A wafer regeneration rapid spin-drying device
By designing a rapid spin-drying device with pressing, material handling, guiding, and positioning mechanisms, the problems of inconvenient wafer loading and device instability have been solved, achieving automated loading and stable rotation, and improving the efficiency and stability of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI FULLERDE CHANGJIANG SEMICON MATERIALS CO LTD
- Filing Date
- 2022-10-31
- Publication Date
- 2026-06-16
AI Technical Summary
Existing spin-drying equipment cannot quickly and conveniently feed wafers, which can easily lead to secondary contamination of the wafers. Furthermore, the device is not stable enough when rotating at high speed, which affects the spin-drying effect.
A rapid spin-drying device was designed, comprising a pressing mechanism, a material handling and transfer mechanism, a guiding mechanism, and a positioning mechanism. Through the synergistic effect of these mechanisms, automated wafer loading and stable device rotation are achieved.
It enables rapid and pollution-free wafer loading, improves the efficiency of the equipment, and maintains the stability of the equipment during high-speed rotation, avoiding shaking and damage.
Smart Images
Figure CN115662920B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer technology, specifically a rapid spin-drying device for wafer regeneration. Background Technology
[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. The main wafer processing methods are wafer fabrication and batch processing, which involve processing one or more wafers simultaneously. As semiconductor feature sizes shrink and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. During wafer regeneration, the wafer surface needs thorough cleaning to remove dust, dirt, and chemical residues. After cleaning, a large amount of moisture remains on the wafer surface, requiring a spin-drying process to remove this moisture.
[0003] The existing technology has the following problems:
[0004] (1) Existing spin dryers cannot load wafers more quickly and conveniently during use. If workers manually load wafers after cleaning, it will cause secondary contamination of the wafers and reduce the efficiency of the equipment.
[0005] (2) Existing spin-drying equipment cannot better guide and stabilize the inside of the device during the spin-drying process. The device rotates at high speed for a long time, which can easily cause shaking inside the device and affect the spin-drying effect. Summary of the Invention
[0006] The purpose of this invention is to provide a rapid spin-drying device for wafer regeneration, so as to solve the problems mentioned in the background art.
[0007] The technical solution of the present invention is: a rapid spin-drying device for wafer regeneration, comprising a body, a top frame fixedly installed on one side of the top of the body, and a base fixedly installed on one side of the body, and further comprising a pressing mechanism, a material handling and transfer mechanism, a guiding mechanism, and a positioning mechanism. The pressing mechanism is fixedly installed on one side of the top frame, a sealing mechanism is fixedly installed at the bottom of the pressing mechanism, a spin-drying rack is fixedly installed at the bottom of the sealing mechanism, and a limit mechanism is provided below the spin-drying rack. The material handling and transfer mechanism is fixedly installed on the top of the base, and the material handling and transfer mechanism includes two mounting plates respectively fixedly installed on both sides of the top of the base, two lead screw slides respectively fixedly installed on the top of the two mounting plates, a support plate fixedly installed on the top of the sliding block of the two lead screw slides, an electric rotating block fixedly installed on the top of the support plate, a connecting plate fixedly installed on the top of the electric rotating block, and an electric lifting sleeve fixedly installed on the top of the connecting plate. The guiding mechanism is disposed on the inner wall of the body, and the positioning mechanism is fixedly installed on both sides of the outer wall of the spin-drying rack.
[0008] Preferably, the pressing mechanism includes a cylinder, a push rod, a connecting block, a slot, a locking block, and a rotating block. The cylinder is vertically fixedly installed on one side of the top of the top frame. The push rod is fixedly connected to the output end of the cylinder. The connecting block is fixedly installed at the bottom end of the push rod. The slot is opened at the bottom of the connecting block. The locking block is fitted inside the slot. The rotating block is fixedly installed at the bottom of the locking block.
[0009] Preferably, the sealing mechanism includes a top plate, a sealing ring, a plurality of movable blocks respectively fixedly installed on both sides of the bottom of the top plate, and a plurality of movable hooks respectively fitted and installed inside the plurality of movable blocks. The top plate is fixedly installed on the bottom of the rotating block, and the sealing ring is fixedly installed on one side of the plurality of movable hooks.
