Component heating method, control device, power supply system

Abstract

The application provides a component heating method, a control device and a power supply system. The component heating method is used for heating a target component in a switching power supply circuit. The component heating method comprises the following steps: when it is detected that the target component needs to be heated, determining a ripple modulation amount according to the temperature of the target component; and controlling a switching tube in the switching power supply circuit based on the ripple modulation amount to heat the target component. The ripple modulation amount is used to heat the target component by adding a ripple to the switching power supply circuit. The application can effectively reduce the influence of low temperature on electronic components in the switching power supply circuit, thereby ensuring stable operation of the switching power supply circuit.

Description

Technical Field

[0001] This invention belongs to the field of circuit technology, and more specifically, relates to a component heating method, control equipment, and power supply system. Background Technology

[0002] Switching power supply circuits contain various electronic components. These components can function normally at room temperature, but in low-temperature environments, they are susceptible to performance degradation due to the low temperature.

[0003] Therefore, there is an urgent need for a solution to reduce the impact of low temperatures on the performance of electronic components and ensure the stable operation of switching power supply circuits. Summary of the Invention

[0004] The purpose of this invention is to provide a component heating method, control device, and power supply system to reduce the impact of low temperature on the performance of electronic components and ensure the stable operation of switching power supply circuits.

[0005] To achieve the above objectives, the present invention provides a component heating method for heating target components in a switching power supply circuit. The component heating method includes:

[0006] When it is detected that the target component needs to be heated, the ripple modulation amount is determined based on the temperature of the target component;

[0007] The switching transistor in the switching power supply circuit is controlled based on the ripple modulation amount to heat the target component;

[0008] The ripple modulation amount is used to heat the target component by adding ripple to the switching power supply circuit.

[0009] In one possible implementation, determining the ripple modulation amount based on the temperature of the target component includes:

[0010] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0011] The temperature difference is input into a preset first controller to obtain the ripple modulation amount.

[0012] In one possible implementation, determining the ripple modulation amount based on the temperature of the target component includes:

[0013] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0014] The ripple corresponding to the temperature difference is determined based on the temperature difference and a pre-calibrated first mapping relationship, wherein the first mapping relationship is the mapping relationship between the temperature difference and the ripple.

[0015] Obtain the current ripple of the switching power supply circuit;

[0016] The ripple difference is determined based on the ripple corresponding to the temperature difference and the current ripple.

[0017] The ripple difference is input to a preset second controller to obtain the ripple modulation amount.

[0018] In one possible implementation, controlling the switching transistor in the switching power supply circuit to heat the target component based on the ripple modulation amount includes:

[0019] The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0020] The target modulation wave is used to control the switching transistor in the switching power supply circuit to heat the target component.

[0021] In one possible implementation, before inputting the temperature difference to a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller;

[0022] Determining the adjustment coefficient of the first controller includes:

[0023] Determine the relationship between the temperature difference and the preset difference value;

[0024] If the temperature difference is greater than a preset difference value, then the preset first adjustment coefficient is used as the adjustment coefficient of the first controller;

[0025] If the temperature difference is not greater than a preset difference value, then the preset second adjustment coefficient is used as the adjustment coefficient of the first controller;

[0026] The adjustment speed of the first adjustment coefficient is greater than the adjustment speed of the second adjustment coefficient.

[0027] In one possible implementation, before inputting the temperature difference to a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller;

[0028] Determining the adjustment coefficient of the first controller includes:

[0029] The adjustment coefficient corresponding to the temperature difference is determined based on the temperature difference and the pre-calibrated second mapping relationship; wherein, the second mapping relationship is the mapping relationship between the temperature difference and the adjustment coefficient;

[0030] The adjustment coefficient corresponding to the temperature difference is used as the adjustment coefficient of the first controller.

