process data y1, such as waveform data of substrate temperature changes. The difference between the acquired process data y2 and the previously acquired reference process data y1 is obtained (S3).

[0069] Figure 5This is a graph illustrating an example of temperature changes between baseline process data y1 and comparison data y2, which are used to compare the baseline process data with the baseline process data, after a series of substrate processing steps. (See figure.) Figure 5 As shown, a difference exists in temperature variation between the reference process data y1 and the process data y2 actually measured by the monitoring unit 330. This difference in temperature variation tends to become significant due to mechanical malfunctions of the substrate processing apparatus 1, deterioration over time, etc. Therefore, the difference in temperature variation is acquired at a predetermined time interval t (e.g., a 1-second interval) as the data difference. The values ​​of the differences acquired here are then summed to calculate the sum of the differences (S4). The calculation of this sum of differences x1 can be achieved using the following formula.

[0070]

Number 1

[0071]

[0072] Here, the calculation of the sum of differences is preferably performed on a step-by-step basis in the substrate processing apparatus 1. The steps referred to here are process steps for which different set values ​​can be set in the formula information. Specifically, examples include heating steps in the heating chamber, film formation steps for forming a film on the substrate, N2 purging steps for purging the chamber using N2 (nitrogen) gas as an inactive gas, cooling steps for cooling the processed substrate, loading / unloading steps for moving the substrate into / out of the chamber, APC valve opening / closing steps for opening / closing the APC (Auto Pressure Controller) valve for adjusting the pressure in the chamber, and vacuuming steps for evacuating the chamber. The calculation of the sum of differences is performed repeatedly for all steps included in the formula information. In this way, by extracting the sum of differences on a step-by-step basis, the correction values ​​described later can be reflected on a step-by-step basis. Therefore, since fine adjustments to the set information can be made, reproducibility is easily improved.

[0073] The sum of the differences calculated here is temporarily stored in the storage unit 322. Furthermore, it is determined whether the number of substrates processed (also called the "Run number") n, which is a preset number of substrates required for calculating the deviation quality data, has been reached (S5). If not (no in S5), substrate processing continues with a different substrate being processed (S6). During the continued substrate processing, the acquisition of process data y2 based on the monitoring unit 330 (S2) and the calculation of the difference and the sum of the differences are continued (S3 and S4). Furthermore, although the value of the number of substrates processed n is not particularly limited, it is preferable to set it to multiple. By setting the number of substrates processed n to multiple, deviation quality data can be calculated using multiple process data, thus enabling a more accurate assessment of the substrate processing capability of the substrate processing apparatus 1.

[0074] When substrate processing continues until a predetermined number of substrates n is reached (yes in S5), the sum of process data and associated differences is also stored in the storage unit 322 corresponding to the number of substrates n. Therefore, the stored sum of differences corresponding to n substrates, x1, x2, x3, ..., x..., is then calculated. n average value (x) (S7). The average value can be calculated using the following formula.

[0075]

Number 2

[0076]

[0077] After calculating the mean, the unbiased variance s is then calculated. 2 (S8). The calculation of unbiased variance can be achieved using the following formula.

[0078]

Number 3

[0079]

[0080] Furthermore, the mean and unbiased variance values ​​calculated here can be calculated in steps, just like the calculation of the sum of differences.

[0081] Furthermore, the average value calculated through the above procedures will be... and unbiased variance s 2Deviation quality data (for each step) of the Run number n of one processing chamber of the substrate processing apparatus 1 is stored in the storage unit 322. This completes the generation of deviation quality data for one processing chamber of the substrate processing apparatus 1. Furthermore, in the above-described method for calculating deviation quality data, only the case where the process data consists of waveform data of temperature changes is described. However, deviation quality data can be calculated using other process data, such as waveform data of gas flow rate and / or waveform data of pressure changes, either separately or in parallel. Moreover, it is preferable to pre-calculate multiple deviation quality data points for one processing chamber of the substrate processing apparatus 1 so that multiple reproducibility indices (described later) can be calculated based on different data. Furthermore, the method for calculating deviation quality data using these other process data is almost identical to the method described above, and therefore, its description is omitted here to avoid repetition.

