A vertical lifting device

Abstract

The application discloses a vertical lifting device, comprising a box, two groups of spraying assemblies arranged in the incoming sheet area and the outgoing sheet area in the box respectively, a movable door which can enter and exit the box and is used for separating the incoming sheet area and the outgoing sheet area, a bearing mechanism which is used for driving the wafer to move along the vertical direction to pass through the spraying assembly, a displacement mechanism which is used for driving the bearing mechanism to move between the incoming sheet area and the outgoing sheet area, and a lifting mechanism which is located above the spraying assembly in the outgoing sheet area and is used for grabbing the processed wafer.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and more particularly to a vertical lifting device. Background Technology

[0002] In the semiconductor industry, the cleanliness of the wafer surface is one of the most important factors affecting the reliability of semiconductor devices. During wafer fabrication processes such as deposition, plasma etching, photolithography, electroplating, and chemical mechanical polishing, contaminants and / or particles can be introduced onto the wafer surface, leading to a decrease in surface cleanliness and low yield of the manufactured semiconductor devices. To achieve a contaminant-free wafer surface, it is necessary to remove contaminants to prevent their re-residue before the manufacturing process. Therefore, multiple surface cleaning processes are required during wafer manufacturing to remove contaminants such as metal ions, atoms, organic matter, and particles adhering to the wafer surface.

[0003] The purpose of cleaning is to remove particles and various chemicals from the wafer surface, and to avoid corrosion and damage to the surface and internal structure during the cleaning process. Currently, common wet cleaning methods involve cleaning wafers in a solution environment, such as soaking in cleaning agents, mechanical scrubbing, and wet chemical cleaning.

[0004] After cleaning, a significant amount of water or cleaning solution residue remains on the wafer surface. Because these residues contain dissolved impurities, allowing them to evaporate naturally will cause these impurities to re-adhere to the wafer surface, leading to contamination and even damaging the wafer's structure. Therefore, a drying process is necessary to remove these residual liquids. Traditional drying methods often result in a very thick residual water film, reaching micrometer levels or larger, which easily causes watermark defects. Thus, existing technologies suffer from poor wafer drying performance and a tendency to leave residual liquids. Summary of the Invention

[0005] This invention provides a vertical lifting device, which aims to at least solve one of the technical problems existing in the prior art.

[0006] This invention provides a vertical lifting device, comprising:

[0007] Box;

[0008] The spray assembly consists of two sets, which are respectively located in the film inlet area and the film outlet area inside the box;

[0009] The movable door allows entry and exit from the box, separating the film entry area from the film exit area;

[0010] The support mechanism is used to move the wafer vertically to pass through the spray assembly;

[0011] The shifting mechanism is used to move the carrying mechanism between the inlet and outlet areas;

[0012] The lifting mechanism, located above the spray assembly in the wafer exit area, is used to grab the processed wafers.

[0013] In one embodiment, the spray assembly includes a first spray mechanism and a dual spray mechanism. The first spray mechanism is located in the wafer inlet area of ​​the housing and is used to perform initial cleaning on the wafer. The dual spray mechanism is located in the wafer outlet area of ​​the housing and is used to spray liquid and gas onto the wafer separately or simultaneously.

[0014] In one embodiment, the movable door is disposed between the first spray mechanism and the dual spray mechanism.

[0015] In one embodiment, when the first spray mechanism is rinsing the wafer in the wafer inlet area, or when the dual spray mechanism is processing the wafer in the wafer outlet area, or when the first spray mechanism and the dual spray mechanism are working simultaneously, the movable door extends into the housing.

[0016] In one embodiment, the movable door includes a door body, a connecting rod, and a drive component.

[0017] In one embodiment, the support mechanism includes a retainer for clamping the bottom of the wafer, a support frame for fixing the retainer, and a lifting component connected to the support frame.

[0018] In one embodiment, the two sides of the retainer are end caps, and the inner side of the retainer is an elastic part. The two end caps cooperate to clamp the elastic part between them. The side edge of the elastic part that contacts the wafer has a groove for clamping the wafer.

[0019] In one embodiment, the outer periphery of the elevator is covered with a protective cover.