[0010] Preferably, the limiting mechanism includes a high-speed turntable, a plurality of limiting rods respectively fixedly installed on both sides of the bottom of the spin dryer, and a plurality of limiting holes respectively opened on both sides of the top of the high-speed turntable, wherein the high-speed turntable is fixedly installed on the bottom of the inner wall of the machine body.
[0011] Preferably, the material handling and transfer mechanism further includes a fixed plate, a fixed clamping plate, an electric slide rail, and a movable clamping plate. The fixed plate is fixedly installed at the telescopic end of the electric lifting rod, the fixed clamping plate is fixedly installed on one side of the bottom of the fixed plate, the electric slide rail is fixedly installed on one side of the bottom of the fixed plate, and the movable clamping plate is fixedly installed at the bottom of the sliding block of the electric slide rail.
[0012] Preferably, the guiding mechanism includes four guide rails respectively formed on the inner wall of the machine body, eight sliders respectively fitted and installed on the inner side of the four guide rails, and eight limiting grooves respectively formed on one side of the eight sliders.
[0013] Preferably, the positioning mechanism includes six mounting blocks respectively fixedly installed on both sides of the outer wall of the spin dryer, six telescopic sleeves respectively fixedly installed on one side of the six mounting blocks, six fixing blocks respectively fixedly installed inside the six telescopic sleeves, and six telescopic rods respectively movably installed inside the six telescopic sleeves, with a telescopic spring connected between each fixing block and the telescopic rod.
[0014] Preferably, the clamping and fixing mechanism includes six support blocks respectively fixedly installed on both sides of the inner wall of the spin dryer, six hydraulic rods respectively fixedly installed on the bottom of the six support blocks, six pressure plates respectively fixedly installed on the telescopic ends of the six hydraulic rods, and six protective pads respectively fixedly installed on the bottom of the six pressure plates.
[0015] This invention provides an improved rapid spin-drying device for wafer regeneration, which has the following improvements and advantages compared with the prior art:
[0016] Firstly, this invention employs a pressing mechanism and a material handling and transfer mechanism. The spin dryer is pushed, causing the clamping block to engage with the slot, thus fixing the top plate at the bottom of the push rod. Then, the cylinder is opened, lifting the push rod to its highest point. Next, the lead screw slide is opened, causing the sliding block to move the support plate to one side of the base. Then, the electric lifting rod is opened, causing the fixed plate to move downwards, moving the fixed clamping plate and movable clamping plate to both sides of the wafer. Then, the electric slide rail is opened, causing the sliding block to move the movable clamping plate inwards until the fixed clamping plate and movable clamping plate clamp the wafer securely. Then, the electric lifting rod is opened to lift the wafer. The electric rotating block is opened, causing the wafer to rotate 180 degrees. Finally, the lead screw slide is opened, causing the sliding block to move the wafer... Moving the wafers to the top of the bottom layer of the spin dryer allows for more convenient and faster wafer loading, preventing workers from touching the wafers and causing secondary contamination that could affect subsequent use. The material handling and transfer mechanism ensures more precise loading, effectively improving the efficiency of the device. After placing the wafers at the top of the bottom layer of the spin dryer, the cylinder is activated, extending the push rod and moving the spin dryer downwards until the middle layer is parallel to the machine body. This loading process is repeated until all three layers of the spin dryer are loaded, making the device more automated. It can also spin dry multiple wafers at once, significantly improving efficiency. Furthermore, the slots and blocks allow for easy replacement of the spin dryer to meet different usage needs, making it more convenient to use.
