A die bonder die bonder fixture

Abstract

The application relates to the field of die bonder and discloses a die bonder die bonder clamp, which effectively solves the problem of poor clamping effect of a wafer disc side wall by two side clamps and easy wafer disc deflection, and comprises a work platform, the top end of the work platform is provided with a wafer disc, the top end of the work platform is provided with a first clamping assembly, the first clamping assembly comprises symmetrical grooves arranged at the top end of the work platform, and the inside of the work platform is rotationally connected with a screw rod, the application is characterized in that the motor is started, the output shaft of the motor drives the screw rod to rotate, the two sliding blocks are driven to move close to each other, the two first clamps are driven to move to one side of the wafer disc, when the first clamps are in contact with the outer wall of the wafer disc, the mounting block continues to move to the first clamps, the first spring is compressed, the two first clamps clamp the wafer disc under the elastic force of the first spring, and the wafer disc is conveniently fixed.

Description

Technical Field

[0001] This invention belongs to the field of die bonders, specifically a die bonder fixture. Background Technology

[0002] The wafer rack in a die bonder is a wafer disk, typically circular in shape, densely packed with wafers, usually square. When a wafer is needed, it is transferred using a negative pressure suction nozzle. During this transfer, the wafer disk must be kept stationary to prevent misalignment during pick-up. Clamping devices are usually clamps on both sides of the wafer disk. As the clamps move towards the wafer disk, they clamp it, thus securing it. However, the following drawbacks still exist:

[0003] The wafer disk is clamped by clamping the side walls with two side plates, but the clamping effect is not good and the wafer disk is prone to deflection. Summary of the Invention

[0004] In view of the above situation and to overcome the defects of the prior art, the present invention provides a die bonding machine die bonding fixture, which effectively solves the problem that the current method of clamping the side walls of the wafer disk with two side plates is not effective and easily causes the wafer disk to deflect.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a die bonding machine die bonding fixture, comprising a working platform, a wafer disk being provided at the top of the working platform, and a first clamping component being installed at the top of the working platform;

[0006] The first clamping assembly includes symmetrically arranged grooves at the top of the work platform. A screw is rotatably connected inside the work platform and is located inside the groove. One end of the screw is fixedly connected to the output shaft of a motor. The motor is fixedly connected to the work platform. A threaded groove is formed on the outer side of the portion of the screw inside the groove, and the two threaded grooves are opened in opposite directions. A slider is slidably connected inside the groove and is threadedly connected to the screw. An installation block is installed at the top of the slider. A first clamping plate is provided on the side of the two installation blocks that are close to each other. Insert rods are symmetrically installed on the side of the first clamping plate that is close to the installation blocks. The insert rods are movably connected inside the first connecting groove, which is symmetrically opened inside the installation blocks.

[0007] Preferably, the side of the first clamping plate away from the mounting block is adapted to the outer wall of the wafer disk, and a first spring is symmetrically installed on the side of the mounting block near the first clamping plate. One end of the first spring is fixedly connected to the first clamping plate. A negative pressure adsorption assembly is installed on the outside of the first clamping plate, and a limiting plate is installed on one end of the insertion rod. The limiting plate is located on the side of the mounting block away from the first clamping plate.

[0008] Preferably, the negative pressure adsorption assembly includes an inner groove opened inside the first clamping plate, negative pressure holes are equidistantly opened on the side of the inner groove away from the mounting block, a connecting pipe is installed on the other side of the first clamping plate, the connecting pipe is movably connected to the inside of the second connecting groove, the second connecting groove is opened inside the mounting block, a piston tube is installed on the outer side of one end of the connecting pipe, and the piston tube is located on the side of the mounting block away from the first clamping plate.

[0009] Preferably, two negative pressure fans are installed at the top of the working platform, and a first pipe is installed on one side of the negative pressure fans. The interiors of the two first pipes are slidably connected to two piston pipes, and the first pipes are connected to the interior of the connecting pipe.

[0010] Preferably, a second pipe is installed on the other side of the negative pressure fan, and an auxiliary clamping unit is installed inside one end of the second pipe. The auxiliary clamping units are symmetrically arranged on the front and back of the wafer disk.

