Component heating circuit and method, control device, power supply system

Abstract

The application provides a component heating circuit and method, a control device and a power supply system, and the component heating circuit and method are used for heating a target component in a switching power supply circuit, and the component heating circuit comprises a switch, and on this basis, the target component can be short-circuited or the resistance of the heating circuit itself can be heated by controlling the switch in the component heating circuit. When the target component is short-circuited, the line connected with the target component will heat due to a large current, and then the target component can be heated. The resistance of the heating circuit itself is in physical contact with the target component, so when the resistance of the heating circuit itself heats, the target component can be heated. That is to say, the heating of the target component can be realized by controlling the switch of the heating circuit, so that the influence of low temperature on electronic components in the switching power supply circuit is effectively reduced, and the stable operation of the switching power supply circuit is ensured.

Description

Technical Field

[0001] This invention belongs to the field of circuit technology, and more specifically, relates to a component heating circuit and method, control equipment, and power supply system. Background Technology

[0002] Switching power supply circuits contain various electronic components. These components can function normally at room temperature, but in low-temperature environments, they are susceptible to performance degradation due to the low temperature.

[0003] Therefore, there is an urgent need for a solution to reduce the impact of low temperatures on the performance of electronic components and ensure the stable operation of switching power supply circuits. Summary of the Invention

[0004] The purpose of this invention is to provide a component heating circuit and method, control device, and power supply system to reduce the impact of low temperature on the performance of electronic components and ensure the stable operation of the switching power supply circuit.

[0005] To achieve the above objectives, the present invention provides a component heating circuit for heating target components in a switching power supply circuit. The component heating circuit includes:

[0006] A first switch, which is connected in parallel with the target component;

[0007] The first switch is used to short-circuit the target component when it is closed, thereby heating the target component.

[0008] The beneficial effects of the component heating circuit provided by this invention are as follows:

[0009] When component temperatures are low, those skilled in the art typically add heating devices around the switching power supply circuit to raise the ambient temperature around the components, thereby increasing the component temperature. However, considering that adding heating devices around the switching power supply circuit is not suitable in some scenarios, and that raising the ambient temperature around the components is costly, this invention provides a component heating circuit. This component heating circuit includes a first switch that heats the target component by short-circuiting. Analysis of the component heating circuit of this invention reveals that short-circuiting is generally avoided as much as possible in the art; however, this invention unconventionally utilizes short-circuiting to heat the target component. Furthermore, in this invention, the first switch is directly connected in parallel across the target component, a simple setup that also reduces heating costs. In other words, this invention effectively solves the problems in the prior art, reduces the impact of low temperatures on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0010] In one possible implementation, the component heating circuit further includes: a first resistor;

[0011] The first resistor has physical contact with the target component, and the first resistor and the first switch are connected in series to form a series circuit, which is then connected in parallel with the target component.

[0012] The first resistor is used to generate heat when the first switch is closed, thereby heating the target component.

[0013] The beneficial effects of the component heating circuit provided by this invention are as follows:

[0014] When component temperatures are low, those skilled in the art typically add heating devices around the switching power supply circuit to raise the ambient temperature around the components, thereby increasing the component temperature. However, considering that adding heating devices around the switching power supply circuit is not suitable in some scenarios, and that raising the ambient temperature around the components is costly, this invention provides a component heating circuit. This component heating circuit includes a first switch and a first resistor. The first switch heats the target component by causing the first resistor to heat up. Analysis of the component heating circuit of this invention shows that it is simple to install and has low heating costs. Furthermore, the component heating circuit provided by this invention can heat the components while the switching power supply circuit is operating normally, effectively reducing the impact on the operation of the switching power supply circuit. In other words, this invention effectively solves the problems in the prior art, reduces the impact of low temperatures on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0015] To achieve the above objectives, the present invention also provides a component heating method, which is used to heat a target component in the switching power supply circuit based on the component heating circuit described above; the component heating method includes:

[0016] If it is detected that the target component needs to be heated, then the output voltage of the front-end circuit of the target component is controlled to be less than a preset voltage, the back-end circuit of the target component is controlled to be disconnected, and the first switch is controlled to be closed.

[0017] If the temperature of the target component is detected to have reached a preset temperature, the first switch is controlled to open.