[0020] In one embodiment, the bottom of the bearing mechanism is provided with a first magnetic attraction part; the displacement mechanism includes a sliding component and a second magnetic attraction part, the second magnetic attraction part is connected to the sliding component to follow the movement of the sliding component; the first magnetic attraction part and the second magnetic attraction part are magnetically coupled.

[0021] In one embodiment, the bottom of the housing is provided with a guide rail, and the supporting mechanism moves along the guide rail.

[0022] The beneficial effects of this invention include: using a movable door to divide the housing into an infeed area and an outfeed area, the wafers can be processed separately in these two areas without interference, resulting in good wafer cleaning effect. Attached Figure Description

[0023] The advantages of the present invention will become clearer and easier to understand through the detailed description taken in conjunction with the following accompanying drawings, but these drawings are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0024] Figure 1 A vertical lifting device according to an embodiment of the present invention is shown;

[0025] Figure 2 It shows Figure 1 The structure of the load-bearing mechanism;

[0026] Figure 3 and Figure 4 It shows Figure 2 The structure of the middle retainer;

[0027] Figures 5 to 14 It shows Figure 1 The working process of the vertical lifting device. Detailed Implementation

[0028] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods and scope of protection of the present invention. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein. It should be understood that, unless specifically stated otherwise, for ease of understanding, the following description of specific embodiments of the present invention is based on the premise that the relevant equipment, devices, components, etc., are in their original static state and are not given external control signals or driving forces.

[0029] Furthermore, it should be noted that the terms used in this application to indicate orientation, such as front, back, up, down, left, right, top, bottom, front, back, horizontal, and vertical, are merely for ease of explanation and to aid in the understanding of relative position or direction, and are not intended to limit the orientation of any device or structure.

[0030] To illustrate the technical solution described in this invention, the following description will be provided with reference to the accompanying drawings and embodiments.

[0031] In this application, chemical mechanical polishing is also called chemical mechanical planarization, and wafer is also called wafer, silicon wafer, substrate, etc., with the same meaning and actual function.

[0032] Reference Figure 1 A vertical lifting device according to an embodiment of the present invention is described. For example... Figure 1 As shown, the vertical lifting device includes:

[0033] Box 1 is used to provide a processing chamber and prevent liquid leakage;

[0034] The spray assembly 2 has two sets, which are respectively set in the film inlet area and film outlet area inside the housing 1;

[0035] The movable door 5, which allows entry and exit of the housing 1, is used to separate the film entry area and the film exit area and prevent mutual interference between the two areas during operation.

[0036] The support mechanism 3 is used to drive the wafer to move vertically to pass through the spray assembly 2;

[0037] The shifting mechanism 4 is used to move the carrying mechanism 3 between the inlet area and the outlet area;

[0038] The lifting mechanism 6 is located above the spray assembly 2 in the wafer exit area and is used to grab the processed wafers.

[0039] In this embodiment of the invention, the movable door 5 is used to divide the inside of the housing 1 into an infeed area and an outfeed area. The wafers can be processed separately in these two areas without interfering with each other, resulting in a good wafer cleaning effect.

[0040] like Figure 1 As shown, the top surface of the housing 1 has three parallel openings: a wafer inlet 11, a middle opening 12, and a wafer outlet 13. The wafer inlet 11 is used for the wafer to vertically enter the wafer loading area within the housing 1. The middle opening 12 allows the movable door 5 to pass vertically, enabling the movable door 5 to enter and exit the housing 1. The wafer outlet 13 allows the wafer to vertically exit the wafer outlet area within the housing 1. In one embodiment, the bottom of the housing 1 has a drain outlet, and the top or side of the housing 1 has an exhaust vent.

[0041] like Figure 1 As shown, the spray assembly 2 is disposed in the housing 1 and can be installed on the wall of the housing 1. The spray assembly 2 includes a first spray mechanism 21 and a double spray mechanism 22.