[0082] Figure 6 It is a schematic representation Figure 4 The diagram illustrates the method for generating deviation quality data. (See figure.) Figure 6 As shown, the method for generating the above series of deviation quality data is not limited to generating only one processing chamber (e.g., processing chamber 136) of the substrate processing apparatus 1 (e.g., substrate processing apparatus 1(1)) of this embodiment, but can also be generated in other processing chambers. Other processing chambers may include other processing chambers within the substrate processing apparatus 1 that perform common processing, processing chambers in other substrate processing apparatuses 1(0) constituting the main device or other remote devices that perform processing common to the above-mentioned processing chamber. Here, as described above, in this embodiment, the deviation quality data of the processing chamber of the substrate processing apparatus 1(0) constituting the main device is used as comparison data, so the deviation quality data can also be calculated in advance in one processing chamber of the substrate processing apparatus 1(0).

[0083] <Method for calculating the reproducibility index>

[0084] Following the above, the method for calculating the reproduction index in the substrate processing apparatus 1 of this embodiment, and the method for judging the effectiveness of the processing in the substrate processing apparatus 1 using the calculated reproduction index, will be described below. The reproduction index can be an index indicating the degree to which the substrate processing performed by the substrate processing apparatus 1 accurately reproduces the desired substrate processing that is being compared. By using this reproduction index, the process differences between apparatuses or processing chambers can be quantitatively expressed, thereby making it easy to identify reproducibility. In this embodiment, the value indicating the degree of reproduction when the substrate processing apparatus 1 reproduces the substrate processing performed by the main apparatus corresponds to this reproduction index. Furthermore, the processes described below can be mainly implemented by the analysis unit 329 of the substrate processing apparatus 1.

[0085] Figure 7 This is a flowchart illustrating an example of a method for calculating the reproduction index in a substrate processing apparatus according to one embodiment of the present invention. In calculating the reproduction index in the substrate processing apparatus of this embodiment, firstly, deviation quality data of the substrate processing apparatus 1 (0), which is the main apparatus, is acquired as comparison data (S11). This acquisition of deviation quality data of the substrate processing apparatus 1 (0), which is the main apparatus, can be performed, for example, via a network using the communication unit 326, and the acquired data is stored in the storage unit 322. Furthermore, both the comparison data acquired here and the deviation quality data generated by the substrate processing apparatus 1 are generated step-by-step. Therefore, the reproduction index calculated based on this data is also determined step-by-step.

[0086] After the comparison data is stored, a t-test (S12) is performed to determine the reproducibility index based on the comparison data and the pre-calculated deviation quality data of the substrate processing apparatus 1. The t-test can be performed using the following formula.

[0087]

Number 4

[0088]

[0089] in,

[0090]

Number 5

[0091]

[0092] Here, t refers to the t-test value. The average of the sums of the differences in the comparison data is referred to as n1, which is the number of Runs in the comparison data, and s1 is the average of the sums of the differences in the comparison data. 2 The unbiased variance of the data being compared. n2 refers to the average of the sum of the differences in the deviation quality data (of the substrate processing apparatus 1), n2 refers to the Run number as the deviation quality data, and s2 refers to the average of the differences in the deviation quality data. 2 The unbiased variance, s, refers to the unbiased variance of the deviation quality data. 2 The variance after combining the unbiased variances of the two samples is the variance obtained by summing them up.

[0093] After determining the t-test value using the above formula, the probability value (p-Value)p is then calculated based on the t-test value (S13). The probability value p can be calculated, for example, from a t-distribution table expressed in terms of t-test values.

[0094] After calculating the probability value p, the reproducibility index (S14) is then calculated using this probability value p. This reproducibility index can be expressed as reproducibility index = (1-p) × 100. Furthermore, in the t-test described above, t cannot be calculated when s is 0. Therefore, in this case, p is set to 0, and the reproducibility index is set to 100.

[0095] Figure 8 This diagram illustrates an example of a device parameter table stored in the storage unit of a substrate processing apparatus according to one embodiment of the present invention. After the reproduction index is calculated in the above process, the analysis unit 329 obtains a lower limit value (S15) for determining the validity of the reproduction index. Figure 8 As shown, this lower limit value can be stored in an appropriate location within the device parameter table that constitutes the device parameters stored in the storage unit 322. Furthermore, this lower limit value is a value predetermined by the administrator or others, and functions as a threshold for the reproduction index.