[0018] The beneficial effects of the component heating method provided by this invention are as follows:

[0019] Based on the component heating circuit provided by the present invention, the present invention can achieve component heating by controlling the closing and opening of the first switch, which is simple to control and has low cost. In other words, the present invention effectively solves the problems in the prior art, reduces the impact of low temperature on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0020] In one possible implementation, if it is detected that heating of the target component is required, the component heating method further includes:

[0021] The ripple modulation amount is determined based on the temperature of the target component;

[0022] The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0023] The switching transistor in the switching power supply circuit is controlled based on the target modulation wave.

[0024] The ripple modulation amount is used to add ripple to the switching power supply circuit, thereby achieving the heating of the target component.

[0025] In one possible implementation, determining the ripple modulation amount based on the temperature of the target component includes:

[0026] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0027] The temperature difference is input into a preset controller to obtain the ripple modulation amount.

[0028] To achieve the above objectives, the present invention also provides a component heating method, which is used to heat a target component in the switching power supply circuit based on the component heating circuit including a first resistor described above; the component heating method includes:

[0029] If it is detected that the target component needs to be heated, then the first switch is controlled to close.

[0030] If the temperature of the target component is detected to have reached a preset temperature, the first switch is controlled to open.

[0031] The beneficial effects of the component heating method provided by this invention are as follows:

[0032] Based on the component heating circuit provided by the present invention, the present invention can achieve component heating by controlling the closing of the first switch, which is simple to control and low in cost. Furthermore, the component heating method provided by the present invention can achieve component heating while the switching power supply circuit is operating normally, effectively reducing the impact on the operation of the switching power supply circuit. In other words, the present invention effectively solves the problems in the prior art, reduces the impact of low temperature on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0033] In one possible implementation, if it is detected that heating of the target component is required, the component heating method further includes:

[0034] The ripple modulation amount is determined based on the temperature of the target component;

[0035] The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0036] The switching transistor in the switching power supply circuit is controlled based on the target modulation wave.

[0037] The ripple modulation amount is used to add ripple to the switching power supply circuit, thereby achieving the heating of the target component.

[0038] In one possible implementation, determining the ripple modulation amount based on the temperature of the target component includes:

[0039] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0040] The temperature difference is input into a preset controller to obtain the ripple modulation amount.

[0041] In another aspect, the present invention provides a control device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the component heating method described above.

[0042] In another aspect, the present invention provides a power supply system, comprising:

[0043] The switching power supply circuit and control device described above. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the component heating circuit provided in an embodiment of the present invention;

[0046] Figure 2 This is a schematic diagram of the component heating circuit provided in another embodiment of the present invention;

[0047] Figure 3 This is a control loop diagram of a switching power supply circuit provided in an embodiment of the present invention;

[0048] Figure 4 This is a structural block diagram of a control device provided in an embodiment of the present invention. Detailed Implementation

[0049] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0050] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0051] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a component heating circuit provided in an embodiment of the present invention. The component heating circuit is used to heat the target component in the switching power supply circuit. The target component can be a capacitor on the bus or a battery, which is not limited here.

[0052] like Figure 1 The component heating circuit described in this embodiment of the invention includes:

[0053] The first switch K1 is connected in parallel with the target component.

[0054] The first switch K1 is used to short-circuit the target component when it is closed, thereby heating the target component.

[0055] In this embodiment, closing the first switch K1 will short-circuit the target component. At this time, the circuit where the target component is located will heat up due to excessive current, thereby increasing the temperature of the target component as the temperature of its circuit increases, thus achieving the purpose of heating the target component.

[0056] Unlike existing technologies, the heating circuit in this embodiment is not used to raise the ambient temperature around the switching power supply circuit, but is directly connected in parallel with the target component to heat the target component itself. Furthermore, the target component can be heated by controlling the switch in the heating circuit.

[0057] The beneficial effects of the component heating circuit provided in this embodiment of the invention are as follows:

[0058] When component temperatures are low, those skilled in the art typically add heating devices around the switching power supply circuit to raise the ambient temperature around the components, thereby increasing the component temperature. However, considering that adding heating devices around the switching power supply circuit is not suitable in some scenarios and that raising the ambient temperature around the components is costly, this invention provides a component heating circuit. This component heating circuit includes a first switch that heats the target component by short-circuiting. Analysis of the component heating circuit of this invention shows that short-circuiting is generally avoided as much as possible in the art; however, this invention unconventionally utilizes short-circuiting to heat the target component. Furthermore, in this invention, the first switch is directly connected in parallel across the target component, a simple setup that also reduces heating costs. In other words, this invention effectively solves the problems in the prior art, reduces the impact of low temperatures on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0059] One possible implementation can be referenced. Figure 2 The component heating circuit also includes:

[0060] The first resistor is R1.