[0017] Secondly, this invention incorporates a guiding mechanism and a positioning mechanism. As the spin dryer moves downwards, the positioning mechanism moves accordingly until the telescopic rod reaches the slider side and contacts the inner wall of the limiting groove on that side. The telescopic rod receives pressure and contracts inwards, causing the telescopic spring to compress. The compressed spring generates a rebound force, thus maintaining relative stability between the telescopic rod and the limiting groove. This downward push continues until each layer's telescopic rod is locked and fixed inside its corresponding limiting groove. This allows for more convenient positioning of the spin dryer. When the device rotates at high speed, it provides better stability, preventing the center of gravity from shifting and affecting subsequent use. Furthermore, when the high-speed turntable inside the machine rotates the spin dryer, the positioning mechanisms on both sides of the spin dryer cause the slider to slide inside the guide rail, providing better guidance and ensuring stability during use. This prevents shaking and potential damage to the internal components, ensuring continued usability. Attached Figure Description
[0018] The present invention will be further explained below with reference to the accompanying drawings and embodiments:
[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;
[0020] Figure 2 This is a cross-sectional structural schematic diagram of the present invention;
[0021] Figure 3 This is a schematic diagram of the material handling and transfer mechanism of the present invention;
[0022] Figure 4 This is a schematic diagram of the clamping and fixing mechanism of the present invention;
[0023] Figure 5 This is the invention Figure 2 Enlarged structural diagram at point A in the middle;
[0024] Figure 6 This is the invention Figure 1 Enlarged structural diagram at point B;
[0025] Figure 7 This is the invention Figure 1 Enlarged structural diagram at point C.
[0026] Explanation of reference numerals in the attached drawings: 1. Machine body; 2. Top frame; 3. Pressing mechanism; 31. Cylinder; 32. Push rod; 33. Connecting block; 34. Slot; 35. Locking block; 36. Rotating block; 4. Sealing mechanism; 41. Top plate; 42. Movable block; 43. Movable hook; 44. Sealing ring; 5. Spin-drying rack; 6. Limiting mechanism; 61. Limiting rod; 62. High-speed turntable; 63. Limiting hole; 7. Base; 8. Material handling and transfer mechanism; 81. Mounting plate; 82. Screw slide; 83. Support plate; 84. 85. Electric rotating block; 86. Connecting plate; 87. Electric lifting sleeve; 88. Fixing plate; 89. Fixing clamp; 80. Electric slide rail; 810. Movable clamp; 91. Guide mechanism; 92. Guide rail; 93. Slider; 10. Limiting groove; 10. Positioning mechanism; 101. Mounting block; 102. Telescopic sleeve; 103. Fixing block; 104. Telescopic spring; 105. Telescopic rod; 11. Pressing and fixing mechanism; 111. Support block; 112. Hydraulic rod; 113. Pressure plate; 114. Protective pad. Detailed Implementation
[0027] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0028] This invention provides an improved rapid spin-drying device for wafer regeneration. The technical solution of this invention is as follows:
[0029] Example 1:
[0030] like Figures 1-4 As shown, a rapid spin-drying device for wafer regeneration includes a body 1, a top frame 2 fixedly installed on one side of the top of the body 1, and a base 7 fixedly installed on one side of the body 1. It also includes a pressing mechanism 3, a material handling and transfer mechanism 8, a guiding mechanism 9, and a positioning mechanism 10. The pressing mechanism 3 is fixedly installed on one side of the top frame 2. A sealing mechanism 4 is fixedly installed at the bottom of the pressing mechanism 3. A spin-drying rack 5 is fixedly installed at the bottom of the sealing mechanism 4. A limit mechanism 6 is provided below the spin-drying rack 5. The material handling and transfer mechanism 8 is fixedly installed on the top of the base 7. The material handling and transfer mechanism 8 includes two mounting plates 81 respectively fixedly installed on both sides of the top of the base 7, two lead screw slides 82 respectively fixedly installed on the top of the two mounting plates 81, a support plate 83 fixedly installed on the top of the sliding blocks of the two lead screw slides 82, an electric rotating block 84 fixedly installed on the top of the support plate 83, a connecting plate 85 fixedly installed on the top of the electric rotating block 84, and an electric lifting sleeve 86 fixedly installed on the top of the connecting plate 85. The guiding mechanism 9 is provided on the inner wall of the body 1, and the positioning mechanism 10 is fixedly installed on both sides of the outer wall of the spin-drying rack 5.