[0096] Next, the obtained lower limit value and the calculated reproduction index are compared to determine the validity of the reproduction index (S16). Specifically, it is determined whether the value of the reproduction index is greater than the lower limit value. If the reproduction index is above the lower limit value (yes in S16), it is determined that the reproducibility of the substrate processing performed based on the substrate processing apparatus 1 (relative to the processing in the main apparatus) is high, and the processing is considered to be proceeding normally and ends. Figure 7 The processing shown.

[0097] Conversely, if the reproducibility index is lower than the lower limit (not in S16), it is determined that the reproducibility of the substrate processing performed based on the substrate processing apparatus 1 is low, and the processing is considered to have a potential for abnormality. In this case, the analysis unit 329 calculates a correction value for correcting the setting information included in the formula information (S17). When considering the calculation method of this correction value, in addition to the value of the reproducibility index, the type of process data used to calculate the reproducibility index and the corresponding equipment in the processing chamber can also be considered and set in an automatic calculation manner. For example, it can be preset that after calculating the reproducibility index based on process data related to temperature changes, if the determination result is that the reproducibility index is lower than the lower limit, the analysis unit 329 automatically calculates a correction value for raising or lowering the target temperature of the heater operating in the corresponding step in the corresponding processing chamber at any time point. In this way, by automatically identifying and calculating the process type, the target step, the current setting value, and the correction value, the time required for apparatus adjustment can be shortened. Furthermore, the determination of the specific correction value does not necessarily need to be automatically performed by the analysis unit 329. For example, the correction value can be determined by notifying any operator at the point when the reproducibility index is detected to be lower than the lower limit, and requesting the input of a correction value via the operation unit 327b. At this time, various information used to determine the correction value can be displayed on the display unit 327a.

[0098] Figure 9This diagram illustrates an example of a condition change instruction information table used to correct setting information contained in the formula information. After the correction value is calculated by the analysis unit 329, the control unit 320 notifies the process system controller of the correction value, thereby correcting the setting information contained in the formula information (S18). When performing this correction, it is preferable to use... Figure 9 The table showing condition change instruction information is as follows. Figure 9 As shown, this condition change instruction information table, by including at least the processing room number, recipe name, step number, process category information to be changed, and specific correction value, enables proper correction at the process system controller side. Furthermore, this condition change instruction information table can be stored in the storage unit 322.

[0099] When the setting information contained in the formula information is corrected, the substrate processing device 1 notifies the subject (S19) and ends the process. Figure 7 The processing is shown. Various methods can be used as the method of notification. For example, a message related to the correction can be displayed on the display unit 327a of the control system 300, or the situation of a correction being made or an anomaly being detected can be communicated to the operator using voice or visual effects. Alternatively, a method can be used to communicate the correction to the administrator by sending a message containing information such as the subject of the anomaly, the subject of the correction, or the correction result (formula information) via the communication unit 326, and displaying the message on the external computer, such as a computer host. Furthermore, in Figure 7 The example shows that the operator is notified after a correction is made, but the notification can also be made before the correction is made, for example, when the calculated reproducibility index is detected to be below the lower limit (no in S16).

[0100] Regarding the aforementioned reproducibility index, it is preferable to calculate multiple indices using deviation quality data and comparative data generated from different types of process data (e.g., temperature monitoring data, gas flow monitoring data, and pressure monitoring data). By performing validity judgments on multiple reproducibility indices calculated for a single processing chamber, the reproducibility of substrate processing performed on the substrate processing apparatus 1 can be evaluated from multiple perspectives.

[0101] Furthermore, as described above, since the deviation quality data and comparison data are calculated step-by-step, and the reproducibility index is also calculated step-by-step, when a reproducibility index lower than the lower limit is detected, the object requiring correction can be limited to a specific step. Therefore, fine adjustments can be made, and the correction value can be determined more easily.

[0102] Furthermore, by executing a program that can be stored in the memory of a computer, such as the computer constituting the control system 300 or the computer host, the processor can execute the aforementioned series of semiconductor device manufacturing methods. Additionally, this program can be provided in the form of an application provided by a server device configured on a network or a cloud-based data processing platform, or it can be provided in the form of a non-transitory computer-readable recording medium.