[0042] In one embodiment, a first spraying mechanism 21 is disposed in the wafer loading area of ​​the housing 1. The first spraying mechanism 21 is located near the wafer loading port 11 inside the housing 1 and can spray liquid onto the wafer surface for initial cleaning. The liquid can be deionized water, acid, or alkaline solution, such as HCl, HF, organic bases, tetramethylammonium hydroxide (TMAH), ammonium hydroxide, etc. When the wafer moves vertically downwards from the wafer loading port 11 into the housing 1, i.e., when the wafer enters the wafer loading area, the first spraying mechanism 21 sprays liquid onto the wafer surface for rinsing.

[0043] In one embodiment, a dual-spray mechanism 22 is disposed in the wafer ejection area of ​​the housing 1, near the wafer ejection port 13 within the housing 1, for spraying liquid and gas onto the wafer separately or simultaneously. When the wafer moves vertically upward from the wafer ejection port 13 and leaves the housing 1, i.e., when the wafer leaves the wafer ejection area, the dual-spray mechanism 22 sprays liquid and / or gas onto the wafer surface for cleaning and / or drying. Preferably, as the wafer moves vertically upward, the dual-spray mechanism 22 simultaneously sprays liquid and gas onto the wafer surface, with the gas sprayed in the upper layer and the liquid sprayed in the lower layer, utilizing the Marangoni effect to remove adhering substances from the wafer surface, achieving wafer cleaning and drying. This embodiment utilizes the Marangoni effect to clean and dry the wafer surface, solving the problem of secondary contamination of the wafer surface by particles within the immersion device cavity. The liquid can be deionized water, acid, or alkaline solution, such as HCl acid, HF acid, organic base, tetramethylammonium hydroxide (TMAH), ammonium hydroxide, etc. The gas can be a mixture of surface-active organic vapors, such as IPA vapor, and inert gases, such as nitrogen.

[0044] like Figure 1 As shown, the movable door 5 can extend into the box 1 in a closed state, and can also be moved out of the box 1 in an open state. The movable door 5 is located between the first spray mechanism 21 and the double spray mechanism 22, separating the film entry area and the film exit area.

[0045] In one embodiment, when the first spray mechanism 21 rinses the wafer in the wafer entry area, or when the dual spray mechanism 22 processes the wafer in the wafer exit area, or when the first spray mechanism 21 and the dual spray mechanism 22 operate simultaneously, the movable door 5 extends into the housing 1 to prevent liquid splashing. For example, when the first spray mechanism 21 rinses the incoming wafer in the wafer entry area, and the dual spray mechanism 22 cleans and dries the wafer to be removed in the wafer exit area, the movable door 5 blocks the flow, preventing splashing liquid from the wafer entry area from affecting the drying effect of the wafer in the wafer exit area.

[0046] In one embodiment, the movable door 5 can move vertically up and down, passing through the central opening 12 and moving inside and outside the housing 1. In another embodiment, the central opening 12 can be located on the side of the housing 1, and the movable door 5 moves horizontally to enter and exit the housing 1. It is understood that the movable door 5 can move in various directions; any direction that enables entry and exit from the housing 1 and divides the interior of the housing 1 into two areas should fall within the scope of protection of this invention. Figure 1As shown, the movable door 5 may include a door body 51, a connecting rod 52, and a driving component 53. The door body 51 is placed vertically and can enter the housing 1 through the central opening 12. After entering, it can divide the processing chamber inside the housing 1 into two areas: an infeed area and an outfeed area. The door body 51 is connected to the driving component 53 via the connecting rod 52. The driving component 53 is located outside the housing 1 and is used to drive the door body 51 to move vertically. The driving component 53 can be implemented by a motor, cylinder, etc.

[0047] like Figure 1 As shown, the carrier mechanism 3 is located inside the housing 1 and is used to receive the wafer and clamp its bottom end for movement. The carrier mechanism 3 receives the wafer entering the housing 1 from the wafer inlet 11 in the wafer entry area, and moves the wafer vertically downwards. Simultaneously, the first spray mechanism 21 sprays liquid onto the wafer surface for initial cleaning. After moving the wafer to the wafer exit area, the carrier mechanism 3 moves the wafer vertically upwards to exit the housing 1 through the wafer exit outlet 13. When the wafer passes through the dual spray mechanism 22, the dual spray mechanism 22 sprays gas and liquid onto the wafer surface for Marangoni drying.