[0061] The first resistor R1 is in physical contact with the target component. Figure 2 (This is a circuit diagram, so this point is not shown.) The first resistor R1 and the first switch K1 are connected in series to form a series circuit, and the series circuit is connected in parallel with the target component.

[0062] The first resistor is used to generate heat when the first switch is closed, thereby heating the target component.

[0063] In this embodiment, after the first switch is closed, current will flow through the first resistor, which will cause the temperature of the first resistor to rise. Based on this, the embodiment of the present invention sets the first resistor R1 to be in physical contact with the target component, so that the temperature of the target component rises with the temperature of the first resistor R1, thereby achieving the purpose of heating the target component.

[0064] In this embodiment, the physical contact between the first resistor R1 and the target component includes: the first resistor R1 being attached to / covered / wound around the outside of the target component.

[0065] In this embodiment, by connecting the first resistor R1 in parallel with the first switch K1, the voltage requirements of the front-end circuit of the target component can be significantly reduced. Even when the switching power supply circuit is operating normally, heating of the target component can still be achieved. In other words, the first resistor R1 can act as a current-limiting resistor, making the heating process of the target component safer.

[0066] In this embodiment, the first resistor R1 can be a thermistor, whose resistance increases as the ambient temperature rises and decreases as the ambient temperature falls. Based on this design, when the ambient temperature of the switching power supply circuit is low, the target component temperature is low, and heating of the target component is required, the thermistor's resistance decreases as the temperature decreases. At this time, closing the first switch K1 allows the thermistor to heat up rapidly, thus achieving rapid temperature rise of the target component. Furthermore, when the ambient temperature of the switching power supply circuit and the target component temperature rises and further heating is no longer necessary, the thermistor's resistance increases as the ambient temperature rises. Therefore, even without immediately disconnecting the first switch K1, further heating of the target component can be avoided as much as possible, thus preventing overheating due to untimely control. In other words, using a thermistor as the first resistor effectively improves the heating efficiency of the target component and avoids overheating, thereby reducing the impact on the target component's performance and ensuring the stable operation of the switching power supply circuit.

[0067] Considering that covering the target component with the first resistor R1 may affect the heat dissipation of the target component under normal temperature, in this embodiment the first resistor R1 can be in the form of a resistance wire. Since the resistance wire has thermal conductivity, using the resistance wire can enhance the heat dissipation effect of the target component under normal temperature to a certain extent.

[0068] The beneficial effects of the component heating circuit provided in this embodiment of the invention are as follows:

[0069] When component temperatures are low, those skilled in the art typically add heating devices around the switching power supply circuit to raise the ambient temperature around the components, thereby increasing the component temperature. However, considering that adding heating devices around the switching power supply circuit is not suitable in some scenarios and that raising the ambient temperature around the components is costly, this invention provides a component heating circuit. This component heating circuit includes a first switch and a first resistor. The first switch heats the target component by causing the first resistor to heat up. Analysis of the component heating circuit of this invention shows that it is simple to install and has low heating costs. Furthermore, the component heating circuit provided by this invention can heat the components while the switching power supply circuit is operating normally, effectively reducing the impact on the operation of the switching power supply circuit. In other words, this invention effectively solves the problems in the prior art, reduces the impact of low temperatures on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0070] To achieve the above objectives, embodiments of the present invention also provide a component heating method, which is used to heat target components in a switching power supply circuit based on the component heating circuit described above. The component heating method includes:

[0071] If heating of the target component is detected, the output voltage of the front-end circuit of the target component is controlled to be less than the preset voltage, the back-end circuit of the target component is controlled to be disconnected, and the first switch is controlled to be closed.

[0072] If the temperature of the target component is detected to have reached the preset temperature, the first switch is turned off.

[0073] In this embodiment, short-circuit conditions are usually avoided as much as possible in the art, but the present invention makes unconventional use of the temperature rise caused by the short circuit to achieve rapid heating of the target component.

[0074] In this embodiment, when the first switch is closed, the circuit containing the target component will experience a temperature increase due to the large current, thereby rapidly heating the target component. Considering that the large current may damage the switching power supply circuit, this embodiment also controls the preceding and following stage circuits of the target component. The output voltage of the preceding stage circuit is controlled at a low voltage, and the following stage circuit is disconnected to ensure the normal operation of the switching power supply circuit.