[0011] Preferably, the auxiliary clamping unit includes a piston block movably connected inside the second pipe. A connecting rod is installed on the side of the piston block near the wafer disk. A second clamping plate is installed at one end of the connecting rod. The side of the second clamping plate near the wafer disk is adapted to the wafer disk. Fixing blocks are symmetrically installed on both sides of the second pipe. A second spring is installed on the side of the fixing block near the second clamping plate. One end of the second spring is fixedly connected to the second clamping plate. A clamping assembly is installed inside the second clamping plate.

[0012] Preferably, the clamping assembly includes movable grooves symmetrically formed on both sides of the second clamping plate, a connecting groove is formed on the side of the movable groove near the wafer disk, and an installation groove is formed on the side of the connecting groove near the wafer disk, with the installation groove extending through to the front of the second clamping plate.

[0013] Preferably, a first movable block is slidably connected inside the movable groove, and a third spring is installed on one side of the two first movable blocks that are close to each other. One end of the third spring is fixedly connected to the inner wall of the movable groove. A friction rod is installed inside the mounting groove, and a rotating rod is installed between the first movable block and the friction rod. The two ends of the rotating rod are rotatably connected to the first movable block and the friction rod, respectively.

[0014] Preferably, a fourth spring is installed on the side of the first movable block away from the third spring, a second movable block is installed on one end of the fourth spring, and an electromagnet is installed on the other side of the second movable block. Both electromagnets are externally powered, and the two electromagnets have opposite magnetic properties.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] (1) In this invention, by turning on the motor, the output shaft of the motor drives the screw to rotate, which drives the two sliders to move closer to each other, thereby pushing the two first clamping plates to move towards one side of the wafer disk. When the first clamping plate contacts the outer wall of the wafer disk, the mounting block continues to move towards the first clamping plate, causing the first spring to compress. Thus, under the elastic force of the first spring, the two first clamping plates clamp the wafer disk, which facilitates the fixing of the wafer disk.

[0017] (2) The invention uses the rotation of the fan blades inside the negative pressure fan to drive the air inside the first pipe into the second pipe, thereby generating negative pressure inside the inner groove, which improves the tightness between the first clamping plate and the wafer disk and improves the clamping effect of the wafer disk. At the same time, the air pressure inside the second pipe increases, pushing the piston block to move towards the wafer disk, so that the two second clamping plates clamp and fix the wafer disk, thereby further improving the clamping effect of the wafer disk.

[0018] (3) The invention uses two electromagnets to energize two second movable blocks, which bring the two second movable blocks closer together, increasing the pressure of the fourth spring on the first movable block. This, in turn, increases the outward pushing force of the first movable block on the friction rod through the rotating rod. Since one end of the friction rod is in close contact with the outer wall of the wafer disk, the friction force of the friction rod on the wafer disk increases after the pressure increases, thereby improving the clamping effect on the wafer disk. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0020] In the attached diagram:

[0021] Figure 1 This is a schematic diagram of the structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of the first clamping component of the present invention;

[0023] Figure 3 This is a schematic diagram of the first clamping plate structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the second pipeline structure of the present invention;

[0025] Figure 5 This is a schematic diagram of the auxiliary clamping unit structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the clamping component structure of the present invention;