[0103] As described above, the substrate processing apparatus, semiconductor device manufacturing method, and process according to this embodiment can evaluate the production quality of processing performed on the substrate processing apparatus without using additional measuring devices. This allows for easy integration of production quality with other substrate processing apparatuses. Furthermore, by determining the effectiveness of the reproducibility index, a decrease in process reproducibility can be detected, thereby enabling the detection or prediction of abnormalities. Moreover, when the reproducibility index is detected to be lower than a preset value, an optimal correction value can be determined based on a series of judgments, in addition to the process type requiring correction and the set value, thus shortening the adjustment time when abnormalities occur.

[0104] Furthermore, the aforementioned modifications can also address maintenance required to address the deterioration of the equipment over the years. Moreover, the adjustments made easier by using repetitive equipment that operates under the same conditions as the main unit facilitate the rapid commencement of production.

[0105] <Preferred Embodiments of the Invention>

[0106] The preferred embodiments of the present invention are described below.

[0107] (Postscript 1)

[0108] According to one aspect of the present invention, a substrate processing apparatus is provided, comprising:

[0109] The processing chamber is where the substrate is processed;

[0110] The storage unit stores formula information that records the steps of processing the substrate, process data accumulated during the processing of multiple substrates, deviation quality data calculated based on the process data, and comparison data for comparison with the deviation quality data.

[0111] The monitoring unit monitors the aforementioned process data and requests the storage unit to store the aforementioned process data.

[0112] The analysis unit compares the aforementioned deviation quality data and the aforementioned comparison data, calculates a reproducibility index representing the reproducibility relative to the aforementioned comparison data, and calculates a correction value for the setting information included in the aforementioned formula information if the reproducibility index is lower than a predetermined value; and

[0113] The control unit is capable of correcting the setting information contained in the above-mentioned formula information using the correction value.

[0114] (Postscript 2)

[0115] In the apparatus described in Appendix 1,

[0116] It also has a communication unit for communicating with external computers or other external devices.

[0117] It is configured to receive the comparison data from the external computer or other external device via the communication unit and store the comparison data in the storage unit.

[0118] (Note 3)

[0119] In the apparatus described in Appendix 1,

[0120] The aforementioned deviation quality data is obtained by summing the differences per unit time based on process data accumulated during the processing of one substrate and process data used as a baseline, and by calculating the average value and unbiased variance of the sum of the differences corresponding to the number of substrates processed repeatedly.

[0121] The aforementioned process data used as a benchmark is obtained from process data obtained from an apparatus that processes substrates at a quality level of or higher than a specified grade.

[0122] The above average value is obtained by dividing the sum of the above differences by the number of processed substrates.

[0123] The above unbiased variance is calculated based on the sum and average of the differences corresponding to the number of processed substrates.

[0124] (Postscript 4)

[0125] In the apparatus described in Appendix 1,

[0126] The above formula information includes at least one step.

[0127] The above steps allow for the setting of data for each type of process information, which includes at least one of the following: temperature setpoint, gas flow rate setpoint, and pressure setpoint.

[0128] The aforementioned process data includes at least one of temperature, gas flow rate, and pressure control data, and is process monitoring data sequentially reported by the monitoring unit during the aforementioned processing of one of the aforementioned substrates.

[0129] The above-mentioned deviation quality data were calculated using the above-mentioned process data in units of the above-mentioned steps.

[0130] (Note 5)

[0131] In the apparatus described in Appendix 1,

[0132] The t-test and p-value were calculated using the above deviation quality data and the above comparison data.

[0133] The recurrence index is derived from the calculated probability values.

[0134] (Note 6)

[0135] In the apparatus described in Appendix 1,

[0136] The validity of the aforementioned reproducibility index is determined using the predetermined values ​​mentioned above.

[0137] (Note 7)

[0138] In the apparatus described in Appendix 1,

[0139] The predetermined value mentioned above represents the threshold value of the reproduction index recorded in the device parameters stored in the storage unit.

[0140] (Postscript 8)

[0141] In the apparatus described in Appendix 1,

[0142] It also has a display unit capable of displaying the processing status of the aforementioned substrate.