[0075] To further ensure the safety of the switching power supply circuit, after the first switch is closed and before the temperature of the target component reaches a preset temperature, the component heating method provided in this embodiment of the invention may further include: acquiring the current in the switching power supply circuit; controlling the first switch to turn off when the current in the switching power supply circuit exceeds a first preset current value; and controlling the first switch to close when the current in the switching power supply circuit is less than a second preset current value. Wherein, the first preset current value is not less than the second preset current value. Based on this, applying the aforementioned scheme of this embodiment of the invention, the following situation will occur: the first switch is closed, and the target component is heated by a short circuit. After the first switch is closed for a period of time, the current in the switching power supply circuit exceeds the device protection point of the current limiting protection circuit (i.e., the current in the switching power supply circuit exceeds the first preset current value), and protection is activated (the first switch is turned off). After exiting the aforementioned protection point, the circuit is short-circuited again to heat the line where the target component is located. This process is repeated until the temperature of the target component is detected to have reached the preset temperature. Then, the first switch is disconnected, and the aforementioned repeated heating stage is exited, allowing the switching power supply circuit to enter normal operating mode.

[0076] To further ensure the safety of the switching power supply circuit, this embodiment of the invention can also add a current limiting protection circuit in the front-end circuit of the target component. This current limiting protection circuit will disconnect the switching power supply circuit when the current in the switching power supply circuit exceeds a third preset current value, and will turn on the switching power supply circuit when the current in the switching power supply circuit is less than a fourth preset current value. The third preset current value is not less than the fourth preset current value. Based on this, applying the aforementioned solution of this embodiment of the invention, the following situation will occur: The first switch is closed, and the target component is heated by short-circuiting. After the first switch is closed for a period of time, the current in the switching power supply circuit exceeds the device protection point of the current limiting protection circuit (that is, the current in the switching power supply circuit exceeds the third preset current value), and protection is activated. After exiting the aforementioned protection point, the circuit is short-circuited again to heat the line where the target component is located. This process is repeated until the temperature of the target component is detected to reach the preset temperature. Then, the first switch is opened, the aforementioned repeated heating stage is exited, and the switching power supply circuit can enter the normal operating mode.

[0077] The beneficial effects of the component heating method provided in this embodiment of the invention are as follows:

[0078] Based on the component heating circuit provided in the embodiments of the present invention, the present invention can achieve component heating by controlling the closing and opening of the first switch, which is simple to control and has low cost. In other words, the present invention effectively solves the problems in the prior art, reduces the impact of low temperature on the performance of electronic components, and ensures the stable operation of the switching power supply circuit.

[0079] In one possible implementation, if it is detected that heating of the target component is required, the component heating method further includes:

[0080] The ripple modulation amount is determined based on the temperature of the target component.

[0081] The ripple modulation amount is superimposed on a preset modulation wave to obtain the target modulation wave. The preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0082] The switching transistor in the switching power supply circuit is controlled based on the target modulation wave.

[0083] Among them, the ripple modulation amount is used to add ripple to the switching power supply circuit, thereby achieving the heating of the target components.

[0084] In this embodiment, while heating the target component through the heating circuit, the target component can also be heated through ripple modulation to improve heating efficiency.

[0085] In this embodiment, the preset modulation wave is essentially the modulation wave corresponding to the switching power supply circuit when the target component is heated.

[0086] In this embodiment, the ripple modulation amount can be superimposed on a preset modulation wave to obtain the final modulation wave (i.e., the target modulation wave). Based on the final modulation wave, the switching transistor in the switching power supply circuit is controlled to increase the ripple in the switching power supply circuit, thereby achieving the effect of heating the target component.

[0087] In this embodiment, a corresponding heating method can also be selected based on the temperature difference. The temperature difference refers to the difference between a preset temperature and the temperature of the target component. For example, when the temperature difference is less than a first preset difference, the target component can be heated using ripple modulation. When the temperature difference is not less than the first preset difference and less than a second preset difference, the target component can be heated using a heating circuit. When the temperature difference is not less than the second preset difference, the target component can be heated using both ripple modulation and a heating circuit. Based on this scheme, the safety and stability of the switching power supply circuit, as well as the heating efficiency of the target component, can be comprehensively considered, achieving a balance between safety and heating efficiency.

[0088] In one possible implementation, please refer to Figure 2 , Figure 2 The current temperature refers to the temperature of the target component. Figure 2 The modulation wave in this context refers to a preset modulation wave. The ripple modulation amount is determined based on the temperature of the target component, including:

[0089] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0090] The temperature difference is input into a preset controller to obtain the ripple modulation amount.