[0027] In the diagram: 1. Working platform; 2. Wafer disk; 3. First clamping assembly; 301. Slide groove; 302. Screw; 303. Motor; 304. Slider; 305. Mounting block; 306. First connecting groove; 307. Insert rod; 308. First clamping plate; 309. First spring; 310. Limiting plate; 4. Negative pressure adsorption assembly; 401. Second connecting groove; 402. Connecting pipe; 403. Piston pipe; 404. Inner groove; 405. Negative pressure hole; 406. Negative pressure fan; 407. 408. First pipe; 409. Second pipe; 409. Auxiliary clamping unit; 4091. Piston block; 4092. Connecting rod; 4093. Second clamping plate; 4094. Fixing block; 4095. Second spring; 5. Pressing assembly; 501. Movable groove; 502. Connecting groove; 503. Mounting groove; 504. Third spring; 505. First movable block; 506. Rotating rod; 507. Friction rod; 508. Fourth spring; 509. Second movable block; 510. Electromagnet. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0029] Example 1, by Figures 1-6The present invention includes a working platform 1, a wafer disk 2 at the top of the working platform 1, and a first clamping assembly 3 mounted at the top of the working platform 1. The first clamping assembly 3 includes symmetrically formed grooves 301 at the top of the working platform 1. A screw 302 is rotatably connected inside the working platform 1, and the screw 302 is located inside the grooves 301. One end of the screw 302 is fixedly connected to the output shaft of a motor 303, which is fixedly connected to the working platform 1. A threaded groove is formed on the outer side of the portion of the screw 302 inside the grooves 301, and the two threaded grooves are formed in opposite directions. A slider 304 is slidably connected inside the grooves 301, and the slider 304 is threadedly connected to the screw 302. A mounting block 305 is mounted on the top of the slider 304. A first clamping plate 308 is provided on one side of the mounting blocks 305 that are close to each other. Insert rods 307 are symmetrically installed on the side of the first clamping plate 308 that is close to the mounting blocks 305. Insert rods 307 are movably connected to the inside of the first connecting groove 306. The first connecting groove 306 is symmetrically opened inside the mounting blocks 305. The side of the first clamping plate 308 that is away from the mounting blocks 305 is adapted to the outer wall of the wafer disk 2. A first spring 309 is symmetrically installed on the side of the mounting blocks 305 that is close to the first clamping plate 308. One end of the first spring 309 is fixedly connected to the first clamping plate 308. A negative pressure adsorption component 4 is installed on the outside of the first clamping plate 308. A limiting plate 310 is installed on one end of the insert rod 307. The limiting plate 310 is located on the side of the mounting block 305 that is away from the first clamping plate 308.

[0030] In use, the wafer disk 2 is placed on top of the work platform 1 between the two first clamping plates 308. Then, the motor 303 is turned on, causing the output shaft of the motor 303 to drive the screw 302 to rotate. Since the slider 304 is threadedly connected to the screw 302, the rotation of the screw 302 causes the two sliders 304 to move closer to each other, thereby causing the first clamping plates 308 on both sides of the wafer disk 2 to move towards one side of the wafer disk 2. When the first clamping plate 308 contacts the outer wall of the wafer disk 2, the mounting block 305 continues to move towards the first clamping plate 308, causing the first spring 309 to compress. Under the elastic force of the first spring 309, the two first clamping plates 308 clamp the wafer disk 2, which facilitates the fixation of the wafer disk 2.

[0031] In Example 2, based on Example 1, the negative pressure adsorption assembly 4 includes an inner groove 404 formed inside the first clamping plate 308. Negative pressure holes 405 are equidistantly formed on the side of the inner groove 404 away from the mounting block 305. A connecting pipe 402 is installed on the other side of the first clamping plate 308. The connecting pipe 402 is movably connected to the interior of a second connecting groove 401, which is formed inside the mounting block 305. A piston pipe 403 is installed on the outer side of one end of the connecting pipe 402. The piston pipe 403 is located on the mounting block 305 away from the first clamping plate 305. On one side of a clamping plate 308, two negative pressure fans 406 are installed at the top of the work platform 1. A first pipe 407 is installed on one side of the negative pressure fan 406. The interior of the two first pipes 407 is slidably connected to two piston pipes 403 respectively, and the first pipes 407 are connected to the interior of the connecting pipe 402. A second pipe 408 is installed on the other side of the negative pressure fan 406. An auxiliary clamping unit 409 is installed inside one end of the second pipe 408. The auxiliary clamping units 409 are symmetrically arranged on the front and back of the wafer disk 2.