[0031] In one possible implementation, the component heating method further includes: detecting whether the target component needs to be heated;

[0032] The detection of whether the target component needs to be heated includes:

[0033] Obtain the temperature of the target component;

[0034] Determine whether the temperature of the target component is lower than a preset low temperature value. If the temperature of the target component is lower than the preset low temperature value, then it is determined that the target component needs to be heated.

[0035] In one possible implementation, the component heating method further includes:

[0036] When the temperature of the target component is detected to have reached a preset temperature, the step of determining the ripple modulation amount based on the temperature of the target component is stopped.

[0037] In another aspect, the present invention provides a control device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the component heating method described above.

[0038] In another aspect, the present invention provides a power supply system, comprising:

[0039] The switching power supply circuit and control device described above.

[0040] The beneficial effects of the component heating method, control equipment, and power supply system provided by this invention are as follows:

[0041] Analysis of the specific technical means of this invention reveals that, unlike the conventional approach of minimizing ripple in existing technologies, this invention increases ripple to heat the components in the switching power supply circuit, thereby raising the component temperature. In other words, this invention creatively proposes a solution different from existing approaches, achieving component heating, reducing the impact of low temperatures on component performance, ensuring the stable operation of the switching power supply circuit, and thus effectively solving the problems in existing technologies.

[0042] Furthermore, it should be noted that when the component temperature is low, those skilled in the art usually add heating devices around the switching power supply circuit to increase the ambient temperature around the components, thereby increasing the component temperature. However, considering that it is not suitable to add heating devices around the switching power supply circuit in some scenarios and that adding heating devices would increase costs, this invention provides a heating scheme based on existing devices. That is, by using the existing control devices of the switching power supply circuit, the components can be heated by controlling the switching transistors in the switching power supply circuit. Therefore, while solving the problems of the prior art, this invention also has the advantages of low cost and wide application range.

[0043] Furthermore, since the component heating solution provided by this invention can be implemented during normal operation of the switching power supply circuit, the application scope of this invention is further expanded from this perspective. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic flowchart of a component heating method provided in an embodiment of the present invention;

[0046] Figure 2 This is a control loop diagram of a switching power supply circuit provided in an embodiment of the present invention;

[0047] Figure 3 A control loop diagram of a switching power supply circuit provided in another embodiment of the present invention;

[0048] Figure 4 This is a schematic diagram of the structure of a control device provided in an embodiment of the present invention. Detailed Implementation

[0049] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0050] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0051] Please refer to Figure 1 , Figure 1This is a schematic flowchart of a component heating method provided in an embodiment of the present invention. The component heating method is used to heat a target component in a switching power supply circuit. The target component can be a capacitor on the bus or a battery, and is not limited here.

[0052] The component heating method described in this embodiment of the invention includes:

[0053] S101: When it is detected that the target component needs to be heated, the ripple modulation amount is determined according to the temperature of the target component.

[0054] In this embodiment, the temperature of the target component can be acquired in real time to determine whether heating is required. That is, the component heating method described in this embodiment may further include: acquiring the temperature of the target component, and determining whether heating is required based on the temperature. Based on this, once it is determined that heating is required, the target component can be heated using ripple modulation.

[0055] Considering that the presence of circuit ripple can cause electronic components to heat up, the art usually tries to reduce circuit ripple as much as possible. However, the embodiments of the present invention make unconventional use of this characteristic, and determine the ripple modulation amount according to the temperature of the target component, so as to increase the ripple in the switching power supply circuit and thus achieve the purpose of heating.

[0056] S102: The switching transistor in the switching power supply circuit is controlled based on the ripple modulation amount to heat the target component. The ripple modulation amount is used to heat the target component by adding ripple to the switching power supply circuit.

[0057] In this embodiment, the ripple modulation amount can be applied to the switching power supply circuit by controlling the switching transistor in the switching power supply circuit, thereby increasing the ripple in the switching power supply circuit and achieving the purpose of heating the target component.