[0143] (Note 9)

[0144] In the device described in Appendix 8,

[0145] When the reproduction index is lower than the predetermined value, the display unit displays the corresponding message data.

[0146] (Postscript 10)

[0147] In the apparatus described in Appendix 1,

[0148] When the reproduction index is lower than a predetermined value, the control unit uses the correction value to change the setting value of the object formula stored in the storage unit.

[0149] (Postscript 11)

[0150] In the apparatus described in Appendix 2,

[0151] If the aforementioned reproduction index is lower than a predetermined value, the aforementioned communication unit will send the corresponding message to the aforementioned external computer or other external device.

[0152] (Postscript 12)

[0153] In the apparatus described in Appendix 1,

[0154] If the reproducibility index is the same as or exceeds a predetermined value, the analysis unit determines that the data is reproducible relative to the comparison data.

[0155] (Postscript 13)

[0156] According to another aspect of the present invention, a method for manufacturing a semiconductor device or a substrate processing method is provided, comprising the following steps:

[0157] The process of moving the substrate into the processing chamber;

[0158] Based on the formula information that describes the steps for processing the substrate, the substrate is processed in the processing chamber, and the process data is monitored and stored in the storage unit.

[0159] The process of calculating deviation quality data based on multiple of the above process data;

[0160] The process involves comparing the aforementioned deviation quality data with the comparison data stored in the aforementioned storage unit, calculating a reproducibility index representing the reproducibility relative to the aforementioned comparison data, and, if the reproducibility index is lower than a predetermined value, calculating a correction value for the setting information included in the aforementioned formula information; and

[0161] The process of correcting the setting information contained in the above formula information using the above correction value.

[0162] (Postscript 14)

[0163] According to another aspect of the present invention, a program or a non-transitory computer-readable recording medium recording the program is provided, which causes a substrate processing apparatus to perform the following steps via a computer:

[0164] The step of moving the substrate into the processing chamber;

[0165] Based on the formula information that describes the steps of performing the above-mentioned substrate processing, the above-mentioned substrate is processed in the above-mentioned processing chamber, and the steps of monitoring the process data and storing the above-mentioned process data in the storage unit are performed.

[0166] The steps include: calculating deviation quality data based on multiple process data; comparing the deviation quality data with the comparison data stored in the storage unit; determining a reproducibility index representing the reproducibility relative to the comparison data; and calculating a correction value for the setting information included in the formula information if the reproducibility index is lower than a predetermined value.

[0167] The step of correcting the setting information contained in the above formula information using the above correction value.

[0168] The above embodiments are merely illustrative examples, and therefore the present invention is not limited to these embodiments. Various modifications and implementations can be made without departing from the spirit of the invention. Furthermore, all such modifications are included within the technical concept of the present invention. Additionally, in the present invention, each structural element may exist as one or more, provided there is no contradiction.

Claims

1. A substrate processing apparatus, characterized in that, have: The processing chamber is where the substrate is processed; The storage unit stores formula information that records the steps of processing the substrate, process data accumulated during the processing of multiple substrates, deviation quality data calculated based on the process data, and comparison data for comparison with the deviation quality data, wherein the deviation quality data represents the degree of deviation relative to a benchmark quality. The monitoring unit monitors the process data. The analysis unit compares the deviation quality data and the comparison data, calculates a reproducibility index representing the reproducibility relative to the comparison data, and calculates a correction value for the setting information contained in the formula information if the reproducibility index is lower than a predetermined value. and The control unit is capable of using the correction value to correct the setting information contained in the formula information. The deviation quality data is obtained as follows: A process is performed to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the baseline process data. The average value and unbiased variance are calculated based on the sum of the differences corresponding to the number of substrates processed repeatedly across multiple substrates. The baseline process data is the process data obtained when substrate processing is performed at a quality level above a specified level. The average value is the value obtained by dividing the sum of the differences corresponding to the number of substrates processed by the number of substrates processed. The unbiased variance is the value calculated based on the sum of the differences corresponding to the number of substrates processed and the average value.

2. The substrate processing apparatus as claimed in claim 1, characterized in that, It also has a communication unit for communicating with external computers or other external devices. The device is configured to receive the comparison data from the external computer or other external device via the communication unit and store the comparison data in the storage unit.