[0032] The auxiliary clamping unit 409 includes a piston block 4091 movably connected inside the second pipe 408. A connecting rod 4092 is installed on the side of the piston block 4091 near the wafer disk 2. A second clamping plate 4093 is installed on one end of the connecting rod 4092. The side of the second clamping plate 4093 near the wafer disk 2 is adapted to the wafer disk 2. Fixing blocks 4094 are symmetrically installed on both sides of the second pipe 408. A second spring 4095 is installed on the side of the fixing block 4094 near the second clamping plate 4093. One end of the second spring 4095 is fixedly connected to the second clamping plate 4093. A clamping assembly 5 is installed inside the second clamping plate 4093.

[0033] When the negative pressure fan 406 is turned on, the fan blades of the negative pressure fan 406 rotate, causing the air inside the first pipe 407 to enter the second pipe 408. Since the first pipe 407 is connected to the connecting pipe 402, and the first clamping plate 308 is in close contact with the outer wall of the wafer disk 2, a negative pressure is generated inside the inner groove 404 when the air moves into the second pipe 408. This improves the tightness between the first clamping plate 308 and the wafer disk 2, thereby improving the clamping effect of the wafer disk 2. At the same time, after the air enters the second pipe 408, the air pressure inside the second pipe 408 increases, thereby pushing the piston block 4091 to move towards the wafer disk 2. This makes the second clamping plate 4093 in close contact with the outer wall of the wafer disk 2, thereby further improving the clamping effect of the wafer disk 2.

[0034] In Embodiment 3, based on Embodiment 1, the clamping assembly 5 includes movable grooves 501 symmetrically formed on both sides of the second clamping plate 4093. A connecting groove 502 is formed on the side of the movable groove 501 closest to the wafer disk 2, and a mounting groove 503 is formed on the side of the connecting groove 502 closest to the wafer disk 2. The mounting groove 503 extends through to the front of the second clamping plate 4093. A first movable block 505 is slidably connected inside the movable groove 501. A third spring 504 is installed on the side of the two first movable blocks 505 that are close to each other. One end of the third spring 504 is attached to the inner wall of the movable groove 501. A friction rod 507 is installed inside the mounting slot 503. A rotating rod 506 is installed between the first movable block 505 and the friction rod 507. The two ends of the rotating rod 506 are rotatably connected to the first movable block 505 and the friction rod 507, respectively. A fourth spring 508 is installed on the side of the first movable block 505 away from the third spring 504. A second movable block 509 is installed on one end of the fourth spring 508. An electromagnet 510 is installed on the other side of the second movable block 509. Both electromagnets 510 are externally powered, and the magnetism of the two electromagnets 510 is opposite.

[0035] When the second clamping plate 4093 is in close contact with the outer wall of the wafer disk 2, the two electromagnets 510 are energized, causing the two second movable blocks 509 to move closer to each other. This compresses the fourth spring 508, increasing the pressure of the fourth spring 508 on the first movable block 505. Consequently, the first movable block 505 increases the outward pushing force of the first movable block 505 on the friction rod 507 through the rotating rod 506. Since one end of the friction rod 507 is in close contact with the outer wall of the wafer disk 2, the increased pressure increases the frictional force of the friction rod 507 on the wafer disk 2, thereby improving the clamping effect on the wafer disk 2.

Claims

1. A die bonding fixture for a die bonding machine, comprising a working platform (1), characterized in that: The top of the working platform (1) is provided with a wafer disk (2), and the top of the working platform (1) is equipped with a first clamping assembly (3). The first clamping assembly (3) includes symmetrically arranged slide grooves (301) at the top of the work platform (1). A screw (302) is rotatably connected inside the work platform (1). The screw (302) is located inside the slide groove (301). One end of the screw (302) is fixedly connected to the output shaft of the motor (303). The motor (303) is fixedly connected to the work platform (1). A threaded groove is opened on the outer side of the part of the screw (302) inside the slide groove (301), and the two threaded grooves are opened in opposite directions. The internal sliding connection includes a slider (304), which is threadedly connected to a screw (302). A mounting block (305) is installed on the top of the slider (304). A first clamping plate (308) is provided on the side of the two mounting blocks (305) that are close to each other. A plug rod (307) is symmetrically installed on the side of the first clamping plate (308) that is close to the mounting block (305). The plug rod (307) is movably connected to the inside of the first connecting groove (306). The first connecting groove (306) is symmetrically opened inside the mounting block (305). The side of the first clamping plate (308) away from the mounting block (305) is adapted to the outer wall of the wafer disk (2). The side of the mounting block (305) close to the first clamping plate (308) is symmetrically equipped with a first spring (309). One end of the first spring (309) is fixedly connected to the first clamping plate (308). A negative pressure adsorption assembly (4) is installed on the outside of the first clamping plate (308). One end of the insertion rod (307) is equipped with a limiting plate (310). The limiting plate (310) is located on the side of the mounting block (305) away from the first clamping plate (308).