[0048] In one embodiment, such as Figure 2 As shown, the supporting mechanism 3 includes a clamping member 31 that clamps the bottom of the wafer, a support frame 32 that fixes the clamping member 31, and a lifting member 33 connected to the support frame 32. Multiple clamping members 31 can be provided to further securely clamp the wafer and prevent it from shaking during movement, thus affecting the cleaning and drying effect. For example... Figure 2 The three components shown are all fixedly mounted on the support frame 32. The lifting component 33 drives the support frame 32 to rise or fall, thereby causing the wafer fixed by the holding component 31 to move up and down. The lifting mechanism can be implemented by a motor, cylinder, etc. In one embodiment, in order to improve waterproof performance, a protective cover is provided on the outside of the bearing mechanism 3. Gas can be introduced into the protective cover for gas sealing. Specifically, the outer periphery of the lifting component 33 is covered by the protective cover.

[0049] In one embodiment, such as Figure 3 and Figure 4 As shown, the retaining member 31 has end caps 311 on both sides and an elastic part 312 on the inner side. The two end caps 311 cooperate to clamp the elastic part 312 between them. The side edge of the elastic part 312 that contacts the wafer has a groove 313, which is used to clamp and fix the wafer. The elastic part 312 is made of an elastic material, specifically, it can be polyurethane, rubber, or other materials. This makes the groove 313 elastic enough to clamp the wafer and prevent the wafer from shaking during vertical movement. Furthermore, the groove 313 has two opposing sidewalls for limiting the wafer, and the inner side of the sidewalls has an inclined guide surface. In this embodiment, the bearing mechanism 3 uses an elastic material at the contact position with the wafer, which can firmly clamp the wafer and prevent wear on the wafer edge.

[0050] Understandable, Figures 1 to 4 The holder 31 shown is wheel-shaped, but the shape of the holder 31 is not limited to that shown in the figure. The holder 31 can also be semi-circular, polygonal or irregular in shape, etc. As long as it can firmly clamp the wafer, it should fall within the protection scope of this application.

[0051] In one embodiment, the bottom of the support mechanism 3 is provided with a first magnetic suction part. The first magnetic suction part can be embedded inside the base of the lifting member 33, or the first magnetic suction part can be covered with anti-corrosion material to prevent the first magnetic suction part from directly contacting the cleaning liquid.

[0052] like Figure 1 As shown, the shifting mechanism 4 is located on the bottom outer side of the housing 1. The shifting mechanism 4 is used to drive the bearing mechanism 3 to move back and forth in the horizontal direction.

[0053] In one embodiment, the shifting mechanism 4 includes a sliding component and a second magnetic attraction part. The second magnetic attraction part is connected to the sliding component and can move with the sliding component. The first magnetic attraction part and the second magnetic attraction part are magnetically coupled. When the second magnetic attraction part moves, the mutual attraction between the two magnetic attraction parts generates a driving force on the first magnetic attraction part, thereby driving the first magnetic attraction part to move. This enables the shifting mechanism 4 to drive the carrying mechanism 3 to reciprocate in the horizontal direction, realizing the cyclic reciprocating movement of the carrying mechanism 3 between the infeed area and the outfeed area. Specifically, the first magnetic attraction part and the second magnetic attraction part can be magnets formed by neodymium magnets, samarium cobalt magnets, alnico magnets, or ferrite magnets. In one embodiment, the sliding component includes an interconnected linear module and a slider. The linear module can be implemented by a motor or a cylinder.

[0054] like Figure 1 As shown, the bottom of the box 1 is also provided with a guide rail 41. The shifting mechanism 4 drives the bearing mechanism 3 to move along the guide rail 41 to reduce the friction force when the bearing mechanism 3 reciprocates, and to limit its movement direction and trajectory.