[0031] The specific implementation scheme is as follows: Open the lead screw slide 82, causing the sliding block of the lead screw slide 82 to move the support plate 83 to one side of the base 7. Then open the electric lifting sleeve 86, causing the electric lifting sleeve 86 to move the fixed plate 87 downwards, causing the fixed plate 87 to move the fixed clamping plate 88 and the movable clamping plate 810 to both sides of the wafer. Then open the electric slide rail 89, causing the sliding block of the electric slide rail 89 to move the movable clamping plate 810 inwards until the fixed clamping plate 88 and the movable clamping plate 810 clamp and fix the wafer. Then open the electric lifting sleeve 86 to lift the wafer. Open the electric rotating block 84, causing the electric rotating block 84 to rotate the wafer 180 degrees. Then open the lead screw slide 82, causing the sliding block of the lead screw slide 82 to move the wafer to the top of the bottom layer of the spin dryer 5. This allows for more convenient and faster wafer loading, avoiding contact between workers and the wafer, preventing secondary contamination of the wafer and affecting subsequent use.
[0032] Specifically, the pressing mechanism 3 includes a cylinder 31, a push rod 32, a connecting block 33, a slot 34, a locking block 35, and a rotating block 36. The cylinder 31 is vertically fixedly installed on one side of the top of the top frame 2. The push rod 32 is fixedly connected to the output end of the cylinder 31. The connecting block 33 is fixedly installed at the bottom end of the push rod 32. The slot 34 is opened at the bottom of the connecting block 33. The locking block 35 is fitted inside the slot 34. The rotating block 36 is fixedly installed at the bottom of the locking block 35. By setting up the cylinder 31, push rod 32, connecting block 33, slot 34, locking block 35, and rotating block 36, the device can be more automated. At the same time, multiple wafers can be spun dry at one time, which greatly improves the efficiency of the device. In addition, the slot 34 and locking block 35 can make it easier to replace the spin dryer 5 according to different usage needs, making it more convenient to use.
[0033] Specifically, the sealing mechanism 4 includes a top plate 41, a sealing ring 44, multiple movable blocks 42 respectively fixedly installed on both sides of the bottom of the top plate 41, and multiple movable hooks 43 respectively fitted inside the multiple movable blocks 42. The top plate 41 is fixedly installed on the bottom of the rotating block 36, and the sealing ring 44 is fixedly installed on one side of the multiple movable hooks 43. By providing the top plate 41, movable blocks 42, movable hooks 43 and sealing ring 44, the device can be better sealed during use to prevent internal sewage from splashing out.
[0034] Specifically, the limiting mechanism 6 includes a high-speed turntable 62, multiple limiting rods 61 respectively fixedly installed on both sides of the bottom of the spin dryer 5, and multiple limiting holes 63 respectively opened on both sides of the top of the high-speed turntable 62. The high-speed turntable 62 is fixedly installed on the bottom of the inner wall of the machine body 1. By setting the limiting rods 61, the high-speed turntable 62 and the limiting holes 63, the device can be more conveniently and quickly limited and assembled, making it easier to combine and connect the various parts, and making the use more coherent.
[0035] Specifically, the material handling and transfer mechanism 8 also includes a fixed plate 87, a fixed clamping plate 88, an electric slide rail 89, and a movable clamping plate 810. The fixed plate 87 is fixedly installed on the telescopic end of the electric lifting sleeve 86, the fixed clamping plate 88 is fixedly installed on one side of the bottom of the fixed plate 87, the electric slide rail 89 is fixedly installed on one side of the bottom of the fixed plate 87, and the movable clamping plate 810 is fixedly installed on the bottom of the sliding block of the electric slide rail 89.
[0036] Specifically, the guiding mechanism 9 includes four guide rails 91 respectively opened on the inner wall of the body 1, eight sliders 92 respectively installed on the inner side of the four guide rails 91, and eight limiting grooves 93 respectively opened on one side of the eight sliders 92. By setting the guide rails 91, sliders 92 and limiting grooves 93, the device plays a better guiding role, which further ensures the stability of the device during use, avoids shaking, and prevents damage to the internal parts of the device, thus affecting subsequent use.