[0058] In this embodiment, the component heating method may further include: stopping the step of "determining the ripple modulation amount based on the temperature of the target component" when the temperature of the target component is detected to have reached a preset temperature. That is, when the temperature of the target component is detected to have reached the preset temperature, the calculation of the ripple modulation amount can be stopped, thereby stopping the addition of ripple to the switching power supply circuit and better ensuring the stable operation of the switching power supply circuit.

[0059] Based on the above description and analysis of the specific technical means of the embodiments of the present invention, it can be seen that, unlike the conventional approach of minimizing ripple in the prior art, the embodiments of the present invention appropriately increase ripple to heat the components in the switching power supply circuit, thereby achieving the purpose of raising the component temperature. In other words, the embodiments of the present invention creatively propose a solution that differs from existing approaches, achieving component heating, reducing the impact of low temperatures on component performance, ensuring the stable operation of the switching power supply circuit, and thus effectively solving the problems in the prior art.

[0060] Furthermore, it should be noted that when the component temperature is low, those skilled in the art usually add heating devices around the switching power supply circuit to increase the ambient temperature around the components, thereby increasing the component temperature. However, considering that it is not suitable to add heating devices around the switching power supply circuit in some scenarios and adding heating devices would increase costs, this invention provides a heating scheme based on existing devices. That is, by using the existing control devices of the switching power supply circuit, the components can be heated by controlling the switching transistors in the switching power supply circuit. Therefore, while solving the problems of the prior art, this invention also has the advantages of low cost and wide application range.

[0061] Furthermore, since the component heating solution provided in this embodiment of the invention can be implemented during normal operation of the switching power supply circuit, the application scope of this embodiment of the invention is further expanded from this perspective.

[0062] In one possible implementation, please refer to Figure 2 , Figure 2 The current temperature refers to the temperature of the target component. Figure 2 The modulated wave in the text refers to the preset modulated wave. Figure 2 The controller in this embodiment refers to the first controller, which determines the ripple modulation amount based on the temperature of the target component, including:

[0063] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0064] The temperature difference is input into the preset first controller to obtain the ripple modulation amount.

[0065] In this embodiment, the temperature difference is determined based on the temperature of the target component and the preset temperature, which can be described in detail as follows: the temperature difference is the difference between the preset temperature and the temperature of the target component.

[0066] In this embodiment, the preset first controller can be a P controller, a PI controller, or the like.

[0067] In other words, a controller can be pre-built to calculate the ripple modulation amount corresponding to the current temperature of the target component. Then, the corresponding ripple modulation amount can be automatically generated based on the temperature of the target component, achieving adaptive heating of the target component. It should be noted that when setting the controller, the possibility of excessive ripple affecting the normal operation of the switching power supply circuit must be considered. That is, in this embodiment, the ripple in the switching power supply circuit is controlled within the tolerance range of the target component when setting the controller.

[0068] One possible implementation can be referenced. Figure 3 , Figure 3 The current ripple in the text refers to the current ripple of the switching power supply circuit. Figure 3 The controller in this embodiment refers to the second controller, which determines the ripple modulation amount based on the temperature of the target component, including:

[0069] The temperature difference is determined based on the temperature of the target component and the preset temperature.

[0070] The ripple corresponding to the temperature difference is determined based on the temperature difference and a pre-defined first mapping relationship, wherein the first mapping relationship is the mapping relationship between the temperature difference and the ripple.

[0071] Obtain the current ripple of the switching power supply circuit.

[0072] The ripple difference is determined based on the ripple corresponding to the temperature difference and the current ripple.

[0073] The ripple difference is input to a preset second controller to obtain the ripple modulation amount.

[0074] In this embodiment, the difference between the preset temperature and the temperature of the target component is the current temperature difference.

[0075] In this embodiment, the correspondence between temperature difference and ripple can be pre-calibrated to obtain a first mapping relationship. Based on this, the ripple of the switching power supply circuit corresponding to the current temperature difference can be determined according to the first mapping relationship, that is, the ripple corresponding to the aforementioned temperature difference. Based on this, the ripple modulation amount can be calculated through negative feedback.