3. The substrate processing apparatus as claimed in claim 1, characterized in that, The formulation information has at least one step in which data can be set for each type of process information, which includes at least one of temperature setpoint, gas flow rate setpoint, and pressure setpoint. The process data is at least one of temperature, gas flow rate, and pressure control process data, which is process monitoring data reported sequentially by the monitoring unit during the processing of one of the substrates. The deviation quality data is calculated using the process data in units of the steps.

4. The substrate processing apparatus as claimed in claim 1, characterized in that, Based on the deviation quality data and the comparison data, a probability value, i.e., p-value, is calculated using a t-test, and the reproducibility index is determined based on the calculated probability value.

5. The substrate processing apparatus as claimed in claim 1, characterized in that, The validity of the reproducibility index is determined using the predetermined value.

6. The substrate processing apparatus as claimed in claim 1, characterized in that, The predetermined value represents the threshold value of the reproduction index recorded in the device parameters stored in the storage unit.

7. The substrate processing apparatus as claimed in claim 1, characterized in that, It also has a display unit capable of displaying the processing status of the substrate.

8. The substrate processing apparatus as claimed in claim 7, characterized in that, When the reproduction index is lower than the predetermined value, the display unit displays the corresponding message data.

9. The substrate processing apparatus as claimed in claim 1, characterized in that, If the reproduction index is lower than a predetermined value, the control unit uses the correction value to change the setting value of the object formula stored in the storage unit.

10. The substrate processing apparatus as claimed in claim 2, characterized in that, If the reproduction index is lower than a predetermined value, the communication unit will send a corresponding message to the external computer or the other external device.

11. The substrate processing apparatus as claimed in claim 1, characterized in that, The analysis unit determines that the reproducibility is relative to the comparison data when the reproducibility index is the same as or exceeds a predetermined value.

12. A method for manufacturing a semiconductor device, characterized in that, It includes the following processes: The process of moving the substrate into the processing chamber; Based on the recipe information which describes the steps for processing the substrate, the substrate is processed in the processing chamber, and the process of monitoring the process data and storing the process data in the storage unit is performed. The process of calculating deviation quality data, representing the degree of deviation relative to a benchmark quality, based on multiple process data. The process of comparing the deviation quality data with the comparison data stored in the storage unit, determining a reproducibility index representing the reproducibility relative to the comparison data, and calculating a correction value for the setting information included in the formula information if the reproducibility index is lower than a predetermined value; and The process of correcting the setting information contained in the formula information using the correction value. The deviation quality data is obtained as follows: A process is performed to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the baseline process data. The average value and unbiased variance are calculated based on the sum of the differences corresponding to the number of substrates processed repeatedly across multiple substrates. The baseline process data is the process data obtained when substrate processing is performed at a quality level above a specified level. The average value is the value obtained by dividing the sum of the differences corresponding to the number of substrates processed by the number of substrates processed. The unbiased variance is the value calculated based on the sum of the differences corresponding to the number of substrates processed and the average value.

13. A recording medium, being a non-transitory, computer-readable recording medium, recording a program, characterized in that, The program causes the substrate processing device to perform the following steps via a computer: The step of moving the substrate into the processing chamber; Based on the recipe information that describes the steps of performing the processing of the substrate, the substrate is processed in the processing chamber, and the steps of monitoring the process data and storing the process data in the storage unit are performed. The step of calculating deviation quality data, representing the degree of deviation relative to a benchmark quality, based on multiple process data. The steps include comparing the deviation quality data with the comparison data stored in the storage unit, determining a reproducibility index that represents the reproducibility relative to the comparison data, and calculating a correction value for the setting information contained in the formula information if the reproducibility index is lower than a predetermined value. as well as The step of correcting the setting information contained in the formula information using the correction value. The deviation quality data is obtained as follows: A process is performed to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the baseline process data. The average value and unbiased variance are calculated based on the sum of the differences corresponding to the number of substrates processed repeatedly across multiple substrates. The baseline process data is the process data obtained when substrate processing is performed at a quality level above a specified level. The average value is the value obtained by dividing the sum of the differences corresponding to the number of substrates processed by the number of substrates processed. The unbiased variance is the value calculated based on the sum of the differences corresponding to the number of substrates processed and the average value.