[0055] like Figure 1 As shown, the lifting mechanism 6 is used to grasp the portion of the wafer outside the housing 1 when the carrier mechanism 3 lifts the wafer to a point where it is partially outside the housing 1, and continues to lift the wafer until it is completely removed from the housing 1. During this process, the wafer moves through the dual spray mechanism 22, which continuously cleans and / or dries the wafer surface. After the lifting mechanism 6 clamps the wafer, the carrier mechanism 3 stops rising to detach the wafer. Afterward, the carrier mechanism 3 can return to the wafer receiving area to wait for the next wafer.

[0056] In one embodiment, the lifting mechanism 6 includes a parallel gripper, a clamping drive unit, and a lifting drive unit. The clamping drive unit is connected to the parallel gripper to drive the parallel gripper to open and close, thereby releasing or clamping the wafer. The clamping drive unit is connected to the lifting drive unit to achieve vertical movement.

[0057] The following reference Figures 5 to 14 The working process of the vertical lifting device provided in the embodiments of the present invention is described. Step 1, as follows: Figure 5 As shown, a robotic arm (not shown) places the wafer w into the housing 1 through the wafer inlet. The carrier mechanism 3 receives the wafer w and moves it downwards with the wafer w. During this process, the wafer w passes through the first spray mechanism 21, which sprays liquid onto the surface of the wafer w for preliminary cleaning.

[0058] Step 2, as follows Figure 6 As shown, the carrier mechanism 3 moves the wafer w downwards to the lowest position of the wafer insertion area. Figure 5 and Figure 6 During the process shown, that is, as the carrier mechanism 3 moves the wafer w downward, the movable door 5 remains closed, that is, the movable door 5 extends into the housing 1 to separate the wafer entry area and the wafer exit area.

[0059] Step 3, as follows Figure 7 As shown, the movable door 5 opens, that is, the movable door 5 moves out of the box 1.

[0060] Step 4, as follows Figure 8 As shown, the movable door 5 remains open, and the shifting mechanism 4 drives the carrier mechanism 3 to move horizontally through the movable door 5. The carrier mechanism 3, together with the wafer w on it, moves to the wafer entry area.

[0061] Step 5, as follows Figure 9 As shown, the movable door 5 is closed, meaning that the movable door 5 extends into the box 1.

[0062] Step 6, as follows Figure 10 As shown, the movable door 5 remains closed, and the supporting mechanism 3 lifts the wafer w vertically to remove the wafer w through the exit port.

[0063] Step 7, as follows Figure 11 As shown, after the wafer w is partially removed from the housing 1, the lifting mechanism 6 grabs the part of the wafer w located outside the housing 1, realizing the transfer of the wafer w from the carrying mechanism 3 to the lifting mechanism 6.

[0064] Step 8, as follows Figure 12 As shown, the lifting mechanism 6 continues to lift the wafer w, while the supporting mechanism 3 descends to the lowest position in the wafer exit area. Figures 10 to 12 During the process shown, the movable door 5 remains closed. When the wafer w rises and passes through the dual spray mechanism 22, the dual spray mechanism 22 simultaneously sprays liquid and gas onto the surface of the wafer w for Marangoni cleaning and drying.

[0065] Step 9, as follows Figure 13 As shown, the movable door 5 opens, and the shifting mechanism 4 drives the carrying mechanism 3 back to the entry area.

[0066] Step 10, as follows Figure 14 As shown, the support structure 3 waits for the next wafer w to arrive.

[0067] Steps 1 to 10 above are repeated cyclically.