[0076] In this embodiment, the difference between the ripple corresponding to the temperature difference and the current ripple is the ripple difference.

[0077] In this embodiment, the second controller can be a P controller, a PI controller, or the like.

[0078] In other words, a controller can be pre-built to calculate the ripple modulation amount corresponding to the current temperature of the target component. Then, the corresponding ripple modulation amount can be automatically generated based on the temperature of the target component, achieving adaptive heating of the target component. It should be noted that when setting the controller, the possibility of excessive ripple affecting the normal operation of the switching power supply circuit must be considered. That is, in this embodiment, the ripple in the switching power supply circuit is controlled within the tolerance range of the target component when setting the controller.

[0079] In this embodiment, the temperature difference is converted into ripple difference, thereby calculating the temperature modulation corresponding to the current temperature of the target component. Compared with directly inputting the temperature difference to the controller to calculate the ripple modulation amount, this embodiment of the invention can reduce the design difficulty of the controller to a certain extent, and the transfer function of the controller can also be simpler, thereby improving control efficiency.

[0080] In one possible implementation, please refer to Figure 2 and Figure 3 The method of controlling the switching transistor in a switching power supply circuit based on ripple modulation to heat target components includes:

[0081] The ripple modulation amount is superimposed on a preset modulation wave to obtain the target modulation wave. The preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit.

[0082] The target modulated wave controls the switching transistor in the switching power supply circuit to heat the target component.

[0083] In this embodiment, the preset modulation wave is essentially the modulation wave corresponding to the switching power supply circuit when the target component is heated.

[0084] In this embodiment, the ripple modulation amount can be superimposed on a preset modulation wave to obtain the final modulation wave (i.e., the target modulation wave). Based on the final modulation wave, the switching transistor in the switching power supply circuit is controlled to increase the ripple in the switching power supply circuit, thereby achieving the effect of heating the target component.

[0085] In one possible implementation, before inputting the temperature difference into a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller.

[0086] Determining the adjustment coefficient of the first controller includes:

[0087] Determine the relationship between the temperature difference and the preset difference value.

[0088] If the temperature difference is greater than the preset difference value, the preset first adjustment coefficient will be used as the adjustment coefficient of the first controller.

[0089] If the temperature difference is not greater than the preset difference value, then the preset second adjustment coefficient will be used as the adjustment coefficient of the first controller.

[0090] Among them, the adjustment speed of the first adjustment coefficient is greater than that of the second adjustment coefficient.

[0091] In this embodiment, a first adjustment coefficient and a second adjustment coefficient are preset. Based on these, the adjustment coefficient can be adaptively selected according to the size of the temperature difference to avoid over-adjustment (avoiding excessive increase in ripple) while rapidly increasing ripple, thus ensuring circuit stability.

[0092] Specifically, when the temperature difference is large, a larger adjustment coefficient can be selected to achieve rapid heating of the target electrical component. When the temperature difference is small, a smaller adjustment coefficient can be selected to ensure the safe and stable operation of the switching power supply circuit, while avoiding over-adjustment.

[0093] In this embodiment, the adjustment coefficient can be a single coefficient or a set of coefficients. For example, if the first controller is a P controller, then the adjustment coefficient can be a proportional coefficient. If the first controller is a PI controller, the adjustment coefficient can be a combination of a proportional coefficient and an integral coefficient; this is not limited here.

[0094] In this embodiment, when the first controller is a PI controller, the proportional coefficient in the first adjustment coefficient is greater than the proportional coefficient in the second adjustment coefficient. Alternatively, when the first controller is a PI controller, the proportional coefficient in the first adjustment coefficient is equal to the proportional coefficient in the second adjustment coefficient, and the integral coefficient in the first adjustment coefficient is greater than the integral coefficient in the second adjustment coefficient. Wherein, the integral coefficients in the first and / or second adjustment coefficients can be 0, in which case the first controller is equivalent to being converted into a P controller to achieve different control requirements.