[0037] Specifically, the positioning mechanism 10 includes six mounting blocks 101 fixedly installed on both sides of the outer wall of the spin dryer 5, six telescopic sleeves 102 fixedly installed on one side of the six mounting blocks 101, six fixing blocks 103 fixedly installed inside the six telescopic sleeves 102, and six telescopic rods 105 movably installed inside the six telescopic sleeves 102. Each fixing block 103 and telescopic rod 105 is connected to a telescopic spring 104. By setting up the mounting blocks 101, telescopic sleeves 102, fixing blocks 103, telescopic springs 104, and telescopic rods 105, the spin dryer 5 can be positioned more conveniently. When the device rotates at high speed, the spin dryer 5 can be stabilized better, preventing the center of gravity from deviating and affecting the subsequent use of the device.
[0038] Specifically, the clamping and fixing mechanism 11 includes six support blocks 111 respectively fixedly installed on both sides of the inner wall of the spin dryer 5, six hydraulic rods 112 respectively fixedly installed on the bottom of the six support blocks 111, six pressure plates 113 respectively fixedly installed on the telescopic ends of the six hydraulic rods 112, and six protective pads 114 respectively fixedly installed on the bottom of the six pressure plates 113. By setting the support blocks 111, hydraulic rods 112, pressure plates 113 and protective pads 114, the wafer can be clamped and fixed more conveniently, ensuring that the wafer remains stable during the spin dryer process.
[0039] Working principle: First, connect the external power supply and push the spin dryer 5 to engage the locking block 35 with the locking slot 34, thereby fixing the top plate 41 at the bottom of the push rod 32. Then, open the cylinder 31 to lift the push rod 32 to its highest position. Next, open the lead screw slide 82 to move the sliding block of the lead screw slide 82 to move the support plate 83 to one side of the base 7. Then, open the electric lifting sleeve 86 to move the fixed plate 87 downward, causing the fixed plate 87 to move the fixed clamping plate 88 and the movable clamping plate 810 to both sides of the wafer. Finally, open the electric slide rail 89 to move the sliding block of the electric slide rail 89 to... The movable clamping plate 810 moves inward until the fixed clamping plate 88 and the movable clamping plate 810 clamp the wafer securely. Then, the electric lifting sleeve 86 is opened to lift the wafer. The electric rotating block 84 is opened to rotate the wafer 180 degrees. The lead screw slide 82 is then opened to move the wafer to the top of the bottom layer of the spin dryer 5. The cylinder 31 is then opened to extend the push rod 32, thereby moving the spin dryer 5 downward until the middle layer of the spin dryer 5 is parallel to the machine body 1. The above loading operation is repeated, and so on, until all three layers of the spin dryer 5 are loaded. The process begins with loading the wafer. Next, the hydraulic rod 112 is opened, causing it to press down the pressure plate 113 and protective pad 114, thus clamping and securing the wafer. As the spin dryer 5 moves downwards, the positioning mechanism 10 moves accordingly until the telescopic rod 105 moves to the side of the slider 92 and contacts the inner wall of the limiting groove 93 on that side. The telescopic rod 105 receives pressure and retracts inwards, causing the telescopic spring 104 to compress. The compressive spring 104 generates a rebound force, thus maintaining relative stability between the telescopic rod 105 and the limiting groove 93. This process continues downwards until the telescopic rods 105 of each layer are properly engaged. The device is positioned within the corresponding limiting groove 93. Finally, when the high-speed turntable 62 inside the machine body 1 drives the spin dryer 5 to rotate, the positioning mechanism 10 on both sides of the spin dryer 5 drives the slider 92 to slide inside the guide rail 91, which plays a better guiding role for the device. The cylinder 31 is model YS-NZ100-12A, the screw slide 82 is model PKH40, the electric rotating block 84 is model DG60-5, the electric lifting sleeve 86 is model XYDHA24-800, the electric slide rail 89 is model 45WDJ, and the hydraulic rod 112 is model CDM2B25.