2. The die bonding fixture for a die bonder according to claim 1, characterized in that: The negative pressure adsorption assembly (4) includes an inner groove (404) opened inside the first clamping plate (308). Negative pressure holes (405) are equidistantly opened on the side of the inner groove (404) away from the mounting block (305). A connecting pipe (402) is installed on the other side of the first clamping plate (308). The connecting pipe (402) is movably connected to the inside of the second connecting groove (401). The second connecting groove (401) is opened inside the mounting block (305). A piston pipe (403) is installed on the outer side of one end of the connecting pipe (402). The piston pipe (403) is located on the side of the mounting block (305) away from the first clamping plate (308).

3. The die bonding fixture for a die bonder according to claim 1, characterized in that: Two negative pressure fans (406) are installed at the top of the working platform (1). A first pipe (407) is installed on one side of the negative pressure fan (406). The interior of the two first pipes (407) is slidably connected to two piston pipes (403) respectively, and the first pipes (407) are connected to the interior of the connecting pipe (402).

4. A die bonding fixture for a die bonder according to claim 3, characterized in that: A second pipe (408) is installed on the other side of the negative pressure fan (406). An auxiliary clamping unit (409) is installed inside one end of the second pipe (408). The auxiliary clamping unit (409) is symmetrically arranged on the front and back of the wafer disk (2).

5. A die bonding fixture for a die bonder according to claim 4, characterized in that: The auxiliary clamping unit (409) includes a piston block (4091) movably connected inside the second pipe (408). A connecting rod (4092) is installed on the side of the piston block (4091) near the wafer disk (2). A second clamping plate (4093) is installed at one end of the connecting rod (4092). The side of the second clamping plate (4093) near the wafer disk (2) is adapted to the wafer disk (2). Fixing blocks (4094) are symmetrically installed on both sides of the second pipe (408). A second spring (4095) is installed on the side of the fixing block (4094) near the second clamping plate (4093). One end of the second spring (4095) is fixedly connected to the second clamping plate (4093). A clamping assembly (5) is installed inside the second clamping plate (4093).

6. A die bonding fixture for a die bonder according to claim 5, characterized in that: The clamping assembly (5) includes movable grooves (501) symmetrically opened on both sides of the second clamping plate (4093). A connecting groove (502) is opened on the side of the movable groove (501) near the wafer disk (2). An installation groove (503) is opened on the side of the connecting groove (502) near the wafer disk (2). The installation groove (503) extends through to the front of the second clamping plate (4093).

7. A die bonding fixture for a die bonder according to claim 6, characterized in that: The movable groove (501) is slidably connected to a first movable block (505). A third spring (504) is installed on the side of the two first movable blocks (505) that are close to each other. One end of the third spring (504) is fixedly connected to the inner wall of the movable groove (501). A friction rod (507) is installed inside the mounting groove (503). A rotating rod (506) is installed between the first movable block (505) and the friction rod (507). The two ends of the rotating rod (506) are rotatably connected to the first movable block (505) and the friction rod (507) respectively.

8. A die bonding fixture for a die bonder according to claim 7, characterized in that: A fourth spring (508) is installed on the side of the first movable block (505) away from the third spring (504). A second movable block (509) is installed on one end of the fourth spring (508). An electromagnet (510) is installed on the other side of the second movable block (509). Both electromagnets (510) are connected to an external power source, and the magnetism of the two electromagnets (510) is opposite.

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