[0095] In one possible implementation, before inputting the temperature difference into a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller.

[0096] Determining the adjustment coefficient of the first controller includes:

[0097] The adjustment coefficient corresponding to the temperature difference is determined based on the temperature difference and a pre-calibrated second mapping relationship. The second mapping relationship is the mapping relationship between the temperature difference and the adjustment coefficient.

[0098] The adjustment coefficient corresponding to the temperature difference is used as the adjustment coefficient of the first controller.

[0099] In this embodiment, in order to better ensure the balance between heating rate and circuit stability, the relationship between temperature difference and adjustment coefficient can be pre-calibrated to obtain a second mapping relationship.

[0100] Based on this, the adjustment coefficient corresponding to the current temperature difference can be determined according to the second mapping relationship. The adjustment coefficient corresponding to the current temperature difference is used as the adjustment coefficient of the controller, thereby achieving the effect of "adaptively adjusting the heating rate of the target component according to the size of the temperature difference". This ensures the heating of the target component while maintaining the stable and safe operation of the switching power supply circuit.

[0101] In one possible implementation, the component heating method further includes: detecting whether the target component needs to be heated.

[0102] Determining whether heating of the target component is necessary includes:

[0103] Obtain the temperature of the target component.

[0104] Determine if the temperature of the target component is lower than the preset low temperature value. If the temperature of the target component is lower than the preset low temperature value, then it is determined that the target component needs to be heated.

[0105] In this embodiment, the preset temperature is not lower than a preset low temperature value. The temperature of the target component can be detected in real time, and heating of the target component is controlled when the temperature of the target component is low.

[0106] Please refer to Figure 4In another aspect, the present invention provides a control device 300, including: one or more processors 301, one or more input devices 302, one or more output devices 303, and one or more memories 304. The processors 301, input devices 302, output devices 303, and memories 304 communicate with each other via a communication bus 305. The memories 304 store computer programs, including program instructions. The processors 301 execute the program instructions stored in the memories 304. The processors 301 are configured to invoke the program instructions to execute the steps of the above-described method embodiments. It should be understood that in the embodiments of the present invention, the processor 301 may be a Central Processing Unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor. Input device 302 may include a touchpad, a fingerprint sensor (for collecting the user's fingerprint information and fingerprint orientation information), a microphone, etc., while output device 303 may include a display (LCD, etc.), a speaker, etc. Memory 304 may include read-only memory and random access memory, and provides instructions and data to processor 301. A portion of memory 304 may also include non-volatile random access memory. For example, memory 304 may also store device type information. In specific implementations, the processor 301, input device 302, and output device 303 described in the embodiments of the present invention can execute the implementation methods described in the first and second embodiments of the component heating method provided in the embodiments of the present invention.

[0107] In another aspect, the present invention provides a power supply system, comprising:

[0108] The switching power supply circuit and control device described above.

[0109] In one possible implementation, the power supply system may further include the heating circuit in the foregoing embodiments, which is connected in parallel with the target components in the switching power supply circuit.

[0110] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for heating components, characterized in that, The component heating method is used to heat a target component in a switching power supply circuit, wherein the target component is a capacitor on the busbar; the component heating method includes: When it is detected that the target component needs to be heated, the ripple modulation amount is determined based on the temperature of the target component; The switching transistor in the switching power supply circuit is controlled based on the ripple modulation amount to heat the target component; The ripple modulation amount is used to heat the target component by adding ripple to the switching power supply circuit; The step of determining the ripple modulation amount based on the temperature of the target component includes: The temperature difference is determined based on the temperature of the target component and the preset temperature. The temperature difference is input to a preset first controller to obtain the ripple modulation amount; The method of controlling the switching transistor in the switching power supply circuit based on the ripple modulation amount to heat the target component includes: The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit. The target modulation wave is used to control the switching transistor in the switching power supply circuit to heat the target component.