[0040] The foregoing description enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A rapid spin-drying device for wafer regeneration, comprising a body (1), a top frame (2) fixedly installed on one side of the top of the body (1), and a base (7) fixedly installed on one side of the body (1), characterized in that: It also includes a pressing mechanism (3), a material handling and transfer mechanism (8), a guiding mechanism (9), and a positioning mechanism (10). The pressing mechanism (3) is fixedly installed on one side of the top frame (2). A sealing mechanism (4) is fixedly installed at the bottom of the pressing mechanism (3). A spin-drying rack (5) is fixedly installed at the bottom of the sealing mechanism (4). A limit mechanism (6) is provided below the spin-drying rack (5). The material handling and transfer mechanism (8) is fixedly installed on the top of the base (7). The material handling and transfer mechanism (8) includes two mounting plates (81). The mounting plates (81) are respectively set on the top two sides of the base (7), and each of the mounting plates (81) is provided with a screw slide (82). The top of the sliding block of the two screw slides (82) is connected to the support plate (83). An electric rotating block (84) is fixedly installed on the top of the support plate (83). A connecting plate (85) is fixedly installed on the top of the electric rotating block (84). An electric lifting sleeve rod (86) is fixedly installed on the top of the connecting plate (85). The guide mechanism (9) is set on the inner wall of the machine body (1), and the positioning mechanism (10) is fixedly installed on both sides of the outer wall of the spin dryer (5). The pressing mechanism (3) includes a cylinder (31), a push rod (32), a connecting block (33), a slot (34), a locking block (35), and a rotating block (36). The cylinder (31) is vertically fixedly installed on one side of the top of the top frame (2). The push rod (32) is fixedly connected to the output end of the cylinder (31). The connecting block (33) is fixedly installed at the bottom end of the push rod (32). The slot (34) is opened at the bottom of the connecting block (33). The locking block (35) is fitted inside the slot (34). The rotating block (36) is fixedly installed at the bottom of the locking block (35). The material handling and transfer mechanism (8) further includes a fixed plate (87), a fixed clamping plate (88), an electric slide rail (89), and a movable clamping plate (810). The fixed plate (87) is fixedly installed on the telescopic end of the electric lifting sleeve (86). The fixed clamping plate (88) is fixedly installed on one side of the bottom of the fixed plate (87). The electric slide rail (89) is fixedly installed on one side of the bottom of the fixed plate (87). The movable clamping plate (810) is fixedly installed on the bottom of the sliding block of the electric slide rail (89). The guiding mechanism (9) includes four guide rails (91) set on the inner wall of the body (1), two sliders (92) installed on the inner side of each guide rail (91), and a limiting groove (93) set on one side of each slider (92). The positioning mechanism (10) includes six mounting blocks (101). The six mounting blocks (101) are symmetrically fixed on both sides of the outer wall of the spin dryer (5). Each mounting block (101) has a telescopic sleeve (102) fixedly installed on one side. A fixing block (103) is fixedly installed inside the telescopic sleeve (102). A telescopic rod (105) is movably installed inside the telescopic sleeve (102). A telescopic spring (104) is connected between the fixing block (103) and the telescopic rod (105).
2. The rapid spin-drying equipment for wafer regeneration according to claim 1, characterized in that: The sealing mechanism (4) includes a top plate (41), a sealing ring (44), multiple movable blocks (42) and multiple movable hooks (43). The movable blocks (42) are fixedly installed on both sides of the bottom of the top plate (41), and each movable block (42) has a movable hook (43) installed on its inner side. The top plate (41) is fixedly installed on the bottom of the rotating block (36), and the sealing ring (44) is fixedly installed on one side of the multiple movable hooks (43).
3. The rapid spin-drying equipment for wafer regeneration according to claim 1, characterized in that: The limiting mechanism (6) includes a high-speed turntable (62), multiple limiting rods (61) and multiple limiting holes (63). The multiple limiting rods (61) are fixedly installed on both sides of the bottom of the spin dryer (5), and the multiple limiting holes (63) are respectively set on both sides of the top of the high-speed turntable (62). The high-speed turntable (62) is fixedly installed on the bottom of the inner wall of the machine body (1).
4. The rapid spin-drying equipment for wafer regeneration according to claim 1, characterized in that: The equipment also includes a clamping and fixing mechanism (11), which includes six support blocks (111). The six support blocks (111) are symmetrically fixed on both sides of the inner wall of the spin dryer (5). A hydraulic rod (112) is fixedly installed at the bottom of each support block (111). A pressure plate (113) is fixedly installed at the telescopic end of the hydraulic rod (112). A protective pad (114) is fixedly installed at the bottom of the pressure plate (113).