[0091] In this embodiment, the temperature difference is determined based on the temperature of the target component and the preset temperature, which can be described in detail as follows: the temperature difference is the difference between the preset temperature and the temperature of the target component.

[0092] In this embodiment, the preset first controller can be a P controller, a PI controller, or the like.

[0093] In other words, a controller can be pre-built to calculate the ripple modulation amount corresponding to the current temperature of the target component. Then, the corresponding ripple modulation amount can be automatically generated based on the temperature of the target component, achieving adaptive heating of the target component. It should be noted that when setting the controller, the possibility of excessive ripple affecting the normal operation of the switching power supply circuit must be considered. That is, in this embodiment, the ripple in the switching power supply circuit is controlled within the tolerance range of the target component when setting the controller.

[0094] To achieve the above objectives, embodiments of the present invention also provide a component heating method, which is used to heat target components in a switching power supply circuit based on the component heating circuit described above. The component heating method includes:

[0095] If it is detected that the target component needs to be heated, the first switch is closed.

[0096] If the temperature of the target component is detected to have reached the preset temperature, the first switch is turned off.

[0097] In this embodiment, after the first switch is closed, current will flow through the first resistor, which will cause the temperature of the first resistor to rise. Based on this, the embodiment of the present invention sets the first resistor R1 to be in physical contact with the target component, so that the temperature of the target component rises with the temperature of the first resistor R1, thereby achieving the purpose of heating the target component.

[0098] The beneficial effects of the component heating method provided in this embodiment of the invention are as follows:

[0099] Based on the component heating circuit provided in the embodiments of the present invention, the heating of components can be achieved by controlling the closing of the first switch, which is simple to control and has low cost. Furthermore, the component heating method provided in the embodiments of the present invention can achieve component heating while the switching power supply circuit is operating normally, effectively reducing the impact on the operation of the switching power supply circuit. In other words, the embodiments of the present invention effectively solve the problems in the prior art, reduce the impact of low temperature on the performance of electronic components, and ensure the stable operation of the switching power supply circuit.

[0100] In one possible implementation, if it is detected that heating of the target component is required, the component heating method further includes:

[0101] The ripple modulation amount is determined based on the temperature of the target component.

[0102] The ripple modulation amount is superimposed on a preset modulation wave to obtain the target modulation wave. The preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0103] The switching transistor in the switching power supply circuit is controlled based on the target modulation wave.

[0104] Among them, the ripple modulation amount is used to add ripple to the switching power supply circuit, thereby achieving the heating of the target components.

[0105] In this embodiment, while heating the target component through the heating circuit, the target component can also be heated through ripple modulation to improve heating efficiency.

[0106] In this embodiment, determining the ripple modulation amount based on the temperature of the target component includes: determining a temperature difference based on the temperature of the target component and a preset temperature, and inputting the temperature difference into a preset controller to obtain the ripple modulation amount.

[0107] In this embodiment, the preset modulation wave is essentially the modulation wave corresponding to the switching power supply circuit when the target component is heated.

[0108] In this embodiment, the ripple modulation amount can be superimposed on a preset modulation wave to obtain the final modulation wave (i.e., the target modulation wave). Based on the final modulation wave, the switching transistor in the switching power supply circuit is controlled to increase the ripple in the switching power supply circuit, thereby achieving the effect of heating the target component.

[0109] In this embodiment, a corresponding heating method can also be selected based on the temperature difference. The temperature difference refers to the difference between a preset temperature and the temperature of the target component. For example, when the temperature difference is less than a first preset difference, the target component can be heated using ripple modulation. When the temperature difference is not less than the first preset difference and less than a second preset difference, the target component can be heated using a heating circuit. When the temperature difference is not less than the second preset difference, the target component can be heated using both ripple modulation and a heating circuit. Based on this scheme, the safety and stability of the switching power supply circuit, as well as the heating efficiency of the target component, can be comprehensively considered, achieving a balance between safety and heating efficiency.

[0110] The specific implementation of ripple modulation can be found in the above embodiments, and will not be repeated here.