2. The component heating method as described in claim 1, characterized in that, Before inputting the temperature difference into a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller; Determining the adjustment coefficient of the first controller includes: Determine the relationship between the temperature difference and the preset difference value; If the temperature difference is greater than a preset difference value, then the preset first adjustment coefficient is used as the adjustment coefficient of the first controller; If the temperature difference is not greater than a preset difference value, then the preset second adjustment coefficient is used as the adjustment coefficient of the first controller; The adjustment speed of the first adjustment coefficient is greater than the adjustment speed of the second adjustment coefficient.

3. The component heating method as described in claim 1, characterized in that, Before inputting the temperature difference into a preset first controller, the component heating method further includes: determining the adjustment coefficient of the first controller; Determining the adjustment coefficient of the first controller includes: The adjustment coefficient corresponding to the temperature difference is determined based on the temperature difference and the pre-calibrated second mapping relationship; wherein, the second mapping relationship is the mapping relationship between the temperature difference and the adjustment coefficient; The adjustment coefficient corresponding to the temperature difference is used as the adjustment coefficient of the first controller.

4. The component heating method according to any one of claims 1 to 3, characterized in that, The component heating method further includes: detecting whether the target component needs to be heated; The detection of whether the target component needs to be heated includes: Obtain the temperature of the target component; Determine whether the temperature of the target component is lower than a preset low temperature value. If the temperature of the target component is lower than the preset low temperature value, then it is determined that the target component needs to be heated.

5. The component heating method according to any one of claims 1 to 3, characterized in that, The component heating method further includes: When the temperature of the target component is detected to have reached a preset temperature, the step of determining the ripple modulation amount based on the temperature of the target component is stopped.

6. A method for heating components, characterized in that, The component heating method is used to heat a target component in a switching power supply circuit, wherein the target component is a capacitor on the busbar; the component heating method includes: When it is detected that the target component needs to be heated, the ripple modulation amount is determined based on the temperature of the target component; The switching transistor in the switching power supply circuit is controlled based on the ripple modulation amount to heat the target component; The ripple modulation amount is used to heat the target component by adding ripple to the switching power supply circuit; The step of determining the ripple modulation amount based on the temperature of the target component includes: The temperature difference is determined based on the temperature of the target component and the preset temperature. The ripple corresponding to the temperature difference is determined based on the temperature difference and a pre-calibrated first mapping relationship, wherein the first mapping relationship is the mapping relationship between the temperature difference and the ripple. Obtain the current ripple of the switching power supply circuit; The ripple difference is determined based on the ripple corresponding to the temperature difference and the current ripple. The ripple difference is input to a preset second controller to obtain the ripple modulation amount; The method of controlling the switching transistor in the switching power supply circuit based on the ripple modulation amount to heat the target component includes: The ripple modulation amount is superimposed on a preset modulation wave to obtain a target modulation wave; wherein the preset modulation wave is a modulation wave predetermined according to the control requirements of the switching power supply circuit. The target modulation wave is used to control the switching transistor in the switching power supply circuit to heat the target component.

7. The component heating method as described in claim 6, characterized in that, The component heating method further includes: detecting whether the target component needs to be heated; The detection of whether the target component needs to be heated includes: Obtain the temperature of the target component; Determine whether the temperature of the target component is lower than a preset low temperature value. If the temperature of the target component is lower than the preset low temperature value, then it is determined that the target component needs to be heated.

8. The component heating method as described in claim 6, characterized in that, The component heating method further includes: When the temperature of the target component is detected to have reached a preset temperature, the step of determining the ripple modulation amount based on the temperature of the target component is stopped.

9. A control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the component heating method as described in any one of claims 1 to 5; or, when the processor executes the computer program, it implements the steps of the component heating method as described in any one of claims 6 to 8.

10. A power supply system, characterized in that, include: A switching power supply circuit and the control device as described in claim 9.

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