[0068] Understandable, Figures 12 to 14 The load-bearing mechanism 3 shown descends, moves, rises, and... Figure 5 The wafer receiving process of the carrier mechanism 3 shown can occur simultaneously with the process of the lifting mechanism 6 clamping and raising the wafer w. In other words, two wafers can be processed simultaneously in the housing 1 at a certain moment; one wafer undergoes preliminary cleaning in the wafer entry area, while the other wafer undergoes drying in the wafer exit area, thereby significantly improving the operating efficiency of the device. The accompanying drawings in this specification are schematic diagrams to help illustrate the concept of the invention, schematically showing the shape of each part and its interrelationship. It should be understood that, in order to clearly show the structure of each component in the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0069] In summary, this invention provides a non-immersion vertical lifting device for wafer cleaning and drying. During wafer lowering, liquid can be used to rinse away residues on the wafer surface for initial cleaning. During wafer lifting, a dual-spray assembly performs Marangoni treatment on the wafer to achieve both cleaning and drying. Throughout the process, the liquid is discharged directly through the drain outlet of the enclosure, preventing residue or adhesion to the wafer surface and thus avoiding secondary contamination. The wafer lowering cleaning and lifting drying areas are divided into two parts, separated by a movable door, ensuring no interference between them.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A non-immersion type vertical lifting device, characterized by, include: The enclosure has a drain outlet and guide rail at the bottom; two sets of spray assemblies are provided, respectively located in the wafer inlet area and wafer outlet area inside the enclosure; a movable door allows entry and exit of the enclosure and is used to separate the wafer inlet area and the wafer outlet area; a carrying mechanism is used to drive the wafer to move vertically to pass through the spray assemblies; A shifting mechanism is used to move the carrying mechanism between the wafer entry area and the wafer exit area; a lifting mechanism is located above the spray assembly in the wafer exit area and is used to grasp the processed wafer; the spray assembly includes a first spray mechanism and a dual spray mechanism, the first spray mechanism is disposed in the wafer entry area, the dual spray mechanism is disposed in the wafer exit area, and the movable door is disposed between the first spray mechanism and the dual spray mechanism; the dual spray mechanism is used to spray liquid and gas onto the wafer separately or simultaneously; when the first spray mechanism rinses the wafer in the wafer entry area, or when the dual spray mechanism processes the wafer in the wafer exit area, or when the first spray mechanism and the dual spray mechanism... When the spraying mechanism is working simultaneously, the movable door extends into the housing; the bottom of the carrying mechanism is provided with a first magnetic suction part; the shifting mechanism is located on the bottom outer side of the housing, and the shifting mechanism includes a sliding component and a second magnetic suction part, the second magnetic suction part being connected to the sliding component to move with the sliding component; the first magnetic suction part and the second magnetic suction part are magnetically coupled, and the carrying mechanism moves along the guide rail; the lifting mechanism is used to grab the wafer and continue lifting when the carrying mechanism lifts the wafer to a point where it is partially outside the housing, and the carrying mechanism stops rising after the lifting mechanism clamps the wafer to detach from the wafer, and then returns to the wafer receiving area to wait for the next wafer.

2. The vertical lifting device according to claim 1, characterized in that The bearing mechanism includes a retaining member that clamps the bottom end of the wafer, a support frame that fixes the retaining member, and a lifting member connected to the support frame.

3. The vertical lifting device according to claim 2, characterized in that, The retainer has end caps on both sides and an elastic part on the inner side. The two end caps cooperate to clamp the elastic part between them. The side edge of the elastic part that contacts the wafer has a groove, which is used to clamp the wafer.

4. The vertical lifting device according to claim 3, characterized in that, The groove has two opposing sidewalls for positioning the wafer, and the inner side of the sidewalls has an inclined guide surface.

5. The vertical lifting device according to claim 2, characterized in that, The outer periphery of the lifting component is covered with a protective cover.

6. The vertical lifting device according to claim 1, characterized in that, The movable door includes a door body, a connecting rod, and a driving component. The driving component is located outside the housing and is used to drive the door body to enter and exit the housing.

7. The vertical lifting device according to claim 2, characterized in that, The first magnetic suction part is embedded inside the base of the lifting component.

8. The vertical lifting device according to claim 1, characterized in that, The sliding assembly includes a linear module and a slider that are connected to each other.

9. The vertical lifting device according to claim 1, characterized in that, The lifting mechanism includes a parallel gripper, a clamping drive unit, and a lifting drive unit. The clamping drive unit is connected to the parallel gripper to drive the parallel gripper to open and close, thereby releasing or clamping the wafer. The clamping drive unit is connected to the lifting drive unit to achieve vertical movement.

10. The vertical lifting device according to claim 1, characterized in that, When the dual-spray mechanism simultaneously sprays liquid and gas onto the wafer surface, the gas is sprayed in the upper layer and the liquid is sprayed in the lower layer.

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