[0111] Please refer to Figure 4In another aspect, the present invention provides a control device 300, including: one or more processors 301, one or more input devices 302, one or more output devices 303, and one or more memories 304. The processors 301, input devices 302, output devices 303, and memories 304 communicate with each other via a communication bus 305. The memories 304 store computer programs, including program instructions. The processors 301 execute the program instructions stored in the memories 304. The processors 301 are configured to invoke the program instructions to execute the steps of the above-described method embodiments. It should be understood that in the embodiments of the present invention, the processor 301 may be a Central Processing Unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor. Input device 302 may include a touchpad, a fingerprint sensor (for collecting the user's fingerprint information and fingerprint orientation information), a microphone, etc., while output device 303 may include a display (LCD, etc.), a speaker, etc. Memory 304 may include read-only memory and random access memory, and provides instructions and data to processor 301. A portion of memory 304 may also include non-volatile random access memory. For example, memory 304 may also store device type information. In specific implementations, the processor 301, input device 302, and output device 303 described in the embodiments of the present invention can execute the implementation methods described in the first and second embodiments of the component heating method provided in the embodiments of the present invention.

[0112] In another aspect, the present invention provides a power supply system, comprising:

[0113] The switching power supply circuit and control device described above.

[0114] In one possible implementation, the power supply system may further include the component heating circuit in the foregoing embodiments, which is connected in parallel with the target component in the switching power supply circuit.

[0115] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for heating components, characterized in that, The component heating method is used to heat a target component in a switching power supply circuit based on a component heating circuit; the component heating circuit includes a first switch, which is connected in parallel with the target component; wherein, when the first switch is closed, it is used to short-circuit the target component, thereby achieving heating of the target component; the target component is a capacitor on the busbar; The component heating method includes: If heating of the target component is detected, then when the temperature difference is less than a first preset difference, the target component is heated using a first preset method; when the temperature difference is not less than the first preset difference and is less than a second preset difference, the target component is heated using a second preset method; when the temperature difference is not less than the second preset difference, the target component is heated using both the first and second preset methods; wherein, the temperature difference is the difference between a preset temperature and the temperature of the target component; the second preset difference is greater than the first preset difference; Heating the target component using a first preset method includes: The ripple modulation amount is determined based on the temperature of the target component; The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit. The switching transistor in the switching power supply circuit is controlled based on the target modulation wave. The ripple modulation amount is used to add ripple to the switching power supply circuit to achieve heating of the target component; Heating the target component using a second preset method includes: Control the output voltage of the front-end circuit of the target component to be less than a preset voltage, control the back-end circuit of the target component to be disconnected, and control the first switch to be closed; If the temperature of the target component is detected to have reached a preset temperature, the first switch is controlled to open.

2. The component heating method as described in claim 1, characterized in that, The step of determining the ripple modulation amount based on the temperature of the target component includes: The temperature difference is determined based on the temperature of the target component and the preset temperature. The temperature difference is input into a preset controller to obtain the ripple modulation amount.

3. A method for heating components, characterized in that, The component heating method is used to heat a target component in a switching power supply circuit based on a component heating circuit; the component heating circuit includes a first switch and a first resistor; the first resistor has physical contact with the target component, and the first resistor and the first switch are connected in series to form a series circuit, and the series circuit is connected in parallel with the target component; wherein, the first resistor is used to generate heat when the first switch is closed, thereby achieving the heating of the target component; The component heating method includes: If heating of the target component is detected, then when the temperature difference is less than a first preset difference, the target component is heated using a first preset method; when the temperature difference is not less than the first preset difference and is less than a second preset difference, the target component is heated using a third preset method; when the temperature difference is not less than the second preset difference, the target component is heated using both the first and third preset methods; wherein, the temperature difference is the difference between a preset temperature and the temperature of the target component; the second preset difference is greater than the first preset difference; Heating the target component using a first preset method includes: The ripple modulation amount is determined based on the temperature of the target component; The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit. The switching transistor in the switching power supply circuit is controlled based on the target modulation wave. The ripple modulation amount is used to add ripple to the switching power supply circuit to achieve heating of the target component; Heating the target component using a third preset method includes: Control the first switch to close; If the temperature of the target component is detected to have reached a preset temperature, the first switch is controlled to open.

4. The component heating method as described in claim 3, characterized in that, The step of determining the ripple modulation amount based on the temperature of the target component includes: The temperature difference is determined based on the temperature of the target component and the preset temperature. The temperature difference is input into a preset controller to obtain the ripple modulation amount.

5. A control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the component heating method as described in claim 1 or 2; or, when the processor executes the computer program, it implements the steps of the component heating method as described in claim 3 or 4.

6. A power supply system, characterized in that, include: A switching power supply circuit and the control device as described in claim 5.

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