14. A recipe editing method, characterized in that, It includes the following processes: Based on multiple process data monitored during the processing of the substrate in the processing chamber according to the formula information that describes the steps of processing the substrate, a process is used to calculate deviation quality data that represents the degree of deviation relative to a benchmark quality. The process involves comparing the deviation quality data with the comparison data stored in the storage unit, determining a reproducibility index representing the reproducibility relative to the comparison data, and calculating a correction value for the setting information included in the formula information if the reproducibility index is lower than a predetermined value; and... The process of correcting the setting information contained in the formula information using the correction value. The deviation quality data is obtained as follows: A process is performed to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the baseline process data. The average value and unbiased variance are calculated based on the sum of the differences corresponding to the number of substrates processed repeatedly across multiple substrates. The baseline process data is the process data obtained when substrate processing is performed at a quality level above a specified level. The average value is the value obtained by dividing the sum of the differences corresponding to the number of substrates processed by the number of substrates processed. The unbiased variance is the value calculated based on the sum of the differences corresponding to the number of substrates processed and the average value.

15. A substrate processing apparatus, characterized in that, have: The processing chamber is where the substrate is processed; The storage unit stores formula information recording the steps of processing the substrate, process data accumulated during multiple processing of the substrate in the processing chamber based on the formula information, reference process data obtained when the substrate is processed with a quality of a specified level or higher, deviation quality data, and comparison data for comparison with the deviation quality data. The deviation quality data is obtained by repeatedly performing a process in multiple substrates to calculate the sum of differences between the process data accumulated during the processing of one substrate and the reference process data per unit time. The monitoring unit monitors the process data. The analysis unit compares the deviation quality data and the comparison data, calculates a reproducibility index representing the reproducibility relative to the comparison data, and calculates a correction value for the setting information contained in the formula information if the reproducibility index is lower than a predetermined value. and The control unit is capable of correcting the setting information contained in the recipe information using the correction value.

16. A method for manufacturing a semiconductor device, characterized in that, It includes the following processes: The process of moving the substrate into the processing chamber; Based on the formula information that records the steps for processing the substrate, the substrate is processed multiple times in the processing chamber, and the process data during the multiple processing of the substrate is monitored, and the reference process data obtained when the substrate is processed at a quality level above a specified level is stored in the storage unit. The process of calculating and storing deviation quality data is obtained by repeatedly performing a process on multiple substrates to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the reference process data. The process of comparing the deviation quality data with the comparison data stored in the storage unit, determining a reproducibility index that represents the reproducibility relative to the comparison data, and calculating a correction value for the setting information contained in the formula information if the reproducibility index is lower than a predetermined value; as well as The process of correcting the setting information contained in the formula information using the correction value.

17. A recipe editing method, characterized in that, It includes the following processes: The deviation quality data is calculated by repeatedly performing a process in a processing chamber to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the reference process data obtained when the substrate is processed at a quality level of or higher, relative to the process data monitored during the multiple processing of the substrate based on the formula information that records the steps of processing the substrate. The process of comparing the deviation quality data and the comparison data to determine the reproducibility index relative to the comparison data, and calculating the correction value of the setting information contained in the formula information if the reproducibility index is lower than a predetermined value; as well as The process of correcting the setting information contained in the formula information using the correction value.

18. A recording medium, a non-transitory computer-readable recording medium, recording a program, characterized in that, The program causes the substrate processing device to perform the following steps via a computer: The step of moving the substrate into the processing chamber; Based on the formula information that describes the steps of processing the substrate, the substrate is processed multiple times in the processing chamber, and the process data during the multiple processing of the substrate is monitored, and the reference process data obtained when the substrate is processed at a quality level above a specified level is stored in the storage unit. The step of calculating and storing deviation quality data is obtained by repeatedly performing a process across multiple substrates to calculate the sum of the differences per unit time between the process data accumulated during the processing of one substrate and the reference process data. The deviation quality data is compared with the comparison data stored in the storage unit to determine a reproducibility index that represents the reproducibility relative to the comparison data. The step of calculating the correction value of the setting information contained in the formula information when the reproducibility index is lower than a predetermined value; as well as The step of correcting the setting information contained in the formula information using the correction value.

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